CN111505905B - Dry film, cured product, and electronic component - Google Patents
Dry film, cured product, and electronic component Download PDFInfo
- Publication number
- CN111505905B CN111505905B CN201911004611.2A CN201911004611A CN111505905B CN 111505905 B CN111505905 B CN 111505905B CN 201911004611 A CN201911004611 A CN 201911004611A CN 111505905 B CN111505905 B CN 111505905B
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- China
- Prior art keywords
- resin
- film
- resin layer
- protective film
- dry film
- Prior art date
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- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- NNENFOSYDBTCBO-UHFFFAOYSA-M tributyl(hexadecyl)phosphanium;chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[P+](CCCC)(CCCC)CCCC NNENFOSYDBTCBO-UHFFFAOYSA-M 0.000 description 1
- QEXITCCVENILJI-UHFFFAOYSA-M tributyl(phenyl)azanium;chloride Chemical compound [Cl-].CCCC[N+](CCCC)(CCCC)C1=CC=CC=C1 QEXITCCVENILJI-UHFFFAOYSA-M 0.000 description 1
- GLSQMJPVEVGXMZ-UHFFFAOYSA-N tributyl-(2,5-dihydroxyphenyl)phosphanium;bromide Chemical compound [Br-].CCCC[P+](CCCC)(CCCC)C1=CC(O)=CC=C1O GLSQMJPVEVGXMZ-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- JSPLKZUTYZBBKA-UHFFFAOYSA-N trioxidane Chemical group OOO JSPLKZUTYZBBKA-UHFFFAOYSA-N 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/094—Multilayer resist systems, e.g. planarising layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/03—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers with respect to the orientation of features
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B2038/0052—Other operations not otherwise provided for
- B32B2038/0076—Curing, vulcanising, cross-linking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The present invention relates to a dry film, a cured product, and an electronic component. [ problem ] to provide: even if the slitting process is continuously performed, the resin does not adhere to the knife and the sharpness is not deteriorated, and as a result, breakage, floating of the resin at the end portion, and floating of the dry film of the protective film are not generated. A dry film comprising a carrier film, a resin layer, and a protective film, wherein the peel strength of the protective film to the resin layer is 0.010kgf/cm or more and the peel strength of the protective film to the resin layer is greater than the peel strength of the carrier film to the resin layer.
Description
Technical Field
The present invention relates to a dry film, a cured product, and an electronic component.
Background
Conventionally, dry films (laminated films) have been used as one of the formation schemes of protective films such as solder resists and interlayer insulating layers and insulating layers provided on printed circuit boards used in electronic devices and the like (for example, patent document 1). The dry film has a resin layer obtained by applying a resin composition having desired properties to a carrier film and then performing a drying process, and is generally distributed on the market in a state in which a protective film for protecting a surface opposite to the carrier film is further laminated. The printed wiring board having the protective film and the insulating layer as described above can be manufactured by applying (hereinafter also referred to as "lamination") a resin layer of the dry film to a substrate, and then performing patterning and curing treatment.
When the dry film is bonded to the substrate, the protective film is removed from the resin layer, but in order not to transfer the resin composition to the protective film at this time (hereinafter, also referred to as "accidental separation of resin"), conventionally, in the production process of the dry film, conditions have been adjusted so that the peel strength of the protective film from the resin composition becomes small. Patent document 2 discloses an adhesive sheet with a protective film, which does not cause resin peeling when peeling the protective film, and the peel strength of the protective film is smaller than that of the carrier film by 0.0020kgf/cm or more.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 2015-010179
Patent document 2: japanese patent No. 6353184
Disclosure of Invention
Problems to be solved by the invention
In the above-described three-layer dry film having a protective film and a carrier film, the curable resin composition is usually first subjected to viscosity adjustment according to the amount of solvent and applied to the carrier film, then dried in a drying oven to form a resin layer on the carrier film, and then the protective film is laminated on the surface of the produced dry film, thereby producing a long-sized dry film. The long dry film has a shape of, for example, 1m in width and 1000m in length, and is in a roll shape.
The long dry film is cut (cut) to a dry film by adjusting the width to 50cm according to the required length and width, but when the cutting is continuously performed over a length of 1000m, for example, as described above, the conventional dry film has problems such that the resin adheres to a knife and the sharpness is deteriorated, and as a result, the resin at the end portion is broken, lifted, and the protective film is lifted.
It is therefore an object of the present invention to provide: even if the slitting process is continuously performed, the resin does not adhere to the knife and the sharpness is not deteriorated, and as a result, breakage, floating of the resin at the end, and floating of the dry film of the protective film are not generated; a cured product of the resin layer of the dry film; and an electronic component having the cured product.
Solution for solving the problem
The inventors have conducted intensive studies and found that: the present invention has been accomplished in the light of the above problems, and has been accomplished by the present invention without any concern about transfer of a protective film to a resin composition at the time of removing the protective film from the resin layer, in the above-described cases, by using a dry film which sufficiently adheres the protective film to the resin layer and satisfies a constant peel strength of the protective film to the resin layer. That is, the dry film of the present invention comprises: the protective film has a peel strength of 0.010kgf/cm or more with respect to the resin layer, and the peel strength of the protective film with respect to the resin layer is greater than the peel strength of the carrier film with respect to the resin layer.
In the dry film of the present invention, the peel strength of the protective film is preferably 0.005kgf/cm or more greater than the peel strength of the carrier film to the resin layer.
The dry film of the present invention preferably has a thickness of 60 μm or more.
The dry film of the present invention preferably has adhesion to the protective film.
The cured product of the present invention is characterized by being obtained by curing the resin layer of the dry film.
The electronic component of the present invention is characterized by comprising the cured product.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, there may be provided: even if the slitting process is continuously performed, the resin does not adhere to the knife and the sharpness is not deteriorated, and as a result, breakage, floating of the resin at the end, and floating of the dry film of the protective film are not generated; a cured product of the resin layer of the dry film; and an electronic component having the cured product.
Drawings
Fig. 1 is a schematic cross-sectional view showing an embodiment of the dry film of the present invention.
