CN105956561A - Press type fingerprint identifier and manufacturing method thereof - Google Patents
Press type fingerprint identifier and manufacturing method thereof Download PDFInfo
- Publication number
- CN105956561A CN105956561A CN201610296751.1A CN201610296751A CN105956561A CN 105956561 A CN105956561 A CN 105956561A CN 201610296751 A CN201610296751 A CN 201610296751A CN 105956561 A CN105956561 A CN 105956561A
- Authority
- CN
- China
- Prior art keywords
- cof
- identification unit
- fingerprint identification
- pressing type
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
Landscapes
- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a press type fingerprint identifier, comprising a substrate and a COF electrically connected with the substrate. The substrate comprises a preset fingerprint sensing area, and the edge of the fingerprint sensing area is provided with a gap. The upper surface of the fingerprint sensing area is pasted with a base plate, and the base plate is provided with a through hole. The COF is provided with a fingerprint sensor and a sensing layer. The lower surface of the sensing layer is pasted with a conductive baffle. The end of the upper surface of the COF is adhered to the lower surface of the substrate. One end of the COF is bent upward along a position flush with the gap to make the fingerprint sensor completely embedded into the through hole. The conductive baffle is bent downward to make the sensing layer and the fingerprint sensing area overlap with each other. Imaging is stable, and the yield is improved.
Description
Technical field
The invention belongs to the technical field for identifying figure, particularly relate to a kind of pressing type Fingerprint Identification Unit and
Its manufacture method.
Background technology
Along with the universal use with notebook computer that develops rapidly of electronic technology, current network technology in addition
High speed development, device fabrication the smallest and the most exquisite convenient, its personal sensitive information preserved and secret number
Being lost and stolen risk according to being faced with, the existing safety only realized with a kind of password authentification form is compared,
The use of fingerprint identification technology makes its level of security higher.
At present, pressing type Fingerprint Identification Unit manufacture during because in encapsulation process each element it
Between only by one layer of two-sided conductive adhesive, the most two-sided conducting resinl itself is because former material is processed and follow-up cross cutting adds
Work making can cause the phenomenon of the coating inequality of glue, so that Fingerprint Identification Unit is in whole encapsulation process, because of
The element layering of two-sided conducting resinl stickup degree uneven generation fingerprint reading area is bad, causes product to read and refers to
During stricture of vagina, imaging is unstable, and yields is low, and cost waste is higher.
Summary of the invention
The invention aims to solve above-mentioned technical problem, and provide a kind of pressing type Fingerprint Identification Unit and
Its manufacture method, thus realize product image stabilization, yields improves, cost-effective.In order to reach above-mentioned
Purpose, technical solution of the present invention is as follows:
A kind of pressing type Fingerprint Identification Unit, including substrate and the COF that electrically connects with described substrate；Described base
Plate includes the fingerprint induction region preset, and the edge of described fingerprint induction region is jagged, described fingerprint
Induction region upper surface is bonded with backing plate, and described backing plate is provided with through hole, and described COF is provided with fingerprint sensing
Device and inductive layer, the lower surface bonds of described inductive layer has conductive shield, one end of the upper surface of described COF
Being adhered to the lower surface of described substrate, the other end of described COF is along the position flushed with described breach upwards
Bending makes described fingerprint sensor be completely fitted with described lead to the hole site, and described conductive shield bends downwards and makes
Obtain described inductive layer overlapping with described fingerprint induction region.
Concrete, described substrate includes printing board PCB or flexible PCB FPC.
Concrete, also include the light guide plate for transmitting display optical signal being located at described base plate bottom.
Concrete, the upper and lower surface of described backing plate is bonded with double faced adhesive tape respectively.
Concrete, the end of the upper surface of described COF is provided with golden finger area and it is adhered to described substrate
The pin field of lower surface.
Concrete, the upper surface of described conductive shield bonds to the lower surface of described inductive layer, and described conduction is kept off
The lower surface bonds of plate is to described backing plate.
