KR20220002081A - Insulation film for electronic device manufacturing - Google Patents

Abstract

The present invention can provide a novel insulation film for manufacturing an electronic device, wherein the novel insulation film for manufacturing an electronic device comprises: an insulation layer; a first protective film layer formed on one surface of the insulation layer; and a second protective film layer formed on the other surface opposite to one surface of the insulation layer, and the relationship between the release force of the first protective film layer to the insulation layer and the release force of the second protective film layer to the insulation layer is precisely controlled. Thus, the insulation film has improved product reliability by simplifying a manufacturing process of an electronic device and increasing adhesion strength between the insulation film and an electronic device substrate.

Description

Insulation film for electronic device manufacturing

The present invention relates to an insulating film for manufacturing an electronic device, and more particularly, to an insulating film for improving the manufacturing process efficiency of an electronic device.

Recently, circuit boards such as printed circuit boards (PCBs) are manufactured by sequentially stacking and pressing various types of build-up insulating films for thinning and high integration. The build-up substrate is provided as an insulating film in the form of a thin sheet, and both sides of the insulating film are covered with predetermined protective films for protection from the external environment. The build-up board is prepared and transported in a form in which both sides of the insulating film are covered with protective films before the manufacturing process of the printed circuit board. Thereafter, during the manufacturing process of the printed circuit board, only the insulating film is selectively used by separating the protective films from the build-up board.

However, the protective films can be very easily peeled off from the 　 build-up substrate, and the insulating film may be damaged in the process of separating the protective films from the 　 build-up substrate. This phenomenon is because the release force of the protective films covering the insulating film is not precisely controlled. In order to solve this problem, it is necessary to study the release force between the insulating film and the protective film.

In order to solve the above problems, the present invention simplifies the electronic device manufacturing process by adjusting the release force between each protective film and the insulating film, and improves the reliability of the product by increasing the adhesion strength between the insulating film and the electronic device substrate. An object of the present invention is to provide an insulating film for manufacturing electronic devices.

However, the technical problem to be achieved by the present invention is not limited to the above-mentioned problems, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

According to an embodiment of the present invention, the insulating film for manufacturing an electronic device according to the present invention includes an insulating layer, a first protective film layer formed on one surface of the insulating layer, and a second protective film layer formed on the other surface opposite to one surface of the insulating layer. , and the general formula 1 is satisfied.

[General formula 1]

< 1.0 0.1 <

< 1.0

In Formula 1, A and B each represent a release force when peeling at 180° at room temperature, A is a release force of the first protective film layer with respect to the insulating layer, and B is a release force of the insulating layer after curing is the release force of the second protective film layer with respect to .

In the insulating film for manufacturing an electronic device according to the present invention, by precisely controlling the relationship between the releasing force of the first protective film layer with respect to the insulating layer and the releasing force of the second protective film layer with respect to the insulating layer, the electronic device manufacturing process When separating the first protective film layer from the insulating layer, it is possible to prevent the problem that the second protective film layer is peeled from the insulating layer.

In addition, when the second protective film layer is separated from the insulating layer after curing, it is possible to prevent the insulating layer from being torn or the residue of the second protective film layer from being attached to the insulating layer.

In addition, the uncured insulating layer and the second protective film layer can be cured at once, and the second protective film layer is easily separated from the insulating layer after curing, so that the substrate cracks including warpage of the electronic device substrate. can prevent

In addition, when the first protective film layer is separated from the insulating layer as described above, the second protective film layer is not peeled off from the insulating layer, so that it can be applied to an automated process.

In addition, since the first protective film layer is easily separated from the insulating layer, it is possible to prevent a phenomenon in which the insulating layer is partially torn or the residue of the first protective film layer is attached to the insulating layer.

1 is a cross-sectional view showing an insulating film according to an embodiment of the present invention.
2 is a cross-sectional view illustrating a first process of separating a first protective film layer from an insulating layer.
3 is a cross-sectional view illustrating a second process of separating the second protective film layer from the insulating layer after curing.
4 is a cross-sectional view illustrating an insulating film including a first protective film layer having an uneven structure according to an embodiment of the present invention.

The objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings and preferred embodiments. In the present specification, in adding reference numbers to the components of each drawing, it should be noted that only the same components are given the same number as possible even though they are indicated on different drawings. In addition, terms such as "first", "second", "one side", "the other side" are used to distinguish one component from other components, and it is not that the component is limited by the terms no. Hereinafter, in describing the present invention, detailed descriptions of related known technologies that may unnecessarily obscure the gist of the present invention will be omitted.

The insulating film for manufacturing an electronic device according to the present invention comprises an insulating layer, a first protective film layer formed on one surface of the insulating layer, and a second protective film layer formed on the other surface opposite to one surface of the insulating layer, Satisfies.

[General formula 1]

< 1.0 0.1 <

< 1.0

In Formula 1, A and B each represent a release force when peeling at 180° at room temperature, A is a release force of the first protective film layer with respect to the insulating layer, and B is a release force of the insulating layer after curing is the release force of the second protective film layer with respect to .

First, the insulating film for manufacturing an electronic device according to the present invention includes an insulating layer.

1 shows a cross-sectional view of an insulating film according to an embodiment of the present invention. As shown in FIG. 1 , the insulating film 10 according to the present invention has a structure in which an insulating layer 12 is laminated between a first protective film layer 11 and a second protective film layer 13 .

The insulating layer 12 secures insulation, and serves to prevent a short circuit from occurring even if a portion close to an electronic device, such as a printed circuit board, exhibits high electrical conductivity. The insulating layer 12 may be formed by curing an insulating resin material, and the insulating layer 12 may be an insulating film constituting a single layer of a multilayer printed circuit board.

The insulating layer 12 may include a thermosetting resin and a filler.

The thermosetting resin is not particularly limited as long as it is an insulating resin material, and may preferably be an epoxy resin. Examples of the epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AF type epoxy resin, dicyclopentadiene type epoxy resin, trisphenol epoxy resin, naphthol novolac epoxy resin, phenol Novolac type epoxy resin, tert-butyl-catechol type epoxy resin, naphthalene type epoxy resin, glycidylamine type epoxy resin, glycidyl ester type epoxy resin, cresol novolak type epoxy resin, biphenyl type epoxy resin, linear type and aliphatic epoxy resins, alicyclic epoxy resins, heterocyclic epoxy resins, spiro ring-containing epoxy resins, cyclohexanedimethanol type epoxy resins, naphthylene ether type epoxy resins, and trimethylol type epoxy resins. It can be used as or two or more types can be used in combination.

Examples of the filler include silica, alumina, barium sulfate, talc, clay, mica powder, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum borate, barium titanate, strontium titanate, calcium titanate, titanate. and magnesium, bismuth titanate, titanium oxide, barium zirconate, and calcium zirconate, and the filler may be used alone or in combination of two or more. The filler is preferably silica such as amorphous silica, fused silica, crystalline silica, synthetic silica, hollow silica, and more preferably, the filler is spherical silica.

The content of the filler included in the insulating layer 12 is preferably 50 parts by weight to 400 parts by weight based on 100 parts by weight of the thermosetting resin. When the content of the filler relative to 100 parts by weight of the thermosetting resin is less than 50 parts by weight, the coefficient of thermal expansion of the insulating layer 12 obtained by thermosetting may be increased. Accordingly, a difference between the thermal expansion coefficient of the insulating layer 12 and the thermal expansion coefficient of the electronic device in contact with the insulating layer 12 is generated, thereby causing defects in the electronic device or the insulating layer 12 is peeled from the electronic device. Problems may arise. When the content of the filler is more than 400 parts by weight relative to 100 parts by weight of the thermosetting resin, the mechanical strength of the insulating layer 12 may be reduced, and the insulating layer 12 and the electronic device in contact with the insulating layer 12 may be separated from each other by weight. Adhesion may be reduced.