Description of the reference numerals
11. Dry film with three-layer structure
12. Resin layer
13. Carrier film
14. Protective film
Detailed Description
< Dry film >
Fig. 1 shows a schematic cross-sectional view of the dry film according to the invention. The dry film 11 of the three-layer structure of the present invention has a structure in which a resin layer 12 is formed on a carrier film 13 and a protective film 14 is laminated. The dry film of the present invention is characterized in that in the dry film having such a three-layer structure, the peel strength of the protective film to the resin layer is 0.010kgf/cm or more, and the peel strength of the protective film to the resin layer is greater than the peel strength of the carrier film to the resin layer. Here, as the upper limit value of the peeling strength of the protective film to the resin layer, for example, if it is 0.150kgf/cm or less, transfer of the resin composition to the protective film can be satisfactorily prevented.
In the dry film of the present invention, the peel strength of the protective film to the resin layer is preferably 0.005kgf/cm or more greater than the peel strength of the carrier film to the resin layer. Here, as the upper limit value of the difference in peel strength, for example, if it is 0.150kgf/cm or less, transfer of the resin composition to the protective film can be satisfactorily prevented.
The dry film of the present invention satisfies the above characteristics, and therefore, even if the slitting process is continuously performed, the resin does not adhere to the knife and the sharpness is not deteriorated, and as a result, breakage, floating of the resin at the end portion and floating of the protective film do not occur. Such effects are apparent in dry films having a thickness of 60 μm or more, are further apparent in dry films having a thickness of 100 μm or more, and are particularly apparent in dry films having a thickness of 150 μm or more. The upper limit of the dry film thickness was 500. Mu.m.
[ protective film ]
The protective film is provided on the surface of the resin layer opposite to the carrier film for the purpose of preventing dust or the like from adhering to the surface of the resin layer of the dry film, preventing physical damage to the surface of the resin layer at the time of slitting the dry film, and improving the handleability. Examples of the material used for the protective film include polyolefin such as polyethylene, polypropylene, and polyvinyl chloride, polyester such as PET and PEN, polycarbonate, polyimide, and the like.
As the protective film of the present invention, any commercially available protective film may be used as long as the characteristics of the present invention that the peel strength of the protective film to the resin layer is 0.010kgf/cm or more and that the peel strength of the protective film to the resin layer is greater than the peel strength of the carrier film to the resin layer are satisfied. For example, biaxially oriented polypropylene films MA-411, MA-420, MAM-430, etc. manufactured by OjiF-Tex Co., ltd. Can be used by improving the peel strength of the protective film by adjusting the pressure and temperature at the time of bonding, and preferable examples include: futamura Chemical Co., ltd., heat-resistant micro-adhesive special polyester films T-APN10, somatac WA series (PS-105 WA, PS-1080WA, PS-503WA, etc.) made by Somar, film tape made by Temple of Kabushiki Kaisha (465#40, etc.), PEEK film adhesive tape (4920.012, etc.), silicone rubber double-sided adhesive tape (9030W), film having Lintec Corporation adhesive (MF, MA, enutakku, REPOP silicone micro adhesive, etc.) formed on PET and OPP film, adhesive film "Hitalex" made by Hitachi Kaisha-2400 series, D-5700 series, GS-1000 series, L-1200 series, L-3300 series, BN-1000, toyochem Co., ltd.
Here, the peel strength of the protective film to the resin layer in the present invention is the peel strength (90 ° peel strength) when the protective film is peeled off the resin layer in the vertical direction (90 ° direction), and the peel strength when the protective film is peeled off the resin layer at a peel angle of 90 ° is measured by a tensile tester. Examples of the tensile testing machine include a general-purpose tensile testing machine AG-X manufactured by Shimadzu corporation.
When the protective film is bonded to the resin layer, the protective film is preferably laminated to the resin layer by a roll, press bonding, or the like under a temperature condition around the lowest melting temperature of the curable resin composition. The pressure of the press-bonding in the lamination process is preferably 0.01kgf/cm 2 ～20kgf/cm 2 . Here, the definition of the minimum melting temperature is as follows.
Definition of minimum melting temperature
The dry film (40 μm) thus obtained was subjected to MVLP-500 (manufactured by Kyowa Co., ltd.) in a vacuum laminator under conditions of 50℃for 120 seconds and 0.5MPa for pressure and a release of the protective film surface, to prepare a sample for melt viscosity measurement having a thickness of 200 μm and a size of 50X 50 mm. Then, the film was processed into a round shape having a measurement dimension of 20mm, and the PET film on the front and back surfaces was peeled off to prepare a sample for measurement. Thereafter, melt viscosity was measured by a rheometer HAAKE MARS (manufactured by Thermo Fisher) under the following conditions, and the viscosity was defined in this case. The measurement was performed by a temperature rising method of measuring 180 μm in a gap between samples and 5℃per minute from room temperature using a vibration mode of a sensor parallel plate of phi 20mm, a strain of 2% and a frequency of 1Hz, and the measurement was defined by the temperature at which the viscosity of the material became lowest.
Here, in order to increase the peel strength of the protective film to the resin layer as much as possible while using the protective film having no micro-adhesiveness to the range of the present invention, it is necessary to make the bonding temperature higher than the conventional bonding temperature, but in the above case, when unevenness occurs in the bonding temperature, or when the bonding temperature excessively increases, there are the following problems: the problem of stretching the protective film and the problem of curling due to the difference in shrinkage rates between the protective film and the resin layer and between the protective film and the carrier film at the time of shrinkage after lamination. Therefore, in the present invention, it is preferable to use an adhesive protective film such as a micro-adhesive protective film for the reason that the peeling strength of the protective film can be improved without increasing the bonding temperature. As a constituent material of the adhesive layer of the protective film having adhesiveness, a styrene-based polymer or a styrene-isoprene-based polymer is preferable.
In addition, as the protective film, a biaxially stretched polypropylene film is preferably used from the viewpoint of reducing the cooling shrinkage after lamination of the resin layer.
The thickness of the protective film is not particularly limited and may be appropriately selected in the range of approximately 10 to 100 μm depending on the application. The surface of the protective film on which the resin layer is provided is preferably subjected to a treatment for improving adhesion, such as embossing, corona treatment, or micro-adhesion, and a mold release treatment.
