KR20170132680A - Resin composition - Google Patents

Abstract

The present invention provides a resin composition which can obtain an insulating layer having a low dielectric tangent and a high adhesion to a conductor layer, and has a minimum melt viscosity in a suitable range. The resin composition contains (A) an epoxy resin, (B) an active ester compound, and (C) a polyimide resin having an indane skeleton.

Description

Resin composition {RESIN COMPOSITION}

The present invention relates to a resin composition and an adhesive film, a prepreg, a printed wiring board and a semiconductor device obtained by using such a resin composition.

As a manufacturing technique of a printed wiring board, a manufacturing method by a build-up method in which an insulating layer and a conductor layer are alternately laminated is known. In the build-up method, generally, the insulating layer is formed by curing the resin composition. Such resin compositions have been studied conventionally. For example, Patent Document 1 discloses a resin composition comprising (A) an epoxy resin, (B) an active ester compound, (C) a carbodiimide compound, (D) a thermoplastic resin and (E) And a content of the non-volatile component in the resin composition is 100 mass%, the resin composition is 40 mass% or more.

Japanese Unexamined Patent Application Publication No. 2016-27097

However, it is desired to further improve the performance of the insulating layer. Particularly, development of a technique capable of realizing an insulating layer having a low dielectric tangent and a high adhesion to a conductor layer by using a resin composition having a minimum melt viscosity in an appropriate range is desired.

SUMMARY OF THE INVENTION The present invention has been devised in view of the above problems, and it is an object of the present invention to provide a resin composition capable of obtaining an insulating layer having low dielectric tangent and high adhesion to a conductor layer and having a minimum melt viscosity in a suitable range; An adhesive film and a prepreg containing the above resin composition; And a printed circuit board and a semiconductor device including the cured product of the above resin composition.

As a result of intensive studies on the above problems, the present inventors have found that the above problems can be solved by a resin composition comprising an epoxy resin, (B) an active ester compound, and (C) a polyimide resin having an indane skeleton And have accomplished the present invention.

That is, the present invention includes the following contents.

[1] A resin composition comprising (A) an epoxy resin, (B) an active ester compound, and (C) a polyimide resin having an indane skeleton.

[2] The resin composition according to [1], wherein the component (C) has a trimethylindan skeleton.

[3] The resin composition according to [1] or [2], wherein the component (C) has a 1,1,3-trimethylindane skeleton.

[4] The resin composition according to any one of [1] to [3], wherein the amount of the component (C) is 1% by mass to 20% by mass based on 100% by mass of the resin component in the resin composition.

[5] The resin composition according to any one of [1] to [4], which further comprises (D) an inorganic filler.

[6] The resin composition according to [5], wherein the amount of the component (D) is 50 mass% or more based on 100 mass% of the nonvolatile component in the resin composition.

[7] The resin composition according to any one of [1] to [6], which is a resin composition for forming an insulating layer of a printed wiring board.

[8] An adhesive film comprising a support and a resin composition layer comprising the resin composition according to any one of [1] to [7] formed on the support.

[9] A prepreg having a sheet-like fibrous substrate and the resin composition according to any one of [1] to [7] impregnated into the sheet-like fibrous substrate.

[10] A printed wiring board having an insulating layer containing a cured product of the resin composition according to any one of [1] to [7].

[11] A semiconductor device comprising the printed wiring board according to [10].

According to the present invention, it is possible to provide an insulating layer having a low dielectric loss tangent and a high adhesion to a conductor layer and having a minimum melt viscosity in a suitable range; An adhesive film and a prepreg containing the above resin composition; And a printed wiring board and a semiconductor device including the cured product of the resin composition described above can be realized.

Hereinafter, the present invention will be described in detail with reference to embodiments and examples. However, the present invention is not limited to the following embodiments and examples, and can be arbitrarily changed without departing from the scope of the claims of the present invention and its equivalent scope.

In the following description, the amount of each component in the resin composition is a value relative to 100 mass% of the nonvolatile component in the resin composition, unless otherwise specified.

In the following description, the "resin component" of the resin composition refers to a component other than the inorganic filler (D) among the nonvolatile components contained in the resin composition.

[One. Outline of resin composition]

The resin composition of the present invention comprises (A) an epoxy resin, (B) an active ester compound, and (C) a polyimide resin having an indane skeleton. In the following description, the " polyimide resin having an indane skeleton " may be referred to as " indanepolyimide resin ". Such a resin composition is suitable as a resin composition for forming an insulating layer of a printed wiring board and specifically has a lowest melt viscosity within a range suitable for use as a material for forming an insulating layer of a printed wiring board. By using such a resin composition, it is possible to obtain an insulating layer having a low dielectric tangent and a high adhesion to a conductor layer.

[2. (A) epoxy resin]

Examples of the epoxy resin (A) include epoxy resins such as a biscylenol type epoxy resin, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a bisphenol S type epoxy resin, a bisphenol AF type epoxy resin, a dicyclopentadiene type epoxy resin, A phenol type epoxy resin, a naphthol novolak type epoxy resin, a phenol novolak type epoxy resin, a tert-butyl catechol type epoxy resin, a naphthalene type epoxy resin, a naphthol type epoxy resin, an anthracene type epoxy resin, Cresol novolak type epoxy resin, biphenyl type epoxy resin, linear aliphatic epoxy resin, epoxy resin having a butadiene structure, alicyclic epoxy resin, heterocyclic epoxy resin, spiro ring containing epoxy resin, Cyclohexanedimethanol type epoxy resin, naphthylene ether type epoxy resin, trimethylol type epoxy resin Resin, tetraphenyl ethane type epoxy resin, and the like.

Among these, as the epoxy resin (A), an epoxy resin containing an aromatic skeleton is preferable from the viewpoint of lowering the average linear heat expansion coefficient. Here, the aromatic skeleton is a chemical structure generally defined as aromatic, and includes polycyclic aromatic and aromatic heterocyclic rings. Specifically, at least one epoxy resin selected from the group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin, naphthalene type epoxy resin, biphenyl type epoxy resin, and dicyclopentadiene type epoxy resin is preferable, A biphenyl type epoxy resin is more preferable.

The resin composition preferably contains, as the epoxy resin (A), an epoxy resin having two or more epoxy groups in one molecule. The proportion of the epoxy resin having two or more epoxy groups in one molecule with respect to 100% by mass of the nonvolatile component (A) of the epoxy resin is preferably 50% by mass or more, more preferably 60% by mass or more, Is not less than 70% by mass. Among them, the resin composition preferably contains (A) an epoxy resin having three or more epoxy groups in one molecule and a solid epoxy resin at a temperature of 20 캜 (hereinafter sometimes referred to as "solid epoxy resin") Do.

The epoxy resin (A) may be used singly or in combination of two or more kinds at any ratio. Therefore, the resin composition may contain only (A) an epoxy resin as solid epoxy resin, and may include a solid epoxy resin in combination with other epoxy resin. Among them, the resin composition comprises (A) an epoxy resin, a solid epoxy resin, and an epoxy resin (hereinafter sometimes referred to as " liquid epoxy resin ") having a liquid epoxy resin having two or more epoxy groups in one molecule at a temperature of 20 캜 It is preferable to include them in combination. (A) By using a combination of a liquid epoxy resin and a solid epoxy resin as the epoxy resin, it is possible to improve the flexibility of the resin composition or to improve the fracture strength of the cured product of the resin composition.

Examples of the liquid epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, phenol novolak type epoxy resin , An alicyclic epoxy resin having an ester skeleton, a cyclohexanedimethanol type epoxy resin, a glycidylamine type epoxy resin, and an epoxy resin having a butadiene structure are preferable, and a glycidylamine type epoxy resin, a bisphenol A type epoxy resin , Bisphenol F type epoxy resin, bisphenol AF type epoxy resin and naphthalene type epoxy resin are more preferable.

Specific examples of the liquid epoxy resin include " HP4032 ", " HP4032D ", " HP4032SS " (naphthalene type epoxy resin) manufactured by DIC Corporation; "828US", "jER828EL", "825", "Epikote 828EL" (bisphenol A type epoxy resin) manufactured by Mitsubishi Kagaku; &Quot; jER807 ", " 1750 " (bisphenol F type epoxy resin) manufactured by Mitsubishi Chemical Corporation; &Quot; jER152 " (phenol novolak type epoxy resin) manufactured by Mitsubishi Chemical Corporation; 630 ", " 630LSD " (glycidylamine type epoxy resin) manufactured by Mitsubishi Chemical Corporation; 630LSD " (glycidylamine type epoxy resin) manufactured by Mitsubishi Chemical Corporation; ZX1059 " (a mixture of a bisphenol A type epoxy resin and a bisphenol F type epoxy resin) manufactured by Shinnitetsu Sumikin Kagaku Co., Ltd.; EX-721 " (glycidyl ester type epoxy resin) manufactured by Nagase ChemteX Corporation; &Quot; Celloxide 2021P " (an alicyclic epoxy resin having an ester skeleton) manufactured by Daicel Company; &Quot; PB-3600 " (epoxy resin having a butadiene structure) manufactured by Daicel Company; ZX1658 " and " ZX1658GS " (liquid 1,4-glycidyl cyclohexane type epoxy resin) manufactured by Shinnetsu Kagaku Co., Ltd., and the like. These may be used alone, or two or more kinds may be used in combination at an arbitrary ratio.

Examples of the solid epoxy resin include naphthalene type tetrafunctional epoxy resins, cresol novolak type epoxy resins, dicyclopentadiene type epoxy resins, trisphenol type epoxy resins, naphthol type epoxy resins, biphenyl type epoxy resins, naphthylene ether type epoxy resins , An anthracene type epoxy resin, a bisphenol A type epoxy resin and a tetraphenylethane type epoxy resin are preferable, and a naphthalene type tetrafunctional epoxy resin, a naphthol type epoxy resin and a biphenyl type epoxy resin are more preferable.

Specific examples of the solid epoxy resin include " HP4032H " (naphthalene type epoxy resin) manufactured by DIC Corporation; HP-4700 ", " HP-4710 " (naphthalene type tetrafunctional epoxy resin) manufactured by DIC Corporation; "N-690" (cresol novolak type epoxy resin) manufactured by DIC Corporation; "N-695" (cresol novolak type epoxy resin) manufactured by DIC Corporation; HP-7200 " (dicyclopentadiene type epoxy resin) manufactured by DIC Corporation; EXA-7311-G4 "," EXA-7311-G4S ", and" HP6000 "(manufactured by DIC Corporation," HP-7200HH "," HP-7200H "," EXA-7311 " Naphthylene ether type epoxy resin); "EPPN-502H" (trisphenol type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; NC7000L " (naphthol novolak type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; Quot; NC3000H ", " NC3000 ", " NC3000L ", and " NC3100 " (biphenyl type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "ESN475V" (naphthalene type epoxy resin) manufactured by Shinnitetsu Sumikin Kagaku Co., Ltd.; "ESN485" (naphthol novolak type epoxy resin) manufactured by Shinnitetsu Sumikin Kagaku Co., Ltd.; YX4000H ", " YX4000 ", and " YL6121 " manufactured by Mitsubishi Chemical Corporation (biphenyl type epoxy resin); &Quot; YX4000HK " (biquileneol type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YX8800" (anthracene type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "PG-100" and "CG-500" manufactured by Osaka Gas Chemical Co., Ltd.; &Quot; YL7760 " (Bisphenol AF type epoxy resin) manufactured by Mitsubishi Chemical Corporation; &Quot; YL7800 " (fluorene type epoxy resin) manufactured by Mitsubishi Chemical Corporation; &Quot; jER1010 " (solid bisphenol A type epoxy resin) manufactured by Mitsubishi Chemical Corporation; And " jER1031S " (tetraphenyl ethane type epoxy resin) manufactured by Mitsubishi Chemical Corporation. These may be used singly or in combination of two or more in an arbitrary ratio.

