CN107818291A - Assemble the method for identification of fingerprint module and the cutting process of identification of fingerprint sensing element - Google Patents
Assemble the method for identification of fingerprint module and the cutting process of identification of fingerprint sensing element Download PDFInfo
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- CN107818291A CN107818291A CN201610824110.9A CN201610824110A CN107818291A CN 107818291 A CN107818291 A CN 107818291A CN 201610824110 A CN201610824110 A CN 201610824110A CN 107818291 A CN107818291 A CN 107818291A
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- Prior art keywords
- identification
- sensing element
- fingerprint sensing
- fingerprint
- connecting plate
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
Abstract
The present invention relates to a kind of cutting process for the method and identification of fingerprint sensing element for assembling identification of fingerprint module, the method for assembling identification of fingerprint module retains connecting plate thin slice during sensing connecting plate is cut, and the upper surface of identification of fingerprint sensing element is closely sized in pre-set dimension.Next cutting connecting plate thin slice, and in forming depressed part on the lower surface of identification of fingerprint sensing element, make the lower surface of identification of fingerprint sensing element size be less than identification of fingerprint sensing element upper surface size.Even if identification of fingerprint sensing element occurs to cut crooked situation, identification of fingerprint sensing element also can lift fine ratio of product by dimension control.
Description
Technical field
The present invention relates to a kind of assemble method, more particularly to the method for assembling identification of fingerprint module and identification of fingerprint sensing member
The cutting process of part.
Background technology
In recent years, identification of fingerprint technology is applied in various electronic products, makes user to input the fingerprint of oneself in electricity
In sub- product and electronic product is allowed to achieve, user can input the fingerprint of oneself by identification of fingerprint module afterwards, to carry out electricity
The unblock of sub- product.The unlocking manner of password is manually entered than ever faster to unlock electronic product using identification of fingerprint technology
It is fast, more convenient, therefore favored by user, and the demand of identification of fingerprint module also increases therewith.
In general, identification of fingerprint module includes identification of fingerprint sensing element, protection cap, becket and circuit board,
Identification of fingerprint sensing element sets and is electrically connected at circuit board, and its function captures its fingerprint letter to sense the finger of user
Breath.Protection cap is coated on identification of fingerprint sensing element, to protect identification of fingerprint sensing element, allows the finger of user only can be with guarantor
Protecting cover contacts, without directly being contacted with identification of fingerprint sensing element, to avoid identification of fingerprint sensing element from being damaged.Becket is arranged
In in protection cap, to conduct the electric charge on the finger of user, and contribute to the running of identification of fingerprint sensing element.
It is as follows as the assemble method of existing identification of fingerprint module.First, identification of fingerprint sensing element is set in circuit board
On, and carry out the electric connection between identification of fingerprint sensing element and circuit board.Secondly, the protection that coincides is placed on identification of fingerprint sensing
On element and bond the rwo.Finally, becket is arranged in protection cap, to complete the assembling of existing identification of fingerprint module.Its
In, identification of fingerprint sensing element is to be formed by a piece of sensing connecting plate by cutting, and the generation of identification of fingerprint sensing element
Journey is as follows：Sensing connecting plate is fixed on pedestal with viscose glue, and sensing connecting plate is cut according to pre-set dimension and produces multiple fingerprints and distinguishes
Know sensing element.The size of multiple identification of fingerprint sensing elements caused by cutting should be consistent with pre-set dimension or close to presetting
Size, however, identification of fingerprint sensing element caused by cutting may cut tolerance.
Referring to Fig. 1, it is the structural representation of existing identification of fingerprint sensing element.Fig. 1 shows that identification of fingerprint senses
Element 10, being closely sized to of the upper surface 101 of identification of fingerprint sensing element 10 (that is, are about roughly equal to default chi in pre-set dimension
It is very little), but identification of fingerprint sensing element 10 is crooked because easily cutting so that and the size of its lower surface 102 is more than pre-set dimension.
Although the size of the upper surface of such a identification of fingerprint sensing element 10 is consistent with pre-set dimension, the size of its lower surface is more than
Pre-set dimension is too many, therefore it can not be classified as defective products by size measuring.Further, since identification of fingerprint sensing element
Viscose glue fixation sensing connecting plate must be utilized during generation, and on pedestal, after cutting running and completing, identification of fingerprint sensing is first
The situation of cull easily occurs on part, the running of identification of fingerprint sensing element is influenceed in order to avoid cull, it is necessary to additionally enter
Row removes the work of cull, therefore can extend processing time, and reduces its manufacture efficiency.