Concrete, pressing type Fingerprint Identification Unit manufacture method, comprise the following steps:
S1, utilizes the lower surface of the inductive layer of the described COF after die-cut with glue false sticker to align false patch, vacation is pasted
After described COF proceed to hot press and described conductive shield and carry out hot pressing and obtain packaged described COF；
S2, carries out pressing stickup by upper surface one end of packaged described COF and the lower surface of described substrate；
S3, by described backing plate bonding on described substrate, by the other end of described COF along flushing with described breach
Position is folded upward at, and described conductive shield bends downwards so that described inductive layer and described fingerprint induction region weight
Folded；
S4, puts into tool by the product after bending, toasts together with tool, and oven temperature sets 120 DEG C-130 DEG C,
Baking time sets 30min；
S5, cleans the product after baking；
S6, carries out, at fingerprint area pressed, processing of spraying paint.
Concrete, in S1, the preheating temperature of described false sticker is set to 118 DEG C-122 DEG C, preheating time
5Sec, board pressure 0.5Mpa；The temperature of described hot press is set as 178 DEG C-182 DEG C, hot pressing time 3Min,
Board pressure 2-3Mpa.
Concrete, in S2, between described COF and the described substrate after pressing, peeling force is more than or equal to
1.2kgf。
Concrete, in S6, spray process being divided into four times and completes, primer spray requires that film thickness value is 9 μ
M-11 μm, oven cooking times is 50Min, and baking temperature is 83-87 DEG C；Spray is painted ground floor and requires film
Thick value is 14 μm-16 μm, and oven cooking times is 50Min, and baking temperature is 83-87 DEG C；Paint the in spray
Two layers require that film thickness value is 14 μm-16 μm, and oven cooking times is 50Min, and baking temperature is 83-87 DEG C；
Topcoating require film thickness value be 16 μm-20 μm, preheating time 3Min, baking temperature 78-82 DEG C, UV energy:
900-1100mj/cm, chain speed: 3m/Min.
Compared with prior art, the beneficial effect of pressing type Fingerprint Identification Unit of the present invention and manufacture method thereof is main
It is embodied in: the part-structure of pressing type Fingerprint Identification Unit, through bending encapsulation, is effectively protected in COF
Circuit designs, and the breach of fingerprint induction region can leave space to kink, does not results in circuit folding and extremely causes
Open circuit or breakage；In the manufacture method of pressing type Fingerprint Identification Unit, by using strict procedure of processing,
And material state characteristic is carried out secondary change, the technique through hot pressing, baking solves fingerprint reading area
Each element bad problem of layering, improve yields, reduce production cost；The technique sprayed paint makes product
More fit durable.
Accompanying drawing explanation
Fig. 1 is the explosive view of the embodiment of the present invention 1；
Fig. 2 is the structural representation of the present embodiment 1 backing plate；
Fig. 3 is the front view of the present embodiment 1；
Fig. 4 is the side view of the present embodiment 1；
Fig. 5 is the rearview of the present embodiment 1；
Fig. 6 is the Fig. 3 sectional view along A-A；
Fig. 7 is the structural representation of the present embodiment 1；
Fig. 8 is lower surface and the bonding schematic diagram of conductive shield of the present embodiment 1COF；
In figure, numeral represents:
1 substrate, 11 fingerprint induction regions, 12 light guide plates, 13 signal lighties, 2 backing plates, 21 through holes, 22
One double faced adhesive tape, 23 second double faced adhesive tapes, 24 location hole, 3COF, 31 fingerprint inductors, 32 inductive layers, 33ACF
Glue, 4 conductive shield, 41 PURs, 42 conducting resinls, 43 locating dowels, 5 protecting film.
Detailed description of the invention
Technical scheme in the embodiment of the present invention will be carried out clear, complete description below in conjunction with the accompanying drawings, aobvious
So, described embodiment is only a part of embodiment of the present invention rather than whole embodiments.
Embodiment 1:
With reference to shown in Fig. 1, the present embodiment one pressing type Fingerprint Identification Unit, optional including substrate 1, substrate 1
With printing board PCB or flexible PCB FPC, and the COF3 electrically connected with substrate 1；Substrate 1 wraps
Including default fingerprint induction region 11, the side outer rim of fingerprint induction region 11 offers breach, gap position
Coordinate with the turnover of COF3.
