CN215416697U - Packaging structure of biological information induction chip and electronic product - Google Patents
Packaging structure of biological information induction chip and electronic product Download PDFInfo
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- CN215416697U CN215416697U CN202122263625.5U CN202122263625U CN215416697U CN 215416697 U CN215416697 U CN 215416697U CN 202122263625 U CN202122263625 U CN 202122263625U CN 215416697 U CN215416697 U CN 215416697U
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Abstract
The embodiment of the application provides a packaging structure of a biological information induction chip and an electronic product. The biological information induction chip comprises a substrate layer and a chip pin positioned on the substrate layer, a through hole is formed in the peripheral side of the biological information induction chip by the packaging layer, the redistribution layer extends to the corresponding position of the through hole from the position of the chip pin above the packaging layer, and the packaging structure connecting part is arranged on one side, far away from the redistribution layer, of the packaging layer and electrically connected with the redistribution layer through the through hole. Therefore, the lead-out of the chip electrical connection relation is realized by arranging the through hole on the packaging layer, the occupied space of the packaging layer is fully used, the overall dimension of the chip packaging structure is reduced, and the miniaturization and thinning design of electronic products is facilitated.
Description
Technical Field
The application relates to the technical field of chip packaging, in particular to a packaging structure of a biological information induction chip and an electronic product.
Background
With the continuous development of electronic technology, biological information induction chips can be arranged on electronic products such as smart phones, tablet computers and smart watches, so that an intelligent induction function is realized. For example, a Fingerprint recognition chip (FPS) is disposed on the various electronic products to realize a Fingerprint recognition function of the electronic products, so as to realize intelligent control of the electronic products through Fingerprint recognition. Taking a fingerprint identification Chip as an example, a common Chip packaging manner for the fingerprint identification Chip is FC-LGA (Flip Chip Land Grid Array, Flip Chip Grid Array package). The chip packaging mode has the advantages of large wiring pin and large overall dimension of the packaging structure of the biological information sensing chip, and is not beneficial to the miniaturization and thinning design of electronic products.
SUMMERY OF THE UTILITY MODEL
Based on the above, in order to solve the above problems, in one aspect, the present application provides a package structure of a biological information sensing chip, where the package structure includes the biological information sensing chip, a package layer formed by packaging the biological information sensing chip, a redistribution layer, and a package structure connection portion;
the biological information induction chip comprises a substrate layer and a chip pin positioned on the substrate layer, a through hole is formed in the peripheral side of the biological information induction chip by the packaging layer, the redistribution layer extends to the corresponding position of the through hole from the position of the chip pin above the packaging layer, and the packaging structure connecting part is arranged on one side, far away from the redistribution layer, of the packaging layer and electrically connected with the redistribution layer through the through hole.
Based on a possible implementation manner of the above aspect, the package structure further includes a conductive bump located between the redistribution layer and the chip pin, and the redistribution layer is electrically connected to the chip pin through the conductive bump.
In a possible implementation manner of the above aspect, the conductive bump is a copper pillar bump.
Based on a possible implementation manner of the above aspect, the package structure further includes a through hole connection structure located in the through hole, and the redistribution layer is electrically connected to the package structure connection portion through the through hole connection structure.
In a possible implementation manner based on the above aspect, the through hole connection structure and the package structure connection portion are an integral structure; or the through hole connecting structure and the rewiring layer are of an integral structure, and the packaging structure connecting part is a conductive solder ball which is in contact with the through hole connecting structure.
Based on a possible implementation manner of the above aspect, the connection portion of the package structure is a solder ball, and the solder ball penetrates through the through hole and is electrically connected with the redistribution layer.
Based on one possible implementation manner of the above aspect, the biological information sensing chip further includes a sensing area, and the sensing area includes a functional component required for implementing a sensing function of the biological information sensing chip.
Based on a possible implementation manner of the above aspect, the package structure further includes a planarization layer located on the biological information sensing chip, the planarization layer is provided with a planarization layer through hole at a position corresponding to the chip pin, and the redistribution layer is located on the planarization layer and electrically connected to the chip pin through the planarization layer through hole.
Based on one possible implementation manner of the above aspect, the biological information sensing chip is a fingerprint identification chip.
On the other hand, the embodiment of the application also provides an electronic product, and the electronic product comprises the packaging structure of the biological information sensing chip.
