CN110298215B - Method for assembling fingerprint identification module - Google Patents
Method for assembling fingerprint identification module Download PDFInfo
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- CN110298215B CN110298215B CN201810245067.XA CN201810245067A CN110298215B CN 110298215 B CN110298215 B CN 110298215B CN 201810245067 A CN201810245067 A CN 201810245067A CN 110298215 B CN110298215 B CN 110298215B
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- sensing
- fingerprint identification
- protective film
- connecting plate
- coating
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/1365—Matching; Classification
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- Physics & Mathematics (AREA)
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- Theoretical Computer Science (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Image Input (AREA)
Abstract
The invention provides a method for assembling a fingerprint identification module, which comprises the steps of firstly carrying out primary spraying work on a first surface of an induction connecting plate, and respectively covering a first protective film and a second protective film on the first surface and a second surface of the induction connecting plate. Then, the sensing connecting plate is cut to form a plurality of fingerprint identification sensing elements, and meanwhile, a fat edge structure formed by the first spraying work can be removed. And then, respectively carrying out secondary spraying work on a plurality of side walls of the fingerprint identification sensing elements, and removing the cut first protective film and the cut second protective film to ensure that the color of the first surface of the fingerprint identification sensing element is consistent with that of the side walls of the fingerprint identification sensing element.
Description
Technical Field
The present invention relates to an assembly method, and more particularly, to a method for assembling a fingerprint recognition module.
Background
In recent years, fingerprint identification technology is applied to various electronic products, so that a user can input his/her fingerprint into the electronic product and store the electronic product, and then the user can input his/her fingerprint through a fingerprint identification module to unlock the electronic product. The electronic product is unlocked by using the fingerprint identification technology more quickly and conveniently than the conventional unlocking method of manually inputting the password, so that the method is favored by users, and the requirement of the fingerprint identification module is greatly increased.
Generally speaking, the fingerprint identification module includes a fingerprint identification sensing element, a protection cover and a circuit board, wherein the fingerprint identification sensing element is disposed on and electrically connected to the circuit board, and functions to sense a finger of a user and extract fingerprint information thereof. The protective cover is coated on the fingerprint identification sensing element to protect the fingerprint identification sensing element, so that the finger of a user can only contact with the protective cover and can not directly contact with the fingerprint identification sensing element, and the fingerprint identification sensing element is prevented from being damaged. However, the cost of the protective cover is high, and in order to reduce the cost of the fingerprint identification module, a coating is disposed on the fingerprint identification sensing element in the market, so that the sprayed coating covers the fingerprint identification sensing element to protect the fingerprint identification sensing element.
In addition, the fingerprint identification module is disposed on an electronic device (e.g., a smart phone, a tablet computer, etc.) and partially exposed outside a housing of the electronic device for a user to operate, wherein a color of the fingerprint identification module is different from a color of the housing of the electronic device. For aesthetic reasons, the coating with the same color as the housing is selected during the process of spraying the coating, so that the color of the fingerprint identification module is the same as that of the housing.
However, the coating material distributed on the fingerprint sensor forms a fat edge structure in the outer edge region of the fingerprint sensor according to the surface tension, which may cause defects in the appearance of the fingerprint sensor module.
Therefore, a method for assembling a fingerprint recognition module is needed to solve the problem of beauty.
Disclosure of Invention
The present invention is directed to a method for assembling a fingerprint recognition module that solves the problem of appearance.
In a preferred embodiment, the present invention provides a method for assembling a fingerprint recognition module, comprising the steps of:
(A) Spraying a first coating on a first surface of an induction connecting plate.
(B) Covering a first protection film on the first surface of the sensing connecting plate and covering a second protection film on a second surface of the sensing connecting plate.
(C) The sensing connecting plate is cut to form a plurality of fingerprint identification sensing elements.
(D) And spraying a second coating on the side walls of the fingerprint identification sensing elements.
(E) The cut first protective film and the second protective film are excluded from the plurality of fingerprint identification sensing elements.
In a preferred embodiment, the step (a) includes the steps of:
step (A1): spraying a first primer in the first paint on the first surface of the induction connecting plate.
Step (A2): spraying a first color paint in the first paint on the first primer.
