KR102516292B1 - Insulation film for electronic device manufacturing - Google Patents

Abstract

The present invention includes an insulating layer, a first protective film layer formed on one surface of the insulating layer, and a second protective film layer formed on the other surface opposite to the one surface of the insulating layer, and the release force of the first protective film layer with respect to the insulating layer And by precisely adjusting the relationship between the release force of the second protective film layer with respect to the insulating layer, a new electronic device manufacturing process is simplified and the reliability of the product is improved by increasing the adhesion strength between the insulating film and the electronic device substrate. An insulating film for device manufacture can be provided.

Description

Insulation film for electronic device manufacturing

The present invention relates to an insulating film for manufacturing an electronic device, and more particularly, to an insulating film for improving the manufacturing process efficiency of an electronic device.

Recently, a circuit board such as a printed circuit board (PCB) is manufactured by sequentially stacking and compressing various types of build-up insulating films for thinning and high integration. The build-up substrate is provided as a thin sheet-shaped insulating film, and both sides of the insulating film are covered with predetermined protective films to protect it from the external environment. The build-up board is prepared and transported in a form in which both sides of the insulating film are covered with protective films prior to the manufacturing process of the printed circuit board. Then, during the manufacturing process of the printed circuit board, only the insulating film is selectively used by separating the protective films from the build-up board.

However, the protective films can be very easily separated from the “build-up” substrate, and the insulating film may be damaged in the process of separating the protective films from the “build-up” substrate. This phenomenon is because the release force of the protective films covering the insulating film is not precisely controlled. In order to solve this problem, it is necessary to study the release force between the insulating film and the protective film.

In order to solve the above problems, the present invention simplifies the manufacturing process of an electronic device by adjusting the release force between each of the protective films and the insulating film, and improves the reliability of the product by increasing the adhesion strength between the insulating film and the electronic device substrate. It is an object of the present invention to provide an insulating film for manufacturing electronic devices.

However, the technical problem to be achieved by the present invention is not limited to the above-mentioned problem, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

According to one embodiment of the present invention, the insulating film for manufacturing an electronic device according to the present invention includes an insulating layer, a first protective film layer formed on one surface of the insulating layer, and a second protective film layer formed on the other surface opposite to one surface of the insulating layer. , and satisfies General Formula 1.

[Formula 1]

< 1.0 0.1 <

< 1.0

In Formula 1, A and B represent the release force when peeling at 180 ° at room temperature, where A is the release force of the first protective film layer with respect to the insulating layer, and B is the insulating layer after curing. is the release force of the second protective film layer for

The insulating film for manufacturing an electronic device according to the present invention precisely controls the relationship between the release force of the first protective film layer with respect to the insulating layer and the release force of the second protective film layer with respect to the insulating layer, so that during the manufacturing process of the electronic device When the first protective film layer is separated from the insulating layer, a problem in which the second protective film layer is separated from the insulating layer can be prevented.

In addition, when the second protective film layer is separated from the insulating layer after curing, it is possible to prevent a phenomenon in which the insulating layer is torn or a residue of the second protective film layer adheres to the insulating layer.

In addition, the uncured insulating layer and the second protective film layer can be cured collectively, and after curing, the second protective film layer is easily separated from the insulating layer, thereby preventing cracks in the substrate including bending of the electronic device substrate. can prevent

In addition, when the first protective film layer is separated from the insulating layer as described above, the second protective film layer is not separated from the insulating layer, so it can be applied to an automated process.

In addition, since the first protective film layer is easily separated from the insulating layer, it is possible to prevent a phenomenon in which the insulating layer is partially torn or a residue of the first protective film layer adheres to the insulating layer.

1 is a cross-sectional view showing an insulating film according to an embodiment of the present invention.
2 is a cross-sectional view showing a first step of separating the first protective film layer from the insulating layer.
3 is a cross-sectional view showing a second process of separating the second protective film layer from the insulating layer after curing.
4 is a cross-sectional view showing an insulating film including a first protective film layer having a concavo-convex structure according to an embodiment of the present invention.

Objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and preferred embodiments taken in conjunction with the accompanying drawings. In adding reference numerals to components of each drawing in this specification, it should be noted that the same components have the same numbers as much as possible, even if they are displayed on different drawings. In addition, terms such as "first", "second", "one side", "other side" are used to distinguish one component from another, and the components are not limited by the above terms. no. Hereinafter, in describing the present invention, detailed descriptions of related known technologies that may unnecessarily obscure the subject matter of the present invention will be omitted.

An insulating film for manufacturing an electronic device according to the present invention includes an insulating layer, a first protective film layer formed on one surface of the insulating layer, and a second protective film layer formed on the other surface opposite to one surface of the insulating layer, Satisfies.

[Formula 1]

< 1.0 0.1 <

< 1.0

In Formula 1, A and B represent the release force when peeling at 180 ° at room temperature, where A is the release force of the first protective film layer with respect to the insulating layer, and B is the insulating layer after curing. is the release force of the second protective film layer for

First, the insulating film for manufacturing an electronic device according to the present invention includes an insulating layer.

1 shows a cross-sectional view of an insulating film according to an embodiment of the present invention. As shown in FIG. 1 , the insulating film 10 according to the present invention has a structure in which an insulating layer 12 is laminated between a first protective film layer 11 and a second protective film layer 13 .

The insulating layer 12 secures insulating properties and serves to prevent a short circuit or the like from occurring even when a portion close to an electronic device such as a printed circuit board exhibits high electrical conductivity. The insulating layer 12 may be formed by curing an insulating resin material, and the insulating layer 12 may be an insulating film constituting a single layer of a multilayer printed circuit board.

The insulating layer 12 may include a thermosetting resin and a filler.

The thermosetting resin is not particularly limited as long as it is an insulating resin material, and may preferably be an epoxy resin. Types of the epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AF type epoxy resin, dicyclopentadiene type epoxy resin, trisphenol epoxy resin, naphthol novolac epoxy resin, phenol Novolac type epoxy resin, tert-butyl-catechol type epoxy resin, naphthalene type epoxy resin, glycidylamine type epoxy resin, glycidyl ester type epoxy resin, cresol novolak type epoxy resin, biphenyl type epoxy resin, linear aliphatic epoxy resins, alicyclic epoxy resins, heterocyclic epoxy resins, spirocyclic epoxy resins, cyclohexane dimethanol type epoxy resins, naphthylene ether type epoxy resins, and trimethylol type epoxy resins; It can be used alone or in combination of two or more.

Types of the filler include silica, alumina, barium sulfate, talc, clay, mica powder, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum borate, barium titanate, strontium titanate, calcium titanate, titanic acid magnesium, bismuth titanate, titanium oxide, barium zirconate, calcium zirconate, and the like, and the above fillers may be used alone or in combination of two or more. The filler is preferably silica such as amorphous silica, fused silica, crystalline silica, synthetic silica, and hollow silica, and more preferably spherical silica.

The content of the filler included in the insulating layer 12 is preferably 50 parts by weight to 400 parts by weight based on 100 parts by weight of the thermosetting resin. When the content of the filler is less than 50 parts by weight relative to 100 parts by weight of the thermosetting resin, the thermal expansion coefficient of the insulating layer 12 obtained by thermal curing may be increased. Accordingly, a difference between the thermal expansion rate of the insulating layer 12 and the thermal expansion rate of the electronic device in contact with the insulating layer 12 is generated, causing defects in the electronic device or the insulating layer 12 being peeled off from the electronic device problems can arise. When the content of the filler is greater than 400 parts by weight relative to 100 parts by weight of the thermosetting resin, the mechanical strength of the insulating layer 12 may be lowered, and the contact between the insulating layer 12 and the electronic device in contact with the insulating layer 12 may be reduced. Adhesion may deteriorate.