Compared with the prior art, the package structure of the biological information sensing chip and the electronic product provided by the embodiment of the application realize the leading-out of the electrical connection relation of the chip by arranging the through hole on the package layer, fully utilize the occupied space of the package layer, reduce the overall dimension of the chip package structure compared with the conventional leading-out mode of the electrical connection relation such as wire bonding and the like, and are beneficial to the miniaturization and thinning design of the electronic product. Because the overall dimension of the chip packaging structure is reduced, the sensing sensitivity of the biological information sensing chip can be enhanced to a certain extent.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below. It is appreciated that the following drawings depict only certain embodiments of the application and are therefore not to be considered limiting of its scope. For a person skilled in the art, it is possible to derive other relevant figures from these figures without inventive effort.
Fig. 1 is a schematic view of a package structure of a biological information sensing chip with an opening on the front surface.
Fig. 2 is a schematic view of a package structure of a biological information sensing chip according to a first embodiment of the present application.
Fig. 3 is a schematic diagram of a package structure of a biological information sensing chip according to a second embodiment of the present application.
Fig. 4 is a schematic view of a package structure of a biological information sensing chip according to a third embodiment of the present application.
Fig. 5 is a schematic view of a package structure of a biological information sensing chip according to a fourth embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present application, it is to be understood that the terms "upper", "lower", "inner", "outer", "left", "right", and the like, refer to orientations or positional relationships that are based on the orientations or positional relationships shown in the drawings, or the orientations or positional relationships that the products of the application conventionally position when in use, or the orientations or positional relationships that are conventionally understood by those skilled in the art, and are used for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated, and therefore, should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
In the description of the present application, it is also to be noted that, unless otherwise explicitly stated or limited, the terms "disposed" and "connected" are to be interpreted broadly, for example, "connected" may be a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; the connection may be direct or indirect via an intermediate medium, and may be a communication between the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
Based on the technical problems mentioned in the background art, as shown in fig. 1, a schematic diagram of a package structure of a main stream of the related art biological information sensing chip with a hole on the front surface is shown. In this embodiment, for convenience of description, the biological information sensing chip is taken as an example of a fingerprint identification chip.
As shown in fig. 1, the package structure of the fingerprint identification chip includes a fingerprint identification chip 100, a chip carrier 200 and a cover plate 300, wherein the fingerprint identification chip 100 is packaged between the cover plate 300 and the chip carrier 200 by a packaging material (a packaging adhesive). The cover 300 may be a sapphire cover, a glass cover, a transparent resin cover, or the like, so that the fingerprint recognition chip 100 can perform fingerprint recognition through the cover 300. Further, in such a package structure, the leads of the fingerprint identification chip 100 need to be bonded and connected to the signal bonding points (such as ribbon cables) on one side of the chip carrier 200 through the bonding wires 400. As such, the routing space of the bonding wires 400 needs to be considered inside the package structure, and the bonding wires 400 inevitably need to be routed to a certain curvature, for example, a curvature in the vertical direction, which ultimately results in a larger overall size (especially, a larger size in the thickness) of the chip package structure, which is not favorable for the miniaturization and thinning of the electronic product.
It should be noted that the above prior art solutions have defects which are the results of practical and careful study by the inventor, therefore, the discovery process of the above technical problems and the solutions proposed by the following embodiments of the present application for the above problems should be the contribution of the inventor to the present application in the course of the invention creation process, and should not be understood as technical contents known by those skilled in the art.
In view of the above, in order to improve the above problems, an embodiment of the present application innovatively designs a package structure of a biological information sensing chip, which utilizes a space of a chip package layer in the package structure to provide an electrical connection path between a chip lead and another electrical connection object, and does not need to use a bonding wire manner, so as to reduce an overall external dimension of the package structure, thereby facilitating miniaturization and thinning design of an electronic product. The following detailed description of specific embodiments for implementing the above schemes in the present application will be made with reference to the accompanying drawings.
To solve the technical problem in the background art, please refer to fig. 2, in which fig. 2 is a schematic diagram of a package structure of a biological information sensing chip according to a first embodiment of the present application.
In this embodiment, the biological information sensing chip may be, but is not limited to, a fingerprint identification chip, a heart rate monitoring chip, a blood oxygen monitoring chip, etc., and may be used in electronic products such as smart phones and smart bracelets. In this embodiment, the biometric information sensing chip is preferably a fingerprint identification chip.
In this embodiment, the package structure includes a biological information sensing chip 100 and a package layer 140 formed by packaging the biological information sensing chip 100. The biological information sensing chip 100 includes a substrate layer 101 and a chip pin 102 located on the substrate layer 101. The base layer 101 may be a silicon base layer (silicon), and in other embodiments, the base layer 101 may also be other types of chip base layers, which is not limited in this embodiment.