(A) When the liquid epoxy resin and the solid epoxy resin are used in combination as the epoxy resin, the mass ratio thereof (liquid epoxy resin: solid epoxy resin) is preferably 1: 0.1 to 1:15, more preferably 1 : 0.5 to 1:10, particularly preferably 1: 1 to 1: 8. By setting the mass ratio of the liquid epoxy resin and the solid epoxy resin to the above-mentioned range, it is possible to obtain an appropriate tackiness when used in the form of an adhesive film. Further, when used in the form of an adhesive film, sufficient flexibility can be obtained and handling properties are improved. Further, the breaking strength of the cured product of the resin composition can be effectively increased.

The epoxy equivalent of the epoxy resin (A) is preferably 50 to 5000, more preferably 50 to 3000, still more preferably 80 to 2000, still more preferably 110 to 1000. When the epoxy equivalent of the epoxy resin (A) is in the above range, the crosslinked density of the cured product of the resin composition becomes sufficient, and an insulating layer having a small surface roughness can be obtained.

The epoxy equivalent is the mass of the resin containing one equivalent of epoxy group and can be measured according to JIS K7236.

The weight average molecular weight of the epoxy resin (A) is preferably 100 to 5000, more preferably 250 to 3000, and still more preferably 400 to 1500 from the viewpoint of achieving the desired effect of the present invention.

The weight average molecular weight of the resin can be measured as a polystyrene reduced value by a gel permeation chromatography (GPC) method. Specifically, the weight average molecular weight of the resin was measured by using LC-9A / RID-6A manufactured by Shimadzu Corporation as a measuring device and Shodex K-800P / K-804L / K-804L manufactured by Showa Denko KK as a column, And the column temperature can be measured at 40 占 폚 and calculated using the calibration curve of standard polystyrene.

The amount of the epoxy resin (A) in the resin composition is preferably 5% by mass or more, more preferably 5% by mass or more, and more preferably 5% by mass or more, based on 100% by mass of the resin component in the resin composition, from the viewpoint of obtaining an insulating layer showing good mechanical strength and insulation reliability 10% by mass or more, and more preferably 20% by mass or more.

The upper limit of the amount of the epoxy resin (A) is arbitrary as long as the effects of the present invention are exhibited, preferably 70 mass% or less, more preferably 65 mass% or less, particularly preferably 60 mass% or less.

[3. (B) Active ester compound]

The active ester compound (B) is a compound having at least one active ester group in one molecule. Usually, such an active ester compound (B) can function as a curing agent for curing the resin composition by reacting with the epoxy resin (A). By using the active ester compound (B), the dielectric tangent of the cured product of the resin composition can be lowered, and in general, an insulating layer with a small surface roughness can be obtained.

The active ester compound (B) preferably has two or more active ester groups in one molecule. Examples of the active ester compound (B) include esters having a high reactivity, such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds, Or a compound having two or more of them. The active ester compound may be used alone, or two or more kinds thereof may be used in combination at an arbitrary ratio.

From the viewpoint of improvement in heat resistance, the active ester compound (B) is more preferably an active ester compound obtained by condensation reaction of a carboxylic acid compound and / or a thiocarboxylic acid compound with a hydroxy compound and / or a thiol compound. Among them, an active ester compound obtained by reacting a carboxylic acid compound with at least one selected from the group consisting of a phenol compound, a naphthol compound and a thiol compound is more preferable. Further, an aromatic compound having two or more active ester groups per molecule, obtained by reacting a carboxylic acid compound with an aromatic compound having a phenolic hydroxyl group, is more preferable. Among them, an aromatic compound having at least two active ester groups in one molecule is particularly preferable as an aromatic compound obtained by reacting a carboxylic acid compound having at least two carboxyl groups in one molecule with an aromatic compound having a phenolic hydroxyl group. The active ester compound (B) may be in a linear form or in a multi-branched form. If the carboxylic acid compound having two or more carboxyl groups in one molecule contains a fatty chain, compatibility with the resin composition can be enhanced, and heat resistance can be enhanced if the compound has an aromatic ring.

Examples of the carboxylic acid compound include aliphatic carboxylic acids having 1 to 20 (preferably 2 to 10, more preferably 2 to 8) carbon atoms, aromatic groups having 7 to 20 carbon atoms (preferably 7 to 10) Carboxylic acid. Examples of the aliphatic carboxylic acid include acetic acid, malonic acid, succinic acid, maleic acid, itaconic acid, and the like. Examples of the aromatic carboxylic acid include benzoic acid, phthalic acid, isophthalic acid, terephthalic acid, pyromellitic acid and the like. Among them, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid and terephthalic acid are preferable from the viewpoint of heat resistance, and isophthalic acid and terephthalic acid are more preferable. The carboxylic acid compound may be used singly or in combination of two or more at any ratio.

The thiocarboxylic acid compound includes, for example, thioacetic acid, thiobenzoic acid, and the like. The thiocarboxylic acid compound may be used alone, or two or more thiocarboxylic acid compounds may be used in combination at an arbitrary ratio.

Examples of the phenol compound include a phenol compound having 6 to 40 carbon atoms (preferably 6 to 30, more preferably 6 to 23, and still more preferably 6 to 22) carbon atoms. Suitable specific examples of the phenol compound include hydroquinone, resorcin, bisphenol A, bisphenol F, bisphenol S, phenol phthaline, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o- Cresol, catechol, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, fluoroglucine, benzene triol, dicyclopentadiene type diphenol, and the like. Here, the "dicyclopentadiene-type diphenol" refers to a phenol compound obtained by condensing two molecules of phenol in one molecule of dicyclopentadiene. As the phenol compound, a phenol novolak, a phosphorus atom-containing oligomer having a phenolic hydroxyl group described in JP-A-2013-40270 may be used. The phenol compounds may be used singly or in combination of two or more in an arbitrary ratio.

The naphthol compound includes, for example, a naphthol compound having 10 to 40 (preferably 10 to 30, more preferably 10 to 20) carbon atoms. Suitable specific examples of the naphthol compound include? -Naphthol,? -Naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene and 2,6-dihydroxynaphthalene. As the naphthol compound, naphthol novolak may also be used. The naphthol compound may be used singly or in combination of two or more in an arbitrary ratio.

Among them, bisphenol A, bisphenol F, bisphenol S, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, catechol,? -Naphthol,? -Naphthol, 1,5-dihydroxy Naphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, fluoroglucine, benzene triol, dicyclopenta Diene type diphenols, phenol novolacs, and phosphorus atom-containing oligomers having a phenolic hydroxyl group are preferable. Further, it is also possible to use catechol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, More preferred are phosphorus atom-containing oligomers having fluoroglycine, benzenetriol, dicyclopentadiene type diphenol, phenol novolac, and phenolic hydroxyl group. Among them, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, dicyclopentane Diene-type diphenol, phenol novolac, and phosphorus atom-containing oligomers having a phenolic hydroxyl group are more preferable. Further, it is also possible to use a phosphorus atom-containing oligomer having 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dicyclopentadiene type diphenol, phenol novolak, Is more preferable. Among them, phosphorus atom-containing oligomers having 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dicyclopentadiene type diphenol and phenolic hydroxyl groups are particularly preferable . Dicyclopentadiene type diphenols are also particularly preferred.

As the thiol compound, for example, benzenedithiol, triazinedithiol and the like can be given. The thiol compound may be used alone, or two or more thiol compounds may be used in combination at an arbitrary ratio.

Suitable specific examples of the active ester compound include active ester compounds containing a dicyclopentadiene type diphenol structure, active ester compounds containing a naphthalene structure, active ester compounds containing an acetylated phenol novolak, benzoyl phenol novolak An active ester compound containing a cargo, and an active ester compound obtained by reacting an aromatic carboxylic acid with a phosphorus atom-containing oligomer having a phenolic hydroxyl group. Among them, an active ester compound having a dicyclopentadiene type diphenol structure, an active ester compound having a naphthalene structure, and an active ester compound obtained by reacting an aromatic carboxylic acid with a phosphorus atom-containing oligomer having a phenolic hydroxyl group are more preferable. Here, the " dicyclopentadiene type diphenol structure " refers to a bivalent structural unit composed of phenylene-dicyclopentylene-phenylene.

Particularly preferred specific examples of the active ester compound having a dicyclopentadiene type diphenol structure include a compound represented by the following formula (B1).

In the above formula (B1), each R independently represents a phenyl group or a naphthyl group. Among them, R is preferably a naphthyl group from the viewpoint of lowering dielectric tangent and improving heat resistance.

In the above formula (B1), k represents 0 or 1. Among them, k is preferably 0 from the viewpoint of lowering dielectric tangent and improving heat resistance.

In the above formula (B1), n is an average number of repeating units, and is 0.05 to 2.5. Among them, n is preferably 0.25 to 1.5 from the viewpoint of lowering dielectric tangent and improving heat resistance.

As the active ester compound (B), an active ester compound disclosed in Japanese Patent Application Laid-Open No. 2004-277460 or Japanese Patent Application Laid-Open No. 2013-40270 may be used. As the active ester compound (B), commercially available active ester compounds may be used. EXB9451 "," EXB9460 "," EXB9460S "," HPC-8000-65T "," HPC-8000L-65M "(dicyclopentadiene type diphenol ≪ / RTI >structure); &Quot; EXB9416-70BK " (active ester compound containing a naphthalene structure) manufactured by DIC Corporation; &Quot; DC808 " (active ester compound containing acetylated phenol novolak), manufactured by Mitsubishi Chemical Corporation; &Quot; YLH1026 " (active ester compound containing benzoylated phenol novolak) manufactured by Mitsubishi Chemical Corporation; EXB9050L-62M " (phosphorus atom-containing active ester compound) manufactured by DIC Corporation.

The active group equivalent of the active ester compound (B) is preferably 120 to 500, more preferably 150 to 400, and particularly preferably 180 to 300. When the active group equivalent of the active ester compound (B) is in the above range, the crosslinked density of the cured product of the resin composition becomes sufficient, and an insulating layer having a small surface roughness can be obtained. Here, the active group equivalent represents the mass of the resin containing one equivalent of an active group.

The active ester compound may be used alone, or two or more kinds thereof may be used in combination at an arbitrary ratio.

The amount of the active ester compound (B) in the resin composition is preferably 1% by mass or more, more preferably 2% by mass or more, further preferably 3% by mass or more based on 100% by mass of the nonvolatile component in the resin composition By mass, more preferably not less than 4% by mass, not less than 5% by mass, not less than 6% by mass or not less than 7% by mass, particularly preferably not more than 30% by mass, more preferably not more than 25% , And particularly preferably 15 mass% or less, or 10 mass% or less. If the amount of the active ester compound (B) is lower than the lower limit of the above range, the adhesiveness between the conductor layer and the insulating layer can be particularly enhanced. If the amount is less than the upper limit of the above range, heat resistance can be improved, can do.

When the number of epoxy groups in the epoxy resin (A) is 1, the number of active groups in the active ester compound (B) is preferably 0.1 or more, more preferably 0.2 or more, and still more preferably 0.2 or more, from the viewpoint of obtaining an insulating layer having a good mechanical strength. Preferably not less than 0.3, particularly preferably not less than 0.4, preferably not more than 2, more preferably not more than 1.5, still more preferably not more than 1. [ Here, the " epoxy group number of epoxy resin " is a value obtained by dividing the value obtained by dividing the solid content of each epoxy resin present in the resin composition by the epoxy equivalent, for all epoxy resins. The term " active group " means a functional group capable of reacting with the epoxy group, and the " number of active groups of the active ester compound " is the sum of values obtained by dividing the solid content of the active ester compound in the resin composition by the active group equivalent .

[4. (C) Polyimide resin having an indane skeleton]

(C) Indane polyimide resin is a polyimide resin having an indane skeleton. The indane skeleton is a carbon skeleton represented by the following formula (C1). (C) an indanepolyimide resin in combination with (A) an epoxy resin and (B) an active ester compound, the resin composition of the present invention has a lowest melt viscosity in a suitable range, It is possible to obtain a desired effect of realizing an insulating layer having high adhesion with the insulating layer.