[ resin layer ]
The resin layer of the dry film of the present invention is generally in a state called B-stage state and is obtained from a curable resin composition, specifically, is obtained by applying a curable resin composition onto a film and then drying the film. The thickness of the resin layer is not particularly limited, and may be, for example, 1 to 200. Mu.m. In the present invention, since the flatness is more excellent when the thickness is large, it is possible to suitably use a thickness of 30 μm or more, more preferably 50 μm or more, and still more preferably 100 μm or more, for example. The resin layer having a thickness exceeding 200 μm may be formed by stacking a plurality of resin layers of the dry film of the present invention. In this case, a roll laminator or a vacuum laminator may be used.
The resin layer preferably contains a curable resin, and may contain an epoxy resin, for example. The epoxy resin is a resin having an epoxy group, and any conventionally known resin may be used. Examples of the method include: a 2-functional epoxy resin having 2 epoxy groups in the molecule, a multifunctional epoxy resin having 3 or more epoxy groups in the molecule, and the like. It is to be noted that hydrogenated epoxy resin may be used. The resin layer contains at least any one of a semi-solid epoxy resin and a crystalline epoxy resin as the epoxy resin. The semi-solid epoxy resin and the crystalline epoxy resin may be used singly or in combination of 2 or more kinds, respectively. The resin layer may contain a solid epoxy resin or a liquid epoxy resin. In the present specification, the solid epoxy resin means an epoxy resin which is solid at 40 ℃, the semi-solid epoxy resin means an epoxy resin which is solid at 20 ℃ and liquid at 40 ℃, and the liquid epoxy resin means an epoxy resin which is liquid at 20 ℃. The determination of the liquid state is performed according to an additional "confirmation method of liquid state" 2 (province of the ministry of life of flat-forming autonomous province No. 1) regarding the test and the property of dangerous objects. For example, the method is carried out by the method described in paragraphs 23 to 25 of Japanese patent application laid-open No. 2016-079384. The crystalline epoxy resin means an epoxy resin having strong crystallinity, and means a thermosetting epoxy resin having a low viscosity equivalent to that of a liquid resin when melted, although the polymer chains are regularly arranged at a temperature equal to or lower than the melting point.
Examples of the semi-solid epoxy resin include bisphenol A type epoxy resins such as EPICLON860, EPICLON900-IM, EPICLONEXA-4816, EPICLON EXA-4812, epotoo YD-134, mitsubishi chemical corporation, jER834, jER872, and ELA-134; naphthalene type epoxy resins such as EPICLON HP-4032 manufactured by DIC Co., ltd; and phenol novolac type epoxy resins such as EPICLON N-740 manufactured by DIC Co., ltd.
As the semi-solid epoxy resin, at least one selected from the group consisting of bisphenol a type epoxy resin, naphthalene type epoxy resin, and phenol novolac type epoxy resin is preferably contained. By including the semi-solid epoxy resin, the glass transition temperature (Tg) of the cured product becomes high, the CTE becomes low, and crack resistance is excellent.
As the crystalline epoxy resin, for example, crystalline epoxy resins having a biphenyl structure, a thioether structure, a phenylene structure, a naphthalene structure, or the like can be used. The biphenyl type epoxy resins are supplied, for example, in the form of jor YX4000, jor YX4000H, jor YL6121H, jor YL6640, jor YL6677, the diphenyl sulfide type epoxy resins are supplied, for example, in the form of epooto YSLV-120TE, manufactured by tokyo chemical company, and the phenylene type epoxy resins are supplied, for example, in the form of epooto YDC-1312, manufactured by tokyo chemical company, and the naphthalene type epoxy resins are supplied, for example, in the form of epoilon HP-4032, epoilon HP-4032D, and epoilon HP-4700, manufactured by DIC corporation. As the crystalline epoxy resin, there may be used EPOTOTO YSLV-90C (product of Dongdu chemical Co., ltd.) and TEPIC-S (triglycidyl isocyanurate) (product of Nissan chemical Co., ltd.).
Examples of the solid epoxy resin include naphthalene type epoxy resins such as HP-4700 (naphthalene type epoxy resin) manufactured by DIC Co., ltd., EXA4700 (4-functional naphthalene type epoxy resin) manufactured by DIC Co., ltd., and NC-7000 (multifunctional solid epoxy resin containing naphthalene skeleton) manufactured by Japanese chemical Co., ltd.; an epoxide (triphenol epoxy resin) of a condensate of phenols such as EPPN-502H (triphenol epoxy resin) manufactured by Kagaku Co., ltd., and an aromatic aldehyde having a phenolic hydroxyl group; dicyclopentadiene aralkyl type epoxy resins such as EPICLON HP-7200H (dicyclopentadiene skeleton-containing multifunctional solid epoxy resin) manufactured by DIC Co., ltd; biphenyl aralkyl type epoxy resins such as NC-3000H (biphenyl skeleton-containing polyfunctional solid epoxy resin) manufactured by japan chemical company; biphenyl/phenol novolac type epoxy resins such as NC-3000L manufactured by japan chemical company; novolac type epoxy resins such as EPICLON 660, EPICLON 690, and N770 manufactured by DIC Co., ltd., EOCN-104S manufactured by Japanese chemical Co., ltd; phosphorus-containing epoxy resins such as TX0712, available from Nippon Temminck chemical Co., ltd; and tris (2, 3-epoxypropyl) isocyanurate such as TEPIC, manufactured by daily chemical company. By including the solid epoxy resin, the glass transition temperature of the cured product becomes high, and the heat resistance is excellent.
Examples of the liquid epoxy resin include bisphenol a type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, phenol novolac type epoxy resin, t-butylcatechol type epoxy resin, glycidylamine type epoxy resin, aminophenol type epoxy resin, alicyclic type epoxy resin, and the like. By containing a liquid epoxy resin, the dry film is excellent in flexibility.
The total amount of the semi-solid epoxy resin and the crystalline epoxy resin is preferably 5 to 40% by mass, more preferably 10 to 30% by mass, based on the total amount of the epoxy resin. When the content is within the above range, the resin layer of the dry film is excellent in tackiness and flexibility.