Therefore, it is necessary to a kind of method for the assembling identification of fingerprint module for lifting fine ratio of product and manufacture efficiency.
The content of the invention
It is an object of the invention to provide a kind of fine ratio of product and identification of fingerprint sensing element of manufacture efficiency of being lifted
Cutting process.
Another object of the present invention is to provide a kind of to lift fine ratio of product and the assembling identification of fingerprint mould of manufacture efficiency
The method of block.
In a preferred embodiment, the present invention provides a kind of cutting process of identification of fingerprint sensing element, including following step
Suddenly：
(A) according to a pre-set dimension, a sensing connecting plate is cut and forms multiple identification of fingerprint sensing elements；Wherein, often
Connected between two identification of fingerprint sensing elements by a connecting plate thin slice, and the connecting plate thin slice is close to the plurality of identification of fingerprint
A lower surface of sensing element.
(B) the cropped sensing connecting plate is fixed in a fixed seat with upside down, distinguished with manifesting the plurality of fingerprint
Know the lower surface of sensing element.
(C) the connecting plate thin slice is cut and in forming a depressed part on the lower surface of the plurality of identification of fingerprint sensing element,
To form the identification of fingerprint sensing element independently；Wherein, the size of the lower surface of the identification of fingerprint sensing element is small
In the pre-set dimension.
In a preferred embodiment, the present invention also provides a kind of method for assembling identification of fingerprint module, comprises the following steps：
(A) according to a pre-set dimension, a sensing connecting plate is cut and forms multiple identification of fingerprint sensing elements；Wherein, often
Connected between two identification of fingerprint sensing elements by a connecting plate thin slice, and the connecting plate thin slice is close to the plurality of identification of fingerprint
A lower surface of sensing element.
(B) the cropped sensing connecting plate is fixed in a fixed seat with upside down, distinguished with manifesting the plurality of fingerprint
Know the lower surface of sensing element.
(C) the connecting plate thin slice is cut and in forming a depressed part on the lower surface of the plurality of identification of fingerprint sensing element,
To form the identification of fingerprint sensing element independently；Wherein, the size of the lower surface of the identification of fingerprint sensing element is small
In the pre-set dimension.
(D) the identification of fingerprint induction module is formed with reference to the identification of fingerprint sensing element and a circuit board.
In short, the inventive method is to retain connecting plate thin slice during sensing connecting plate is cut, sense identification of fingerprint
The upper surface of element is closely sized in pre-set dimension, or consistent with pre-set dimension.Cut connecting plate thin slice again afterwards, and in fingerprint
Recognize and form depressed part on the lower surface of sensing element, the size of the lower surface of identification of fingerprint sensing element is less than identification of fingerprint
The size of the upper surface of sensing element.In other words, as long as making being closely sized in the default of upper surface of identification of fingerprint sensing element
Size, identification of fingerprint sensing element can be by dimension control, and can lift fine ratio of product.Further, since in the inventive method
Without the use of viscose glue, therefore it is not required to be purged cull work, and manufacture efficiency can be lifted.
Brief description of the drawings
Fig. 1 is the structural representation of existing identification of fingerprint sensing element.
Fig. 2 is structural representation of the identification of fingerprint module of the present invention in a preferred embodiment.
Fig. 3 is flow chart of the method for present invention assembling identification of fingerprint module in a preferred embodiment.
Fig. 4 is structural representation of the sensing connecting plate of identification of fingerprint module of the present invention in a preferred embodiment.
Fig. 5 is structural representation of the cropped sensing connecting plate of identification of fingerprint module of the present invention in a preferred embodiment
Figure.
Fig. 6 is that the cropped sensing connecting plate of identification of fingerprint module of the present invention is fixed in fixation in a preferred embodiment
Structural representation on seat.
Fig. 7 is structural representation of the identification of fingerprint sensing element of identification of fingerprint module of the present invention in a preferred embodiment
Figure.
