CN104050445B - Fingerprint identification device, the packaging method of fingerprint identification device and intelligent terminal - Google Patents
Fingerprint identification device, the packaging method of fingerprint identification device and intelligent terminal Download PDFInfo
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- CN104050445B CN104050445B CN201410138447.5A CN201410138447A CN104050445B CN 104050445 B CN104050445 B CN 104050445B CN 201410138447 A CN201410138447 A CN 201410138447A CN 104050445 B CN104050445 B CN 104050445B
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- flexible pcb
- fingerprint
- metal
- induction chip
- identification device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The present invention provides the packaging method and intelligent terminal of a kind of fingerprint identification device, fingerprint identification device, wherein fingerprint identification device includes：Fingerprint induction chip, the first flexible PCB, the second flexible PCB, metal solder sphere and metal shell；Wherein, the fingerprint induction chip includes several pins, and the fingerprint induction chip is welded on by several pins on the first flexible PCB；Second flexible PCB is fixed and is electrically connected with first flexible PCB by the metal solder sphere, and the fingerprint induction chip is fixed between first flexible PCB and the second flexible PCB；The fingerprint induction chip, the first flexible PCB, the second flexible PCB and metal solder sphere are encapsulated in metal shell.Fingerprint identification device provided by the invention, the packaging method of fingerprint identification device and intelligent terminal can improve the intensity of fingerprint identification device, to extend the service life of mobile terminal.
Description
Technical field
The present invention relates to the encapsulation sides of fingerprint identification technology more particularly to a kind of fingerprint identification device, fingerprint identification device
Method and intelligent terminal.
Background technology
Fingerprint identification technology is a kind of biological detection that the arrangement feature of valley and a ridge in human finger's fingerprint is identified
Technology has been widely used in the various fields for needing progress authentication, such as：Fingerprint gate lock, using fingerprint recognition into
Row opens the mobile terminal etc. of operation.
The fingerprint identification device generally use capacitive induction device that fingerprint identification technology is applied carrys out the feature to fingerprint
Incuded, and generates corresponding electric signal and be sent to processor progress feature recognition.Existing fingerprint identification device usually wraps
Including the components such as lens, button, basic ring, fingerprint Identification sensor, flexible member and support plate, wherein basic ring is used to that lens to be clamped,
The fingerprint identification device is the packaged type stacked gradually using basic ring, button, fingerprint recognition sensing flexible member and support plate,
Its encapsulating structure and packaging technology are more complex, affect the encapsulation yield of product, thereby reduce the quality of product.
Invention content
The present invention provides the packaging method and intelligent terminal of a kind of fingerprint identification device, fingerprint identification device, can simplify
The structure of device, and simplify encapsulating structure and packaging technology.
The embodiment of the present invention provides a kind of fingerprint identification device, including：Fingerprint induction chip, the first flexible PCB,
Two flexible PCBs, metal solder sphere and metal shell；Wherein,
The fingerprint induction chip includes several pins, and the fingerprint induction chip is welded on by several pins
On one flexible PCB；
Second flexible PCB is fixed and is electrically connected with first flexible PCB by the metal solder sphere,
The fingerprint induction chip to be fixed between first flexible PCB and the second flexible PCB；
The fingerprint induction chip, the first flexible PCB, the second flexible PCB and metal solder sphere are encapsulated in metal
In shell.
The fingerprint induction chip includes semiconductor wafer and is arranged in the semiconductor die in one of the embodiments,
The fingerprint sensing element of on piece；
The output end of the fingerprint sensing element is as several pins.
The fingerprint induction chip is connected by metal coupling and first flexible PCB in one of the embodiments,
It connects；
One end of the metal coupling is fixed on the semiconductor die on piece, and draws with described the several of fingerprint sensing element
Foot connects, and the other end is fixed on first flexible PCB, and is electrically connected with first flexible PCB.
The metal solder sphere includes in one of the embodiments,：Upper circuit board, lower circuit board and metal ball；
The upper circuit board is welded on first flexible PCB, and the lower welding circuit board is flexible described second
On circuit board, the metal ball respectively with the upper circuit board and lower welding circuit board.
Buffering adhesive is filled between the fingerprint induction chip and the second flexible PCB in one of the embodiments,
Body.
Megohmite insulant is filled between the fingerprint induction chip and the metal shell in one of the embodiments,.
The metal shell includes shell and capping in one of the embodiments,；
First flexible PCB is fixed on the top of the shell；
The capping is fixed on second flexible PCB, and with the case weld.
The metal coupling includes the aluminium block, gold bullion and block tin being stacked in one of the embodiments,；
The aluminium block is fixed on the semiconductor die on piece, and the block tin is welded on first flexible PCB.