The (C) indanepolyimide resin may have a non-substituted indane skeleton in which a hydrogen atom is bonded to a carbon atom of the indane skeleton, may have a substituted indane skeleton in which some or all of the hydrogen atoms are substituted with a substituent, Substituted indane skeleton may be combined. As the substituent, a hydrocarbon group is preferable from the viewpoint of effectively lowering the minimum melt viscosity of the resin composition and effectively reducing the dielectric tangent of the cured product of the resin composition. The number of carbon atoms of the hydrocarbon group is usually 1 to 6, preferably 1 to 4, more preferably 1 to 2. Examples of suitable hydrocarbon groups include alkyl groups such as methyl, ethyl and propyl groups.

In the substituted indane skeleton, the substituent may be bonded to the 5-membered ring of the indane skeleton or may be bonded to the 6-membered ring. The substituted indane skeleton may have a combination of a substituent bonded to a 5-membered ring and a substituent bonded to a 6-membered ring. Among them, from the viewpoint of obtaining the desired effect of the present invention remarkably, it is preferable that the substituent is bonded to the 5-membered ring of the indane skeleton.

The number of substituents is usually 1 to 6 per one indan skeleton, and of these, 3 is preferable. By adjusting the number of substituents per one indane skeleton as described above, the desired effect of the present invention can be obtained remarkably.

Among them, from the viewpoint of obtaining the desired effect of the present invention remarkably, the (C) indanepolyimide resin preferably has a trimethylindane skeleton in which three methyl groups are bonded to one indan skeleton, It is particularly preferable to have a 1,3-trimethylindane skeleton.

The above-mentioned indane skeleton is a group (indene group) having a valence of at least 1, and is included in the indene polyimide resin (C). The valence of the above-mentioned indene group is usually 2 or more. Among them, from the viewpoint of obtaining the desired effect of the present invention remarkably, the (C) indanepolyimide resin preferably contains the above-mentioned indan skeleton as a divalent group. When the indane skeleton is a divalent group, it is preferable that each of the 5-membered ring and the 6-membered ring of the indane skeleton has a combining hand by one.

As the (C) indanepolyimide resin, those obtained by polymerizing a diamine compound and a tetracarboxylic acid compound can be used. Therefore, the (C) indanepolyimide resin usually contains a diamine structural unit and a tetracarboxylic acid structural unit in the molecule. Here, the diamine structural unit means a repeating unit having a structure formed by polymerizing a diamine compound. The tetracarboxylic acid structural unit means a repeating unit having a structure formed by polymerizing a tetracarboxylic acid compound. The (C) indane polyimide resin may contain the indane skeleton in the diamine structural unit or may be contained in the tetracarboxylic acid structural unit. Among them, the (C) indanepolyimide resin preferably contains the indan skeleton in the diamine structural unit from the viewpoint of obtaining the desired effect of the present invention remarkably.

Examples of the diamine compound containing an indane skeleton include 5- (4-aminophenoxy) -3- [4- (4-aminophenoxy) phenyl] -1,1,3- Amino-1- (4-aminophenyl) -1,3,3-trimethylindane, and the like. Among them, the 5- (4-aminophenoxy) -3- [4- (4-aminophenoxy) phenyl] -1,1,3-trimethylindan is a compound having an aromatic cyclic structure and an aliphatic cyclic structure Carbon chain, it is possible to effectively lower the dielectric loss tangent while increasing the mechanical strength and heat resistance of the (C) indanepolyimide resin. The diamine compound including the indane skeleton and the diamine structural unit corresponding to such a diamine compound may be used singly or two or more of them may be used in combination at an arbitrary ratio.

The proportion of the diamine compound containing an indan skeleton in the total diamine compound serving as a raw material of the (C) indanepolyimide resin is preferably 50 mol% or more, more preferably 50 mol% or less, from the viewpoint of improving the heat resistance, mechanical strength and dielectric loss tangent of the cured product of the resin composition. Or more, and more preferably 80 mol% or more.

The (C) indane polyimide resin may contain a diamine structural unit that does not contain an indane skeleton, if necessary. Examples of the diamine compound not containing the indane skeleton include 4,4'-diaminodiphenyl ether, 1,4-phenylenediamine, 2,2-bis [4- (4-aminophenoxy) phenyl ] Aromatic diamines such as propane; 1,3-diaminopropane, 1,4-diaminobutane, 1,5-diaminopentane, 1,6-hexanediamine, 1,7-heptanediamine, 1,8- Linear aliphatic diamines such as octane diamine, 1,9-nonane diamine, 1,10-decane diamine, 1,11-undecane diamine and 1,12-dodecane diamine; 1,2-diamino-2-methylpropane, 1,3-diamino-2-methylpropane, 1,3-diamino- Branched aliphatic diamines such as diaminopentane and 1,5-diamino-2-methylpentane; Amino-1,3,3-trimethylcyclohexanemethylamine (isophoronediamine), 1,4-diaminocyclohexane, 1,3-diaminocyclohexane, 1,4-cyclohexanebis (methylamine) (4), 8 (9) -bis (4-amino-3-methylcyclohexyl) methane, (Aminomethyl) tricyclo [5.2.1.0 ^2,6 ] decane, 2,5 (6) -bis (aminomethyl) bicyclo [2.2.1] heptane, 1,3-diaminoamantane, -Diamino-1,1'-biadamantyl, 1,6-diaminoamidanthane, and the like. The diamine compound not containing an indane skeleton and the diamine structural unit corresponding to such a diamine compound may be used singly or in combination of two or more at any ratio.

Examples of the tetracarboxylic acid compound include bis (3,4-dicarboxyphenyl) ether dianhydride, 2,2-bis [4- (3,4-dicarboxyphenoxy) ', 4,4'-biphenyl tetracarboxylic acid dianhydride, pyromellitic dianhydride, 3,3', 4,4'-benzophenone tetracarboxylic acid dianhydride, 3,3 ', 4,4'-diphenyl sulfone And aromatic tetracarboxylic acid dianhydrides such as tetracarboxylic acid dianhydride. Among them, 2,2-bis [4- (3,4-dicarboxyphenoxy) phenyl] propane dianhydride is preferable because it can effectively increase the mechanical strength, heat resistance, chemical resistance and electrical insulation of the cured product of the resin composition . Further, 3,3 ', 4,4'-biphenyltetracarboxylic acid dianhydride is preferable because it can effectively increase the heat resistance and mechanical strength of the cured product of the resin composition. Further, bis (3,4-dicarboxyphenyl) ether dianhydride is preferable because it can effectively increase the mechanical strength, heat resistance, chemical resistance and electrical insulation of the cured product of the resin composition and further remarkably lower the dielectric loss tangent . The tetracarboxylic acid compound and the tetracarboxylic acid structural unit corresponding to such a tetracarboxylic acid compound may be used singly or two or more kinds may be used in combination at an arbitrary ratio.

There is no limitation on the polymerization structure of the (C) indanepolyimide resin, and it may be a random polymer, an alternating polymer, or a block polymer.

As the (C) indanepolyimide resin, for example, a polyimide resin described in JP-A-2015-214680, JP-A-2015-209461, or JP-A-2015-209455 Maybe.

The (C) indanepolyimide resin may be used singly or in combination of two or more in an arbitrary ratio.

The weight average molecular weight of the (C) indanepolyimide resin is preferably 5000 to 100000, more preferably 8000 to 50000, and still more preferably 10000 to 30000 from the viewpoint of obtaining the desired effect of the present invention.

The above-mentioned (C) indanepolyimide resin can be produced, for example, by polymerizing a diamine compound and a tetracarboxylic acid compound. In this case, a desired indane polyimide resin can be obtained by using an indane skeleton as either or both of the diamine compound and the tetracarboxylic acid compound. In the above-mentioned polymerization, optional copolymerization components may be polymerized as necessary. (C) an indanepolyimide resin is obtained by polymerizing a diamine compound containing an indan skeleton, a tetracarboxylic acid compound, and optionally an optional copolymerization component (for example, a diamine compound not containing an indan skeleton) . The (C) indanepolyimide resin can be prepared by, for example, polymerizing a diamine compound, a tetracarboxylic acid compound and optionally a copolymerization component as necessary to obtain a polyamic acid, and then dehydrating and cyclizing the polyamic acid Or may be prepared by imidization.

The amount of the diamine compound and the tetracarboxylic acid compound can be arbitrarily set within a range in which the desired (C) indanepolyimide resin can be obtained. Among them, from the viewpoint of sufficiently increasing the molecular weight of the (C) indanepolyimide resin, it is preferable to adjust the acid anhydride group of the tetracarboxylic acid compound to 0.9 equivalents or more with respect to the amino group of the diamine compound. Normally, the diamine compound and the tetracarboxylic acid compound are supplied to the polymerization in such an amount that the total amount of the diamine compound and the total amount of the tetracarboxylic acid compound is approximately the same molar amount. The above-mentioned polymerization is usually carried out in a suitable reaction solvent at a reaction temperature of 80 DEG C or lower, under an atmosphere or in a nitrogen atmosphere.

When a polyamic acid is obtained by the above polymerization, the polyamic acid is imidized to obtain the desired (C) indanepolyimide resin. The imidization can be carried out, for example, by a chemical ring-closing method in which dehydration is carried out using a dehydrating agent and a catalyst. Examples of the dehydrating agent include an aromatic carboxylic acid anhydride such as an aliphatic carboxylic acid anhydride such as acetic anhydride and phthalic anhydride. Examples of the catalyst include heterocyclic tertiary amine compounds such as pyridine, picoline and quinoline; Aliphatic tertiary amine compounds such as triethylamine; And aromatic tertiary amine compounds such as N, N-dimethylaniline. Each of the dehydrating agent and the catalyst may be used alone, or two or more kinds thereof may be used in combination at an arbitrary ratio.

The imidization can be carried out, for example, by a thermal cyclization method of thermally dehydrating. The heating temperature in the thermal cyclization method is usually 100 占 폚 to 400 占 폚, preferably 200 占 폚 to 350 占 폚, and more preferably 250 占 폚 to 300 占 폚. The heating time is usually 1 minute to 6 hours, preferably 5 minutes to 2 hours, more preferably 15 minutes to 1 hour. The heating atmosphere is not particularly limited, but an inert atmosphere such as a nitrogen gas atmosphere or a nitrogen / hydrogen mixed gas atmosphere is preferable from the viewpoint of inhibiting the coloring.

The amount of the indanepolyimide resin (C) in the resin composition is preferably 1% by mass or more, more preferably 4% by mass or more, particularly preferably 8% by mass or more, based on 100% Preferably 20 mass% or less, more preferably 18 mass% or less, particularly preferably 15 mass% or less. If the amount of the (C) indene polyimide resin is lower than the lower limit of the above range, the dielectric tangent of the cured product of the resin composition can be effectively lowered. When the amount of the indium polyimide resin (C) is not more than the upper limit of the above range, the adhesion between the conductor layer and the conductive layer can be effectively increased.

[5. (D) inorganic filler]

The resin composition may further comprise, as optional components, (D) an inorganic filler in addition to the above components. (D) By using the inorganic filler, the coefficient of thermal expansion of the cured product of the resin composition can be reduced, and the reflow warp of the insulating layer can be suppressed.

The material of the inorganic filler (D) is not particularly limited, and examples thereof include silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, Magnesium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide , Barium titanate, barium titanate zirconate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate. Of these, silica is particularly suitable. As the silica, spherical silica is preferable. The inorganic filler (D) may be used singly or in combination of two or more at any ratio.

Usually, the inorganic filler (D) is contained in the resin composition in the form of particles. The average particle diameter of the particles of the inorganic filler (D) is preferably 5 占 퐉 or less, more preferably 2.5 占 퐉 or less, and still more preferably 2 占 퐉 or less, from the viewpoint of improving the circuit embedding property and obtaining an insulating layer with a small surface roughness. Mu m or less, particularly preferably 1.5 mu m or less. The lower limit of the average particle diameter is not particularly limited, but is preferably 0.01 占 퐉 or more, more preferably 0.05 占 퐉 or more, further preferably 0.1 占 퐉 or more, and particularly preferably 0.5 占 퐉 or more.

