CN110298215A - The method for assembling identification of fingerprint module - Google Patents
The method for assembling identification of fingerprint module Download PDFInfo
- Publication number
- CN110298215A CN110298215A CN201810245067.XA CN201810245067A CN110298215A CN 110298215 A CN110298215 A CN 110298215A CN 201810245067 A CN201810245067 A CN 201810245067A CN 110298215 A CN110298215 A CN 110298215A
- Authority
- CN
- China
- Prior art keywords
- identification
- connecting plate
- fingerprint
- induction
- fingerprint module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/1365—Matching; Classification
Abstract
The present invention provides a kind of method for assembling identification of fingerprint module, first carries out first time spray coating operations to the first surface of induction connecting plate, and is covered each by the first protective film and the second protective film in the first surface and its second surface of induction connecting plate.Next cutting induction connecting plate is to form multiple identification of fingerprint sensing elements, while can exclude first time spray coating operations and be formed by fat edges structure.Next second of spray coating operations is carried out to multiple side walls of multiple identification of fingerprint sensing elements respectively, and excludes cropped the first protective film and the second protective film, make the color of the first surface of identification of fingerprint sensing element and the solid colour of its side wall.
Description
Technical field
The present invention relates to a kind of assemble methods, more particularly to the method for assembling identification of fingerprint module.
Background technique
In recent years, identification of fingerprint technology is applied in various electronic products, enables user that can input the fingerprint of oneself in electricity
In sub- product and electronic product is allowed to achieve, user can input the fingerprint of oneself by identification of fingerprint module later, to carry out electricity
The unlock of sub- product.Electronic product is unlocked using identification of fingerprint technology than being manually entered the unlocking manner of password in the past faster
It is fast, more convenient, therefore the favor by user, and the demand of identification of fingerprint module also increases therewith.
In general, identification of fingerprint module includes identification of fingerprint sensing element, protection cap and circuit board, identification of fingerprint
Sensing element is arranged and is electrically connected at circuit board, and function is to incude the finger of user and extract its finger print information.Protection
Lid is coated on identification of fingerprint sensing element, to protect identification of fingerprint sensing element, the finger of user can only be connect with protection cap
Touching, it is impaired to avoid identification of fingerprint sensing element without directly being contacted with identification of fingerprint sensing element.However, protection cap at
This is higher, in order to reduce the cost of identification of fingerprint module, on the market using setting coating in identification of fingerprint sensing element, so that by
The coating of sprinkling coats identification of fingerprint sensing element, to protect identification of fingerprint sensing element.
In addition, identification of fingerprint module is set on electronic device (such as smart phone, tablet computer etc.), and part appears
In outside the casing of electronic device, for user's operation, wherein the color of general identification of fingerprint module and the casing of electronic device
Color it is different., can be during above-mentioned spray paint for beauty, the coating of selection and the solid colour of casing, to enable
The color of identification of fingerprint module and the solid colour of its casing.
However, the coating being distributed on identification of fingerprint sensing element can be according to surface tension effects, and in identification of fingerprint
The outer edge area of sensing element forms fat edges structure, will cause the apparent defect of identification of fingerprint module.
Therefore, it is necessary to the methods that one kind can solve the assembling identification of fingerprint module of aesthetic problem.
Summary of the invention
The purpose of the present invention is to provide the methods that one kind can solve the assembling identification of fingerprint module of aesthetic problem.
In a preferred embodiment, the present invention provides a kind of method for assembling identification of fingerprint module, comprising the following steps:
(A) one first coating of spraying is on a first surface of an induction connecting plate.
(B) one first protective film of covering is on the first surface of the induction connecting plate, and covers one second protective film in this
On the second surface for incuding connecting plate.
(C) the induction connecting plate is cut, to form multiple identification of fingerprint sensing elements.
(D) one second coating of spraying is on multiple side walls of multiple identification of fingerprint sensing element.
(E) by excluding cropped first protective film and second protection on multiple identification of fingerprint sensing element
Film.
In a preferred embodiment, the step (A) the following steps are included:
Step (A1): one first priming paint in first coating is sprayed on the first surface of the induction connecting plate.
Step (A2): one first colored paint in first coating is sprayed on first priming paint.
Step (A3): one first finishing coat in first coating is sprayed on first colored paint.
In a preferred embodiment, which is one second colored paint, and the color of second colored paint and first color
The color of paint is identical.