Another embodiment of the present invention provides a kind of packaging method of fingerprint identification device, and the fingerprint identification device includes referring to
Line induction chip, the first flexible PCB, the second flexible PCB, metal solder sphere and metal shell；The packaging method packet
It includes：
Fingerprint induction chip is welded on by several pins in the fingerprint induction chip on the first flexible PCB；
First flexible PCB is fixed on by metal solder sphere on the second flexible PCB, and with described second
Flexible PCB is electrically connected；
The fingerprint induction chip, the first flexible PCB, the second flexible PCB and metal solder sphere are encapsulated in institute
It states in metal shell.
The fingerprint induction chip includes semiconductor wafer and is arranged in the semiconductor die in one of the embodiments,
The fingerprint sensing element of on piece；
The output end of the fingerprint sensing element is as several pins.
Fingerprint induction chip is welded by several pins in the fingerprint induction chip in one of the embodiments,
On the first flexible PCB, including：
Metal coupling is formed in the semiconductor die on piece, the metal coupling draws with described the several of fingerprint sensing element
Foot connects；
The metal coupling is fixed on first flexible PCB, and is electrically connected with first flexible PCB
It connects.
The metal solder sphere includes in one of the embodiments,：Upper circuit board, lower circuit board and metal ball；
First flexible PCB is fixed on by metal solder sphere on the second flexible PCB, and with described second
Flexible PCB is electrically connected, including：
The upper circuit board is welded on first flexible PCB；
By the lower welding circuit board on second flexible PCB；
The metal ball is welded with the upper circuit board and second circuit board respectively.
The packaging method of fingerprint identification device further includes in one of the embodiments,：
The filling buffering colloid between the fingerprint induction chip and the second flexible PCB.
The packaging method of fingerprint identification device further includes in one of the embodiments,：
Megohmite insulant is filled between the fingerprint sensing element and the metal shell.
The metal shell includes shell and capping in one of the embodiments,；
The fingerprint induction chip, the first flexible PCB, the second flexible PCB and metal solder sphere are encapsulated in institute
It states in metal shell, including：
First flexible PCB is fixed on to the top of the shell；
The capping is fixed on second flexible PCB；
By the capping and the case weld.
Further embodiment of this invention provides a kind of intelligent terminal, including fingerprint identification device as described above.
Technical solution provided in an embodiment of the present invention is adopted by the way that fingerprint induction chip to be fixed on the first flexible PCB
Electrical connection is fixed and realized to first flexible PCB and the second flexible PCB by metal welding ball, and fingerprint is then incuded core
Piece, the first flexible PCB, the second flexible PCB and metal solder sphere overall package simplify encapsulation knot in metal shell
Structure and packaging technology, improve the encapsulation yield of product, and then improve the quality of product.
Description of the drawings
Fig. 1 is the structural schematic diagram for the fingerprint identification device that the embodiment of the present invention one provides；
Fig. 2 is the flow chart of the packaging method of fingerprint identification device provided by Embodiment 2 of the present invention；
Fig. 3 is the structural schematic diagram that fingerprint sensing element is formed in packaging method provided by Embodiment 2 of the present invention；
Fig. 4 is the structural schematic diagram that metal coupling is formed in packaging method provided by Embodiment 2 of the present invention；
Fig. 5 is to fix the structural schematic diagram after the first flexible PCB in packaging method provided by Embodiment 2 of the present invention；
Fig. 6 is the structural schematic diagram that fixed colloid is formed in packaging method provided by Embodiment 2 of the present invention；
Fig. 7 is the structural schematic diagram that insulation colloid is formed in packaging method provided by Embodiment 2 of the present invention；
Fig. 8 is the structural schematic diagram that buffering colloid is formed in packaging method provided by Embodiment 2 of the present invention；
Fig. 9 is the structural schematic diagram that metal ball is formed in packaging method provided by Embodiment 2 of the present invention；
Figure 10 is that first flexible PCB and the second flexible PCB connect in packaging method provided by Embodiment 2 of the present invention
Structural schematic diagram before connecing；
Figure 11 is that first flexible PCB and the second flexible PCB connect in packaging method provided by Embodiment 2 of the present invention
Structural schematic diagram after connecing；
Figure 12 is the structural schematic diagram one of package metals shell in packaging method provided by Embodiment 2 of the present invention；
Figure 13 is the structural schematic diagram two of package metals shell in packaging method provided by Embodiment 2 of the present invention；
Figure 14 is the structural schematic diagram of fixed capping in packaging method provided by Embodiment 2 of the present invention.