In addition, the insulating layer 12 may further include a curing agent, a thermoplastic resin, a curing accelerator, a flame retardant, and an additive in addition to the thermosetting resin and the filler.

The curing agent is not particularly limited as long as it has a function of curing the thermosetting resin, and examples of the curing agent include a phenol-based curing agent, an active ester-based curing agent, a benzoxazine-based curing agent, and a cyanate ester-based curing agent. The curing agent may be used alone or in combination of two or more. Examples of the thermoplastic resin include phenoxy resin, polyvinyl acetal resin, polyimide resin, polyamideimide resin, polyethersulfone resin, and polysulfone resin, and the thermoplastic resin may be used alone or in two types. The above can be used in combination. Examples of the curing accelerator include an organic phosphine compound, an imidazole compound, an amine adduct compound, and a tertiary amine compound, and the curing accelerator may be used alone or in combination of two or more. Examples of the flame retardant include organic phosphorus-based flame retardants, organic nitrogen-containing phosphorus compounds, nitrogen compounds, silicone-based flame retardants, and metal hydroxides, and the flame retardant may be used alone or in combination of two or more. As the additive, rubber particles may be used as an example. Examples of the rubber particles include core-shell type rubber particles, cross-linked acrylonitrile butadiene rubber particles, cross-linked styrene butadiene rubber particles, and acrylic rubber particles, and the rubber particles. The particles may be used alone or in combination of two or more.

The cross-sectional thickness of the insulating layer 12 is not particularly limited, but considering the use applied to the printed circuit board, when the cross-sectional thickness of the insulating layer 12 is less than 25 μm, it is difficult to automate the process, and the insulating layer 12 If the cross-sectional thickness of the bar is less than 50 μm, economical efficiency, the insulating layer 12 has a cross-sectional thickness of preferably 25 μm to 50 μm.

Next, the insulating film for manufacturing an electronic device according to the present invention includes a first protective film layer formed on one surface of the insulating layer and a second protective film layer formed on the other surface opposite to one surface of the insulating layer.

1 is a cross-sectional view showing an insulating film according to an embodiment of the present invention. As shown in FIG. 1 , a first protective film layer 11 is formed on one surface of the insulating layer 12 constituting the insulating film 10 according to the present invention, and the other side of the insulating layer 12 one surface. A second protective film layer 13 is formed on the other surface.

The first protective film layer 11 may be attached to one surface of the insulating layer 12 to protect the insulating layer 12 from external environmental factors. In addition, the first protective film layer 11 may have a surface roughness to adjust the adhesive force with the insulating layer 12 , and the first protective film layer 11 has an uneven structure and an embossed structure. It may include at least one. As an example, FIG. 4 shows the first protective film layer 11 formed in a concave-convex structure on one surface of the insulating layer 12 . As shown in FIG. 4 , the bonding area of the first protective film layer 11 with the insulating layer 12 is relatively small compared to the case where the bonding surface with the insulating layer 12 is flat, so that the insulation The first protective film layer 11 from the layer 12 can be easily separated.

Although the type of the first protective film layer 11 is not particularly limited, it is preferable to include oriented polypropylene (OPP) in consideration of the releasability and economic feasibility with the insulating layer 12 .

The second protective film layer 13 is attached to the other surface opposite to one surface of the insulation layer 12 to protect the insulation layer 12 from external environmental factors, and when manufacturing a printed circuit board, the second protective film layer (13) is separated from the insulating layer 12, it is possible to prevent damage to the insulating layer (12). In addition, the second protective film layer 13 may include at least one of a concave-convex structure and an embossing structure to be the same as or different from that of the first protective film layer 11 in order to adjust the adhesive force with the insulating layer 12 .

The type of the second protective film layer 13 is not particularly limited, but it is preferable to include polyethylene terephthalate (PET) in consideration of the releasability and economic feasibility with the insulating layer 12 after curing.

In particular, the releasing force of the first protective film layer 11 with respect to the insulating layer 12 and the releasing force of the second protective film layer 13 with respect to the insulating layer 12 satisfy the following general formula (1) do.

