CN106384105A - Manufacturing method of fingerprint recognition module - Google Patents
Manufacturing method of fingerprint recognition module Download PDFInfo
- Publication number
- CN106384105A CN106384105A CN201610926093.XA CN201610926093A CN106384105A CN 106384105 A CN106384105 A CN 106384105A CN 201610926093 A CN201610926093 A CN 201610926093A CN 106384105 A CN106384105 A CN 106384105A
- Authority
- CN
- China
- Prior art keywords
- fingerprint recognition
- motherboard
- module
- cover plate
- recognition chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 claims description 29
- 239000003292 glue Substances 0.000 claims description 15
- 238000010030 laminating Methods 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 14
- 239000000084 colloidal system Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 9
- 239000004593 Epoxy Substances 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 abstract description 11
- 230000007423 decrease Effects 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- VTLYHLREPCPDKX-UHFFFAOYSA-N 1,2-dichloro-3-(2,3-dichlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C(=C(Cl)C=CC=2)Cl)=C1Cl VTLYHLREPCPDKX-UHFFFAOYSA-N 0.000 description 1
- 208000031481 Pathologic Constriction Diseases 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 210000001215 vagina Anatomy 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
Landscapes
- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The invention discloses a manufacturing method of a fingerprint recognition module, comprising the following steps: jointing a fingerprint recognition chip motherboard and a cover plate motherboard to make a first module, wherein the fingerprint recognition chip motherboard comprises multiple fingerprint recognition chips arranged in an array, and the cover plate motherboard comprises multiple cover plates arranged in an array; cutting the first module to get second modules, wherein each second module includes the fingerprint recognition chip and the cover plate which are jointed together; mounting the second modules on a flexible circuit board to make the fingerprint recognition chips disposed between the flexible circuit board and the cover plates, so as to get the fingerprint recognition module. By using the manufacturing method of a fingerprint recognition module provided by the invention, the production efficiency can be improved.
Description
Technical field
The present invention relates to fingerprint recognition field, more particularly, to a kind of manufacture method of fingerprint recognition module.
Background technology
Along with the rise of fingerprint identification technology, as the carrier of fingerprint identification technology, fingerprint recognition module in a large number should
With on the terminal device, fingerprint identification function is increasingly becoming the standard configuration function of terminal unit.In prior art, fingerprint recognition mould
The manufacture process of group has that production efficiency is low.
Content of the invention
In view of this, the invention provides a kind of manufacture method of fingerprint recognition module, it is possible to increase production efficiency.
A kind of manufacture method of fingerprint recognition module, including：Fingerprint recognition chip motherboard is fitted with cover plate motherboard to make
Become the first module, described fingerprint recognition chip motherboard includes multiple fingerprint recognition chips of array arrangement, described cover plate motherboard bag
Include multiple cover plates of array arrangement；Described first module is cut to be partitioned into the second module, described second module includes fitting
Described fingerprint recognition chip together and described cover plate；Described second module is mounted on flexible PCB so that described
Fingerprint recognition chip is located between described flexible PCB and described cover plate, to make described fingerprint recognition module.
Wherein, described fingerprint recognition chip motherboard is fitted with cover plate motherboard including：In described fingerprint recognition chip motherboard
And/or colloid is coated with described cover plate motherboard；Described fingerprint recognition chip motherboard and described cover plate motherboard are carried out para-position；To institute
State fingerprint recognition chip motherboard and described cover plate motherboard pressure, so that described fingerprint recognition chip motherboard is led to described cover plate motherboard
Cross described colloid laminating.
Wherein, described colloid is liquid glue.
Wherein, the coating speed of described liquid glue is 3～20mm/s.
Wherein, the coating air pressure of described liquid glue is 10～300Kpa.
Wherein, described described second module is mounted on flexible PCB includes：Will be described using surface mounting technology
Second module is mounted on described flexible PCB.
Wherein, described fingerprint recognition chip is epoxy encapsulation.
Thus, the manufacture method of the present invention, employing first will be whole with described cover plate motherboard for described fingerprint recognition chip motherboard
Version laminating forms described first module, more described first module is carried out with cutting forms described second module, finally by described the
Two modules are mounted on the mode on described flexible PCB.Compared to prior art, due to only needing to described first module is entered
Row cutting, and without cutting to described fingerprint recognition chip motherboard and described cover plate motherboard respectively, therefore decrease cutting
Number of times.In laminating, just multiple cover plates can be attached on multiple fingerprint recognition chips due to only needing to once fit, and without
Repeatedly carry out fitting of fingerprint recognition chip and cover plate, therefore decrease laminating number of times again.Thus, this manufacture method is greatly improved
Production efficiency.