Reference numeral：
1- fingerprint induction chips；The first flexible PCBs of 2-；The second flexible PCBs of 3-；
4- metal solder spheres；5- metal shells；11- semiconductor wafers；
12- fingerprint sensing elements；13- metal couplings；The upper circuit boards of 41-；
Circuit board under 42-；43- metal balls；51- shells；
52- is covered；53- is open；6- buffers colloid；
7- fixes colloid；8- insulation colloids；9- protects baffle；
The first gaps 14-；The radium-shine pads of 54-；131- aluminium blocks；
132- gold bullions；133- block tins.
Specific implementation mode
Fig. 1 is the structural schematic diagram of fingerprint identification device provided in an embodiment of the present invention.As shown in Figure 1, the fingerprint recognition
Device may include：Fingerprint induction chip 1, the first flexible PCB 2, the second flexible PCB 3, metal solder sphere 4 and metal
Shell 5.
Wherein, fingerprint induction chip 1 includes several pins, which is welded on first by several pins
On flexible PCB 2.Fingerprint induction chip 1 be used for in finger print ridge and paddy be identified, according to valley and a ridge in fingerprint
Arrangement and depth difference, fingerprint induction chip 1 generate induced current simultaneously exported by several pins.First flexible PCB
Hardware circuit is provided on 2, the input terminal pin of hardware circuit is correspondingly connected with several pins on fingerprint induction chip 1, is used
It is identified and transmits in the induced current sent out to fingerprint induction chip 1.
Second flexible PCB 3 is fixed and is electrically connected with the first flexible PCB 2 by metal solder sphere 4, by fingerprint
Induction chip 1 is fixed between the first flexible PCB 2 and the second flexible PCB 3.One function of metal solder sphere 4 is to use
It is to realize the first flexible PCB 2 and second in supporting the first flexible PCB 2 and the second flexible PCB 3, another function
The quantity of the electrical connection of flexible PCB 3, metal solder sphere 4 can be multiple, be used for transmission different electric signals.
Fingerprint induction chip 1, the first flexible PCB 2, the second flexible PCB 3 and metal solder sphere 4 are encapsulated in metal
In shell 5.Metal shell 5 can shield external interference, improve the accuracy of fingerprint recognition.
The structure of above-mentioned fingerprint identification device is relatively simple, and manufacturing process also simplifies many compared with the prior art,
It no longer needs multiple devices to be stacked, but two flexible PCBs is fixed to by metal solder sphere and kept electrical connection,
And between fingerprint induction chip is fixed on two flexible PCBs, above-mentioned component is encapsulated in metal shell, simplifies envelope
Assembling structure and packaging technology, improve the encapsulation yield of product, and then improve the quality of product.
The device of the wrinkle ridge of Fingers for identification and paddy commonly used in the prior art can be used in above-mentioned fingerprint induction chip 1.
The fingerprint sense that the fingerprint induction chip 1 that the present embodiment uses specifically includes semiconductor wafer 11 and is arranged on semiconductor wafer 11
Answer element 12, several pins of the output end of fingerprint sensing element 12 as fingerprint induction chip 1 above-mentioned.
Fingerprint sensing element 12 specifically may be provided on the first surface of semiconductor wafer 11, can be arranged in first surface
Center.It is performed etching in the first surface of semiconductor wafer 11 to be formed by etching technics commonly used in the prior art
The arranging rule of fingerprint sensing element 12, fingerprint sensing element 12 can be array format, or be other forms, the present embodiment
It does not limit.The semiconductor wafer 11 provided in the present embodiment can be used earth silicon material and be made, and thickness can be micro- 350
For rice between 650 microns, the appropriate thickness that increases can improve the intensity of semiconductor wafer 11.The output end of fingerprint sensing element 12
Multiple pins are formed, circuit connection corresponding with the first flexible PCB 2, for induced current to be transferred to the first flexible electrical
Road plate 2.
During the connection type of 1 and first flexible PCB 2 of above-mentioned fingerprint induction chip has very much, those skilled in the art can
It is designed according to actual structure.The present embodiment provides a kind of realization methods：Fingerprint induction chip 1 passes through metal coupling 13
It is connected to the first flexible PCB 2.According to the above-mentioned fingerprint induction being made of fingerprint sensing element 12 and semiconductor wafer 11
Chip 1, then one end of metal coupling 13 be fixed on semiconductor wafer 11, the other end is fixed on the first flexible PCB 2, and
And metal coupling 13 is connect with the corresponding line in fingerprint sensing element 12 and the first flexible PCB 2 respectively, will be referred to realizing
Line induction chip 1 is fixedly connected with the first flexible PCB 2, and realizes that fingerprint induction chip 1 and the first flexible PCB 2 are kept
Electrical connection.