[ inorganic filler ]
The resin layer preferably contains an inorganic filler. By compounding the inorganic filler, curing shrinkage of the obtained cured product can be suppressed, and thermal characteristics such as adhesion, hardness, and crack resistance generated in conformity with the thermal strength of the conductor layer such as copper located around the insulating layer can be improved. The inorganic filler is not limited to a specific material, and examples thereof include silica such as barium sulfate, barium titanate, amorphous silica, crystalline silica, fused silica, and spherical silica, talc, clay, and noorupo silica particles, boehmite, magnesium carbonate, calcium carbonate, titanium oxide, aluminum hydroxide, silicon nitride, aluminum nitride, and calcium zirconate, and metallic powders such as copper, tin, zinc, nickel, silver, palladium, aluminum, iron, cobalt, gold, and platinum. The inorganic filler is preferably spherical particles. Among them, silica is preferable, and the cured product of the curable composition is suppressed from shrinking in curing, and has lower CTE, and further, has improved properties such as adhesion and hardness. In addition, although the sedimentation rate of an inorganic filler having a large specific gravity is generally increased as in alumina, the sedimentation can be suppressed in the present invention, and thus the inorganic filler can be suitably used. The average particle diameter (median particle diameter, D50) of the inorganic filler is preferably 0.01 to 10. Mu.m. From the viewpoint of the slitting processability, silica having an average particle diameter of 0.01 to 3 μm is preferable as the inorganic filler. In the present specification, the average particle diameter of the inorganic filler is an average particle diameter including not only the particle diameter of the primary particles but also the particle diameter of the secondary particles (aggregates). The average particle diameter can be obtained by a laser diffraction type particle diameter distribution measuring device. Examples of the measuring device by the laser diffraction method include microtracwave manufactured by microtracbl corp.
The inorganic filler may be subjected to surface treatment. As the surface treatment, a surface treatment using a coupling agent, an alumina treatment, or the like may be performed without introducing an organic group. The surface treatment method of the inorganic filler is not particularly limited, and a known and conventional method may be used, and the surface of the inorganic filler may be treated with a surface treatment agent having a curable reactive group, for example, a coupling agent having a curable reactive group as an organic group, or the like.
The inorganic filler may be blended with an epoxy resin or the like in a powder or solid state, or may be mixed with a solvent or a dispersant to form a slurry and then blended with an epoxy resin or the like.
The inorganic filler may be used alone or in the form of a mixture of 2 or more. The amount of the inorganic filler to be blended is preferably 10 to 90% by mass, more preferably 50 to 90% by mass, still more preferably 60 to 90% by mass, based on the total amount of solid components of the resin layer of the dry film. When the amount of the inorganic filler is 10 mass% or more, thermal expansion is suppressed and heat resistance is improved, while when it is 90 mass% or less, occurrence of cracks can be suppressed.
[ curing agent ]
The resin layer preferably contains a curing agent. Examples of the curing agent include a compound having a phenolic hydroxyl group, a polycarboxylic acid and an anhydride thereof, a compound having a cyanate group, a compound having an active ester group, a compound having a maleimide group, and an alicyclic olefin polymer. The curing agent may be used alone or in combination of 2 or more.
In the present invention, the resin layer preferably contains at least 1 of a compound having a phenolic hydroxyl group, a compound having an active ester group, a compound having a cyanate group, and a compound having a maleimide group. By using a compound having a phenolic hydroxyl group and a compound having an active ester group, a cured product excellent in adhesion to a low-roughness substrate or a circuit can be obtained. In addition, by using cyanate ester, tg of the cured product becomes high, heat resistance improves, and by using a compound having maleimide group, tg of the cured product becomes high, heat resistance improves, and CTE can be lowered.
As the compound having a phenolic hydroxyl group, there may be used: phenol novolac resins, alkylphenol novolac resins, bisphenol a novolac resins, dicyclopentadiene type novolac resins, xylok type novolac resins, terpene modified novolac resins, cresol/naphthol resins, polyvinylphenols, phenol/naphthol resins, phenol/naphthol skeleton-containing novolac resins, triazine skeleton-containing cresol novolac resins, biphenyl aralkyl type novolac resins, xylok type phenol novolac resins, and the like.
Of the above compounds having phenolic hydroxyl groups, those having a hydroxyl equivalent weight of 100g/eq. Or more are preferred. Examples of the compound having a phenolic hydroxyl group having a hydroxyl group equivalent of 100g/eq. Dicyclopentadiene-skeleton phenol novolac resins (GDP series, manufactured by Rong Chemicals Co., ltd.), xylok-type phenol novolac resins (MEH-7800, manufactured by Ming and Chemicals Co., ltd.), biphenyl aralkyl-type novolac resins (MEH-7851, manufactured by Ming and Chemicals Co., ltd.), naphthol aralkyl-type curing agents (SN series, manufactured by Nippon Kagaku Co., ltd.), triazine-containing cresol novolac resins (manufactured by LA-3018-50P, DIC Co., ltd.), triazine-containing phenol novolac resins (manufactured by LA-705N, DIC Co., ltd.), and the like.
The compound having a cyanate group is preferably a compound having 2 or more cyanate groups (-OCN) in one molecule. Any of the conventionally known compounds having a cyanate group can be used. Examples of the compound having a cyanate group include phenol novolac type cyanate resin, alkylphenol novolac type cyanate resin, dicyclopentadiene type cyanate resin, bisphenol a type cyanate resin, bisphenol F type cyanate resin, and bisphenol S type cyanate resin. In addition, the prepolymer may be partially triazinized.
The compounds having a cyanate group which are commercially available include: phenol novolac type polyfunctional cyanate resin (manufactured by Lonza Japan Ltd, PT 30S), prepolymer in which part or all of bisphenol a dicyanate is triazinized to form a trimer (manufactured by Lonza Japan Ltd, BA230S 75), dicyclopentadiene structure-containing cyanate resin (manufactured by Lonza Japan Ltd, DT-4000, DT-7000), and the like.
The compound having an active ester group is preferably a compound having 2 or more active ester groups in one molecule. The compound having an active ester group can be generally obtained by a condensation reaction of a carboxylic acid compound with a hydroxyl compound. Among them, compounds having an active ester group obtained by using a phenol compound or a naphthol compound as a hydroxyl compound are preferable. Examples of the phenol compound or the naphthol compound include hydroquinone, resorcinol, bisphenol a, bisphenol F, bisphenol S, phenolphthalein, methylated bisphenol a, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α -naphthol, β -naphthol, 1, 5-dihydroxynaphthalene, 1, 6-dihydroxynaphthalene, 2, 6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucinol, dicyclopentadiene diphenol, phenol novolac, and the like. In addition, the compound having an active ester group may be a naphthalene diol alkyl/benzoic acid type.
