KR20190073129A - Reinforced film for fingerprint recognition sensor, Manufacturing method thereof and fingerprint recognition sensor module using the same - Google Patents

Abstract

The present invention relates to a reinforcement film for a fingerprint recognition sensor chip which can be applied by directly contact with the top of the fingerprint recognition sensor chip, a production method thereof, and a fingerprint recognition sensor module using the same. More specifically, provided is a thin and lightened fingerprint recognition sensor module by directly applying the reinforcement film to a fingerprint recognition sensor.

Description

Technical Field [0001] The present invention relates to a reinforcing film for a fingerprint recognition sensor chip, a manufacturing method thereof, and a fingerprint recognition sensor module including the same.

The present invention relates to a reinforcing film for a fingerprint recognition sensor chip composed of a soft layer and a hard layer, a method of manufacturing the same, and a thin and lightweight fingerprint recognition sensor module using the same.

Fingerprint recognition technology is a technique that is mainly used to prevent various security incidents by going through user registration and authentication procedures. In particular, it is a technology applied to personal and organizational network defense, protection of various contents and data, and secure access control.

2. Description of the Related Art In recent years, as the number of users of various portable devices including smartphones and tablet PCs has surged, personal information and contents stored in and stored in a portable device have frequently been leaked to the outside. In the case of the conventional mobile phone, it has been used only for the purpose of making a voice call, and in the case of a personal computer, it has been placed in the home or office, and only a few users have been provided. However, recently developed smart phones and tablet PCs have been manufactured in a compact form that can be carried by users anytime, anywhere, away from the limited use of conventional mobile phones and personal computers, It is a concept of necessity to carry around. With the development of mobile technology and the development of computing devices, portable devices such as smartphones and tablet PCs have built-in large-capacity data storage media, high-performance computation processor and high-speed communication module, It is now possible to carry out the following. If such a portable device is lost or handed over to the hands of a malicious person, there is a risk that information that requires security maintenance such as various personal information and business secrets may be leaked to an unspecified third party. In addition, there are many cases where personal financial transactions are carried out using a portable device, and when personal financial information is leaked to another person, a risk of serious financial accidents may occur.

In recent years, fingerprint sensor technology has been continuously developed, and portable devices such as smart phones have become thinner and shorter. There is also a growing demand for thin and light fingerprint sensor modules to be used here. And the applied fingerprint sensor simply encapsulates the chip of the fingerprint sensor with the epoxy encapsulation material. However, the existing technology has caused the durability of the fingerprint sensor due to the shortening of the fingerprint sensor.

Korea Registration No. 10-1368264 (Notification Date 2014.02.28)

The present inventors have made efforts to solve the deterioration of physical properties such as durability caused by the short-time shortening of the fingerprint sensor, and as a result, they have found that a new reinforcement of the hard layer and the soft layer double structure, Film. That is, the present invention provides a reinforcing film for a fingerprint sensor chip and a method of manufacturing the same.

In order to solve the above problems, the present invention relates to a reinforcing film for a fingerprint sensor chip (hereinafter referred to as "reinforcing film"), and a hard layer having an average thickness of 10 占 퐉 to 25 占 퐉.

As a preferred embodiment of the present invention, in the reinforcing film of the present invention, the storage modulus after curing of each layer of the soft layer and the hard layer can satisfy the following equation (1).

[Equation 1]

15 <{(Storage elastic modulus value (Mpa) of the hard layer at 25 ° C / Storage elastic modulus value (Mpa) of the soft layer at 25 ° C)

In the equation (1), the storage elastic modulus value was measured by using a dynamic thermomechanical analyzer (Perkin Elmer, Diamond DMA) after curing the specimen of 20 mm x 5 mm (width x length) at 180 ° C for 2 hours At a temperature of -30 占 폚 to 300 占 폚 (rate of temperature increase of 10 占 폚 / min) and a measurement frequency of 10 Hz.

As a preferred embodiment of the present invention, the soft elastic layer may satisfy the following equation (2).

[Equation 2]

(Mpa) of the soft layer before curing at 25 DEG C / a storage elastic modulus value (Mpa) of the soft layer at 130 DEG C before curing &lt; = 90

In the equation (2), the storage elastic modulus value was measured by a dynamic thermomechanical analyzer (Perkin Elmer, Diamond DMA) after curing the specimen having a size of 20 mm x 5 mm (width x length) at 180 ° C for 2 hours At a temperature of -30 占 폚 to 300 占 폚 (rate of temperature increase of 10 占 폚 / min) and a measurement frequency of 10 Hz.

In one preferred embodiment of the present invention, the soft layer has a storage elastic modulus value after curing at 260 DEG C of 3 MPa or more.

In one preferred embodiment of the present invention, the soft layer may have an adhesive strength of 150 to 400 N / m at 25 ° C after curing, and an adhesive strength of 20 to 120 N / m at 260 ° C after curing .

In one preferred embodiment of the present invention, the hard layer may have a transmittance of 15% or less when measured according to a permeability measurement method (haze meter NDH-7000, manufactured by Nippon Denshoku).

In one preferred embodiment of the present invention, the soft layer is a thermoplastic resin having a number average molecular weight of 600,000 to 1,000,000; Epoxy resin; Curing agent; Inorganic fillers; Curing accelerator; And a coupling agent.

In one preferred embodiment of the present invention, the soft layer comprises 60 to 75% by weight of the thermoplastic resin, 10 to 25% by weight of the epoxy resin, 2 to 10% by weight of a curing agent, 4 to 15% by weight of an inorganic filler, 2% by weight and 0.1 to 4% by weight of a coupling agent.

In one preferred embodiment of the present invention, the epoxy resin among the soft layer components may include a bisphenol-based epoxy resin and a cresol novolak-based epoxy resin in a weight ratio of 1: 0.2 to 1: 1.

In one preferred embodiment of the present invention, the hard layer may be formed of a polyimide film containing a black pigment or a polyetheretherketone (PEEK) film containing a black pigment.

In one preferred embodiment of the present invention, the reinforcing film of the present invention further comprises a cover adhesive layer on the hard layer stacked on the soft layer, wherein the cover adhesive layer has a storage elastic modulus after curing of 7,000 ~ 8,000 MPa can be satisfied.

As a preferred embodiment of the present invention, the storage modulus value at 25 ° C after curing of the soft layer and the storage modulus value at 25 ° C after curing of the cover adhesive layer may be 1:25 to 40 times.