In short, the method for the present invention is first to carry out first time spray coating operations to the first surface of induction connecting plate, next divide
The first surface and its second surface of connecting plate Bao Hu not incuded, and cut induction connecting plate, to form multiple identification of fingerprint inductions
Element, while first time spray coating operations can be excluded and be formed by fat edges structure.Next member is incuded to multiple identification of fingerprint respectively
Multiple side walls of part carry out second of spray coating operations, so that the integral color of identification of fingerprint sensing element is consistent.Finally, excluding quilt
The first protective film and the second protective film cut, and the combination of identification of fingerprint sensing element and circuit board is carried out, to complete to distinguish
Know the assembling of induction module.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the identification of fingerprint module of the present invention in a preferred embodiment.
Fig. 2 is flow chart of the method for present invention assembling identification of fingerprint module in a preferred embodiment.
Fig. 3 is structural profile illustration of the induction connecting plate of identification of fingerprint module of the present invention in a preferred embodiment.
Fig. 4 is that the induction connecting plate of identification of fingerprint module of the present invention is sprayed-on the structure of the first coating in a preferred embodiment
Diagrammatic cross-section.
Fig. 5 is the partial structurtes of the induction connecting plate and the first coating of identification of fingerprint module of the present invention in a preferred embodiment
Diagrammatic cross-section.
Fig. 6 be identification of fingerprint module of the present invention induction connecting plate and the first protective film and the second protective film it is preferably real in one
Apply the structural decomposition diagram in example.
Fig. 7 is the structural representation before the induction connecting plate of identification of fingerprint module of the present invention is cut in a preferred embodiment
Figure.
Fig. 8 is that the structural profile after the induction connecting plate of identification of fingerprint module of the present invention is cut in a preferred embodiment shows
It is intended to.
Fig. 9 is that the identification of fingerprint sensing element of identification of fingerprint module of the present invention is sprayed-on the second painting in a preferred embodiment
The structural schematic diagram of material.
Appended drawing reference is as follows:
1 identification of fingerprint module
2 11 identification of fingerprint sensing elements
12 circuit boards
20 induction connecting plates
21 first coating
22 first protective films
23 second protective films
The first protective film that 22* has been cut
The second protective film that 23* has been cut
24 second coating
111 substrates
112 induction crystal grain
113 encapsulated layers
The side wall of 114 identification of fingerprint sensing elements
The lower surface of 115 identification of fingerprint sensing elements
201 connecting plate substrates
202 connecting plate encapsulated layers
The first surface of 203 induction connecting plates
The outer edge area of 204 induction connecting plates
The second surface of 205 induction connecting plates
211 first priming paint
212 first colored paints
213 first finishing coats
214 fat edges structures
221 the first film ontologies
222 first viscose glues
231 second film bulks
232 second viscose glues
1111 electrical connection sections
A~F, A1, A2, A3 step
P location reference point
Specific embodiment
The present invention provides a kind of method for assembling identification of fingerprint module, to solve the problems, such as well-known technique.Referring initially to figure
1, it is structural schematic diagram of the identification of fingerprint module of the present invention in a preferred embodiment.Identification of fingerprint module 1 is distinguished including fingerprint
Know sensing element 11 and circuit board 12, and identification of fingerprint sensing element 11 is fixed on circuit board 12.In this preferred embodiment
In, identification of fingerprint sensing element 11 is encapsulated in grid array (Land Grid Array, LGA) mode, and circuit board 12 is optional
With flexible circuit board (FPC) or soft-hard composite board.
Identification of fingerprint sensing element 11 includes substrate 111, multiple induction crystal grain 112 and encapsulated layer 113, and substrate 111 has
There are multiple electrical connection sections 1111, is set to the lower surface of substrate 111 (that is, the lower surface of identification of fingerprint sensing element 11
115) induction crystal grain 112 is set on substrate 111 and engages (Wire Bonding) with 111 routing of substrate, and encapsulated layer coats
The upper surface of multiple induction crystal grain 112 and substrate 111, in this preferred embodiment, encapsulated layer 113 is epoxy encapsulant
(EMC)。
The method that assembling identification of fingerprint module will be illustrated next.Referring to Fig. 2, it is present invention assembling identification of fingerprint module
Flow chart of the method in a preferred embodiment.The present invention assemble identification of fingerprint module method the following steps are included:
Step A: the first coating of spraying is on the first surface of induction connecting plate.
Step B: covering the first protective film in induction connecting plate first surface on, and cover the second protective film in induction connecting plate
Second surface on.
Step C: cutting induction connecting plate, to form multiple identification of fingerprint sensing elements.
Step D: the second coating of spraying is on multiple side walls of multiple identification of fingerprint sensing elements.
Step E: by excluding cropped the first protective film and the second protective film on multiple identification of fingerprint sensing elements.
Step F: setting identification of fingerprint sensing element is on circuit board, to form identification of fingerprint module.