The quantity of metal coupling 13 can be multiple, can be arranged in the both sides of fingerprint sensing element 12 respectively, arrange
Mode may be other forms, and the present embodiment does not limit.What multiple metal couplings 13 can export fingerprint sensing element 12
Electric signal is drawn, and is sent to the first flexible PCB 2.
To be used to support and fix the first flexible PCB 2 using 13 one side of metal coupling, on the other hand for realizing
Fingerprint sensing element 12 and the first flexible PCB 2 are kept into electrical connection, therefore in the material selection of metal coupling 13, this reality
Apply example and aluminium, Jin Hexi be respectively adopted, the block structure of thinner thickness is respectively prepared, the corresponding position of semiconductor wafer 11 according to
Secondary formation aluminium block, gold bullion and block tin.Wherein, the conductive capability of the lighter in weight of aluminium block, gold bullion is preferable, and block tin is welded in metal
There is stronger welding ability in field, be combined using three kinds of metal derbies, it can either be by metal coupling 13 and the first flexible electrical
Road plate 2 securely connects, and can reach preferable conductive effect.
In addition, on the one hand the function of the metal solder sphere 4 in above structure is to realize that the first flexible PCB 2 and second is soft
Property circuit board 3 secured connection, on the other hand be realize the first flexible PCB 2 and the second flexible PCB 3 electrical connection,
Concrete shape and structure can specifically be set by technical staff.The present embodiment provides a kind of realization methods that can refer to：
Metal solder sphere 4 includes：Upper circuit board 41, lower circuit board 42 and metal ball 43, wherein upper circuit board 41 is welded on
On first flexible PCB 2, and it is electrically connected with the first flexible PCB 2；Lower circuit board 42 is welded on the second flexible PCB 3
On, and be electrically connected with the second flexible PCB 3；Metal ball 43 is welded with upper circuit board 41 and lower circuit board 42 respectively, and real
It is now upper to be electrically connected between circuit board 41 and lower circuit board 42.
The quantity of metal solder sphere 4 may be multiple, be respectively used in the first flexible PCB 2 and the second flexible circuit
Different electric signals is transmitted between plate 3.Upper circuit board 41 is welded on the first flexible PCB 2, is on the one hand achieved a fixed connection
On the first flexible PCB 2, on the other hand with some connection in the first flexible PCB 2.Lower circuit board 42 welds
On the second flexible PCB 3, on the one hand achieve a fixed connection on the second flexible PCB 3, it is on the other hand flexible with second
Some connection in circuit board 3.Upper circuit board 41, lower circuit board 42 and the metal ball 43 of welding between are common real
Show and has transmitted electric signal between the first flexible PCB 2 and the second flexible PCB 3.
In addition, since fingerprint induction chip 1 is easy to be damaged by extraneous strenuous vibration, it can be in fingerprint induction chip
1 and the second buffering colloid 6 of filling between flexible PCB 3, it specifically can be opposite with first surface the in semiconductor wafer 11
Filling buffering colloid 6 between two surfaces and the second flexible PCB 3.The buffering colloid 6 may be used commonly used in the prior art
Shape is fixed and the preferable colloid of elasticity, in fingerprint induction chip 1 when by extraneous strenuous vibration to it into row buffering
Protection.
In order to make between fingerprint induction chip 1 and the first flexible PCB 2 more securely, viscosity can be coated between
Higher colloid, and dry solidification forms the fixation colloid 7 of stable structure.
Megohmite insulant, such as insulation colloid 8 can also be filled between fingerprint induction chip 1 and metal shell 5.Specifically may be used
Filled in the gap formed between fingerprint induction chip 1 and the first flexible PCB 2, and the first flexible PCB 2 with
It is filled between metal shell 5, the function of one side is protected to fingerprint induction chip 1, on the other hand can be by first
Flexible PCB 2 is fixed on the top of metal shell 5.The megohmite insulant can also be ceramic material, be filled in fingerprint induction core
In the gap formed between piece 1 and the first flexible PCB 2, for being protected to fingerprint induction chip 1.And in the first flexibility
Insulation colloid can be filled between circuit board 2 and metal shell 5, and the first flexible PCB 2 is fixed on to the top of metal shell 5
Portion.
Above-mentioned fingerprint induction chip 1, the first flexible PCB 2, the second flexible PCB 3 and metal solder sphere 4 is whole
It is encapsulated in metal shell 5, specifically, the metal shell 5 may include shell 51 and capping 52.First flexible PCB 2 is solid
It is scheduled on the top of shell 51, capping 52 is fixed on the second flexible PCB 3, and is welded with shell 51.Those skilled in the art
It should be understood that can the top center of metal shell 5 open up one opening 53, it is corresponding, in the first flexible PCB 2 with
The corresponding position of fingerprint induction chip 1 is also provided with perforation so that any conductive material is not present in the top of fingerprint induction chip 1
Matter.In addition, the surface of the insulation colloid 8 coated above fingerprint induction chip 1 need to carry out planarization Operation, protrusion is avoided the occurrence of
Or recess, to improve accuracy and the sensitivity of fingerprint recognition.