Step (A3): spraying a first surface paint in the first paint on the first color paint.
In a preferred embodiment, the second coating is a second colored paint, and the color of the second colored paint is the same as the color of the first colored paint.
In brief, the method of the present invention includes performing a first spraying operation on a first surface of an induction connection plate, respectively protecting the first surface and a second surface of the induction connection plate, and cutting the induction connection plate to form a plurality of fingerprint identification induction elements, while removing a fat edge structure formed by the first spraying operation. And then, spraying for the second time on a plurality of side walls of the fingerprint identification sensing elements respectively, so that the overall color of the fingerprint identification sensing elements is consistent. And finally, removing the cut first protective film and the cut second protective film, and combining the fingerprint identification sensing element with the circuit board to complete the assembly of the identification sensing module.
Drawings
FIG. 1 is a schematic diagram of a fingerprint recognition module according to a preferred embodiment of the present invention.
FIG. 2 is a flow chart of a method for assembling a fingerprint recognition module according to a preferred embodiment of the present invention.
FIG. 3 is a cross-sectional view of a sensing connection plate of the fingerprint recognition module according to a preferred embodiment of the present invention.
FIG. 4 is a cross-sectional view of a sensing connection plate of the fingerprint recognition module of the present invention sprayed with a first coating in a preferred embodiment.
FIG. 5 is a cross-sectional view of a portion of a sensing connecting plate and a first coating of the fingerprint recognition module according to a preferred embodiment of the present invention.
FIG. 6 is an exploded view of the sensing connection plate, the first protective film and the second protective film of the fingerprint recognition module according to a preferred embodiment of the present invention.
FIG. 7 is a schematic diagram of a sensing connecting plate of the fingerprint recognition module before being cut according to a preferred embodiment of the invention.
FIG. 8 is a cross-sectional view of a cut-away sensing connecting plate of the fingerprint recognition module according to a preferred embodiment of the present invention.
FIG. 9 is a schematic view of a fingerprint sensing device of the fingerprint sensing module of the present invention being sprayed with a second coating in a preferred embodiment.
The reference numbers are as follows:
1. fingerprint identification module
211 fingerprint identification sensing element
12. Circuit board
20. Induction connecting plate
21. First coating
22. First protective film
23. Second protective film
22 first protective film cut
23 # cut second protective film
24. Second coating
111. Substrate
112. Induction crystal grain
113. Encapsulation layer
114. Side wall of fingerprint identification sensing element
115. Lower surface of fingerprint identification sensing element
201. Board connecting substrate
202. Board connecting packaging layer
203. First surface of induction connecting plate
204. Outer edge region of induction connecting plate
205. Second surface of the induction connecting plate
211. First primer
212. First color paint
213. First face paint
214. Fat edge structure
221. First film body
222. The first adhesive
231. Second film body
232. Second adhesive
1111. Electrical connection part
A-F, A, A2 and A3
P location reference point
Detailed Description
The invention provides a method for assembling a fingerprint identification module, which aims to solve the known technical problem. Fig. 1 is a schematic structural diagram of a fingerprint identification module according to a preferred embodiment of the present invention. The fingerprint identification module 1 includes a fingerprint identification sensing element 11 and a circuit board 12, and the fingerprint identification sensing element 11 is fixed on the circuit board 12. In the preferred embodiment, the fingerprint sensor device 11 is packaged by Land Grid Array (LGA), and the circuit board 12 can be a Flexible Printed Circuit (FPC) or a flexible-rigid composite board.
The fingerprint sensor device 11 includes a substrate 111, a plurality of sensor dies 112, and a package layer 113, wherein the substrate 111 has a plurality of electrical connections 1111 disposed on a lower surface of the substrate 111 (i.e., a lower surface 115 of the fingerprint sensor device 11), the sensor dies 112 are disposed on the substrate 111 and Wire bonded (Wire Bonding) to the substrate 111, and the package layer covers the plurality of sensor dies 112 and an upper surface of the substrate 111, and in the preferred embodiment, the package layer 113 is an epoxy Encapsulation Material (EMC).