Examples of commercially available products of the inorganic filler (D) having an average particle size as described above include " SP60-05 ", " SP507-05 ", Shin- "YC100C", "YA050C", "YA050C-MJE" and "YA010C" manufactured by Adomatex Corporation; "UFP-30" manufactured by Denka Corporation; "Seal Pill NSS-3N", "Seal Pill NSS-4N" and "Seal Pill NSS-5N" manufactured by Tokuyama Corporation; "SC2500SQ", "SO-C4", "SO-C2", and "SO-C1" manufactured by Adomex Corporation.

(D) The average particle diameter of particles such as inorganic filler can be measured by a laser diffraction / scattering method based on the Mie scattering theory. Specifically, the particle size distribution of the particles can be measured on the volume basis by the laser diffraction scattering type particle size distribution measuring apparatus, and the average particle size can be measured as the median diameter from the particle size distribution. The measurement sample can be preferably those in which particles are dispersed in water by ultrasonic waves. As the laser diffraction scattering type particle size distribution measuring apparatus, "LA-500" manufactured by Horiba Seisakusho Co., Ltd. and the like can be used.

The inorganic filler (D) may be subjected to surface treatment with an arbitrary surface treatment agent. Examples of the surface treatment agent include an amino silane coupling agent, an epoxy silane coupling agent, a mercaptosilane coupling agent, an alkoxysilane compound, an organosilazane compound, and a titanate coupling agent. By performing surface treatment with these surface treatment agents, the moisture resistance and dispersibility of the inorganic filler (D) can be enhanced. As commercially available products of the surface treatment agent, for example, KBM403 (3-glycidoxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., KBM803 (3-mercaptopropyl (3-aminopropyltriethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., KBM573 (N-phenyl-3-aminopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., "KBM-103" (phenyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM-4803" manufactured by Shin-Etsu Chemical Co., Ltd. Epoxy type silane coupling agent). One type of surface treatment agent may be used alone, or two or more types of surface treatment agents may be used in combination at an arbitrary ratio.

The degree of the surface treatment by the surface treatment agent can be evaluated by the amount of carbon per unit surface area (D) of the inorganic filler. The amount of carbon per unit surface area of the inorganic filler (D) is preferably at least 0.02 mg / m 2, more preferably at least 0.1 mg / m 2, and most preferably at least 0.2 mg / m 2 from the viewpoint of improving the dispersibility of the inorganic filler (D) Particularly preferred. On the other hand, the amount of carbon is preferably 1 mg / m 2 or less, more preferably 0.8 mg / m 2 or less, and more preferably 0.5 mg / m 2 or less from the viewpoint of suppressing the increase of the melt viscosity and the melt viscosity in the sheet form of the resin composition Is particularly preferable.

The amount of carbon per unit surface area of the inorganic filler (D) can be measured after washing the inorganic filler (D) after the surface treatment with a solvent. As the solvent, for example, methyl ethyl ketone (hereinafter may be abbreviated as " MEK ") may be used. Specifically, a sufficient amount of methyl ethyl ketone and inorganic filler (D) surface-treated with a surface treatment agent are mixed and ultrasonically cleaned at 25 占 폚 for 5 minutes. Thereafter, the supernatant is removed, and the solid content is dried, and then the amount of carbon per unit surface area (D) of the inorganic filler can be measured using a carbon analyzer. As the carbon analyzer, "EMIA-320V" manufactured by Horiba Seisakusho Co., Ltd. can be used.

The amount of the inorganic filler (D) in the resin composition is preferably not less than 50% by mass, more preferably not less than 55% by mass, based on 100% by mass of the nonvolatile component in the resin composition from the viewpoint of obtaining an insulating layer having a low coefficient of thermal expansion. Or more, more preferably 60 mass% or more, or 65 mass% or more. The upper limit is preferably 95 mass% or less, more preferably 90 mass% or less, further preferably 85 mass% or less, or 80 mass% or less, from the viewpoint of the mechanical strength of the insulating layer,

[6. (E) Organic filler]

The resin composition may further comprise, as optional components, (E) an organic filler in addition to the above-mentioned components. By using (E) an organic filler, the flexibility of the cured product of the resin composition can be improved, so that the extensibility of the insulating layer can be improved.

As the organic filler (E), any organic filler that can be used in forming the insulating layer of the printed wiring board can be used. Examples of the (E) organic filler include rubber particles, polyamide particles, silicon particles and the like. As the rubber particles, a commercially available product may be used. Examples thereof include "EXL2655" manufactured by Dow Chemical Co., Ltd., "AC3816N" manufactured by Aikoko Co., Ltd., and the like. The organic fillers (E) may be used singly or in a combination of two or more kinds.

The average particle diameter of the particles of the organic filler (E) is preferably 5 占 퐉 or less, more preferably 4 占 퐉 or less, and further preferably 3 占 퐉 or less, from the viewpoint of excellent dispersibility in the resin composition. The lower limit of the average particle diameter of the organic filler (E) is not particularly limited, but is preferably 0.05 탆 or more, more preferably 0.08 탆 or more, and particularly preferably 0.10 탆 or more.

The amount of the organic filler (E) in the resin composition is preferably from 0.1% by mass to 20% by mass, more preferably from 0.1% by mass to 20% by mass with respect to 100% by mass of the resin component in the resin composition from the viewpoint of adjusting the mechanical properties of the cured product, , More preferably 0.2 mass% to 10 mass%, still more preferably 0.3 mass% to 5 mass%, or 0.5 mass% to 3 mass%.

[7. (F) Curing accelerator]

The resin composition may further contain, as optional components, (C) a curing accelerator in addition to the above components. By using the curing accelerator (F), curing can be promoted when the resin composition is cured.

Examples of the curing accelerator (F) include phosphorus hardening accelerators, amine hardening accelerators, imidazole hardening accelerators, guanidine hardening accelerators and metal hardening accelerators. Among them, a phosphorus hardening accelerator, an amine hardening accelerator, an imidazole hardening accelerator, and a metal hardening accelerator are preferable, and an amine hardening accelerator, an imidazole hardening accelerator, and a metal hardening accelerator are more preferable.

Examples of phosphorus hardening accelerators include triphenylphosphine, phosphonium borate compounds, tetraphenylphosphonium tetraphenylborate, n-butylphosphonium tetraphenylborate, tetrabutylphosphonium decanoate, (4-methylphenyl) triphenyl Phosphonium thiocyanate, tetraphenylphosphonium thiocyanate, butyltriphenylphosphonium thiocyanate, and the like, and triphenylphosphine and tetrabutylphosphonium decanoate are preferable.

Examples of the amine-based curing accelerator include trialkylamines such as triethylamine and tributylamine; amines such as 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6-tris (dimethylaminomethyl) Diazabicyclo (5,4,0) undecene, and 4-dimethylaminopyridine and 1,8-diazabicyclo (5,4,0) -undecene are preferable.

Examples of the imidazole-based curing accelerator include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, Imidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl- Benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl- 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium Trimellitate, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')] -ethyl-s-triazine, 2,4- diamino-6- [ Imidazolyl- (1 ')] - ethyl-s-triazine, 2,4-diamino-6- [2'-ethyl-4'-methylimidazolyl- Triazine, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')] - ethyl-s-triazine isocyanuric acid Water, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,3 -Dihydro-1H-pyrrolo [1,2-a] benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, And imidazole compounds of imidazole compounds and epoxy resins, and 2-ethyl-4-methylimidazole and 1-benzyl-2-phenylimidazole are preferable.

As the imidazole-based curing accelerator, a commercially available product may be used, for example, " P200-H50 " manufactured by Mitsubishi Chemical Corporation.

Examples of the guanidine curing accelerator include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1- (o-tolyl) guanidine, dimethylguanidine, , Trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo [4.4.0] deca-5-ene, 7-methyl-1,5,7-triazabicyclo [4.4.0] 1-n-butylbiguanide, 1-n-octadecylbiguanide, 1,1-dimethylbiguanide, 1, 1-cyclohexylbiguanide, 1-allylbiguanide, 1-phenylbiguanide, 1- (o-tolyl) biguanide, and the like, and dicyandiamide, 1,5,7-triazabicyclo [4.4.0] deca-5-ene are preferred.

Examples of the metal-based curing accelerator include organic metal complexes or organic metal salts of metals such as cobalt, copper, zinc, iron, nickel, manganese and tin. Specific examples of the organometallic complexes include organic cobalt complexes such as cobalt (II) acetylacetonate and cobalt (III) acetylacetonate; Organic copper complexes such as copper (II) acetylacetonate; An organic zinc complex such as zinc (II) acetylacetonate; An organic iron complex such as iron (III) acetylacetonate; An organic nickel complex such as nickel (II) acetylacetonate; And organic manganese complexes such as manganese (II) acetylacetonate. Examples of the organic metal salt include zinc octylate, tin octylate, zinc naphthenate, cobalt naphthenate, tin stearate and zinc stearate.

One type of the (C) curing accelerator may be used alone, or two or more types may be used in combination at an arbitrary ratio.

The amount of the curing accelerator (F) in the resin composition is not particularly limited, but is preferably 0.01% by mass to 3% by mass based on 100% by mass of the resin component in the resin composition from the viewpoint of achieving the desired effect of the present invention.

[8. (G) Curing agent]

The resin composition may further contain, as optional components, (C) a curing agent other than the active ester compound (B), in addition to the above components.

As the (G) curing agent, any curing agent having a function of curing the epoxy resin can be used. Examples of the (G) curing agent include a phenol-based curing agent, a naphthol-based curing agent, a cyanate ester-based curing agent, a benzoxazine-based curing agent, and a carbodiimide-based curing agent.

As the phenol-based curing agent and naphthol-based curing agent, a phenol-based curing agent having a novolak structure or a naphthol-based curing agent having a novolak structure is preferable from the viewpoints of heat resistance and water resistance. From the viewpoint of obtaining an insulating layer having excellent adhesion with a conductor layer, a nitrogen-containing phenol-based curing agent and a nitrogen-containing naphthol-based curing agent are preferable, and a phenazine-based curing agent containing a triazine skeleton and a naphthol- . Among them, phenol novolac resins containing a triazine skeleton and naphthol novolak resins containing a triazine skeleton are preferable from the viewpoint of high heat resistance, water resistance, and adhesion to a conductor layer.

Specific examples of the phenol-based curing agent and naphthol-based curing agent include "MEH-7700", "MEH-7810" and "MEH-7851" manufactured by Meiwa Kasei; NHN ", " CBN ", " GPH ", manufactured by Nippon Kayaku Co., "SN170", "SN180", "SN190", "SN475", "SN485", "SN495", "SN375" and "SN395" manufactured by Shinnetsu Tetsu Sumikin Kakuga; LA-7052 "," LA-7054 "," LA-3018 "," LA-1356 ", and" TD2090 "manufactured by DIC Corporation.

Examples of the cyanate ester-based curing agent include novolak-type cyanate ester-based curing agents such as phenol novolak type and alkylphenol novolak type; Dicyclopentadiene type cyanate ester-based curing agents; Bisphenol-type cyanate ester-based curing agents such as bisphenol A type, bisphenol F type, and bisphenol S type; And prepolymerized prepolymers thereof, and the like. Specific examples of the cyanate ester curing agent include bisphenol A dicyanate, polyphenol cyanate, oligo (3-methylene-1,5-phenylene cyanate), 4,4'-methylene bis (2,6- Cyanate), 4,4'-ethylidenediphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis (4-cyanate) phenylpropane, 1,1- (4-cyanate-3,5-dimethylphenyl) methane, 1,3-bis (4-cyanate phenyl-1- (methyl ethylidene)) benzene, bis ) Bifunctional cyanate resins such as thioether, and bis (4-cyanate phenyl) ether; Polyfunctional cyanate resins derived from phenol novolak and cresol novolak; And prepolymerized prepolymers obtained by partially curing these cyanate resins. Specific examples of commercially available cyanate ester curing agents include " PT30 " and " PT60 " (both phenol novolak type polyfunctional cyanate ester resins), " BA230 " (part of bisphenol A dicyanate or A prepolymer in which all triazines are trimerized to form a trimer).