One end of second flexible PCB 3 passes through the side of metal shell 5, with the external treatment electricity in fingerprint identification device
Road connects, and is identified with the induced current sent out to fingerprint induction chip 1, and then to the arrangement of ridge and paddy in finger print
It is recognized.
Above-mentioned technical proposal, will using metal solder sphere by the way that fingerprint induction chip to be fixed on the first flexible PCB
First flexible PCB and the second flexible PCB are fixed and realize electrical connection, then by fingerprint induction chip, the first flexible electrical
Road plate, the second flexible PCB and metal solder sphere overall package simplify encapsulating structure and packaging technology in metal shell,
The encapsulation yield of product is improved, and then improves the quality of product.
Embodiment two
Fig. 2 is the flow chart of the packaging method of fingerprint identification device provided by Embodiment 2 of the present invention.The present embodiment is base
A kind of packaging method namely fingerprint identification device that the fingerprint identification device provided in above-described embodiment proposes include fingerprint sense
Answer chip 1, the first flexible PCB 2, the second flexible PCB 3, metal solder sphere 4 and metal shell 5.As shown in Fig. 2, the party
Method may include the following steps：
Fingerprint induction chip 1 is welded on the first flexible circuit by step 10 by several pins in fingerprint induction chip 1
On plate 2.
First flexible PCB 2 is fixed on by metal solder sphere 4 on the second flexible PCB 3 by step 20, and with
Two flexible PCBs 3 are electrically connected.
Step 30, by fingerprint induction chip 1,4 envelope of the first flexible PCB 2, the second flexible PCB 3 and metal solder sphere
In metal shell 5.
Specifically, in above-mentioned steps 10, fingerprint induction chip 1 may include semiconductor wafer 11 and be arranged in semiconductor die
Fingerprint sensing element 12 on piece 11, the output end of fingerprint sensing element 12 is as several pins.Therefore, fingerprint can be incuded member
Several pins in part 12 are welded on the first flexible PCB 2.
In step 10, the mode that fingerprint induction chip 1 is welded on on the first flexible PCB 2 can refer to following steps
It realizes：
Fig. 3 is the structural schematic diagram that fingerprint sensing element is formed in packaging method provided by Embodiment 2 of the present invention.Such as Fig. 3
It is shown, first, fingerprint sensing element 12 is formed on the first surface of semiconductor wafer 11.It is specific to can be used in the prior art often
Lithographic technique forms fingerprint sensing element 12, the present embodiment to the concrete structure and arrangement mode of fingerprint sensing element 12 simultaneously
It does not limit, those skilled in the art can set according to realization method commonly used in the prior art.
Fig. 4 is the structural schematic diagram that metal coupling is formed in packaging method provided by Embodiment 2 of the present invention.Such as Fig. 4 institutes
Show, metal coupling 13 is formed on semiconductor wafer 11, which connect with several pins of fingerprint sensing element 12.
Metal coupling 13 is that block structure is respectively prepared by three kinds of aluminium, gold, tin metals, the mode of metal deposit can be used, in semiconductor
On the first surface of chip 11, it is initially formed aluminium block 131 in the both sides of fingerprint sensing element 12, with reference to Fig. 3.Then in aluminium block 131
Top sequentially form gold bullion 132 and block tin 133, aluminium block 131, gold bullion 132 and block tin 133 are collectively as metal coupling 13.
Fig. 5 is to fix the structural schematic diagram after the first flexible PCB in packaging method provided by Embodiment 2 of the present invention.
As shown in figure 5, metal coupling 13 is fixed on the first flexible PCB 2, and it is electrically connected with the first flexible PCB 2.Specifically
First flexible PCB 2 can be welded on the block tin 133 in metal coupling 13.And according to fingerprint sensing element 12 and first
The circuit connecting relation set between flexible PCB 2 carries out circuit connection by metal coupling 13.
It is provided with the rectangle opening to match with the positions and dimensions of fingerprint sensing element 12 in first flexible PCB 2,
The sensitivity incuded with ensuring fingerprint sensing element 12 to fingerprint and accuracy.In order to be protected to fingerprint sensing element 12,
A block protection baffle 9 can be first fixed in rectangle opening herein, the material of the protection baffle 9 can be set by technical staff
It is fixed, select the material with certain mechanical strength.Between rectangle opening and fingerprint sensing element 12 in first flexible PCB 2
Form the first gap 14.