In addition, the insulating layer 12 may further include a curing agent, a thermoplastic resin, a curing accelerator, a flame retardant, and additives in addition to the thermosetting resin and the filler.

The curing agent is not particularly limited as long as it has a function of curing the thermosetting resin, and the type of the curing agent includes a phenol-based curing agent, an active ester-based curing agent, a benzoxazine-based curing agent, and a cyanate ester-based curing agent. The curing agent may be used alone or in combination of two or more. Types of the thermoplastic resin include phenoxy resin, polyvinyl acetal resin, polyimide resin, polyamideimide resin, polyethersulfone resin, and polysulfone resin, and the thermoplastic resin may be used alone or in combination of two types. The above can be used in combination. Types of the curing accelerator include organic phosphine compounds, imidazole compounds, amine adduct compounds, and tertiary amine compounds, and the curing accelerators may be used alone or in combination of two or more. Examples of the flame retardant include organic phosphorus-based flame retardants, organic nitrogen-containing phosphorus compounds, nitrogen compounds, silicon-based flame retardants, and metal hydroxides. The flame retardants may be used alone or in combination of two or more. For example, rubber particles may be used as the additive, and examples of the rubber particles include core-shell rubber particles, crosslinked acrylonitrile butadiene rubber particles, crosslinked styrene butadiene rubber particles, and acrylic rubber particles. The particles may be used alone or in combination of two or more.

The cross-sectional thickness of the insulating layer 12 is not particularly limited, but considering the use applied to the printed circuit board, it is difficult to apply process automation when the cross-sectional thickness of the insulating layer 12 is less than 25 μm, and the insulating layer 12 If the thickness of the cross section exceeds 50 μm, economical efficiency is poor. Therefore, the thickness of the cross section of the insulating layer 12 is preferably 25 μm to 50 μm.

Next, the insulating film for manufacturing an electronic device according to the present invention includes a first protective film layer formed on one surface of the insulating layer and a second protective film layer formed on the other surface opposite to one surface of the insulating layer.

1 shows a cross-sectional view of an insulating film according to an embodiment of the present invention. As shown in FIG. 1, a first protective film layer 11 is formed on one surface of the insulating layer 12 constituting the insulating film 10 according to the present invention, and the opposite side of the insulating layer 12 is formed. A second protective film layer 13 is formed on the other surface of the phosphor.

The first protective film layer 11 is attached to one surface of the insulating layer 12 to protect the insulating layer 12 from external environmental factors. In addition, the first protective film layer 11 may have a surface roughness formed in order to adjust the adhesive strength with the insulating layer 12, and the first protective film layer 11 has a concavo-convex structure and an embossed structure. may contain at least one. As an example, FIG. 4 shows a first protective film layer 11 formed in a concave-convex structure on one surface of the insulating layer 12 . As shown in FIG. 4, the bonding area of the first protective film layer 11 with the insulating layer 12 is relatively small compared to the case where the bonding surface with the insulating layer 12 is flat. The first protective film layer 11 from the layer 12 can be easily separated.

The type of the first protective film layer 11 is not particularly limited, but it is preferable to include oriented polypropylene (OPP) in consideration of release force with the insulating layer 12 and economy.

The second protective film layer 13 is attached to the other surface opposite to one surface of the insulating layer 12 to protect the insulating layer 12 from external environmental factors, and when manufacturing a printed circuit board, the second protective film layer (13) is separated from the insulating layer 12 to prevent damage to the insulating layer 12. In addition, the second protective film layer 13 may include at least one of a concavo-convex structure and an embossed structure identical to or different from the first protective film layer 11 in order to adjust adhesive strength with the insulating layer 12 .

The type of the second protective film layer 13 is not particularly limited, but it is preferable to include polyethylene terepthalate (PET) in consideration of the release force and economy with the insulating layer 12 after curing.

In particular, the release force of the first protective film layer 11 with respect to the insulating layer 12 and the release force of the second protective film layer 13 with respect to the insulating layer 12 satisfy the following general formula 1 do.