Wherein, description of reference numerals is as follows：
2 identification of fingerprint modules
3 clamping devices
4 fixed seats
5 cutters
10th, 21 identification of fingerprint sensing element
20 sensing connecting plates
22 circuit boards
23 connecting plate thin slices
41 accommodating grooves
42 vavuum pumps
101st, the upper surface of 212 identification of fingerprint sensing elements
102nd, the upper surface of 211 identification of fingerprint sensing elements
213 depressed parts
The thickness of T1 connecting plate thin slices
The thickness that T2 sensing connecting plates are cut
The length of T3 depressed parts
The height of T4 depressed parts
26 second circuit boards
A~J, C1, C2 step
Embodiment
The present invention provides a kind of cutting process for the method and identification of fingerprint sensing element for assembling identification of fingerprint module, with
Solves prior art problem.Referring initially to Fig. 2, it is that structure of the identification of fingerprint module of the present invention in a preferred embodiment is shown
It is intended to.Identification of fingerprint module 2 includes identification of fingerprint sensing element 21 and circuit board 22, and identification of fingerprint sensing element 21 is solid
Due on circuit board 22.In this preferred embodiment, identification of fingerprint sensing element 21 is with grid array (Land Grid
Array, LGA) mode and encapsulate, flexible PCB (FPC) or soft-hard composite board can be selected in circuit board 22.
Referring to Fig. 3, it assembles flow chart of the method for identification of fingerprint module in a preferred embodiment for the present invention.This
The method of invention assembling identification of fingerprint module comprises the following steps：
Step A：Sensing connecting plate is fixed using clamping device.
Step B：According to pre-set dimension, sensing connecting plate is cut and forms unsegregated multiple identification of fingerprint sensing elements.
Step C：The cropped sensing connecting plate is fixed in a fixed seat with upside down, to manifest the plurality of fingerprint
Recognize the lower surface of sensing element.
Step D：Connecting plate thin slice is cut in forming depressed part on the lower surface of identification of fingerprint sensing element, is distinguished with being formed
Independent identification of fingerprint sensing element.
Step E：The size of the upper surface of measurement identification of fingerprint sensing element independently, and according to the pre-set dimension and
Judge whether identification of fingerprint sensing element passes through dimension control.
Step F：Judge that identification of fingerprint sensing element passes through dimension control.
Step G：Judge that identification of fingerprint sensing element does not pass through dimension control.
Step H：Identification of fingerprint induction module is formed with reference to identification of fingerprint sensing element and circuit board.
Wherein, step C includes：
Step C1：Cropped sensing connecting plate is placed in fixed seat with upside down, so that multiple identification of fingerprint sense
Element is stretched into multiple accommodating grooves of fixed seat.
Step C2：Start the vavuum pump of fixed seat, fixed multiple identification of fingerprint sensing elements are in multiple to produce suction
In accommodating groove.
And in step E, when judging whether identification of fingerprint sensing element passes through dimension control, step G is carried out, conversely,
Then carry out step H.
Next the implementation situation of the method for explanation assembling identification of fingerprint module.Please refer to Fig. 2~Fig. 7, Fig. 4 be for
Structural representation of the sensing connecting plate of identification of fingerprint module of the present invention in a preferred embodiment, Fig. 5 is distinguished for fingerprint of the present invention
Know structural representation of the cropped sensing connecting plate of module in a preferred embodiment, Fig. 6 is for identification of fingerprint mould of the present invention
The cropped sensing connecting plate of block is fixed in the structural representation in fixed seat in a preferred embodiment, and Fig. 7 is for this
Structural representation of the identification of fingerprint sensing element of invention identification of fingerprint module in a preferred embodiment.When production line start into
During the method for row present invention assembling identification of fingerprint module, step A is carried out first：Sensing connecting plate 20 is fixed using clamping device 3, such as
Shown in Fig. 4.Wherein, clamping device 3 can be operated in a manner of manpower or machinery etc., preferably, clamping device 3 is with machinery side
Formula and operate, so that finer and stable running can be carried out.After sensing connecting plate 20 is by fixed complete, step B is carried out：Root
According to pre-set dimension, sensing connecting plate 20 is cut and forms unsegregated multiple identification of fingerprint sensing elements 21, wherein, it is unsegregated
Multiple identification of fingerprint sensing elements 21 are defined as connecting by connecting plate thin slice 23 between each two identification of fingerprint sensing element 21,
And connecting plate thin slice 23 is close to the lower surface 211 of identification of fingerprint sensing element 21, as shown in Figure 5.