Further, in this embodiment, the packaging layer 140 has at least one through hole 141 formed around the biological information sensing chip 100. The package layer 140 may be a plastic package body formed by plastic-packaging the biological information sensing chip 100 with a plastic package material. The through hole 141 is a through hole penetrating the encapsulation layer 140, and may be referred to as a TMV (through molding via).
The package structure further includes a redistribution layer (RDL) 120 electrically connected to the chip lead 102, where the RDL 120 extends from a position of the chip lead 102 to a corresponding position of the through hole 141 from above the package layer 140. Based on this, the package structure further includes a package structure connecting portion 150, the package structure connecting portion 150 is electrically connected to the redistribution layer 120 through the through hole 141 from a side of the package layer 140 away from the redistribution layer 120, and the package structure connecting portion 150 is used for electrically connecting the biological information sensing chip 100 with an external electronic component, so as to implement a chip function of the biological information sensing chip 100.
In an alternative implementation manner of this embodiment, the package structure connection portion 150 may be a solder ball, the solder ball is formed from a side of the package layer 140 away from the redistribution layer 120 through a ball-mounting process, and a material of the solder ball penetrates through the through hole and then contacts the redistribution layer 120.
In addition, in this embodiment, the biological information sensing chip 100 further includes a sensing region 103, and the sensing region 103 is used to fabricate functional components, such as sensing electrodes, required for implementing the sensing function of the biological information sensing chip 100.
The package structure may further include a planarization layer 110 disposed on the biological information sensing chip 100, the planarization layer 110 has a planarization layer through hole formed at a position corresponding to the chip pin 102, and the redistribution layer 120 is disposed on the planarization layer 110 and electrically connected to the chip pin 102 through the planarization layer through hole.
Further, the package structure may further include a dielectric layer 130 over the redistribution layer 120. The redistribution layers 120 may be a multi-layer structure, in which case, the redistribution structure between two adjacent redistribution layers 120 may be electrically connected through a dielectric layer via between the two adjacent redistribution layers 120.
As shown in fig. 3, fig. 3 is a schematic view of a package structure of a biological information sensing chip according to a second embodiment of the present application. The second embodiment is substantially the same as the first embodiment, except that in the second embodiment, the package structure further includes a conductive bump 121 located between the redistribution layer 120 and the chip pin 102, and the redistribution layer 120 is electrically connected to the chip pin 102 through the conductive bump 121. Preferably, in this embodiment, the conductive bump 121 and the redistribution layer 120 may be made of the same conductive material. As an example, the conductive bump 121 may be a copper Pillar bump (Cu Pillar).
As shown in fig. 4, fig. 4 is a schematic view of a package structure of a biological information sensing chip according to a third embodiment of the present application. The third embodiment is substantially the same as the first embodiment, except that in the third embodiment, the package structure may further include a via connection structure 151 located in the via 141, and the via connection structure 151 may be made of the same material as the redistribution layer 120 in the via 141 to achieve electrical connection between the redistribution layer 120 and the package structure connection portion 150. For example, as an example, the through hole connection structure 151 may be formed by electroplating or printing a metal conductive material (e.g., a solder paste, a copper paste, a silver paste, etc.) on the through hole 141, and accordingly, the package structure connection portion 150 may also be formed by electroplating or printing a metal material on the package layer 140 at a position corresponding to the through hole 141 and electrically connected to the through hole connection structure 151.
As shown in fig. 5, fig. 5 is a schematic view of a package structure of a biological information sensing chip according to a fourth embodiment of the present application. The fourth embodiment is substantially the same as the second embodiment, except that in the fourth embodiment, the package structure may further include a via connection structure 151 located in the via 141, and the via connection structure 151 may be made of the same material as the redistribution layer 120 in the via 141 to achieve electrical connection between the redistribution layer 120 and the package structure connection portion 150. For example, as an example, the through hole connection structure 151 may be formed in the through hole 141 by electroplating or printing a metal conductive material, and accordingly, the package structure connection part 150 may also be formed at a corresponding position of the package layer 140 and the through hole 141 by electroplating or printing and electrically connected to the through hole connection structure 151. In another perspective, in the fourth embodiment, the conductive bump 121 of the second embodiment and the via connection structure 151 of the third embodiment are included. In this embodiment, the through hole connection structure 151 and the package structure connection part 150 may be an integrated structure formed by using the same material in the same manufacturing process. Alternatively, the through hole connection structure 151 and the redistribution layer 120 may be formed in the same manufacturing process by using the same material, and the package structure connection portion 150 may be a conductive solder ball in contact with the through hole connection structure 151.