[Formula 1]

< 1.0 0.1 <

< 1.0

In Formula 1, A and B represent the release force when peeling at 180 ° at room temperature, where A is the release force of the first protective film layer with respect to the insulating layer, and B is the insulating layer after curing. is the release force of the second protective film layer for

In general, a process of manufacturing an electronic device such as a printed circuit board includes a process of sequentially stacking and compressing insulating layers. In addition, prior to the process of laminating the insulating layer on the printed circuit board, a first process of separating a predetermined first protective film layer covered on one surface of the insulating layer is required, and the insulating layer is laminated and compressed on the printed circuit board. After curing, a second process of separating the predetermined second protective film layer covered on the other surface of the insulating layer is required.

More specifically, 2 shows a first step of separating the first protective film layer 11 from the insulating layer 12 prior to the step of curing the insulating film 10 on the electronic device substrate. 3 shows a second process of separating the second protective film layer 23 from the insulating layer 22 after curing the insulating film 20 on the electronic device substrate.

In the first process, when the release force of the first protective film layer 11 with respect to the insulating layer 12 is large, the insulating layer 12 is partially torn or the first protective film on the insulating layer 12 The problem of adhesion of residues of the layer 11 may occur. In addition, when the release force of the first protective film layer 11 with respect to the insulating layer 12 is large or the release force of the second protective film layer 13 with respect to the insulating layer 12 is small, the insulating layer after curing A problem in that the second protective film layer 13 to be separated from (12) is peeled off from the insulating layer 12 before curing may occur. Conversely, when the release force of the first protective film layer 11 with respect to the insulating layer 12 is small, the first protective film layer 11 is peeled off from the insulating layer 12 before proceeding with the first process. 1 A problem in which the protective film layer 11 cannot protect the insulating layer 12 from external environmental factors may occur.

In the second process, when the release force of the second protective film layer 23 with respect to the insulating layer 22 is large, the second protective film layer 23 is not easily peeled off from the cured insulating layer 22. Therefore, the insulating layer 22 may be partially torn or the residue of the second protective film layer 23 may be attached to the insulating layer 22, resulting in an increase in the defect rate in the process.

As such, in the manufacturing process of an electronic device such as a printed circuit board, the release force of the first protective film layer with respect to the insulating layer and the release force of the second protective film layer with respect to the insulating layer after curing are closely related to each other can know

The present invention derives an insulating film for manufacturing electronic devices that satisfies the relationship in which the release force of the first protective film layer with respect to the insulating layer and the release force of the second protective film layer with respect to the insulating layer satisfy the following general formula 1, The insulating film for manufacturing an electronic device according to the present invention has an effect of improving reliability of a product by simplifying the manufacturing process of an electronic device and reducing a defect rate in the process.

[Formula 1]

< 1.0 0.1 <

< 1.0

In Formula 1, A and B represent the release force when peeling at 180 ° at room temperature, where A is the release force of the first protective film layer with respect to the insulating layer, and B is the insulating layer after curing. is the release force of the second protective film layer for

More specifically, in Formula 1, A represents the release force of the first protective film layer with respect to the insulating layer, and the release force of A is preferably 0.2 gf/in to 2.0 gf/in. If the release force of A is less than 0.2 gf / in, the first protective film layer is peeled off from the insulating layer and there is a problem that the insulating layer cannot be protected from external environmental factors, and if the release force of A exceeds 2.0 gf / in, insulation A problem in which a layer is partially torn or a residue of the first protective film layer is attached to the insulating layer may occur.

Further, in Formula 1, B represents the release force of the second protective film layer with respect to the insulating layer after curing, and the release force of B is preferably 2.5 gf/in to 10 gf/in. If the release force of B is less than 2.5 gf / in, there is a problem that the second protective film layer to be separated after curing is peeled off before curing, and if the release force of B exceeds 10 gf / in, the second protection from the cured insulating layer Since the film layer is not easily peeled off, problems such as partial tearing of the cured insulating layer or adhesion of residues of the second protective film layer on the insulating layer may occur.