Specific examples of the benzoxazine-based curing agent include "HFB2006M" manufactured by Showa Kobunshi Co., Ltd., "P-d" manufactured by Shikoku Kasei Corporation, and "F-a".

Specific examples of the carbodiimide-based curing agent include "V-03" and "V-07" manufactured by Nisshinbo Chemical Co.,

Among the above-mentioned (G) curing agents, a phenol-based curing agent and a naphthol-based curing agent are preferred from the viewpoint of obtaining an insulating layer exhibiting a good breaking elongation by combination with the components (A), (B) Do. Further, a phenolic curing agent is particularly preferable because an insulating layer with a small surface roughness can be obtained.

One kind of the (G) curing agent may be used alone, or two or more kinds may be used in combination at an arbitrary ratio.

The amount of the (C) curing agent in the resin composition is preferably 0.5% by mass or more, more preferably 0.6% by mass or more, still more preferably 0.7% by mass or more, relative to 100% by mass of the nonvolatile component in the resin composition, , More preferably not more than 8 mass%, not more than 4 mass%, not more than 3 mass%, or not more than 2 mass%.

[9. (H) Thermoplastic resin]

The resin composition may further contain (H) a thermoplastic resin as an optional component in addition to the above components.

(H) As the thermoplastic resin, for example, phenoxy resin; Polyvinyl acetal resin; Polyolefin resins; Polybutadiene resin; Polysulfone resin; Polyethersulfone resin; Polycarbonate resin; Polyether ether ketone resins; Polyester resin; (C) a polyimide resin other than an indene polyimide resin, a polyamideimide resin, and a polyetherimide resin.

Examples of the phenoxy resin include bisphenol A skeleton, bisphenol F skeleton, bisphenol S skeleton, bisphenol acetophenone skeleton, novolak skeleton, biphenyl skeleton, fluorene skeleton, dicyclopentadiene skeleton, norbornene skeleton, naphthalene skeleton, A phenoxy resin having at least one skeleton selected from the group consisting of a skeleton, an anthracene skeleton, an adamantane skeleton, a terpene skeleton, and a trimethyl cyclohexane skeleton. The terminal of the phenoxy resin may be any functional group such as a phenolic hydroxyl group or an epoxy group. Specific examples of the phenoxy resin include " 1256 " and " 4250 " (all phenolic resin containing bisphenol A skeleton) manufactured by Mitsubishi Chemical Corporation; &Quot; YX8100 " (bisphenol S skeleton-containing phenoxy resin) manufactured by Mitsubishi Chemical Corporation; "YX6954" (a phenoxy resin containing a bisphenol acetophenone skeleton) manufactured by Mitsubishi Chemical Corporation; &Quot; FX280 " and " FX293 " manufactured by Shinnitetsu Sumikin Kagaku; "YX6954BH30", "YX7553", "YX7553BH30", "YL7769BH30", "YL6794", "YL7213", "YL7290", "YL7891BH30" and "YL7482" manufactured by Mitsubishi Kagaku Co.,

As the polyvinyl acetal resin, for example, a polyvinyl formal resin and a polyvinyl butyral resin can be mentioned, and a polyvinyl butyral resin is preferable. Specific examples of the polyvinyl acetal resin include "Denkabutilal 4000-2", "Denkabutilal 5000-A", "Denkabutilal 6000-C", "Denkabutilal 6000-EP" manufactured by Denki Kagaku Kogyo Co., ; (For example, BX-5Z), KS series (for example, KS-1), BL series, and BM series manufactured by Sekisui Kagaku Kogyo Co., Ltd.

Specific examples of the polyether sulfone resin include "PES 5003P" manufactured by Sumitomo Chemical Co., Ltd.

Specific examples of the polysulfone resin include polysulfone "P1700" and "P3500" manufactured by Solvay Advanced Polymers Co., Ltd.

Specific examples of the polyimide resin other than the (C) indanepolyimide resin include "Rika coat SN20" and "Rika coat PN20" manufactured by Shin-Nippon Rikagaku. Specific examples of these polyimide resins include linear polyimide resins obtained by reacting bifunctional hydroxyl-terminated polybutadiene, diisocyanate compounds and tetrabasic acid anhydride (polyimide resins described in JP-A-2006-37083 ), Polysiloxane skeleton-containing polyimide resins (JP-A-2002-12667 and JP-A-2000-319386, etc.), and other modified polyimide resins.

Specific examples of the polyamide-imide resin other than the (C) indan-polyimide resin include "Bylomex HR11NN" and "Bylomax HR16NN" manufactured by Toyobo Co., Specific examples of these polyamideimide resins include modified polyamideimides such as "KS9100" and "KS9300" (polysiloxane skeleton-containing polyamideimide) produced by Hitachi Chemical Co., Ltd.

Among them, a phenoxy resin and a polyvinyl acetal resin are preferable as the thermoplastic resin (H), and a phenoxy resin is particularly preferable from the viewpoint of obtaining an insulating layer having a small surface roughness and excellent adhesion to a conductor layer.

(H) The thermoplastic resin may be used singly or in combination of two or more in an arbitrary ratio.

The weight average molecular weight of the thermoplastic resin (H) is preferably 8,000 to 70,000, more preferably 10,000 to 60,000, and particularly preferably 20,000 to 60,000 from the viewpoint of achieving the desired effect of the present invention.

The amount of the thermoplastic resin (H) in the resin composition is preferably 0.5% by mass to 15% by mass, more preferably 0.6% by mass to 12% by mass, relative to 100% by mass of the resin component in the resin composition, 0.7% by mass to 10% by mass.

[10. (I) Flame Retardant]

The resin composition may further comprise (I) a flame retardant as an optional component in addition to the above components. (I) Examples of the flame retardant include organic phosphorus flame retardants, organic nitrogen-containing phosphorus compounds, nitrogen compounds, silicon-based flame retardants and metal hydroxides. (I) As the flame retardant, a commercially available product may be used, and examples thereof include "HCA-HQ" manufactured by Sanko Co., Ltd. and "PX-200" manufactured by Daihatsu Kagakuko Co., The flame retardant (I) may be used singly or in combination of two or more at any ratio.

The amount of the (I) flame retardant in the resin composition is not particularly limited, but is preferably 0.5% by mass to 20% by mass, more preferably 0.5% by mass to 15% by mass, further preferably 0.5% by mass to 100% And preferably 0.5% by mass to 10% by mass.

[11. (J) optional additive]

The resin composition may contain (J) optional additives in addition to the above components. Examples of such additives include organic metal compounds such as organic copper compounds, organic zinc compounds and organic cobalt compounds; Thickener; Defoamer; Leveling agents; An adhesion imparting agent; And a resin additive such as a coloring agent.

[12. Characteristics of Resin Composition]

The above-mentioned resin composition has the lowest melt viscosity within a range suitable for use as a material for an insulating layer of a printed wiring board. Here, the lowest melt viscosity of the resin composition means the lowest viscosity exhibited by the resin composition when the resin composition is melted. Specifically, when the resin composition is melted by heating the resin composition at a constant heating rate, the melt viscosity of the resin composition is lowered along with the temperature rise in the initial stage, and then the melt viscosity increases with the temperature rise. The lowest melt viscosity refers to the melt viscosity of such a minimum point.

The specific minimum melt viscosity of the resin composition is preferably 200 poise or more, more preferably 300 poise or more, particularly preferably 400 poise or more, preferably 3,000 poise or less, more preferably 2,000 poise or less, particularly preferably 1,500 poise or less . Since the lowest melt viscosity of the resin composition is lower than the lower limit described above, even if the resin composition layer is thin, the thickness of the resin composition is easily stably maintained, and better circuit embedding property can be obtained.

The minimum melt viscosity of the resin composition was measured using a dynamic viscoelasticity measuring apparatus under the measurement conditions of a temperature rising rate of 5 占 폚 / min, a measurement temperature interval of 2.5 占 폚 and a vibration of 1 Hz / deg in a measurement temperature range from 60 占 폚 to 200 占 폚 can do.

According to the inventors of the present invention, it is presumed that a structure capable of having the lowest melt viscosity within a range suitable for use as the material of the insulating layer of the printed wiring board is as follows. However, the technical scope of the present invention is not limited by the following structure.

(B) The active ester compound generally has a low polarity. In addition, the (C) indanepolyimide resin has a large proportion of aromatic rings in the molecule in order to have an indane skeleton, and therefore the polarity is small. Therefore, the active ester compound (B) and the (C) indanepolyimide resin can be mixed well with high compatibility. Therefore, since the melt viscosity as a whole of the resin composition is low, it can have a lowest melt viscosity in a low range suitable for the material of the insulating layer of the printed wiring board as described above.

Further, by curing the above-mentioned resin composition, a cured product having a low dielectric tangent can be obtained. Therefore, by using a cured product of the resin composition, it is possible to realize an insulating layer having a low dielectric tangent. The dielectric tangent of the cured product of the resin composition is preferably as low as possible and is preferably 0.020 or less, more preferably 0.010 or less, still more preferably 0.009 or less, particularly preferably 0.008 or less, 0.007 or less, or 0.006 or less. The lower limit is not particularly limited, but is usually 0.001 or more.

The dielectric loss tangent of the cured product of the resin composition can be measured by the cavity resonance perturbation method under the measurement conditions of a measurement frequency of 5.8 GHz and a measurement temperature of 23 캜.

According to the present inventors, it is assumed that the structure capable of lowering the dielectric tangent of the cured product of the resin composition is as follows. However, the technical scope of the present invention is not limited by the following structure.

As described above, the (C) indanepolyimide resin has a large proportion of aromatic rings occupied in the molecule in order to have an indane skeleton, and thus the polarity is small. Accordingly, the polarity of the cured product of the resin composition comprising the (C) indanepolyimide resin and (A) the epoxy resin and (B) the active ester compound is reduced. Since the polarity is small as described above, dielectric tangent of the cured product of the resin composition can be lowered. Particularly, when a hydrocarbon group such as a methyl group is bonded to the indane skeleton of the (C) indanepolyimide resin, the number of carbon atoms of the molecule of the (C) indanepolyimide resin can be increased and the polarity can be further reduced, The tangency can be made particularly low.

Further, by using the above-mentioned cured product of the resin composition, it is possible to realize an insulating layer having excellent adhesion with the conductor layer. The adhesion between the insulating layer and the conductor layer can be evaluated by the peel strength as a load when the conductor layer is pulled out in a direction perpendicular to the insulating layer at room temperature. More specifically, it is preferably 0.40 kgf / cm or more, more preferably 0.45 kgf / cm or more, further preferably 0.50 kgf / cm or more, particularly preferably 0.53 kgf / cm or more Or more. The upper limit is not particularly limited, but is usually 1.2 kgf / cm or less. Particularly, since the insulating layer containing the cured product of the resin composition exhibits such a high fill strength even if the arithmetic mean roughness (Ra) (surface roughness) of the surface of the insulating layer after the roughening treatment is small, It can contribute significantly to miniaturization of wiring.

According to the present inventors, it is presumed that the structure capable of increasing the adhesion between the insulating layer including the cured product of the resin composition and the conductor layer is as follows. However, the technical scope of the present invention is not limited by the following structure.

(C) Indane polyimide resin has an indane skeleton, and therefore has a high rigidity. The (C) indanepolyimide resin can be mixed well with (A) the epoxy resin and (B) the active ester compound. Therefore, the cured product of the resin composition has high mechanical strength. Therefore, the cured product of the resin composition is hardly broken at the portion near the interface between the insulating layer containing the cured product of the resin composition and the conductor layer. Therefore, it is difficult for the conductor layer to peel off due to breakage of the cured product of the resin composition, so that the adhesion between the insulating layer and the conductor layer can be enhanced.

The above-mentioned cured product of the resin composition usually has a high glass transition temperature, and therefore has excellent heat resistance. The specific glass transition temperature of the resin composition is preferably 130 占 폚 or higher, more preferably 150 占 폚 or higher, particularly preferably 155 占 폚 or higher, or 160 占 폚 or higher. The upper limit of the glass transition temperature is not particularly limited, but is preferably 200 占 폚 or lower, more preferably 190 占 폚 or lower, and particularly preferably 180 占 폚 or lower.

