CN105069443A - Fingerprint recognition module and fingerprint recognition module preparation method - Google Patents
Fingerprint recognition module and fingerprint recognition module preparation method Download PDFInfo
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- CN105069443A CN105069443A CN201510547279.XA CN201510547279A CN105069443A CN 105069443 A CN105069443 A CN 105069443A CN 201510547279 A CN201510547279 A CN 201510547279A CN 105069443 A CN105069443 A CN 105069443A
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- chip
- fingerprint recognition
- recognition module
- ink layer
- tin cream
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
Abstract
The invention brings forward a fingerprint recognition module and a module preparation method. To be specific, the fingerprint recognition module includes a flexible circuit board, a chip and a printing ink layer. The chip includes a fingerprint recognition sensor, is arranged on the top surface of the flexible circuit board, and is electrically connected to the flexible circuit board through solder paste. The printing ink layer is disposed on the top surface of the chip. In this way, a fingerprint recognition function can be exhibited by means of the chip equipped with the fingerprint recognition sensor, and thus the use effect of the fingerprint recognition module is improved.
Description
Technical field
The present invention relates to electronic applications.Particularly, the present invention relates to fingerprint recognition module and fingerprint recognition module preparation method.
Background technology
Along with the development of electronic technology, personal electronic equipments is more and more to multifunction and hommization future development.Such as, in recent years in the electronic device, more and more with the addition of the functions such as such as password setting, fingerprint recognition, to improve the safe class of electronic equipment.Therefore, relevant to fingerprint identification function technology and electron device obtain to be paid close attention to widely.
Current fingerprint recognition module, exists and causes chip surface poor flatness, fingerprint recognition module to produce the undesirable situation of yield due to chip sides residual ink.Inventor finds through further investigation, this is owing to carrying out wafer cutting and after being arranged on flexible PCB by welding by opening greatly chip packing-body, carrying out the setting of ink layer again, causing ink layer when welding because variable color, cracking and causing can occur high temperature.In addition, inventor finds, the chip had compared with small size is defined owing to cutting rear large chip packing-body, therefore when arranging ink layer by spraying, the side of chip can be caused to form ink residue, and comparatively large compared with the chip surface tension force of small size owing to having, usually there is ink layer out-of-flatness, core amasss oil condition, thus affect flatness and the product yield of fingerprint recognition module entirety.
Summary of the invention
In a first aspect of the present invention, the invention provides a kind of fingerprint recognition module.According to embodiments of the invention, this fingerprint recognition module comprises: flexible PCB; Chip, containing fingerprint Identification sensor in described chip, and described chip is arranged on the upper surface of described flexible PCB, and described chip is electrically connected with described flexible PCB by tin cream; And ink layer, described ink layer is arranged on the upper surface of described chip.Thus, by the chip containing fingerprint Identification sensor for this module provides fingerprint identification function, and fingerprint recognition module rational in infrastructure can be formed by above-mentioned parts, so improve fingerprint recognition module in the embodiment of the present invention prepare yield and result of use.
According to embodiments of the invention, in this fingerprint recognition module, described tin cream comprises at least one be selected from following alloy: SnBi, SnBiAg and SnInBi.Thus, the tin cream that can be formed by above-mentioned alloy completes the electrical connection of chip and flexible PCB, so can improve this fingerprint recognition module prepare yield.
According to embodiments of the invention, in this fingerprint recognition module, described tin cream has the fusing point of 100 ~ 150 degrees Celsius.Thus, chip and flexible PCB can be connected by having compared with the tin cream of low melting point, and then avoid in welding process temperature for the impact of ink layer, thus improve the situation such as the variable color of fingerprint recognition module ink layer, cracking in the embodiment of the present invention.
According to embodiments of the invention, described tin cream has the Reflow Soldering temperature of 150 ~ 200 degrees Celsius.Thus, chip and flexible PCB can be connected by the tin cream with lower Reflow Soldering temperature, and then keep away in welding process temperature for the impact of ink layer, thus improve in the embodiment of the present invention situations such as the variable color of fingerprint recognition module ink layer, cracking.
According to embodiments of the invention, described ink layer comprises further: undercoat, and described undercoat is arranged on the upper surface of described chip; Color layers, described color layers is arranged on the upper surface of described undercoat; And protective seam, described protective seam is arranged on the upper surface of described color layers.Thus, by said structure for this fingerprint recognition module provides the ink layer with good stability, thus the result of use of fingerprint recognition module in the embodiment of the present invention can be improved.