Further, an electronic product is provided in an embodiment of the present application, where the electronic product may include the package structure of the biological information sensing chip provided in any one of the above embodiments. In this embodiment, the electronic product may be a smart phone, a tablet computer, a notebook computer, a smart watch, and the like, but is not limited thereto. The packaging structure can be mounted on a circuit board of the electronic product to realize corresponding functions required by the electronic product.
To sum up, the packaging structure of biological information response chip that this application embodiment provided and have packaging structure's electronic product realizes drawing of chip electrical connection through seting up the through-hole on the encapsulation layer, has fully used the occupation space of encapsulation layer self, compares in conventional pin-bonding electricity connection such as electricity and draws the mode, has reduced chip packaging structure's overall dimension, is favorable to electronic product's miniaturization and slim design. Because the overall dimension of the chip packaging structure is reduced, the sensing sensitivity of the biological information sensing chip can be enhanced to a certain extent.
The foregoing description, for purpose of explanation, has been described with reference to specific embodiments. However, the illustrative discussions above are not intended to be exhaustive or to limit the application to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the application and its practical application, to thereby enable others skilled in the art to best utilize the application and various embodiments with various modifications as are suited to the particular use contemplated. The foregoing description, for purpose of explanation, has been described with reference to specific embodiments. However, the illustrative discussions above are not intended to be exhaustive or to limit the application to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the application and its practical application, to thereby enable others skilled in the art to best utilize the application and various embodiments with various modifications as are suited to the particular use contemplated.
Claims (10)
1. A packaging structure of a biological information induction chip is characterized in that the packaging structure comprises the biological information induction chip, a packaging layer formed by packaging the biological information induction chip, a rewiring layer and a packaging structure connecting part;
the biological information induction chip comprises a substrate layer and a chip pin positioned on the substrate layer, a through hole is formed in the peripheral side of the biological information induction chip by the packaging layer, the redistribution layer extends to the corresponding position of the through hole from the position of the chip pin above the packaging layer, and the packaging structure connecting part is arranged on one side, far away from the redistribution layer, of the packaging layer and electrically connected with the redistribution layer through the through hole.
2. The package structure of biological information sensing chip of claim 1, further comprising a conductive bump between the redistribution layer and the chip pin, wherein the redistribution layer is electrically connected to the chip pin through the conductive bump.
3. The package structure of biological information sensing chip of claim 2, wherein the conductive bump is a copper pillar bump.
4. The package structure of biological information sensing chip according to any one of claims 1 to 3, further comprising a via connection structure located in the via, wherein the redistribution layer is electrically connected to the package connection portion through the via connection structure.
5. The package structure of biological information sensing chip of claim 4, wherein the through hole connection structure and the package structure connection part are an integral structure;
or the through hole connecting structure and the rewiring layer are of an integral structure, and the packaging structure connecting part is a conductive solder ball which is in contact with the through hole connecting structure.
6. The package structure of a bioinformation sensing chip according to any one of claims 1 to 3, wherein the package structure connection portion is a solder ball, and the solder ball penetrates through the through hole and then is electrically connected to the redistribution layer.
7. The package structure of biological information sensing chip according to any one of claims 1 to 3, wherein the biological information sensing chip further comprises a sensing area, and the sensing area comprises functional components required for implementing a sensing function of the biological information sensing chip.
8. The package structure of a biological information sensing chip according to any one of claims 1 to 3, further comprising a planarization layer on the biological information sensing chip, wherein the planarization layer has a planarization layer through hole formed at a position corresponding to the chip pin, and the redistribution layer is located on the planarization layer and electrically connected to the chip pin through the planarization layer through hole.
9. The package structure of biological information sensing chip according to any one of claims 1 to 3, wherein the biological information sensing chip is a fingerprint identification chip.
10. An electronic product, characterized in that the electronic product comprises the packaging structure of the biological information sensing chip of any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202122263625.5U CN215416697U (en) | 2021-09-17 | 2021-09-17 | Packaging structure of biological information induction chip and electronic product |
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| CN202122263625.5U CN215416697U (en) | 2021-09-17 | 2021-09-17 | Packaging structure of biological information induction chip and electronic product |
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| CN215416697U true CN215416697U (en) | 2022-01-04 |
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| CN202122263625.5U Active CN215416697U (en) | 2021-09-17 | 2021-09-17 | Packaging structure of biological information induction chip and electronic product |
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Address after: No.12 Shangyang Road, high tech Zone, Chengdu, Sichuan 610000 Patentee after: Chengdu ESWIN SYSTEM IC Co.,Ltd. Address before: No.12 Shangyang Road, high tech Zone, Chengdu, Sichuan 610000 Patentee before: Chengdu yisiwei system integrated circuit Co.,Ltd. |
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