The glass transition temperature of the cured product of the resin composition can be measured by a tensile weighting method (JIS K7197) using a thermomechanical analyzer.

By using the above-mentioned cured product of the resin composition, an insulating layer having a small surface roughness after the roughening treatment can be usually obtained. The above-mentioned surface roughness can be expressed by an arithmetic average roughness. The arithmetic average roughness of the surface of the insulating layer after the roughening treatment is preferably as small as possible. Specifically, it is preferably 280 nm or less, more preferably 250 nm or less, further preferably 200 nm or less, 140 nm or less, 130 nm or less, 110 nm or less, 100 nm or less, 95 nm or less, or 90 nm or less. The lower limit of the arithmetic mean roughness is not particularly limited, but is usually 0.5 nm or more.

The arithmetic average roughness of the surface of the insulating layer can be measured by a non-contact surface roughness meter (e.g., " WYKO NT3300 " manufactured by Vico Instruments).

As described above, the resin composition of the present invention can be suitably used as a resin composition (resin composition for an insulating layer of a printed wiring board) for forming an insulating layer of a printed wiring board, Can be suitably used as a resin composition for forming a layer. Further, the resin composition of the present invention can be used suitably when the printed wiring board is a component built-in circuit board, because it can form an insulating layer with excellent parts embedding property. Further, the resin composition of the present invention can be used as a material of a prepreg.

[13. Adhesive film]

An adhesive film can be obtained by using the resin composition of the present invention. Such an adhesive film has a support and a resin composition layer containing the resin composition formed on the support.

The thickness of the resin composition layer is preferably 900 占 퐉 or less, more preferably 800 占 퐉 or less, further preferably 700 占 퐉 or less, and even more preferably 600 占 퐉 or less. From the viewpoint of thinning, the thickness of the resin composition layer may be 100 占 퐉 or less, 80 占 퐉 or less, 60 占 퐉 or less, 50 占 퐉 or less, or 40 占 퐉 or less. The lower limit of the thickness of the resin composition layer is not particularly limited, but may be 1 占 퐉 or more, 1.5 占 퐉 or more, or 2 占 퐉 or more.

As the support, for example, a film made of a plastic material, a metal foil and a release paper can be mentioned, and a film or a metal foil made of a plastic material is preferable.

When a film made of a plastic material is used as a support, examples of the plastic material include polyethylene terephthalate (hereinafter sometimes abbreviated as "PET"), polyethylene naphthalate (hereinafter abbreviated as "PEN" (Hereinafter sometimes abbreviated as "PC"), polymethyl methacrylate (hereinafter may be abbreviated as "PMMA"), cyclic polyolefins, triacetyl Cellulose (hereinafter may be abbreviated as "TAC"), polyether sulfide (hereinafter, may be abbreviated as "PES"), polyether ketone, polyimide and the like. Among them, polyethylene terephthalate and polyethylene naphthalate are preferable, and inexpensive polyethylene terephthalate is particularly preferable.

When a metal foil is used as the support, examples of the metal foil include copper foil and aluminum foil, and copper foil is preferable. As the copper foil, a foil made of a copper metal may be used, or a foil made of an alloy of copper and another metal (for example, tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) may be used.

The surface of the support to be bonded to the resin composition layer may be subjected to a surface treatment such as a mat treatment or a corona treatment.

As the support, a support having a release layer having a release layer on the surface to be bonded to the resin composition layer may be used. As the releasing agent for use in the release layer of the release layer-adhered support, for example, one or more release agents selected from the group consisting of an alkyd resin, a polyolefin resin, a urethane resin, and a silicone resin may be mentioned. SK-1, " " AL-5, " and " AL-5, " manufactured by LINTEX Corporation, each of which is a PET film having a releasing layer mainly composed of an alkyd resin-based releasing agent, 7; " Lumirror T6AM " manufactured by Toray Industries, Inc., and the like.

The thickness of the support is not particularly limited, but is preferably in the range of 5 탆 to 75 탆, more preferably in the range of 10 탆 to 60 탆. When the release layer-adhered support is used, it is preferable that the thickness of the entirety of the release layer-adhered support is in the above range.

The adhesive film can be formed, for example, by preparing a resin varnish containing an organic solvent and a resin composition, applying the resin varnish on a support using a coating device such as a die coater, and further drying the resin varnish to form a resin composition layer Can be manufactured.

Examples of the organic solvent include ketone solvents such as acetone, methyl ethyl ketone and cyclohexanone; Acetic acid ester solvents such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate and carbitol acetate; Carbitol solvents such as cellosolve and butyl carbitol; Aromatic hydrocarbon solvents such as toluene and xylene; And amide solvents such as dimethylformamide, dimethylacetamide (hereinafter sometimes abbreviated as "DMAc") and N-methylpyrrolidone. The organic solvent may be used singly or in combination of two or more in an arbitrary ratio.

The drying may be performed by any method such as heating, hot air blowing, or the like. The drying conditions are not particularly limited, but the drying is carried out so that the content of the organic solvent in the resin composition layer is usually 10 mass% or less, preferably 5 mass% or less. The resin varnish may vary depending on the boiling point of the organic solvent in the resin varnish. For example, when a resin varnish containing an organic solvent of 30% by mass to 60% by mass is used, the resin varnish is dried at 50 ° C to 150 ° C for 3 minutes to 10 minutes, Layer can be formed.

The adhesive film may have an arbitrary layer in combination with the support and the resin composition layer. For example, the adhesive film may further include a protective film according to the support on the side of the resin composition layer not bonded to the support (i.e., the side of the resin composition opposite to the support). The thickness of the protective film is not particularly limited, but is, for example, 1 m to 40 m. By the protective film, adhesion of dust or the like to the surface of the resin composition layer and scratch can be suppressed. Further, the adhesive film can be rolled and stored. When the adhesive film has a protective film, it can usually be used by peeling off the protective film.

[14. Prepreg]

By using the resin composition of the present invention, a prepreg can be obtained. The prepreg has a sheet-like fiber substrate and the resin composition impregnated in the sheet-like fiber substrate.

The sheet-like fiber substrate is not particularly limited, and for example, those commonly used as prepreg substrates such as glass cloth, aramid nonwoven fabric, and liquid crystal polymer nonwoven fabric can be used. The thickness of the sheet-like fibrous base material is preferably 900 占 퐉 or less, more preferably 800 占 퐉 or less, further preferably 700 占 퐉 or less, particularly preferably 600 占 퐉 or less. Further, from the viewpoint of thinning, the thickness of the sheet-like fiber base material may be 30 占 퐉 or less, 20 占 퐉 or less, or 10 占 퐉 or less. The lower limit of the thickness of the sheet-like fibrous substrate is not particularly limited, but may be usually 1 占 퐉 or more, 1.5 占 퐉 or more, or 2 占 퐉 or more.

The prepreg can be produced by, for example, a hot melt method, a solvent method, or the like.

The thickness of the prepreg can be the same as that of the resin composition layer in the above-mentioned adhesive film.

The prepreg can be used, for example, to form an insulating layer of a printed wiring board. Among them, it can be suitably used for forming an interlayer insulating layer of a multilayer printed wiring board.

[15. Printed wiring board]

By using the resin composition of the present invention, a printed wiring board can be obtained. Such a printed wiring board has an insulating layer containing a cured product of the resin composition.

The printed wiring board can be produced, for example, by a method including the following steps (I) and (II) using an adhesive film.

(I) A step of laminating an adhesive film on an inner layer substrate and a resin composition layer of the adhesive film to be bonded to an inner layer substrate.

(II) A step of thermally curing the resin composition layer to form an insulating layer.

The term " inner layer substrate " used in the process (I) is mainly a substrate such as a glass epoxy substrate, a metal substrate, a ceramic substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, a thermosetting polyphenylene ether substrate, Refers to a circuit board on which patterned conductor layers (corresponding to circuits) are formed on one or both sides of a substrate. Further, when the printed wiring board is manufactured, the inner layer circuit board as an intermediate product to which the insulating layer and / or the conductor layer is to be formed is also included in the above-mentioned "innerlayer board". When the printed wiring board is a component built-in circuit board, an inner-layer board incorporating the components can be used.

The lamination of the inner layer substrate and the adhesive film can be performed, for example, by heat-pressing the adhesive film from the support side to the inner layer substrate. Examples of the member for heating and pressing the adhesive film to the inner layer substrate (hereinafter sometimes referred to as "hot pressed member") include a heated metal plate (SUS hard plate) or a metal roll (SUS roll etc.) . Further, it is preferable to press the heat-press member through an elastic material such as heat-resistant rubber such that the heat-press member is not pressed directly onto the adhesive film but the adhesive film sufficiently follows the surface unevenness of the inner-layer substrate.

The lamination of the inner layer substrate and the adhesive film may be performed by, for example, a vacuum lamination method. In the vacuum laminating method, the heat-pressing temperature is preferably in the range of 60 占 폚 to 160 占 폚, more preferably 80 占 폚 to 140 占 폚, the heat pressing pressure is preferably 0.098 MPa to 1.77 MPa, Is in the range of 0.29 MPa to 1.47 MPa, and the heat pressing time is preferably in the range of 20 seconds to 400 seconds, more preferably 30 seconds to 300 seconds. The lamination is preferably performed under a reduced pressure of 26.7 hPa or less.

The lamination may be carried out by using a commercially available vacuum laminate. Examples of commercially available vacuum laminates include vacuum pressurized laminator manufactured by Meikishesakusho Co., Ltd., and baking applicator manufactured by Nikko Materials Company.

After lamination, the laminated adhesive film may be subjected to a smoothing treatment under atmospheric pressure (at atmospheric pressure), for example, by pressing a hot press member from the support side. The pressing condition of the smoothing process can be set to the same condition as the hot pressing condition of the lamination. The smoothing process can be performed by a commercially available laminator. The lamination and the smoothing process may be performed continuously using the commercially available vacuum laminator.

The support may be removed between the step (I) and the step (II) or may be removed after the step (II).

In the step (II), the resin composition layer is thermally cured to form an insulating layer.

The thermosetting conditions of the resin composition layer are not particularly limited, and the conditions employed when forming the insulating layer of the printed wiring board may be arbitrarily used.

The specific heat curing conditions of the resin composition layer are different depending on the type of the resin composition, but the curing temperature is usually 120 to 240 캜 (preferably 150 to 220 캜, more preferably 170 to 200 캜) The curing time is usually from 5 minutes to 120 minutes (preferably from 10 minutes to 100 minutes, more preferably from 15 minutes to 90 minutes).

The resin composition layer may be preheated at a temperature lower than the curing temperature before thermosetting the resin composition layer. For example, prior to thermosetting the resin composition layer, the resin composition layer is heated at a temperature of 50 ° C or more and less than 120 ° C (preferably 60 ° C or more and 110 ° C or less, more preferably 70 ° C or more and 100 ° C or less) It may be preheated for 5 minutes or more (preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes).

In the production of the printed wiring board, the step of (III) piercing the insulating layer, (IV) the step of roughening the insulating layer, and the step of forming the conductor layer (V) may be further performed. These steps (III) to (V) may be carried out according to various methods used in the production of printed wiring boards. When the support is removed after the step (II), the removal of the support may be carried out between the steps (II) and (III), between the steps (III) and (IV), or between the steps ).

Step (III) is a step of perforating the insulating layer, whereby holes such as via holes and through holes can be formed in the insulating layer. The step (III) may be carried out using, for example, a drill, a laser, a plasma or the like depending on the composition of the resin composition used for forming the insulating layer. The dimensions and shape of the holes may be appropriately determined according to the design of the printed wiring board.