In step B, setting cutter 5 (refer to Fig. 6) is to cut sensing connecting plate 20 for close to the multiple of pre-set dimension
Identification of fingerprint sensing element 21.Wherein, identification of fingerprint sensing element 21 to be closely sized in pre-set dimension be with identification of fingerprint sense
The size of the upper surface 212 of element 21 is answered to be defined, that is, the first length of the upper surface 212 of identification of fingerprint sensing element 21 connects
It is bordering on the first preset length of pre-set dimension, and the first width of the upper surface 212 of identification of fingerprint sensing element 21 is close to pre-
If the first predetermined width of size.Preferably, it is to cut sensing connecting plate 20 for the multiple identification of fingerprint consistent with pre-set dimension
Sensing element 21.In this preferred embodiment, the thickness T1 of connecting plate thin slice 23 is about 0.15 millimeter (mm), and identification of fingerprint senses
The thickness (being also the thickness T2 cut to sensing connecting plate 20) of the upper surface 212 of element 21 to the upper surface of connecting plate thin slice 23
About 0.635 millimeter.
After step B completions, step C1 is carried out：By cropped sensing connecting plate 20 (or unsegregated multiple fingerprints
Identification sensing element 21) it is positioned over upside down in fixed seat 4, so that multiple identification of fingerprint sensing elements 21 are respectively protruding into admittedly
In multiple accommodating grooves 41 of reservation 4.Followed by step C2：Start the vavuum pump 42 of fixed seat 4, will be more to produce suction
The direction of inside of the individual identification of fingerprint sensing element 21 toward accommodating groove 41 attracts, with the multiple identification of fingerprint sensing elements 21 of fixation in
In multiple accommodating grooves 41, the lower surface 211 of multiple identification of fingerprint sensing elements 21 can be manifested whereby outside fixed seat 4, such as
Shown in Fig. 6.Specifically, be in this preferred embodiment with vavuum pump 42 fix multiple identification of fingerprint sensing elements 21 in
In accommodating groove 41, it is only that illustration is used, rather than as limit.In other words, the inventive method can be consolidated using various fixing means
Surely the sensing connecting plate 20 cut, without limiting its means and related fixed structure.
Followed by step D：Cut connecting plate thin slice 23 and in the lower surface of corresponding identification of fingerprint sensing element 21
Depressed part 213 is formed on 211, to form multiple identification of fingerprint sensing elements 21 independently, and makes identification of fingerprint sensing member
The size of the lower surface 211 of part 21 is less than pre-set dimension.That is, the of the lower surface 211 of identification of fingerprint sensing element 21
Two length are less than the first preset length of pre-set dimension.In this preferred embodiment, the length of the depressed part 213 shown by Fig. 7
T3 is about 0~0.1 millimeter, and the height T4 of depressed part 213 is about 0.12~0.18 millimeter.Preferably, the length of depressed part 213
T3 is 0 so that the length of the upper surface 211 of identification of fingerprint sensing element 21 and the lower surface 211 of identification of fingerprint sensing element 21
Length it is consistent and consistent with pre-set dimension.
After step D completions, step E is carried out：The upper surface 212 of the identification of fingerprint sensing element 21 of measurement independently
Size, and judge whether identification of fingerprint sensing element 21 passes through dimension control according to pre-set dimension.In short, step D is
Check cropped identification of fingerprint sensing element 21 whether close to pre-set dimension.When the upper surface of identification of fingerprint sensing element 21
Gap between 212 size and pre-set dimension is small or during equal to admissible error, judges that identification of fingerprint sensing element 21 passes through chi
Very little inspection, that is, carry out step F.Conversely, then judging identification of fingerprint sensing element 21 not by dimension control, that is, carry out step
G, and be judged as not being considered as defective products by the identification of fingerprint sensing element 21 of dimension control.Wherein, step A~step
The step of F (or step G) running belongs to the cutting process of identification of fingerprint sensing element of the present invention.
