CN106471448A - Duplexer, the manufacture method of duplexer, capacitance type contact panel and image display device - Google Patents
Duplexer, the manufacture method of duplexer, capacitance type contact panel and image display device Download PDFInfo
- Publication number
- CN106471448A CN106471448A CN201580016098.2A CN201580016098A CN106471448A CN 106471448 A CN106471448 A CN 106471448A CN 201580016098 A CN201580016098 A CN 201580016098A CN 106471448 A CN106471448 A CN 106471448A
- Authority
- CN
- China
- Prior art keywords
- layer
- printing layer
- back side
- transparent panel
- panel substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Abstract
The disclosure provide a kind of when by Laser Processing by the transparent electrode layer of contact panel, distribution pattern layers, the printing layer generation duplexer of defect, the manufacture method of duplexer, capacitance type contact panel and image display device will not banded what the outer edge of transparent panel substrate back was formed by black ink.Top board (11) possesses：Transparent panel substrate (1)；2 layers of construction band printing layer (3), printing layer (3B) banded by the black of the outer edge being formed at above-mentioned transparent panel substrate (1) back side band printing layer (3W) with white and constitute；Planarization resin bed (4), have on the above-mentioned face banding printing layer (3) in the formation of above-mentioned transparent panel substrate (1), be formed as covering throughout the above-mentioned region banding printing layer (3) and above-mentioned transparent panel substrate (1)；And transparent electrode layer (6), it is formed at the back side of above-mentioned planarization resin bed, there is wiring layer (6A)；The above-mentioned wiring layer (6A) of this top board (11) and transparent electrode layer (6) are by being patterned using the Laser Processing of infrared laser from the rear side banding printing layer (3).The 2nd layer that is contacted with above-mentioned planarization resin bed (4) is that white bands printing layer (3W).
Description
Technical field
The present invention relates to the manufacture method of a kind of duplexer, duplexer, capacitance type contact panel and image display dress
Put, more particularly, to a kind of duplexer, duplexer of banding printing layer with the outer edge being formed at transparent panel substrate back
Manufacture method, capacitance type contact panel and image display device.The application is with March 24th, 2014 in Japanese publication
CLAIM OF PRIORITY based on Japanese patent application No. Patent 2014-060098, is incorporated in the application by referring to this application
In.
Background technology
The smart mobile phone that easily can be operated by contact panel, tablet PC are widely popularized, thus contact panel
Slimming, lightweight and cost degradation have become a urgent problem.
The detection mode of touch panel has various modes, for example, can enumerate：2 resistive film overlaps to be recognized
The resistive film mode of indicating positions and make panel surface produce ultrasound wave, surface acoustic wave and carry out the detection of indicating positions
Surface acoustic wave mode etc..With regard to the touch panel for above-mentioned smart mobile phone, tablet PC, need reply complicated as follows and have
The operation of degree of freedom：Clicked on panel with finger or drag or so that 2 fingers is pinched in the way of opening on picture
Put (Pinch out) action come enlarged drawing or make 2 fingers by contract near in the way of activity pinch (Pinch in) operation
Deng.Therefore, under present situation, form xy matrix using transparency electrode and the quiet of the detection of multiple indicating positions can be carried out simultaneously
Electric capacitive type touch panel becomes main flow.
In the past, in the manufacturing engineering of capacitive touch panel, the forming step of the test section of detection contact is：?
Nesa coating is coated on after substrate, by etching part only necessary to residue detection, and unwanted part is removed.
Although in addition, the wiring lead for connecting detection portion and external circuit passes through silver paste and passes through screen printing scopiform
Become the peripheral part in contact panel, but the number being as the test section on contact panel increases, wiring width miniaturization, therefore
The limit is produced by the maneuver of printing, now then same with nesa coating, to be formed by etching.
The maneuver of etching is roughly divided into：Wet-type etching using medicinal liquid and the dry-etching using laser etc..Wet-type etching
Wait and manufacturing process is many due to will be repeated to clean, dry-etching then has the simplification that can seek manufacturing process to reach fall
The advantage of low cost.
In addition, on contact panel, in order to cover aforesaid wiring lead, implementing to be referred to as banding printing in peripheral part
Predominantly use the printing of black ink.