According to embodiments of the invention, described ink layer is formed by a kind of mode in spraying, serigraphy and transfer printing.Thus, ink layer can be formed conveniently by modes such as sprayings, and then saved preparation cost and simplified processing procedure, thus further increase cost performance and the result of use of fingerprint recognition module in the embodiment of the present invention.
In a second aspect of the present invention, the present invention proposes a kind of method preparing fingerprint recognition module.According to embodiments of the invention, the method comprises: (1) provides chip, and containing fingerprint Identification sensor in described chip, and the upper surface of described chip is formed with ink layer; (2) by tin cream, the lower surface of described chip is fitted to the upper surface of flexible PCB, and described chip is electrically connected with described flexible PCB, to obtain described fingerprint recognition module.Thus, the setting carrying out ink layer after chip is connected with flexible PCB can be avoided by said process, and then chip sidewall can be avoided to form residual ink and chip center amass oil to the flatness of this fingerprint recognition module and the impact of result of use, thus improve fingerprint recognition module in the embodiment of the present invention further prepare yield and result of use.
According to embodiments of the invention, in step (1), described chip obtains through the following steps: (1-1) encapsulates multiple fingerprint Identification sensor, to obtain a large chip packing-body; (1-2) described ink layer is formed at the upper surface of described large chip packing-body; (1-3) described large the chip packing-body being formed with described ink layer obtained in step (1-2) is cut, to obtain described chip, optionally, described ink layer is formed by a kind of mode in spraying, serigraphy and transfer printing.Thus, the setting of ink layer can be completed before forming the less chip of area, and then avoid chip sidewall to form residual ink and chip center amassing oil to the flatness of this fingerprint recognition module and the impact of result of use, thus improve fingerprint recognition module in the embodiment of the present invention further prepare yield and result of use.
According to embodiments of the invention, described ink layer is formed through the following steps: (a) forms undercoat at the upper surface of described large chip packing-body; B () forms color layers at the upper surface of described undercoat; And (c) forms protective seam at the upper surface of described color layers.Thus, the setting of ink layer can be completed by above-mentioned steps, and by said structure for this fingerprint recognition module provides the ink layer with good stability, thus improve the result of use of the fingerprint recognition module prepared in the embodiment of the present invention.
According to embodiments of the invention, in step (2), pass through reflow soldering, adopt described tin cream, the lower surface of described chip is fitted to the upper surface of described flexible PCB, wherein, the temperature of described reflow soldering is 150 ~ 200 degrees Celsius, optionally, described tin cream comprises at least one be selected from following alloy: SnBi, SnBiAg and SnInBi.Thus, welding can be completed by the tin cream with above-mentioned Reflow Soldering temperature, thus avoid temperature in welding process on the impact of ink layer, to avoid variable color and the cracking of ink layer, and then improve fingerprint recognition module in the embodiment of the present invention prepare yield and result of use.
Accompanying drawing explanation
Fig. 1 shows the structural representation of fingerprint recognition module according to an embodiment of the invention;
Fig. 2 shows the part-structure schematic diagram of fingerprint recognition module in accordance with another embodiment of the present invention;
Fig. 3 shows the part-structure schematic diagram of the fingerprint recognition module according to another embodiment of the present invention;
Fig. 4 shows the part-structure schematic diagram of the fingerprint recognition module according to another embodiment of the present invention;
Fig. 5 shows the schematic flow sheet of the method preparing fingerprint recognition module according to an embodiment of the invention;
Fig. 6 shows the schematic flow sheet of the method preparing fingerprint recognition module in accordance with another embodiment of the present invention; And
Fig. 7 shows the schematic flow sheet preparing the method for fingerprint recognition module according to another embodiment of the present invention;
Description of reference numerals:
100: flexible PCB
200: chip
210: fingerprint Identification sensor
300: ink layer
310: undercoat
320: color layers
330: protective seam
400: tin cream
500: open chip packing-body greatly
Embodiment
Be described below in detail embodiments of the invention, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Being exemplary below by the embodiment be described with reference to the drawings, only for explaining the present invention, and can not limitation of the present invention being interpreted as.
