CN205080565U - Fingerprint identification sensor - Google Patents
Fingerprint identification sensor Download PDFInfo
- Publication number
- CN205080565U CN205080565U CN201520811746.0U CN201520811746U CN205080565U CN 205080565 U CN205080565 U CN 205080565U CN 201520811746 U CN201520811746 U CN 201520811746U CN 205080565 U CN205080565 U CN 205080565U
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- China
- Prior art keywords
- circuit board
- fingerprint identification
- identification sensor
- recognition chip
- fingerprint recognition
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Abstract
The utility model relates to a fingerprint identification sensor. This fingerprint identification sensor includes: the circuit board has relative first surface and second surface, be equipped with a plurality of pads on the first surface, the fingerprint identification chip is located on the circuit board first surface, have surface of the work and ATTACH SURFACES, the surface of the work is used for contacting with the finger, ATTACH SURFACES is last to be equipped with electric tie point, electrically conductive bonding agent, the electricity is connected circuit board pad with the fingerprint identification chip electric connection point, nonconductive adhesive locates on the circuit board first surface, and lie in around the fingerprint identification chip, so that the fingerprint identification chip with form airtight space between the circuit board. Above -mentioned fingerprint identification sensor has better leakproofness to electrically conductive bonding agent.
Description
Technical field
The utility model relates to technical field of biometric identification, particularly relates to a kind of fingerprint Identification sensor.
Background technology
Fingerprint recognition system has been widely used in various terminal device, such as mobile terminal, banking system, attendance checking system etc.Fingerprint recognition system comprises fingerprint Identification sensor and drive circuit unit, wherein: fingerprint Identification sensor is for detecting fingerprint active user fingerprint pattern, and active user's fingerprint pattern is converted to the finger print information of electric signal, drive circuit unit, for driving fingerprint Identification sensor, and process the finger print information that fingerprint Identification sensor detects.
Fingerprint Identification sensor generally includes fingerprint recognition chip and circuit board, and fingerprint recognition chip has electric connection point, and circuit board all has pad.When assembling above-mentioned fingerprint Identification sensor, first coated with conductive bonding agent on the pad of circuit board, then being put into by fingerprint recognition chip is coated with on the circuit board of electrically conducting adhesive, the electric connection point of fingerprint recognition chip is contacted with electrically conducting adhesive, and then fingerprint recognition chip is electrically connected with circuit board.Adopt bottom filler (Underfill) technique again, in the process of filler, the size of fingerprint recognition chip is depended in filler path, monolateral filler can be adopted for undersized fingerprint recognition chip, L shape or U-shaped filler can be adopted for large-sized fingerprint recognition module, to accelerate to fill, ooze out until the other end of fingerprint recognition chip finds that there is glue.Due to needs whole filler between fingerprint recognition chip and circuit board, make glue quantity too large, and there is welding assisted agent residuals on circuit boards, cause glue cannot to be filled completely the space between fingerprint recognition chip and circuit board, cause electrically conducting adhesive to be easily subject to water in outside air and oxygen corrosion.
Utility model content
Based on this, be necessary to provide a kind of fingerprint Identification sensor electrically conducting adhesive to better sealing.
A kind of fingerprint Identification sensor, comprising:
Circuit board, has relative first surface and second surface, and described first surface is provided with multiple pad;
Fingerprint recognition chip, is located on described circuit board first surface, has working surface and connecting surface, and described working surface is used for and finger contact, and described connecting surface is provided with electric connection point;
Electrically conducting adhesive, is electrically connected described board pads and described fingerprint recognition chip electrical contact; And
Non-conductive adhesive, is located on described circuit board first surface, and is positioned at described fingerprint recognition chip surrounding, to make to form confined space between described fingerprint recognition chip and described circuit board.
Wherein in an embodiment, the thickness of described electrically conducting adhesive is 0.05 ~ 0.1mm.
Wherein in an embodiment, described electrically conducting adhesive is tin cream.
Wherein in an embodiment, described non-conductive adhesive is glue.