A method of assembling the fingerprint recognition module is described below. Please refer to fig. 2, which is a flowchart illustrating a method for assembling a fingerprint recognition module according to a preferred embodiment of the present invention. The method for assembling the fingerprint identification module comprises the following steps:
step A: and spraying a first coating on the first surface of the induction connecting plate.
And B, step B: the first protective film is covered on the first surface of the induction connecting plate, and the second protective film is covered on the second surface of the induction connecting plate.
And C: and cutting the sensing connecting plate to form a plurality of fingerprint identification sensing elements.
Step D: spraying a second coating on the plurality of side walls of the plurality of fingerprint identification sensing elements.
Step E: the cut first protective film and the second protective film are excluded from the plurality of fingerprint identification sensing elements.
Step F: and arranging a fingerprint identification sensing element on the circuit board to form a fingerprint identification module.
Wherein, step A includes:
step A1: and spraying a first primer in a first coating on the first surface of the induction connecting plate.
Step A2: spraying a first color paint in the first paint on the first primer.
Step A3: and spraying the first finishing coat in the first coating on the first color coat.
The following describes an implementation of the method for assembling the fingerprint recognition module. Referring to fig. 3, 4 and 5, fig. 4 is a schematic cross-sectional view illustrating a structure of a sensing link plate of a fingerprint recognition module sprayed with a first coating in a preferred embodiment of the present invention, and fig. 5 is a schematic cross-sectional view illustrating a partial structure of the sensing link plate of the fingerprint recognition module and the first coating in a preferred embodiment of the present invention. When the production line starts to carry out the method for assembling the fingerprint identification module, firstly, the step A is carried out: a first coating 21 is sprayed on the first surface 203 of the induction connection board 20, and fig. 4 shows the structure of the induction connection board 20, the induction connection board 20 includes a connection board substrate 201, a plurality of induction dies 112, and a connection board encapsulation layer 202. Wherein the plurality of sensing dies 112 are disposed on the connecting substrate 201 and Wire bonded (Wire) to the connecting substrate 201
Bonding) and the link encapsulation layer 202 covers the plurality of sensor dies 112 and the upper surface of the link substrate 201. The first coating 21 includes a first primer 211, a first color paint 212, and a first topcoat 213, as shown in fig. 5.
In step a, first, step A1: a first primer 211 is sprayed on the first surface 203 of the induction link plate 20. Next, step A2 is performed: the first colored paint 212 is sprayed on the first primer 211, so that the induction connecting plate 20 can display the color of the first colored paint 212. Finally, step A3 is performed: the first topcoat 213 is sprayed on the first pigmented paint 212 to protect the first pigmented paint 212. After step a, the first coating 21 is coated on the first surface 203 of the induction connection plate 20, so that the first coating 21 forms a plurality of fat edge structures 214 on the outer edge area 204 of the induction connection plate 20 due to the surface tension, as shown in fig. 4. In the preferred embodiment, the color of the first colored paint 212 is the same as the color of the housing of the electronic device (not shown) to which the fingerprint recognition module 2 is applied.
Referring to fig. 3 and 6, fig. 6 is an exploded view of the sensing connecting plate, the first protective film and the second protective film of the fingerprint recognition module according to a preferred embodiment of the present invention. After the step a is completed, the first protection film 22 and the second protection film 23 are prepared, fig. 6 shows the structure of the first protection film 22 and the second protection film 23, the first protection film 22 includes a first film body 221 and a first adhesive 222, and the first film body 221 can contact with the first surface 203 of the sensing link plate 20. The first adhesive 222 is distributed on the first film body 221 and functions to bond the first film body 221 and the first surface 203 of the sensing connection board 20. Similar to the first protective film 22, the second protective film 23 includes a second film body 231 and a second adhesive 232, and the second film body 231 can be in contact with the second surface 203 of the sensing link plate 20. The second adhesive 232 is disposed on the second film body 231 and functions to bond the second film body 231 and the second surface 203 of the sensing connection board 20. In the preferred embodiment, the first film body 221 and the second film body 231 are made of Polyimide (PI) material or Polyethylene Terephthalate (PET) material, and the first adhesive 222 and the second adhesive 232 are made of silicone.