In a first aspect of the present invention, the present invention proposes a kind of fingerprint recognition module.According to embodiments of the invention, with reference to figure 1, this fingerprint recognition module comprises: flexible PCB 100, chip 200, ink layer 300 and tin cream 400.Chip 200 is arranged on the upper surface of flexible PCB 100, and is formed with flexible PCB 100 be electrically connected by tin cream 400.Further, at the upper surface of chip 200, ink layer 300 is provided with.Particularly, with reference to figure 4, according to embodiments of the invention, encapsulation is carried out to multiple fingerprint Identification sensor 210 and forms a large chip packing-body 500, chip 200 by open greatly chip packing-body 500 carry out wafer cut is formed, in chip 200 contain fingerprint Identification sensor 210.Thus, can by the chip 200 containing fingerprint Identification sensor 210 for this module provides fingerprint identification function, and form fingerprint recognition module rational in infrastructure by above-mentioned parts, and then in the raising embodiment of the present invention, fingerprint recognition module prepares yield and result of use.
Particularly, according to embodiments of the invention, tin cream 400 has the fusing point of 100 ~ 150 degrees Celsius, and the Reflow Soldering temperature of 150 ~ 200 degrees Celsius.Inventor finds through further investigation, the tin cream adopted due to traditional fingerprint recognition module is generally SnAgCu alloy tin cream, its fusing point is more than 200 degrees Celsius, and there is higher reflow soldering temperature, be generally 230 ~ 280 degrees Celsius, therefore carrying out in welding process, needing fingerprint recognition module to be heated to higher temperature.But ink layer there will be the situation such as variable color, cracking at relatively high temperatures, chip is first fitted on flexible PCB by tin cream by therefore traditional fingerprint recognition module general employing in preparation process, form ink layer at the upper surface of chip again, thus avoid the destruction that high-temperature soldering process causes ink layer.But because chip has less surface area and larger surface tension, therefore in the process of ink layer formation, oil is amassed because surface tension effects is formed in the center of usually causing the side of chip to there is residual ink and chip upper surface.According to embodiments of the invention, tin cream 400 adopts and comprises at least one be selected from following alloy: SnBi, SnBiAg and SnInBi.Thus, can, while guarantee welding quality, tin cream 400 be made to have lower fusing point and reflow soldering temperature.Inventor finds through great many of experiments, welds under the fusing point and Reflow Soldering temperature of tin cream 400, can not produce destroy the structure of ink layer 300.In other words, under the fusing point and Reflow Soldering temperature of the tin cream 400 according to the embodiment of the present invention, can not there is the situation such as variable color, cracking in ink layer 300.Therefore, first ink layer 300 can be formed at the circuit surface with appropriate configuration, carry out laminating process again, thus avoid the destruction because high-temperature soldering causes ink layer 300, and then the yield of preparing of this fingerprint recognition module caused due to central product oil and chip 200 sidewall residual ink can be avoided to decline.
In addition, according to embodiments of the invention, ink layer 300 can be formed by a kind of mode in spraying, serigraphy or transfer printing.Thus, ink layer 300 can be formed at the upper surface of chip 200 easily.Wherein, according to embodiments of the invention, with reference to figure 2, ink layer 300 may further include: undercoat 310, color layers 320 and protective seam 330.Undercoat 310 is arranged on the upper surface of chip 200, combines with chip 200, is used for increasing the adhesive ability of this layer and color layers 320, so that in the module making color layers 320 can be fixed on more closely according to the embodiment of the present invention.According to embodiments of the invention, color layers 320 can have different colors, such as, black, white etc., to make this fingerprint recognition module have different colors, to make chip 200 opaque, and invisible to user, thus make this fingerprint recognition module more attractive in appearance.In addition, ink layer 300 can also comprise protective seam 330.Protective seam 330 is arranged on the upper surface of color layers 320, for ink layer 300 provides protection, avoids causing ink layer 300 surface to form cut in use procedure owing to frequently contacting.Thus, by said structure for this fingerprint recognition module provides the ink layer with good stability, thus the result of use of fingerprint recognition module in the embodiment of the present invention can be improved.
