TWM540449U - Stacking structure of multi-function system-level package (1) - Google Patents

Description

Stacking structure of multi-function system-level package (1)

This creation is about semiconductor package structures, especially a system in package (SiP) structure.

System in Package (SiP) is characterized by integrating and packaging components of different process technologies and properties (such as active components and passive components) into a single module with a single function to achieve system integration and reduction. For specific purposes, storage modules, image processing modules or wireless communication modules such as RF modules, etc., compared to other system integration technologies, such as system-level chips that require complex semiconductor process technology (System) On Chip, SoC), system-in-package has the advantages of high heterogeneity, short development time and low cost.

Most of the existing system-level package modules have only a single function, and there is still room for improvement in terms of integration and miniaturization. For this, the Republic of China Patent No. I468086 "Electronic devices, system-level package modules and systems A method of manufacturing a stage package module (hereinafter referred to as I468086) discloses a system-in-package module having a first circuit board assembly, a second circuit board assembly, and a plurality of conductive pillars disposed on the first circuit board assembly And the second circuit board assembly, and the conductive pillars are electrically connected to the first circuit board component and the second circuit board component, thereby implementing a technical solution for packaging two different functional SiP modules together, however , I468086 patent The conductive column used is specifically a metal column or a micro circuit board formed by surrounding the metal column with an insulating material. When manufacturing a system-level package module such as the patent of I468086, a carrier having a plurality of holes must be used. The metal post is placed in the hole of the carrier, and then the bonding material is used to join the circuit board and the metal post. The overall process is complicated, and the additional carrier or micro circuit board can greatly improve the production. Cost, therefore, how to improve the above-mentioned deficiencies, that is, the technical difficulties that the applicant of this case wants to solve.

In view of the above-mentioned shortcomings of the conventional system-level packaging technology, the purpose of this creation is to develop a system-level package structure that simplifies the process and reduces the manufacturing cost.

To achieve the above objective, the present invention provides a stack structure of a multi-functional system-level package, comprising a first system module, a second system module, a lead frame, and an enclosure, wherein: the first The system module is provided with a first circuit board. The lower surface of the first circuit board is provided with a plurality of first connection pads. The second system module is located below the first system module, and the second system module is provided with a first system module. a second circuit board, the second circuit board is provided with a plurality of second connection pads on the lower surface thereof; the lead frame is provided with a plurality of pins, and the bottom of each pin is connected to the second circuit board, and each of the pins The top portion is also respectively connected to each of the first connection pads of the first circuit board; the package body covers the first system module, the second system module and the lead frame.

In addition, the present invention also provides a stack structure of a multi-functional system-level package, comprising a first system module, a second system module, a lead frame, a package body, and a metal case, wherein: A system module is provided with a first circuit board, and a plurality of first connection pads are disposed on a lower surface of the first circuit board; the second system module is located under the first system module, and the second system module is configured a second circuit board having a plurality of second connections on a lower surface of the second circuit board a lead pad; the lead frame is provided with a plurality of pins, the bottom of each pin is connected to the second circuit board, and the top of each pin is also respectively connected to each of the first connection pads of the first circuit board The package encloses the second system module and the lead frame; the metal case covers the first system module.

The first system module and the second system module are different wireless communication modules.

Further, the first system module is a WiFi module, and the second system module is a Bluetooth module.

By using a lead frame to realize stacking and interconnection of the first system module and the second system module, two different functions can be simultaneously provided in a single package structure to reduce the size and size of the module. At the same time, the creation only needs to use mature and relatively cheap process technology and components such as SMT and lead frame, without the need to make additional carriers or micro-boards, so as to simplify the process and reduce the manufacturing cost.

[this creation]

1‧‧‧System-in-package stacking structure

2‧‧‧First System Module

21‧‧‧First board

22‧‧‧First active component

23‧‧‧First passive component

24‧‧‧First connection pad

3‧‧‧Second system module

31‧‧‧Second circuit board

32‧‧‧Second active components

33‧‧‧Second passive components

34‧‧‧Second connection pad

4‧‧‧ lead frame

41‧‧‧ pin

5‧‧‧Package

6‧‧‧Metal housing

The first figure is a schematic structural view of an embodiment of the present creation.