< 1.0을 만족하며, 바람직하게는 0.14 ≤

≤ 0.89 일 수 있다. In the above general formula 1, the relationship between the release force of A and the release force of B is 0.1 <

< 1.0, preferably 0.14 ≤

≤ 0.89.

≤ 0.1 인 경우 절연층으로부터 제1보호필름층이 박리되어 외부 환경 요소들로부터 절연층을 보호하지 못하는 문제가 발생되거나, 경화된 절연층으로부터 제2보호필름층이 박리될 때 절연층 상에 제2보호필름층의 잔여물이 부착되는 문제가 발생될 수 있다. 또한, 상기 일반식 1에서

≥ 1.0 인 경우 절연층과 제2보호필름층의 이형력 대비 절연층과 제1보호필름층의 이형력이 현저히 높음으로 인해 경화 후에 분리되어야 할 제2보호필름층이 경화 전에 절연층으로부터 박리되는 문제가 발생되거나, 절연층과 제1보호필름층이 용이하게 분리되지 않아 자동화 공정에 적용이 어려운 문제가 발생될 수 있다.In the above general formula 1

If ≤ 0.1, the first protective film layer is peeled off from the insulating layer, causing a problem of not protecting the insulating layer from external environmental factors, or when the second protective film layer is peeled off from the cured insulating layer, the first protective film layer is separated from the insulating layer. 2 There may be a problem that the residue of the protective film layer is attached. In addition, in the above general formula 1

In the case of ≥ 1.0, the release force of the insulating layer and the first protective film layer is significantly higher compared to the release force of the insulating layer and the second protective film layer, so that the second protective film layer to be separated after curing is separated from the insulating layer before curing. A problem may occur, or the insulating layer and the first protective film layer may not be easily separated, making it difficult to apply to an automated process.

The insulating film for manufacturing an electronic device according to the present invention can be used for a printed circuit board that can be easily embedded even in a narrow space, and can be used for a flexible printed circuit board that can be miniaturized and high-density and has repeated flexibility.

In addition, the printed circuit board is a key component of electronic products, such as mobile phones, cameras, laptops, computers and peripherals, wearable devices, video and audio devices, camcorders, printers, DVD players, TFT LCD display devices, satellite equipment, and military equipment. , And can be used for at least one of medical equipment, preferably can be used for at least one of mobile phones, cameras, laptops and wearable devices.

Hereinafter, a preferred embodiment is presented to aid understanding of the present invention. However, the following examples are provided to more easily understand the present invention, and the content of the present invention is not limited by the following examples.

<Example>

1. Example 1

(1) Preparation of Insulation Layer Composition

40 parts by weight of epoxy resin (manufacturer: Kukdo Chemical, product name: KDS8161), 40 parts by weight of epoxy resin (manufacturer: NIPPON KAYAKU, product name: NC-3000), 20 parts by weight of phenoxy resin (manufacturer: Gabriel, product name: PKHH), 4 parts by weight of nitrile-based rubber (manufacturer: ZEON, product name: NIPOL 1072CGX) was dissolved with 50 parts by weight of solvent naphtha while stirring and then heating. After cooling the mixture to room temperature, 40 parts by weight of a curing agent (manufacturer: DIC, product name: LA-7052), 0.1 part by weight of an imidazole-based curing accelerator (manufacturer: SHIKOKU, product name: 2E4MZ), 120 parts by weight of spherical silica (manufacturer: DIC, product name: LA-7052) : ADMATEC, product name: SC-2050MB) were mixed and uniformly dispersed with a mixer to prepare an insulating layer composition.

(2) Manufacture of insulating film

A polyethylene terephthalate film (manufacturer: Yulchon Chemical, product name: P38-S-3) was prepared as a second protective film, and the insulating layer composition was uniformly applied on the surface of the second protective film with a die coater, and 80 ° C. to 110 ° C. for 4 minutes to form an insulating layer on the second protective film. The cross-sectional thickness of the insulating layer was 35 μm. An oriented polypropylene film (manufacturer: manufactured by Ojitoku City Co., Ltd., product name: MA-411) was laminated on the surface of the insulating layer side at 70 ° C. and normal pressure to prepare an insulating film as a first protective film.