Owing to have employed the tin cream 400 had compared with low melting point and lower reflow soldering temperature according to the embodiment of the present invention, the structure of ink layer 300 can not be destroyed in welding process, therefore ink layer 300 can be set in advance in the parts surface with large surface area and appropriate configuration, then form chip 200 by following process.According to embodiments of the invention, with reference to figure 3, by forming ink layer 300 at the upper surface of a large chip packing-body 500, then by cutting an above-mentioned large chip packing-body 500 containing ink layer 300, chip 200 can be formed.Particularly, according to embodiments of the invention, with reference to figure 4, a large chip packing-body 500 is by being undertaken encapsulating being formed by multiple fingerprint Identification sensors 210 with certain arrangement mode.Wherein, according to embodiments of the invention, when forming large chip packing-body 500, the arrangement mode of fingerprint Identification sensor 210 is not particularly limited, those skilled in the art can according to the connection of actual conditions and flexible PCB 100, selection can realize the arrangement mode arrangement fingerprint Identification sensor 210 of fingerprint identification function and encapsulate, and forms a large chip packing-body 500.According to embodiments of the invention, ink layer 300 is formed in the upper surface of a large chip packing-body 500.Then, by carrying out wafer cutting to a large chip packing-body 500, chip 200 is formed.Because ink layer 300 is the upper surfaces being set in advance in large chip packing-body 500, the upper surface of the chip 200 therefore formed after wafer cutting is also formed with ink layer 300.Because ink layer 300 is upper surfaces of being set in advance in large the chip packing-body 500 with larger area, therefore avoid and that cause ink layer 300 skewness even long-pending oily problem excessive due to surface tension.Further, after forming chip 200 by the large chip packing-body 500 of cutting, do not need to carry out the setting of ink layer 300, and then solve the problem that chip 200 side forms residual ink.Therefore, chip 200 sidewall is not containing ink according to an embodiment of the invention, is structurally different from chip of the prior art.Thus, cut again by first forming ink layer 300, and then chip 200 side of avoiding cutting rear spray oil layer of ink and causing forms residual ink, and the core of the chip 200 to cause due to surface tension produces long-pending oil, thus improve fingerprint recognition module in the embodiment of the present invention prepare yield and result of use.
In addition, according to embodiments of the invention, chip 200 can be arranged on the upper surface of flexible PCB 100 by surface mount.Surface mounting technology, is also called SMT (SurfaceMountedTechnology), is current electronic applications Application comparison package technique widely.Surface mounting technology, without the need to carrying out brill plug-in opening to circuit board, can fit to circuit board surface by directly needing the components and parts connected, and components and parts and circuit board is formed be electrically connected by welding and complete the assembling process of device.Thus, according to embodiments of the invention, adopt surface mounting technology chip 200 to be fitted to the upper surface of flexible PCB 100, the procedure for producing producing this fingerprint recognition module can be simplified, and reduce the production cost of this module.Particularly, according to embodiments of the invention, first the part of laminating chip 200 is needed to carry out the setting of tin cream 400 at the upper surface of flexible PCB 100.Subsequently, the chip 200 by glue upper surface being formed with ink layer 300 is fixed on above-mentioned position, then adopts reflow soldering, is realized the electrical connection of chip 200 and flexible PCB 100 by tin cream 400.Thus, supermatic surface mount process can be had by above-mentioned, complete the laminating of chip 200 and flexible PCB 100, chip 200 is arranged on the upper surface of flexible PCB 100, and then simplifies the procedure for producing of fingerprint recognition module in the embodiment of the present invention and reduce the production cost of this module.
In a second aspect of the present invention, the present invention proposes a kind of method preparing fingerprint recognition module.According to embodiments of the invention, with reference to figure 5, the method comprises:
S100: chip is provided
According to embodiments of the invention, in this step, for this fingerprint recognition module provides the chip containing ink layer.Thus, the method of chip is formed again by pre-setting ink layer, chip sidewall can be avoided to form residual ink and chip center and to amass the flatness of fingerprint recognition module and the impact of result of use that oil prepared the method, thus improve fingerprint recognition module in the embodiment of the present invention further prepare yield and result of use.
Particularly, according to embodiments of the invention, can complete through the following steps with reference to figure 6, S100:
S110: encapsulation
In this step, according to embodiments of the invention, in this step, multiple fingerprint Identification sensor is encapsulated, form a large chip packing-body.Particularly, according to embodiments of the invention, with reference to figure 4, multiple fingerprint Identification sensor can be arranged according to a graded, and above-mentioned multiple fingerprint Identification sensor is encapsulated, make multiple fingerprint Identification sensor be formed in an entirety with larger area and open greatly chip packing-body inside.Wherein, the arrangement mode of fingerprint Identification sensor is not particularly limited.Those skilled in the art can according to actual conditions and the fingerprint recognition module demand for fingerprint Identification sensor, selects to realize the arrangement mode arrangement fingerprint Identification sensor of fingerprint identification function and encapsulates, forming a large chip packing-body.Thus, a large chip packing-body with large surface area can be obtained, and then be convenient to subsequent ink spraying process and realize the even setting of ink layer, and be conducive to producing in batches, and then improve cost performance and the result of use of fingerprint recognition module in the embodiment of the present invention.