The second to fifth figures are schematic diagrams showing the production process of an embodiment of the present creation.

The sixth drawing is a schematic structural view of the second embodiment of the present creation.

7 to 11 are schematic views showing the production flow of the second embodiment of the present creation.

Referring to the first figure, it is an embodiment of the system-in-package stack structure 1 of the present invention, which comprises a first system module 2, a second system module 3, and a lead frame 4 And a package 5, wherein: The first system module 2 has a first circuit board 21, and the upper surface of the first circuit board 21 is provided with at least one first active component 22 (such as an IC chip or a transistor) and at least one first passive component 23 ( For example, a resistor, a capacitor or an inductor is used to make the first circuit board 21, each of the first active components 22 and each of the first passive components 23 have a single function like a conventional system-in-package module (SiP). The first active component 22 and each of the first passive component 23 may be specifically soldered to the upper surface of the first circuit board 21 by surface adhesion technology (SMT). Generally, the first The circuit board 21 may be a single layer board, a double-sided board or a multi-layer board. In addition, the lower surface of the first circuit board 21 may be provided with a plurality of first The second system module 3 has a second circuit board 31, and the upper surface of the second circuit board 31 is provided with at least a second circuit board 31. a second active component 32 and at least one second passive component 33 The second circuit board 31, each of the second active components 32, and each of the second passive components 33 can also form a single module with a single function, such as a conventional system-in-package module (SiP). The second surface of the second circuit board 31 may also be provided with a plurality of second connection pads 34 for use as an electrical contact for the system-in-package stack structure 1 of the present invention to be connected to an external circuit. Generally, the second system module 3 and the first system module 2 each have different functions. In a preferred embodiment, the second system module 3 and the first system module 2 are different wireless communication modules, for example, One system module is a WiFi module, and the other system module is a Bluetooth module. In addition, the lead frame 4 is also disposed on the upper surface of the second circuit board 31 of the second system module 3, and the lead frame 4 A plurality of leads 41 are included, and the pins 41 are circumferentially distributed around the periphery of the second active component 32 and the second passive component 33, and the bottom of the pins 41 and the second circuit board 31 At least part of the connection pads (not shown) of the surface are connected, such as soldered The lead frame 4 is electrically connected to the second circuit board 31, and the top of each lead 41 of the lead frame 4 is also soldered to the first connection pad 24 of the lower surface of the first circuit board 21, respectively. The lead frame 4 is also electrically connected to the first circuit board 21, and the package 5 is formed on the second circuit board 31 of the second system module 3 to cover the first system. The module 2, the second system module 3 and the lead frame 4 are thus the complete structure of the system-level package stack structure 1 of the present invention.

The following briefly describes the manufacturing process of the above-mentioned system-level package stack structure 1 of the present invention: please refer to the second figure, first, prepare the first circuit board 21, and then flip the first circuit board 21 so that the lower surface thereof faces Then, the surface of each of the first connection pads 24 is pre-pre soldered, and as shown in the second figure, next, referring to the third figure, the first circuit board 21 is flipped back, and then The first active component 22 and each of the first passive components 23 are mounted on the upper surface of the first circuit board 21 by an SMT process, so that the first system module 2 can be completed. Next, please refer to As shown in the fourth figure, in the same SMT process, the pins 41 of the second active component 32, the second passive component 33, and the lead frame 4 are respectively placed on the upper surface of the second circuit board 31, and simultaneously The second system module 3 and the process of combining with the lead frame 4 are completed; next, please refer to the fifth figure, the first system module 2 is stacked on the second system module 3, At the same time, each of the first connection pads 24 on the lower surface of the first circuit board 21 is respectively aligned with the wire. Each of the pins 41 of the fourth electrode is soldered to the top of the first connecting pad 24 by a reflow process, and finally, the package 5 such as a resin for encapsulation is filled, and the first step is completed. The system-level package stack structure 1 shown in the figure, it is worth mentioning that, after the completion of the system-level package stack structure 1 of the present invention, the appearance is similar to that of the conventional system-level package module. Like an SMT component, it actually contains two system modules with different functions. The system modules of the two different functions can also interconnect the electrical signals through the lead frame 4.