[General formula 1]

< 1.0 0.1 <

< 1.0

In Formula 1, A and B each represent a release force when peeling at 180° at room temperature, A is a release force of the first protective film layer with respect to the insulating layer, and B is a release force of the insulating layer after curing is the release force of the second protective film layer with respect to .

In general, a process of manufacturing an electronic device such as a printed circuit board includes a process of sequentially stacking and compressing insulating layers. In addition, prior to the process of laminating the insulating layer on the printed circuit board, a first process of separating a predetermined first protective film layer covered on one surface of the insulating layer is required, and the insulating layer is laminated and compressed on the printed circuit board. After curing, a second process of separating a predetermined second protective film layer covered on the other surface of the insulating layer is required.

More specifically, 2 shows a first process of separating the first protective film layer 11 from the insulating layer 12 prior to the process of curing the insulating film 10 on the electronic device substrate. 3 shows a second process of separating the second protective film layer 23 from the insulating layer 22 after curing the insulating film 20 on the electronic device substrate.

In the first process, when the releasing force of the first protective film layer 11 with respect to the insulating layer 12 is large, the insulating layer 12 is partially torn or the first protective film on the insulating layer 12 is A problem may arise in which the residue of the layer 11 adheres. In addition, when the releasing force of the first protective film layer 11 with respect to the insulating layer 12 is large or when the releasing force of the second protective film layer 13 with respect to the insulating layer 12 is small, the insulating layer after curing The second protective film layer 13 to be separated from (12) may be peeled off from the insulating layer 12 before curing. Conversely, when the releasing force of the first protective film layer 11 with respect to the insulating layer 12 is small, the first protective film layer 11 is peeled off from the insulating layer 12 before the first process is performed. 1 There may be a problem that the protective film layer 11 does not protect the insulating layer 12 from external environmental factors.

In the second process, when the releasing force of the second protective film layer 23 with respect to the insulating layer 22 is large, the second protective film layer 23 is not easily peeled from the cured insulating layer 22 . As a result, the insulating layer 22 is partially torn or the residue of the second protective film layer 23 is attached to the insulating layer 22 , thereby increasing the defect rate in the process.

As such, in the manufacturing process of an electronic device such as a printed circuit board, there is a close relationship between the release force of the first protective film layer with respect to the insulating layer and the release force of the second protective film layer with respect to the insulating layer after curing. can be known

The present invention is by deriving an insulating film for manufacturing an electronic device that satisfies the relationship in which the releasing force of the first protective film layer with respect to the insulating layer and the releasing force of the second protective film layer with respect to the insulating layer satisfy the following general formula 1, The insulating film for manufacturing an electronic device according to the present invention has the effect of improving the reliability of the product by simplifying the manufacturing process of the electronic device and reducing the defect rate in the process.

[General formula 1]

< 1.0 0.1 <

< 1.0

In Formula 1, A and B each represent a release force when peeling at 180° at room temperature, A is a release force of the first protective film layer with respect to the insulating layer, and B is a release force of the insulating layer after curing is the release force of the second protective film layer with respect to .

More specifically, in Formula 1, A represents the release force of the first protective film layer with respect to the insulating layer, and the release force of A is preferably 0.2 gf/in to 2.0 gf/in. When the release force of A is less than 0.2 gf/in, there is a problem in that the first protective film layer is peeled off from the insulating layer and cannot protect the insulating layer from external environmental factors, and when the release force of A is more than 2.0 gf/in, insulation A problem in which the layer is partially torn or the residue of the first protective film layer is attached to the insulating layer may occur.

In addition, in Formula 1, B represents the release force of the second protective film layer with respect to the insulating layer after curing, and the release force of B is preferably 2.5 gf/in to 10 gf/in. When the release force of B is less than 2.5 gf/in, there is a problem that the second protective film layer to be separated after curing is peeled off before curing, and when the release force of B is more than 10 gf/in, the second protection from the cured insulating layer Since the film layer is not easily peeled off, a problem in which the cured insulating layer is partially torn or the residue of the second protective film layer is attached to the insulating layer may occur.