S120: ink layer is set
According to embodiments of the invention, in this step, ink layer is formed at the upper surface of a large chip packing-body.Particularly, by a kind of mode in spraying, serigraphy or transfer printing, ink layer can be formed at the upper surface of a large chip packing-body.Thus, by having large surface area and less capillary surface formation ink layer, and then the homogeneity of ink layer can be ensured.
In addition, according to embodiments of the invention, with reference to figure 7, ink layer can also be formed by following steps:
S10: form undercoat
According to embodiments of the invention, first form undercoat at the upper surface of a large chip packing-body.According to embodiments of the invention, undercoat can increase the adhesive ability of this layer and the structure of follow-up formation, so that in the module enabling ink layer be fixed on more closely according to the embodiment of the present invention.Thus, by forming undercoat, for this fingerprint recognition module provides the ink layer with good stability, thus the result of use of fingerprint recognition module in the embodiment of the present invention can be improved.
S20: form color layers
According to embodiments of the invention, in this step, color layers is formed at the upper surface of undercoat.Particularly, according to embodiments of the invention, color layers can have different colors, such as, black, white etc., to make this fingerprint recognition module have different colors, make this module opaque, and invisible to user, thus make this fingerprint recognition module more attractive in appearance.
S30: form protective seam
According to embodiments of the invention, at the upper surface of color layers, form protective seam.In other words, protective seam is arranged on the upper surface of color layers, for ink layer 300 provides protection.Thus, can avoid in use procedure, causing owing to frequently contacting ink layer surface to form cut, thus improve the result of use of fingerprint recognition module in the embodiment of the present invention.
S130: cutting
According to embodiments of the invention, with reference to figure 6, in this step, the large chip packing-body containing ink layer is cut, to obtain chip.Before forming chip, first define ink layer at the upper surface of a large chip packing-body, the upper surface of the chip therefore formed after cutting is also containing ink layer.Thus, the setting of ink layer can be completed before forming the less chip of area, and then avoid chip sidewall to form residual ink and chip center amassing oil to the flatness of this fingerprint recognition module and the impact of result of use, thus improve fingerprint recognition module in the embodiment of the present invention further prepare yield and result of use.
S200: tin cream is fitted
According to embodiments of the invention, in this step, by tin cream, chip is fitted to the upper surface of flexible PCB, and chip is formed with flexible PCB be electrically connected, to obtain the fingerprint recognition film group according to the embodiment of the present invention.
Wherein, the tin cream used in this step comprises at least one be selected from following alloy: SnBi, SnBiAg and SnInBi.Inventor finds through further investigation and great many of experiments, and the tin cream be made up of above-mentioned alloy, has lower fusing point.Further, the ink layer arranged by step S120, under this melting temperature, can't to be ftractureed, variable color.Thus, can by adopting according to the tin cream of the embodiment of the present invention, ensure chip and flexible PCB fit the degree of reliability prerequisite under, realization first arranges ink layer, then carries out the possibility of tin cream laminating.That therefore can improve fingerprint recognition module in the embodiment of the present invention further prepares yield and result of use.
In addition, according to embodiments of the invention, in step s 200, by reflow soldering, adopt above-mentioned tin cream that the lower surface of chip is fitted to the upper surface of flexible PCB, the temperature of reflow soldering is 150 ~ 200 degrees Celsius.Thus, the laminating of chip and flexible PCB can be completed by the solder reflow process with above-mentioned Reflow Soldering temperature, thus avoid high-temperature soldering on the impact of ink layer, avoid variable color and the cracking of ink layer, so improve fingerprint recognition module in the embodiment of the present invention prepare yield and result of use.
In describing the invention, term " longitudinal direction ", " transverse direction ", " on ", D score, "front", "rear", "left", "right", " vertically ", " level ", " top ", the orientation of the instruction such as " end " or position relationship be based on orientation shown in the drawings or position relationship, be only the present invention for convenience of description instead of require that the present invention with specific azimuth configuration and operation, therefore must can not be interpreted as limitation of the present invention.