Brief description
For more clearly illustrating structural features and effect of the present invention, it is entered with specific embodiment below in conjunction with the accompanying drawings
Row describes in detail.
Fig. 1 is the schematic flow block diagram of the manufacture method of fingerprint recognition module provided in an embodiment of the present invention.
Fig. 2 is the process flow diagram of the manufacture method shown in Fig. 1.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes.Obviously, described embodiment is a part of embodiment of the present invention, rather than whole embodiments.Based on this
Embodiment in bright, the every other reality that those of ordinary skill in the art are obtained on the premise of not making creative work
Apply example, all should belong to the scope of protection of the invention.
As shown in figure 1, embodiments providing a kind of manufacture method 100 of fingerprint recognition module, including：
S110, fingerprint recognition chip motherboard is fitted with cover plate motherboard to make the first module, described fingerprint recognition chip
Motherboard includes multiple fingerprint recognition chips of array arrangement, and described cover plate motherboard includes multiple cover plates of array arrangement；
S120, described first module is cut to be partitioned into the second module, described second module includes fitting together
Described fingerprint recognition chip and described cover plate；
S130, described second module is mounted on flexible PCB so that described fingerprint recognition chip is positioned at described soft
Property is between circuit board and described cover plate, to make described fingerprint recognition module.
In the manufacture process of fingerprint recognition module, fingerprint recognition chip motherboard and cover plate motherboard can be prepared respectively.Fingerprint
Identification chip motherboard is made up of multiple fingerprint recognition chips of array arrangement, and described fingerprint recognition chip can adopt epoxy resin
Encapsulation or other various encapsulation technology manufactures.Cover plate motherboard is made up of multiple cover plates of array arrangement.To be referred to using cutting technique
Stricture of vagina identification chip motherboard and cover plate motherboard carry out cutting splitting, can be partitioned into fingerprint recognition chip and cover plate.
Specifically, in S110, fingerprint recognition chip motherboard is fitted with cover plate motherboard to make the first module.Described
First module is formed by the laminating of above-mentioned two-layer motherboard, continues to it is processed in subsequent technique.
Further, described fingerprint recognition chip motherboard is fitted with cover plate motherboard including：
Colloid is coated with described fingerprint recognition chip motherboard and/or described cover plate motherboard；
Described fingerprint recognition chip motherboard and described cover plate motherboard are carried out para-position；
To described fingerprint recognition chip motherboard and described cover plate motherboard pressure, so that described fingerprint recognition chip motherboard and institute
State cover plate motherboard to fit by described colloid.
Specifically, described colloid can only be coated on described fingerprint recognition chip motherboard or on described cover plate motherboard,
Or both it is coated with described colloid.In the present embodiment, described colloid is liquid glue.Liquid glue has good mobility,
When being coated with described fingerprint recognition chip motherboard or on the larger base material of this kind of spreading area of described cover plate motherboard, painting can be reduced
The harmful effect to coating homogeneity for the flatness defect of cloth cover.Liquid glue is less expensive, therefore reduces Material Cost.In addition right
For coating apparatus, liquid glue coating process is simple, is more easy to realize.Certainly, in other embodiments, it is not limited to use liquid
Glue.In the present embodiment, the coating speed of liquid glue is 3～20mm/s, and coating air pressure is 10～300Kpa.This painting parameter is set
It is able to ensure that the coating weight of liquid glue, it is to avoid the situation of starved and excessive glue in laminating layer.Certainly, in other embodiments, apply
Cloth parameter can be determined as the case may be.
After colloid is coated with, described fingerprint recognition chip motherboard and described cover plate motherboard are carried out para-position.Described fingerprint
Identification chip motherboard with described cover plate motherboard during fabrication, has pre-set alignment mark thereon.By above-mentioned two-layer motherboard
Alignment mark alignment, you can complete para-position, in order to continue subsequent technique.
After described fingerprint recognition chip motherboard is completed with described cover plate motherboard para-position, equipment will be to above-mentioned two-layer motherboard
Applying pressure makes it be pasted together, thus forming described first module.Force intensity and force time are given as the case may be
To set.
In other embodiments, described fingerprint recognition chip motherboard can also be completed using other modes female with described cover plate
The attaching process of plate.