In above-mentioned fingerprint Identification sensor, adopt the mode of surrounding sealing to substitute traditional bottom filler technique, thus electrically conducting adhesive is sealed in confined space preferably, electrically conducting adhesive can be avoided by the water in outside air and oxygen corrosion.Above-mentioned fingerprint Identification sensor greatly can reduce because electrically conducting adhesive corrodes and cause fingerprint recognition chip and circuit board to occur the situation of open circuit, thus above-mentioned fingerprint Identification sensor has longer serviceable life.And, adopt the mode of surrounding sealing to form fingerprint Identification sensor and form fingerprint Identification sensor compared to employing bottom filler technique, need the amount of the non-conductive adhesive used less, and require lower to the mobility of bonding agent.
Accompanying drawing explanation
Fig. 1 is the structural representation of the fingerprint Identification sensor of the utility model one embodiment;
Fig. 2 is the Making programme figure of the utility model fingerprint Identification sensor.
Embodiment
Below in conjunction with drawings and the specific embodiments, the utility model fingerprint Identification sensor is further described.
As shown in Figure 1, the fingerprint Identification sensor 10 of the utility model one embodiment, comprises circuit board 100, fingerprint recognition chip 200, electrically conducting adhesive 300 and non-conductive adhesive 400.
Circuit board 100 has relative first surface 110 and second surface 120.First surface 110 is provided with multiple pad (not shown).Concrete, in the present embodiment, circuit board 100 is flexible PCB.In other embodiments, circuit board 100 can be other circuit boards with pad.
Fingerprint recognition chip 200 is located on first surface 110.Fingerprint recognition chip 200 has working surface 210 and connecting surface 220.Working surface 210 for finger contact, connecting surface 220 is provided with electric connection point (not shown).Concrete, in the present embodiment, electric connection point is pad.In other embodiments, electric connection point can for soldered ball etc. be for realizing the element be electrically connected.
Electrically conducting adhesive 300 is electrically connected pad and electric connection point, thus fingerprint recognition chip 200 is electrically connected with circuit board 100.Concrete, in the present embodiment, at circuit board 100 with on the stacked direction of fingerprint recognition chip 200, the thickness of electrically conducting adhesive 300 is 0.05 ~ 0.1mm.Concrete, in the present embodiment, electric bonding agent 300 is tin cream.In other embodiments, the thickness of electrically conducting adhesive 300 and material can be the bonding agent that other rational thickness and realizing are electrically connected.
Non-conductive adhesive 400 is located on first surface 110, and is positioned at fingerprint recognition chip 200 surrounding, and is connected with fingerprint recognition chip 200, to make to form confined space 500 between fingerprint recognition chip 200 and circuit board 100.Concrete, non-conductive adhesive 400 is glue.
In above-mentioned fingerprint Identification sensor 10, adopt the mode of surrounding sealing to substitute traditional bottom filler technique, thus make electrically conducting adhesive 300 be sealed in confined space 500 preferably, electrically conducting adhesive 300 can be avoided by the water in outside air and oxygen corrosion.Above-mentioned fingerprint Identification sensor 10 can reduce the situation causing fingerprint recognition chip 200 and circuit board 100 to occur open circuit because electrically conducting adhesive 300 corrodes greatly, thus above-mentioned fingerprint Identification sensor 10 has longer serviceable life.
And, adopt the mode of surrounding sealing to form fingerprint Identification sensor 10 and form fingerprint Identification sensor compared to employing bottom filler technique, need the amount of the non-conductive adhesive used less, and require lower to the mobility of bonding agent.
Further, in the present embodiment, on from circuit board 100 towards the direction of fingerprint recognition chip 200, the peak of the side that non-conductive adhesive 400 is connected with the outer wall of fingerprint recognition chip 200 arrives 1/2 ~ 2/3 place of fingerprint recognition chip 200 outer wall.Thus make non-conductive adhesive 400 while providing good sealing, enough strength of joint can also be provided.