Fig. 6 is the structural schematic diagram that fixed colloid is formed in packaging method provided by Embodiment 2 of the present invention.Such as Fig. 6 institutes
Show, is filled in remaining region between semiconductor wafer 11 and the first flexible PCB 2 in addition to above-mentioned first gap 14 solid
Determine colloid 7.On the one hand the effect of fixed colloid 7 is to be protected to semiconductor wafer 11, prevent from damaging semiconductor because of vibration
On the other hand chip 11 is securely to connect semiconductor wafer 11 with the first flexible PCB 2.Fixed colloid 7 can be according to its work(
Common glue material in the art can be selected.
Fig. 7 is the structural schematic diagram that insulation colloid is formed in packaging method provided by Embodiment 2 of the present invention.Such as Fig. 7 institutes
Show, first removes the protection baffle 9 in the first flexible PCB 2, then filling insulation colloid 8, insulation in the first gap 14
Colloid 8 fills up the first gap 14, and can also be coated in the table at 5 top of metal shell to be fixed in the first flexible PCB 2
On face.In addition, the surface planarisation for the colloid 8 that also needs will to insulate, avoid the occurrence of it is raised or sunken, to touch insulation colloid in finger
The induction sensitivity and accuracy of fingerprint sensing element 12 are improved when 8.Above-mentioned insulation colloid 8 or ceramic material or other
Insulating materials, can be selected that intensity is higher and the material of resistance to scratch.
The distance on the structure formed using above step, wherein fingerprint sensing element 12 to 8 surface of insulation colloid can be small
In 50 microns, the distance of existing fingerprint identification device is much smaller than in the prior art, reduces the volume of fingerprint identification device,
The space occupied in intelligent terminal is reduced, is conducive to intelligent terminal and realizes ultrathin design.
In addition, in order to further be protected to fingerprint induction chip 1, it can be in fingerprint induction chip 1 and the second flexible electrical
Filling buffering colloid 6 between road plate 3.Therefore, before step 20, can buffering colloid 6 be formed in the second flexible electrical in advance
On road plate 3, as shown in figure 8, Fig. 8 is the structural representation for forming buffering colloid in packaging method provided by Embodiment 2 of the present invention
Figure.
Then step 20 is executed, i.e.,：First flexible PCB 2 is fixed on the second flexible circuit by metal solder sphere 4
On plate 3, and it is connect with the second flexible PCB electricity 3.
For metal solder sphere 4 include upper circuit board 41, lower circuit board 42 and metal ball 43 realization method, can respectively by
Upper circuit board 41 is soldered on the first flexible PCB 2, and is electrically connected with the first flexible PCB 2, as shown in Figure 7；By lower electricity
Road plate 42 is soldered on the second flexible PCB 3, as shown in Figure 8；Then one end of metal ball 43 and upper circuit board 41 are welded,
The other end is welded with lower circuit board 42, as shown in figure 9, Fig. 9 is to form metal in packaging method provided by Embodiment 2 of the present invention
The structural schematic diagram of ball.
Figure 10 is that first flexible PCB and the second flexible PCB connect in packaging method provided by Embodiment 2 of the present invention
Structural schematic diagram before connecing, Figure 11 are the first flexible PCB and second soft in packaging method provided by Embodiment 2 of the present invention
Property circuit board connection after structural schematic diagram.As shown in FIG. 10 and 11, by metal solder sphere 4 by upper circuit board 41 and lower circuit
Plate 42 is welded together, and realizes and is fixedly connected with the first flexible PCB 2 with the second flexible PCB 3.
After step 20, step 30 can perform.Fingerprint induction chip 1, the first flexible PCB 2, second is flexible
Circuit board 3 and metal solder sphere 4 are encapsulated in the inside of metal shell 5.Specifically, metal shell 5 includes shell 51 and capping 52.
The fingerprint induction chip 1 being fixedly connected, the first flexible PCB 2, the second flexible PCB 3 and metal solder sphere 4 are put
Enter in shell 51, the first flexible PCB 2 is towards the top of shell 51, and the glue coated by 2 surface of the first flexible PCB
Body bonds together with shell 51, so that the opening 53 that 1 face shell of fingerprint induction chip, 51 top is arranged.
Later, capping 52 is fixed on the second flexible PCB 3.Alternatively, during capping 52 can also be before the step of
It is just fixedly connected with the second flexible PCB 3, as shown in Figure 8.
