CN106793466B - circuit board and mobile terminal - Google Patents
circuit board and mobile terminal Download PDFInfo
- Publication number
- CN106793466B CN106793466B CN201611270863.6A CN201611270863A CN106793466B CN 106793466 B CN106793466 B CN 106793466B CN 201611270863 A CN201611270863 A CN 201611270863A CN 106793466 B CN106793466 B CN 106793466B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- plate
- straight line
- cabling
- line section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003466 welding Methods 0.000 abstract description 24
- 238000007906 compression Methods 0.000 abstract description 8
- 238000009792 diffusion process Methods 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 abstract description 3
- 230000001340 slower Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 37
- 238000000034 method Methods 0.000 description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- QUOZWMJFTQUXON-UXXRCYHCSA-N Androsin Natural products COC1=CC(C(C)=O)=CC=C1O[C@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 QUOZWMJFTQUXON-UXXRCYHCSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 208000008425 Protein Deficiency Diseases 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
Abstract
This application involves technical field of electronic devices, more particularly to a kind of circuit board and mobile terminal, circuit board includes dielectric layer, conductive layer and cabling, there is conduction region and nonconductive regions on the dielectric layer, the conductive layer is set to the conduction region, and connecting hole between plate is opened up in the nonconductive regions, and the cabling is set in the nonconductive regions, and one end of the cabling is connected to connection hole between the plate, the other end is connect with the conductive layer.Non-conductive layer is arranged in circuit board provided by the present application on dielectric layer, certain interval is formed between connecting hole and conductive layer on circuit board, when implementing thermal compression welding operation, the heat diffusion speed of connection hole slows down, so that pad temperature meets the requirement of thermal compression welding.It is not easy problem of faulty soldering occur when as it can be seen that welding the circuit board.
Description
Technical field
This application involves technical field of electronic devices more particularly to a kind of circuit boards and mobile terminal.
Background technique
Usually need to carry out the welding procedure of electronic device in the production process of electronic device, thermal compression welding is to compare at present
More typical electronic device welding procedure.Specifically, using hot-press equipment, by pre-add scolding tin the PCB of circuit board solder joint
Upper tin, the major parameters such as the upper tin thickness of strict control pre-add scolding tin and flatness.Then electricity is fixed by ready-made fixture
The PCB of road plate, the pad that FPC is fixed on PCB by fixture is just above, the transformer that at this moment hot-press equipment passes through the pulse power
Electric network source is converted into low voltage and high current, resistance heat is generated using the electric current for flowing through heating tool head, heats thermal head pair
Solder joint implements heating welding, ensures the reliability of welding in welding process by control pressure and electrified regulation time.
Circuit board is that one of the core component in electronic equipment needs when using welding procedure of hot pressing soldered circuit board
It is punched on the layer of circuit board, which reaches lower layer after passing through pad, the cabling arrangement between each layer to realize circuit board.
If the hole number beaten is more, it will lead to heat by via hole and be transmitted to underlying power or ground level, cause
It radiates too fast, the heat on pad does not reach requirement and rosin joint occurs.If the hole beaten is less, it just will appear electrical conduction current deficiency,
Also the via hole on pad can be caused to crack because welding temperature is excessively high, pad finally occur with lower layer via hole and connect open circuit
This problem.
Summary of the invention
This application provides a kind of circuit board and mobile terminals, to improve reliability when welding.
The first aspect of the application provides a kind of circuit board comprising dielectric layer, conductive layer and cabling, the dielectric layer
Upper to have conduction region and nonconductive regions, the conductive layer is set to the conduction region, opens up in the nonconductive regions and connects between plate
Hole, the cabling are set in the nonconductive regions, and one end of the cabling is connected to connection hole between the plate, the other end
It is connect with the conductive layer.
Preferably, connecting hole is set as multiple between the plate, and connecting hole interval is arranged between each plate, and the cabling
One end is connected to connection hole between each plate simultaneously.
Preferably, the center of connecting hole is located along the same line between each plate.
Preferably, the straight line parallel between each plate where the center of connecting hole in the nonconductive regions between the plate
The adjacent edge of connecting hole.
Preferably, the cabling includes first straight line section, changeover portion and second straight line section, and the first straight line section is connected to
Connection hole between each plate, the second straight line section are connect by the changeover portion with the first straight line section, and described
One straightway is parallel with the second straight line section.