That is, conventional electronic equipment etc. image display panel, be arranged on its surface capacitance type touch
Touch in panel, by the neighboring area of image display area is added a variety of patterns as banding region, to improve commodity value.
However, in above-mentioned neighboring area, because being formed with the Wiring pattern being electrically connected to transparency electrode, when constituting duplexer
Touch panel surface is possible to produce the concavo-convex of the shape corresponding to above-mentioned Wiring pattern.In this case, exist and can not tie up
Hold the desired flatness of touch panel, the problem of damaged merchandise value.
In addition, because over there plate substrate implement band and thereon paste optical double-sided adhesive tape band in the case of, by
Band the inner side of the segment difference of generation it may happen that bubble, air layer, so filling ultraviolet curable resin is filling by panel base
Back band the segment difference that printing layer is led to, so that the display panel substrate back side is smoothed, thus to form do not distort smooth
The display panel substrate of shape.
Prior art literature
Patent documentation
Patent documentation 1：Japanese Unexamined Patent Publication 2014-000725 publication
Patent documentation 2：Japanese Unexamined Patent Publication 2013-246885 publication
Patent documentation 3：Japanese Unexamined Patent Publication 2001-202826 publication
Content of the invention
Invent technical problem to be solved
However, in the manufacturing process using the Wet-type etching of medicinal liquid, due to there being the steps such as water flushing or etching, therefore must
Resin, the substrate with solvent resistance, alkali resistance etc. must be selected.In the case that there is no abundant resistance, can make film adaptation,
Electric conductivity of piece bulk resistance etc. produces bad.In addition, the reason also become yield rate more than the number of steps of Wet-type etching and reduce.
On the other hand, laser machine due to being dry type manufacturing process, therefore compared with wet type manufacturing process, resin, substrate
Selection there is degree of freedom, and procedure of processing number is also few.Must there are 8 steps, laser with respect to existing wet type manufacturing process
Then can be patterned with 1 step.
However, in conventional capacitance type contact panel, by laser machining the transparency electrode of contact panel
Layer, distribution pattern layers when, have produce formed by black ink in the outer edge of transparent panel substrate back band
The problem that printing layer is impaired and damages the defects such as outward appearance.
Therefore, in view of problem points conventional as above, it is an object of the invention to provide will touched by Laser Processing
When the transparent electrode layer of control panel, distribution pattern layers, black oil will not be passed through in the outer edge of transparent panel substrate back
Ink and the printing layer of banding that formed produces the duplexer of defect, the manufacture method of duplexer, capacitance type contact panel and figure
As display device.
Other objects of the present invention, can be described with reference to the accompanying drawings from below by the getable concrete advantage of the present invention
Embodiment clearly understand.
Solve the means of technical problem
In the present invention, make black and white 2 layers construction by banding Printing Department, and make illuminated infrared laser
Side be white portion, so that infrared ray is absorbed in above-mentioned white portion, reduce reach black part ultrared amount of reach,
Thus lowering the damage of the above-mentioned black part banding printing layer.
That is, the present invention is a kind of duplexer, it possesses：Transparent panel substrate；2 layers construction band printing layer,
It is formed at the outer edge at the back side of described transparent panel substrate, with the stacking of described transparent panel substrate-parallel；Planarization resin bed,
On the face banding printing layer described in having in the formation of described transparent panel substrate, be formed as cover throughout described band printing layer with
The region of described transparent panel substrate；And transparent electrode layer, it is formed at the back side of described planarization resin bed, there is distribution
Layer；In banding in printing layer of described 2 layers construction, the 2nd layer that is contacted with described planarization resin bed is white.
In addition, the duplexer of the present invention also can be following constructions：Described band printing layer be directly layered in described transparent
The back side of display panel substrate.
The duplexer of the present invention also can be following constructions：Described printing layer of banding is across the described transparent panel substrate of covering
The back side tackifier coating stacking.
In addition, the duplexer of the present invention also can be following constructions：Band in printing layer described, described 2nd layer red
Outside line absorbtivity is 92%～95% when wavelength is for 1060nm.
Further, the duplexer of the present invention also can be following constructions：Described transparency conducting layer is by comprising silver-colored Nanowire or Cu
The material of Nanowire is constituted.