Wherein, step A includes:
Step A1: the first priming paint in the first coating of spraying is on the first surface of induction connecting plate.
Step A2: the first colored paint in the first coating of spraying is on the first priming paint.
Step A3: the first finishing coat in the first coating of spraying is on the first colored paint.
The implementation situation of the method for assembling identification of fingerprint module will be illustrated next.Please refer to Fig. 3, Fig. 4 and Fig. 5,
Fig. 4 is that the induction connecting plate of identification of fingerprint module of the present invention is sprayed-on the structural profile signal of the first coating in a preferred embodiment
Figure, and the induction connecting plate that Fig. 5 is identification of fingerprint module of the present invention is cutd open with partial structurtes of first coating in a preferred embodiment
Face schematic diagram.When production line starts to carry out the method for present invention assembling identification of fingerprint module, progress step A first: spraying the
One coating 21 in induction connecting plate 20 first surface 203 on, and Fig. 4 show induction connecting plate 20 structure, induction connecting plate 20 wrap
Include connecting plate substrate 201, multiple induction crystal grain 112 and connecting plate encapsulated layer 202.Wherein, multiple induction crystal grain 112 are set to connecting plate
(Wire is engaged on substrate 201 and with 201 routing of connecting plate substrate
Bonding), and connecting plate encapsulated layer 202 coat it is multiple induction crystal grain 112 and connecting plate substrate 201 upper surfaces.Its
In, the first coating 21 includes the first priming paint 211, the first colored paint 212 and the first finishing coat 213, as shown in Figure 5.
In step A, progress step A1 first: the first priming paint 211 of spraying is on the first surface 203 of induction connecting plate 20.It connects
Get off, carry out step A2: the first colored paint 212 of spraying is on the first priming paint 211, so that induction connecting plate 20 can show the first colored paint
212 color.Finally, carrying out step A3: the first finishing coat 213 of spraying is on the first colored paint 212, to protect the first colored paint 212.In
After step A is completed, the first coating 21 is covered on the first surface 203 of induction connecting plate 20, due to surface tension effects, so that
First coating 21 is in forming multiple fat edges structures 214 in the outer edge area 204 of induction connecting plate 20, as shown in Figure 4.It is preferably real in this
It applies in example, the casing of electronic device (not shown in the figures) applied by the color and identification of fingerprint module 2 of the first colored paint 212
Color is identical.
Please refer to Fig. 3 and Fig. 6, Fig. 6 be identification of fingerprint module of the present invention induction connecting plate and the first protective film with
And second structural decomposition diagram of the protective film in a preferred embodiment.After step A completion, prepare the first protective film 22
And second protective film 23, Fig. 6 show the structure of the first protective film 22 and the second protective film 23, the first protective film 22 includes
The first film ontology 221 and the first viscose glue 222, the first film ontology 221 can connect with the first surface 203 of induction connecting plate 20
Touching.And the first viscose glue 222 is distributed on the first film ontology 221, function is to connect in conjunction with the first film ontology 221 and induction
The first surface 203 of plate 20.Similar to the first protective film 22, the second protective film 23 includes the second film bulk 231 and second
Viscose glue 232, the second film bulk 231 can be contacted with the second surface 203 of induction connecting plate 20.And the second viscose glue 232 is distributed in
On two film bulks 231, function is the second surface 203 in conjunction with the second film bulk 231 and induction connecting plate 20.In this compared with
In good embodiment, the first film ontology 221 and the second film bulk 231 all with polyimides (Polyimide, PI) material or
Made by polyethylene terephthalate (Polyethylene Terephthalate, PET) material, and first viscose glue 222
And second viscose glue 232 all use silica gel.
Followed by step B: covering the first protective film 22 in the first surface 203 of induction connecting plate 20 with bonding method
On, and the second protective film 23 is covered on the second surface 203 of induction connecting plate 20 with bonding method.Please refer to Fig. 2, Fig. 7
And Fig. 8, Fig. 7 be identification of fingerprint module of the present invention induction connecting plate it is cropped in a preferred embodiment before structural representation
Figure, and the structural profile after the induction connecting plate that Fig. 8 is identification of fingerprint module of the present invention is cut in a preferred embodiment is illustrated
Figure.After step B completion, step C is carried out: cutting induction connecting plate 20, to form multiple identification of fingerprint sensing elements 11,
In, the position location P to be cut in induction connecting plate 20 must be prejudged before cutting, as shown in Figure 7.In general, sense
It answers and has multiple location reference points on connecting plate 20, to prompt the position of multiple induction crystal grain 112 in induction connecting plate 20, thus may be used
Determine the position location P to be cut.About location reference point and cuts running and know detailed process for known this those skilled in the art institute
Known, so it will not be repeated.