Preferably, the cabling further includes third straightway, the third straightway be connected to the second straight line section with
Between the conductive layer, the third straightway is obliquely installed relative to the extending direction of the second straight line section.
Preferably, the third straightway inclines relative to the second straight line section to the first straight line section side
Tiltedly.
Preferably, the changeover portion is arc-shaped transition section.
Preferably, the quantity of the connecting hole is four.
The second aspect of the application provides a kind of mobile terminal comprising circuit board described in any of the above embodiments.
Technical solution provided by the present application can achieve it is following the utility model has the advantages that
Non-conductive layer is arranged in circuit board provided by the present application on dielectric layer, between the connecting hole and conductive layer on circuit board
Certain interval is formed, when implementing thermal compression welding operation, the heat diffusion speed of connection hole slows down, so that pad temperature
Meet the requirement of thermal compression welding.It is not easy problem of faulty soldering occur when as it can be seen that welding the circuit board.
It should be understood that the above general description and the following detailed description are merely exemplary, this can not be limited
Application.
Detailed description of the invention
Fig. 1 is the partial structure diagram of circuit board provided by the embodiment of the present application；
Fig. 2 is the structural schematic diagram of cabling in circuit board provided by the embodiment of the present application.
Appended drawing reference:
10- dielectric layer；
Connecting hole between 100- plate；
11- conductive layer；
12- cabling；
120- first straight line section；
121- changeover portion；
122- second straight line section；
123- third straightway.
The drawings herein are incorporated into the specification and forms part of this specification, and shows the implementation for meeting the application
Example, and together with specification it is used to explain the principle of the application.
Specific embodiment
The application is described in further detail below by specific embodiment and in conjunction with attached drawing.
As depicted in figs. 1 and 2, the embodiment of the present application provides a kind of circuit board, may include dielectric layer 10,11 and of conductive layer
Cabling 12.Dielectric layer 10 is the carrier of each device in circuit board, which can be set multiple, can specifically be used
PCB (Printed Circuit Board, printed circuit board).Conduction region and non-conductive can be set on each dielectric layer 10
Area, conductive layer 11 are set on conduction region, which can also be correspondingly arranged multiple.That is, aforesaid conductive area is real
Just refer to the region of setting conductive layer 11 on border, nonconductive regions is exactly to be not provided with the region of conductive layer 11.Optionally, conductive layer 11
It can be set to layers of copper.
Connecting hole 100 between plate is opened up in above-mentioned nonconductive regions, the effect of connecting hole 100 is realize circuit board each between the plate
Electrical connection between a conductive layer 11 can specifically be realized by being connected to the cabling 12 of connection hole between the plate.The cabling 12
It is set in nonconductive regions, and one end of cabling 12 is connected between plate at connecting hole 100, the other end is electrically connected with conductive layer 11.
Foregoing circuit plate provided by the embodiments of the present application can be welded using the technique of thermal compression welding.Specific welding
Process are as follows: use hot-press equipment, by pre-add scolding tin on the solder joint of the PCB of circuit board tin, strict control pre-add scolding tin it is upper
The major parameters such as tin thickness and flatness.Then the PCB that circuit board is fixed by ready-made fixture, FPC (Flexible
Printed Circuit, flexible circuit board) pad of PCB is fixed on just above by fixture, at this moment hot-press equipment passes through pulse
Electric network source is converted to low voltage and high current by the transformer of power supply, generates resistance heat using the electric current for flowing through heating tool head,
It heats the implementation heating of thermal head butt welding point to weld, welding is ensured by control pressure and electrified regulation time in welding process
Reliability.
After foregoing circuit plate, connecting hole 100 and cabling 12 are all set in the nonconductive regions of dielectric layer 10 between plate, so that
Certain interval is formed between plate between connecting hole 100 and conductive layer 11.When implementing thermal compression welding operation, between plate at connecting hole 100
Heat diffusion speed slow down so that pad temperature meets the requirement of thermal compression welding.As it can be seen that welding the embodiment of the present application mentions
It is not easy problem of faulty soldering occur when the circuit board of confession.