Finally, step H is carried out：Identification of fingerprint sensing mould is formed with reference to identification of fingerprint sensing element 21 and circuit board 22
Block 2, wherein, identification of fingerprint sensing element 21 is to be fixed on surface adhering technical (SMT) on circuit board 22, as shown in Figure 2.
Specifically have three, first, gold goal, tin ball can be set on the lower surface 211 of identification of fingerprint sensing element 21
Deng electric connection thing, to fill up the difference in height between depressed part 213 and its lower surface 211.Second, because identification of fingerprint senses member
It is to be combined with surface adhering technical (SMT) between part 21 and circuit board 22, therefore is without the use of viscose glue, the feelings without cull occurs
Shape.Due to being not required to be purged the work of cull, therefore the inventive method can lift manufacture efficiency.3rd, according to conventional manufacture
Experience, during cutting senses connecting plate, it is crooked that the identification of fingerprint sensing element that is cut and is formed occurs most frequently cutting
Situation, such as：The size of the lower surface of identification of fingerprint sensing element is more than the size of the upper surface of identification of fingerprint sensing element, and
The upper surface of identification of fingerprint sensing element is closely sized in pre-set dimension, and such a identification of fingerprint sensing element is because of its lower surface
It is oversized, and dimension control can not be passed through.Therefore, the inventive method is on the lower surface 211 of identification of fingerprint sensing element 21
Form depressed part 213 so that the size of the lower surface 211 of identification of fingerprint sensing element 21 is less than identification of fingerprint sensing element 21
The size of upper surface 212, and the upper surface 212 of identification of fingerprint sensing element 21 is closely sized in pre-set dimension.Consequently, it is possible to
Even if occurring to cut crooked situation in working angles, caused identification of fingerprint sensing element 21 can also be examined by size
Test.
Understood according to above-mentioned, the inventive method is to retain connecting plate thin slice during sensing connecting plate is cut, and distinguishes fingerprint
Know being closely sized in pre-set dimension for the upper surface of sensing element, or it is consistent with pre-set dimension.Cut connecting plate thin slice again afterwards, and
In forming depressed part on the lower surface of identification of fingerprint sensing element, it is less than the size of the lower surface of identification of fingerprint sensing element and refers to
The size of the upper surface of line identification sensing element.In other words, as long as making being closely sized to for the upper surface of identification of fingerprint sensing element
In pre-set dimension, identification of fingerprint sensing element can be by dimension control, and can lift fine ratio of product.It is further, since of the invention
It is without the use of viscose glue in method, therefore is not required to be purged cull work, and manufacture efficiency can be lifted.
The foregoing is only presently preferred embodiments of the present invention, be not limited to protection scope of the present invention, thus it is all its
It is intended to be limited solely by claim of the invention without departing from the lower equivalent change or modification completed of spirit disclosed in this invention
In the range of book.
Claims (13)
1. a kind of cutting process of identification of fingerprint sensing element, comprises the following steps：
(A) according to a pre-set dimension, a sensing connecting plate is cut and forms multiple identification of fingerprint sensing elements；Wherein, each two
Connected between the identification of fingerprint sensing element by a connecting plate thin slice, and the connecting plate thin slice senses close to the plurality of identification of fingerprint
A lower surface of element；
(B) the cropped sensing connecting plate is fixed in a fixed seat with upside down, to manifest the plurality of identification of fingerprint sense
Answer the lower surface of element；And
(C) the connecting plate thin slice is cut and in forming a depressed part on the lower surface of the plurality of identification of fingerprint sensing element, with shape
Into the identification of fingerprint sensing element independently；Wherein, the size of the lower surface of the identification of fingerprint sensing element, which is less than, is somebody's turn to do
Pre-set dimension.
2. the cutting process of identification of fingerprint sensing element as claimed in claim 1, wherein in the step (A), this at least one
One first length of one upper surface of identification of fingerprint sensing element is close to one first preset length of the pre-set dimension, and this is extremely
One first predetermined width of one first width of the upper surface of a few identification of fingerprint sensing element close to the pre-set dimension.
3. the cutting process of identification of fingerprint sensing element as claimed in claim 1, wherein including following step in the step (B)
Suddenly：
(B1) the cropped sensing connecting plate is placed in the fixed seat, making the plurality of identification of fingerprint sensing element with upside down
Stretch into multiple accommodating grooves of the fixed seat；And
(B2) vavuum pump of the fixed seat is started, fixed the plurality of identification of fingerprint sensing element is in the plurality of to produce suction
In accommodating groove.