Examples of the commercially available compounds having an active ester group include dicyclopentadiene-type diphenol compounds, for example, HPC8000-65T (manufactured by DIC Co., ltd.), HPC8100-65T (manufactured by DIC Co., ltd.), and HPC8150-65T (manufactured by DIC Co., ltd.).
The maleimide group-containing compound is a compound having a maleimide skeleton, and any conventionally known compound can be used. The maleimide group-containing compound preferably has at least one of 2 or more maleimide skeletons, more preferably N, N ' -1, 3-phenylenedimaleimide, N ' -1, 4-phenylenedimaleimide, N ' -4, 4-diphenylmethane bismaleimide, 1, 2-bis (maleimide) ethane, 1, 6-bismaleimide hexane, 1, 6-bismaleimide- (2, 4-trimethyl) hexane, 2' -bis- [4- (4-maleimide phenoxy) phenyl ] propane, 3' -dimethyl-5, 5' -diethyl-4, 4' -diphenylmethane bismaleimide, 4-methyl-1, 3-phenylenedimaleimide, bis (3-ethyl-5-methyl-4-maleimidophenyl) methane, bisphenol A diphenyl ether bismaleimide, polyphenylmethane maleimide, and oligomers thereof, and diamine condensates having maleimide skeletons. The oligomer is obtained by condensing a maleimide group-containing compound as a monomer among the maleimide group-containing compounds.
Examples of commercially available compounds having a maleimide group include BMI-1000 (4, 4 '-diphenylmethane bismaleimide, manufactured by Dai-Chemie Co., ltd.), BMI-2300 (phenylmethane bismaleimide, manufactured by Dai-Chemie Co., ltd.), BMI-3000 (m-phenylene bismaleimide, manufactured by Dai-Chemie Co., ltd.), BMI-5100 (3, 3' -dimethyl-5, 5 '-dimethyl-4, 4' -diphenylmethane bismaleimide, manufactured by Dai-Chemie Co., ltd.), BMI-7000 (4-methyl-1, 3-phenylene bismaleimide, manufactured by Dai-Chemie Co., ltd.), BMI-TMH ((1, 6-bismaleimide-2, 4-trimethyl Co., ltd.), and the like.
The amount of the curing agent to be blended is preferably 20 to 100 parts by mass, more preferably 25 to 90 parts by mass, based on 100 parts by mass of the epoxy resin.
Specific examples of the curable resin composition for forming the resin layer include, but are not limited to, a thermosetting resin composition, a photo-curable thermosetting resin composition containing a photopolymerization initiator, a photo-curable thermosetting resin composition containing a photo-alkaline agent, a photo-curable thermosetting resin composition containing a photo-acid generator, a negative photo-curable thermosetting resin composition, a positive photosensitive thermosetting resin composition, an alkali-developable photo-curable thermosetting resin composition, a solvent-developable photo-curable thermosetting resin composition, a swelling-peelable thermosetting resin composition, and a dissolution-peelable thermosetting resin composition.
Hereinafter, as an example, a case where a resin layer is formed from a thermosetting resin composition containing no photocurable component will be described with respect to components that may be contained in addition to the above components.
The resin layer may contain a thermosetting resin other than an epoxy resin, and for example, may be used: known and used thermosetting resins such as isocyanate compounds, blocked isocyanate compounds, amino resins, benzoxazine resins, carbodiimide resins, cyclic carbonate compounds, polyfunctional oxetane compounds and episulfide resins.
The resin layer may further contain a thermoplastic resin in order to improve the mechanical strength of the resulting cured film. The thermoplastic resin is preferably soluble in a solvent. When the resin is soluble in a solvent, the flexibility of the dry film is improved, and the occurrence of cracks and powder falling can be suppressed. Examples of the thermoplastic resin include thermoplastic polyhydroxy polyether resins, phenoxy resins as condensates of epichlorohydrin and various 2-functional phenol compounds, phenoxy resins obtained by esterifying hydroxyl groups of hydroxyl ether groups present on the skeleton with various acid anhydrides and/or acid halides, polyvinyl acetal resins, polyamide imide resins, block copolymers, and the like. The thermoplastic resin may be used alone or in combination of 1 or more than 2.
The resin layer contains a polymer resin. The glass transition point of the polymer resin is preferably-40 to 20 ℃, more preferably-15 to 15 ℃, particularly preferably-5 to 15 ℃. When the temperature is from-5 to 15 ℃, warpage of the cured product can be favorably suppressed.
Further, the higher the weight average molecular weight of the polymer resin, the greater the anti-sedimentation effect of the inorganic filler, and therefore, it is preferably 10 ten thousand or more, more preferably 20 ten thousand or more. The upper limit is, for example, 100 ten thousand or less.
The polymer resin may be a polymer resin having 1 or more kinds of backbones selected from butadiene backbones, amide backbones, imide backbones, acetal backbones, carbonate backbones, ester backbones, urethane backbones, acrylic backbones, and siloxane backbones. Examples thereof include: the polymer resins having a butadiene skeleton (such AS "G-1000", "G-3000", "GI-1000", "GI-3000", manufactured by Caesada, kabushiki Kaisha, R-45EPI ", daicel Chemical Industries, ltd., manufactured by Kaisha, PB3600", "EPFD AT501", manufactured by Clay Valley, "Ricon130", "Ricon142", "Ricon150", "Ricon657", "Ricon130MA", manufactured by Clay Valley), polymer resins having a butadiene skeleton and a polyimide skeleton (such AS those described in Japanese patent application laid-open No. 2006-37083), and polymer resins having an acrylic skeleton (such AS "SG-P3", "SG-600LB", "SG-280", "SG-790", "SG-K2", manufactured by Kogyo Kaisha, SN-50"," AS-3000E "," ME-2000 ").
The blending amount of the thermoplastic resin is preferably 0.5 to 20% by mass, more preferably 0.5 to 10% by mass, based on the total amount of the solid components of the resin layer. When the blending amount of the thermoplastic resin is within the above range, a uniform rough surface state is easily obtained.