In order to improve the electric current for flowing through pad in welding process, it can set multiple for connecting hole 100 between plate, between each plate
The setting of the interval of connecting hole 100, and one end of cabling 12 is connected between each plate simultaneously at connecting hole 100.Preferably, the application is implemented
In the circuit board that example provides, connecting hole 100 may be configured as four between plate.
In view of the pad placed at connecting hole 100 between plate is usually strip structure, therefore in order to better adapt to pad
Shape the center of connecting hole 100 between each plate can be made to be located along the same line to improve the compact-sized degree of circuit board.This
When connect the cabling of connecting hole 100 between each plate also can be using rectilinear structure, and then reach foregoing purpose.Further,
Straight line parallel between each plate where the center of connecting hole 100 is in the edge that connecting hole 100 is adjacent between plate in nonconductive regions.Also
It is to say, the edge of nonconductive regions can be improved to the structure that the distance between connecting hole 100 is more consistent between each plate by this embodiment,
Also can be so that the structure of circuit board to be more compact, whole circuit board the space occupied is smaller.
In a kind of embodiment, above-mentioned cabling 12 may include first straight line section 120, changeover portion 121 and second straight line section 122,
First straight line section 120 is connected between each plate at connecting hole 100, and second straight line section 122 passes through changeover portion 121 and first straight line section
120 connections, and first straight line section 120 is parallel with second straight line section 122.On the one hand, which can increase connecting hole 100 between plate
The length of connection path between conductive layer 11, so that heat between plate at connecting hole 100 is more difficult to be transferred to conductive layer
On 11.On the other hand, the size that can also further reduce cabling 12 reduces its space occupied.
On the basis of above scheme, cabling 12 can also include third straightway 123, and third straightway 123 is connected to
Between second straight line section 122 and conductive layer 11, and third straightway 123 is tilted relative to the extending direction of second straight line section 122
Setting.Compared to directly conductive layer 11 is connected by linear structure, after third straightway 123 is arranged, the length of cabling 12 is longer
It is some, and then slow down the diffusion of heat.
In order to balance the size of 12 occupied space of cabling, third straightway 123 is straight to first relative to second straight line section 122
The inclination of 120 side of line segment.
It can be preferably arc-shaped transition section by changeover portion 121 to improve the structural strength of cabling 12.
As shown in the above, after using circuit board provided by the embodiments of the present application, re-pack a connecting hole 100 on pad
To after next layer, connecting hole 100 connects surface layer pad between plate, and be not directly connected conductive layer 11, and is to utilize lower layer space under
Layer coiling (after cabling 12 bypasses a small distance) reconnects conductive layer 11.The method can achieve directly punches on pad
It (not influencing to radiate when hole is more) and does not need that the effect that cabling punches (save space) again is arranged outside the pad of surface layer, to PCB's
Surface layer design reserves more spaces.
Based on above structure, the embodiment of the present application also provides a kind of mobile terminal comprising described in any of the above-described embodiment
Circuit board.
The foregoing is merely preferred embodiment of the present application, are not intended to limit this application, for the skill of this field
For art personnel, various changes and changes are possible in this application.Within the spirit and principles of this application, made any to repair
Change, equivalent replacement, improvement etc., should be included within the scope of protection of this application.
Claims (6)
1. a kind of circuit board, which is characterized in that including dielectric layer, conductive layer and cabling, on the dielectric layer have conduction region and
Nonconductive regions, the conductive layer are set to the conduction region, and connecting hole between plate, the cabling setting are opened up in the nonconductive regions
In in the nonconductive regions, and one end of the cabling is connected to connection hole between the plate, and the other end and the conductive layer connect
It connects；
Connecting hole is set as multiple between the plate, and connecting hole interval is arranged between each plate, and one end of the cabling connects simultaneously
It is connected to connection hole between each plate；
The center of connecting hole is located along the same line between each plate；
Straight line parallel between each plate where the center of connecting hole is in connecting hole is adjacent between the plate in the nonconductive regions
Edge；
The cabling includes first straight line section, changeover portion and second straight line section, and the first straight line section is connected between each plate
Connection hole, the second straight line section are connect by the changeover portion with the first straight line section, and the first straight line section with
The second straight line section is parallel.
2. circuit board according to claim 1, which is characterized in that the cabling further includes third straightway, the third
Straightway is connected between the second straight line section and the conductive layer, and the third straightway is relative to the second straight line section
Extending direction be obliquely installed.