In S120, cutting splitting is carried out to described first module, obtain described second module to split.And then,
In S130, described second module is mounted on described flexible PCB, thus making described fingerprint recognition module.The present embodiment
In, complete fitting of described second module and described flexible PCB using surface mounting technology (SMT).In other embodiment
In, the attachment of described second module can also be carried out using other modes.
The manufacture method 100 of the present embodiment, using first by described fingerprint recognition chip motherboard and described cover plate motherboard justifying
Laminating, then cut, finally mount the mode of described flexible PCB.And prior art is first respectively to described fingerprint recognition
Chip motherboard and described cover plate motherboard are cut to obtain single fingerprint recognition chip and single cover plate, more single fingerprint is known
Other chip and flexible PCB mount, and finally module obtained in the previous step and cover plate fit (actually gained module again
In fingerprint recognition chip fit with cover plate, fingerprint recognition chip is located between cover plate and flexible PCB) final to obtain
Product.Compared to prior art, described first module that this manufacture method 100 only needs to the laminating of above-mentioned justifying is obtained is cut
Cut, and without cutting to described fingerprint recognition chip motherboard and described cover plate motherboard respectively, therefore decrease cutting times.
In laminating it is only necessary to once laminating just multiple cover plates can be attached on multiple fingerprint recognition chips, and without repeatedly carrying out
Fingerprint recognition chip is fitted with cover plate, therefore decreases laminating number of times again.Thus, this manufacture method 100 greatly improves life
Produce efficiency.And, due to employing that price is less expensive, mobility more preferably, the liquid glue realized is more easy on equipment, thus reducing
Material Cost, improve laminating quality.
Fig. 2 more intuitively shows the technological process of this manufacture method 100.As shown in Fig. 2 fingerprint recognition chip motherboard
10 make the first module 30 with cover plate motherboard 20 through the laminating step of S110.First module 30 is through the cutting step shape of S120
Become the second module 310.Second module 310 and flexible PCB 40, through the attachment step of S130, form fingerprint recognition module 50.
Due to being described in detail to this manufacture method 100 above, repeat no more herein for brevity.
The above, the only specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, and any
Those familiar with the art the invention discloses technical scope in, can easily expect various equivalent modifications or
Replace, these modifications or replacement all should be included within the scope of the present invention.Therefore, protection scope of the present invention Ying Yiquan
The protection domain that profit requires is defined.
Claims (7)
1. a kind of manufacture method of fingerprint recognition module is it is characterised in that include：
Fingerprint recognition chip motherboard is fitted to make the first module with cover plate motherboard, described fingerprint recognition chip motherboard includes battle array
Multiple fingerprint recognition chips of row arrangement, described cover plate motherboard includes multiple cover plates of array arrangement；
Described first module is cut to be partitioned into the second module, the described fingerprint that described second module includes fitting together is known
Other chip and described cover plate；
Described second module is mounted on flexible PCB so that described fingerprint recognition chip be located at described flexible PCB with
Between described cover plate, to make described fingerprint recognition module.
2. manufacture method according to claim 1 it is characterised in that described by fingerprint recognition chip motherboard and cover plate motherboard
Laminating includes：
Colloid is coated with described fingerprint recognition chip motherboard and/or described cover plate motherboard；
Described fingerprint recognition chip motherboard and described cover plate motherboard are carried out para-position；
To described fingerprint recognition chip motherboard and described cover plate motherboard pressure, so that described fingerprint recognition chip motherboard and described lid
Plate motherboard is fitted by described colloid.
3. manufacture method according to claim 2 is it is characterised in that described colloid is liquid glue.
4. manufacture method according to claim 3 is it is characterised in that the coating speed of described liquid glue is 3～20mm/s.
5. manufacture method according to claim 4 it is characterised in that described liquid glue coating air pressure be 10～
300Kpa.
6. the manufacture method according to any one of claim 1-5 is it is characterised in that described mount described second module
Flexible PCB includes：
Using surface mounting technology, described second module is mounted on described flexible PCB.