Specifically, in step C, using various physics cutters or any cutting tool, (such as laser is cut
Device) induction connecting plate 20 is cut, the outer edge area 204 of induction connecting plate 20 can be then cut off, during cutting to exclude multiple fat edges
Structure 214.Fig. 8 shows the structure for being cut the identification of fingerprint sensing element 11 of completion, wherein each identification of fingerprint induction member
The upper surface and lower surface of part 11 the first protective film 22* cut respectively and the second protective film 23* packet cut
It covers, and multiple side walls 114 of only identification of fingerprint sensing element 11 are revealed in outside.
Please refer to Fig. 1, Fig. 2 and Fig. 9, Fig. 9 be identification of fingerprint module of the present invention identification of fingerprint sensing element in
The structural schematic diagram of the second coating is sprayed-on in one preferred embodiment.After the formation of identification of fingerprint sensing element 11, walked
Rapid E: the second coating 24 is sprayed respectively on multiple side walls 114 of multiple identification of fingerprint sensing elements 11, as shown in Figure 9.Yu Ben
In preferred embodiment, the second coating 24 is the second colored paint, and the color of the second colored paint is identical as the color of the first colored paint 212, makes
Obtain the color of the upper surface of identification of fingerprint sensing element 11 and the solid colour of its multiple side wall 114.
Next, carrying out step F: respectively by excluding the first protective film cut on multiple identification of fingerprint sensing elements 11
22* and the second protective film 23* cut.Finally, carrying out step G: identification of fingerprint sensing element 11 is respectively set in opposite
On the circuit board 12 answered, to form identification of fingerprint module 1, as shown in Figure 1.In this preferred embodiment, identification of fingerprint induction member
The second surface (that is, its lower surface) of part 11 is set on circuit board 12 with surface adhering technical (SMT), makes to be located at finger
Multiple electrical connection sections 1111 on the second surface of line identification sensing element 11 are able to be electrically connected with circuit board 12.By this hair
The integral color that bright method is formed by identification of fingerprint module 1 can be consistent with the envelop color of electronic device, and does not have fat edges
Structure exists.
Specifically have three, first, after step A completion, multiple fertilizer for being formed due to surface tension effects
Side structure 214 is located in the outer edge area 204 of induction connecting plate 20, and the method for the present invention passes through the rim area for cutting induction connecting plate 20
Domain 204 and exclude fat edges structure 214, the appearance to solve the problems, such as identification of fingerprint module is inaesthetic.Second, due to covering second
Protective film 23 therefore can protect multiple electrical connection sections 111 on the second surface 203 of induction connecting plate 20, to avoid in carrying out step F
During, pollution occurs or damages the situation of multiple electrical connection sections 111.Third, fat edges structure 214 will form in induction connecting plate
In 20 outer edge area 204, and its outer edge area 204 refers in induction connecting plate 20 at the periphery on each surface, in order to maintain drawing
It is high-visible, in Fig. 4, Fig. 6 and Fig. 7 only show induction connecting plate 20 first surface 203 two sides on fat edges structure
214。
As described above, the method for the present invention is first to carry out first time spray coating operations to the first surface of induction connecting plate, connect
Protection respectively of getting off incudes the first surface and its second surface of connecting plate, and cuts the outer edge area of induction connecting plate, to be formed
Multiple identification of fingerprint sensing elements, while first time spray coating operations can be excluded and be formed by fat edges structure.Next respectively to more
Multiple side walls of a identification of fingerprint sensing element carry out second of spray coating operations, so that the integral color of identification of fingerprint sensing element
Unanimously.Finally, excluding cropped the first protective film and the second protective film, and carry out identification of fingerprint sensing element and circuit board
Combination, with complete identification induction module assembling.
The foregoing is merely presently preferred embodiments of the present invention, the claim being not intended to limit the invention, thus it is all its
It is intended to be limited solely by claim of the invention without departing from the lower equivalent change or modification completed of spirit disclosed in this invention
It is interior.
Claims (10)
1. a kind of method for assembling identification of fingerprint module, comprising the following steps:
(A) one first coating of spraying is on a first surface of an induction connecting plate；
(B) one first protective film of covering is on the first surface of the induction connecting plate, and covers one second protective film in the induction
On one second surface of connecting plate；
(C) the induction connecting plate is cut, to form multiple identification of fingerprint sensing elements；
(D) one second coating of spraying is on multiple side walls of multiple identification of fingerprint sensing element；And
(E) by excluding cropped first protective film and second protective film on multiple identification of fingerprint sensing element.