With reference to shown in Fig. 2, backing plate 2 is corresponding with fingerprint induction region 11 size and offers at same position
Breach, the center of backing plate 2 is further opened with through hole 21, and two ends of the breach of backing plate 2 offer fixed respectively
Hole 24, position, the lower surface bonds of backing plate 2 has the band corresponding with its shape the first double faced adhesive tape 22 jaggy,
The upper surface of backing plate 2 is bonded with and exposes through hole 21 position and the second double faced adhesive tape 23 of position, hole 24, location, pad
Plate 2 utilizes pressing machine effect to be pasted onto on fingerprint induction region 11.
With reference to shown in Fig. 3-5, COF3 is provided with inductive layer 32, and inductive layer 32 is folded to fingerprint induction region
On 11, fingerprint induction region 11 lower surface is provided with light guide plate 12, and fingerprint sense is extended in the side of light guide plate 12
Answering region 11 and the side of turnup laminating fingerprint induction region 11, the bottom of substrate 1 is provided with and light guide plate 12
The LED signal lamp connected, light guide plate 12 is that the optical signal of bottom is shown in fingerprint induction zone by transparent material mass-energy
The side in territory 11, signal lights can make prompting according to the fingerprint situation that Fingerprint Identification Unit senses.
With reference to shown in Fig. 1 and Fig. 6 and Fig. 8, COF3 is provided with fingerprint sensor 31, fingerprint recognition data
By fingerprint sensor 31, view data being converted into analog circuit signal to computer, inductive layer 32 is COF3
Subregion, the lower surface of inductive layer 32 is bonded with conductive shield 4, conductive shield 4 by PUR 41
Lower surface bonds have a band jaggy conducting resinl 42 corresponding with backing plate 2 profile, conduction backing plate 4 times
Surface is provided with two locating dowels 43；The one end of the upper surface of COF3 is provided with golden finger area and it passes through ACF
Glue 33 is adhered to the pin field (not shown) of the lower surface of substrate 1, and COF3 is along conductive shield 4
The edge i.e. edge of inductive layer 32 is folded upward at along the position flushed with breach, and then conductive shield 4 is downward
Bending so that the inductive layer 32 of COF3 is overlapping with the fingerprint induction region 11 preset, fingerprint sensor 31
It is completely fitted with through hole 21 position in backing plate 2, locating dowel 43 and the backing plate 2 of conductive shield 4 lower surface
Interior hole, location 24 phase butt junction location.Due to the structure qualification of COF3, add the size of Fingerprint Identification Unit own
The restriction of structure, COF3 needs to bend twice the requirement of overall dimensions of could fitting, i.e. the bending of S type is effective
Protecting the circuit design in COF3, the breach of fingerprint induction region 11 leaves space can to S type kink,
Do not result in open circuit or breakage that circuit folding extremely causes.
With reference to shown in Fig. 7, inductive layer 32 surface of pressing type Fingerprint Identification Unit attaches protecting film 5, protecting film
5 optional PET, dust-proof antifouling, induction sensitivity is good.
