CN109152196A - A kind of fingerprint recognition mould group installation method and fingerprint recognition mould group - Google Patents
A kind of fingerprint recognition mould group installation method and fingerprint recognition mould group Download PDFInfo
- Publication number
- CN109152196A CN109152196A CN201810826193.4A CN201810826193A CN109152196A CN 109152196 A CN109152196 A CN 109152196A CN 201810826193 A CN201810826193 A CN 201810826193A CN 109152196 A CN109152196 A CN 109152196A
- Authority
- CN
- China
- Prior art keywords
- fingerprint recognition
- chip
- fixed area
- mould group
- becket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10553—Component over metal, i.e. metal plate in between bottom of component and surface of PCB
Abstract
The embodiment of the invention discloses a kind of fingerprint recognition mould group installation method and fingerprint recognition mould groups.The installation method includes: to provide a circuit board, and circuit board includes at least one chip fixed area and the becket fixed area around chip fixed area；Fingerprint recognition bare chip is provided, fingerprint recognition bare chip is fixed on chip fixed area through chip on board packaging technology；In becket fixed area setting structure glue, becket is adhered to becket fixed area.Fingerprint recognition mould group installation method provided in an embodiment of the present invention, by the chip fixed area that fingerprint recognition bare chip is fixed on to circuit board using chip on board packaging technology, reduce chip package process, it avoids the problem that leading to fingerprint recognition chip and circuit board connective stability using surface mounting technology, the installation cost for effectively reducing fingerprint recognition mould group improves the yield of fingerprint recognition mould group.
Description
Technical field
The present embodiments relate to fingerprint identification technologies more particularly to a kind of fingerprint recognition mould group installation method and fingerprint to know
Other mould group.
Background technique
At present in the preparation process of fingerprint recognition mould group, surface mounting technology SMT (Surface Mount
Technology) be a kind of maturation technology, fingerprint recognition chip is welded on circuit board by SMT.Fingerprint in the preparation
Identification chip needs packaging technology, and due to conventional package higher cost, typically constitute from integrated circuit totle drilling cost 40% is even higher.
Fingerprint recognition chip and becket, which are welded in circuit board, using SMT technique is easy to cause liquid to flow into fingerprint knowledge
At other gap between chip and circuit board, butt welding point is corroded, and soldering reliability is influenced, and even results in solder joint fracture；Refer to
Line identification chip depends merely on solder joint to fix, and binding force is bad, is easy in the case where fingerprint recognition mould group is by enormous impact force
Fingerprint recognition chip is set to fall off, to influence the service performance of fingerprint recognition mould group.Therefore it finds low in cost, reliable performance
The installation method of fingerprint recognition mould group is very necessary.
Summary of the invention
The embodiment of the present invention provides a kind of fingerprint recognition mould group installation method and fingerprint recognition mould group, the installation method save
Fingerprint recognition chip package process, can save SMT process, and fingerprint recognition mould group cost is effectively reduced, and improve product yield.
In a first aspect, the embodiment of the present invention provides a kind of fingerprint recognition mould group installation method, which comprises
A circuit board is provided, the circuit board includes at least one chip fixed area and the gold around the chip fixed area
Belong to ring fixed area；
Fingerprint recognition bare chip is provided, the fingerprint recognition bare chip is fixed on the core through chip on board packaging technology
Piece fixed area；
In the becket fixed area setting structure glue, becket is adhered to the becket fixed area.
Optionally, fingerprint recognition bare chip is being provided, the fingerprint recognition bare chip is being consolidated through chip on board packaging technology
Before the chip fixed area, further includes:
Load glue is set in the chip fixed area, the load glue is used to the fingerprint recognition bare chip being adhered to institute
State chip fixed area.
Optionally, the load glue includes at least one of red glue or elargol.
Optionally, in the becket fixed area setting structure glue, by becket be adhered to the becket fixed area it
Before, further includes:
Protective layer is formed on fingerprint recognition bare chip surface.
Optionally, the protective layer is formed using spraying process, and the protective layer includes ink material.
Optionally, the structure glue includes black glue and elargol.
Optionally, described that the fingerprint recognition bare chip is fixed on the chip fixed area through chip on board packaging technology
Include:
By bonding process, the pad of the pad of fingerprint recognition bare chip and the circuit board described in nation's wire bonding is utilized；
The pad of nation's line, the pad of the fingerprint recognition bare chip and the circuit board is sealed using sealant.