In one preferred embodiment of the present invention, the cover adhesive layer comprises 15 to 30 wt% of a thermoplastic resin, 15 to 40 wt% of the epoxy resin, 4 to 15 wt% of a curing agent, 40 to 60 wt% of an inorganic filler, 0.1 By weight to 2% by weight and a coupling agent in an amount of 0.5 to 5% by weight.

As a preferred embodiment of the present invention, a cover film layer may further be provided on the adhesive layer for cover.

As a preferred embodiment of the present invention, a release film layer may further be provided under the soft layer.

It is another object of the present invention to provide a method for producing the various types of reinforcing films described above, comprising the steps of: preparing a resin for a soft part; And And a second step of casting the resin for soft part on the hard film and drying the resin to form a soft part of the B-stage on the hard film.

In addition, the reinforcing film of the present invention comprises the steps of: preparing a resin for a soft part; And a second step of casting the resin for soft part on the top of the release film and then drying to form a soft part of the B-stage and then laminating the soft part on the hard film. You may.

Another object of the present invention is to provide a fingerprint sensor module to which various types of reinforcing films are applied, including a PCB (printed circuit board); An epoxy molding compound (EMC) molding part; Fingerprint recognition sensor chip; And the reinforcing film.

As a preferred embodiment of the present invention, in the fingerprint recognition sensor module, the reinforcing film is formed on the upper part of the EMC molding part and the fingerprint recognition sensor chip, and the soft part of the reinforcing film directly contacts both the EMC molding part and the fingerprint recognition sensor chip part. As shown in Fig.

As a preferred embodiment of the present invention, in the fingerprint recognition sensor module, the EMC molding part and the fingerprint recognition sensor chip may be formed on the PCB.

As a preferred embodiment of the present invention, the fingerprint recognition sensor module of the present invention further includes an FPCB substrate, and the PCB may be formed on the FPCB.

As a preferred embodiment of the present invention, the fingerprint recognition sensor module of the present invention may further include a wire.

INDUSTRIAL APPLICABILITY The reinforcing film for a fingerprint sensor chip of the present invention is not only excellent in physical properties such as durability, compression resistance, impact resistance and adhesive strength but also suitable for application as a sensor protection reinforcing film of a fingerprint recognition sensor module The fingerprint sensor module to which the reinforcing film of the present invention is applied does not need to mold the chip into EMC to protect the fingerprint recognition sensor chip, thereby providing a thin and light fingerprint sensor module.

1 is a schematic cross-sectional view of a general structure of a conventional fingerprint recognition sensor module.
2 is a schematic cross-sectional view of a fingerprint sensor module structure to which the fingerprint sensor of the present invention is applied.
3A and 3B are schematic cross-sectional views of a reinforcing film for a fingerprint recognition sensor chip of the present invention.

As used herein, the term "before curing" means that the soft portion is in the B-stage state and "after hardening" means that the soft portion is in the C-stage state.

Hereinafter, the present invention will be described in more detail.

As shown schematically in FIG. 1, the existing fingerprint recognition sensor module is manufactured by molding an encapsulation (seal) of a fingerprint recognition sensor by EMC (Epoxy Molding Compound) in order to protect the fingerprint recognition sensor chip. The thickness of the EMC has to be very thick, i.e., 70 to 100 占 퐉 in order to protect it from external impact or the like.

On the other hand, the inventors of the present invention have developed a reinforcing film for a fingerprint recognition sensor chip that has excellent mechanical properties, adhesive strength and electrical characteristics. By applying the reinforcing film to a fingerprint sensor module, as shown in the schematic diagram of FIG. 2, And to provide a fingerprint sensor module having a reduced size and a reduced size.

The fingerprint sensor module of the present invention includes a PCB (printed circuit board) 20; An epoxy molding compound (EMC) molding part 30; A fingerprint recognition sensor chip 40; And a reinforcing film (10) for a fingerprint recognition sensor chip.

The height of the EMC molding part 30 in the fingerprint recognition sensor module to which the reinforcing film 10 of the present invention is applied can be formed to be approximately equal to the height of the module of the fingerprint recognition sensor chip 40 The height difference between the EMC molding part and the fingerprint recognition sensor chip may be 1 탆 or less, preferably 0.5 탆 or less, more preferably 0.1 탆 or less, from one side of the PCB on which the molding part and the fingerprint recognition sensor chip are formed.

The structure of the reinforcing film 10 for a fingerprint recognition sensor chip is composed of a soft layer 1 and a hard layer 2 as schematically shown in Fig.

The reinforcing film 10 for a fingerprint recognition sensor chip may further include a cover adhesive layer 3 on the upper portion of the rigid portion 2 as schematically shown in FIG. And may further comprise a film layer 4.

Further, the reinforcing film 10 for a fingerprint recognition sensor chip may further include a release film layer 5 to be removed under the soft portion 1 when the fingerprint recognition sensor module is applied.

More specifically, the reinforcing film 10 is formed on the upper part of the EMC molding part 30 and the fingerprint recognition sensor chip 40, and the soft layer 1 of the reinforcing film 10 is formed on the upper surface of the EMC molding part 30, And the fingerprint recognition sensor chip 40 may be formed directly on the PCB 20. The EMC molding unit 30 and the fingerprint recognition sensor chip 40 may be formed on the PCB 20. [

The reinforcing film applied to the fingerprint recognition sensor module has a total thickness of 20 탆 to 45 탆 including the soft portion 1 and the rigid portion 2, The overall thickness of the module can be reduced.

A method of manufacturing the reinforcing film 10 of the present invention will now be described.

The reinforcing film of the present invention comprises the steps of: preparing a resin for a soft part; And a second step of casting the resin for soft part on the hard film and drying the resultant to form a soft part of the B-stage on the hard film (process 1) .

Preparing a resin for a soft portion; And a second step of casting the resin for soft part on the top of the release film and then drying to form a soft part of the B-stage and then laminating the soft part on the hard film. (Method 2).

Further, the third step of resin casting for the cover adhesive layer and drying may be further performed on the hard film of the reinforcing film produced by Production Methods 1 and 2.

Further, a fourth step of further laminating a cover film on the adhesive layer for cover may be further performed.

In the first and second processes, the resin for the soft part in the first step is a thermoplastic resin; Epoxy resin; Curing agent; Inorganic fillers; Curing accelerator; And a coupling agent.

The thermoplastic resin preferably has a number average molecular weight of 600,000 to 1,000,000, preferably a number average molecular weight of 700,000 to 900,000, more preferably 740,000 to 870,000, wherein the number average molecular weight of the thermoplastic resin is less than 600,000 If the number average molecular weight exceeds 1,000,000, the cohesive force may be excessive and the initial adhesion property may be deteriorated.