Embodiment 2:
According to embodiment 1 pressing type Fingerprint Identification Unit manufacture method, the first step: COF3's is die-cut, by winding
Formula encapsulation produce COF3, utilize soft board bicker and mould to be punched out according to specification, die-cut after
Finished product allowance control, within 0.005mm, utilizes 100 times of magnifieres to inspect by random samples, it is ensured that the COF3 after die-cut
The smooth defective products without burr of surrounding, Mold Making requires that mold notch is less than with drift fit clearance tolerance
0.002mm；The encapsulation of second step: COF, utilizes vacation by the lower surface of the COF3 after die-cut with solid-state conductive glue
Patch machine alignment vacation patch, solid-state conductive glue is PUR 41, and the preheating temperature of false sticker is set to 118 DEG C-122 DEG C,
Preheating time, 5Sec, board pressure 0.5Mpa, then proceeded to hot press and conductive shield by the COF3 after vacation patch
4 carry out hot pressing, and the temperature of hot press is set as 178 DEG C-182 DEG C, hot pressing time 3Min, board pressure
2-3Mpa, needs before conductive shield 4 hot pressing to carry out ultrasonic waves for cleaning with isopropanol, and scavenging period is 3Min,
Prevent its surface bad because producing layering after greasy dirt and COF3 hot pressing；3rd step: ACF assembles, by packaged
COF3 utilize the lower surface of ACF glue and substrate 1 to carry out pressing stickup, the model requirement of ACF glue
TGP20508G is strip, and between COF3 and the substrate 1 after pressing, peeling force is more than or equal to 1.2kgf；The
Four steps: COF bending assembles, and carries out backing plate 2 the most again and assembles, and the positive and negative of backing plate 2 utilizes pressing
Machine sticking two-faced adhesive tape, is placed on COF3 on special bending tool subsequently, carries out S type bending and assembles, COF3 edge
The position flushed with breach to be folded upward at, conductive shield 4 bends downwards and inductive layer 32 is sensed with fingerprint
Region 11 is overlapping；5th step: baking, puts into tool by the product after bending, toasts together with tool, roasting
Case temperature sets 120 DEG C-130 DEG C, and baking time sets 30min；6th step: clean, by the product after baking
Product are put in Plasma equipment, utilize oxygen to be carried out, and make the complete deoxidation of product surface, follow-up
The adhesion effect sprayed paint and product dust fall more easy-clear；7th step: spraying, is carried out at fingerprint area pressed
Spray paint processing, i.e. at the inductive layer 32 of COF3, spray process is divided into four times and completes, primer spray
Requiring that film thickness value is 9 μm-11 μm, oven cooking times is 50Min, and baking temperature is 83-87 DEG C；In spray
Paint ground floor requires that film thickness value is 14 μm-16 μm, and oven cooking times is 50Min, and baking temperature is
83-87℃；Painting the second layer in spray and require that film thickness value is 14 μm-16 μm, oven cooking times is 50Min,
Baking temperature is 83-87 DEG C；Topcoating requires that film thickness value is 16 μm-20 μm, and preheating time, 3Min, toasted
Temperature 78-82 DEG C, UV energy: 900-1100mj/cm, chain speed: 3m/Min, finish paint is the UV colored varnish, UV
After the chain of equipment sets chain speed, the speed irradiating solid paint is fast, effective.The present invention is strict by using
Procedure of processing, and material state characteristic is carried out secondary change, the technique through hot pressing, baking solves
Each element of fingerprint reading area is layered bad problem, improves yields, reduces production cost.
Above-described is only some embodiments of the present invention.For the person of ordinary skill of the art,
Without departing from the concept of the premise of the invention, it is also possible to make some deformation and improvement, these broadly fall into
Protection scope of the present invention.
Claims (10)
1. a pressing type Fingerprint Identification Unit, it is characterised in that: include substrate and electrically connect with described substrate
COF；Described substrate includes the fingerprint induction region preset, and the edge of described fingerprint induction region is jagged,
Described fingerprint induction region upper surface is bonded with backing plate, and described backing plate is provided with through hole, and described COF is provided with
Fingerprint sensor and inductive layer, the lower surface bonds of described inductive layer has conductive shield, the upper table of described COF
The one end in face is adhered to the lower surface of described substrate, and the other end of described COF is along flushing with described breach
Position is folded upward at so that described fingerprint sensor is completely fitted with described lead to the hole site, described conductive shield to
Lower bending makes described inductive layer overlapping with described fingerprint induction region.
Pressing type Fingerprint Identification Unit the most according to claim 1, it is characterised in that: described substrate includes printing
Circuit board PCB or flexible PCB FPC.
Pressing type Fingerprint Identification Unit the most according to claim 1, it is characterised in that: also include being located at described base
The light guide plate for transmitting display optical signal bottom plate.
Pressing type Fingerprint Identification Unit the most according to claim 1, it is characterised in that: the upper surface of described backing plate
Double faced adhesive tape it is bonded with respectively with lower surface.