Optionally, in the pad and the circuit for sealing nation's line, the fingerprint recognition bare chip using sealant
Before the pad of plate, further includes:
Bonding quality is detected, determines bonding with the presence or absence of defect.
Optionally, nation's line includes at least one of aluminum steel or gold thread.
Second aspect, the embodiment of the present invention also provide a kind of fingerprint recognition mould group, using fingerprint recognition mould as described above
Group installation method is installed to be formed, which includes circuit board, fingerprint recognition bare chip and becket；
The circuit board includes chip fixed area and the becket fixed area around the chip fixed area；
The fingerprint recognition bare chip is fixed on the chip fixed area；
The becket is fixed on the becket fixed area.
The embodiment of the present invention provides a kind of fingerprint recognition mould group installation method, and this method includes providing a circuit board, circuit
Plate includes at least one chip fixed area and the becket fixed area around chip fixed area；Fingerprint recognition bare chip is provided, it will
Fingerprint recognition bare chip is fixed on chip fixed area through chip on board packaging technology；It, will in becket fixed area setting structure glue
Becket is adhered to becket fixed area.By the way that fingerprint recognition bare chip is fixed on circuit board using chip on board packaging technology
Chip fixed area, reduce chip package process, avoid leading to fingerprint recognition chip and circuit board using surface mounting technology
The problem of connective stability, effectively reduces the installation cost of fingerprint recognition mould group, improves the yield of fingerprint recognition mould group.
Detailed description of the invention
Fig. 1 is a kind of flow diagram for fingerprint recognition mould group installation method that the embodiment of the present invention one provides；
Fig. 2 is a kind of flow diagram of fingerprint recognition mould group installation method provided by Embodiment 2 of the present invention；
Fig. 3 is the flow diagram of chip on board packaging technology provided in an embodiment of the present invention；
Fig. 4 is a kind of schematic top plan view for fingerprint recognition mould group that the embodiment of the present invention three provides；
Fig. 5 is the schematic diagram of the section structure of the Fig. 4 along hatching line A-A '.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention rather than limiting the invention.It also should be noted that in order to just
Only the parts related to the present invention are shown in description, attached drawing rather than entire infrastructure.
Embodiment one
Fig. 1 is a kind of flow diagram for fingerprint recognition mould group installation method that the embodiment of the present invention one provides, specific to wrap
Include following steps:
Step 110 provides a circuit board, and circuit board includes at least one chip fixed area and the gold around chip fixed area
Belong to ring fixed area.
It is understood that fingerprint recognition mould group includes circuit board, fingerprint recognition chip and becket, it is arranged on circuit board
There are resistance, capacitor, connecting line etc. to can be printed circuit board for realizing the circuit element of fingerprint identification function, such as circuit board
PCB(Printed Circuit Board).Circuit board includes chip fixed area and becket fixed area, the setting of chip fixed area
There is the pad of welding chip, for fixing becket, becket can may be used also becket fixed area with the circuit on covering board
To be grounded by circuit board, for the electrostatic on shield fingerprints identification chip.
In the specific implementation, circuit board can be include multiple chip fixed areas and becket fixed area circuit board it is big
Plate is cut into independent fingerprint recognition mould group after once forming multiple fingerprint recognition mould groups, improves yield.
Step 120 provides fingerprint recognition bare chip, and fingerprint recognition bare chip is fixed on core through chip on board packaging technology
Piece fixed area.
In the prior art, first fingerprint recognition chip is packaged, then by packaged fingerprint recognition chip and driving
The circuit board of fingerprint recognition chip connects.Since traditional die encapsulation includes a series of works such as chip attachment, interconnection, forming and hardening
Skill step, and chip package needs accurate instrument and equipment, higher cost typically constitutes from the 40% of integrated circuit totle drilling cost even
It is higher.
Chip on board COB (Chip On Board) encapsulation technology is a kind of by un-encapsulated Integrated circuit IC
(Integrated Circuit) chip is incorporated directly into the technology on PCB.Using COB technology, directly by fingerprint recognition naked core
The circuit board electrical connection of piece (DIE) and driving fingerprint recognition chip, eliminates cost when chip package, can significantly reduce product
Manufacturing cost, cost advantage is especially prominent in mass production.
Step 130, in becket fixed area setting structure glue, becket is adhered to becket fixed area.
Optionally, structure glue may include black glue and elargol, and elargol is conductive, can be by becket and circuit board electricity
Connection is conducive to becket ground connection, realizes the function of antistatic.