3. circuit board according to claim 2, which is characterized in that the third straightway is relative to the second straight line section
It is tilted to the first straight line section side.
4. circuit board according to claim 1, which is characterized in that the changeover portion is arc-shaped transition section.
5. circuit board described in any one of -4 according to claim 1, which is characterized in that the quantity of connecting hole is four between the plate
It is a.
6. a kind of mobile terminal, which is characterized in that including circuit board of any of claims 1-5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611270863.6A CN106793466B (en) | 2016-12-30 | 2016-12-30 | circuit board and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611270863.6A CN106793466B (en) | 2016-12-30 | 2016-12-30 | circuit board and mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106793466A CN106793466A (en) | 2017-05-31 |
| CN106793466B true CN106793466B (en) | 2019-01-08 |
Family
ID=58952296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611270863.6A Expired - Fee Related CN106793466B (en) | 2016-12-30 | 2016-12-30 | circuit board and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106793466B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109429429B (en) * | 2017-09-01 | 2020-06-23 | 北大方正集团有限公司 | Manufacturing method of vertical wiring in printed circuit board and printed circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6181551B1 (en) * | 1998-04-15 | 2001-01-30 | Dell Usa, L.P. | Pin soldering enhancement and method |
| JP2002094194A (en) * | 2000-09-14 | 2002-03-29 | Hitachi Telecom Technol Ltd | Printed wiring board of electronic apparatus |
| CN201388341Y (en) * | 2009-03-05 | 2010-01-20 | 中兴通讯股份有限公司 | Flexible printed circuit board |
| CN104302097A (en) * | 2014-10-16 | 2015-01-21 | 深圳市华星光电技术有限公司 | Multilayer printed circuit board |
-
2016
- 2016-12-30 CN CN201611270863.6A patent/CN106793466B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6181551B1 (en) * | 1998-04-15 | 2001-01-30 | Dell Usa, L.P. | Pin soldering enhancement and method |
| JP2002094194A (en) * | 2000-09-14 | 2002-03-29 | Hitachi Telecom Technol Ltd | Printed wiring board of electronic apparatus |
| CN201388341Y (en) * | 2009-03-05 | 2010-01-20 | 中兴通讯股份有限公司 | Flexible printed circuit board |
| CN104302097A (en) * | 2014-10-16 | 2015-01-21 | 深圳市华星光电技术有限公司 | Multilayer printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106793466A (en) | 2017-05-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107565235A (en) | Electric connector | |
| CN104507271B (en) | The PCBA processing methods and PCBA board combined based on plug-in element technique and paster technique | |
| TW201112545A (en) | Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration | |
| CN201509370U (en) | Connecting assembly with plug-in unit | |
| CN109727737A (en) | Current-sense resistor and its manufacturing method | |
| CN206451877U (en) | Connector and the power supply with the connector | |
| CN106793466B (en) | circuit board and mobile terminal | |
| CN201234406Y (en) | Flexible printed circuit board | |
| CN205566796U (en) | Printed circuit board convenient to patch element wiring | |
| CN102593626A (en) | Flexible flat cable assembly and assembling method thereof | |
| CN106471870A (en) | Circuit structure | |
| CN107394568A (en) | Electric connector assembling method | |
| CN203040009U (en) | High heat conducting circuit board | |
| CN207560449U (en) | A kind of flexible PCB | |
| CN106252950A (en) | A kind of method preventing pricking with needle adapter pricking with needle to come off | |
| CN203896582U (en) | High-efficiency heat radiation type PCB | |
| CN201130730Y (en) | Plate-to-plate electric connector and circuit board assembly using the same | |
| CN101252808B (en) | Soldering circuit plate and soldering method thereof | |
| CN203040008U (en) | Printed circuit board with copper base embedded with circuit | |
| CN105491815A (en) | Reflow soldering template, template component, tin paste printing device and reflow soldering method | |
| CN102918710B (en) | Antenna radiation unit, feeding method and antenna system | |
| CN206134677U (en) | High resistance precision chip resistor of metal sheet structure high power | |
| CN109587947A (en) | A kind of circuit board | |
| CN104955272A (en) | Printed circuit board | |
| US10277093B2 (en) | Power tool and circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190108 Termination date: 20191230 |