The resin layer may contain rubber-like particles as needed. Examples of such rubber-like particles include polybutadiene rubber, polyisoprene rubber, urethane-modified polybutadiene rubber, epoxy-modified polybutadiene rubber, acrylonitrile-modified polybutadiene rubber, carboxyl-modified polybutadiene rubber, acrylonitrile-butadiene rubber modified with carboxyl groups or hydroxyl groups, crosslinked rubber particles thereof, core-shell rubber particles, and the like, and 1 or 2 or more kinds thereof may be used singly or in combination. These rubber-like particles are added to improve the flexibility of the resulting cured film, to improve crack resistance, to enable surface roughening treatment with an oxidizing agent, and to improve adhesion strength with copper foil or the like.
The average particle diameter of the rubber-like particles is preferably in the range of 0.005 to 1. Mu.m, more preferably in the range of 0.2 to 1. Mu.m. The average particle diameter of the rubber-like particles of the present invention can be obtained by a laser diffraction type particle diameter distribution measuring apparatus. For example, the rubber-like particles can be measured by uniformly dispersing the rubber-like particles in an appropriate organic solvent by ultrasonic waves or the like, and preparing a particle size distribution of the rubber-like particles on a mass basis using Nanotrac wave manufactured by Nikkin corporation, and taking the median particle size as the average particle size.
The blending amount of the rubber-like particles is preferably 0.5 to 10% by mass, more preferably 1 to 5% by mass, based on the total amount of the solid components of the resin layer. When the amount is 0.5 mass% or more, crack resistance can be obtained, and adhesion strength to a conductor pattern or the like can be improved. When the amount is 10% by mass or less, the Coefficient of Thermal Expansion (CTE) decreases, the glass transition temperature (Tg) increases, and the curing property improves.
The resin layer may contain a curing accelerator. The curing accelerator is a substance that promotes a heat curing reaction, and is used to further improve the properties such as adhesion, chemical resistance, and heat resistance. Specific examples of such a curing accelerator include imidazole and its derivatives; guanamines such as acetoguanamine and benzoguanamine; polyamines such as diaminodiphenylmethane, m-phenylenediamine, m-xylylenediamine, diaminodiphenyl sulfone, dicyandiamide, urea derivatives, melamine and polybasic hydrazides; organic acid salts and/or epoxy adducts thereof; amine complexes of boron trifluoride; triazine derivatives such as ethyl diamino-s-triazine, 2, 4-diamino-s-triazine, and 2, 4-diamino-6-xylyl-s-triazine; amines such as trimethylamine, triethanolamine, N-dimethyloctylamine, N-benzyldimethylamine, pyridine, N-methylmorpholine, hexa (N-methyl) melamine, 2,4, 6-tris (dimethylaminophenol), tetramethylguanidine, and m-aminophenol; polyphenols such as polyvinyl phenol, polyvinyl phenol bromide, phenol novolac, alkylphenol novolac, and the like; organic phosphines such as tributylphosphine, triphenylphosphine and tri-2-cyanoethylphosphine; phosphonium salts such as tri-n-butyl (2, 5-dihydroxyphenyl) phosphonium bromide and cetyl tributyl phosphonium chloride; quaternary ammonium salts such as benzyl trimethyl ammonium chloride and phenyl tributyl ammonium chloride; the aforementioned polybasic acid anhydrides; photo-cation polymerization catalysts such as diphenyliodonium tetrafluoroborate, triphenylsulfonium hexafluoroantimonate, and 2,4, 6-triphenylthiopyrylium hexafluorophosphate; styrene-maleic anhydride resin; the curing accelerators are conventionally known, such as an equimolar reactant of phenyl isocyanate and dimethylamine, an equimolar reactant of organic polyisocyanate such as toluene diisocyanate and isophorone diisocyanate and dimethylamine, and a metal catalyst. Among the curing accelerators, phosphonium salts are preferred in view of obtaining BHAST (Biased Highly Accelerated Stress Test) resistance.
The curing accelerator may be used alone or in combination of 1 or more than 2. The curing accelerator is not necessarily used, but may be used in a range of preferably 0.01 to 5 parts by mass relative to 100 parts by mass of the epoxy resin in the case where acceleration of curing is particularly desired. In the case of the metal catalyst, the amount of the metal catalyst is preferably 10 to 550ppm, more preferably 25 to 200ppm in terms of metal, per 100 parts by mass of the compound having a cyanate group.
The organic solvent is not particularly limited, and examples thereof include ketones, aromatic hydrocarbons, glycol ethers, glycol ether acetates, esters, alcohols, aliphatic hydrocarbons, and petroleum solvents. Specifically, ketones such as methyl ethyl ketone, cyclohexanone, methyl butyl ketone, and methyl isobutyl ketone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, dipropylene glycol diethyl ether, triethylene glycol monoethyl ether, and the like; esters such as ethyl acetate, butyl acetate, isobutyl acetate, ethylene glycol monoethyl ether acetate, dipropylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, and propylene glycol butyl ether acetate; alcohols such as ethanol, propanol, 2-methoxypropanol, n-butanol, isobutanol, isoamyl alcohol, ethylene glycol, and propylene glycol; aliphatic hydrocarbons such as octane and decane; petroleum solvents such as petroleum ether, naphtha, hydrogenated naphtha and solvent naphtha, and N, N-Dimethylformamide (DMF), tetrachloroethylene, terpineol, and the like. Organic solvents such as SWASOL1000, SWASOL1500, solvent #100, solvent #150, SHELLSOL A100, SHELLSOL A150, IPSOL100, and IPSOL150 from Walsh Petroleum Co., ltd. The organic solvent may be used alone or in the form of a mixture of 2 or more.
The amount of the residual solvent in the resin layer is preferably 0.5 to 7.0 mass%. When the residual solvent is 7.0 mass% or less, the bumping during heat curing is suppressed, and the surface flatness is further improved. In addition, the resin can be prevented from flowing due to excessive reduction in melt viscosity, and the flatness is improved. When the residual solvent is 0.5 mass% or more, the fluidity at the time of lamination is good, and the flatness and embeddability become further good.