Step (IV) is a step of roughening the insulating layer. The procedure and conditions of the roughening treatment are not particularly limited and arbitrary procedures and conditions used for forming the insulating layer of the printed wiring board can be adopted. For example, the swelling treatment with a swelling liquid, the coarsening treatment with an oxidizing agent, and the neutralization treatment with a neutralizing liquid can be carried out in this order to roughen the insulating layer. The swelling liquid is not particularly limited, and examples thereof include an alkali solution and a surfactant solution, and an alkaline solution is preferably used. As the alkali solution, a sodium hydroxide solution and a potassium hydroxide solution are more preferable. Examples of commercially available swelling liquids include "Swelling Deep Siciligan P" and "Swelling Deep Cecrigans SBU" manufactured by Atotech Japan Co., Ltd. The swelling liquid may be used alone, or two or more swelling liquids may be used in combination at an arbitrary ratio. The swelling treatment by the swelling liquid is not particularly limited, and can be performed, for example, by immersing the swelling liquid at 30 캜 to 90 캜 for 1 minute to 20 minutes. It is preferable to immerse the insulating layer for 5 minutes to 15 minutes in a swelling liquid at 40 deg. C to 80 deg. C from the viewpoint of suppressing the swelling of the resin of the insulating layer to an appropriate level. The oxidizing agent is not particularly limited, and for example, an alkaline permanganic acid solution obtained by dissolving potassium permanganate or sodium permanganate in an aqueous solution of sodium hydroxide can be mentioned. The oxidizing agent may be used singly or in combination of two or more in an arbitrary ratio. The roughening treatment with an oxidizing agent such as an alkaline permanganic acid solution is preferably carried out by immersing the insulating layer in an oxidizing agent solution heated at 60 캜 to 80 캜 for 10 minutes to 30 minutes. The concentration of the permanganate in the alkaline permanganic acid solution is preferably 5% by mass to 10% by mass. Examples of the commercially available oxidizing agent include alkaline permanganic acid solutions such as "Concentrate Compact CP" manufactured by Atotech Japan Co., Ltd. and "Dozing Solution Sekurigans P". The neutralization solution is preferably an acidic aqueous solution, and commercially available products include, for example, " Reduction Solution Sucuregent P " manufactured by Atotech Japan Co., The neutralizing liquid may be used alone, or two or more kinds of neutralizing liquids may be used in combination at an arbitrary ratio. The treatment with the neutralizing liquid can be performed by immersing the treated surface subjected to the roughening treatment with an oxidizing agent in a neutralizing solution at 30 ° C to 80 ° C for 5 minutes to 30 minutes. It is preferable to immerse the object subjected to the roughening treatment with an oxidizing agent in a neutralizing solution at 40 캜 to 70 캜 for 5 minutes to 20 minutes in terms of workability and the like.

Step (V) is a step of forming an insulating layer.

The conductor material used for the conductor layer is not particularly limited. In a preferred embodiment, the conductor layer comprises at least one metal selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin and indium . The conductor layer may be a single metal layer or an alloy layer. Examples of the alloy layer include a layer formed of an alloy of two or more kinds of metals (for example, a nickel-chromium alloy, a copper-nickel alloy, and a copper-titanium alloy) selected from the above-mentioned group. Among them, chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper single metal layers or nickel-chromium alloys, copper-nickel alloys, An alloy layer of copper-titanium alloy is preferable and an alloy layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper single metal layer or nickel-chromium alloy is more preferable, Do.

The conductor layer may have a single-layer structure or a multi-layer structure including two or more single-metal layers or alloy layers made of different kinds of metals or alloys. When the conductor layer has a multilayer structure, the layer in contact with the insulating layer is preferably a single metal layer of chromium, zinc or titanium, or an alloy layer of a nickel-chromium alloy.

The thickness of the conductor layer is generally 3 mu m to 35 mu m, preferably 5 mu m to 30 mu m, though it depends on the design of the desired printed wiring board.

The conductor layer may be formed by plating. For example, a conductor layer having a desired wiring pattern can be formed by plating the surface of the insulating layer by a technique such as a semi-custom method or a pull-to-body method. Hereinafter, an example in which the conductor layer is formed by the semi-

First, a plating seed layer is formed on the surface of the insulating layer by electroless plating. Subsequently, a mask pattern is formed on the formed plating seed layer to expose a part of the plating seed layer corresponding to the desired wiring pattern. A metal layer is formed on the exposed plating seed layer by electrolytic plating, and then the mask pattern is removed. Thereafter, an unnecessary plating seed layer is removed by etching or the like, and a conductor layer having a desired wiring pattern can be formed.

When an adhesive film in which the support is a metal foil is used, a conductor layer may be formed by a subtractive method or a modified semi-

The printed wiring board may be manufactured using the prepreg described above. The manufacturing method of the printed wiring board using the prepreg is basically the same as the case of using the adhesive film.

[16. Semiconductor device]

The semiconductor device of the present invention comprises a printed wiring board. The semiconductor device can be manufactured using a printed wiring board.

Examples of the semiconductor device include various semiconductor devices provided in an electric product (such as a computer, a mobile phone, a digital camera and a television) and a vehicle (such as a motorcycle, a car, a train, have.

The semiconductor device can be manufactured, for example, by mounting a component (semiconductor chip) in a conductive portion of a printed wiring board. The "conduction point" is a "point for transmitting electrical signals on the printed wiring board", and may be a surface or a buried point. Further, as the semiconductor chip, an electric circuit element using a semiconductor material can be arbitrarily used.

The method of mounting the semiconductor chip at the time of manufacturing the semiconductor device is not particularly limited as long as the semiconductor chip effectively functions. Examples of the mounting method include a wire bonding mounting method, a flip chip mounting method, a mounting method using a bumpless buildup layer (BBUL), a mounting method using an anisotropic conductive film (ACF), a mounting method using a nonconductive film (NCF) And the like. Here, the "mounting method using the bumpless buildup layer (BBUL)" refers to a "mounting method in which a semiconductor chip is directly buried in a concave portion of a printed wiring board to connect the semiconductor chip and wiring on the printed wiring board.

[Example]

Hereinafter, the present invention will be described in detail with reference to examples. However, the present invention is not limited to the examples described below. In the following description, " part " and "% " representing amounts are on a mass basis unless otherwise stated.

In the following description, " MEK " refers to methyl ethyl ketone, and " PET " refers to polyethylene terephthalate.

[Synthesis Example 1]

A 500 ml separable flask equipped with a moisture quantifying machine connected to a reflux condenser, a nitrogen introduction tube, and a stirrer was prepared. To this flask was added 20.3 g of 4,4'-oxydiphthalic anhydride (ODPA), 200 g of? -Butyrolactone, 20 g of toluene and 10 g of 5- (4-aminophenoxy) -3- [4- Yl) phenyl] -1,1,3-trimethylindane was added, and the mixture was stirred at 45 DEG C for 2 hours under a nitrogen stream.

Then, the temperature of the reaction solution was raised, and the condensed water was azeotropically removed with toluene under a nitrogen stream while maintaining the temperature at about 160 ° C. It was confirmed that a predetermined amount of water was accumulated in the water amount determination machine and that the water outflow was not observed. After confirming, the reaction solution was further heated and stirred at 200 ° C for 1 hour. Thereafter, the mixture was cooled to obtain a varnish containing 20 mass% of a polyimide resin having a 1,1,3-trimethylindane skeleton. The obtained polyimide resin had a repeating unit represented by the following formula (X1) and a repeating unit represented by the following formula (X2). The weight average molecular weight of the polyimide resin was 12,000.

[Example 1]

, 30 parts of bisphenol A type epoxy resin ("828US" manufactured by Mitsubishi Kagaku Co., Ltd., epoxy equivalent weight 180) and 30 parts of biphenyl type epoxy resin ("NC3000H" manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent weight 269) The mixture was heated and dissolved while stirring, and then cooled to room temperature to obtain a mixed solution.

Spherical silica (average particle diameter 0.5 mu m, "SO-C2" manufactured by Adomex Co., Ltd.) surface-treated with an amino silane coupling agent (KBM573, manufactured by Shin-Etsu Chemical Co., Ltd.) was prepared as an inorganic filler. 260 parts of this spherical silica and 3 parts of methacrylbutadiene styrene rubber particles ("EXL-2655", manufactured by Dow Chemical Company) as an organic filler were added to the above mixed solution, kneaded with three rolls and uniformly dispersed to obtain a roll dispersion ≪ / RTI >

To this roll dispersion, 40 parts of a solution of an active ester compound (" HPC-8000-65T ", manufactured by DIC Corporation, active equivalent weight of active ester compound: about 223 and a nonvolatile component: 65% by weight toluene solution) 60 parts of a varnish containing a polyimide resin (20% by mass of a? -Butyrolactone solution of a solid content) and a solution of a curing accelerator (4-dimethylaminopyridine as a curing accelerator, methyl ethyl ketone solution of a solid content of 5% Were mixed and uniformly dispersed in a high-speed rotary mixer to prepare a resin varnish.

As the support, a PET film with an alkyd resin-based release layer (" AL5 " The above-described resin varnish was uniformly coated on the release layer of such a support so that the thickness of the resin composition layer after drying was 40 占 퐉. Thereafter, it was dried at 80 to 120 캜 (average 100 캜) for 5 minutes to obtain an adhesive film having a support and a resin composition layer.

[Example 2]

In Example 1, 14 parts of a solution of a triazine skeleton-containing phenolic curing agent ("LA-3018-50P" manufactured by DIC Corporation, hydroxyl group equivalent of about 151, 50% solids content of 2-methoxypropanol solution) was added to the roll dispersion Lt; / RTI > A resin varnish and an adhesive film were produced in the same manner as in Example 1 except for the above.

[Example 3]

In Example 2, 30 parts of a biphenyl type epoxy resin ("NC3000H" manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent weight: about 269) was mixed with 30 parts of a naphthol type epoxy resin ("ESN475V" manufactured by Shinnitetsu Sumikin Kagaku Co., Ltd., epoxy equivalent 332) Change. A resin varnish and an adhesive film were produced in the same manner as in Example 2, except for the above.

[Example 4]

In Example 2, 30 parts of a biphenyl type epoxy resin ("NC3000H" manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent weight: 269) was changed to 30 parts of a nonylphenol epoxy resin ("YX4000HK" manufactured by Mitsubishi Kagaku Co., Ltd., epoxy equivalent weight: about 185) Respectively. A resin varnish and an adhesive film were produced in the same manner as in Example 2, except for the above.

[Example 5]

60 parts of varnish (the 20% by mass of the solid content of the? -Butyrolactone solution) containing the polyimide resin synthesized in Synthesis Example 1 was added to 60 parts of the varnish containing the polyimide resin synthesized in Synthesis Example 1 20% by mass of? -Butyrolactone solution) and 30 parts by mass of a solution containing a phenoxy resin ("YX6954BH30" manufactured by Mitsubishi Chemical Corporation, solids content of 30% by mass, solvent: 1: ) To 20 parts. A resin varnish and an adhesive film were produced in the same manner as in Example 2, except for the above.

[Comparative Example 1]

60 parts of a varnish (solid content 20% by mass of? -Butyrolactone solution) containing polyimide resin synthesized in Synthesis Example 1 was mixed with 100 parts by mass of a phenoxy resin ("YX6954BH30" manufactured by Mitsubishi Kagaku Co., Ltd., % Solution, solvent: 1: 1 mixed solvent of MEK and cyclohexanone). A resin varnish and an adhesive film were produced in the same manner as in Example 1 except for the above.

[Comparative Example 2]

109 parts of spherical silica (average particle size 0.5 mu m, "SO-C2" manufactured by Adomex Co., Ltd.) surface-treated with an amino silane coupling agent ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.) Change. The amount of the active ester compound ("HPC-8000-65T" manufactured by DIC Co., active agent equivalent weight of about 223 of active ester compound and toluene solution of 65 mass% of nonvolatile component) was changed to 48 parts. Further, 60 parts of a varnish (a 20% by mass of a? -Butyrolactone solution) containing the polyimide resin synthesized in Synthesis Example 1 was mixed with a solution of a polyimide resin obtained by reacting a tetracarboxylic acid with a dimeric diamine PIAD200 " manufactured by Koh Tao Co., Ltd., a solid content of 30% by mass, and the solvent was 433 parts of a mixed solvent of cyclohexanone and dimethyl glycol and methylcyclohexane). A resin varnish and an adhesive film were produced in the same manner as in Example 1 except for the above.

[Assessment Methods]

The adhesive films prepared in the above Examples and Comparative Examples were evaluated by the following methods.

[Preparation of sample for measurement]

(1) Ground treatment of inner layer circuit board:

A glass cloth base epoxy resin double-sided copper clad laminate (thickness of copper foil: 18 mu m, thickness of the board: 0.4 mm, "R1515A" manufactured by Panasonic Corporation) having copper foil as an inner layer circuit on both sides was prepared as an inner layer circuit board. Both surfaces of this inner-layer circuit board were etched with an etching amount of 1 占 퐉 using an etching agent ("CZ8101" manufactured by McCarthy Co., Ltd.), and the roughening treatment was performed on the copper surface.

(2) Lamination of adhesive film:

The adhesive films produced in Examples and Comparative Examples were laminated on both surfaces of the inner-layer circuit board so that the resin composition layer was bonded to the inner-layer circuit board using a batch type vacuum pressure laminator ("MVLP-500" manufactured by Meikisha Chemical Co., Lt; / RTI > The lamination treatment was carried out by reducing the pressure for 30 seconds to adjust the air pressure to 13 hPa or less, followed by pressing at 100 deg. C and a pressure of 0.74 MPa for 30 seconds.

(3) Curing of resin composition:

After the inner layer circuit board and the adhesive film were laminated, the resin composition layer was thermally cured under the conditions of 100 占 폚 for 30 minutes and then at 180 占 폚 for 30 minutes to form an insulating layer. Thereafter, the support was peeled off to expose the insulating layer. Thus, a multilayer board having an insulating layer, an inner-layer circuit board, and an insulating layer in this order was obtained.

(4) Harmonizing treatment:

The above-mentioned multilayer board having the exposed insulating layer was immersed in a swelling liquid ("Swelling Deep Sekirigant P" manufactured by Atotech Japan Co., sodium hydroxide aqueous solution containing diethylene glycol monobutyl ether) at 60 ° C for 10 minutes , And then immersed in an oxidizing agent ("Concentrate Compact CP" manufactured by Atotech Japan Co., Ltd., potassium permanganate concentration of about 6 mass% and sodium hydroxide concentration of about 4 mass%) at 80 ° C. for 20 minutes, Reduction Solution Sucuregant P " manufactured by Atotech Japan Co., Ltd., aqueous solution of hydroxylamine sulfate) at 40 ° C for 5 minutes. Thereafter, the substrate was dried at 80 DEG C for 30 minutes to obtain a multilayer substrate having a surface roughened. This double-layer substrate subjected to the roughening treatment may hereinafter be referred to as " evaluation substrate a ".

(5) Formation of conductor layer:

A conductor layer was formed on the roughened surface of the insulating layer of the evaluation board a according to the Semi-permanent method. Specifically, the following operation was performed.

The double-layer substrate (i.e., evaluation substrate a) subjected to the roughening treatment was immersed in an electroless plating solution containing PdCl ₂ at 40 ° C for 5 minutes. Subsequently, this double-layer substrate was immersed in an electroless copper plating solution at 25 캜 for 20 minutes. Subsequently, this multilayer substrate was subjected to annealing for heating at 150 DEG C for 30 minutes. Thereafter, an etching resist was formed on the surface of the multilayer substrate and pattern formation was performed by etching. Thereafter, copper sulfate electroplating was performed to form a conductor layer having a thickness of 30 mu m. Thereafter, annealing treatment was performed at 200 캜 for 60 minutes to obtain an evaluation substrate b having a conductor layer.

[Measurement of arithmetic mean roughness (Ra)]

The average value of the arithmetic mean roughness (Ra) of 10 randomly selected points on the surface of the evaluation substrate a was measured as the arithmetic mean roughness (Ra) of the evaluation substrate a. The measurement of the arithmetic mean roughness (Ra) A non-contact surface roughness meter ("WYKO NT3300" manufactured by Vico Instruments) was used and the measurement range was set to 121 μm × 92 μm by a VSI contact mode and a 50 × lens.

[Measurement of Peel Strength of Conductor Layer]

The peel strength of the insulating layer and the conductor layer was measured in accordance with the Japanese Industrial Standard (JIS C6481) for the evaluation board b. Specifically, the following procedure was followed.

The conductor layer of the evaluation board b was cut so as to surround a rectangular portion having a width of 10 mm and a length of 100 mm. The lengthwise end of this rectangular portion was peeled off and grabbed with a gripping tool. The holding tool was pulled in the vertical direction at a rate of 50 mm / minute at room temperature to remove the 35 mm length of the rectangular portion. The load (kgf / cm) at the time of peeling off was measured as the peel strength. A tensile tester ("AC-50C-SL" manufactured by TSE) was used for the above measurement.

[Measurement of Minimum Melting Viscosity]

The melt viscosities of the resin composition layers in the adhesive films produced in Examples and Comparative Examples were measured using a dynamic viscoelasticity measuring apparatus (" Rheosol-G3000 " This measurement was carried out using a parallel plate having a diameter of 18 mm for 1 g of the sample collected from the resin composition layer. The measurement conditions were a start temperature of 60 占 폚 to 200 占 폚, a temperature raising rate of 5 占 폚 / min, a measurement temperature interval of 2.5 占 폚, and a vibration of 1 Hz / deg. The lowest melt viscosity was determined from the measurement of the obtained melt viscosity.

[Measurement of glass transition temperature]

The adhesive films prepared in Examples and Comparative Examples were heated at 200 占 폚 for 90 minutes to thermally cure the resin composition layer. Thereafter, the support was peeled off to obtain a cured product of the resin composition layer. Such a cured product may hereinafter be referred to as " cured product for evaluation c ".

A test piece having a width of about 5 mm and a length of about 15 mm was cut from the cured product c for evaluation. These test pieces were thermomechanically analyzed by tensile weighting using a thermomechanical analyzer ("Thermo Plus TMA8310" manufactured by Rigaku Corporation). Specifically, after the test piece was mounted on the thermomechanical analyzer, measurement was carried out twice in succession under the conditions of a load of 1 g and a temperature raising rate of 5 캜 / min. Then, the glass transition temperature (占 폚) was calculated in the second measurement.

[Measurement of dielectric loss tangent]

A test piece having a width of 2 mm and a length of 80 mm was cut from the cured product for evaluation c. The dielectric loss tangent was measured for the two test pieces, and the average of the measured values was obtained as dielectric tangent of the insulating layer. The dielectric loss tangent of the above test piece was measured by a resonance perturbation method using a measuring device (HP8362B manufactured by Agilent Technologies) at a measurement frequency of 5.8 GHz and a measurement temperature of 23 占 폚.

[result]

The results of the above-described Examples and Comparative Examples are shown in the following table. In the following table, the abbreviations have the following meanings.

828US: bisphenol A type epoxy resin ("828US" manufactured by Mitsubishi Chemical Corporation).

NC3000H: phenyl type epoxy resin ("NC3000H" manufactured by Nippon Kayaku Co., Ltd.).

ESN475V: naphthol type epoxy resin ("ESN475V" manufactured by Shinnetsu Tetsu Sumikin Kagaku Co., Ltd.).

YX4000HK: Bicyclenol type epoxy resin ("YX4000HK" manufactured by Mitsubishi Chemical Corporation).

HPC-8000-65T: Active ester compound ("HPC-8000-65T" manufactured by DIC Corporation).

LA3018-50P: solution of phenolic curing agent containing triazine skeleton (" LA-3018-50P "

PIAD200: Polyimide resin ("PIAD200" manufactured by Arakawa Chemical Industries, Ltd.) obtained by reacting tetracarboxylic acid with dimeric diamine.

YX6954BH30: phenoxy resin ("YX6954BH30" manufactured by Mitsubishi Chemical Corporation).

SO-C2: spherical silica ("SO-C2" manufactured by Adomatex Co., Ltd.) surface-treated with an amino silane coupling agent (KBM573 manufactured by Shin-Etsu Chemical Co., Ltd.).

EXL-2655: methacrylbutadiene styrene rubber particle ("EXL-2655", manufactured by Dow Chemical Company).

DMAP: 4-dimethylaminopyridine.

Content of inorganic filler: The ratio of inorganic filler to 100 mass% of the nonvolatile component in the resin composition.

Ra: Arithmetic mean roughness of the surface of evaluation substrate a.

[Review]

The resin composition of Example 1 and the resin composition of Comparative Example 1 have the same composition except for the kind of the thermoplastic resin used in combination with the epoxy resin (A) and the active ester compound (B). Among them, in Comparative Example 1 in which the (C) indene polyimide resin is not used as the thermoplastic resin, the minimum melt viscosity is in a good range, but the conductor layer has low peel strength and dielectric loss tangent is large. On the contrary, in Example 1 using the (C) indene polyimide resin as the thermoplastic resin, the minimum melt viscosity is in a good range, the peak strength of the conductor layer is large, and the dielectric loss tangent is effectively low. Therefore, from the results of Example 1 and Comparative Example 1, it was confirmed that the combination of the epoxy resin (A) and the (C) indanepolyimide resin with respect to the active ester compound (B) A high insulation layer can be obtained and a resin composition having a minimum melt viscosity in a suitable range can be realized.

In addition, although the compositions of the resin compositions according to Examples 1 to 5 are different from each other, they are common in that they contain (C) an indene polyimide resin in combination with (A) an epoxy resin and (B) an active ester compound. The resin compositions according to Examples 1 to 5 are superior to the resin compositions having the same compositions as those of Examples 1 to 5 except that (C) the polyimide resin is not included, and the minimum melt viscosity, the peel strength of the conductor layer, Good results can be obtained for tangency. For example, although the dielectric loss tangent of Example 5 is lower than that of Comparative Example 1, excellent results are obtained as compared with the case of using a resin composition having the same composition as in Example 5 except that (C) the polyimide resin (C) It is. Therefore, from the results of Examples 1 to 5, it is possible to obtain a minimum melt viscosity in a suitable range in a resin composition of a wide composition including (A) an epoxy resin, (B) an active ester compound and (C) an indanepolyimide resin It is possible to realize an insulating layer having a low dielectric tangent and a high adhesion to a conductor layer.

Comparative Example 2 is an experimental example of a conventional resin composition which can reduce the dielectric tangent in the range investigated by the present inventors. In Comparative Example 2, although the dielectric loss tangent is made particularly small, the minimum melt viscosity is too small and the peel strength is remarkably deteriorated. Therefore, it is difficult to use the resin composition of Comparative Example 2 as a resin composition for forming an insulating layer. On the contrary, the resin compositions of Examples 1 to 5 are excellent in industrial properties because they are excellent in balance of properties required as a resin composition for forming an insulating layer.

Claims (11)

(A) an epoxy resin, (B) an active ester compound, and (C) a polyimide resin having an indane skeleton. The resin composition according to claim 1, wherein the component (C) has a trimethylindane skeleton. The resin composition according to claim 1, wherein the component (C) has a 1,1,3-trimethylindane skeleton. The resin composition according to claim 1, wherein the amount of the component (C) is 1% by mass to 20% by mass based on 100% by mass of the resin component in the resin composition. The resin composition according to claim 1, which comprises (D) an inorganic filler. The resin composition according to claim 5, wherein the amount of the component (D) is 50% by mass or more based on 100% by mass of the nonvolatile component in the resin composition. The resin composition according to claim 1, which is a resin composition for forming an insulating layer of a printed wiring board. An adhesive film comprising a support and a resin composition layer comprising the resin composition according to any one of claims 1 to 7 formed on the support. A prepreg having the sheet-like fibrous base material and the resin composition according to any one of claims 1 to 7 impregnated into the sheet-like fibrous base material. A printed wiring board having an insulating layer containing a cured product of the resin composition according to any one of claims 1 to 7. A semiconductor device comprising the printed wiring board according to claim 10.