As such a thermoplastic resin, an acrylic copolymer resin can be used, and preferably an acrylic copolymer resin having a glass transition temperature of 10 ° C to 20 ° C, more preferably a glass transition temperature of 12 ° C to 18 ° C. The acrylic copolymer resin may be a copolymer of ethyl acrylate, butyl acrylate, methyl methacrylate, glycidyl acrylate, and acrylonitrile, and glycidyl acrylate, which is a monomer of the copolymer, And acrylonitrile may be copolymerized at a weight ratio of 6.5 to 12, and more preferably, glycidyl acrylate and acrylonitrile may be copolymerized at a weight ratio of 8 to 10.

It is preferable that the content of the thermoplastic resin in the total weight of the resin for soft part is 60 to 75% by weight, preferably 62 to 74% by weight and more preferably 65 to 72% by weight. When the thermoplastic resin content is less than 60% There may be a problem that the reinforcing film has insufficient elasticity before curing to deteriorate the adhesive effect and may be difficult to manufacture. When the content exceeds 75% by weight, the content of the thermosetting part is insufficient and the total crosslinking degree is low, It is because.

It is preferable that the epoxy resin among the resin components for soft part be mixed with bisphenol-based epoxy resin and cresol novolak-based epoxy resin at a weight ratio of 1: 0.2 to 1.2, preferably 1: 0.5 to 1.2. If the amount of the cresol novolak epoxy resin used is less than 0.2 weight ratio, the crosslinking point for forming the three-dimensional crosslinking may be insufficient and the heat resistance may be insufficient. If the amount of the cresol novolak epoxy resin used exceeds 1.2 weight ratio, the crosslinking degree is too high, There may be a vulnerability. The bisphenol epoxy resin is preferably a bisphenol A epoxy resin having an equivalent weight of 400 to 500 g / eq and a softening point of 57 to 70 ° C, more preferably a bisphenol A epoxy resin having an equivalent weight of 440 to 495 g / eq and a softening point of 60 to 68 ° C . The cresol novolac epoxy resin may be a cresol novolak epoxy resin having an equivalent weight of 150 to 250 g / eq and a softening point of 48 to 54 ° C, more preferably 180 to 220 g / eq, Cresol novolak epoxy resin having a melting point of 54 deg. C is preferably used. It is preferable that the epoxy resin content is 10 to 25% by weight, preferably 12 to 22% by weight and more preferably 15 to 20% by weight in the total weight of the resin for soft part. If the epoxy resin content is less than 10% by weight There may be a problem that the adhesive strength after the curing of the reinforcing film is inadequate, and when it exceeds 25% by weight, the brittleness before and after curing is strong, so that the adhesive effect at the time of the curing is reduced and the impact resistance after curing may be problematic.

Among the soft resin components, the curing agent may be a conventional one used in the art, preferably a phenol novolak resin having an OH equivalent of 95 to 120 g / eq and a softening point of 110 to 130 ° C, It is preferable to use a phenol novolac resin having an OH equivalent of 100 to 110 g / eq and a softening point of 115 ° C to 125 ° C. The content of the curing agent in the total weight of the resin for soft part is preferably 2 to 10 wt%, preferably 3 to 8 wt%, more preferably 4 to 7.5 wt%. If the curing agent content is less than 2 wt% There may be a problem that the crosslinking density after curing is too low, resulting in insufficient adhesion. If the content exceeds 10% by weight, there may be a problem that the reliability of the unreacted curing agent is lowered.

Among the soft resin components, the inorganic filler plays a role of complementing dimensional stability and heat resistance, and at least one selected from silica, alumina, carbon black, titanium dioxide and barium titanate can be used. The inorganic filler preferably has an average particle diameter of 10 to 100 nm, preferably 10 to 50 nm. The content of the inorganic filler in the total weight of the resin for soft portion is preferably 4 to 15% by weight, more preferably 6 to 13% by weight, and still more preferably 7 to 12.5% by weight. When the content of the inorganic filler is less than 4% There may be a problem that the adhesive force between the substrates decreases due to thermal expansion and shrinkage due to an increase in the thermal expansion coefficient, and if it exceeds 15% by weight, there is a problem that the adhesive strength remarkably lowers.

In addition, the curing accelerator among the soft resin components has a role of accelerating curing when the soft layer in a B-stage state is applied to a fingerprint sensor chip and then cured by applying heat. The curing accelerator is an imidazole- A hardening accelerator may be used, and it is preferable to use an imidazole hardening accelerator. As the imidazole-based curing accelerator, 2E4MZ, 2E4MZ-A, 2E4MZ-CN, 2PZ, 2PZ-CN, 2P4MZ, C11Z, C11Z-CN, C11Z-CNS, C17Z, 2MZ, 2MZ- S, 2PHZ-PW, 2P4MHZ-PW, and TBZ. The phosphorus hardening accelerator may be at least one selected from the group consisting of triphenylphosphine, tributylphosphine, tritolylphosphine, trisilylphosphine, phosphine oxide, triphenylphosphonium tetraphenylborate, tetraphenylphosphonium and tetraphenylporate And may include at least one selected.

The content of the curing accelerator in the total weight of the soft resin is preferably 0.1 to 2% by weight, preferably 0.1 to 1% by weight, more preferably 0.1 to 0.8% by weight. When the content of the curing accelerator is less than 0.1% There may be a problem that productivity is remarkably lowered because the product curing time is too long during the process, and when it exceeds 1% by weight, there is a problem that the stability over time is insufficient and the use period is decreased.

In addition, the coupling agent of the soft resin component plays a role of increasing the adhesive force due to the chemical bonding between the surface of the inorganic filler and the organic material, and may be a general coupling agent used in the art. Preferably, Lt; / RTI &gt; If the content of the coupling agent is less than 0.1 wt%, the content of the coupling agent is preferably 0.1 to 4 wt%, more preferably 0.5 to 2.5 wt%, and still more preferably 0.5 to 2 wt% There may be a problem that the surface of the inorganic filler can not be sufficiently wrapped, resulting in deterioration of the adhesive strength. When the content exceeds 4% by weight, the content of the volatile low molecular material becomes too high, and reliability may be deteriorated due to the remaining coupling agent.