The resin layer may further contain conventionally known colorants such as phthalocyanine blue, phthalocyanine green, iodine green, disazo yellow, crystal violet, titanium oxide, carbon black, and naphthalene black, conventionally known thickeners such as asbestos, ORBEN, BENTON, and fine silica, defoaming agents and/or leveling agents such as silicone-based, fluorine-based, and polymer-based, adhesion imparting agents such as thiazole-based, triazole-based, and silane-based coupling agents, flame retardants, titanate-based, and conventionally known additives such as aluminum-based, as necessary.
[ Carrier film ]
The carrier film is a film having a function of supporting the resin layer of the dry film, and is a film to which the curable resin composition is applied when the resin layer is formed. Examples of the carrier film include polyester films such as polyethylene terephthalate and polyethylene naphthalate, polyimide films, polyamideimide films, polyethylene films, polytetrafluoroethylene films, polypropylene films, films made of thermoplastic resins such as polystyrene films, and surface-treated papers. Among them, polyester films can be suitably used from the viewpoints of heat resistance, mechanical strength, handleability, and the like. The thickness of the support film is not particularly limited and is appropriately selected in the range of approximately 10 to 150 μm depending on the application. The surface of the carrier film on which the resin layer is provided may be subjected to a mold release treatment. Further, a sputtered or ultra-thin copper foil may be formed on the surface of the carrier film on which the resin layer is provided.
As a method for manufacturing a printed wiring board using the dry film of the present invention, a conventionally known method may be used. For example, when the resin layer is formed of a thermosetting resin composition, a printed wiring board can be manufactured by the following method. The protective film is peeled from the dry film, heat laminated on the circuit board on which the circuit pattern is formed, and then thermally cured. The heat curing may be performed in an oven or may be performed under hot plate pressure. When the substrate on which the circuit is formed and the dry film of the present invention are laminated or hot plate pressed, copper foil or the substrate on which the circuit is formed may be laminated at the same time. A printed wiring board can be manufactured by forming a pattern or a via hole by laser irradiation or drilling at a position corresponding to a predetermined position on a substrate on which a circuit pattern is formed, and exposing the circuit wiring. At this time, when there is a component (a residue) remaining on the circuit wiring in the pattern or the via hole without being completely removed, the residue removing process is performed. The carrier film may be peeled off at any time after lamination, after heat curing, after laser processing, or after desmear treatment. The connection method of the interlayer circuit may be a connection using a copper pillar.
The dry film of the present invention can be preferably used for the formation of a permanent protective film of an electronic component, particularly a printed circuit board, and particularly can be preferably used for the formation of a solder resist layer, an interlayer insulating layer, and a cover layer of a flexible printed circuit board. In particular, the dry film of the present invention can be preferably used for forming a cured product having a large content of an inorganic filler. The dry film of the present invention may be used to paste wiring to form a wiring board. In addition, the material can be used as a sealing material for semiconductor chips.
Examples
The present invention will be specifically described below by way of examples and comparative examples, but the present invention is not limited to the examples. Hereinafter, the "parts" and "%" are mass references unless otherwise specified.
Preparation of curable resin composition
The materials and solvents described in tables 1 and 2 were placed in a vessel and stirred while heating to 50 ℃, followed by addition of the resin and the coupling agent, respectively. After confirming that the resin was dissolved, the filler component was added and stirred sufficiently. Thereafter, the curable resin compositions 1 to 4 were prepared by kneading with a three-roll mill.
< preparation of Dry film >)
The prepared curable resin composition was coated with a carrier film (PET film; TN-100, manufactured by Toyobo Co., ltd., thickness: 38 μm) prepared by adjusting the amount of the solvent so that the viscosity became 0.5 to 20 dPa.s (rotational viscometer 5rpm, 25 ℃), using HIRANO TECSEED CO., LTD. Standard Lab Coater so that the film thickness of the resin layer became 40 μm after drying, and then dried in a drying oven at 80 to 100 ℃ under a temperature gradient so that the residual solvent of the resin layer became 0.5 to 2.5 mass%, thereby forming a resin layer on the carrier film. Next, the roll surface temperature was set to 110℃and the pressure was set to 0.1kgf/cm 2 The three-layer structured roll dry films of examples 1 to 6 and comparative example 1 were produced by laminating protective films (Oji F-Tex co., ltd. OPP films MA-411, futamura Chemical co., ltd. Self-adhesive OPP film 100M, or Nitto Shinko Corporation heat-resistant micro-adhesive special polyester film T-APN 10) on the surfaces of the produced dry films.
Specifically, comparative example 1 was produced by bonding a protective film to a curable resin composition under normal bonding temperature conditions using a protective film MA-411 having no adhesiveness. In contrast, example 1 was produced by using the same protective film MA-411 having no adhesiveness and setting the bonding temperature of the protective film higher than the normal bonding temperature conditions, and examples 2 to 6 were produced by using the protective film 100M having adhesiveness and the T-APN10 instead of the protective film MA-411 having no adhesiveness.
< determination of peel Strength >
For the obtained dry film of the three-layer structure, the peel strength of (a) the carrier film to the resin layer and the peel strength of (B) the protective film to the resin layer were measured. The dry film obtained was fixed to FR4 having a thickness of 1.6mm with an adhesive, and a score having a width of 10mm and a length of 150mm was introduced into the surface of the film, and one end of the film was peeled off. Thereafter, the end of the film was clamped and fixed by a jig, and peel strength was measured by using a universal tensile tester AG-X manufactured by Shimadzu corporation. The test method was carried out at a temperature of 25℃and a peel angle of 90℃and a speed of 50 mm/min in accordance with JIS-C-6481. The measurement results are shown in table 3.
< evaluation of separation of resin >
The obtained rolled dry film having a three-layer structure was continuously slit by 1000m using an automatic cutter device TS-350P (manufactured by Banxia iron works Co., ltd.), and the state of the resin end of the slit was evaluated. The evaluation criteria were set as follows. The evaluation results are shown in table 3.
And (2) the following steps: after 1000m of processing, the resin end was not damaged and the protective film was peeled off.
X: after 1000m of processing, breakage and peeling of the protective film (3 mm or so of floating) were observed at the resin end.