Pressing type Fingerprint Identification Unit the most according to claim 1, it is characterised in that: the upper surface of described COF
End be provided with golden finger area and it is adhered to the pin field of lower surface of described substrate.
Pressing type Fingerprint Identification Unit the most according to claim 1, it is characterised in that: described conductive shield upper
Surface bonds to the lower surface of described inductive layer, and the lower surface bonds of described conductive shield is to described backing plate.
Pressing type Fingerprint Identification Unit manufacture method the most according to claim 1, it is characterised in that include following step
Rapid:
S1, utilizes false sticker to align false patch, described in after vacation being pasted by the lower surface of the described COF after die-cut with glue
COF proceeds to hot press and described conductive shield carries out hot pressing and obtains packaged described COF；
S2, carries out pressing stickup by upper surface one end of packaged described COF and the lower surface of described substrate；
S3, by described backing plate bonding on described substrate, by the other end of described COF along flushing with described breach
Position is folded upward at, and described conductive shield bends downwards so that described inductive layer and described fingerprint induction region weight
Folded；
S4, puts into tool by the product after bending, toasts together with tool, and oven temperature sets 120 DEG C-130 DEG C,
Baking time sets 30min；
S5, cleans the product after baking；
S6, carries out, at fingerprint area pressed, processing of spraying paint.
Pressing type Fingerprint Identification Unit manufacture method the most according to claim 7, it is characterised in that: in S1,
The preheating temperature of described false sticker is set to 118 DEG C-122 DEG C, preheating time 5Sec, board pressure 0.5Mpa；
The temperature of described hot press is set as 178 DEG C-182 DEG C, hot pressing time 3Min, board pressure 2-3Mpa.
Pressing type Fingerprint Identification Unit manufacture method the most according to claim 7, it is characterised in that: in S2,
Between described COF and described substrate after pressing, peeling force is more than or equal to 1.2kgf.
Pressing type Fingerprint Identification Unit manufacture method the most according to claim 7, it is characterised in that: in S6,
Being divided into four times in spray process to complete, primer spray requires that film thickness value is 9 μm-11 μm, oven cooking times
For 50Min, baking temperature is 83-87 DEG C；Spray is painted ground floor and requires that film thickness value is 14 μm-16 μm, roasting
Case baking time is 50Min, and baking temperature is 83-87 DEG C；Spray is painted the second layer and requires that film thickness value is 14 μm-16
μm, oven cooking times is 50Min, and baking temperature is 83-87 DEG C；Topcoating requires that film thickness value is 16 μ
M-20 μm, preheating time 3Min, baking temperature 78-82 DEG C, UV energy: 900-1100mj/cm, chain speed:
3m/Min。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610296751.1A CN105956561B (en) | 2016-05-06 | 2016-05-06 | Push type Fingerprint Identification Unit and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610296751.1A CN105956561B (en) | 2016-05-06 | 2016-05-06 | Push type Fingerprint Identification Unit and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105956561A true CN105956561A (en) | 2016-09-21 |
| CN105956561B CN105956561B (en) | 2019-08-06 |
Family
ID=56913924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610296751.1A Active CN105956561B (en) | 2016-05-06 | 2016-05-06 | Push type Fingerprint Identification Unit and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105956561B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106270023A (en) * | 2016-09-29 | 2017-01-04 | 东莞市铭宣机电有限公司 | Fingerprint recognition module bender |
| CN107877876A (en) * | 2017-12-15 | 2018-04-06 | 昆山建皇光电科技有限公司 | LGA products automatic assembling and packaging technology |
| CN108196626A (en) * | 2018-01-17 | 2018-06-22 | 南昌黑鲨科技有限公司 | A kind of screen assembly and the intelligent terminal with the screen assembly |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2795945Y (en) * | 2005-05-08 | 2006-07-12 | 全量工业股份有限公司 | Micro and thin contact type image sensing device |
| US20110176037A1 (en) * | 2010-01-15 | 2011-07-21 | Benkley Iii Fred G | Electronic Imager Using an Impedance Sensor Grid Array and Method of Making |