In the production methods 1 and 2, the hard film may be a polyimide film containing a black pigment, a polyetheretherketone (PEEK) film containing a black pigment or a polyethylene naphthalate film containing a black pigment. The content of the black pigment in the hard film is preferably such that the transmittance of the hard film is 15% or less, the transmittance is preferably 0 to 5%, and the transmittance of the hard film is preferably 5% or less, when measured based on the permeability measurement method (Haze meter NDH-7000, manufactured by Nippon Denshoku) Preferably, it is used so as to satisfy the transmittance of 1% or less. If the black pigment is used in a small amount so that the transmittance is more than 15%, the visible light shielding force is lowered and the fingerprint recognition sensor chip is seen from the outside. If the black pigment content is too high, there is a problem that the brittleness is strong and the handleability of the film is deteriorated.

In the processes 1 and 2, the two-step drying can be carried out by a general method used in the art. Preferably, the drying is carried out by hot-air drying for 3 to 8 minutes at a temperature of 120 ° C to 150 ° C, The soft portion in the B-stage state can be formed at a temperature of preferably from 130 to 145 DEG C for 4 to 6 minutes. If the drying temperature is lower than 120 ° C, the drying time may become too long and the surface of the soft portion may become rough. If the drying temperature exceeds 150 ° C, it may dry too rapidly, have.

The reinforcing film of the present invention produced by the above method is laminated with a soft layer in a B-stage state and a hard layer (or hard film layer) having an average thickness of 12 to 25 μm as schematically shown in FIG. 3A have. The soft layer is a portion directly bonded to the chip when applied to a fingerprint sensor chip.

The soft layer is a layer having a role of adhesion between the chip and the EMC molding part and has an average thickness of 10 탆 to 25 탆, preferably 12 탆 to 20 탆, more preferably 15 탆 to 20 탆, If it is less than 10 mu m, sufficient impact resistance of the reinforcing film may not be secured, and if it is used in excess of 25 mu m, it is disadvantageous in making it thin.

The hard layer serves to reinforce the strength and preferably has an average thickness of 10 to 25 占 퐉, preferably 12 to 23.5 占 퐉, more preferably 15 to 22 占 퐉. If the hard layer thickness is less than 10 占 퐉, Durability and strength may not be ensured. If the thickness exceeds 25 mu m, the thickness becomes unnecessarily large, which is disadvantageous to flaking.

The storage elastic modulus after curing of each of the soft layer and the hard layer of the reinforcing film of the present invention can satisfy the following equation (1).

[Equation 1]

15 < Storage elasticity value (Mpa) of the hard layer at 25 deg. C / Storage elastic modulus value (Mpa) of the soft layer at 25 deg. (Storage modulus value (Mpa) of the hard layer at 25 deg. C / (Mpa) / storage modulus value at 25 deg. C Modulus of elasticity value (Mpa)} < 28.5

In the equation 1, the storage elastic modulus value was measured by a dynamic thermomechanical analyzer (Perkin Elmer, Diamond DMA) after curing the specimen having a size of 20 mm × 5 mm (width × length) at 180 ° C. for 2 hours, Measured at a measurement temperature of -30 캜 to 300 캜 (rate of temperature increase of 10 캜 / min) and a measurement frequency of 10 Hz. At this time, if the value of the equation 1 exceeds 30, there is a problem that the deformation is severe during an external impact, and the cover layer is damaged or the shape is difficult to maintain. If the value of the equation 1 is less than 15, Can be.

The soft elastic layer may satisfy the following equation (2).

[Equation 2]

(Mpa) of the soft layer before curing at 25 deg. C / a storage modulus value (Mpa) of the soft layer at 130 deg. C before curing &lt; = 90, preferably 25 & The storage elastic modulus value (Mpa) / the storage modulus value (Mpa) before curing at 130 deg. C of the soft layer &lt; = 85 and more preferably 30 & The storage elastic modulus value before curing (Mpa) at 130 ° C ≤ 80

In the equation 2, the storage elastic modulus value was measured by a dynamic thermomechanical analyzer (Perkin Elmer, Diamond DMA) after curing the specimen having a size of 20 mm × 5 mm (width × length) at 180 ° C. for 2 hours, Measured at a measurement temperature of -30 캜 to 300 캜 (rate of temperature increase of 10 캜 / min) and a measurement frequency of 10 Hz. At this time, if the value of the equation 2 exceeds 90, there may be a problem that the occurrence of warping due to thermal deformation increases. If the value of the equation 2 is less than 20, the room temperature storage elastic modulus is too low, Can be.

The soft layer may have a storage elastic modulus value after curing at 260 DEG C of 3 Mpa or more, preferably 4 Mpa to 30 Mpa.

Also, when the thickness of the soft layer is 20 탆, the adhesive strength at 25 캜 after curing may be 150 to 400 N / m, and preferably 180 to 350 N / m. When the thickness of the soft layer is 20 占 퐉, the adhesive strength at 260 占 폚 after curing may be 20 to 120 N / m, preferably 30 to 100 N / m.

The reinforcing film of the present invention may have a dielectric constant of 3 to 15, preferably 3.0 to 7.0, more preferably 3.0 to 5.0 at 1 GHz when measured based on a network analyzer method. In this case, if the dielectric constant is less than 3, the signal transmission efficiency of the fingerprint recognition may be insufficient, and if the dielectric constant is more than 15, fingerprint identification noise may occur due to too high sensitivity.

In the case where the reinforcing film of the present invention further comprises an adhesive layer for cover on the hard layer laminated on the soft layer, the thickness of the adhesive layer for cover is preferably 10 to 40 占 퐉, If the thickness of the fingerprint sensor module is more than 40 m, the total thickness of the fingerprint sensor module is increased to make it difficult to reduce the thickness of the fingerprint sensor module, and the adhesive layer may be excessively flowed out .

The adhesive layer for the cover may have a storage elastic modulus after curing of 7,000 to 8,000 MPa, preferably 7,100 to 7,900 MPa, more preferably 7,150 to 7,750 MPa.

The reinforcing film of the present invention may have a ratio of the storage elastic modulus value at 25 캜 after curing of the soft layer and the storage elastic modulus value at 25 캜 after curing of the cover adhesive layer is 1:25 to 40, 27 to 39 times, and more preferably 30 to 39 times. If the storage modulus ratio exceeds 40, there may be a problem that the cover layer at the outermost periphery is damaged due to the external impact due to the deformation of the reinforcing film. If the storage modulus ratio is less than 25, There may be a problem that the impact resistance is lowered.

Hereinafter, the present invention will be described in more detail with reference to the following examples. However, the following examples should not be construed as limiting the scope of the present invention, and should be construed to facilitate understanding of the present invention.