Figure 12 is the structural schematic diagram one of package metals shell in packaging method provided by Embodiment 2 of the present invention, and Figure 12 shows
Go out fingerprint induction chip 1, the first flexible PCB 2, the second flexible PCB 3 and metal solder sphere 4 and is encapsulated in metal shell 5
Structural schematic diagram before inside.Figure 13 is that the structure of package metals shell in packaging method provided by Embodiment 2 of the present invention is shown
It is intended to two, Figure 13 and shows fingerprint induction chip 1,4 envelope of the first flexible PCB 2, the second flexible PCB 3 and metal solder sphere
Structural schematic diagram after 5 inside of metal shell.
Figure 14 is the structural schematic diagram of fixed capping in packaging method provided by Embodiment 2 of the present invention.As shown in figure 14,
Capping 52 and shell 51 are welded together, radium-shine welding may be used, radium-shine weldering is formed between capping 52 and shell 51
Contact 54.
Technical solution provided in this embodiment is by the way that fingerprint induction chip to be fixed on the first flexible PCB, using gold
Belong to solder sphere the first flexible PCB and the second flexible PCB are fixed and realize electrical connection, then by fingerprint induction chip,
First flexible PCB, the second flexible PCB and metal solder sphere overall package simplify encapsulating structure in metal shell
And packaging technology, the encapsulation yield of product is improved, and then improve the quality of product.
The present invention also provides a kind of realization method of intelligent terminal, which can be mobile phone, tablet computer, touch
Controlling equipment etc., the fingerprint identification device provided including above-described embodiment one.The fingerprint identification device is by by fingerprint
Induction chip is fixed on the first flexible PCB, using metal solder sphere by the first flexible PCB and the second flexible PCB
It fixes and realizes electrical connection, then by fingerprint induction chip, the first flexible PCB, the second flexible PCB and metal solder sphere
Overall package simplifies encapsulating structure and packaging technology in metal shell, improves the encapsulation yield of product, and then improves
The quality of product.
Finally it should be noted that：The above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Present invention has been described in detail with reference to the aforementioned embodiments for pipe, it will be understood by those of ordinary skill in the art that：Its according to
So can with technical scheme described in the above embodiments is modified, either to which part or all technical features into
Row equivalent replacement；And these modifications or replacements, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (14)
1. a kind of fingerprint identification device, which is characterized in that including：Fingerprint induction chip, the first flexible PCB, the second flexible electrical
Road plate, metal solder sphere and metal shell；Wherein,
The fingerprint induction chip includes several pins, and it is soft that the fingerprint induction chip by several pins is welded on first
On property circuit board；
Second flexible PCB is fixed and is electrically connected with first flexible PCB by the metal solder sphere, will
The fingerprint induction chip is fixed between first flexible PCB and the second flexible PCB；
The fingerprint induction chip, the first flexible PCB, the second flexible PCB and metal solder sphere are encapsulated in metal shell
It is interior；
Wherein, the metal solder sphere includes：Upper circuit board, lower circuit board and metal ball；The upper circuit board is welded on described
On first flexible PCB, the lower welding circuit board on second flexible PCB, the metal ball respectively with it is described
Upper circuit board and lower welding circuit board；
Further, the quantity of the metal solder sphere is multiple.
2. fingerprint identification device according to claim 1, which is characterized in that the fingerprint induction chip includes semiconductor die
Piece and the fingerprint sensing element in the semiconductor die on piece is set；
The output end of the fingerprint sensing element is as several pins.
3. fingerprint identification device according to claim 2, which is characterized in that the fingerprint induction chip passes through metal coupling
It is connect with first flexible PCB；
One end of the metal coupling is fixed on the semiconductor die on piece, and connects with several pins of the fingerprint sensing element
It connects, the other end is fixed on first flexible PCB, and is electrically connected with first flexible PCB.
4. fingerprint identification device according to claim 3, which is characterized in that the fingerprint induction chip and the second flexible electrical
Filled with buffering colloid between the plate of road.
5. fingerprint identification device according to claim 4, which is characterized in that outside the fingerprint induction chip and the metal
Megohmite insulant is filled between shell.
6. fingerprint identification device according to claim 5, which is characterized in that the metal shell includes shell and capping；
First flexible PCB is fixed on the top of the shell；
The capping is fixed on second flexible PCB, and with the case weld.
7. according to claim 3-6 any one of them fingerprint identification devices, which is characterized in that the metal coupling includes stacking
Aluminium block, gold bullion and the block tin of setting；
The aluminium block is fixed on the semiconductor die on piece, and the block tin is welded on first flexible PCB.