< 1.0을 만족하며, 바람직하게는 0.14 ≤

≤ 0.89 일 수 있다. In the above general formula 1, the relationship between the release force of A and the release force of B is 0.1 <

<1.0, preferably 0.14 ≤

≤ 0.89.

≤ 0.1 인 경우 절연층으로부터 제1보호필름층이 박리되어 외부 환경 요소들로부터 절연층을 보호하지 못하는 문제가 발생되거나, 경화된 절연층으로부터 제2보호필름층이 박리될 때 절연층 상에 제2보호필름층의 잔여물이 부착되는 문제가 발생될 수 있다. 또한, 상기 일반식 1에서

≥ 1.0 인 경우 절연층과 제2보호필름층의 이형력 대비 절연층과 제1보호필름층의 이형력이 현저히 높음으로 인해 경화 후에 분리되어야 할 제2보호필름층이 경화 전에 절연층으로부터 박리되는 문제가 발생되거나, 절연층과 제1보호필름층이 용이하게 분리되지 않아 자동화 공정에 적용이 어려운 문제가 발생될 수 있다.In the above general formula 1

When ≤ 0.1, the first protective film layer is peeled from the insulating layer, and there is a problem in that the insulating layer cannot be protected from external environmental factors, or when the second protective film layer is peeled off from the cured insulating layer, the first protective film layer is 2There may be a problem that the residue of the protective film layer is attached. In addition, in the above general formula 1

When ≥ 1.0, the second protective film layer to be separated after curing is peeled off from the insulating layer before curing because the release force of the insulating layer and the first protective film layer is significantly higher than that of the insulating layer and the second protective film layer. A problem may occur, or the insulating layer and the first protective film layer are not easily separated, which may cause a problem that is difficult to apply to an automated process.

The insulating film for manufacturing an electronic device according to the present invention can be used for a printed circuit board that can be easily embedded even in a narrow space, and can also be used for a flexible printed circuit board having compactness and high density, and having repetitive flexibility.

In addition, the printed circuit board is a core component of electronic products, and includes mobile phones, cameras, notebook computers, and peripheral devices, wearable devices, video and audio devices, camcorders, printers, DVD players, TFT LCD displays, satellite devices, and military equipment. , and may be used in at least one of medical equipment, and preferably may be used in at least one of a mobile phone, a camera, a notebook computer, and a wearable device.

Hereinafter, preferred examples are presented to help the understanding of the present invention. However, the following examples are only provided for easier understanding of the present invention, and the contents of the present invention are not limited by the following examples.

<Example>

1. Example 1

(1) Preparation of insulating layer composition

40 parts by weight of epoxy resin (Manufacturer: Kukdo Chemical, Product name: KDS8161), 40 parts by weight of epoxy resin (Manufacturer: NIPPON KAYAKU, Product name: NC-3000), 20 parts by weight of phenoxy resin (Manufacturer: Gabriel, Product name: PKHH), 4 parts by weight of nitrile-based rubber (manufacturer: ZEON, product name: NIPOL 1072CGX) was dissolved with 50 parts by weight of solvent naphtha, followed by stirring and heating. After cooling the mixture to room temperature, 40 parts by weight of a curing agent (manufacturer: DIC, product name: LA-7052), 0.1 parts by weight of an imidazole-based curing accelerator (manufacturer: SHIKOKU, product name: 2E4MZ), 120 parts by weight of spherical silica (manufacturer) : ADMATEC, product name: SC-2050MB) was mixed and uniformly dispersed with a mixer to prepare an insulating layer composition.

(2) manufacture of insulating film

Prepare a polyethylene terephthalate film (manufacturer: Yulchon Chemical, product name: P38-S-3) as a second protective film, and uniformly apply the insulating layer composition to the surface of the second protective film with a die coater, and at 80 ° C. to 110° C. for 4 minutes to form an insulating layer on the second protective film. The cross-sectional thickness of the insulating layer was 35 µm. An insulating film was prepared by laminating an orientated polypropylene film (manufactured by Ojitokushu, Co., Ltd., product name: MA-411) as a first protective film on the surface of the insulating layer at 70° C. and atmospheric pressure.