4. the cutting process of identification of fingerprint sensing element as claimed in claim 1, wherein before the step (A), in addition to
Step (D)：The sensing connecting plate is fixed using a clamping device.
5. the cutting process of identification of fingerprint sensing element as claimed in claim 1, wherein in the step (C), this at least one
One second length of the lower surface of identification of fingerprint sensing element is less than one first preset length of the pre-set dimension.
6. the cutting process of identification of fingerprint sensing element as claimed in claim 1, wherein after the step (C), in addition to
Following steps：
(E) size of the upper surface of the identification of fingerprint sensing element of measurement independently, and sentenced according to the pre-set dimension
Whether the disconnected identification of fingerprint sensing element passes through dimension control；
(F) judge that the identification of fingerprint sensing element passes through dimension control；And
(G) judge that the identification of fingerprint sensing element does not pass through dimension control.
7. a kind of method for assembling identification of fingerprint induction module, comprises the following steps：
(A) according to a pre-set dimension, a sensing connecting plate is cut and forms multiple identification of fingerprint sensing elements；Wherein, each two
Connected between the identification of fingerprint sensing element by a connecting plate thin slice, and the connecting plate thin slice senses close to the plurality of identification of fingerprint
A lower surface of element；
(B) the cropped sensing connecting plate is fixed in a fixed seat with upside down, to manifest the plurality of identification of fingerprint sense
Answer the lower surface of element；And
(C) the connecting plate thin slice is cut and in forming a depressed part on the lower surface of the plurality of identification of fingerprint sensing element, with shape
Into the identification of fingerprint sensing element independently；Wherein, the size of the lower surface of the identification of fingerprint sensing element, which is less than, is somebody's turn to do
Pre-set dimension；And
(D) the identification of fingerprint induction module is formed with reference to the identification of fingerprint sensing element and a circuit board.
8. the method for assembling identification of fingerprint induction module as claimed in claim 7, wherein in the step (A), this at least one
One first length of one upper surface of identification of fingerprint sensing element is close to one first preset length of the pre-set dimension, and this is extremely
One first predetermined width of one first width of the upper surface of a few identification of fingerprint sensing element close to the pre-set dimension.
9. the method for assembling identification of fingerprint induction module as claimed in claim 7, wherein including following step in the step (B)
Suddenly：
(B1) the cropped sensing connecting plate is placed in the fixed seat, making the plurality of identification of fingerprint sensing element with upside down
Stretch into multiple accommodating grooves of the fixed seat；And
(B2) vavuum pump of the fixed seat is started, fixed the plurality of identification of fingerprint sensing element is in the plurality of to produce suction
In accommodating groove.
10. the method for assembling identification of fingerprint induction module as claimed in claim 7, wherein before the step (A), in addition to
Step (E)：The sensing connecting plate is fixed using a clamping device.
11. the method for assembling identification of fingerprint induction module as claimed in claim 7, wherein in the step (C), this at least one
One second length of the lower surface of identification of fingerprint sensing element is less than one first preset length of the pre-set dimension.
12. the method for assembling identification of fingerprint induction module as claimed in claim 7, wherein in the step (D), the fingerprint is distinguished
Knowing sensing element and the circuit board is combined by surface adhering technical, to form the identification of fingerprint induction module.