Step B is then performed: the first protection film 22 is covered on the first surface 203 of the induction connection plate 20 in an adhering manner, and the second protection film 23 is covered on the second surface 203 of the induction connection plate 20 in an adhering manner. Referring to fig. 2, 7 and 8, fig. 7 is a schematic structural view of a sensing connecting plate of a fingerprint recognition module before being cut in a preferred embodiment of the present invention, and fig. 8 is a schematic structural cross-sectional view of the sensing connecting plate of the fingerprint recognition module after being cut in a preferred embodiment of the present invention. After step B is completed, step C is performed: the sensing plate 20 is cut to form a plurality of fingerprint sensing devices 11, wherein the position P to be cut in the sensing plate 20 must be determined in advance before cutting, as shown in fig. 7. Generally speaking, there are a plurality of positioning reference points on the sensing board 20 to indicate the positions of the plurality of sensing dies 112 in the sensing board 20, so as to determine the positioning position P to be cut. The detailed procedures for locating reference points and trimming operations are well known to those skilled in the art and will not be described further.
Specifically, in step C, the sensing link 20 may be cut by various physical tools or any cutting tools (e.g., laser cutter), and the outer edge region 204 of the sensing link 20 may be removed during the cutting process to eliminate the fat edge structures 214. Fig. 8 shows the structure of the cut fingerprint sensor device 11, wherein the upper surface and the lower surface of each fingerprint sensor device 11 are covered by the cut first protective film 22 and the cut second protective film 23, respectively, and only the sidewalls 114 of the fingerprint sensor device 11 are exposed.
Referring to fig. 1, 2 and 9, fig. 9 is a schematic structural view of a fingerprint sensing element of the fingerprint sensing module of the present invention sprayed with a second coating in a preferred embodiment. After the fingerprint identification sensor 11 is formed, step E is performed: the second coating 24 is respectively sprayed on the sidewalls 114 of the fingerprint sensor devices 11, as shown in fig. 9. In the preferred embodiment, the second paint 24 is a second color paint, and the color of the second color paint is the same as the color of the first color paint 212, so that the color of the upper surface of the fingerprint sensing device 11 is the same as the color of the sidewalls 114.
Next, step F is performed: the cut first protective film 22 and the cut second protective film 23 are excluded from the plurality of fingerprint sensing elements 11, respectively. Finally, step G is performed: the fingerprint sensing elements 11 are disposed on the corresponding circuit boards 12, respectively, to form a fingerprint sensing module 1, as shown in fig. 1. In the preferred embodiment, the second surface (i.e. the lower surface) of the fingerprint sensing device 11 is disposed on the circuit board 12 by a Surface Mount Technology (SMT), such that the electrical connections 1111 located on the second surface of the fingerprint sensing device 11 are electrically connected to the circuit board 12. The integral color of the fingerprint identification module 1 formed by the method of the invention is consistent with the color of the shell of the electronic device, and no fat edge structure exists.
First, after step a, a plurality of fat edge structures 214 formed by surface tension are located on the outer edge area 204 of the sensing link plate 20, and the method of the present invention eliminates the fat edge structures 214 by cutting the outer edge area 204 of the sensing link plate 20, so as to solve the problem that the appearance of the fingerprint identification module is not beautiful. Second, since the second protective film 23 is covered on the second surface 203 of the sensing connection board 20, the electrical connection portions 111 can be protected, so as to avoid the electrical connection portions 111 being contaminated or damaged during the step F. Third, the fat edge structure 214 is formed on the outer edge area 204 of the induction link plate 20, and the outer edge area 204 refers to the periphery of each surface of the induction link plate 20, and in order to keep the drawing clearly visible, only the fat edge structures 214 on both sides of the first surface 203 of the induction link plate 20 are shown in fig. 4, 6 and 7.
According to the above, the method of the present invention includes performing a first spraying operation on the first surface of the sensing connection plate, then respectively protecting the first surface and the second surface of the sensing connection plate, and cutting the outer edge region of the sensing connection plate to form a plurality of fingerprint identification sensing elements, and simultaneously removing the fat edge structure formed by the first spraying operation. And then, spraying for the second time on a plurality of side walls of the fingerprint identification sensing elements respectively, so that the overall color of the fingerprint identification sensing elements is consistent. And finally, removing the cut first protective film and the cut second protective film, and combining the fingerprint identification sensing element with the circuit board to complete the assembly of the identification sensing module.