[ Example ]

Preparation Example  1-1: For soft layer  Manufacture of resin and soft film

67% by weight of an acrylic copolymer (N, trade name: SG-P3) containing 3% by weight of glycidyl acrylate and having a number average molecular weight of 800,000 and a glass transition temperature of 15 DEG C, an equivalent weight of 475 g / 8% by weight of a cresol novolac epoxy resin (trade name: YDCN 1P) having an equivalent weight of 200 g / eq and a softening point of 52 DEG C, 8% by weight of a bisphenol A epoxy resin (trade name: YD- 6% by weight of a phenol novolac resin having an OH equivalent of 106 g / eq and a softening point of 120 DEG C (trade name: KPH-F2004 from Kolon Chemical Industries, Ltd.), 9.5% by weight of silica having an average particle diameter of 15 to 17 nm (Aerosil R972, 0.5% by weight of an imidazole compound (Kyurazol 2PH manufactured by Shikoku Chemical Co., Ltd.) and 1% by weight of a silane coupling agent (KBM-303 from Shin-Etsu) were mixed to prepare a resin for a soft layer.

Next, the soft resin for soft layer was cast on a polyester film subjected to release treatment and then hot-air dried at 140 DEG C for 5 minutes to prepare a soft film for soft layer of B-stage having an average thickness of 20 mu m.

Preparation Example 1 -2 ~ Preparation Example  1-7 and Example of comparison preparation  1-1 ~ Example of comparison preparation  1-6

A soft resin and a soft film were prepared in the same manner as in Preparation Example 1-1, except that a resin having the composition and composition ratio shown in Table 1 below was prepared, 1-7 and Comparative Preparation Examples 1-1 to 1-6, respectively.

division
(weight%) Thermoplastic resin Epoxy resin Hardener weapon
Filler Hardening
accelerant Coupling agent Acrylic copolymer Bisphenol-based Cresol novolac Phenol novolak resin Silica Imidazole compound Silane coupling agent Preparation Example 1-1 67 8 8 6 9.5 0.5 One Preparation Example 1-2 62.2 10 8 6 9.5 0.5 One Preparation Example 1-3 74 5 5 5.5 9 0.5 One Preparation Example 1-4 67 10 6 6 9.5 0.5 One Preparation Example 1-5 67 7 9 6 9.5 0.5 One Preparation Example 1-6 72 8.5 8 6 4 0.5 One Preparation Example 1-7 65 7 7 5.5 14 0.5 One Comparative Preparation Example 1-1 57 11 11 8.5 11 0.5 One Comparative Preparation Example 1-2 78 5 5 4.5 6.3 0.4 0.8 Comparative Preparation Example 1-3 67 16 - 6 9.5 0.5 One Comparative Preparation Example 1-4 67 6 10 6 9.5 0.5 One Comparison Preparation Example 1-5 71 10 9.5 6 2 0.5 One Comparative Preparation Example 1-6 64 6.5 6.5 5 16.5 0.5 One

Experimental Example  1: Measurement of physical properties of soft film

The storage elastic modulus and adhesive strength, which are physical properties of the soft film prepared in Preparation Example and Comparative Preparation Example, were measured by the following methods, and the results are shown in Table 2 below.

(One) Storage modulus  Measure

The storage elastic modulus was measured by using a dynamic thermomechanical analyzer (Perkin Elmer, Diamond DMA) at a temperature of -30 ° C to 300 ° C at a temperature of -30 ° C to 300 ° C Speed 10 [deg.] C / min) and a measurement frequency of 10 Hz. The storage elastic modulus of the soft film in the B-stage state before curing at 25 占 폚 and 130 占 폚 was measured, and the storage elastic modulus of the soft film in the C-stage state at 25 占 폚 and 260 占 폚 after curing the soft film of the same composition The storage elastic modulus was measured, and the storage elastic modulus value in Table 2 is a value obtained by dividing the measured storage modulus value by the specimen thickness.

(2) Measurement of adhesion strength

After the reinforcing film was cut into a size of 10 mm x 10 mm x 20 m (width x length x thickness) and then adhered to a silicon wafer with a roll laminator at 130 DEG C, the specimen was cured at 180 DEG C for 2 hours, The adhesive strength was measured by a 180 degree peeling method. The adhesive strength at 260 占 폚 of the soft film in the B-stage state before curing and the soft film in the C-stage state after curing at 25 占 폚 before curing was measured.

division Before curing
Storage modulus
(Mpa) Storage elasticity after curing
(Mpa) After curing
Adhesive strength
(N / m) After curing
Adhesive strength
(N / m) 25 ℃ 130 ℃ 25 ° C /
130 ⁽¹⁾ 25 ℃ 260 ℃ 25 ℃ 260 ℃ Preparation Example 1-1 63 1.3 48 201 6.9 317 59 Preparation Example 1-2 89 1.2 74 267 9.1 288 67 Preparation Example 1-3 58 2.8 21 179 4.3 349 51 Preparation Example 1-4 67 1.1 61 197 6.4 332 53 Preparation Example 1-5 61 1.4 44 237 8.4 301 62 Preparation Example 1-6 47 0.7 67 152 3.4 381 47 Preparation Example 1-7 88 3.0 29 249 8.1 215 66 Comparative Preparation Example 1-1 98 Not measurable
(&Lt; 0.5) - 322 12.3 214 89 Comparative Preparation Example 1-2 49 3.7 13 144 2.9 391 18 Comparative Preparation Example 1-3 68 1.0 68 161 5.1 355 21 Comparative Preparation Example 1-4 142 1.4 101 332 10.9 253 88 Comparison Preparation Example 1-5 39 Not measurable
(&Lt; 0.5) - 101 1.3 399 33 Comparative Preparation Example 1-6 114 5.1 22 403 12.1 114 30 (1) 25 ° C / 130 ° C means a value obtained by dividing the storage modulus value (Mpa) of the soft layer at 25 ° C by the storage modulus value (Mpa) at 130 ° C of the soft layer.

The results of measurement of the above Table 2 show that the soft films of Preparative Examples 1-1 to 1-7 showed a proper storage elastic modulus and adhesion strength before and after curing.

On the other hand, in Comparative Preparation Example 1-1 in which the thermoplastic resin content is less than 60% by weight, the adhesive layer tends to be fragile due to insufficient elasticity before curing, which makes it difficult to manufacture, In Comparative Preparation Example 1-2 in which the content exceeds 75% by weight, there is a problem that the content of the thermosetting portion is insufficient and the total crosslinking degree is low, so that the adhesive strength and heat resistance after curing are insufficient. In Comparative Preparation Examples 1-3, which did not use the cresol novolak resin in the epoxy resin, there was a problem that the crosslinking points for forming the three-dimensional crosslinking were insufficient and the heat resistance and adhesiveness were insufficient. The use amount of the cresol novolac epoxy resin In Comparative Preparation Examples 1-4, which exceeded the ratio by weight of 1.2, the storage elastic modulus and the adhesive strength were generally excellent, but the crosslinking degree was too high, so that there was a problem of being vulnerable to impact resistance.

