KR20170113230A - Resin composition - Google Patents

Abstract

[PROBLEMS] To provide a resin composition having good compatibility and excellent melt viscosity, which forms an insulating layer having a low dielectric tangent and an excellent plating adhesion and base adhesion.
A resin composition comprising (A) an epoxy resin, (B) a curing agent, (C) a vinyl group-containing resin, and (D) an indencumarone resin, wherein the content of the component (D) By mass to 5% by mass to 20% by mass.

Description

Resin composition {RESIN COMPOSITION}

The present invention relates to a resin composition. The present invention also relates to an adhesive film, a printed wiring board, and a semiconductor device.

As a manufacturing technique of a printed wiring board, there is known a manufacturing method by a build-up method in which an insulating layer and a conductor layer are alternately laminated on an inner layer substrate. The insulating layer is generally formed by curing the resin composition. For example, Patent Document 1 discloses a resin composition containing a specific epoxy resin and a curing agent and having low dielectric constant and high heat resistance.

Patent Document 1: JP-A-2015-57465

2. Description of the Related Art In recent years, miniaturization and high performance of electronic devices have progressed, and in a multilayer printed wiring board, buildup layers have been layered, and miniaturization and densification of wiring have been demanded. In order to achieve further miniaturization and high densification of wiring, a resin composition having good compatibility and good melt viscosity, which forms an insulating layer with low dielectric tangent and excellent in plating adhesion and ground adhesion, is required. The current situation is not.

Disclosure of the Invention An object of the present invention is to provide a resin composition having good compatibility and good melt viscosity, which forms an insulating layer having a low dielectric tangent and an excellent plating adhesion and ground adhesion.

The present inventors have intensively studied the above problems and found that the above problems can be solved by using a combination of a resin having a vinyl group and a predetermined amount of indenkumarone resin, and have accomplished the present invention.

That is, the present invention includes the following contents.

[1] A resin composition comprising (A) an epoxy resin, (B) a curing agent, (C) a resin having a vinyl group, and (D) an indencumarone resin,

And the content of the component (D) is 5% by mass to 20% by mass when the content of the resin component is 100% by mass.

[2] The resin composition according to [1], wherein at least one of the components (C) has an aromatic ring.

[3] The resin composition according to [1] or [2], wherein the content of the component (C) is 5% by mass to 20% by mass based on 100% by mass of the resin component.

[4] The resin composition according to any one of [1] to [3], wherein at least one kind of the component (B) is an active ester type curing agent.

[5] The resin composition according to any one of [1] to [4], further comprising (E) an inorganic filler.

[6] The resin composition according to [5], wherein the content of the component (E) is 50% by mass or more when the nonvolatile component of the resin composition is 100% by mass.

[7] The resin composition according to any one of [1] to [6], wherein the component (D) is a copolymer of indene, coumarone, and styrene.

[8] The resin composition according to any one of [1] to [7], which is used for forming an insulating layer of a printed wiring board.

[9] An adhesive film having a support and a resin composition layer comprising the resin composition according to any one of [1] to [8] formed on the support.

[10] A printed wiring board comprising an insulating layer formed by a cured product of the resin composition according to any one of [1] to [8].

[11] A semiconductor device comprising the printed wiring board according to [10].

According to the present invention, it is possible to provide a resin composition having good compatibility and good melt viscosity, which forms an insulating layer having a low dielectric tangent and an excellent plating adhesion and ground adhesion.

Hereinafter, the resin composition, the adhesive film, the printed wiring board, and the semiconductor device of the present invention will be described in detail.

[Resin composition]

The resin composition of the present invention comprises (A) an epoxy resin, (B) a curing agent, (C) a vinyl group-containing resin, and (D) an indencumarone resin, wherein the content of the component (D) And is from 5% by mass to 20% by mass. On the other hand, in the present invention, the "resin component" refers to a component other than the inorganic filler (E) to be described later, which is a nonvolatile component constituting the resin composition. Hereinafter, each component contained in the resin composition of the present invention will be described in detail.

≪ (A) Epoxy resin >

The resin composition of the present invention contains (A) an epoxy resin. Examples of the epoxy resin include epoxy resins such as biquicylenol type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AF type epoxy resin, dicyclopentadiene type epoxy resin, Butyl-catechol type epoxy resin, naphthalene type epoxy resin, naphthol type epoxy resin, anthracene type epoxy resin, glycidylamine type epoxy resin, glycidyl type epoxy resin, glycidyl type epoxy resin, Cresol ester type epoxy resin, cresol novolak type epoxy resin, biphenyl type epoxy resin, linear aliphatic epoxy resin, epoxy resin having butadiene structure, alicyclic epoxy resin, heterocyclic epoxy resin, spirocyclic epoxy resin, cyclohexane Dimethanol type epoxy resin, naphthylene ether type epoxy resin, trimethylol type epoxy resin , And the like tetraphenyl ethane epoxy resin. The epoxy resins may be used alone or in combination of two or more. The component (A) is preferably an aromatic skeleton-containing epoxy resin from the viewpoint of lowering the average linear heat expansion coefficient, and is preferably a bisphenol A epoxy resin, a bisphenol F epoxy resin, a naphthalene epoxy resin, A pentadiene type epoxy resin, and more preferably a biphenyl type epoxy resin. An aromatic skeleton is a chemical structure generally defined as aromatic, and includes polycyclic aromatic and aromatic heterocyclic rings.

The epoxy resin preferably contains an epoxy resin having two or more epoxy groups in one molecule. When the nonvolatile component of the epoxy resin is 100% by mass, it is preferable that at least 50% by mass or more of the epoxy resin is an epoxy resin having two or more epoxy groups in one molecule. Among them, it is preferable to contain an epoxy resin having three or more epoxy groups per molecule and a solid phase at 20 캜 (hereinafter referred to as " solid epoxy resin "). The epoxy resin may contain only solid epoxy resin, and may contain liquid epoxy resin (hereinafter referred to as " liquid epoxy resin ") and solid epoxy resin at two or more epoxy groups per molecule at a temperature of 20 占 폚. By using a liquid epoxy resin and a solid epoxy resin as an epoxy resin in combination, a resin composition having excellent flexibility can be obtained. Further, the fracture strength of the cured product of the resin composition is also improved.

Examples of the liquid epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, phenol novolak type epoxy resin , An alicyclic epoxy resin having an ester skeleton, a cyclohexanedimethanol type epoxy resin, a glycidylamine type epoxy resin, and an epoxy resin having a butadiene structure are preferable, and a glycidylamine type epoxy resin, a bisphenol A type epoxy resin , Bisphenol F type epoxy resin, bisphenol AF type epoxy resin and naphthalene type epoxy resin are more preferable. Specific examples of the liquid epoxy resin include "HP4032", "HP4032D", "HP4032SS" (naphthalene type epoxy resin), "828US", "jER828EL" and "825" manufactured by Mitsubishi Kagaku , "EPICOTE 828EL" (bisphenol A type epoxy resin), "jER807", "1750" (bisphenol F type epoxy resin), "jER152" (phenol novolak type epoxy resin), "630" ZX1059 " (a mixture of a bisphenol A type epoxy resin and a bisphenol F type epoxy resin) manufactured by Shinnitetsu Sumikin Kagaku Co., Ltd., " EX- 720 "(glycidyl ester type epoxy resin)," Celloxide 2021P "(alicyclic epoxy resin having an ester skeleton)," PB-3600 "(epoxy resin having a butadiene structure) ZX1658 ", " ZX1658GS " (liquid 1,4-glycidyl cyclohexane) manufactured by Tetsu Kagaku Co., Ltd., 630LSD " (glycidylamine type epoxy resin) manufactured by Tsubishi Chemical Co., Ltd., and the like. These may be used alone, or two or more kinds may be used in combination.

Examples of the solid epoxy resin include naphthalene type tetrafunctional epoxy resins, cresol novolak type epoxy resins, dicyclopentadiene type epoxy resins, trisphenol type epoxy resins, naphthol type epoxy resins, biphenyl type epoxy resins, naphthylene ether type epoxy resins , An anthracene type epoxy resin, a bisphenol A type epoxy resin and a tetraphenylethane type epoxy resin are preferable, and a naphthalene type tetrafunctional epoxy resin, a naphthol type epoxy resin and a biphenyl type epoxy resin are more preferable. Specific examples of the solid epoxy resin include HP4032H (naphthalene type epoxy resin), HP-4700, HP-4710 (naphthalene type tetrafunctional epoxy resin), N-690 HP-7200H "," HP-7200H "," EXA (epoxy resin) ", EXA-7311-G4 "," EXA-7311-G4S "," HP6000 "(naphthylene ether type epoxy resin)," EPPN Quot; NC3000H ", " NC3000L ", " NC3100 " (biphenyl type epoxy resin), Shinnetsu Tetsu Sumikin (Naphthalene type epoxy resin), "ESN485" (naphthol novolak type epoxy resin), "YX4000H", "YX4000", and "YL6121" manufactured by Mitsubishi Kagaku Co., Phenyl PG-100 "," CG-500 ", and" Mitsubishi Kagaku "manufactured by Osaka Gas Chemical Co., Ltd. (trade name: YX4000HK) (bixylenol type epoxy resin), YX8800 "JER1010" (solid bisphenol A type epoxy resin), "jER1031S" (tetra (meth) acrylate) manufactured by Mitsubishi Kagaku Co., Ltd., "YL7760" (bisphenol AF type epoxy resin) Phenyl ethane type epoxy resin) and the like. These may be used alone, or two or more kinds may be used in combination.

When a liquid epoxy resin and a solid epoxy resin are used together as the epoxy resin, their ratio (liquid epoxy resin: solid epoxy resin) is preferably in the range of 1: 0.1 to 1:15 in terms of the mass ratio. By setting the ratio between the liquid epoxy resin and the solid epoxy resin within such a range, it is possible to form suitable adhesiveness in the case of i) use in the form of an adhesive film, and ii) sufficient flexibility can be obtained when used in the form of an adhesive film , Handling property is improved, and (iii) a cured product having sufficient breaking strength can be obtained. From the viewpoint of the effects of the above i) to iii), the ratio of the liquid epoxy resin to the solid epoxy resin (liquid epoxy resin: solid epoxy resin) is more preferably in the range of 1: 0.5 to 1:10, : 1 to 1: 8 is more preferable.

The content of the epoxy resin in the resin composition is preferably 5% by mass or more, more preferably 10% by mass or more, more preferably 10% by mass or more, more preferably 10% Or more, more preferably 20 mass% or more. The upper limit of the content of the epoxy resin is not particularly limited as long as the effects of the present invention are exhibited, but is preferably 60 mass% or less, more preferably 50 mass% or less, further preferably 40 mass% or less.

The epoxy equivalent of the epoxy resin is preferably 50 to 5000, more preferably 50 to 3000, still more preferably 80 to 2000, still more preferably 110 to 1000. With this range, the crosslinked density of the cured product becomes sufficient, and an insulating layer having a small surface roughness can be formed. On the other hand, the epoxy equivalent can be measured in accordance with JIS K7236, and is the mass of the resin containing one equivalent of epoxy group.

The weight average molecular weight of the epoxy resin is preferably 100 to 5000, more preferably 250 to 3000, and still more preferably 400 to 1500. Here, the weight average molecular weight of the epoxy resin is a weight average molecular weight in terms of polystyrene measured by a gel permeation chromatography (GPC) method.

<(B) Hardener>

The resin composition of the present invention contains (B) a curing agent. The curing agent is not particularly limited as long as it has a function of curing an epoxy resin, and examples thereof include phenol-based curing agents, naphthol-based curing agents, active ester-based curing agents, benzoxazine- based curing agents, cyanate ester- based curing agents and carbodiimide- And a hardening agent. The curing agent may be used alone or in combination of two or more. The component (B) is preferably at least one selected from the group consisting of a phenol-based curing agent, a naphthol-based curing agent, an active ester-based curing agent, a carbodiimide-based curing agent and a cyanate ester-based curing agent, and is preferably an active ester-based curing agent.

As the phenol-based curing agent and naphthol-based curing agent, a phenol-based curing agent having a novolak structure or a naphthol-based curing agent having a novolak structure is preferable from the viewpoints of heat resistance and water resistance. From the viewpoint of adhesion with the conductor layer, a nitrogen-containing phenol-based curing agent is preferable, and a phenazine-based curing agent containing a triazine skeleton is more preferable. Among them, a phenazine novolac curing agent containing a triazine skeleton is preferable from the viewpoint of highly satisfying heat resistance, water resistance, and adhesion with a conductor layer.

Specific examples of the phenol-based curing agent and naphthol-based curing agent include "MEH-7700", "MEH-7810", "MEH-7851", "MEH-7851H" manufactured by Meiwa Kasei Co., "SN170", "SN180", "SN190", "SN475", "SN485", "SN495" and "SN495" manufactured by Shinnetsu Tetsu Sumikin Co., "TD-2090", "LA-7052", "LA-7054", "LA-1356", "LA-3018-50P", "EXB-9500 &Quot; and the like.

From the viewpoint of obtaining an insulating layer having excellent adhesiveness to a conductor layer, an active ester-based curing agent is preferable. The active ester-based curing agent is not particularly limited, but generally, an ester group having a high reaction activity such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of a heterocyclic hydroxy compound, A compound having two or more is preferably used. It is preferable that the active ester-based curing agent is obtained by a condensation reaction of a carboxylic acid compound and / or a thiocarboxylic acid compound with a hydroxy compound and / or a thiol compound. From the viewpoint of heat resistance improvement, an active ester type curing agent obtained from a carboxylic acid compound and a hydroxy compound is preferable, and an active ester type curing agent obtained from a carboxylic acid compound and a phenol compound and / or a naphthol compound is more preferable. Examples of the carboxylic acid compound include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid and pyromellitic acid. Examples of the phenol compound or naphthol compound include hydroquinone, resorcin, bisphenol A, bisphenol F, bisphenol S, phenolphthalein, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o- Cresol, catechol, alpha -naphthol, beta -naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, Trihydroxybenzophenone, tetrahydroxybenzophenone, fluoroglucine, benzene triol, dicyclopentadiene type diphenol compounds, phenol novolak, and the like. Here, the "dicyclopentadiene type diphenol compound" refers to a diphenol compound obtained by condensing two molecules of phenol in one molecule of dicyclopentadiene.

Specifically, there can be mentioned an active ester compound containing a dicyclopentadiene type diphenol structure, an active ester compound containing a naphthalene structure, an active ester compound containing an acetylated phenol novolac, a benzoyl compound of phenol novolac Active ester compounds are preferable. Of these, active ester compounds containing a naphthalene structure and active ester compounds containing a dicyclopentadiene-type diphenol structure are more preferable. The "dicyclopentadiene-type diphenol structure" refers to a divalent structural unit consisting of phenylene-dicyclopentylene-phenylene.

EXB9451 "," EXB9460 "," EXB9460S "," HPC-8000-65T "," HPC-8000H-65TM ", and the like are available as commercial products of the active ester- EXB9416-70BK "(manufactured by DIC Corporation) as an active ester compound containing a naphthalene structure, an active ester containing an acetylated product of phenol novolak (Manufactured by Mitsubishi Chemical Corporation) as an active ester compound containing benzoylate of phenol novolac, &quot; YLH1026 &quot; (manufactured by Mitsubishi Chemical Corp.) as the compound, DC808 , "YLH1026" (manufactured by Mitsubishi Kagaku Co., Ltd.), "YLH1030" (manufactured by Mitsubishi Kagaku KK) as the active ester curing agent which is a benzoylate of phenol novolak, "DC808" ), &Quot; YLH1048 &quot; (Manufactured by Bishi Kagaku Co., Ltd.).

Specific examples of the benzoxazine type curing agent include "HFB2006M" manufactured by Showa Kobunshi Co., Ltd., "P-d" and "F-a" manufactured by Shikoku Kasei Kogyo Co.,

Examples of the cyanate ester curing agent include bisphenol A dicyanate, polyphenol cyanate, oligo (3-methylene-1,5-phenylene cyanate), 4,4'- Dimethylphenyl cyanate), 4,4'-ethylidenediphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis (4-cyanate) phenylpropane, 1,1- Cyanate phenylmethane), bis (4-cyanate-3,5-dimethylphenyl) methane, 1,3-bis Bifunctional cyanate resins derived from phenol novolacs and cresol novolacs such as bis (4-cyanophenyl) thioether and bis (4-cyanatephenyl) ether, and polyfunctional cyanate resins derived from these cyanate resins And prepolymers. Specific examples of the cyanate ester-based curing agent include "PT30" and "PT60" (both phenol novolak type polyfunctional cyanate ester resins), "BA230", "BA230S75" A prepolymer in which part or all of the nate is triarylated to form a trimer).

Specific examples of the carbodiimide-based curing agent include "V-03" and "V-07" manufactured by Nisshinbo Chemical Co.,

The ratio of the epoxy resin to the curing agent is preferably in the range of 1: 0.1 to 1:10, more preferably in the range of 1: 0.5 to 1: 5, in the ratio of [the total number of epoxy groups of epoxy resin]: [the total number of reactors of the curing agent] More preferably 1: 1 to 1: 3. Here, the reactive group of the curing agent is an active hydroxyl group, an active ester group, and the like, depending on the kind of the curing agent. The total number of epoxy groups in the epoxy resin refers to a value obtained by dividing the solid component mass of each epoxy resin by the epoxy equivalent to the total epoxy resin and the total number of reactors of the curing agent means that the solid mass of each curing agent is equivalent to the reactor Divided by the total amount of the curing agent. By setting the ratio of the epoxy resin and the curing agent to this range, the heat resistance of the cured product of the resin composition is further improved.

The content of the curing agent in the resin composition is not particularly limited, but it is preferably 60 mass% or less, more preferably 55 mass% or less, further preferably 50 mass% or less, when the resin component is 100 mass%. The lower limit is not particularly limited, but is preferably 30 mass% or more, more preferably 35 mass% or more, and further preferably 40 mass% or more.

&Lt; (C) Resin Having Vinyl Group >

The resin composition of the present invention contains (C) a resin having a vinyl group. By containing the component (C) and the component (D) described later in combination, it is possible to obtain a resin composition having good compatibility and good melt viscosity, which forms an insulating layer having low dielectric tangent and excellent in plating adhesion and ground adhesion. The component (C) may be used alone or in combination of two or more.

The component (C) is not particularly limited as long as it has a vinyl group, but it is preferably one having an aromatic ring. Among them, a resin represented by the following formula (1) is preferable from the viewpoint of storage stability.

(Wherein R ¹ to R ⁶ each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and A represents a group represented by the following formula (2) or (3)

(E in the above formula (2) represents E-1, E-2 or E-3 shown below)

(Wherein R ⁷ to R ¹⁴ each independently represent a hydrogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group, and E represents E-1, E-2 or E-3, b represents an integer of 0 to 100, at least one of which is not 0)

[E-1]

[Formula E-2]

[Formula E-3]

(In the general formula E-1 to E-3, R ¹⁵ to R ³⁴ each independently represent a hydrogen atom, a carbon atom number of 6 alkyl group described below, or a phenyl group. G is straight chain, branched in the carbon atom number of 20 or less A gaseous or cyclic divalent hydrocarbon group)

In the general formula (1), R ¹ to R ⁶ each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, preferably a hydrogen atom. Examples of the alkyl group having 1 to 4 carbon atoms include a methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, s-butyl group and t-butyl group.

The formula R ⁷ to R ^14, and the formula E-1 to E-3 of the R ¹⁵ to R ³⁴ in the 3 each independently represents an alkyl group or a phenyl group of a hydrogen atom, the number of carbon atoms not more than 6. Examples of the alkyl group having 6 or less carbon atoms include methyl, ethyl, n-propyl, isopropyl, n-butyl, s-butyl, t-butyl, pentyl and hexyl. As R ⁷ to R ¹⁴ , a hydrogen atom and a methyl group are preferable.

a and b each represent an integer of 0 to 100, at least one of which is not 0. a and b are preferably an integer of 0 to 50, more preferably an integer of 0 to 10, provided that at least one of them is not 0.

G represents a linear, branched or cyclic divalent hydrocarbon group having 20 or less carbon atoms. Examples of the divalent hydrocarbon group include an alkylene group having 1 to 20 carbon atoms, an alkenylene group having 2 to 20 carbon atoms, and an alkynylene group having 2 to 20 carbon atoms. Examples of the alkylene group having 1 to 20 carbon atoms include a methylene group, an ethylene group, a propylene group, and a butylene group. Examples of the alkenylene group having 2 to 20 carbon atoms include a vinylene group, a propenylene group and a butenylene group. Examples of the alkynylene group having 2 to 20 carbon atoms include an ethynylene group, a propynylene group, and a butynylene group.

The vinyl group in the resin having a vinyl group may have a substituent. The alkyl group, the phenyl group, and the divalent hydrocarbon group may have a substituent.

The substituent is not particularly limited, for example, a halogen atom, -OH, -OC _{1 -6} alkyl, -N (C _{1 -6} alkyl) _2, C _{1 -6} alkyl, C _{6 -10} aryl groups, -NH _2, -CN, can be given a -C (O) OC _{1 -6} alkyl, -COOH, -C (O) H , -NO 2 or the like.

Here, the term "C _{p -q} " (p and q are positive integers and p <q is satisfied) indicates that the number of carbon atoms of the organic group described immediately after this term is p to q. For example, the expression &quot; C _{1 -6} alkyl group &quot; represents an alkyl group having 1 to 6 carbon atoms.

The substituent described above may further have a substituent (hereinafter sometimes referred to as &quot; secondary substituent &quot;). As the secondary substituent, the same substituents as those described above may be used, unless otherwise specified.

Specific examples of the component (C) are illustrated below, but the present invention is not limited thereto.

(Wherein R ¹ to R ⁶ , E, a and b are the same as those of the formula (1) or (3), and the preferable range is also the same)

(Number average molecular weight: 2200) and OPE-2St 1200 (number average molecular weight: 2200) manufactured by Mitsubishi Gas Kagaku Co., Ltd. are used as the component (C) (Styrene-modified polyphenylene ether resin), "YL7776 (number average molecular weight: 331)" manufactured by Mitsubishi Chemical Corporation, and (beacilene diallyl ether resin).

The number average molecular weight of the component (C) is preferably in the range of 100 to 10000, more preferably in the range of 200 to 3000, from the viewpoint of preventing the volatilization during drying of the resin varnish and preventing the melt viscosity of the resin composition from being excessively increased More preferable. The number average molecular weight in the present invention is measured by a gel permeation chromatography (GPC) method (in terms of polystyrene). Specifically, the number average molecular weight by the GPC method was measured by using LC-9A / RID-6A manufactured by Shimadzu Corporation as a measuring device and Shodex K-800P / K-804L (trade name, manufactured by Showa Denko K.K. / K-804L as a mobile phase, chloroform at a column temperature of 40 占 폚, and using a calibration curve of standard polystyrene.

The details of the component (C) can be taken into consideration in paragraphs 0010 to 0022 of Japanese Laid-Open Patent Publication No. 2014-34580, the contents of which are incorporated herein.

The content of the component (C) is preferably 30% by mass or less, more preferably 25% by mass or less, more preferably 25% by mass or less, more preferably 100% by mass or less, Is 20 mass% or less, or 15 mass% or less. The lower limit of the content of the component (C) is preferably 1% by mass or more, more preferably 1% by mass or more when the resin component is 100% by mass from the viewpoint of achieving the desired effect in combination with the component Is not less than 3% by mass, and more preferably not less than 5% by mass.

&Lt; (D) Indenkumarone resin >

The resin composition of the present invention contains a predetermined amount of the indencumarone resin (D). By including a predetermined amount of the component (D), the compatibility is improved and a resin composition having a good balance of physical properties can be obtained. The coumarone skeleton contained in the component (D) has good compatibility with epoxy resins or hardeners having high polarity, and the indane skeleton and the coumarone skeleton have good compatibility with a vinyl resin having a low polarity. Therefore, it is considered that the compatibility of the entire resin composition is improved by acting as a compatibilizer between a resin having a high polarity and a resin having a low polarity.

Examples of the component (D) include copolymers of indene and coumarone, copolymers of indene, coumarone and styrene, and the like.

The content of the coumarone component in the indenkumarone resin is preferably 5 mol% or more, more preferably 8 mol% or more, and still more preferably 10 mol% or more. The upper limit is preferably 40 mol% or less, more preferably 35 mol% or less, still more preferably 30 mol% or less.

The content of the indene component in the indencumarone resin is preferably 30 mol% or more, more preferably 35 mol% or more, and further preferably 40 mol% or more. The upper limit is preferably 80 mol% or less, more preferably 75 mol% or less, still more preferably 70 mol% or less.

When the indenkumarone resin is a copolymer of indene, coumarone and styrene, the styrene component content is preferably 20 mol% or more, more preferably 25 mol% or more, and still more preferably 30 mol% or more. The upper limit is preferably 70 mol% or less, more preferably 65 mol% or less, and still more preferably 60 mol% or less.

Specific examples of the indenkumarone resin include "H-100", "V-120S", and "V-120" manufactured by Nitto Kagaku Co.,

The content of the component (D) is 5% by mass or more, preferably 8% by mass or more, more preferably 10% by mass or more, more preferably 10% by mass or more, %. The upper limit of the content of the component (D) is 20% by mass or less, preferably 18% by mass or less, more preferably 20% by mass or less, from the viewpoint of obtaining a resin composition having a good melt viscosity, Is not more than 16 mass% or not more than 15 mass%.

<(E) Inorganic filler>

The resin composition of the present invention may further contain (E) an inorganic filler. The material of the inorganic filler is not particularly limited, and examples thereof include silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, Magnesium hydroxide, aluminum hydroxide, magnesium hydroxide, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, , Barium titanate zirconate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate. Of these, silica is particularly suitable. As the silica, spherical silica is preferable. The inorganic fillers may be used singly or in combination of two or more kinds.

The average particle diameter of the inorganic filler is preferably 5 占 퐉 or less, more preferably 2.5 占 퐉 or less, further preferably 2 占 퐉 or less, from the viewpoint of improving the circuit filling property and obtaining an insulating layer with a low surface roughness Preferably 1.5 m or less. The lower limit of the average particle diameter is not particularly limited, but is preferably 0.01 占 퐉 or more, more preferably 0.05 占 퐉 or more, further preferably 0.1 占 퐉 or more, 0.5 占 퐉 or more, or 1 占 퐉 or more. Examples of commercially available inorganic fillers having such an average particle diameter include "SP60-05", "SP507-05" manufactured by Shinnitetsu Sumikin Materials Co., Ltd., "YC100C" manufactured by Adomex Co., YA050C "," YA050C-MJE "," YA010C "," UFP-30 "manufactured by Denka Corporation," Silphil NSS-3N "," Silphil NSS-4N " , "SC2500SQ", "SO-C4", "SO-C2", and "SO-C1" manufactured by Adomex Corporation.

The average particle diameter of the inorganic filler can be measured by a laser diffraction / scattering method based on the Mie scattering theory. Specifically, the particle size distribution of the inorganic filler can be measured with a laser diffraction scattering type particle size distribution measuring apparatus, and the median diameter is determined as the average particle diameter. The measurement sample can be preferably those in which an inorganic filler is dispersed in water by ultrasonic waves. As the laser diffraction scattering type particle size distribution measuring apparatus, "LA-500" manufactured by Horiba Seisakusho Co., Ltd. and the like can be used.

From the viewpoint of improving the moisture resistance and dispersibility, the inorganic filler is preferably selected from the group consisting of an amino silane coupling agent, an epoxy silane coupling agent, a mercaptosilane coupling agent, an alkoxysilane compound, an organosilazane compound and a titanate coupling agent It is preferable that the surface treatment agent is treated with at least two kinds of surface treatment agents. Examples of commercially available products of the surface treatment agent include KBM403 (3-glycidoxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., KBM803 (3-mercapto- KBE903 "(3-aminopropyltriethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd.," KBM573 "(manufactured by Shin-Etsu Chemical Co., SZ-31 (hexamethyldisilazane) manufactured by Shin-Etsu Chemical Co., Ltd., KBM-103 (phenyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., KBM-4803 &quot; (long-chain epoxy type silane coupling agent) manufactured by Kagyo KK.

The degree of the surface treatment by the surface treatment agent can be evaluated by the amount of carbon per unit surface area of the inorganic filler. The carbon content per unit surface area of the inorganic filler is preferably at least 0.02 mg / m 2, more preferably at least 0.1 mg / m 2, and most preferably at least 0.2 mg / m 2 from the viewpoint of improving the dispersibility of the inorganic filler. On the other hand, it is preferably 1 mg / m 2 or less, more preferably 0.8 mg / m 2 or less, still more preferably 0.5 mg / m 2 or less from the viewpoint of preventing the melt viscosity of the resin varnish and the increase of the melt viscosity in the sheet form.

The amount of carbon per unit surface area of the inorganic filler can be measured after the surface-treated inorganic filler is washed with a solvent (for example, methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to the inorganic filler surface-treated with the surface treatment agent, and ultrasonically cleaned at 25 占 폚 for 5 minutes. After the supernatant is removed and the solid content is dried, the amount of carbon per unit surface area of the inorganic filler can be measured using a carbon analyzer. As the carbon analyzer, "EMIA-320V" manufactured by Horiba Seisakusho Co., Ltd. and the like can be used.

The content of the inorganic filler in the resin composition is preferably not less than 50% by mass, more preferably not less than 55% by mass, more preferably not less than 55% by mass, Or more, more preferably 60 mass% or more, or 65 mass% or more. The upper limit is preferably 95 mass% or less, more preferably 90 mass% or less, further preferably 85 mass% or less, or 80 mass% or less, from the viewpoint of the mechanical strength of the insulating layer,

<(F) Curing accelerator>

The resin composition of the present invention may contain (F) a curing accelerator. Examples of the curing accelerator include phosphorus hardening accelerator, amine hardening accelerator, imidazole hardening accelerator, guanidine hardening accelerator, metal hardening accelerator, and organic peroxide hardening accelerator. Examples of the hardening accelerator include phosphorus hardening accelerator, Accelerators, imidazole-based curing accelerators and metal-based curing accelerators are preferable, and amine-based curing accelerators, imidazole-based curing accelerators and metal-based curing accelerators are more preferable. The curing accelerator may be used singly or in combination of two or more.

Examples of phosphorus hardening accelerators include triphenylphosphine, phosphonium borate compounds, tetraphenylphosphonium tetraphenylborate, n-butylphosphonium tetraphenylborate, tetrabutylphosphonium decanoate, (4-methylphenyl) triphenyl Phosphonium thiocyanate, tetraphenylphosphonium thiocyanate, butyltriphenylphosphonium thiocyanate, and the like, and triphenylphosphine and tetrabutylphosphonium decanoate are preferable.

Examples of the amine-based curing accelerator include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6-tris (dimethylaminomethyl) -Diazabicyclo (5,4,0) undecene, and 4-dimethylaminopyridine and 1,8-diazabicyclo (5,4,0) -undecene are preferred.

Examples of the imidazole-based curing accelerator include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, Imidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl- Benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl- 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium Trimellitate, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')] -ethyl-s-triazine, 2,4- diamino-6- [ Imidazolyl- (1 ')] - ethyl-s-triazine, 2,4-diamino-6- [2'-ethyl-4'-methylimidazolyl- Triazine, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')] - ethyl-s-triazine isocyanate 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2 2-methylimidazolium chloride, 2-methylimidazoline, 2-phenylimidazole, 2-methylimidazolium chloride, Imidazole compounds such as phenol and zolene, and adducts of imidazole compounds and epoxy resins, and 2-ethyl-4-methylimidazole and 1-benzyl-2-phenylimidazole are preferable.

As the imidazole-based curing accelerator, a commercially available product may be used, and for example, "P200-H50" manufactured by Mitsubishi Chemical Corporation.

Examples of the guanidine curing accelerator include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1- (o-tolyl) guanidine, dimethylguanidine, , Trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo [4.4.0] deca-5-ene, 7-methyl-1,5,7-triazabicyclo [ 1-n-butylbiguanide, 1-n-octadecylbiguanide, 1,1-dimethylbiguanide, 1, 1-cyclohexylbiguanide, 1-allylbiguanide, 1-phenylbiguanide, 1- (o-tolyl) biguanide, and the like, and dicyandiamide, 1,5,7-triazabicyclo [4.4.0] deca-5-ene is preferred.

Examples of the metal-based curing accelerator include organic metal complexes or organic metal salts of metals such as cobalt, copper, zinc, iron, nickel, manganese and tin. Specific examples of the organometallic complexes include organic cobalt complexes such as cobalt (II) acetylacetonate and cobalt (III) acetylacetonate, organic copper complexes such as copper (II) acetylacetonate, and zinc (II) acetylacetonate An organic iron complex such as an organic zinc complex and iron (III) acetylacetonate, an organic nickel complex such as nickel (II) acetylacetonate, and an organic manganese complex such as manganese (II) acetylacetonate. Examples of the organic metal salt include zinc octylate, tin octylate, zinc naphthenate, cobalt naphthenate, tin stearate and zinc stearate.

Examples of the organic peroxide-based curing accelerator include dicumylperoxide, cyclohexanoneperoxide, t-butylperoxybenzoate, methylethylketoneperoxide, dicumylperoxide, t-butylcumylperoxide, T-butyl peroxide, diisopropylbenzene hydroperoxide, cumene hydroperoxide, t-butyl hydroperoxide, and the like. As the organic peroxide curing accelerator, a commercially available product may be used, and for example, &quot; Percumyl D &quot;

The content of the curing accelerator in the resin composition is not particularly limited, but it is preferably 0.01 mass% to 3 mass% when the resin component is 100 mass%.

&Lt; (G) Thermoplastic resin >

The resin composition of the present invention may contain (G) a thermoplastic resin. Examples of the thermoplastic resin include thermoplastic resin such as phenoxy resin, polyvinyl acetal resin, polyolefin resin, polybutadiene resin, polyimide resin, polyamideimide resin, polyetherimide resin, polysulfone resin, polyether sulfone resin, polycarbonate resin , A polyether ether ketone resin, and a polyester resin, and a phenoxy resin is preferable. The thermoplastic resins may be used alone or in combination of two or more.

The weight average molecular weight of the thermoplastic resin in terms of polystyrene is preferably in the range of 8,000 to 70,000, more preferably in the range of 10,000 to 60,000, and still more preferably in the range of 20,000 to 60,000. The weight average molecular weight of the thermoplastic resin in terms of polystyrene is measured by gel permeation chromatography (GPC). Specifically, the weight average molecular weight of the thermoplastic resin in terms of polystyrene was measured using LC-9A / RID-6A manufactured by Shimadzu Corporation as a measuring device and Shodex K-800P / K (manufactured by Showa Denko K.K. -804L / K-804L as a mobile phase, chloroform or the like as a mobile phase, measuring the column temperature at 40 占 폚, and using a calibration curve of standard polystyrene.

Examples of the phenoxy resin include bisphenol A skeleton, bisphenol F skeleton, bisphenol S skeleton, bisphenol acetophenone skeleton, novolac skeleton, biphenyl skeleton, fluorene skeleton, dicyclopentadiene skeleton, norbornene skeleton, , An anthracene skeleton, an adamantane skeleton, a terpene skeleton, and a trimethyl cyclohexane skeleton. The terminal of the phenoxy resin may be any functional group such as a phenolic hydroxyl group or an epoxy group. The phenoxy resins may be used alone or in combination of two or more. Specific examples of the phenoxy resin include "1256" and "4250" (both phenol resins containing a bisphenol A skeleton), "YX8100" (phenoxy resin containing a bisphenol S skeleton), and "YX6954" (Phenoxy resin containing a bisphenol acetophenone skeleton). In addition, "FX280" and "FX293" manufactured by Shin Nitetsu Sumikin Kagaku Co., Ltd., "YX6954BH30" and "YX6954BH30" manufactured by Mitsubishi Kagaku Co., YL7591BH30 "," YL7769BH30 "," YL6794 "," YL7213 "," YL7290 "," YL7891BH30 ", and" YL7482 ".

Examples of the polyvinyl acetal resin include a polyvinyl formal resin and a polyvinyl butyral resin, and a polyvinyl butyral resin is preferable. Specific examples of the polyvinyl acetal resin include, but are not limited to, "Phone Butyral 4000-2", "Phone Butyral 5000-A", "Phone Butyral 6000-C" (For example, BX-5Z), KS series (for example, KS-1), BL series, BM (for example, Series, and the like.

Specific examples of the polyimide resin include "Rika coat SN20" and "Rika coat PN20" manufactured by Shin-Nippon Rikagaku Co., Ltd. Specific examples of the polyimide resin include a linear polyimide (polyimide described in JP-A 2006-37083) obtained by reacting a bifunctional hydroxyl-terminated polybutadiene, a diisocyanate compound and a tetrabasic acid anhydride, Modified polyimides such as polysiloxane skeleton-containing polyimide (Japanese Patent Application Laid-Open No. 2002-12667 and Japanese Patent Application Laid-Open No. 2000-319386, etc.).

Specific examples of the polyamide-imide resin include "Bioromax HR11NN" and "Bioromax HR16NN" manufactured by Toyoboseki KK. Specific examples of the polyamide-imide resin include modified polyamideimides such as "KS9100" and "KS9300" (polysiloxane skeleton-containing polyamideimide) manufactured by Hitachi Chemical Co., Ltd.

Specific examples of the polyethersulfone resin include "PES 5003P" manufactured by Tsumito Tomokagaku Co., Ltd. and the like.

Specific examples of the polysulfone resin include polysulfone &quot; P1700 &quot; and &quot; P3500 &quot; manufactured by Solvay Advanced Polymers Co.,

Among them, a phenoxy resin and a polyvinyl acetal resin are preferable as the thermoplastic resin. Accordingly, in a preferred embodiment, the thermoplastic resin includes at least one selected from the group consisting of a phenoxy resin and a polyvinyl acetal resin.

When the resin composition of the present invention contains a thermoplastic resin, the content of the thermoplastic resin is preferably 0.5% by mass to 15% by mass, more preferably 0.6% by mass to 12% by mass %, More preferably 0.7% by mass to 10% by mass.

<(H) Flame retardant>

The resin composition of the present invention may contain flame retardant (H). Examples of the flame retardant include an organic phosphorus flame retardant, an organic nitrogen-containing phosphorus compound, a nitrogen compound, a silicon-based flame retardant, a metal hydroxide, and the like. The flame retardant may be used alone, or two or more thereof may be used in combination.

As the flame retardant, a commercially available product may be used, for example, "HCA-HQ" manufactured by Sanko Co., Ltd., "PX-200" manufactured by Daihatsu Kagakukogyo Co., Ltd., and the like.

When the resin composition of the present invention contains a flame retardant, the content of the flame retardant is not particularly limited. When the resin component is 100 mass%, preferably 0.5 mass% to 20 mass%, more preferably 0.5 mass% 15 mass%, and more preferably 0.5 mass% to 10 mass%.

&Lt; (I) Organic filler >

The resin composition of the present invention may contain (I) an organic filler. As the organic filler, any organic filler that can be used in forming the insulating layer of the printed wiring board may be used, and examples thereof include rubber particles, polyamide fine particles, and silicon particles.

As the rubber particles, a commercially available product may be used, for example, "EXL2655" manufactured by Dow Chemical Co., Ltd., "AC3816N" manufactured by AIKA CO., LTD., And the like.

When the resin composition of the present invention contains an organic filler, the content of the organic filler is preferably 0.1% by mass to 20% by mass, more preferably 0.2% by mass to 10% by mass, based on 100% %, More preferably 0.3 mass% to 5 mass%, or 0.5 mass% to 3 mass%.

<(J) Other additives>

The resin composition of the present invention may further contain other additives as required. Examples of such other additives include organic metal compounds such as organic copper compounds, organic zinc compounds and organic cobalt compounds, and thickeners, defoaming agents, A leveling agent, an adhesion-imparting agent, and a resin additive such as a coloring agent.

INDUSTRIAL APPLICABILITY The resin composition of the present invention can form an insulating layer having low dielectric tangent and excellent in plating adhesion and ground adhesion, and has good compatibility and good melt viscosity. Therefore, the resin composition of the present invention can be suitably used as a resin composition (resin composition for an insulating layer of a printed wiring board) for forming an insulating layer of a printed wiring board, and can be used as a resin composition for forming an interlayer insulating layer of a printed wiring board (For example, a resin composition for an interlaminar insulating layer). Further, since the resin composition of the present invention forms an insulating layer with a good component embedding property, it can be suitably used even when the printed wiring board is a component built-in circuit board.

[Adhesive film]

The adhesive film of the present invention has a support and a resin composition layer formed on the support and comprising the resin composition of the present invention.

The thickness of the resin composition layer is preferably 900 占 퐉 or less, more preferably 800 占 퐉 or less, further preferably 700 占 퐉 or less, and even more preferably 600 占 퐉 or less. Particularly, in the present invention, the plating penetration depth can be suppressed to a small value, and therefore, it is preferably 30 탆 or less, more preferably 20 탆 or less, and further preferably 10 탆 or less. The lower limit of the thickness of the resin composition layer is not particularly limited, but may be usually 1 占 퐉 or more, 1.5 占 퐉 or more, 2 占 퐉 or more, or the like.

As the support, for example, a film made of a plastic material, a metal foil and a release paper can be mentioned, and a film or a metal foil made of a plastic material is preferable.

When a film made of a plastic material is used as the support, examples of the plastic material include polyethylene terephthalate (hereinafter may be abbreviated as "PET"), polyethylene naphthalate (hereinafter sometimes abbreviated as "PEN" (TAC), polyether sulfide (PES), polyether sulfide (PES), polyether sulfone (PES), polyether sulfone Polyether ketone, polyimide, and the like. Among them, polyethylene terephthalate and polyethylene naphthalate are preferable, and inexpensive polyethylene terephthalate is particularly preferable.

In the case of using a metal foil as a support, examples of the metal foil include copper foil and aluminum foil, and copper foil is preferable. As the copper foil, a foil made of a single metal of copper may be used, or a foil made of an alloy of copper and another metal (for example, tin, chromium, silver, magnesium, nickel, zirconium, silicon, May be used.

The support may be subjected to a matte treatment, a corona treatment, and an antistatic treatment on the surface to be bonded to the resin composition layer.

As the support, a support having a release layer having a release layer on the surface to be bonded to the resin composition layer may be used. Examples of the release agent used for the release layer of the release layer-adherend support include at least one release agent selected from the group consisting of an alkyd resin, a polyolefin resin, a urethane resin, and a silicone resin. For example, "SK-1", "AL-5", and "L-5" manufactured by Lintec Corporation, which is a PET film having a releasing layer mainly composed of an alkyd resin- AL-7 "manufactured by Toray Industries, Inc. and" Lumirror T6AM "manufactured by Toray Industries, Inc.

The thickness of the support is not particularly limited, but is preferably in the range of 5 탆 to 75 탆, more preferably in the range of 10 탆 to 60 탆. When the release layer-adhered support is used, it is preferable that the thickness of the entirety of the release layer-adhered support is in the above range.

The adhesive film can be produced, for example, by preparing a resin varnish obtained by dissolving a resin composition in an organic solvent, coating the resin varnish on a support using a die coater or the like, and drying the resin varnish to form a resin composition layer .

Examples of the organic solvent include ketones such as acetone, methyl ethyl ketone (MEK) and cyclohexanone, acetic acid esters such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate and carbitol acetate, Carbitol such as cellosolve and butyl carbitol, aromatic hydrocarbons such as toluene and xylene, and amide solvents such as dimethylformamide, dimethylacetamide (DMAc) and N-methylpyrrolidone. The organic solvents may be used alone or in combination of two or more.

The drying may be carried out by a known method such as heating, hot air blowing, or the like. The drying conditions are not particularly limited, but the drying is carried out so that the content of the organic solvent in the resin composition layer is 10 mass% or less, preferably 5 mass% or less. For example, when a resin varnish containing 30% by mass to 60% by mass of an organic solvent is used, the resin varnish is dried at 50 ° C to 150 ° C for 3 minutes to 10 minutes, A resin composition layer can be formed.

In the adhesive film, a protective film conforming to the support may be further laminated on the surface of the resin composition layer not bonded to the support (that is, the surface opposite to the support). The thickness of the protective film is not particularly limited, but is, for example, 1 m to 40 m. By laminating a protective film, it is possible to prevent adhesion and scratching of dust or the like to the surface of the resin composition layer. The adhesive film can be rolled and stored. When the adhesive film has a protective film, it can be used by peeling off the protective film.

The minimum melt viscosity of the resin composition layer (or the resin composition) in the adhesive film is preferably 1000 poise or more, more preferably 1500 poise or more, and more preferably 2000 poise or more in view of maintaining the thickness stably even if the resin composition layer is thin desirable. The upper limit of the lowest melt viscosity is preferably 12000 poise or less, more preferably 10000 poise or less, still more preferably 8000 poise or less, and 5000 poise or less, from the viewpoint of obtaining good circuit embedding property.

The lowest melt viscosity of the resin composition layer means the lowest viscosity exhibited by the resin composition layer when the resin of the resin composition layer is melted. Specifically, when the resin composition is melted by heating the resin composition layer at a constant heating rate, the melt viscosity of the resin is lowered along with the temperature rise in the initial stage. Thereafter, when the melt viscosity exceeds a certain level, the melt viscosity increases with the temperature rise. The lowest melt viscosity refers to the melt viscosity of such a minimum point. The minimum melt viscosity of the resin composition layer can be measured by a dynamic viscoelasticity method and can be measured by, for example, a method described in &quot; Measurement of Minimum Melting Viscosity of Resin Composition Layer &quot;

The resin composition layer (or resin composition) in the adhesive film of the present invention exhibits excellent compatibility. That is, the resin composition layer (or the resin composition) in the adhesive film of the present invention does not deposit (coarse grains) of 50 mu m or more. The compatibility can be measured according to the method described in <Evaluation of Compatibility> described later.

The insulating layer formed using the adhesive film (or resin composition) of the present invention exhibits low dielectric loss tangent. The dielectric loss tangent is preferably 0.010 or less, more preferably 0.009 or less, still more preferably 0.008 or less, 0.007 or less, or 0.006 or less, or 0.005 or less, from the viewpoints of prevention of heat generation at high frequencies, reduction of signal delay and reduction of signal noise. The lower limit of the dielectric tangent is preferably as low as possible, but may be usually 0.001 or more. The dielectric tangent can be measured according to the method described in &quot; Evaluation of dielectric tangent tangent &quot;

The insulating layer formed using the adhesive film (or resin composition) of the present invention exhibits good plating adhesion. That is, an insulating layer showing good plating peel strength. The plating strength is preferably 1.5 kgf / cm or less, more preferably 1 kgf / cm or less, and still more preferably 0.5 kgf / cm or less. The upper limit may be 0.1 kgf / cm or more. The evaluation of the plating film strength can be carried out according to the method described in [Measurement of the adhesion of plating adhesion] described later.

The insulating layer formed by using the adhesive film (or resin composition) of the present invention exhibits good low-adhesion properties. That is, an insulating layer showing good emboss strength. The emboss strength is preferably 1.5 kgf / cm or less, more preferably 1 kgf / cm or less, and further preferably 0.5 kgf / cm or less. The upper limit may be 0.1 kgf / cm or more. The adhesion of the undercoat layer can be evaluated according to the method described in [Measurement of adhesion of the undercoat layer] described later.

A prepreg may be formed using the resin composition of the present invention. A prepreg can be formed by impregnating a sheet-like fiber substrate with the resin composition of the present invention. Thus, in one embodiment, the prepreg of the present invention comprises a sheet-like fibrous substrate and a resin composition of the present invention impregnated with the sheet-like fibrous substrate.

The sheet-like fibrous base material used in the prepreg is not particularly limited, and those commonly used as prepreg substrates such as glass cloth, aramid nonwoven fabric, and liquid crystal polymer nonwoven fabric can be used. From the viewpoint of reducing the thickness of the printed wiring board, the thickness of the sheet-like fiber base material is preferably 900 占 퐉 or less, more preferably 800 占 퐉 or less, further preferably 700 占 퐉 or less, and even more preferably 600 占 퐉 or less. Particularly, in the present invention, the plating penetration depth can be suppressed to a small value, and therefore, it is preferably 30 탆 or less, more preferably 20 탆 or less, and further preferably 10 탆 or less. The lower limit of the thickness of the sheet-like fibrous substrate is not particularly limited, but may be usually 1 占 퐉 or more, 1.5 占 퐉 or more, 2 占 퐉 or more, or the like.

And can be produced by a known method such as prepreg, hot melt method, solvent method and the like.

The thickness of the prepreg can be the same as that of the resin composition layer in the above-mentioned adhesive film.

[Printed circuit board]

The printed wiring board of the present invention includes an insulating layer formed by a cured product of the resin composition of the present invention.

Specifically, the printed wiring board of the present invention can be produced by a method including the steps (I) and (II) using the above-mentioned adhesive film.

(I) Step of laminating an adhesive film on the inner layer substrate and bonding the resin composition layer of the adhesive film to the inner layer substrate

(II) a step of thermally curing the resin composition layer to form an insulating layer

The term &quot; inner layer substrate &quot; used in the step (I) mainly refers to a substrate such as a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, a thermosetting polyphenylene ether substrate, Refers to a circuit board on which a conductive layer (circuit) patterned on one side or both sides is formed. Further, when manufacturing a printed wiring board, an inner layer circuit board of an intermediate product to which an insulating layer and / or a conductor layer is to be further formed is also included in the &quot; inner layer board &quot; If the printed wiring board is a component built-in circuit board, an inner-layer board containing components may be used.

The lamination of the inner layer substrate and the adhesive film can be performed, for example, by hot pressing the adhesive film from the support side to the inner layer substrate. Examples of the member for heating and pressing the adhesive film to the inner layer substrate (hereinafter also referred to as "hot pressing member") include a heated metal plate (SUS hard plate) or a metal roll (SUS roll). Further, it is preferable to press the heat-press member through an elastic material such as heat-resistant rubber such that the heat-press member is not pressed directly onto the adhesive film but the adhesive film sufficiently follows the surface unevenness of the inner-layer substrate.

The lamination of the inner layer substrate and the adhesive film may be performed by a vacuum lamination method. In the vacuum laminating method, the heat-pressing temperature is preferably in the range of 60 占 폚 to 160 占 폚, more preferably 80 占 폚 to 140 占 폚, the heat pressing pressure is preferably 0.098 MPa to 1.77 MPa, Is in the range of 0.29 MPa to 1.47 MPa, and the heat pressing time is preferably in the range of 20 seconds to 400 seconds, more preferably 30 seconds to 300 seconds. The lamination is preferably performed under a reduced pressure of 26.7 hPa or less.

The lamination can be performed by a commercially available vacuum laminator. Examples of commercially available vacuum laminates include vacuum pressurized laminators manufactured by Meikishesakusho Co., Ltd., and baking applicators manufactured by Nikko Materials Co., Ltd., and the like.

After lamination, the laminated adhesive film may be subjected to smoothing treatment under atmospheric pressure (at atmospheric pressure), for example, by pressing a hot press member from the support side. The pressing condition of the smoothing treatment may be the same as the conditions of the hot pressing of the laminate. The smoothing process can be performed by a commercially available laminator. On the other hand, the lamination and the smoothing process may be continuously performed using the commercially available vacuum laminator.

The support may be removed between step (I) and step (II), or may be removed after step (II).

In the step (II), the resin composition layer is thermally cured to form an insulating layer.

The thermosetting condition of the resin composition layer is not particularly limited, and a condition that is generally adopted when forming the insulating layer of the printed wiring board may be used.

For example, the thermosetting condition of the resin composition layer varies depending on the kind of the resin composition and the like, but the curing temperature is in the range of 120 to 240 占 폚 (preferably in the range of 150 to 220 占 폚, more preferably 170 占 폚 To 200 占 폚), and the curing time may be in the range of 5 minutes to 120 minutes (preferably 10 minutes to 100 minutes, more preferably 15 minutes to 90 minutes).

The resin composition layer may be preheated at a temperature lower than the curing temperature before thermosetting the resin composition layer. For example, before the resin composition layer is thermally cured, the resin composition layer is heated at a temperature of 50 ° C or more and less than 120 ° C (preferably 60 ° C or more and 110 ° C or less, more preferably 70 ° C or more and 100 ° C or less) Preheating may be performed for 5 minutes or more (preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes).

At the time of manufacturing the printed wiring board, at least one of the step of (III) piercing the insulating layer, (IV) the step of roughening the insulating layer, and the step of forming the conductor layer (V) may be further performed. These steps (III) to (V) may be carried out according to various methods known to those skilled in the art, which are used in the production of printed wiring boards. When the support is removed after the step (II), the removal of the support is carried out between the step (II) and the step (III), between the step (III) and the step (IV) ).

In another embodiment, the printed wiring board of the present invention can be produced by using the prepreg described above. The manufacturing method is basically the same as in the case of using an adhesive film.

The step (III) is a step of perforating the insulating layer, whereby holes such as via holes and through holes can be formed in the insulating layer. The step (III) may be carried out using, for example, a drill, a laser or a plasma, depending on the composition of the resin composition used for forming the insulating layer. The dimensions and shape of the holes may be appropriately determined in accordance with the design of the printed wiring board.

Step (IV) is a step of roughening the insulating layer. The procedure and condition of the roughening treatment are not particularly limited, and a known procedure and condition commonly used in forming the insulating layer of the printed wiring board can be adopted. For example, the swelling treatment with a swelling liquid, the coarsening treatment with an oxidizing agent, and the neutralization treatment with a neutralizing liquid can be carried out in this order to roughen the insulating layer. The swelling liquid is not particularly limited, but an alkaline solution, a surfactant solution and the like can be mentioned, and an alkaline solution is preferable, and a sodium hydroxide solution and a potassium hydroxide solution are more preferable as the alkaline solution. Examples of commercially available swelling liquids include Swelling Dip Siculiganth P, Swelling Dip Sicurgis SBU manufactured by Atotech Japan Co., Ltd., and the like. The swelling treatment by the swelling liquid is not particularly limited, but can be carried out, for example, by immersing the swelling liquid at 30 캜 to 90 캜 for 1 minute to 20 minutes. From the viewpoint of suppressing the swelling of the resin in the insulating layer to an appropriate level, it is preferable to immerse the cured body in a swelling liquid at 40 占 폚 to 80 占 폚 for 5 minutes to 15 minutes. The oxidizing agent is not particularly limited, and for example, an alkaline permanganic acid solution obtained by dissolving potassium permanganate or sodium permanganate in an aqueous solution of sodium hydroxide can be mentioned. The roughening treatment with an oxidizing agent such as an alkaline permanganic acid solution is preferably carried out by immersing the insulating layer in an oxidizing agent solution heated at 60 캜 to 80 캜 for 10 minutes to 30 minutes. The concentration of the permanganate in the alkaline permanganic acid solution is preferably 5% by mass to 10% by mass. Examples of the commercially available oxidizing agent include alkaline permanganic acid solutions such as "Concentrate Compact CP" manufactured by Atotech Japan Co., Ltd. and "Dozing Solution · Securigans P". An acidic aqueous solution is preferable as the neutralization solution, and a commercially available product is, for example, "Reduction Solution · Securigant P" manufactured by Atotech Japan Co., Ltd. The treatment with the neutralizing liquid can be performed by immersing the treated surface subjected to the roughening treatment with an oxidizing agent in a neutralizing solution at 30 ° C to 80 ° C for 5 minutes to 30 minutes. It is preferable to immerse the object subjected to the roughening treatment with an oxidizing agent in a neutralizing solution at 40 캜 to 70 캜 for 5 minutes to 20 minutes in terms of workability and the like.

In one embodiment, the arithmetic mean roughness (Ra) of the surface of the insulating layer after the roughening treatment is preferably 280 nm or less, more preferably 250 nm or less, further preferably 200 nm or less, 140 nm or less, 130 nm or less, 110 nm or less, 100 nm or less, 95 nm or less, or 90 nm or less. The lower limit of the Ra value is not particularly limited, but is preferably 0.5 nm or more, more preferably 1 nm or more. The arithmetic mean roughness (Ra) of the surface of the insulating layer can be measured using a non-contact surface roughness meter. A specific example of the non-contact type surface roughness meter is "WYKO NT3300" manufactured by Vico Instruments.

Step (V) is a step of forming a conductor layer.

The conductor material used for the conductor layer is not particularly limited. In a preferred embodiment, the conductor layer comprises at least one metal selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin and indium do. The conductor layer may be a single metal layer or an alloy layer, and examples of the alloy layer include alloys of two or more metals selected from the above group (for example, nickel-chromium alloy, copper-nickel alloy and copper- ). &Lt; / RTI &gt; Among them, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper, or a nickel / chromium alloy, a copper / nickel alloy, An alloy layer of a copper-titanium alloy is preferable and a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper or an alloy layer of nickel-chromium alloy is more preferable, More preferable.

The conductor layer may have a single-layer structure or a multi-layer structure in which two or more single metal layers or alloy layers made of different metals or alloys are stacked. When the conductor layer has a multilayer structure, the layer in contact with the insulating layer is preferably a single metal layer of chromium, zinc or titanium, or an alloy layer of nickel-chromium alloy.

The thickness of the conductor layer is generally 3 mu m to 35 mu m, preferably 5 mu m to 30 mu m, though it depends on the design of the desired printed wiring board.

In one embodiment, the conductor layer may be formed by plating. For example, a conductor layer having a desired wiring pattern can be formed by plating the surface of the insulating layer by a conventionally known technique such as a semi-custom method or a pull-on-wet method. Hereinafter, an example in which the conductor layer is formed by the semi-

First, a plating seed layer is formed on the surface of the insulating layer by electroless plating. Subsequently, a mask pattern is formed on the formed plating seed layer to expose a part of the plating seed layer corresponding to the desired wiring pattern. A metal layer is formed on the exposed plating seed layer by electrolytic plating, and then the mask pattern is removed. Thereafter, an unnecessary plating seed layer is removed by etching or the like, and a conductor layer having a desired wiring pattern can be formed.

[Semiconductor device]

The semiconductor device of the present invention includes a printed wiring board. The semiconductor device of the present invention can be manufactured by using the printed wiring board of the present invention.

Examples of the semiconductor device include various semiconductor devices provided in an electric product (such as a computer, a mobile phone, a digital camera and a television) and a vehicle (such as a motorcycle, a car, a train, have.

The semiconductor device of the present invention can be manufactured by mounting a component (semiconductor chip) to a conductive portion of a printed wiring board. The "conduction point" is a "point for transmitting electrical signals on the printed wiring board", and may be a surface or a buried point. The semiconductor chip is not particularly limited as long as it is an electric circuit element made of a semiconductor material.

The method for mounting the semiconductor chip in manufacturing the semiconductor device of the present invention is not particularly limited as long as the semiconductor chip can function effectively. Specifically, a wire bonding mounting method, a flip chip mounting method, a bumpless mounting method, A mounting method using a buildup layer (BBUL), a mounting method using an anisotropic conductive film (ACF), a mounting method using a nonconductive film (NCF), and the like. Here, the "mounting method using the bumpless buildup layer (BBUL)" refers to a "mounting method in which a semiconductor chip is directly buried in a concave portion of a printed wiring board to connect the semiconductor chip and wiring on the printed wiring board.

[Example]

Hereinafter, the present invention will be described concretely with reference to examples, but the present invention is not limited to these examples. In the following description, &quot; part &quot; and &quot;% &quot; mean &quot; part by mass &quot; and &quot;% by mass &quot;, respectively, unless otherwise specified.

[Example 1]

40 parts of biphenyl type epoxy resin (epoxy equivalent 269, "NC3000" manufactured by Nippon Kayaku Co., Ltd.) was dissolved by heating in 25 parts of solvent naphtha with stirring, and then cooled to room temperature. 330 parts of an inorganic filler ("SO-C2" manufactured by Adomex Co., Ltd., average particle diameter 0.5 μm, carbon amount per unit surface area 0.38 mg / m 2) were mixed and kneaded with three rolls and dispersed. Thereafter, 92.3 parts of an active ester type curing agent ("HPC-8000-65T" manufactured by DIC Corporation, a toluene solution of a nonvolatile matter of about 223 in terms of an activating group equivalent of 65% by mass), a vinyl resin (Mitsubishi Gas Kagaku Co., , 15 parts of indenkumarone resin ("H-100" manufactured by Nitto Kagaku KK), 25 parts of a toluene solution of 60% by mass of a nonvolatile compound "OPE-2St 2200" ) Were mixed and dispersed uniformly with a rotary mixer to prepare a resin varnish 1.

Resin varnish 1 was subjected to die coatering so that the thickness of the resin composition layer after drying was 40 占 퐉 on a release surface of a polyethylene terephthalate film ("AL-5" manufactured by LINTEC CORPORATION) having an alkyd resin type release treatment And dried at 80 to 110 캜 (average 95 캜) for 5 minutes to prepare an adhesive film 1.

[Example 2]

In the same manner as in Example 1 except that a vinyl resin ("OPE-2St 2200" manufactured by Mitsubishi Gas Chemical Co., Ltd., toluene solution of nonvolatile content of 60 mass%) was replaced with a resin having a vinyl group (manufactured by Mitsubishi Gas Chemical Co., OPE-2St 1200 &quot; toluene solution containing 60% by mass of nonvolatile matter). Resin varnish 2 and adhesive film 2 were produced in the same manner as in Example 1, except for the above.

[Example 3]

In Example 1, indencumarone resin ("H-100" manufactured by Nitto Kagaku Co., Ltd.) was changed to indencumarone resin ("V-120S" manufactured by Nitto Kagaku Co., Ltd.). A resin varnish 3 and an adhesive film 3 were produced in the same manner as in Example 1 except for the above.

[Example 4]

In Example 1, an indenkumarone resin ("H-100" manufactured by Nitto Kagaku Co., Ltd.) was changed to indenkumaron resin ("V-120" manufactured by Nitto Kagaku Co., Ltd.). Resin varnish 4 and adhesive film 4 were produced in the same manner as in Example 1 except for the above.

[Example 5]

In Example 1,

(1) 25 parts of a vinyl-containing resin ("OPE-2St 2200" manufactured by Mitsubishi Gas Chemical Company, nonvolatile content of 60% by mass toluene solution) was added to a resin having a vinyl group ("OPE- 2St 2200 "toluene solution of nonvolatile content 60% by mass) and 16.7 parts of a resin having vinyl group (" OPE-2St "manufactured by Mitsubishi Gas Kagaku Co., Ltd., toluene solution of 60% by mass of toluene solution)

(2) The amount of indenkumarone resin ("H-100" manufactured by Nitto Kagaku) was changed from 15 parts to 8 parts.

Resin varnish 5 and adhesive film 5 were produced in the same manner as in Example 1 except for the above.

[Example 6]

In Example 1,

(1) A blending amount of a resin having vinyl group (toluene solution of "OPE-2St 2200" nonvolatile content 60% by mass by Mitsubishi Gas Kagaku Co., Ltd.) was changed from 25 parts to 16.7 parts,

(2) The amount of indencumarone resin ("H-100" manufactured by Nitto Kagaku KK) was changed from 15 parts to 25 parts.

Resin varnish 6 and adhesive film 6 were produced in the same manner as in Example 1 except for the above.

[Comparative Example 1]

In Example 1,

(1) A blending amount of a resin having a vinyl group (toluene solution of "OPE-2St 2200" manufactured by Mitsubishi Gas Chemical Co., Ltd., nonvolatile content of 60 mass%) was changed from 25 parts to 50 parts,

(2) The amount of indenkumarone resin ("H-100" manufactured by Nitto Kagaku Co., Ltd.) was changed from 15 parts to 2 parts.

Resin varnish 7 and adhesive film 7 were produced in the same manner as in Example 1 except for the above.

[Comparative Example 2]

In Example 1,

(1) A blending amount of a resin having a vinyl group (toluene solution of "OPE-2St 2200" nonvolatile content of 60 mass% manufactured by Mitsubishi Gas Kagaku Co., Ltd.) was changed from 25 parts to 8.3 parts,

(2) The amount of the indencumarone resin ("H-100" manufactured by Nitto Kagaku) was changed from 15 parts to 34 parts.

Resin varnish 8 and adhesive film 8 were produced in the same manner as in Example 1 except for the above.

[evaluation]

&Lt; Evaluation of dielectric tangent &

The adhesive films prepared in Examples and Comparative Examples were thermally cured at 190 占 폚 for 90 minutes and the support was peeled off to obtain a sheet-like cured product. The cured product was cut into a length of 80 mm and a width of 2 mm to obtain an evaluation sample. This evaluation sample was measured for dielectric loss tangent at a measurement frequency of 5.8 GHz and a measurement temperature of 23 占 폚 by a resonance perturbation method using an HP8362B device manufactured by Agilent Technologies.

&Lt; Measurement of Minimum Melting Viscosity of Resin Composition Layer >

The melt viscosity of the resin composition layer of the adhesive film produced in the Examples and Comparative Examples was measured using a dynamic viscoelasticity measuring apparatus ("Rheosol-G3000" manufactured by U · B · M Co., Ltd.). 1 g of the sample resin composition was heated in parallel at a heating rate of 5 占 폚 / min from a starting temperature of 60 占 폚 to 200 占 폚 using a parallel plate having a diameter of 18 mm and heated at a measurement interval of 2.5 占 폚, The dynamic viscoelasticity was measured under the measurement conditions, and the lowest melt viscosity (poise) was calculated.

<Evaluation of Compatibility>

The side of the resin composition layer of the adhesive film produced in the examples and comparative examples was observed using a microscope ("DIGITAL MICROSCOPE KH-8700" manufactured by Hirox Co., Ltd.) .

- Criteria for compatibility -

?: No granulation of 50 占 퐉 or more was deposited on the resin composition layer of the adhesive film.

X: The resin composition layer of the adhesive film has a grain size of at least 50 mu m deposited.

[Measurement of plating adhesion]

<Preparation of evaluation substrate>

(1) ground treatment of inner layer circuit board

Both surfaces of a glass cloth base epoxy resin double-sided copper-clad laminate (thickness of copper foil of 18 mu m, thickness of board of 0.4 mm, "R1515A" manufactured by Panasonic Corporation) on which an inner layer circuit was formed was immersed in "CZ8101" Followed by etching to 1 占 퐉 to conduct coarsening treatment of the copper surface.

(2) Lamination of adhesive films

The adhesive films prepared in Examples and Comparative Examples were laminated on both surfaces of the inner layer circuit board so that the resin composition layer was bonded to the inner layer circuit substrate by using a batch type vacuum laminator (MVLP-500, manufactured by Meiki Co., Ltd.) Lt; / RTI &gt; The lamination treatment was carried out by reducing the pressure for 30 seconds to bring the air pressure to 13 hPa or lower, followed by pressing at 100 deg. C and a pressure of 0.74 MPa for 30 seconds.

(3) Curing of the resin composition layer

The PET film as a support was peeled from the laminated adhesive film. Subsequently, after preliminary heating at 80 占 폚 for 30 minutes, the resin composition layer was thermally cured at 170 占 폚 for 30 minutes to form a cured product (insulating layer) on both surfaces of the inner-layer circuit board.

(4) Hardening treatment of hardened product

The inner-layer circuit board on which the cured product was formed on both surfaces was immersed in a swelling solution ("Swelling Deep Sucuregent P" manufactured by Atotech Japan Ltd., sodium hydroxide aqueous solution containing diethylene glycol monobutyl ether) at 60 ° C for 10 minutes , Followed by immersion at 80 ° C for 20 minutes in an aqueous solution ("Concentrate Compact P" manufactured by Atotech Japan Co., Ltd., an aqueous solution having a potassium permanganate concentration of about 6 mass% and a sodium hydroxide concentration of about 4 mass%) And then immersed in a neutralizing solution ("Reduction Solution · Securite Gant P" manufactured by Atotech Japan Co., Ltd., aqueous solution of sulfuric acid hydroxylamine) at 40 ° C for 5 minutes. Then, it was dried at 80 DEG C for 30 minutes.

(5) Formation of conductor layer

A conductor layer was formed on the roughened surface of the cured product according to the semi-specific method.

That is, the substrate after the roughening treatment was immersed in an electroless plating solution containing PdCl ₂ at 40 ° C for 5 minutes, and immersed in an electroless copper plating solution at 25 ° C for 20 minutes. Subsequently, annealing was performed by heating at 150 占 폚 for 30 minutes, etching resist was formed, and a pattern was formed by etching. Thereafter, copper sulfate electroplating was performed to form a conductor layer having a thickness of 30 mu m. Annealing was performed at 200 캜 for 60 minutes to obtain an evaluation substrate.

&Lt; Measurement of Peel Strength (Plating Adhesiveness) Between the Surface of the Cured Part and the Conductor Layer >

A portion of 10 mm in width and 100 mm in length was cut in the conductor layer of the evaluation substrate, the one end was peeled off, picked up with a collecting tool and subjected to a load of 35 mm in a vertical direction at a rate of 50 mm / (kgf / cm) were measured to determine the peel strength. For the measurement, a tensile tester (AC-50C-SL, an automobile tester manufactured by TSE Co., Ltd.) was used.

[Measurement of adhesion of base material]

(1) Treatment of copper foil

(Ra value = 1 mu m) was applied to the copper surface by immersing the glossy surface of 3EC-III (electric copper foil, 35 mu m) manufactured by Mitsui Kinzoku Kozan Co., Ltd. in a McKue etch bond CZ-8101 manufactured by Mack Co. And subjected to anti-corrosive treatment (CL8300). This copper foil is called CZ copper foil. Further, heat treatment was performed in an oven at 130 캜 for 30 minutes.

(2) Formation of laminate and insulating layer of copper foil

(2) Lamination of adhesive film &quot; of the above &quot; Measurement of Coating Adhesion &quot;, and a PET film as a support was peeled off. The treated surface of the CZ copper foil of 3EC-III was laminated on the resin composition layer under the same conditions as in the above ([2] laminating of the adhesive film] of [measurement of the plating adhesion]. Then, the resin composition layer was cured at 190 DEG C for 90 minutes under a curing condition to form an insulating layer, thereby preparing a sample.

(3) Measurement of copper foil peel strength

The prepared sample was cut into small pieces of 150 x 30 mm. An incision of a portion of a width of 10 mm and a length of 100 mm was inserted into a copper foil piece of the piece by using a cutter and one end of the copper foil was peeled and peeled off with a picking tool (automobile type tester, AC-50C-SL manufactured by Toshiba Corporation) The load at the time of peeling 35 mm in the vertical direction at a rate of 50 mm / min at room temperature using an Instron universal testing machine was measured in accordance with JIS C6481, and it was referred to as &quot; not adhesive property &quot;.

In the table, the content of the component (A), the content of the component (B), the content of the component (C), and the content of the component (D) represent the content when the resin component is 100 mass%.

Examples 1 to 6, which contain a predetermined amount of the component (D) and contain the component (C), show excellent compatibility, excellent dielectric tangent and melt viscosity, and excellent plating adhesion and surface adhesion Able to know.

On the other hand, in Comparative Example 2 in which the content of the component (D) was large, the lowest melt viscosity was lowered and the base adhesion was lower than in Examples 1 to 6.

Further, in Comparative Example 1 in which the content of the component (D) was small, compatibility was poor and crystals were precipitated on the adhesive film, and the lowest melt viscosity could not be measured. Further, the compatibility was poor and the insulating layer could not be formed, and dielectric tangent, plating adhesion, and ground adhesion could not be measured.

Claims (11)

1. A resin composition comprising (A) an epoxy resin, (B) a curing agent, (C) a resin having a vinyl group, and (D) indencumarone resin,
And the content of the component (D) is 5% by mass to 20% by mass when the content of the resin component is 100% by mass. The resin composition according to claim 1, wherein at least one of the components (C) has an aromatic ring. The resin composition according to claim 1, wherein the content of the component (C) is 5% by mass to 20% by mass when the content of the resin component is 100% by mass. The resin composition according to claim 1, wherein at least one of the components (B) is an active ester type curing agent. The resin composition according to claim 1, further comprising (E) an inorganic filler. The resin composition according to claim 5, wherein the content of the component (E) is 50% by mass or more when the nonvolatile component of the resin composition is 100% by mass. The resin composition according to claim 1, wherein the component (D) is a copolymer of indene, coumarone, and styrene. The resin composition according to claim 1, which is used for forming an insulating layer of a printed wiring board. An adhesive film having a support and a resin composition layer comprising the resin composition according to any one of claims 1 to 8 formed on the support. A printed wiring board comprising an insulating layer formed by a cured product of the resin composition according to any one of claims 1 to 8. A semiconductor device comprising the printed wiring board according to claim 10.