2. the method for assembling identification of fingerprint module as described in claim 1, wherein further include step after step (E)
(F): the identification of fingerprint sensing element is set on a corresponding circuit board, to form an identification of fingerprint module.
3. the method for assembling identification of fingerprint module as claimed in claim 2, wherein in step (E), identification of fingerprint induction
The second surface of element is set on the circuit board with surface adhering technical, is made positioned at the identification of fingerprint sensing element
An electrical connection section and the circuit board on the second surface are electrically connected.
4. the method for assembling identification of fingerprint module as described in claim 1, wherein in step (A), first coating setting
In on the induction connecting plate, according to surface tension effects, keep first coating multiple in being formed in the outer edge area of the induction connecting plate
Fat edges structure.
5. the method for assembling identification of fingerprint module as described in claim 1, wherein in the step (B), first protective film
It is to be covered in bonding method on the first surface of the induction connecting plate, and first protective film includes:
One the first film ontology is contacted to the first surface with the induction connecting plate；And
One first viscose glue is distributed on the first film ontology, to combine the first film ontology and the induction connecting plate
The first surface.
6. the method for assembling identification of fingerprint module as claimed in claim 5, wherein the first film ontology is with polyimides
Made by material or polyethylene terephthalate material, and first viscose glue is silica gel.
7. the method for assembling identification of fingerprint module as described in claim 1, wherein in the step (B), second protective film
It is the electrical connection section for being covered in bonding method on the second surface of the induction connecting plate, and covering the induction connecting plate, this
Two protective films include:
One second film bulk, to be contacted with the second surface of the induction connecting plate and the electrical connection section；And
One second viscose glue is distributed on second film bulk, to combine second film bulk and the induction connecting plate
The second surface.
8. the method for assembling identification of fingerprint module as claimed in claim 7, wherein second film bulk is with polyimides
Made by material or polyethylene terephthalate material, and second viscose glue is silica gel.
9. as described in claim 1 assembling identification of fingerprint module method, wherein the step (A) the following steps are included:
Step (A1): one first priming paint in first coating is sprayed on the first surface of the induction connecting plate；
Step (A2): one first colored paint in first coating is sprayed on first priming paint；And
Step (A3): one first finishing coat in first coating is sprayed on first colored paint.
10. the method for assembling identification of fingerprint module as claimed in claim 9, wherein second coating is one second colored paint, and
The color of second colored paint is identical as the color of first colored paint.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810245067.XA CN110298215B (en) | 2018-03-23 | 2018-03-23 | Method for assembling fingerprint identification module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810245067.XA CN110298215B (en) | 2018-03-23 | 2018-03-23 | Method for assembling fingerprint identification module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110298215A true CN110298215A (en) | 2019-10-01 |
| CN110298215B CN110298215B (en) | 2023-01-03 |
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ID=68025916
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810245067.XA Active CN110298215B (en) | 2018-03-23 | 2018-03-23 | Method for assembling fingerprint identification module |
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| CN104867883A (en) * | 2014-02-24 | 2015-08-26 | 新东亚微电子股份有限公司 | Fingerprint identification chip packaging module and manufacturing method thereof |
| CN204808363U (en) * | 2012-11-20 | 2015-11-25 | 韩国科泰高科株式会社 | Fingerprint sensor module, has this portable electronic equipment |
| JP2017208388A (en) * | 2016-05-16 | 2017-11-24 | 株式会社アルバック | Method for manufacturing electronic components and processing system |
| CN107818291A (en) * | 2016-09-14 | 2018-03-20 | 致伸科技股份有限公司 | Assemble the method for identification of fingerprint module and the cutting process of identification of fingerprint sensing element |
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2018
- 2018-03-23 CN CN201810245067.XA patent/CN110298215B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101582416A (en) * | 2008-05-14 | 2009-11-18 | 夏普株式会社 | Electronic element wafer module and method for manufacturing the same |
| CN204808363U (en) * | 2012-11-20 | 2015-11-25 | 韩国科泰高科株式会社 | Fingerprint sensor module, has this portable electronic equipment |
| CN104867883A (en) * | 2014-02-24 | 2015-08-26 | 新东亚微电子股份有限公司 | Fingerprint identification chip packaging module and manufacturing method thereof |
| JP2014099667A (en) * | 2014-03-06 | 2014-05-29 | Nichia Chem Ind Ltd | Optical semiconductor device and manufacturing method of the same |
| JP2017208388A (en) * | 2016-05-16 | 2017-11-24 | 株式会社アルバック | Method for manufacturing electronic components and processing system |
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| CN110298215B (en) | 2023-01-03 |
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