In the present embodiment, as shown in Figure 2, a kind of method for making of fingerprint Identification sensor is also provided, comprises the steps:
Step S610, provides circuit board and fingerprint recognition chip.Wherein, circuit board has relative first surface and second surface, and first surface is provided with multiple pad; Fingerprint recognition chip has working surface and connecting surface, and working surface is used for and finger contact, and connecting surface is provided with electric connection point; Board pads is electrically connected by electrically conducting adhesive with fingerprint recognition chip electrical contact.
In the present embodiment, electric connection point is pad, and electrically conducting adhesive is tin cream.First utilize screen printing technology, the pad of circuit board applies tin cream; Then being placed to by paster technique (surface installation technique, SMT) by fingerprint recognition chip is coated with on the circuit board of tin cream, and the electric connection point of fingerprint recognition chip attach surface is contacted with tin cream; Reflux in reflow ovens afterwards, in this heating process, scaling powder in tin cream just evaporated the overwhelming majority in advance before reaching alloy melting point, after temperature reaches alloy melting point, the electric connection point that alloying component in tin cream is connected with circuit board and fingerprint recognition chip is fused together, form electric connection block, after cooling, soldering alloy solidifies and forms stable electrical connection with circuit board.
, it should be noted that, in reflux course, to there is welding assisted agent residuals between circuit board and fingerprint recognition chip herein, if adopt bottom filler technique to carry out filler, can there is glue cannot fill completely, and causing does not have glue around part electric connection block.During poor sealing between circuit board and fingerprint recognition chip, electric connection block can be made to be exposed in outside air completely, and then to cause electric connection block corrosion speed to be accelerated.
Step S620, at fingerprint recognition chip surrounding coating non-conductive adhesive, to make to form confined space between fingerprint recognition chip and circuit board.
Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this instructions is recorded.
The above embodiment only have expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to utility model patent scope.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (4)
1. a fingerprint Identification sensor, is characterized in that, comprising:
Circuit board, has relative first surface and second surface, and described first surface is provided with multiple pad;
Fingerprint recognition chip, is located on described circuit board first surface, has working surface and connecting surface, and described working surface is used for and finger contact, and described connecting surface is provided with electric connection point;
Electrically conducting adhesive, is electrically connected described board pads and described fingerprint recognition chip electrical contact; And
Non-conductive adhesive, is located on described circuit board first surface, and is positioned at described fingerprint recognition chip surrounding, to make to form confined space between described fingerprint recognition chip and described circuit board.
2. fingerprint Identification sensor according to claim 1, is characterized in that, the thickness of described electrically conducting adhesive is 0.05 ~ 0.1mm.
3. fingerprint Identification sensor according to claim 1, is characterized in that, described electrically conducting adhesive is tin cream.
4. fingerprint Identification sensor according to claim 1, is characterized in that, described non-conductive adhesive is glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520811746.0U CN205080565U (en) | 2015-10-19 | 2015-10-19 | Fingerprint identification sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520811746.0U CN205080565U (en) | 2015-10-19 | 2015-10-19 | Fingerprint identification sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205080565U true CN205080565U (en) | 2016-03-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520811746.0U Expired - Fee Related CN205080565U (en) | 2015-10-19 | 2015-10-19 | Fingerprint identification sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205080565U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106127195A (en) * | 2016-08-30 | 2016-11-16 | 广东欧珀移动通信有限公司 | Fingerprint module, fingerprint module manufacture method and mobile terminal |
-
2015
- 2015-10-19 CN CN201520811746.0U patent/CN205080565U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106127195A (en) * | 2016-08-30 | 2016-11-16 | 广东欧珀移动通信有限公司 | Fingerprint module, fingerprint module manufacture method and mobile terminal |
| EP3291515A1 (en) * | 2016-08-30 | 2018-03-07 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Fingerprint module, method for fabricating the same, and mobile terminal |
| US10049259B2 (en) | 2016-08-30 | 2018-08-14 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Fingerprint module, method for fabricating the same, and mobile terminal |
| US10133913B2 (en) | 2016-08-30 | 2018-11-20 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Fingerprint module, method for fabricating the same, and mobile terminal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160309 Termination date: 20211019 |