Referring to the first figure, the stacking and interconnection of the first system module 2 and the second system module 3 are realized by using the lead frame 4, so that the creation is actually an innovative system-level package stacking system. The package structure of SiP on SiP can achieve two different functions in a single package structure to reduce the size and size of the module. At the same time, the creation only needs to use SMT. With mature and relatively inexpensive process technology and components such as lead frame 4, no additional carriers or micro-boards are required, which simplifies the process and reduces the manufacturing cost. In addition, it is worth noting that when this application is applied In the field of the wireless communication module, for example, when the first system module 2 and the second system module 3 are respectively a WiFi module and a Bluetooth module, the two system modules are interconnected by using the lead frame 4, and the data is Or the signal can be quickly transmitted between the two wireless communication modules at the same time. When the creation is applied to products such as the Internet of Things (IoT Gateway), the system transmission efficiency can be greatly improved.

Referring to FIG. 6 again, it is a second embodiment of the system-in-package stack structure 1 of the present invention, which differs from the embodiment shown in the first figure in that the package 5 covers only the second The system module 3 and the lead frame 4, the first system module 2 is not covered by the package 5, and the first system module 2 is further covered with a metal casing 6 for shielding electromagnetic interference. (EMI), please refer to the seventh to tenth drawings again. The difference between the manufacturing process of this embodiment and the first embodiment is that the first system module of the first embodiment shown in the first figure is The molding of both the second system module 3 and the second system module 3 is completed at one time by filling the package 5, and conversely, the second embodiment of the second embodiment shown in FIG. The fabrication and the molding of both the group 2 and the second system module 3 can be individually performed by covering the metal casing 6 and filling the package 5, as shown in the eighth and ninth figures, and finally Similarly, the first system module 2 and the second system module 3 are stacked and welded together by a reflow process, as shown in FIG. This embodiment can be protected except In addition to the effect of electromagnetic interference, the first system module 2 and the second system module 3 can be stacked and combined in a separate module type in the process, so that a better combination or matching can be produced in production. elasticity.

1‧‧‧System-in-package stacking structure

2‧‧‧First System Module

21‧‧‧First board

22‧‧‧First active component

23‧‧‧First passive component

24‧‧‧First connection pad

3‧‧‧Second system module

31‧‧‧Second circuit board

32‧‧‧Second active components

33‧‧‧Second passive components

34‧‧‧Second connection pad

4‧‧‧ lead frame

41‧‧‧ pin

5‧‧‧Package

Claims (6)

A stacking structure of a multi-functional system-in-package, comprising a first system module, a second system module, a lead frame, and a package, wherein: the first system module is provided with a first circuit board, a plurality of first connection pads are disposed on a lower surface of the first circuit board; the second system module is located under the first system module, and the second system module is provided with a second circuit board, the second circuit board a plurality of second connection pads are disposed on the lower surface; the lead frame is provided with a plurality of pins, the bottom of each pin is connected to the second circuit board, and the top of each pin is also respectively associated with the first circuit board Each of the first connection pads is connected; the package covers the first system module, the second system module and the lead frame. The stacking structure of the multi-function system-level package according to claim 1, wherein the first system module and the second system module are different wireless communication modules. The stacking structure of the multi-function system-level package according to claim 2, wherein the first system module is a WiFi module, and the second system module is a Bluetooth module. A stacking structure of a multi-functional system-in-package, comprising a first system module, a second system module, a lead frame, a package body and a metal case, wherein: the first system module is provided with a first a circuit board having a plurality of first connection pads on a lower surface of the first circuit board; the second system module is located below the first system module, the second system module a second circuit board is disposed, the second circuit board is provided with a plurality of second connection pads on the lower surface thereof; the lead frame is provided with a plurality of pins, and the bottom of each pin is connected to the second circuit board, and each of the wires The top of the pin is also respectively connected to each of the first connection pads of the first circuit board; the package covers the second system module and the lead frame; the metal case covers the first system module. The stacking structure of the multi-function system-level package according to claim 4, wherein the first system module and the second system module are different wireless communication modules. The stacking structure of the multi-function system-level package according to claim 5, wherein the first system module is a WiFi module, and the second system module is a Bluetooth module.