The above-mentioned embodiments are merely preferred embodiments of the present invention, which are not intended to limit the scope of the present invention, and therefore, all equivalent changes and modifications that do not depart from the spirit of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A method of assembling a fingerprint recognition module, comprising the steps of:
(A) Spraying a first coating on a first surface of an induction connecting plate;
(B) Covering a first protective film on the first surface of the induction connecting plate and covering a second protective film on a second surface of the induction connecting plate;
(C) Cutting the sensing connecting plate to form a plurality of fingerprint identification sensing elements;
(D) Spraying a second coating on a plurality of side walls of the plurality of fingerprint identification sensing elements; and
(E) The cut first protective film and the second protective film are excluded from the plurality of fingerprint identification sensing elements.
2. The method of claim 1, further comprising (F) after step (E): the fingerprint identification sensing element is arranged on a corresponding circuit board to form a fingerprint identification module.
3. The method according to claim 2, wherein in step (E), the second surface of the fingerprint sensor device is disposed on the circuit board by surface mount technology, such that an electrical connection portion disposed on the second surface of the fingerprint sensor device is electrically connected to the circuit board.
4. The method of claim 1, wherein in step (A), the first coating is disposed on the sensing web, and the first coating forms a plurality of bead structures on the outer edge of the sensing web based on surface tension.
5. The method of claim 1, wherein in the step (B), the first protective film is adhesively coated on the first surface of the sensing link plate, and the first protective film comprises:
a first membrane body for contacting the first surface of the sensing connection plate; and
and the first adhesive is distributed on the first film body and is used for combining the first film body and the first surface of the induction connecting plate.
6. The method of claim 5, wherein the first film body is made of a polyimide material or a polyethylene terephthalate material, and the first adhesive is a silicone.
7. The method of claim 1, wherein in the step (B), the second protective film is adhesively coated on the second surface of the sensing board and covers an electrical connection portion of the sensing board, the second protective film comprises:
a second film body for contacting the second surface of the sensing connection plate and the electrical connection portion; and
and the second adhesive is distributed on the second film body and is used for combining the second film body and the second surface of the induction connecting plate.
8. The method of claim 7, wherein the second film body is made of a polyimide material or a polyethylene terephthalate material, and the second adhesive is a silicone.
9. The method of claim 1, wherein the step (a) comprises the steps of:
step (A1): spraying a first primer in the first coating on the first surface of the induction connecting plate;
step (A2): spraying a first colored paint in the first coating on the first primer; and
step (A3): spraying a first surface paint in the first paint on the first color paint.
10. The method of claim 9, wherein the second coating material is a second color paint, and the second color paint has a color identical to the first color paint.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810245067.XA CN110298215B (en) | 2018-03-23 | 2018-03-23 | Method for assembling fingerprint identification module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810245067.XA CN110298215B (en) | 2018-03-23 | 2018-03-23 | Method for assembling fingerprint identification module |
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| CN110298215A CN110298215A (en) | 2019-10-01 |
| CN110298215B true CN110298215B (en) | 2023-01-03 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2009277883A (en) * | 2008-05-14 | 2009-11-26 | Sharp Corp | Electronic element wafer module and method of manufacturing the same, electronic element module, and electronic information device |
| CN204808363U (en) * | 2012-11-20 | 2015-11-25 | 韩国科泰高科株式会社 | Fingerprint sensor module, has this portable electronic equipment |
| TWI485821B (en) * | 2014-02-24 | 2015-05-21 | Dynacard Co Ltd | Package module of fingerprint identification chip and method of the same |
| JP5796649B2 (en) * | 2014-03-06 | 2015-10-21 | 日亜化学工業株式会社 | Optical semiconductor device and manufacturing method thereof |
| JP6745136B2 (en) * | 2016-05-16 | 2020-08-26 | 株式会社アルバック | Electronic component manufacturing method and processing system |
| CN107818291B (en) * | 2016-09-14 | 2022-01-04 | 致伸科技股份有限公司 | Method for assembling fingerprint identification module and cutting method of fingerprint identification sensing element |
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