The technical solution of the present embodiment, by the way that fingerprint recognition bare chip is fixed on circuit using chip on board packaging technology
The chip fixed area of plate reduces chip package process, and fingerprint recognition mould group front is not necessarily to other plug-in micro devices, simultaneously
It avoids the problem that leading to fingerprint recognition chip and circuit board connective stability using surface mounting technology, effectively reduces fingerprint knowledge
The installation cost of other mould group, improves the yield of fingerprint recognition mould group.Even if fingerprint recognition mould group front needs surface mount work
The plug-in micro devices of skill, save chip package process, can also substantially reduce cost.
Embodiment two
Fig. 2 is a kind of flow diagram of fingerprint recognition mould group installation method provided by Embodiment 2 of the present invention, this implementation
Example provide fingerprint recognition mould group installation method include:
Step 210 provides a circuit board, and circuit board includes at least one chip fixed area and the gold around chip fixed area
Belong to ring fixed area.
It is understood that fingerprint recognition mould group includes circuit board, fingerprint recognition chip and becket, it is arranged on circuit board
There are resistance, capacitor, connecting line etc. to can be PCB for realizing the circuit element of fingerprint identification function, such as circuit board.Circuit board
Including chip fixed area and becket fixed area, chip fixed area is provided with the pad of welding chip, and becket fixed area is used for
Fixed becket, becket can also be grounded with the circuit on covering board by circuit board, be used to shield fingerprints
Electrostatic on identification chip.
In the specific implementation, circuit board can be include multiple chip fixed areas and becket fixed area circuit board it is big
Plate is cut into independent fingerprint recognition mould group after once forming multiple fingerprint recognition mould groups, improves yield.
Load glue is arranged in chip fixed area in step 220, and load glue is consolidated for fingerprint recognition bare chip to be adhered to chip
Determine area.
Before load glue is set, need through means such as manual wipping or ion drifting dust machine purging etc. pcb board pad
On dust and the removings such as greasy dirt it is clean, to improve welding quality.Load glue is used to fingerprint recognition bare chip being fixed on circuit
On plate, prevent fingerprint recognition bare chip from falling off in transmitting and welding process, load glue can be arranged by dispensing mode,
It can specifically be realized using the methods of pin type transfer method, pressure injection method, the embodiment of the present invention is not construed as limiting this.Optionally,
Load glue includes at least one of red glue or elargol.
Step 230 provides fingerprint recognition bare chip, and fingerprint recognition bare chip is fixed on core through chip on board packaging technology
Piece fixed area.
In the prior art, first fingerprint recognition chip is packaged, then by packaged fingerprint recognition chip and driving
The circuit board of fingerprint recognition chip connects.Since traditional die encapsulation includes a series of works such as chip attachment, interconnection, forming and hardening
Skill step, and chip package needs accurate instrument and equipment, higher cost typically constitutes from the 40% of integrated circuit totle drilling cost even
It is higher.
Chip on board COB (Chip On Board) encapsulation technology is a kind of by un-encapsulated Integrated circuit IC
(Integrated Circuit) chip is incorporated directly into the technology on PCB.Using COB technology, directly by fingerprint recognition naked core
The circuit board electrical connection of piece (DIE) and driving fingerprint recognition chip, eliminates cost when chip package, can significantly reduce product
Manufacturing cost, cost advantage is especially prominent in mass production.
Step 240 forms protective layer on fingerprint recognition bare chip surface.
Optionally, protective layer can use spraying process and be formed, and protective layer includes ink material.Protective layer can protect finger
Line identifies bare chip, prevents the injury of water stain, sweat stain and scraping.
Step 250, in becket fixed area setting structure glue, becket is adhered to becket fixed area.
Optionally, structure glue may include black glue and elargol, and elargol is conductive, can be by becket and circuit board electricity
Connection is conducive to becket ground connection, realizes the function of antistatic.
It should be noted that either step in step 220 and step 240 is omitted, also in the present invention in specific implementation process
Within embodiment protection scope.
The technical solution of the present embodiment, by the way that fingerprint recognition bare chip is fixed on circuit using chip on board packaging technology
The chip fixed area of plate reduces chip package process, and fingerprint recognition mould group front is not necessarily to other plug-in micro devices, simultaneously
It avoids the problem that leading to fingerprint recognition chip and circuit board connective stability using surface mounting technology, effectively reduces fingerprint knowledge
The installation cost of other mould group, improves the yield of fingerprint recognition mould group.Even if fingerprint recognition mould group front needs surface mount work
The plug-in micro devices of skill, save chip package process, can also substantially reduce cost.In addition, load glue can prevent fingerprint from knowing
Other bare chip is fallen off in transmitting and welding process, and protective layer can protect fingerprint recognition bare chip, prevent water stain, sweat stain
And the injury scraped, extend the fingerprint recognition mould group service life.