2. Example 2

In the process of preparing the insulating layer composition of Example 1, an insulating film was manufactured in the same manner as in Example 1, except that the content of the curing agent was adjusted to 23 parts by weight.

3. Example 3

In the process of preparing the insulating layer composition of Example 1, an insulating film was manufactured in the same manner as in Example 1, except that the content of the phenoxy resin was adjusted to 40 parts by weight.

4. Example 4

In the process of preparing the insulating layer composition of Example 1, an insulating film was manufactured in the same manner as in Example 1, except that the content of the spherical silica was adjusted to 150 parts by weight.

5. Example 5

In the process of preparing the insulating layer composition of Example 1, an insulating film was manufactured in the same manner as in Example 1, except that the content of the nitrile rubber was adjusted to 5 parts by weight.

6. Example 6

In the process of preparing the insulating layer composition of Example 1, 30 parts by weight of epoxy resin (manufacturer: Kukdo Chemical, product name: KDS8161) and 50 parts by weight of epoxy resin (manufacturer: NIPPON KAYAKU, product name: NC-3000) were excluded. Then, an insulating film and a silicon wafer substrate having the insulating film attached were prepared in the same manner as in Example 1.

7. Comparative Example 1

In the process of preparing the insulating layer composition of Example 1, an insulating film was manufactured in the same manner as in Example 1, except that titanium oxide was used instead of spherical silica.

8. Comparative Example 2

In the process of preparing the insulating layer composition of Example 1, an insulating film was manufactured in the same manner as in Example 1, except that the content of the spherical silica was adjusted to 10 parts by weight.

9. Comparative Example 3

In the process of preparing the insulating layer composition of Example 1, the content of phenoxy resin was 5 parts by weight, 10 parts by weight of epoxy resin (manufacturer: Kukdo Chemical, product name: KDS8161), 20 parts by weight of epoxy resin (manufacturer: NIPPON KAYAKU, Product name: NC-3000), an insulating film was prepared in the same manner as in Example, except that the content of spherical silica was adjusted to 140 parts by weight.

<Experimental Example 1> - Measurement of the release force of the first protective film before curing

After cutting the insulating films prepared in Examples 1 to 6 and Comparative Examples 1 to 3 at room temperature to 1 inch width, in order to measure the release force of the first protective film from the insulating layer, a TA device was used to measure 180 ° Peel was measured.

<Experimental Example 2> - Measurement of the release force of the second protective film after curing

After removing the first protective film from the insulating films prepared in Examples 1 to 6 and Comparative Examples 1 to 3, the insulating film was passed through a laminate heated at 60° and attached to the substrate. Then, in order to measure the release force of the second protective film from the insulating layer cured at room temperature, a 180° Peel was measured using a TA device.

<Experimental Example 3> - Evaluation of edge lift during peeling of the first protective film

Occurrence: Visually check the occurrence of peeling between the edge of the insulating layer and the second protective film before curing.

Non-occurrence: Peeling between the edge of the insulating layer and the second protective film before curing was not visually confirmed.

<Experimental Example 4> - Evaluation of suitability of the insulating layer when the second protective film is peeled off

Unsuitable: Visually confirm that the insulating layer is torn or that the second protective film remains on the surface of the insulating layer.

Conformity: Visually confirm that the insulation layer is torn and that the second protective film does not remain on the surface of the insulation layer.