8. a kind of packaging method of fingerprint identification device, which is characterized in that the fingerprint identification device include fingerprint induction chip,
First flexible PCB, the second flexible PCB, metal solder sphere and metal shell；The packaging method includes：
Fingerprint induction chip is welded on by several pins in the fingerprint induction chip on the first flexible PCB；
First flexible PCB is fixed on by metal solder sphere on the second flexible PCB, and with it is described second flexible
Circuit board electrical connection；
The fingerprint induction chip, the first flexible PCB, the second flexible PCB and metal solder sphere are encapsulated in the gold
Belong in shell；
Wherein, the metal solder sphere includes：Upper circuit board, lower circuit board and metal ball；First flexible PCB is led to
It crosses metal solder sphere to be fixed on the second flexible PCB, and is electrically connected with second flexible PCB, including：On described
Welding circuit board is on first flexible PCB；By the lower welding circuit board on second flexible PCB；It will
The metal ball respectively with the upper circuit board and lower welding circuit board；
Further, the quantity of the metal solder sphere is multiple.
9. the packaging method of fingerprint identification device according to claim 8, which is characterized in that the fingerprint induction chip packet
It includes semiconductor wafer and the fingerprint sensing element in the semiconductor die on piece is set；
The output end of the fingerprint sensing element is as several pins.
10. the packaging method of fingerprint identification device according to claim 9, which is characterized in that lead to fingerprint induction chip
Several pins crossed in the fingerprint induction chip are welded on the first flexible PCB, including：
Metal coupling is formed in the semiconductor die on piece, several pins of the metal coupling and the fingerprint sensing element connect
It connects；
The metal coupling is fixed on first flexible PCB, and is electrically connected with first flexible PCB.
11. the packaging method of fingerprint identification device according to claim 10, which is characterized in that further include：
The filling buffering colloid between the fingerprint induction chip and the second flexible PCB.
12. the packaging method of fingerprint identification device according to claim 11, which is characterized in that further include：
Megohmite insulant is filled between the fingerprint sensing element and the metal shell.
13. the packaging method of fingerprint identification device according to claim 12, which is characterized in that the metal shell includes
Shell and capping；
The fingerprint induction chip, the first flexible PCB, the second flexible PCB and metal solder sphere are encapsulated in the gold
Belong in shell, including：
First flexible PCB is fixed on to the top of the shell；
The capping is fixed on second flexible PCB；
By the capping and the case weld.
14. a kind of intelligent terminal, which is characterized in that including such as claim 1-7 any one of them fingerprint identification device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410138447.5A CN104050445B (en) | 2014-04-08 | 2014-04-08 | Fingerprint identification device, the packaging method of fingerprint identification device and intelligent terminal |
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| CN201410138447.5A CN104050445B (en) | 2014-04-08 | 2014-04-08 | Fingerprint identification device, the packaging method of fingerprint identification device and intelligent terminal |
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| CN104050445B true CN104050445B (en) | 2018-10-16 |
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Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105608406B (en) * | 2014-11-20 | 2019-05-28 | 上海箩箕技术有限公司 | Fingerprint sensor |
| TWI531980B (en) * | 2015-01-19 | 2016-05-01 | 致伸科技股份有限公司 | A method of producing sensing device |
| CN104637892B (en) * | 2015-01-27 | 2017-11-24 | 华进半导体封装先导技术研发中心有限公司 | The encapsulating structure and its method for packing of fingerprint recognition module |
| TWI576734B (en) * | 2015-02-03 | 2017-04-01 | 宸鴻科技（廈門）有限公司 | Touch control device |
| CN105046190B (en) * | 2015-05-08 | 2017-12-19 | 苏州迈瑞微电子有限公司 | Fingerprint recognition module |
| CN105095861B (en) * | 2015-07-09 | 2019-03-26 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device and terminal device |
| CN105224926B (en) * | 2015-10-09 | 2017-11-14 | 广东欧珀移动通信有限公司 | Fingerprint recognition module installation method and fingerprint recognition module mounting structure |
| CN106971136B (en) | 2016-01-14 | 2023-10-20 | 深圳市汇顶科技股份有限公司 | Biological detection device and processing method thereof |
| CN105631444A (en) * | 2016-03-17 | 2016-06-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module and fingerprint identification module assembling method |
| CN105893958B (en) * | 2016-03-31 | 2020-07-24 | 联想(北京)有限公司 | Key device and electronic equipment |
| CN106409784A (en) * | 2016-08-23 | 2017-02-15 | 南通富士通微电子股份有限公司 | Fingerprint identification module and preparation method thereof |
| TWI625077B (en) * | 2016-09-30 | 2018-05-21 | Chip package structure | |
| CN110147696A (en) * | 2018-02-11 | 2019-08-20 | 印象认知（北京）科技有限公司 | Fingerprint acquisition device, its production method and electronic equipment under a kind of screen |
| CN109192708B (en) * | 2018-09-13 | 2020-06-19 | 苏州晶方半导体科技股份有限公司 | Packaging structure and packaging method of fingerprint chip |
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