In the present invention, unless otherwise clearly defined and limited, term " is connected ", " connection ", the term such as " combination " should be interpreted broadly, and such as, can be directly be connected, also indirectly can be connected by intermediate member.For the ordinary skill in the art, above-mentioned term concrete meaning in the present invention can be understood as the case may be, as long as meet according to the annexation between all parts of the embodiment of the present invention.
In the description of this instructions, specific features, structure, material or feature that the description of reference term " embodiment ", " another embodiment " etc. means to describe in conjunction with this embodiment are contained at least one embodiment of the present invention.In this manual, to the schematic representation of above-mentioned term not must for be identical embodiment or example.And the specific features of description, structure, material or feature can combine in one or more embodiment in office or example in an appropriate manner.In addition, when not conflicting, the feature of the different embodiment described in this instructions or example and different embodiment or example can carry out combining and combining by those skilled in the art.
Although illustrate and describe embodiments of the invention above, be understandable that, above-described embodiment is exemplary, can not be interpreted as limitation of the present invention, and those of ordinary skill in the art can change above-described embodiment within the scope of the invention, revises, replace and modification.
Claims (10)
1. a fingerprint recognition module, is characterized in that, comprising:
Flexible PCB;
Chip, containing fingerprint Identification sensor in described chip, and described chip is arranged on the upper surface of described flexible PCB, and described chip is electrically connected with described flexible PCB by tin cream; And
Ink layer, described ink layer is arranged on the upper surface of described chip.
2. fingerprint recognition module according to claim 1, is characterized in that, described tin cream comprises at least one be selected from following alloy: SnBi, SnBiAg and SnInBi.
3. fingerprint recognition module according to claim 1, is characterized in that, described tin cream has the fusing point of 100 ~ 150 degrees Celsius.
4. fingerprint recognition module according to claim 1, is characterized in that, described tin cream has the Reflow Soldering temperature of 150 ~ 200 degrees Celsius.
5. fingerprint recognition module according to claim 1, is characterized in that, described ink layer comprises further:
Undercoat, described undercoat is arranged on the upper surface of described chip;
Color layers, described color layers is arranged on the upper surface of described undercoat; And
Protective seam, described protective seam is arranged on the upper surface of described color layers.
6. fingerprint recognition module according to claim 5, is characterized in that, described ink layer is formed by a kind of mode in spraying, serigraphy and transfer printing.
7. prepare a method for fingerprint recognition module, it is characterized in that, comprising:
(1) provide chip, containing fingerprint Identification sensor in described chip, and the upper surface of described chip is formed with ink layer;
(2) by tin cream, the lower surface of described chip is fitted to the upper surface of flexible PCB, and described chip is electrically connected with described flexible PCB, to obtain described fingerprint recognition module.
8. the method preparing fingerprint recognition module according to claim 7, is characterized in that, in step (1), described chip obtains through the following steps:
(1-1) multiple fingerprint Identification sensor is encapsulated, to obtain a large chip packing-body;
(1-2) described ink layer is formed at the upper surface of described large chip packing-body;
(1-3) described large the chip packing-body being formed with described ink layer obtained in step (1-2) is cut, to obtain described chip,
Optionally, described ink layer is formed by a kind of mode in spraying, serigraphy and transfer printing.
9. the method preparing fingerprint recognition module according to claim 7, is characterized in that, described ink layer is formed through the following steps:
A () forms undercoat at the upper surface of described large chip packing-body;
B () forms color layers at the upper surface of described undercoat; And
C () forms protective seam at the upper surface of described color layers.
10. the method preparing fingerprint recognition module according to claim 7, is characterized in that, in step (2), by reflow soldering, adopts described tin cream, the lower surface of described chip is fitted to the upper surface of described flexible PCB,
Wherein, the temperature of described reflow soldering is 150 ~ 200 degrees Celsius,
Optionally, described tin cream comprises at least one be selected from following alloy: SnBi, SnBiAg and SnInBi.