2. Example 2

An insulating film was prepared in the same manner as in Example 1, except that in the process of preparing the insulating layer composition of Example 1, the content of the curing agent was adjusted to 23 parts by weight.

3. Example 3

An insulating film was prepared in the same manner as in Example 1, except that the content of the phenoxy resin was adjusted to 40 parts by weight in the manufacturing process of the insulating layer composition of Example 1.

4. Example 4

An insulating film was prepared in the same manner as in Example 1, except that in the process of preparing the insulating layer composition of Example 1, the content of spherical silica was adjusted to 150 parts by weight.

5. Example 5

An insulating film was manufactured in the same manner as in Example 1, except that the content of the nitrile-based rubber was adjusted to 5 parts by weight in the process of preparing the insulating layer composition of Example 1.

6. Example 6

In the manufacturing process of the insulating layer composition of Example 1, 30 parts by weight of an epoxy resin (manufacturer: Kukdo Chemical, product name: KDS8161) and 50 parts by weight of an epoxy resin (manufacturer: NIPPON KAYAKU, product name: NC-3000) except that adjusted Then, an insulating film and a silicon wafer substrate to which the insulating film was attached were prepared in the same manner as in Example 1.

7. Comparative Example 1

An insulating film was prepared in the same manner as in Example 1, except that titanium oxide was used instead of spherical silica in the manufacturing process of the insulating layer composition of Example 1.

8. Comparative Example 2

An insulating film was prepared in the same manner as in Example 1, except that in the process of preparing the insulating layer composition of Example 1, the content of spherical silica was adjusted to 10 parts by weight.

9. Comparative Example 3

In the manufacturing process of the insulating layer composition of Example 1, the content of phenoxy resin was 5 parts by weight, 10 parts by weight of epoxy resin (manufacturer: Kukdo Chemical, product name: KDS8161), 20 parts by weight of epoxy resin (manufacturer: NIPPON KAYAKU, Product name: NC-3000), an insulating film was prepared in the same manner as in Example, except that the content of spherical silica was adjusted to 140 parts by weight.

<Experimental Example 1> - Measurement of release force of the first protective film before curing

After cutting the insulating films prepared in Examples 1 to 6 and Comparative Examples 1 to 3 to a width of 1 inch at room temperature, 180° using a TA device to measure the release force of the first protective film from the insulating layer Peel was measured.

<Experimental Example 2> - Measurement of release force of the second protective film after curing

After removing the first protective film from the insulating films prepared in Examples 1 to 6 and Comparative Examples 1 to 3, the insulating film was passed through a laminate heated to 60° and attached to the substrate. Then, 180° Peel was measured using a TA device to measure the release force of the second protective film from the insulating layer cured at room temperature.

<Experimental Example 3> - Evaluation of edge lift when the first protective film is peeled off

Occurrence: Visually confirm the occurrence of peeling between the edge of the insulating layer and the second protective film before curing.

Non-occurrence: Before curing, peeling between the edge of the insulating layer and the second protective film was not visually confirmed.

<Experimental Example 4> - Evaluation of the suitability of the insulating layer when the second protective film is peeled off

Inappropriate: Visually confirm that the insulating layer is torn or the second protective film remains on the surface of the insulating layer.

Suitable: Visually confirm that the insulating layer does not tear and the second protective film does not remain on the insulating layer surface.