The evaluation results of Experimental Examples 1 to 4 are shown in Table 1 below.

before hardening
of the first protective film
Release force (gf/in) After curing
Release force of the second protective film (gf/in)

*

* Edge lift when peeling off the first protective film Whether or not the insulating layer is suitable when the second protective film is peeled off Example 1 1.051 6.185 0.41 non-occurrence fitness Example 2 1.126 5.215 0.46 non-occurrence fitness Example 3 1.054 6.754 0.40 non-occurrence fitness Example 4 1.326 8.233 0.40 non-occurrence fitness Example 5 1.455 5.362 0.52 non-occurrence fitness Example 6 1.054 4.262 0.50 non-occurrence fitness Comparative Example 1 1.598 1.463 1.05 non-occurrence incongruity Comparative Example 2 0.105 15.560 0.08 generation fitness Comparative Example 3 1.542 1.514 1.01 non-occurrence incongruity

에서 A는 경화 전 제1보호필름의 이형력, B는 경화 후 제2보호필름의 이형력을 의미한다.* remind

In, A is the release force of the first protective film before curing, and B is the release force of the second protective film after curing.

< 1.0 을 만족하지 않는 비교예 2는 절연층으로부터 제2보호필름이 박리되는 현상이 발생하였다. 또한, 비교예 1 및 3은 경화 후 절연층으로부터 제2보호필름을 분리하는 경우 절연층이 찢어지거나, 절연층 표면 상에 제2보호필름이 잔존하는 현상이 발생하였다.As can be seen in Table 1 above, [General Formula 1] 0.1 <

In Comparative Example 2 not satisfying <1.0, a phenomenon in which the second protective film was peeled off from the insulating layer occurred. In Comparative Examples 1 and 3, when the second protective film was separated from the insulating layer after curing, the insulating layer was torn or the second protective film remained on the surface of the insulating layer.

Although the present invention has been described as above, the present invention is not limited by the embodiments disclosed herein, and it is obvious that various modifications can be made by a person skilled in the art within the scope of the technical spirit of the present invention. In addition, although the operational effects according to the configuration of the present invention have not been explicitly described and described while describing the embodiments of the present invention, it is natural that the effects predictable by the corresponding configuration should also be recognized.

Claims (12)

insulating layer;
a first protective film layer formed on one surface of the insulating layer; and
And a second protective film layer formed on the other side opposite to the one side of the insulating layer,
The second protective film layer is polyethylene terephthalate (PET),
An insulating film for manufacturing an electronic device satisfying the following general formula 1:
[Formula 1]
0.1 <

< 1.0
In Formula 1, A and B represent the release force when peeling at 180 ° at room temperature, where A is the release force of the first protective film layer with respect to the insulating layer, and B is the insulating layer after curing. Is the release force of the second protective film layer for
The B represents a release force of 2.5 gf/in to 10 gf/in.
According to claim 1,
Wherein A represents a release force of 0.2 gf / in to 2.0 gf / in
Insulation film for manufacturing electronic devices.
delete According to claim 1,
The first protective film layer is characterized in that it comprises at least one of a concave-convex structure and an embossed structure
Insulation film for manufacturing electronic devices.
According to claim 1,
The first protective film layer is characterized in that it comprises oriented polypropylene (OPP: Oriented polypropylene)
Insulation film for manufacturing electronic devices.
delete According to claim 1,
Characterized in that the cross-sectional thickness of the insulating layer is 25 μm to 50 μm
Insulation film for manufacturing electronic devices.
According to claim 1,
The insulating layer is characterized in that it comprises a thermosetting resin and a filler
Insulation film for manufacturing electronic devices.
According to claim 8,
Characterized in that the insulating layer comprises a filler of 50 parts by weight to 400 parts by weight based on 100 parts by weight of the thermosetting resin
Insulation film for manufacturing electronic devices.
According to claim 8,
Characterized in that the filler is spherical silica
Insulation film for manufacturing electronic devices.
The method of any one of claims 1, 2, 4, 5 and 7 to 10,
The insulating film for manufacturing electronic devices is characterized in that used for printed circuit boards
Insulation film for manufacturing electronic devices.
According to claim 11,
Characterized in that the printed circuit board is used for at least one of mobile phones, cameras, notebooks and wearable devices
Insulation film for manufacturing electronic devices.

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