In Comparative Preparation Examples 1-5 in which the content of the inorganic filler was less than 4% by weight, there was a problem that the thermal expansion coefficient was increased and the adhesion between the substrates decreased due to thermal expansion and contraction at 260 캜 after curing. In Comparative Preparative Examples 1-6, which were used in excess of 15% by weight, there was a problem that the adhesive strength at low temperatures remarkably decreased.

Preparation Example  2-1 to 2-3 and Example of comparison preparation  2-1 to 2-4: Preparation of Hard Film

The polyimide film (GC film of S company) having different transparency by adjusting the content of black pigment was prepared as a hard film as shown in Table 3 below.

In Preparation Examples 2-1 to 2-3 and Comparative Preparation Examples 2-1 and 2-2, the black pigment content was the same, but the thicknesses differed. In Comparative Preparation Example 2-3, the black pigment content was different, will be.

The transmittance of the following Table 3 was measured based on the measurement method based on the permeability measurement method (Haze meter NDH-7000, manufactured by Nippon Denshoku).

The storage elastic modulus was measured in the same manner as in Experimental Example 1 above.

division Thickness (㎛) Permeability (%) 25 ℃ Storage modulus
(Mpa) Preparation Example 2-1 20 0.14 4901 Preparation Example 2-2 24 0.21 4434 Preparation Example 2-3 12 0.05 3908 Comparative Preparation Example 2-1 9 0.14 4112 Comparative Preparation Example 2-2 28 0.01 4231 Preparation for Comparison Example 2-3 20 17 3415

Example  1: Manufacture of reinforcing film for fingerprint sensor chip

The soft film of the B-stage state prepared in Preparation Example 1-1 and the hard film of Preparation Example 2-1 were bonded to each other to prepare a reinforcing film having a soft layer and a hard layer structure of B-stage.

At this time, the thickness of the soft layer is 20 mu m and the thickness of the hard layer is 20 mu m.

Example  2 ~ Example  9 and Comparative Example  1 to 6

The reinforcing films were prepared in the same manner as in Example 1, and the reinforcing films having the thicknesses as shown in Table 4 were prepared by controlling the amount of casting of the resin for soft layer, and Comparative Examples 1 to 6 of Examples 2 to 9 were conducted.

Experimental Example  2: Measurement of physical properties of reinforced film 1

The storage elastic modulus ratios and dielectric constants at 25 캜 of the reinforcing films prepared in Examples and Comparative Examples are shown in Table 4 below.

At this time, the dielectric constant is a measurement of the dielectric constant at 1 GHz based on the network analyzer method.

division Soft layer Hard layer 25 ℃
Storage modulus
Ratio ⁽²⁾ permittivity
(1 GHz) Kinds The storage elastic modulus at 25 ° C after curing
(Mpa) Kinds Storage elasticity at 25 ° C
(Mpa) Example 1 Preparation Example 1-1 201 Preparation Example 2-1 4901 24.4 3.8 Example 2 Preparation Example 1-2 267 Preparation Example 2-1 4901 18.4 4.0 Example 3 Preparation Example 1-3 179 Preparation Example 2-1 4901 27.4 3.7 Example 4 Preparation Example 1-4 197 Preparation Example 2-2 4434 22.5 3.4 Example 5 Preparation Example 1-5 237 Preparation Example 2-2 4434 18.7 3.4 Example 6 Preparation Example 1-6 152 Preparation Example 2-3 3908 25.7 5.0 Example 7 Preparation Example 1-7 249 Preparation Example 2-3 4112 16.5 4.7 Example 8 Preparation Example 1-1 201 Preparation Example 2-2 4434 22.1 3.4 Example 9 Preparation Example 1-1 201 Preparation Example 2-3 3908 19.4 4.9 Comparative Example 1 Preparation Example 1-1 201 Comparative Preparation Example 2-1 4112 20.5 3.4 Comparative Example 2 Comparison Preparation Example 1-5 101 Comparative Preparation Example 2-2 4231 41.9 5.8 Comparative Example 3 Comparison Preparation Example 1-5 101 Preparation for Comparison Example 2-3 3415 33.8 3.0 Comparative Example 4 Comparative Preparation Example 1-4 332 Preparation Example 2-1 4901 14.8 3.4 Comparative Example 5 Comparative Preparation Example 1-6 403 Preparation Example 2-1 4901 12.2 3.5 (2) The storage modulus ratio is a value obtained by dividing the storage modulus value (Mpa) of the hard layer at 25 DEG C by the storage modulus value (Mpa) at 25 DEG C of the soft layer.

As shown in Table 4, in the case of Examples 1 to 9, the storage elastic modulus (25 ° C) ratio after curing of the soft layer and the hard layer was 15 to 30,

In the case of Comparative Example 1 in which the hard film thickness is 9 占 퐉, the fingerprint recognition sensor does not perform sufficient strength reinforcement to cause cracking of the cover layer. In the case of Comparative Example 2, , And the storage elastic modulus ratio exceeds 40. In Comparative Example 3 using the hard film of Comparative Preparation Example 2-3 in which the transmittance was 17%, not only the dielectric constant of PI was increased but also the outline of the internal sensor chip was visually observed at the time of observation from the outside, which was a sensual problem . In Comparative Examples 4 and 5 using Comparative Preparation Examples 1-4 as soft films, the storage modulus ratio was less than 15, but the dielectric constants were similar to those in Examples.

Experimental Example  3: Chip impact resistance measurement of reinforced film

The impact resistance of the chips to which the reinforcing films of Examples 1 to 9 and Comparative Examples 1 to 5 were applied was measured, and the results are shown in Table 5 below.