On the basis of above-mentioned each embodiment, Fig. 3 is the stream of chip on board packaging technology provided in an embodiment of the present invention
Journey schematic diagram, optionally, fingerprint recognition bare chip, which is welded in chip fixed area through chip on board packaging technology, includes:
Step 201 passes through bonding process, utilizes the pad of nation's wire bonding fingerprint recognition bare chip and the pad of circuit board.
Bonding (bonding) is a kind of mode of routing in chip production process, and it is preceding by chip interior to be generally used for encapsulation
Circuit gold thread or aluminum steel are connect with package pins or the gold-plated copper foil of wiring board, and the ultrasonic wave from supersonic generator is (general
For 40-140KHz), high-frequency vibration is generated through energy converter, chopper is transmitted to by amplitude transformer, when chopper and lead and welded part connect
When touching, under the action of pressure and vibration, phase mutual friction in metal surface to be welded, oxidation film is destroyed, and is plastically deformed, and is caused
Two pure metal coverings are in close contact, reaches the combination of atomic distance, ultimately forms firm mechanical connection.General bonding
Afterwards (after i.e. circuit is connect with pin) with black glue by chip package.
Step 203 utilizes sealant sealing nation's line, the pad of fingerprint recognition bare chip and the pad of circuit board.
In the specific implementation process, can be used the method welding fingerprint recognition bare chip of ball bonding or downhand welding pad and
The pad of circuit board, specific embodiment are not construed as limiting this according to condition flexible choice, the embodiment of the present invention.
Optionally, before using sealant sealing nation's line, the pad of fingerprint recognition bare chip and the pad of circuit board,
Further include:
Step 202, detection bonding quality, determine bonding with the presence or absence of defect.
Had during bonding it is some as break, spiral, the bad phenomenons such as dry joint and lead to failure of chip, so in core
Performance detection is carried out before piece encapsulation.Analog functuion test fixture is generallyd use to be detected.When detecting bonding existing defects
When, it should defect is excluded using the means such as bonding again, guarantees product yield.
Optionally, nation's line includes at least one of aluminum steel or gold thread.According to condition flexible choice, the present invention when specific implementation
Embodiment is not construed as limiting this.
Embodiment three
Fig. 4 show a kind of schematic top plan view of fingerprint recognition mould group of the offer of the embodiment of the present invention three, and Fig. 5 is the edge Fig. 4
The schematic diagram of the section structure of hatching line A-A '.It is provided referring to fig. 4 with Fig. 5, the fingerprint recognition mould group using above-mentioned any embodiment
Installation method is installed to be formed, which includes circuit board 10, fingerprint recognition bare chip 20 and becket 30；Circuit board
10 include chip fixed area 101 and the becket fixed area 102 around chip fixed area；Fingerprint recognition bare chip 20 is fixed on core
Piece fixed area 101；Becket 30 is fixed on becket fixed area 102.
Wherein, resistance, capacitor, connecting line etc. are provided on circuit board 10 for realizing the circuit element of fingerprint identification function
And connector (not shown), such as circuit board 10 can be PCB.Circuit board 10 includes chip fixed area 101 and metal
Ring fixed area 102, chip fixed area 101 are provided with the pad (not shown) of welding chip, and becket fixed area 102 is used for
Fixed becket 30.Illustratively, there is hole among becket 30, for exposing fingerprint recognition bare chip 20, around becket 30
For shelly-shaped hollow structure, for the element on covering board 10.Becket 30 can be bonded in circuit board by structure glue 40
On 10, structure glue 40 may include black glue and elargol, and elargol is conductive, and becket 30 can pass through elargol and circuit board 10
Electrical connection is realized, to realize that becket 30 is grounded, for the electrostatic on shield fingerprints identification chip.
Fingerprint recognition mould group provided in this embodiment, can be used for the smart machines such as door lock, automobile, mobile phone, by that will refer to
Line identification bare chip is fixed on the chip fixed area of circuit board using chip on board packaging technology, reduces chip package process,
It avoids the problem that leading to fingerprint recognition chip and circuit board connective stability using surface mounting technology, effectively reduces fingerprint knowledge
The installation cost of other mould group, improves the yield of fingerprint recognition mould group.