< evaluation of transfer (unexpected separation of resin) of resin composition >
The prepared dry film (roll product having a thickness of 40 μm, a width of 490mm, and a length of 100 m) having a long 3-layer structure was set in an automatic cutting laminator HLM-a60-T (manufactured by hitachi chemical Co., ltd.), the protective film was peeled off by a take-up roll, and then, after the protective film was continuously and temporarily adhered to a copper-clad plate having a size of 500×500mm and a thickness of 0.8mm at a laminating speed of 1 m/min and a roll temperature of 90 ℃ under a roll pressure of 0.2MPa, an experiment was carried out. The evaluation criteria were set as follows. The evaluation results are shown in table 3.
And (2) the following steps: the separation of the resin layer was not confirmed in the wound portion of the protective film between the winding and temporary bonding (thermocompression bonding) portions of the protective film.
X: in the wound portion of the protective film, separation of the resin layer was confirmed.
TABLE 1
TABLE 2
1: EPICLON840 (liquid epoxy resin, epoxy equivalent 185 g/eq) manufactured by DIC Co., ltd
X 2: EPICLON860 (bisphenol A type solid epoxy resin, epoxy equivalent 245 g/eq)
And 3: EPICLON HP-5000 (naphthalene skeleton modified multifunctional epoxy resin, epoxy equivalent 252 g/eq) manufactured by DIC Co., ltd
X 4: HF-1M, phenol novolak resin, hydroxyl equivalent 106g/eq, manufactured by Ming Chemicals Co., ltd
And 5: EPICLONHPC-8000, active ester resin, 223g/eq active equivalent, solid state, available from DIC Co., ltd
And (6): dimethylaminopyridine
7: 2E4MZ, 2-ethyl-4-methylimidazole, manufactured by Kabushiki Kaisha
8: phenoxy resin,
X 9: ADMATECHS COMPANY SO-C1, spherical silica, and average particle diameter (D50) =200 nm
X 10: bisphenol F-type acrylic resin, manufactured by Nippon Kagaku Co., ltd
11: DIC Co., ltd.): carboxyl group-containing resin having amideimide structure
X 12: tricyclo [ 5.2.1.0.2, 6] decanedimethanol diacrylate, available from Xinzhongcun chemical industries, inc
X 13: jER828, bisphenol A type epoxy resin, epoxy equivalent 189g/eq, liquid state, manufactured by Mitsubishi chemical Co., ltd
X 14: dicyclopentadiene manufactured by DIC Co., ltd
X 15: omnirad 369, 2-methyl-1- [4- (methylthio) phenyl ] -2-morpholino-1-propanone by IGM Resins B.V
X 16: barium sulfate, sakai chemical Co., ltd
TABLE 3
As is clear from the results shown in the above table, according to the present invention, even when the slitting process is continuously performed, the resin does not adhere to the knife and the sharpness is not deteriorated, and as a result, breakage, floating of the resin at the end portion and floating of the protective film are not generated.
Claims (4)
1. A dry film comprising a carrier film, a resin layer, and an adhesive protective film, characterized in that,
the peel strength of the protective film to the resin layer is 0.016kgf/cm or more and 0.150kgf/cm or less, and the peel strength of the protective film to the resin layer is 0.005kgf/cm or more and 0.150kgf/cm or less greater than the peel strength of the carrier film to the resin layer.
2. The dry film of claim 1, wherein the thickness is 60 μm or more.
3. A cured product obtained by curing the resin layer of the dry film according to claim 1 or 2.
4. An electronic component comprising the cured product according to claim 3.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003140333A (en) * | 2001-11-01 | 2003-05-14 | Kanegafuchi Chem Ind Co Ltd | Photosensitive cover lay film excellent in peeling workability |
| CN102549499A (en) * | 2009-09-30 | 2012-07-04 | 可隆工业株式会社 | Dry film photoresist |
| JP2016188924A (en) * | 2015-03-30 | 2016-11-04 | 日立化成株式会社 | Dry film, cured product, semiconductor device and method for forming resist pattern |
| JP2017052952A (en) * | 2016-09-20 | 2017-03-16 | 味の素株式会社 | Adhesive sheet with protective film, manufacturing method of laminate and manufacturing method of printed wiring board |
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| JPS60136546A (en) | 1983-12-26 | 1985-07-20 | Yashima Chem Ind Co Ltd | Substituted phenylacetanilide derivative, its production and use thereof |
| JP2002372781A (en) | 2002-05-30 | 2002-12-26 | Hitachi Chem Co Ltd | Photosensitive element |
| JP2004066803A (en) * | 2002-06-12 | 2004-03-04 | Daicel Chem Ind Ltd | Surface protection film for adhesive resin and its manufacturing method |
| JP5624184B1 (en) | 2013-06-28 | 2014-11-12 | 太陽インキ製造株式会社 | Dry film and printed wiring board |
| JP5882510B2 (en) * | 2014-06-30 | 2016-03-09 | 太陽インキ製造株式会社 | Photosensitive dry film and method for producing printed wiring board using the same |
| CN108476589B (en) * | 2016-01-13 | 2021-10-26 | 太阳油墨制造株式会社 | Dry film and printed circuit board |
| JP2018125378A (en) | 2017-01-31 | 2018-08-09 | 太陽インキ製造株式会社 | Dry film, cured product, printed wiring board, and method for manufacturing cured product |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003140333A (en) * | 2001-11-01 | 2003-05-14 | Kanegafuchi Chem Ind Co Ltd | Photosensitive cover lay film excellent in peeling workability |
| CN102549499A (en) * | 2009-09-30 | 2012-07-04 | 可隆工业株式会社 | Dry film photoresist |
| JP2016188924A (en) * | 2015-03-30 | 2016-11-04 | 日立化成株式会社 | Dry film, cured product, semiconductor device and method for forming resist pattern |
| JP2017052952A (en) * | 2016-09-20 | 2017-03-16 | 味の素株式会社 | Adhesive sheet with protective film, manufacturing method of laminate and manufacturing method of printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI747040B (en) | 2021-11-21 |
| JP7221064B2 (en) | 2023-02-13 |
| KR102313172B1 (en) | 2021-10-15 |
| JP2020121481A (en) | 2020-08-13 |
| CN111505905A (en) | 2020-08-07 |
| TW202030238A (en) | 2020-08-16 |
| JP2023057084A (en) | 2023-04-20 |
| KR20200094616A (en) | 2020-08-07 |
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