The chip impact resistance was measured by attaching a reinforcing film to a silicon wafer chip having a thickness of 100 μm and a size of 9 mm × 12 mm to cure the beads having a diameter of 50 mm and a weight of 500 g at a height of 250 mm to make cracks in the lower end silicon wafer chip The wafer chips with cracks were judged as x and the chips without cracks as 0 according to the presence or absence of cracks having a size of 1 mm or more.

division Chip impact resistance Example 1 O Example 2 O Example 3 O Example 4 O Example 5 O Example 6 O Example 7 O Example 8 O Example 9 O Comparative Example 1 O Comparative Example 2 O Comparative Example 3 O Comparative Example 4 × Comparative Example 5 ×

The chips to which Examples 1 to 7 and Comparative Examples 1 to 3 were applied showed excellent impact resistance results. On the other hand, in the case of Comparative Example 4 and Comparative Example 5 in which the storage modulus at 25 ° C after hardening of the soft layer and the storage modulus ratio at 25 ° C after hardening of the hard layer were less than 1: 15, the chips were cracked This is because the storage elastic modulus of the soft layer is so high that the difference in strength between the upper layer and the lower layer becomes smaller so that the effect of canceling the external impact at the lower layer is insufficient and the lower chip is damaged .

Example  10: Manufacture of reinforced film for fingerprint sensor 2

(1) Preparation of adhesive for cover

21% by weight of an acrylic copolymer (N-trade name: SG-P3) having a number average molecular weight of 800,000 and a glass transition temperature of 15 캜 and containing 3% by weight of glycidyl acrylate, an equivalent weight of 475 g / 10% by weight of a cresol novolac epoxy resin (trade name: YDCN 1P) having an equivalent weight of 200 g / eq and a softening point of 52 ° C, 10% by weight of a bisphenol A epoxy resin (trade name: YD- 8% by weight of a phenol novolac resin having an OH equivalent of 106 g / eq and a softening point of 120 占 폚 (trade name: KPH-F2004 from Kolon Chemical Industries, Ltd.), 50% by weight of silica having an average particle size of 16 탆 (Aerosil R972 manufactured by E company) 0.5% by weight of an imidazole compound (Kyurazol 2PH manufactured by Shikoku Chemical Co., Ltd.) and 1% by weight of a silane coupling agent (KBM-303 from Shin-Etsu) were mixed to prepare a resin for cover adhesive.

Next, the cover resin for a cover was cast on a cover film (release PET film), followed by hot air drying at 140 DEG C for 4 minutes to form a cover film and an adhesive layer for covers (an average thickness of 13 mu m, B- Stage).

(2) Preparation of reinforcement film

The adhesive layer for cover was bonded to the upper portion of the hard layer of the reinforcing film having the soft layer and the hard layer two-layer structure manufactured in Example 1 to form a soft layer-hard layer-cover adhesive layer- Layer structure reinforced film was prepared.

Example  11-13

Layer structure reinforcing film in which the soft layer-hard layer-cover adhesive layer-cover film layer was laminated in order by using the reinforcing film prepared in Example 1 in the same manner as in Example 10, The thickness of the adhesive layer for cover was varied as shown in Table 6 below to prepare reinforcing films.

Example  14-15

In the same manner as in Example 10, a four-layer structure reinforcing film in which the soft layer-hard layer-cover adhesive layer-cover film layer was laminated in order was prepared, and in Example 2 instead of the reinforcing film of Example 1 Reinforced films having a four-layer structure were prepared as shown in Table 6 below.

Example  16

Layer structure reinforcing film in the form of a soft layer-hard layer-cover adhesive layer-cover film layer laminated in this order was prepared in the same manner as in Example 10, except that the reinforcing film of Example 1 was used instead of the reinforcing film of Example 1 Reinforced films having a four-layer structure were prepared as shown in Table 6 below.

Example  17

Layer structure reinforcing film in the form of a soft layer-hard layer-cover adhesive layer-cover film layer laminated in this order was prepared in the same manner as in Example 10, except that in Example 6 instead of the reinforcing film of Example 1 Reinforced films having a four-layer structure were prepared as shown in Table 6 below.

Example  18

Layer structure reinforcing film in which the soft layer-hard layer-cover adhesive layer-cover film layer was laminated in order, was prepared in the same manner as in Example 10, except that the reinforcing film of Comparative Example 4 was used instead of the reinforcing film of Example 1 Reinforced films having a four-layer structure were prepared as shown in Table 6 below.

Experimental Example  4: After curing of reinforcing film Storage modulus  Measure

The storage moduli of the flexible layer and the adhesive layer for cover in the reinforcing films prepared in Examples 10 to 17 were measured in the same manner as in Experimental Example 1, and the results are shown in Table 6 below.

division Soft layer thickness
(탆) Soft layer
25 ℃
Storage modulus
(Mpa) For cover
Adhesive layer thickness
(탆) For cover
Adhesive layer 25 캜 Storage elasticity
(Mpa) Soft layer: for cover
Adhesive layer
Storage modulus
ratio Example 10 20 201 13 7201 1: 35.9 Example 11 20 201 25 7308 1: 36.4 Example 12 20 201 8 7508 1: 37.4 Example 13 20 201 40 7801 1: 38.8 Example 14 20 267 25 7308 1: 27.4 Example 15 20 267 10 7591 1: 28.4 Example 16 20 179 13 7201 1: 40.2 Example 17 20 152 13 7201 1: 47.4 Example 18 20 332 13 7201 1: 21.7

Experimental Example  5: Reinforced film and Of the cover film  Cover impact resistance measurement

For the impact resistance of the cover film, the reinforcing films of Examples 10 to 17 were attached to a silicon wafer chip having a thickness of 100 m and a size of 9 mm x 12 mm, and then the cover film of the reinforcing film was peeled off. A glass of 9 mm x 12 mm was attached on the adhesive layer for cover and cured. Next, a bead having a diameter of 50 mm and a weight of 500 g was freely dropped at a height of 500 mm, and the cracks of the lower silicon wafer chip were observed under a microscope, and the wafer chips with cracks having a size of 1 mm or more were observed. The chip was judged as O.

division Impact resistance Example 10 O Example 11 O Example 12 O Example 13 O Example 14 O Example 15 O Example 16 × Example 17 × Example 18 O

In the case of Examples 16 and 17 in which the storage elastic modulus at 25 占 폚 after curing of the soft layer and the storage elastic modulus ratio at 25 占 폚 after curing of the cover adhesive layer exceeded 1:40 times, the storage elastic modulus of the soft layer was too low, There is a problem that the soft layer is excessively deformed by the impact transmitted from the cover layer and the cover layer is damaged by the cushion effect.

In the case of Example 18 in which the storage modulus at 25 ° C after curing of the soft layer and the storage modulus ratio at 25 ° C after curing of the cover adhesive layer were less than 1: 25, the breakage in the cover layer was not problematic, There is a problem that cracks are generated in the lower end chip due to insufficient absorption effect.

Manufacturing example  : Manufacture of Fingerprint Sensor Module (Semiconductor Package)

A fingerprint sensor module of the type shown in FIG. 2 was manufactured by applying the reinforcing film of the first embodiment.