7. the manufacture method according to any one of claim 1-5 is it is characterised in that described fingerprint recognition chip is epoxy
Resin-encapsulated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610926093.XA CN106384105B (en) | 2016-10-29 | 2016-10-29 | The manufacturing method of fingerprint recognition mould group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610926093.XA CN106384105B (en) | 2016-10-29 | 2016-10-29 | The manufacturing method of fingerprint recognition mould group |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106384105A true CN106384105A (en) | 2017-02-08 |
| CN106384105B CN106384105B (en) | 2019-02-19 |
Family
ID=57957033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610926093.XA Expired - Fee Related CN106384105B (en) | 2016-10-29 | 2016-10-29 | The manufacturing method of fingerprint recognition mould group |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106384105B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107145254A (en) * | 2017-03-24 | 2017-09-08 | 江西合力泰科技有限公司 | Bio-identification module with pressure inducing function |
| CN107153826A (en) * | 2017-05-26 | 2017-09-12 | 广东欧珀移动通信有限公司 | The preparation method and fingerprint recognition module of fingerprint recognition module |
| CN107341450A (en) * | 2017-06-16 | 2017-11-10 | 广东欧珀移动通信有限公司 | The preparation method of fingerprint recognition module and the preparation method of input module |
| CN107639355A (en) * | 2017-11-09 | 2018-01-30 | 信利光电股份有限公司 | A kind of fingerprint recognition module and applying method and electronic equipment |
| CN108734068A (en) * | 2017-04-21 | 2018-11-02 | 致伸科技股份有限公司 | Fingerprint sensing unit impression system and its method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105046244A (en) * | 2015-08-28 | 2015-11-11 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module group and preparation method therefor as well as electronic equipment provided with fingerprint identification module group |
| CN105069443A (en) * | 2015-08-31 | 2015-11-18 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition module and fingerprint recognition module preparation method |
| CN105224926A (en) * | 2015-10-09 | 2016-01-06 | 广东欧珀移动通信有限公司 | Fingerprint recognition module installation method and fingerprint recognition module mounting structure |
| CN105551985A (en) * | 2016-01-21 | 2016-05-04 | 昆山紫芯微电子科技有限公司 | Packaging method for fingerprint identification module, and fingerprint identification module |
| CN105930799A (en) * | 2016-04-21 | 2016-09-07 | 蓝思科技（长沙）有限公司 | Fingerprint recognition module group and preparation method thereof |
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2016
- 2016-10-29 CN CN201610926093.XA patent/CN106384105B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105046244A (en) * | 2015-08-28 | 2015-11-11 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module group and preparation method therefor as well as electronic equipment provided with fingerprint identification module group |
| CN105069443A (en) * | 2015-08-31 | 2015-11-18 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition module and fingerprint recognition module preparation method |
| CN105224926A (en) * | 2015-10-09 | 2016-01-06 | 广东欧珀移动通信有限公司 | Fingerprint recognition module installation method and fingerprint recognition module mounting structure |
| CN105551985A (en) * | 2016-01-21 | 2016-05-04 | 昆山紫芯微电子科技有限公司 | Packaging method for fingerprint identification module, and fingerprint identification module |
| CN105930799A (en) * | 2016-04-21 | 2016-09-07 | 蓝思科技（长沙）有限公司 | Fingerprint recognition module group and preparation method thereof |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107145254A (en) * | 2017-03-24 | 2017-09-08 | 江西合力泰科技有限公司 | Bio-identification module with pressure inducing function |
| CN107145254B (en) * | 2017-03-24 | 2023-05-23 | 江西合力泰科技有限公司 | Biological identification module with pressure sensing function |
| CN108734068A (en) * | 2017-04-21 | 2018-11-02 | 致伸科技股份有限公司 | Fingerprint sensing unit impression system and its method |
| CN107153826A (en) * | 2017-05-26 | 2017-09-12 | 广东欧珀移动通信有限公司 | The preparation method and fingerprint recognition module of fingerprint recognition module |
| CN107153826B (en) * | 2017-05-26 | 2020-01-10 | Oppo广东移动通信有限公司 | Manufacturing method of fingerprint identification module and fingerprint identification module |
| CN107341450A (en) * | 2017-06-16 | 2017-11-10 | 广东欧珀移动通信有限公司 | The preparation method of fingerprint recognition module and the preparation method of input module |
| CN107341450B (en) * | 2017-06-16 | 2020-11-20 | Oppo广东移动通信有限公司 | Manufacturing method of fingerprint identification module and manufacturing method of input assembly |
| CN107639355A (en) * | 2017-11-09 | 2018-01-30 | 信利光电股份有限公司 | A kind of fingerprint recognition module and applying method and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106384105B (en) | 2019-02-19 |
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Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330000 east of Xueyuan 6th Road, south of Tianxiang Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330000 east of Xueyuan 6th Road, south of Tianxiang Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330029 No. 1189 Jingdong Avenue, Nanchang high tech Zone, Jiangxi Patentee before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190219 |