| CN104036173A (en) * | 2014-07-02 | 2014-09-10 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition detection assembly and electronic device thereof |
| CN104700084A (en) * | 2015-03-06 | 2015-06-10 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition device, touch screen with same and terminal device |
| CN104866814A (en) * | 2015-04-17 | 2015-08-26 | 麦克思股份有限公司 | Fingerprint identification device and manufacturing method thereof |
-
2016
- 2016-05-06 CN CN201610296751.1A patent/CN105956561B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2795945Y (en) * | 2005-05-08 | 2006-07-12 | 全量工业股份有限公司 | Micro and thin contact type image sensing device |
| US20110176037A1 (en) * | 2010-01-15 | 2011-07-21 | Benkley Iii Fred G | Electronic Imager Using an Impedance Sensor Grid Array and Method of Making |
| CN104036173A (en) * | 2014-07-02 | 2014-09-10 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition detection assembly and electronic device thereof |
| CN104700084A (en) * | 2015-03-06 | 2015-06-10 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition device, touch screen with same and terminal device |
| CN104866814A (en) * | 2015-04-17 | 2015-08-26 | 麦克思股份有限公司 | Fingerprint identification device and manufacturing method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106270023A (en) * | 2016-09-29 | 2017-01-04 | 东莞市铭宣机电有限公司 | Fingerprint recognition module bender |
| CN107877876A (en) * | 2017-12-15 | 2018-04-06 | 昆山建皇光电科技有限公司 | LGA products automatic assembling and packaging technology |
| CN108196626A (en) * | 2018-01-17 | 2018-06-22 | 南昌黑鲨科技有限公司 | A kind of screen assembly and the intelligent terminal with the screen assembly |
| CN108196626B (en) * | 2018-01-17 | 2023-08-29 | 南昌黑鲨科技有限公司 | Screen assembly and intelligent terminal with same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105956561B (en) | 2019-08-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5144710B2 (en) | Touch screen manufacturing apparatus and manufacturing method | |
| CN105956561A (en) | Press type fingerprint identifier and manufacturing method thereof | |
| CN105528104A (en) | A touch control panel having a fingerprint identification function and a method for manufacturing the same | |
| US20130257791A1 (en) | Capacitive touch screen and manufacturing method thereof | |
| CN105528105A (en) | Touch control device | |
| CN104716081B (en) | Flexible apparatus and preparation method thereof | |
| JP2011506139A (en) | High temperature composite tape and method for producing the same | |
| CN108762583A (en) | A kind of flexible curved surface panel cover membrane type touch screen and its production method | |
| CN205439382U (en) | Deserted optics screen protection membrane of hot pressing curved surface multilayer | |
| TW201133300A (en) | Touch panel and its manufacturing method | |
| CN105792538A (en) | Internal copper plate copper exposure manufacturing method of power cell circuit board | |
| CN207481371U (en) | A kind of location type TPU protective films | |
| CN204808272U (en) | Touch panel with fingerprint identification function | |
| CN104142749B (en) | A kind of contact panel and preparation method thereof | |
| JP2008299421A (en) | Rfid tag and production method for rfid tag | |
| CN105630255B (en) | One chip OGS touch screen and preparation method thereof | |
| CN208240683U (en) | Electronic equipment | |
| CN104007877A (en) | High adhesive force laminating structure for touch control display equipment | |
| CN108062503A (en) | Fingerprint recognition module and its manufacturing method, terminal device | |
| CN108323039A (en) | A kind of multi-layer flexible circuit board manufacture craft that internal layer pad is exposed | |
| CN106471448A (en) | Duplexer, the manufacture method of duplexer, capacitance type contact panel and image display device | |
| CN106507618B (en) | Exterior panel and its manufacturing method | |
| CN104347535B (en) | Electronic packaging module and manufacturing method thereof | |
| CN104422975A (en) | Method for manufacturing shading pattern | |
| CN103838408B (en) | Monolithic glass Trackpad and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Yang Jianfeng Inventor after: Xiao Guanzheng Inventor after: Zhu Yun Inventor after: Li Can Inventor after: Peng Jie Inventor before: Dong Biqiang Inventor before: Gu Meirong |
|
| COR | Change of bibliographic data | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |