JP2009218436A - Mounted structure of electronic component, mounting method and repairing method of the mounted structure, and printed board - Google Patents

Mounted structure of electronic component, mounting method and repairing method of the mounted structure, and printed board Download PDF

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JP2009218436A
JP2009218436A JP2008061639A JP2008061639A JP2009218436A JP 2009218436 A JP2009218436 A JP 2009218436A JP 2008061639 A JP2008061639 A JP 2008061639A JP 2008061639 A JP2008061639 A JP 2008061639A JP 2009218436 A JP2009218436 A JP 2009218436A
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adhesive
printed circuit
circuit board
surface mount
mounting
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JP4989528B2 (en
JP2009218436A5 (en
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Seiji Tokii
誠治 時井
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Panasonic Corp
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Panasonic Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83909—Post-treatment of the layer connector or bonding area
    • H01L2224/83951—Forming additional members, e.g. for reinforcing, fillet sealant

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a printed board which can be prevented from being damaged when peeling off a semiconductor device in repairing operation, and to provide a mounted structure of a surface mount device, which includes the printed board. <P>SOLUTION: The mounted structure of the surface mount device includes: the printed board 2a arraying terminals on one main surface and provided with a mounting area on which the surface mount device is to be mounted and foil-like lands 5 arranged in the periphery of the mounting area; the surface mount device 3 mounted on the mounting area of the printed board 2a by solder balls 13; and adhesive 4 for fixing the surface mount device 3 on the printed board 2a. Wherein, the adhesive 4 is arranged on the foil-like lands 5 on the printed substrate 2a and allowed to be softened by heating. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、小型パーソナルコンピュータや携帯電話機、ビデオカメラ等の電子機器に使用される電子部品の実装構造体および実装方法に関し、特にリペアが可能な電子部品の実装の技術に関する。   The present invention relates to a mounting structure and mounting method for an electronic component used in electronic devices such as a small personal computer, a mobile phone, and a video camera, and particularly to a mounting technology for an electronic component that can be repaired.

近年、電子機器商品は多機能化が著しい一方で、小型、軽量化への要求も非常に高い。そのため、実装される半導体装置には、従来のＱＦＰ（Quad Flat Package）に代表されるリード接続型の半導体装置に替わり、ＢＧＡ（Ball Grid Array）、ＣＳＰ（Chip Size Package）といった、はんだバンプ接続型の半導体装置が数多く使用されている。しかし、人が持ち運ぶことを前提としたモバイル機器は、使用者の不注意による落下等の衝撃に対して高い信頼性が要求される。一般にＢＧＡ、ＣＳＰなどのはんだバンプ接続型半導体装置の実装構造体においては、衝撃が直接はんだ接続部に伝わる為、リードによる応力緩和機能を持つリード接続型半導体装置の実装構造体と比較して電気的接続の信頼性が劣る。その為、信頼性を向上させるためにさまざまな補強が行われている。中でも半導体装置とプリント基板の間に熱硬化性接着剤を注入して補強する、いわゆるアンダーフィルが使われるケースが非常に多い。   In recent years, electronic device products have been remarkably multifunctional, and demands for miniaturization and weight reduction are very high. Therefore, solder bump connection type such as BGA (Ball Grid Array) and CSP (Chip Size Package) is used instead of the conventional lead connection type semiconductor device represented by QFP (Quad Flat Package). Many semiconductor devices are used. However, mobile devices that are supposed to be carried by people are required to have high reliability against impacts such as dropping due to carelessness of the user. In general, in a mounting structure of a solder bump connection type semiconductor device such as BGA or CSP, an impact is directly transmitted to a solder connection portion. Connection reliability is poor. Therefore, various reinforcements are made to improve reliability. In many cases, so-called underfill, in which a thermosetting adhesive is injected between a semiconductor device and a printed circuit board to reinforce, is used.

図１３は、はんだバンプ接続型半導体装置の実装構造体の構成を示す断面図である。プリント基板５１のランド５２に半導体装置５３のはんだボール５４が接続されている。アンダーフィル５５は、半導体装置５３の実装面にまで挿入されている。   FIG. 13 is a cross-sectional view illustrating a configuration of a mounting structure of a solder bump connection type semiconductor device. Solder balls 54 of the semiconductor device 53 are connected to the lands 52 of the printed circuit board 51. The underfill 55 is inserted up to the mounting surface of the semiconductor device 53.

バンプ接続型の半導体装置は、高機能化、多機能化のために端子数が増加し、また小型化、軽量化が進み、それに応じて、はんだバンプピッチやはんだボールの微細化が進んでいる。また、これを受けるプリント基板のランドも小径化している。その結果、接続面積が減少してしまい、接続部の強度が低下し、信頼性が低下する。したがってアンダーフィルによる補強の重要性は益々高くなっている。   Bump connection type semiconductor devices have increased the number of terminals for higher functionality and multi-function, and have become smaller and lighter, and accordingly, solder bump pitch and solder balls have been miniaturized. . Further, the land of the printed circuit board that receives this is also reduced in diameter. As a result, the connection area decreases, the strength of the connection portion decreases, and the reliability decreases. Therefore, the importance of reinforcement by underfill is increasing.

この方法では、アンダーフィル材料として熱硬化性樹脂が用いられる。この為、プリント基板にＢＧＡ部品が実装された後にＢＧＡ部品の不良、あるいはＢＧＡ部品とプリント基板との接続の不良等が発見された時にＢＧＡ部品を交換することが極めて困難である。   In this method, a thermosetting resin is used as the underfill material. For this reason, it is extremely difficult to replace a BGA component when a defect in the BGA component or a connection failure between the BGA component and the printed circuit board is found after the BGA component is mounted on the printed circuit board.

この問題を解決する為に、リペアが可能なアンダーフィル材料、および技術として１５０℃で軟化するエポキシ系樹脂をアンダーフィル材として用いた半導体装置の実装構造体が提案されている（例えば特許文献１参照）。また、加熱しながら半導体装置を実装基板から引き剥がす工程が可能な樹脂組成物を用いた半導体装置の実装構造体が提案されている（例えば、特許文献２参照）。また、半導体装置上面を接着剤で冶具に接触させて加熱することで、接着剤を治具に熱硬化接着させるとともに、プリント基板と半導体装置の間にあるアンダーフィルを加熱劣化させて、基板から半導体装置を物理的に引き剥がす半導体装置の実装構造体のリペア方法が提案されている（特許文献３、４参照）。
特開２００１−２２０４２８号公報 特開平１０−２０９３４２号公報 特開平５−１０９８３８公報 特開２００６−３０３２６６公報 In order to solve this problem, a semiconductor device mounting structure using an underfill material that can be repaired and an epoxy resin that softens at 150 ° C. as an underfill material has been proposed (for example, Patent Document 1). reference). In addition, a mounting structure of a semiconductor device using a resin composition capable of performing a process of peeling the semiconductor device from the mounting substrate while heating has been proposed (for example, see Patent Document 2). Also, by heating the upper surface of the semiconductor device with an adhesive in contact with a jig, the adhesive is thermally cured and bonded to a jig, and the underfill between the printed circuit board and the semiconductor device is heated to deteriorate, A method of repairing a mounting structure of a semiconductor device that physically peels off the semiconductor device has been proposed (see Patent Documents 3 and 4).
JP 2001-220428 A JP-A-10-209342 JP-A-5-109838 JP 2006-303266 A

特許文献１〜４に記載のリペア方法は、図１４に示すように、加熱することにより、樹脂を軟化させて半導体装置を取り外す。   In the repair methods described in Patent Documents 1 to 4, as shown in FIG. 14, the resin is softened by heating to remove the semiconductor device.

特許文献１記載において、リペアは、半導体装置の取り外しの可否で定義されており、樹脂残渣５６の除去に関しての記載は無く、リペア時の樹脂残渣の除去については考慮されていない。   In Patent Document 1, the repair is defined by whether or not the semiconductor device can be removed. There is no description regarding the removal of the resin residue 56, and no consideration is given to the removal of the resin residue during the repair.

また、特許文献２には、プリント基板上に残った、樹脂残渣５６の除去の方法として、所定温度に加熱するか、有機溶剤を含浸させる方法が記載されている。しかし、この場合、プリント基板や周辺に実装された部品を損傷する可能性があり、必ずしも樹脂残渣の除去に適当な有機溶剤が使えるとは限らない。   Patent Document 2 describes a method of removing the resin residue 56 remaining on the printed board by heating to a predetermined temperature or impregnating with an organic solvent. However, in this case, there is a possibility of damaging the printed circuit board and components mounted on the periphery, and an organic solvent suitable for removing the resin residue is not always usable.

また、特許文献３に記載の方法では、プリント基板から剥がした半導体装置はヒータツール側に固着されたままである。したがって、ヒータツールをそのままでは使用できず、半導体装置を剥がし、また、場合によってはヒータツールに残っている付着物を除去してからでなければ再使用できない。   Further, in the method described in Patent Document 3, the semiconductor device peeled off from the printed board remains fixed on the heater tool side. Therefore, the heater tool cannot be used as it is, and it cannot be reused after the semiconductor device is peeled off and, in some cases, the deposits remaining on the heater tool are removed.

一方、特許文献４には、特許文献３の問題であるヒータツールに付着物を残さない為に、半導体装置上面より熱伝導性の大きい良熱伝導性の伝熱板を熱硬化性樹脂を用いて、半導体装置上面の全面に密着させて接着させる方法が記載されている。しかし、半導体装置上面に接着剤により接着していることは、特許文献３の記載と同様で半導体装置から接着剤を剥がす際に半導体装置を損傷させる可能性がある。また、リペアについては、特許文献１記載と同じく、半導体装置の取り外しの可否で定義されており、樹脂残渣の除去に関しての記載は無く、リペア時の樹脂残渣の除去については考慮されていない。   On the other hand, in Patent Document 4, in order not to leave a deposit on the heater tool, which is a problem of Patent Document 3, a heat transfer plate having a heat conductivity higher than that of the upper surface of the semiconductor device is used as a thermosetting resin. Thus, a method of adhering to the entire upper surface of the semiconductor device is described. However, bonding to the upper surface of the semiconductor device with an adhesive may damage the semiconductor device when the adhesive is peeled off from the semiconductor device, as described in Patent Document 3. Further, the repair is defined by whether or not the semiconductor device can be removed as described in Patent Document 1, and there is no description regarding the removal of the resin residue, and the removal of the resin residue at the time of repair is not considered.

なお、熱風に代えてヒータツールを半導体装置に密着させることにより半導体装置をヒータツールからの熱伝導によって加熱し、吸着によってプリント基板から引き剥がす場合には、ヒータツールを貫通して半導体装置との密着面に開口する吸気通路をヒータツールに形成しておく必要がある。この為、ヒータツールの半導体装置の密着面積が吸気通路の開口面積分だけ減少し、ヒータツールからの半導体装置への熱伝導が悪くなる。そこで、吸気通路の面積をできるだけ小さくしてヒータツールと半導体装置との密着面積を大きくすると、吸引力が減少し、半導体装置を引き剥がす力が不足することになる。このため、ナイフ、ピンセットなどの工具を半導体装置とプリント基板との接着部分に差し込んでこじ開けるといった補助的な作業が必須で、周囲の部品やプリント基板を損傷する恐れがある。   When the semiconductor device is heated by heat conduction from the heater tool by sticking the heater tool to the semiconductor device instead of hot air, and peeled off from the printed circuit board by suction, the heater tool penetrates the semiconductor device. It is necessary to form an intake passage opening in the contact surface in the heater tool. For this reason, the contact area of the semiconductor device of the heater tool is reduced by the opening area of the intake passage, and heat conduction from the heater tool to the semiconductor device is deteriorated. Therefore, if the area of the intake passage is made as small as possible to increase the contact area between the heater tool and the semiconductor device, the suction force is reduced and the force for peeling off the semiconductor device is insufficient. For this reason, auxiliary work such as inserting a tool such as a knife or tweezers into the bonding portion between the semiconductor device and the printed board and prying it open is essential, and there is a risk of damaging surrounding components and the printed board.

上記のようにアンダーフィルは半導体装置下面全体と、それと接触するとプリント基板に必ず接着剤樹脂残渣を残すため、その残渣除去の際にプリント基板のレジスト損傷、および基材そのものの損傷等が発生する恐れがある。また、接着剤厚みはばらつきがあるため接着部位において強いところと弱いところの差異が発生し加熱して引き剥がし時にプリント基板のレジストが剥離して基材自体も損傷する危険性がある。   As described above, the underfill always leaves an adhesive resin residue on the printed circuit board when it comes into contact with the entire lower surface of the semiconductor device. This causes damage to the resist on the printed circuit board and damage to the substrate itself. There is a fear. In addition, since the adhesive thickness varies, there is a risk that a difference between a strong part and a weak part occurs at the bonded part, and the resist of the printed circuit board is peeled off when it is heated and peeled to damage the base material itself.

本発明は、かかる問題点を解決するためになされたものであり、リペア作業時の半導体装置を引き剥がす際に、損傷を防止することが可能なプリント基板およびそのプリント基板を有する表面実装デバイスの実装構造体を提供することを目的とする。   The present invention has been made to solve such a problem. A printed circuit board capable of preventing damage when the semiconductor device is peeled off during repair work and a surface mount device having the printed circuit board are disclosed. An object is to provide a mounting structure.

本発明のプリント基板は、上記課題を解決するために、一主面に端子が配列され、表面実装デバイスが実装される実装領域と、前記実装領域の周辺に配置され、前記表面実装デバイスを接着剤で接着する接着領域とを備え、前記接着領域が箔状ランドまたは局部レジストである。この構成により、箔状ランドまたは局部レジスト上に接着剤を配置して、表面実装デバイスをプリント基板に固着する場合に、プリント基板に損傷を与えることなくリペアを行うことができる。   In order to solve the above problems, the printed circuit board of the present invention has terminals arranged on one main surface, a mounting area on which a surface mounting device is mounted, and a periphery of the mounting area, and the surface mounting device is bonded to the mounting area. An adhesive region bonded with an agent, and the adhesive region is a foil land or a local resist. With this configuration, when the adhesive is disposed on the foil land or the local resist and the surface mount device is fixed to the printed board, the repair can be performed without damaging the printed board.

また、前記箔状ランドは、レジストで覆われた構成にすることができる。この構成により、箔状ランドを覆うレジスト上に接着剤を配置して、表面実装デバイスをプリント基板に固着する場合に、プリント基板に損傷を与えることなくリペアを行うことができる。   The foil land may be covered with a resist. With this configuration, when an adhesive is disposed on the resist covering the foil-like land and the surface mount device is fixed to the printed board, the repair can be performed without damaging the printed board.

また、前記局部レジストは、当該プリント基板のレジスト上に配置された構成にすることができる。この構成により、プリント基板のレジスト上の局部レジスト上に接着剤を配置して、表面実装デバイスをプリント基板に固着する場合に、プリント基板に損傷を与えることなくリペアを行うことができる。   The local resist may be arranged on the resist of the printed circuit board. With this configuration, when the adhesive is disposed on the local resist on the resist of the printed circuit board and the surface mount device is fixed to the printed circuit board, the repair can be performed without damaging the printed circuit board.

本発明の表面実装デバイスの実装構造体は、上記課題を解決するために、上記記載のプリント基板と、前記プリント基板の実装領域にはんだにより実装された表面実装デバイスと、前記プリント基板の接着領域に配置され、前記表面実装デバイスを前記プリント基板に固着させる接着剤とを備えている。接着剤がプリント基板の箔状ランドまたは局部レジスト上に配置されているため、リペア時に、箔状ランド上に残った接着剤を、プリント基板を傷つけることなく取り除くことができる。   In order to solve the above problems, a mounting structure for a surface mounting device according to the present invention includes the above-described printed circuit board, a surface mounting device mounted by solder on the mounting area of the printed circuit board, and an adhesion area of the printed circuit board. And an adhesive for fixing the surface mount device to the printed circuit board. Since the adhesive is disposed on the foil land or local resist of the printed circuit board, the adhesive remaining on the foil land can be removed during repair without damaging the printed circuit board.

また、前記接着剤としては、加熱されることにより軟化する素材を用いた構成にすることができる。この構成により、リペア時に接着剤を軟化させることができ、表面実装デバイスを剥ぎ取ることが容易となる。   In addition, the adhesive may be configured using a material that softens when heated. With this configuration, the adhesive can be softened during repair, and the surface mount device can be easily peeled off.

本願発明の表面実装デバイスの実装構造体の製造方法は、上記記載の表面実装デバイスの実装構造体の製造方法であって、前記表面実装デバイスを前記プリント基板の実装領域にはんだ付けし、前記接着領域と前記表面実装デバイスの外周縁との間に接着剤を塗布し、前記接着剤を加熱硬化させる。   A method for manufacturing a mounting structure for a surface mounting device according to the present invention is a method for manufacturing a mounting structure for a surface mounting device as described above, wherein the surface mounting device is soldered to a mounting region of the printed circuit board, and the bonding is performed. An adhesive is applied between the region and the outer peripheral edge of the surface mount device, and the adhesive is cured by heating.

本願発明の表面実装デバイスの実装構造体のリペア方法は、上記課題を解決するために、上記記載の表面実装デバイスの実装構造体のリペア方法であって、所定の温度に加熱されたヒートナイフにより前記接着剤の一部を除去し、前記表面実装デバイスの実装構造体を加熱して、前記接着剤を軟化させると同時に、前記はんだを溶融させ、前記接着剤が軟化し、前記はんだが溶融した状態で、プリント基板から表面実装デバイスを剥がし、前記プリント基板を整地する。この方法により、プリント基板を整地する際に、接着剤の残渣は、箔ランド、または局部レジスト上に位置しているので、プリント基板を損傷させることなくリペアを行うことができる。   A surface mount device mounting structure repair method according to the present invention is a surface mount device mounting structure repair method described above, wherein a heat knife heated to a predetermined temperature is used. A part of the adhesive is removed, and the mounting structure of the surface mount device is heated to soften the adhesive, and at the same time, the solder is melted, the adhesive is softened, and the solder is melted. In the state, the surface mount device is peeled off from the printed board, and the printed board is leveled. By this method, when the printed board is leveled, the adhesive residue is located on the foil land or the local resist, so that the repair can be performed without damaging the printed board.

本発明によれば、プリント基板に接着部を設け、接着部と表面実装デバイスとの間に接着剤を配置することにより、リペア作業時の半導体装置を引き剥がす際に、損傷を防止することが可能なプリント基板およびそのプリント基板を有する表面実装デバイスの実装構造体を提供することができる。   According to the present invention, by providing an adhesive portion on a printed circuit board and disposing an adhesive between the adhesive portion and the surface mount device, damage can be prevented when the semiconductor device is peeled off during repair work. It is possible to provide a possible printed circuit board and a mounting structure for a surface mount device having the printed circuit board.

（実施の形態１）
図１は、本発明の実施の形態１に係る表面実装デバイスの実装構造体１ａの構成を示す平面図である。プリント基板２ａ上に接着剤４を介して表面実装デバイス３が配置されている。図２は、プリント基板２ａの構成を示す平面図である。プリント基板２ａの表面実装デバイス３が実装される実装領域には、例えば銅で形成されたランド５が配置されている。実装領域の四隅の外側に、例えば銅で形成された接着ランド６が配置されている。 (Embodiment 1)
FIG. 1 is a plan view showing a configuration of a surface mounting device mounting structure 1a according to Embodiment 1 of the present invention. The surface mount device 3 is disposed on the printed circuit board 2a with the adhesive 4 interposed therebetween. FIG. 2 is a plan view showing the configuration of the printed circuit board 2a. A land 5 made of, for example, copper is disposed in a mounting region where the surface mounting device 3 is mounted on the printed circuit board 2a. Adhesive lands 6 made of copper, for example, are arranged outside the four corners of the mounting area.

図３は、図１における表面実装デバイスの実装構造体１ａのＡ−Ａ断面図である。プリント基板２ａは、ランド５と、接着ランド６（箔状ランド）と、絶縁基板１１と、レジスト１２とを有する。絶縁基板１１は、エポキシ樹脂などの絶縁基材で形成されている。絶縁基板１１の内部には、多層化された配線が敷設されている。絶縁基板１１の表面上には、ランド５および接着ランド６が配置されている。ランド５は、絶縁基板１１に敷設された配線（図示せず）に接続されている。レジスト１２は、ランド５、接着ランド６が形成されていない領域の絶縁基板１１上に配置されている。接着ランド６は前記配線（図示せず）には接続されず独立したランドとして形成されている。レジスト１２は、絶縁基板１１の表面に敷設された配線と外部との絶縁性を確保するために設けられている。   3 is a cross-sectional view of the surface mounting device mounting structure 1a in FIG. The printed circuit board 2 a includes lands 5, adhesive lands 6 (foil-like lands), an insulating substrate 11, and a resist 12. The insulating substrate 11 is formed of an insulating base material such as an epoxy resin. Multi-layered wiring is laid inside the insulating substrate 11. On the surface of the insulating substrate 11, lands 5 and adhesive lands 6 are arranged. The land 5 is connected to wiring (not shown) laid on the insulating substrate 11. The resist 12 is disposed on the insulating substrate 11 in a region where the land 5 and the adhesive land 6 are not formed. The adhesion land 6 is formed as an independent land without being connected to the wiring (not shown). The resist 12 is provided to ensure the insulation between the wiring laid on the surface of the insulating substrate 11 and the outside.

表面実装デバイス３は、底面にプリント基板２ａと電気的に接続するための接続端子が設けられた表面実装型ＩＣパッケージ、例えば、ＢＧＡ型やＬＧＡ型のＣＳＰによりパッケージ化されている。表面実装デバイス３に設けられた接続端子（図示せず）は、絶縁基板１１上に形成されたランド５とはんだボール１３を介して接続されている。   The surface mount device 3 is packaged by a surface mount IC package, for example, a BGA type or LGA type CSP, in which connection terminals for electrical connection to the printed circuit board 2a are provided on the bottom surface. Connection terminals (not shown) provided on the surface mount device 3 are connected to lands 5 formed on the insulating substrate 11 via solder balls 13.

接着剤４は、例えば熱硬化性樹脂であり、接着ランド６上に配置されて表面実装デバイス３の四隅と接着している。接着剤４は、接着ランド６上以外には形成されておらず、レジスト１２とは接着していない。表面実装デバイス３の四隅と接着することにより、プリント基板２ａに実装された表面実装デバイス３の接合性を補強している。特に、四隅を補強することにより、落下衝撃などの動的な力に対して有効である。   The adhesive 4 is, for example, a thermosetting resin, and is disposed on the adhesive land 6 and adhered to the four corners of the surface mount device 3. The adhesive 4 is not formed except on the adhesive land 6 and is not bonded to the resist 12. By adhering to the four corners of the surface mount device 3, the bondability of the surface mount device 3 mounted on the printed board 2a is reinforced. In particular, reinforcing the four corners is effective against dynamic forces such as drop impacts.

次に、表面実装デバイスの実装構造体１ａのリペア方法について説明する。表面実装デバイスの実装構造体１ａの製造時において、プリント基板２ａに実装された表面実装デバイス３が不良であることを発見した場合に、プリント基板２ａから不良の表面実装デバイス３を外し、新たな表面実装デバイス３をプリント基板２ａに実装する。図４Ａ〜図４Ｆは、表面実装デバイスの実装構造体１ａのリペア方法の工程を示す図１におけるＡ−Ａ断面図である。   Next, a method for repairing the mounting structure 1a of the surface mounting device will be described. When the surface mount device 3 mounted on the printed board 2a is found to be defective during the manufacture of the surface mount device mounting structure 1a, the defective surface mount device 3 is removed from the print board 2a, and a new The surface mount device 3 is mounted on the printed circuit board 2a. 4A to 4F are cross-sectional views taken along the line AA in FIG. 1 showing the steps of the method for repairing the mounting structure 1a of the surface-mounted device.

まず、図４Ａに示すように、表面実装デバイスの実装構造体１ａの接着剤４をヒートナイフにより、取り除く。この際、接着剤４が接着ランド６上にあるため、ヒートナイフによりプリント基板２ａを損傷させずに、接着剤４を取り除くことができる。図４Ｂに示すように、接着剤４は完全に取り除けなくてもよい。つぎに、表面実装デバイスの実装構造体を接着剤４が軟化し、かつはんだボール１３が溶融する温度まで加熱する。加熱する方法は、例えば表面実装デバイス３の表面に、ヒータツールを当てて加熱する。ヒータツールは、熱源を有し、表面実装デバイス３と接触する部分に金属のような熱伝導性の高い材料が配置された治具である。また、非接触の加熱方法としては赤外線加熱、熱風加熱を用いることができる。   First, as shown in FIG. 4A, the adhesive 4 of the surface mounting device mounting structure 1a is removed with a heat knife. At this time, since the adhesive 4 is on the adhesive land 6, the adhesive 4 can be removed without damaging the printed circuit board 2a by the heat knife. As shown in FIG. 4B, the adhesive 4 may not be completely removed. Next, the mounting structure of the surface mount device is heated to a temperature at which the adhesive 4 is softened and the solder balls 13 are melted. As a heating method, for example, the surface of the surface mount device 3 is heated by applying a heater tool. The heater tool is a jig having a heat source and a material having a high thermal conductivity such as a metal disposed in a portion in contact with the surface mount device 3. As a non-contact heating method, infrared heating or hot air heating can be used.

はんだボール１３が溶融すると、つぎに、図４Ｃに示すように、プリント基板２ａから表面実装デバイス３を剥がし、取り除く。このとき、接着剤４は軟化しており、プリント基板２ａから表面実装デバイス３を剥がすと、接着剤４が延び、接着剤４自身が切れる。そして、一部が表面実装デバイス３に接着し、残りが接着ランド６上に残る。   When the solder balls 13 are melted, next, as shown in FIG. 4C, the surface mount device 3 is peeled off from the printed board 2a and removed. At this time, the adhesive 4 is softened, and when the surface mount device 3 is peeled off from the printed board 2a, the adhesive 4 extends and the adhesive 4 itself is cut. And a part adhere | attaches on the surface mount device 3, and the remainder remains on the adhesion land 6. FIG.

つぎに、図４Ｄに示すように、接着ランド６上の接着剤４を取り除き、プリント基板１ａを整地する。この工程では、接着剤４は金属の接着ランド６上に残っているので、ナイフやピンセットなどの工具を用いて接着剤４を取り除いても、プリント基板２ａのレジスト１２や配線などを傷つけることがない。このため、質の高いリペア作業を行うことができる。ランド５上のはんだ残渣はソルダーウィック（はんだ吸取り線）等で平滑整地する。   Next, as shown in FIG. 4D, the adhesive 4 on the adhesive land 6 is removed, and the printed circuit board 1a is leveled. In this step, since the adhesive 4 remains on the metal adhesive land 6, even if the adhesive 4 is removed using a tool such as a knife or tweezers, the resist 12 and the wiring of the printed circuit board 2a may be damaged. Absent. For this reason, high-quality repair work can be performed. The solder residue on the land 5 is smoothed with a solder wick (solder absorption line) or the like.

つぎに、図４Ｅに示すように、クリームはんだ印刷により、クリームはんだ１４をランド５上に印刷する。つぎに、図４Ｆに示すように、クリームはんだ１４が印刷されたプリント基板２ａ上に、はんだボール１３がクリームはんだ１４と接触するように新たな表面実装デバイス３を載置する。つぎに、加熱してはんだ溶融し、冷却固化することによりプリント基板２ａに表面実装デバイス３が実装される。   Next, as shown in FIG. 4E, the cream solder 14 is printed on the lands 5 by cream solder printing. Next, as shown in FIG. 4F, a new surface mount device 3 is placed on the printed circuit board 2 a on which the cream solder 14 is printed so that the solder balls 13 are in contact with the cream solder 14. Next, the surface mounting device 3 is mounted on the printed circuit board 2a by heating, melting the solder, and solidifying by cooling.

つぎに、図４Ａに示すように、接着ランド６と表面実装デバイス３の四隅との間に接着剤４を塗布する。つぎに、加熱炉に表面実装デバイスの実装構造体を入れ、接着剤１４を加熱硬化固定する。接着剤１４の硬化条件にあわせて加熱するが部品への熱影響を考慮すると１５０℃以下がより好ましい。以上の工程により、表面実装デバイスの実装構造体１ａのリペアが完了する。   Next, as shown in FIG. 4A, the adhesive 4 is applied between the adhesive lands 6 and the four corners of the surface mount device 3. Next, the mounting structure of the surface mounting device is put in a heating furnace, and the adhesive 14 is fixed by heating. Although heating is performed in accordance with the curing conditions of the adhesive 14, 150 ° C. or less is more preferable in consideration of the thermal effect on the parts. The repair of the mounting structure 1a of the surface mount device is completed through the above steps.

次に、表面実装デバイスの実装構造体１ａの製造方法について、説明する。表面実装デバイスの実装構造体１ａの製造方法は、配線およびランドが形成されたプリント基板２ａを用意する。この後の工程は、リペア工程のクリームはんだ印刷工程以降の工程と基本工法として同様であり、以下の工程の説明は省略する。   Next, the manufacturing method of the mounting structure 1a of the surface mount device will be described. The manufacturing method of the mounting structure 1a of the surface mounting device prepares a printed circuit board 2a on which wirings and lands are formed. The subsequent processes are the same as the basic process after the cream solder printing process in the repair process, and the description of the following processes is omitted.

以上のように、本実施の形態に係る表面実装デバイスの実装構造体１ａでは、接着ランド６が配置され、接着ランド６上に接着剤４が配置され、接着ランド６上に配置された接着剤４により、表面実装デバイス３のプリント基板２ａへの実装が補強されている。     As described above, in the mounting structure 1 a of the surface mount device according to the present embodiment, the adhesive land 6 is disposed, the adhesive 4 is disposed on the adhesive land 6, and the adhesive disposed on the adhesive land 6. 4 reinforces the mounting of the surface mount device 3 on the printed circuit board 2a.

また、接着剤４は接着ランド６上に配置された構成により、リペア時の接着剤４を取り除く際に、接着ランド６は金属なので接着ランド６下部の絶縁基板１１および配線を損傷させることなくリペア作業を行うことができる。その結果、プリント基板を用いてリペア作業の高信頼性化と効率化が可能となり、リペア後の、表面実装デバイスの実装構造体におけるプリント基板との接続信頼性や衝撃信頼性が低下することを防ぐことができる。   Further, since the adhesive 4 is disposed on the adhesive land 6, the adhesive land 6 is made of metal when the adhesive 4 is repaired without repairing the insulating substrate 11 and the wiring below the adhesive land 6. Work can be done. As a result, it is possible to increase the reliability and efficiency of the repair work using the printed circuit board, and the reliability of the connection with the printed circuit board and the impact reliability of the mounting structure of the surface mount device after repair will be reduced. Can be prevented.

（実施の形態２）
図５は、本発明の実施の形態２に係る表面実装デバイスの実装構造体１ｂにおけるプリント基板２ｂの構成を示す平面図である。図６は、本実施の形態に係る表面実装デバイスの実装構造体１ｂの断面図である。なお、本実施の形態に係る表面実装デバイスの実装構造体１ｂの平面図は、図１と同様であるので図示を省略する。 (Embodiment 2)
FIG. 5 is a plan view showing the configuration of the printed circuit board 2b in the mounting structure 1b of the surface mount device according to the second embodiment of the present invention. FIG. 6 is a cross-sectional view of the surface mount device mounting structure 1b according to the present embodiment. The plan view of the mounting structure 1b of the surface mount device according to the present embodiment is the same as FIG.

本実施の形態に係る表面実装デバイスの実装構造体１ｂは、実施の形態１に係る表面実装デバイスの実装構造体１ａの接着ランド６上にカバーレジスト２１を配置した構成である。なお、実施の形態１と同様、接着剤４は、カバーレジスト２１上以外には形成されておらず、レジスト１２とは接着していない。本実施の形態に係る表面実装デバイスの実装構造体１ｂにおいて、表面実装デバイスの実装構造体１ａと同一の構成要素については、同一の符号を付して説明を省略する。   The surface mounting device mounting structure 1b according to the present embodiment has a configuration in which a cover resist 21 is disposed on the adhesive land 6 of the surface mounting device mounting structure 1a according to the first embodiment. As in the first embodiment, the adhesive 4 is not formed except on the cover resist 21 and is not bonded to the resist 12. In the surface mount device mounting structure 1b according to the present embodiment, the same components as those of the surface mount device mounting structure 1a are denoted by the same reference numerals, and the description thereof is omitted.

また、表面実装デバイスの実装構造体１ｂのリペア工程も、表面実装デバイスの実装構造体１ａのリペア工程と同様であるので、説明を省略する。   Further, the repair process of the surface mounting device mounting structure 1b is the same as the repair process of the surface mounting device mounting structure 1a, and thus the description thereof is omitted.

カバーレジスト２１は、レジスト１２と同じ材料を用いることができる。この構成では、絶縁基板１１上に敷設された配線上のレジスト１２に接着剤４が接着された従来の構成と、金属、レジストおよび接着剤の積層構造である点が同じである。このため、従来の表面実装デバイスの実装構造体と同様の単位面積当たりの接着力を有し、新たに接着力検査を行うことなく接着剤の塗布面積などの設計を行うことができる。   The same material as the resist 12 can be used for the cover resist 21. This configuration is the same as the conventional configuration in which the adhesive 4 is bonded to the resist 12 on the wiring laid on the insulating substrate 11 and a laminated structure of metal, resist and adhesive. For this reason, it has the adhesive force per unit area similar to the mounting structure of the conventional surface mount device, and can design the application area etc. of an adhesive agent, without newly performing an adhesive force test | inspection.

接着材４により、接着ランド６とカバーレジスト２１とを引き離す力が加わった際に、接着ランド６からカバーレジスト２１が剥がされる力より、接着剤４自身が途中で切れる力の方が小さい場合には、表面実装デバイスの実装構造体１ｂのリペア工程において、表面実装デバイス３をプリント基板２ｂから剥がす工程の際に、接着剤４が途中で切れる。この場合は、実施の形態１と同様の工程により、リペアを行うことができる。   When a force for separating the adhesive land 6 and the cover resist 21 is applied by the adhesive 4, the force at which the adhesive 4 itself is cut halfway is smaller than the force for peeling the cover resist 21 from the adhesive land 6. In the process of repairing the mounting structure 1b of the surface mount device, the adhesive 4 is cut off during the process of peeling the surface mount device 3 from the printed board 2b. In this case, repair can be performed by the same process as in the first embodiment.

一方、接着ランド６からカバーレジスト２１が剥がされる力より、接着剤４自身が途中で切れる力の方が大きい場合には、表面実装デバイス３を剥がす際に、カバーレジスト２１と接着ランド６との間が離れて、表面実装デバイス３に接着剤４およびカバーレジスト２１が付いた状態となる。この場合でも、レジスト１２及び配線には、なんら損傷がないため、後の工程により、接着ランド６にカバーレジスト２１を再配置することにより、リペアを行うことができる。   On the other hand, when the force that the adhesive 4 itself cuts halfway is larger than the force that peels the cover resist 21 from the adhesive land 6, when the surface mount device 3 is peeled off, The surface is separated and the surface mount device 3 is in a state where the adhesive 4 and the cover resist 21 are attached. Even in this case, since the resist 12 and the wiring are not damaged at all, the repair can be performed by rearranging the cover resist 21 on the adhesive land 6 in a later step.

以上のように、本実施の形態に係る表面実装デバイスの実装構造体１ｂでは、絶縁基板１１上に接着ランド６とカバーレジスト２１との積層体が配置され、カバーレジスト２１上に接着剤４が配置されている。カバーレジスト２１上に配置された接着剤４により、表面実装デバイス３のプリント基板２ｂへの実装が補強されている。   As described above, in the surface mount device mounting structure 1b according to the present embodiment, the laminate of the adhesive land 6 and the cover resist 21 is disposed on the insulating substrate 11, and the adhesive 4 is provided on the cover resist 21. Is arranged. The mounting of the surface mount device 3 on the printed circuit board 2b is reinforced by the adhesive 4 arranged on the cover resist 21.

また、絶縁基板１１と接着剤４との間に接着ランド６とカバーレジスト２１との積層体が配置された構成により、リペア時の接着剤４を取り除く際に、レジスト１２および配線を損傷させることなくリペア作業を行うことができる。その結果、プリント基板を用いてリペア作業の高信頼性化と効率化が可能となり、リペア後の、表面実装デバイスの実装構造体におけるプリント基板との接続信頼性や衝撃信頼性が低下することを防ぐことができる。   Further, the structure in which the laminated body of the adhesive land 6 and the cover resist 21 is disposed between the insulating substrate 11 and the adhesive 4 may damage the resist 12 and the wiring when removing the adhesive 4 at the time of repair. Repair work can be performed without any problems. As a result, it is possible to increase the reliability and efficiency of the repair work using the printed circuit board, and the reliability of the connection with the printed circuit board and the impact reliability of the mounting structure of the surface mount device after repair will be reduced. Can be prevented.

さらに、従来の配線上のレジストと同様に、上記積層体が金属とレジストとの積層体であるために、従来の構成の接着性のデータを、接着剤４のカバーレジスト２１への接着性のデータとしてそのまま用いることができ、新たに接着性の計測を行う手間を省くことができる。   Further, since the laminate is a laminate of a metal and a resist as in the conventional resist on the wiring, the adhesive data of the conventional configuration is used to determine the adhesiveness of the adhesive 4 to the cover resist 21. The data can be used as it is, and the labor for newly measuring the adhesiveness can be saved.

（実施の形態３）
図７は、本発明の実施の形態２に係る表面実装デバイスの実装構造体１ｃにおけるプリント基板２ｃの構成を示す平面図である。図８は、本実施の形態に係る表面実装デバイスの実装構造体１ｃの断面図である。なお、本実施の形態に係る表面実装デバイスの実装構造体１ｃの平面図は、図１と同様であるので省略する。 (Embodiment 3)
FIG. 7 is a plan view showing the configuration of the printed circuit board 2c in the surface mounting device mounting structure 1c according to the second embodiment of the present invention. FIG. 8 is a cross-sectional view of the surface mount device mounting structure 1c according to the present embodiment. A plan view of the mounting structure 1c of the surface mount device according to the present embodiment is the same as FIG.

本実施の形態に係る表面実装デバイスの実装構造体１ｃは、実施の形態１に係る表面実装デバイスの実装構造体１ａの接着ランド６に置き換わってレジスト１２とレジスト１２上に局部レジスト２２が配置されている。なお、実施の形態１と同様、接着剤４は、局部レジスト２２上以外には形成されておらず、レジスト１２とは接着していない。本実施の形態に係る表面実装デバイスの実装構造体１ｃにおいて、表面実装デバイスの実装構造体１ａと同一の構成要素については、同一の符号を付して説明を省略する。   The surface mount device mounting structure 1c according to the present embodiment is replaced with the adhesive land 6 of the surface mount device mounting structure 1a according to the first embodiment, and the resist 12 and the local resist 22 are arranged on the resist 12. ing. As in the first embodiment, the adhesive 4 is not formed except on the local resist 22 and is not bonded to the resist 12. In the surface mount device mounting structure 1c according to the present embodiment, the same components as those of the surface mount device mounting structure 1a are denoted by the same reference numerals, and the description thereof is omitted.

また、表面実装デバイスの実装構造体１ｃのリペア工程も、表面実装デバイスの実装構造体１ａのリペア工程と同様であるので、説明を省略する。   Further, the repair process of the surface mount device mounting structure 1c is the same as the repair process of the surface mount device mounting structure 1a, and thus the description thereof is omitted.

局部レジスト２２としては、シルクレジストを用いることができる。シルクレジストは、レジスト１２の色と異なる色のものが好ましい。   As the local resist 22, a silk resist can be used. The silk resist preferably has a color different from the color of the resist 12.

表面実装デバイスの実装構造体１ｃのリペア工程において、表面実装デバイス３をプリント基板２ｃから剥がす工程の際に、大部分の接着剤４が除去されているので、レジスト１２から局部レジスト２２を剥がす力が、接着剤４自身が途中で切れる力より強い。このため、表面実装デバイス３をプリント基板２ｃから剥がす際に、接着剤４が途中で切れる。この場合は、実施の形態１と同様の工程により、リペアを行うことができる。   In the process of repairing the surface mounting device mounting structure 1c, most of the adhesive 4 has been removed during the process of peeling the surface mounting device 3 from the printed circuit board 2c, so that the force to peel the local resist 22 from the resist 12 is removed. However, it is stronger than the force with which the adhesive 4 itself can be cut off. For this reason, when the surface mount device 3 is peeled off from the printed board 2c, the adhesive 4 is cut off halfway. In this case, repair can be performed by the same process as in the first embodiment.

また、リペア時のプリント基板２ｃから表面実装デバイス３を取り除いた後に、局部レジスト２２上に残った接着剤４をナイフなどで取り去る際に、局部レジスト２２にレジスト１２の色と異なる色が付いていると、接着剤４を取り除けたか否かが一目でわかる。このため、接着剤４の除去作業を行いすぎて、レジスト１２および配線に損傷を与えることを防ぐことができる。   Further, when the adhesive 4 remaining on the local resist 22 is removed with a knife after removing the surface mount device 3 from the printed circuit board 2c at the time of repair, the local resist 22 is colored differently from the color of the resist 12 If so, it can be seen at a glance whether or not the adhesive 4 has been removed. For this reason, it is possible to prevent the resist 12 and the wiring from being damaged by excessively removing the adhesive 4.

以上のように、本実施の形態に係る表面実装デバイスの実装構造体１ｃでは、レジスト１２上に局部レジスト２２が配置され、局部レジスト２２上に接着剤４が配置されている。局部レジスト２２上に配置された接着剤４により、表面実装デバイス３のプリント基板２ｃへの実装が補強されている。   As described above, in the surface mounting device mounting structure 1 c according to the present embodiment, the local resist 22 is disposed on the resist 12, and the adhesive 4 is disposed on the local resist 22. The mounting of the surface mounting device 3 on the printed circuit board 2c is reinforced by the adhesive 4 arranged on the local resist 22.

また、レジスト１２と接着剤４との間に局部レジスト２２が配置された構成により、リペア時の接着剤４を取り除く際に、レジスト１２および配線を損傷させることなくリペア作業を行うことができる。その結果、プリント基板を用いてリペア作業の高信頼性化と効率化が可能となり、リペア後の、表面実装デバイスの実装構造体におけるプリント基板との接続信頼性や衝撃信頼性が低下することを防ぐことができる。   Further, with the configuration in which the local resist 22 is disposed between the resist 12 and the adhesive 4, when removing the adhesive 4 at the time of repair, the repair operation can be performed without damaging the resist 12 and the wiring. As a result, it is possible to increase the reliability and efficiency of the repair work using the printed circuit board, and the reliability of the connection with the printed circuit board and the impact reliability of the mounting structure of the surface mount device after repair will be reduced. Can be prevented.

実施の形態１〜３においては、プリント基板２ａ〜２ｃにおける表面実装デバイスの実装領域の四隅の外側に、接着ランド６、カバーレジスト２１または、局部レジスト２２を配置する例を示した。しかし、本発明のプリント基板はこの構成に限定されない。図９〜図１２は、他の構成のプリント基板を示す平面図である。例えば、図９に示すように、接着ランド６ｂが表面実装デバイスの実装領域の四隅の外側以外に、実装領域における周辺の一部にも配置されていてもよい。さらに、図１０に示すように、接着ランド６ｃが表面実装デバイスの実装領域を完全に囲む形状にすることもできる。   In the first to third embodiments, the example in which the adhesive lands 6, the cover resist 21, or the local resist 22 are arranged outside the four corners of the mounting area of the surface mount device on the printed circuit boards 2 a to 2 c is shown. However, the printed circuit board of the present invention is not limited to this configuration. 9 to 12 are plan views showing printed circuit boards having other configurations. For example, as shown in FIG. 9, the adhesive lands 6 b may be arranged on a part of the periphery in the mounting area in addition to the outside of the four corners of the surface mounting device. Furthermore, as shown in FIG. 10, the adhesive land 6c can be formed to completely surround the mounting area of the surface mount device.

このように、接着ランド６、カバーレジスト２１または、局部レジスト２２を表面実装デバイスの実装領域の四隅の外側以外の領域にも設けることにより、表面実装デバイス３のプリント基板への補強（特に静的な力に対して）を行うことができる。   Thus, by providing the adhesive land 6, the cover resist 21 or the local resist 22 in regions other than the outside of the four corners of the surface mounting device mounting region, the surface mounting device 3 is reinforced (especially statically). Can be performed on

また、図１１に示す構成では、ランド５に、絶縁基板１１（図３参照）上に敷設された配線２３が接続され、表面実装デバイスの実装領域から外側へ延びている。接着ランド６ｂは、配線２３と接続しないように、配線２３の近傍部分が取り除かれている。   In the configuration shown in FIG. 11, the land 5 is connected to the wiring 23 laid on the insulating substrate 11 (see FIG. 3), and extends outward from the mounting region of the surface-mounted device. The adhesive land 6 b is removed in the vicinity of the wiring 23 so as not to be connected to the wiring 23.

また、図１２に示す構成では、ランド５に、絶縁基板１１上に敷設された配線２３が接続され、表面実装デバイスの実装領域から外側へ延びている。局部レジスト２２は、配線２３を跨ぐように配置されている。局部レジスト２２は絶縁性の材料により構成されているため、配線２３と接触しても影響を与えない。   In the configuration shown in FIG. 12, the land 5 is connected to the wiring 23 laid on the insulating substrate 11, and extends outward from the mounting region of the surface-mounted device. The local resist 22 is disposed so as to straddle the wiring 23. Since the local resist 22 is made of an insulating material, it does not affect the contact with the wiring 23.

図１１および図１２のように配線２３を配置することにより、プリント基板における配線の自由度を増すことができる。   By arranging the wiring 23 as shown in FIGS. 11 and 12, the degree of freedom of wiring on the printed circuit board can be increased.

なお、接着剤を塗布する対象は、接着ランド、カバーレジストおよび、局部レジスト２２以外であってもよい。   The target to which the adhesive is applied may be other than the adhesive land, the cover resist, and the local resist 22.

本発明の実装構造体は、プリント基板のレジストおよび配線に損傷を与えることなく、リペアを行うことができるという効果を有し、半導体装置のプリント基板への実装に利用可能である。   The mounting structure of the present invention has an effect that repair can be performed without damaging the resist and wiring of the printed circuit board, and can be used for mounting a semiconductor device on the printed circuit board.

本発明の実施の形態１に係る表面実装デバイスの実装構造体の構成を示す平面図The top view which shows the structure of the mounting structure of the surface mount device which concerns on Embodiment 1 of this invention 実施の形態１に係るプリント基板の構成を示す平面図The top view which shows the structure of the printed circuit board which concerns on Embodiment 1. 図１におけるＡ−Ａ断面図AA sectional view in FIG. 実施の形態１に係る表面実装デバイスの実装構造体のリペア工程を示す断面図Sectional drawing which shows the repair process of the mounting structure of the surface mount device which concerns on Embodiment 1 図４Ａのつぎの工程を示す断面図Sectional drawing which shows the next process of FIG. 4A 図４Ｂのつぎの工程を示す断面図Sectional drawing which shows the next process of FIG. 4B 図４Ｃのつぎの工程を示す断面図Sectional drawing which shows the process following FIG. 4C 図４Ｄのつぎの工程を示す断面図Sectional drawing which shows the next process of FIG. 4D 図４Ｅのつぎの工程を示す断面図Sectional drawing which shows the process following FIG. 4E 本発明の実施の形態２に係るプリント基板の構成を示す平面図The top view which shows the structure of the printed circuit board concerning Embodiment 2 of this invention. 実施の形態２に係る表面実装デバイスの実装構造体の断面図Sectional drawing of the mounting structure of the surface mount device concerning Embodiment 2 本発明の実施の形態３に係るプリント基板の構成を示す平面図The top view which shows the structure of the printed circuit board concerning Embodiment 3 of this invention. 実施の形態３に係る表面実装デバイスの実装構造体の断面図Sectional drawing of the mounting structure of the surface mount device concerning Embodiment 3 本発明のプリント基板の構成を示す平面図The top view which shows the structure of the printed circuit board of this invention 本発明のプリント基板の構成を示す平面図The top view which shows the structure of the printed circuit board of this invention 本発明のプリント基板の構成を示す平面図The top view which shows the structure of the printed circuit board of this invention 本発明のプリント基板の構成を示す平面図The top view which shows the structure of the printed circuit board of this invention 従来の表面実装デバイスの実装構造体の構成を示す断面図Sectional drawing which shows the structure of the mounting structure of the conventional surface mount device 従来の表面実装デバイスの実装構造体のリペア方法において、プリント基板から表面実装デバイスを引き剥がす工程を示す断面図Sectional drawing which shows the process of peeling a surface mounting device from a printed circuit board in the repair method of the mounting structure of the conventional surface mounting device

符号の説明Explanation of symbols

１ａ、１ｂ、１ｃ 表面実装デバイスの実装構造体
２ａ、２ｂ、２ｃ プリント基板
３ 表面実装デバイス
４ 接着剤
５ ランド
６、６ｂ、６ｃ 接着ランド
１１ 絶縁基板
１２ レジスト
１３ はんだボール
１４ クリームはんだ
２１ カバーレジスト
２２ 局部レジスト
２３ 配線 1a, 1b, 1c Surface mount device mounting structures 2a, 2b, 2c Printed circuit board 3 Surface mount device 4 Adhesive 5 Land 6, 6b, 6c Adhesive land 11 Insulating substrate 12 Resist 13 Solder ball 14 Cream solder 21 Cover resist 22 Local resist 23 wiring

Claims (7)

一主面に端子が配列され、表面実装デバイスが実装される実装領域と、
前記実装領域の周辺に配置され、前記表面実装デバイスを接着剤で接着する接着領域とを備え、
前記接着領域が箔状ランドまたは局部レジストであるプリント基板。 A mounting area where terminals are arranged on one main surface and a surface mount device is mounted;
An adhesive region that is disposed around the mounting region and adheres the surface mount device with an adhesive;
A printed circuit board in which the adhesive region is a foil land or a local resist. 前記箔状ランドは、レジストで覆われた請求項１記載のプリント基板。   The printed circuit board according to claim 1, wherein the foil land is covered with a resist. 前記局部レジストは、当該プリント基板のレジスト上に配置された請求項１に記載のプリント基板。   The printed circuit board according to claim 1, wherein the local resist is disposed on the resist of the printed circuit board. 請求項１〜３のいずれか１項に記載のプリント基板と、
前記プリント基板の実装領域にはんだにより実装された表面実装デバイスと、
前記プリント基板の接着領域に配置され、前記表面実装デバイスを前記プリント基板に固着させる接着剤とを備えている表面実装デバイスの実装構造体。 The printed circuit board according to any one of claims 1 to 3,
A surface mount device mounted by solder on the mounting area of the printed circuit board;
A mounting structure for a surface mounting device, comprising: an adhesive disposed in an adhesion region of the printed circuit board and fixing the surface mounting device to the printed circuit board. 前記接着剤としては、加熱されることにより軟化する素材を用いた請求項４に記載の表面実装デバイスの実装構造体。   The surface-mount device mounting structure according to claim 4, wherein a material that softens when heated is used as the adhesive. 請求項４または５に記載の表面実装デバイスの実装構造体の製造方法であって、
前記表面実装デバイスを前記プリント基板の実装領域にはんだ付けし、
前記接着領域と前記表面実装デバイスの外周縁との間に接着剤を塗布し、
前記接着剤を加熱硬化させる表面実装デバイスの実装構造体の製造方法。 A method for manufacturing a mounting structure of a surface-mounted device according to claim 4 or 5,
Solder the surface mount device to the mounting area of the printed circuit board;
Applying an adhesive between the adhesive region and the outer periphery of the surface mount device;
A method for manufacturing a mounting structure of a surface mounting device, wherein the adhesive is heated and cured. 請求項４または５に記載の表面実装デバイスの実装構造体のリペア方法であって、
所定の温度に加熱されたヒートナイフにより前記接着剤の一部を除去し、
前記表面実装デバイスの実装構造体を加熱して、前記接着剤を軟化させると同時に、前記はんだを溶融させ、
前記接着剤が軟化し、前記はんだが溶融した状態で、プリント基板から表面実装デバイスを剥がし、
前記プリント基板を整地する表面実装デバイスの実装構造体のリペア方法。 A method for repairing a mounting structure of a surface-mounted device according to claim 4 or 5,
Removing a part of the adhesive with a heat knife heated to a predetermined temperature;
Heating the mounting structure of the surface mount device to soften the adhesive and simultaneously melt the solder;
With the adhesive softened and the solder melted, the surface mount device is peeled off from the printed circuit board,
A method for repairing a mounting structure of a surface mounting device for leveling the printed circuit board.
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JP2017203709A (en) * 2016-05-12 2017-11-16 株式会社東海理化電機製作所 Module and method for manufacturing the same
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JP2017203709A (en) * 2016-05-12 2017-11-16 株式会社東海理化電機製作所 Module and method for manufacturing the same
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