Note that the above is only a better embodiment of the present invention and the applied technical principle.It will be appreciated by those skilled in the art that
The invention is not limited to the specific embodiments described herein, be able to carry out for a person skilled in the art it is various it is apparent variation,
It readjusts and substitutes without departing from protection scope of the present invention.Therefore, although being carried out by above embodiments to the present invention
It is described in further detail, but the present invention is not limited to the above embodiments only, without departing from the inventive concept, also
It may include more other equivalent embodiments, and the scope of the invention is determined by the scope of the appended claims.
Claims (10)
1. a kind of fingerprint recognition mould group installation method, which is characterized in that the described method includes:
A circuit board is provided, the circuit board includes at least one chip fixed area and the becket around the chip fixed area
Fixed area；
Fingerprint recognition bare chip is provided, the fingerprint recognition bare chip is fixed on the chip through chip on board packaging technology and is consolidated
Determine area；
In the becket fixed area setting structure glue, becket is adhered to the becket fixed area.
2. fingerprint recognition mould group installation method according to claim 1, which is characterized in that providing fingerprint recognition naked core
The fingerprint recognition bare chip is fixed on before the chip fixed area by piece through chip on board packaging technology, further includes:
Load glue is set in the chip fixed area, the load glue is used to the fingerprint recognition bare chip being adhered to the core
Piece fixed area.
3. fingerprint recognition mould group installation method according to claim 2, which is characterized in that the load glue include red glue or
At least one of elargol.
4. fingerprint recognition mould group installation method according to claim 1, which is characterized in that set in the becket fixed area
Structure glue is set, becket is adhered to before the becket fixed area, further includes:
Protective layer is formed on fingerprint recognition bare chip surface.
5. fingerprint recognition mould group installation method according to claim 4, which is characterized in that the protective layer utilizes spraying work
Skill is formed, and the protective layer includes ink material.
6. fingerprint recognition mould group installation method according to claim 1, which is characterized in that the structure glue include black glue and
Elargol.
7. fingerprint recognition mould group installation method according to claim 1, which is characterized in that described that the fingerprint recognition is naked
Chip is fixed on the chip fixed area through chip on board packaging technology
By bonding process, the pad of the pad of fingerprint recognition bare chip and the circuit board described in nation's wire bonding is utilized；
The pad of nation's line, the pad of the fingerprint recognition bare chip and the circuit board is sealed using sealant.
8. fingerprint recognition mould group installation method according to claim 7, which is characterized in that using described in sealant sealing
Before the pad of nation's line, the pad of the fingerprint recognition bare chip and the circuit board, further includes:
Bonding quality is detected, determines bonding with the presence or absence of defect.
9. fingerprint recognition mould group installation method according to claim 7, which is characterized in that nation's line includes aluminum steel or gold
At least one of line.
10. a kind of fingerprint recognition mould group, which is characterized in that installed using any fingerprint recognition mould group of claim 1~9
Method is installed to be formed, which includes circuit board, fingerprint recognition bare chip and becket；
The circuit board includes chip fixed area and the becket fixed area around the chip fixed area；
The fingerprint recognition bare chip is fixed on the chip fixed area；
The becket is fixed on the becket fixed area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810826193.4A CN109152196A (en) | 2018-07-25 | 2018-07-25 | A kind of fingerprint recognition mould group installation method and fingerprint recognition mould group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810826193.4A CN109152196A (en) | 2018-07-25 | 2018-07-25 | A kind of fingerprint recognition mould group installation method and fingerprint recognition mould group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109152196A true CN109152196A (en) | 2019-01-04 |
Family
ID=64798969
Family Applications (1)
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|---|---|---|---|
| CN201810826193.4A Pending CN109152196A (en) | 2018-07-25 | 2018-07-25 | A kind of fingerprint recognition mould group installation method and fingerprint recognition mould group |
Country Status (1)
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| CN (1) | CN109152196A (en) |
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| CN111046851A (en) * | 2019-12-31 | 2020-04-21 | 宁波星宏智能技术有限公司 | Fingerprint touch intelligence switch fingerprint identification detection device before giving birth to |
| CN111126351A (en) * | 2020-01-21 | 2020-05-08 | 北京京东方光电科技有限公司 | Fingerprint identification module |
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Application publication date: 20190104 |