13. the cutting process of identification of fingerprint sensing element as claimed in claim 7, wherein after the step (C), in addition to
Following steps：
(F) size of the upper surface of the identification of fingerprint sensing element of measurement independently, and sentenced according to the pre-set dimension
Whether the disconnected identification of fingerprint sensing element passes through dimension control；
(G) judge that the identification of fingerprint sensing element passes through dimension control；And
(H) judge that the identification of fingerprint sensing element does not pass through dimension control.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610824110.9A CN107818291B (en) | 2016-09-14 | 2016-09-14 | Method for assembling fingerprint identification module and cutting method of fingerprint identification sensing element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610824110.9A CN107818291B (en) | 2016-09-14 | 2016-09-14 | Method for assembling fingerprint identification module and cutting method of fingerprint identification sensing element |
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| CN107818291A true CN107818291A (en) | 2018-03-20 |
| CN107818291B CN107818291B (en) | 2022-01-04 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110298215A (en) * | 2018-03-23 | 2019-10-01 | 致伸科技股份有限公司 | The method for assembling identification of fingerprint module |
| CN111221688A (en) * | 2018-11-27 | 2020-06-02 | Oppo（重庆）智能科技有限公司 | Method and device for detecting functional component, storage medium and electronic equipment |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101142672A (en) * | 2005-03-16 | 2008-03-12 | 雅马哈株式会社 | Lid frame, semiconductor device, and manufacturing method thereof |
| US20100048000A1 (en) * | 2008-08-25 | 2010-02-25 | Kabushiki Kaisha Toshiba | Method of manufacturing semiconductor chips |
| CN102354692A (en) * | 2007-11-12 | 2012-02-15 | 英飞凌科技股份公司 | Wafer and a method of dicing a wafer |
| US20130234825A1 (en) * | 2010-07-19 | 2013-09-12 | Arun Malhotra | Fingerprint sensors and systems incorporating fingerprint sensors |
| CN103793698A (en) * | 2014-02-21 | 2014-05-14 | 江苏恒成高科信息科技有限公司 | Fingerprint reading sensor capable of removing residual fingerprints |
| CN104201115A (en) * | 2014-09-12 | 2014-12-10 | 苏州晶方半导体科技股份有限公司 | Wafer-level fingerprint recognition chip packaging structure and method |
| CN104615979A (en) * | 2015-01-27 | 2015-05-13 | 华进半导体封装先导技术研发中心有限公司 | Fingerprint identification module and encapsulation method thereof, and fingerprint identification module group and encapsulation method thereof |
| CN104680126A (en) * | 2014-11-24 | 2015-06-03 | 麦克思智慧资本股份有限公司 | Fingerprint identifying device and manufacturing method thereof |
| CN105069443A (en) * | 2015-08-31 | 2015-11-18 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition module and fingerprint recognition module preparation method |
| CN205486163U (en) * | 2015-06-08 | 2016-08-17 | 指纹卡有限公司 | Fingerprint sensing device |
-
2016
- 2016-09-14 CN CN201610824110.9A patent/CN107818291B/en not_active Expired - Fee Related
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101142672A (en) * | 2005-03-16 | 2008-03-12 | 雅马哈株式会社 | Lid frame, semiconductor device, and manufacturing method thereof |
| CN102354692A (en) * | 2007-11-12 | 2012-02-15 | 英飞凌科技股份公司 | Wafer and a method of dicing a wafer |
| US20100048000A1 (en) * | 2008-08-25 | 2010-02-25 | Kabushiki Kaisha Toshiba | Method of manufacturing semiconductor chips |
| US20130234825A1 (en) * | 2010-07-19 | 2013-09-12 | Arun Malhotra | Fingerprint sensors and systems incorporating fingerprint sensors |
| CN103793698A (en) * | 2014-02-21 | 2014-05-14 | 江苏恒成高科信息科技有限公司 | Fingerprint reading sensor capable of removing residual fingerprints |
| CN104201115A (en) * | 2014-09-12 | 2014-12-10 | 苏州晶方半导体科技股份有限公司 | Wafer-level fingerprint recognition chip packaging structure and method |
| CN104680126A (en) * | 2014-11-24 | 2015-06-03 | 麦克思智慧资本股份有限公司 | Fingerprint identifying device and manufacturing method thereof |
| CN104615979A (en) * | 2015-01-27 | 2015-05-13 | 华进半导体封装先导技术研发中心有限公司 | Fingerprint identification module and encapsulation method thereof, and fingerprint identification module group and encapsulation method thereof |
| CN205486163U (en) * | 2015-06-08 | 2016-08-17 | 指纹卡有限公司 | Fingerprint sensing device |
| CN105069443A (en) * | 2015-08-31 | 2015-11-18 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition module and fingerprint recognition module preparation method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110298215A (en) * | 2018-03-23 | 2019-10-01 | 致伸科技股份有限公司 | The method for assembling identification of fingerprint module |
| CN111221688A (en) * | 2018-11-27 | 2020-06-02 | Oppo（重庆）智能科技有限公司 | Method and device for detecting functional component, storage medium and electronic equipment |
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