The evaluation results of Experimental Examples 1 to 4 are shown in Table 1 below.

before curing
of the first protective film
Release force (gf/in) after curing
Release force of the second protective film (gf/in)

*

* Edge lift when peeling the first protective film Whether the insulating layer is suitable for peeling off the second protective film Example 1 1.051 6.185 0.41 non-occurring fitness Example 2 1.126 5.215 0.46 non-occurring fitness Example 3 1.054 6.754 0.40 non-occurring fitness Example 4 1.326 8.233 0.40 non-occurring fitness Example 5 1.455 5.362 0.52 non-occurring fitness Example 6 1.054 4.262 0.50 non-occurring fitness Comparative Example 1 1.598 1.463 1.05 non-occurring incongruity Comparative Example 2 0.105 15.560 0.08 Occur fitness Comparative Example 3 1.542 1.514 1.01 non-occurring incongruity

에서 A는 경화 전 제1보호필름의 이형력, B는 경화 후 제2보호필름의 이형력을 의미한다.* remind

where A is the releasing force of the first protective film before curing, and B is the releasing force of the second protective film after curing.

< 1.0 을 만족하지 않는 비교예 2는 절연층으로부터 제2보호필름이 박리되는 현상이 발생하였다. 또한, 비교예 1 및 3은 경화 후 절연층으로부터 제2보호필름을 분리하는 경우 절연층이 찢어지거나, 절연층 표면 상에 제2보호필름이 잔존하는 현상이 발생하였다.As can be seen in Table 1 above, [General Formula 1] 0.1 <

In Comparative Example 2, which does not satisfy <1.0, a phenomenon in which the second protective film was peeled off from the insulating layer occurred. In Comparative Examples 1 and 3, when the second protective film was separated from the insulating layer after curing, the insulating layer was torn or the second protective film remained on the surface of the insulating layer.

Although the present invention has been described as described above, the present invention is not limited by the embodiments disclosed herein, and it is apparent that various modifications may be made by those skilled in the art within the scope of the technical idea of the present invention. In addition, even if the effect of the configuration of the present invention is not explicitly described and described while describing the embodiment of the present invention, it is natural that the effect predictable by the configuration should also be recognized.

Claims (12)

insulating layer;
a first protective film layer formed on one surface of the insulating layer; and
a second protective film layer formed on the other surface opposite to one surface of the insulating layer;
An insulating film for manufacturing an electronic device that satisfies the following general formula 1:
[General formula 1]
0.1 <

< 1.0
In Formula 1, A and B each represent a release force when peeled by 180° at room temperature, A is a release force of the first protective film layer with respect to the insulating layer, and B is a release force of the insulating layer after curing is the release force of the second protective film layer with respect to .
According to claim 1,
Wherein A is characterized in that it represents a release force of 0.2 gf / in to 2.0 gf / in
Insulation film for manufacturing electronic devices.
According to claim 1,
Wherein B is characterized in that it represents a release force of 2.5 gf / in to 10 gf / in
Insulation film for manufacturing electronic devices.
According to claim 1,
wherein the first protective film layer includes at least one of a concave-convex structure and an embossed structure.
Insulation film for manufacturing electronic devices.
According to claim 1,
The first protective film layer is characterized in that it comprises an oriented polypropylene (OPP: Oriented polypropylene)
Insulation film for manufacturing electronic devices.
According to claim 1,
wherein the second protective film layer comprises polyethylene terephthalate (PET)
Insulation film for manufacturing electronic devices.
According to claim 1,
The insulating layer has a cross-sectional thickness of 25 μm to 50 μm.
Insulation film for manufacturing electronic devices.
According to claim 1,
The insulating layer is characterized in that it comprises a thermosetting resin and a filler
Insulation film for manufacturing electronic devices.
9. The method of claim 8,
The insulating layer is characterized in that it comprises 50 parts by weight to 400 parts by weight of the filler based on 100 parts by weight of the thermosetting resin.
Insulation film for manufacturing electronic devices.
9. The method of claim 8,
The filler is characterized in that spherical silica
Insulation film for manufacturing electronic devices.
11. The method according to any one of claims 1 to 10,
The insulating film for manufacturing an electronic device is used for a printed circuit board,
Insulation film for manufacturing electronic devices.
12. The method of claim 11,
The printed circuit board is used in at least one of a mobile phone, a camera, a notebook computer, and a wearable device,
Insulation film for manufacturing electronic devices.

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