A punching process was performed so that a chip could be attached to the process substrate. Next, a process tape for a mold was laminated on the rear surface of the process substrate punched out and joined together. Next, a PCB was prepared by arranging and attaching a die at room temperature on a process tape for a mold.

Next, the entire manufactured PCB was sealed with EMC. Next, after grinding the EMC surface to the height of the process substrate, the process tape for the mold was peeled off.

Next, the product was laminated at 130 DEG C with the soft layer of the reinforcing film prepared in Example 1 facing the chip side. Next, it was cured by heating at 180 DEG C for 2 hours.

Next, the cured product was diced into a single chip size, and mounted on a PCB substrate to produce a fingerprint recognition module (semiconductor package).

1: soft layer 2: hard layer (or hard film)
3: adhesive layer for cover 4: cover film layer
5: release film layer 10, 10 ': reinforcing film for fingerprint recognition sensor chip
20: PCB 30: EMC molding part
40: fingerprint recognition sensor chip portion

Claims (14)

Stage layer having an average thickness of 10 to 25 mu m and a hard layer having an average thickness of 10 to 25 mu m from the direction of the fingerprint sensor chip when the fingerprint sensor chip is applied to the fingerprint sensor chip, Wherein the storage elastic modulus of each layer of the layer and the hard layer after curing satisfies the following equation (1): &quot; (1) &quot;
[Equation 1]
15 &lt; {Storage elastic modulus value (Mpa) of hard layer at 25 DEG C / Storage elastic modulus value (Mpa) of soft layer at 25 DEG C)
In the equation (1), the storage elastic modulus value was measured by using a dynamic thermomechanical analyzer (Perkin Elmer, Diamond DMA) after curing the specimen having a size of 20 mm × 5 mm (width × length) at 180 ° C. for 2 hours, 30 ° C to 300 ° C (rate of temperature increase: 10 ° C / minute) and a measurement frequency of 10 Hz.
The reinforcing film for a fingerprint sensor chip according to claim 1, wherein the storage elastic modulus of the soft layer satisfies the following equation (2).
[Equation 2]
(Mpa) of the soft layer before curing at 25 DEG C / a storage elastic modulus value (Mpa) of the soft layer at 130 DEG C before curing &lt; = 90
In the equation 2, the storage elastic modulus value was measured by using a dynamic thermomechanical analyzer (Perkin Elmer, Diamond DMA) after curing the specimen having a size of 20 mm x 5 mm (width x length) at 180 ° C for 2 hours, 30 ° C to 300 ° C (rate of temperature increase: 10 ° C / minute) and a measurement frequency of 10 Hz.
The method according to claim 1, wherein the soft layer has a storage modulus value after curing at 260 캜 of 3 MPa or more,
Wherein the soft layer has an adhesive strength of 150 to 400 N / m at 25 占 폚 after curing and an adhesive strength of 20 to 120 N / m at 260 占 폚 after curing when the thickness is 20 占 퐉. Reinforcing film for sensor chip.
The multilayer printed wiring board according to claim 1, wherein the hard layer has a transmittance of 15%
Wherein the hard layer is a polyimide film containing a black pigment, a polyetheretherketone (PEEK) film containing a black pigment, or a polyethylene naphthalate (PEN) film containing a black pigment.
The thermoplastic resin composition according to claim 1, wherein the soft layer has a number average molecular weight of 600,000 to 1,000,000; Epoxy resin; Curing agent; Inorganic fillers; Curing accelerator; And a coupling agent. The reinforcing film for a fingerprint sensor chip according to claim 1,
6. The method of claim 5, wherein the soft layer comprises 60 to 75 wt% of the thermoplastic resin, 10 to 25 wt% of the epoxy resin, 2 to 10 wt% of a curing agent, 4 to 15 wt% of an inorganic filler, 0.1 to 2 wt% And 0.1 to 4% by weight of a coupling agent.
6. The reinforcing film for a fingerprint sensor chip according to claim 5, wherein the epoxy resin comprises bisphenol-based epoxy resin and cresol novolak-based epoxy resin at a weight ratio of 1: 0.2 to 1: 1.
The method according to claim 1, further comprising a cover adhesive layer on the hard layer stacked on the soft layer,
Wherein the adhesive layer for the cover has a storage modulus after curing of 7,000 to 8,000 MPa.
The reinforcing film for a fingerprint sensor chip according to claim 8, wherein the storage elastic modulus at 25 ° C after curing the soft layer and the storage modulus ratio at 25 ° C after curing the adhesive layer for cover are 1:25 to 40 times.
The cushioning material according to claim 8, wherein the cover adhesive layer comprises 15 to 30 wt% of a thermoplastic resin, 15 to 40 wt% of the epoxy resin, 4 to 15 wt% of a curing agent, 40 to 60 wt% of an inorganic filler, %, And 0.5 to 5 wt% of a coupling agent.
Printed circuit board (PCB);
An epoxy molding compound (EMC) molding part;
Fingerprint recognition sensor chip; And
A fingerprint recognition sensor module according to any one of claims 1 to 10.
[12] The method of claim 11, wherein the reinforcing film is formed on an upper surface of the EMC molding part and the fingerprint recognition sensor chip, and the soft part of the reinforcing film is directly bonded to both the EMC molding part and the fingerprint recognition sensor chip part,
Wherein the EMC molding unit and the fingerprint recognition sensor chip are formed on the PCB.
A first step of preparing a resin for a soft part by mixing a thermoplastic resin epoxy resin having a number average molecular weight of 600,000 to 1,000,000, a curing agent, an inorganic filler, a curing accelerator and a coupling agent; And
And a second step of casting the resin for the soft part on the hard film and drying the resin to form a soft part of the B-stage on the hard film,
Wherein the hard film comprises a polyimide film containing a black pigment or a polyetheretherketone (PEEK) film containing a black pigment or a polyethylene naphthalate (PEN) film containing a black pigment. Gt;
A first step of preparing a resin for a soft part by mixing a thermoplastic resin epoxy resin having a number average molecular weight of 600,000 to 1,000,000, a curing agent, an inorganic filler, a curing accelerator and a coupling agent; And
And a second step of casting the resin for soft part on the release film and drying the resultant to form a soft part of the B-stage, and then laminating the soft part on the hard film,
Wherein the hard film comprises a polyimide film containing a black pigment or a polyetheretherketone (PEEK) film containing a black pigment or a polyethylene naphthalate (PEN) film containing a black pigment. Gt;

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