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| CN201510547279.XA CN105069443A (en) | 2015-08-31 | 2015-08-31 | Fingerprint recognition module and fingerprint recognition module preparation method |
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| CN105868736A (en) * | 2016-04-26 | 2016-08-17 | 广东欧珀移动通信有限公司 | Sensing chip, fingerprint recognition module, manufacturing method of fingerprint recognition module and mobile terminal |
| CN106384105A (en) * | 2016-10-29 | 2017-02-08 | 南昌欧菲生物识别技术有限公司 | Manufacturing method of fingerprint recognition module |
| CN106485236A (en) * | 2016-10-31 | 2017-03-08 | 维沃移动通信有限公司 | A kind of manufacture method of fingerprint module, fingerprint module and terminal |
| CN107423660A (en) * | 2016-05-24 | 2017-12-01 | 比亚迪股份有限公司 | Fingerprint identification device, fingerprint identification method and terminal device |
| CN107663395A (en) * | 2016-07-29 | 2018-02-06 | 韩国太阳油墨股份公司 | Dyed layer dry film composition and the fingerprint Identification sensor module with dyed layer |
| CN107742610A (en) * | 2017-09-25 | 2018-02-27 | 南昌欧菲生物识别技术有限公司 | Manufacture method, fingerprint recognition chip, fingerprint recognition module and electronic installation |
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| CN109934063A (en) * | 2017-12-18 | 2019-06-25 | 南昌欧菲生物识别技术有限公司 | Handheld terminal and its fingerprint recognition mould group |
| CN111540690A (en) * | 2020-04-22 | 2020-08-14 | 欧菲微电子技术有限公司 | Chip manufacturing method, chip, fingerprint module and electronic equipment |
| CN111582063A (en) * | 2020-04-21 | 2020-08-25 | 昆山丘钛微电子科技有限公司 | Fingerprint identification module, manufacturing method thereof and electronic equipment |
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- 2015-08-31 CN CN201510547279.XA patent/CN105069443A/en not_active Withdrawn
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| CN105868736A (en) * | 2016-04-26 | 2016-08-17 | 广东欧珀移动通信有限公司 | Sensing chip, fingerprint recognition module, manufacturing method of fingerprint recognition module and mobile terminal |
| CN107423660A (en) * | 2016-05-24 | 2017-12-01 | 比亚迪股份有限公司 | Fingerprint identification device, fingerprint identification method and terminal device |
| CN107663395A (en) * | 2016-07-29 | 2018-02-06 | 韩国太阳油墨股份公司 | Dyed layer dry film composition and the fingerprint Identification sensor module with dyed layer |
| CN107818291A (en) * | 2016-09-14 | 2018-03-20 | 致伸科技股份有限公司 | Assemble the method for identification of fingerprint module and the cutting process of identification of fingerprint sensing element |
| CN107818291B (en) * | 2016-09-14 | 2022-01-04 | 致伸科技股份有限公司 | Method for assembling fingerprint identification module and cutting method of fingerprint identification sensing element |
| CN106384105A (en) * | 2016-10-29 | 2017-02-08 | 南昌欧菲生物识别技术有限公司 | Manufacturing method of fingerprint recognition module |
| CN106384105B (en) * | 2016-10-29 | 2019-02-19 | 南昌欧菲生物识别技术有限公司 | The manufacturing method of fingerprint recognition mould group |
| CN106485236A (en) * | 2016-10-31 | 2017-03-08 | 维沃移动通信有限公司 | A kind of manufacture method of fingerprint module, fingerprint module and terminal |
| CN108062503A (en) * | 2016-11-09 | 2018-05-22 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition module and its manufacturing method, terminal device |
| CN109492472A (en) * | 2017-09-12 | 2019-03-19 | 南昌欧菲生物识别技术有限公司 | Ultrasonic fingerprint identifies mould group and electronic equipment |
| CN107742610A (en) * | 2017-09-25 | 2018-02-27 | 南昌欧菲生物识别技术有限公司 | Manufacture method, fingerprint recognition chip, fingerprint recognition module and electronic installation |
| CN109697384A (en) * | 2017-10-20 | 2019-04-30 | 南昌欧菲生物识别技术有限公司 | Manufacturing method, fingerprint recognition mould group and the electronic device of fingerprint recognition mould group |
| CN109934063A (en) * | 2017-12-18 | 2019-06-25 | 南昌欧菲生物识别技术有限公司 | Handheld terminal and its fingerprint recognition mould group |
| CN111582063A (en) * | 2020-04-21 | 2020-08-25 | 昆山丘钛微电子科技有限公司 | Fingerprint identification module, manufacturing method thereof and electronic equipment |
| CN111540690A (en) * | 2020-04-22 | 2020-08-14 | 欧菲微电子技术有限公司 | Chip manufacturing method, chip, fingerprint module and electronic equipment |
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