The present invention is a kind of manufacture method of duplexer, and this duplexer possesses：Transparent panel substrate；2 layers construction band
Printing layer, is formed at the outer edge at the back side of described transparent panel substrate, with the stacking of described transparent panel substrate-parallel；Planarization
Resin bed, have in the formation of described transparent panel substrate described in band printing layer face on, be formed as cover band throughout described
Printing layer and the region of described transparent panel substrate；And transparent electrode layer, it is formed at the back side of described planarization resin bed, tool
There is wiring layer；And in banding in printing layer of described 2 layers construction, the 2nd layer that is contacted with described planarization resin bed is white；
By using infrared laser laser machining on the back side banding printing layer described in described duplexer as LASER Light Source
Described wiring layer and described transparency electrode pattern layers.
The present invention is a kind of capacitance type contact panel, and it possesses：Transparent panel substrate；2 layers construction band printing
Layer, is formed as and described transparent panel substrate-parallel in the outer edge at the back side of described transparent panel substrate；Planarization resin bed,
On the face banding printing layer described in having in the formation of described transparent panel substrate, be formed as cover throughout described band printing layer with
The region of described transparent panel substrate；And transparent electrode layer, it is formed at the back side of described planarization resin bed, there is distribution
Layer；In banding in printing layer of described 2 layers construction, the 2nd layer that is contacted with described planarization resin bed is white；Described band print
Described wiring layer on the back side of brush layer and described transparent electrode layer pattern by using the Laser Processing of infrared laser.
The capacitance type contact panel of the present invention also can be following constructions：Described printing layer of banding directly is layered in institute
State the back side of transparent panel substrate.
In addition, the capacitance type contact panel of the present invention also can be following constructions：Described printing layer of banding is across covering
Cover the tackifier coating stacking at the back side of described transparent panel substrate.
In addition, the capacitance type contact panel of the present invention also can be following constructions：Band in printing layer described, institute
The infrared ray absorbing amount stating the 2nd layer is 92%～95% when wavelength is for 1060nm.
Further, the capacitance type contact panel of the present invention also can be following constructions：Described transparency conducting layer is by comprising
The material of silver-colored Nanowire or Cu Nanowire is constituted.
The present invention is a kind of image display device, and it possesses capacitance type contact panel in display picture comprehensively, its
In, described capacitance type contact panel possesses：Transparent panel substrate；2 layers construction band printing layer, in described transparent panel
The outer edge at the back side of substrate is formed as and described transparent panel substrate-parallel；Planarization resin bed, in described transparent panel base
The formation of plate is banded on the face of printing layer described in having, and is formed as covering and bands printing layer and described transparent panel substrate throughout described
Region；And transparent electrode layer, it is formed at the back side of described planarization resin bed, there is wiring layer；In described 2 layers construction
Band in printing layer, the 2nd layer that is contacted with described planarization resin bed is white；Described on the described back side banding printing layer
Wiring layer and described transparent electrode layer pattern by using the Laser Processing of infrared laser.
The image display device of the present invention also can be following constructions：Described band printing layer be directly layered in described transparent
The back side of display panel substrate.
In addition, the image display device of the present invention also can be following constructions：Described printing layer of banding is across described in covering
The tackifier coating stacking at the back side of transparent panel substrate.
In addition, the image display device of the present invention also can be following constructions：Band in printing layer described, the described 2nd
The infrared ray absorbing amount of layer is 92%～95% when wavelength is for 1060nm.
Further, the image display device of the present invention also can be following constructions：Described transparency conducting layer is by comprising silver-colored nm
The material of line or Cu Nanowire is constituted.
The effect of invention
The present invention can provide duplexer, the manufacture method of duplexer, capacitance type contact panel and image display dress
Put, its be by band Printing Department make black with white 2 layers construction, and make illuminated infrared laser side be white
Portion, thus makes infrared ray be absorbed in above-mentioned white portion, reduces the ultrared amount of reach reaching black part such that it is able to lower
The damage of the above-mentioned black part banding printing layer, and by laser machining the transparent electrode layer of contact panel, wiring layer
During patterning, the printing layer generation of banding that will not be formed by black ink in the outer edge of transparent panel substrate back is lacked
Fall into.
Brief description
[Fig. 1] Figure 1A, Figure 1B is the construction of the capacitance type contact panel representing one embodiment of the present invention
Figure, Figure 1A is the plane graph of capacitance type contact panel, and Figure 1B is the sectional view on the AA ' line in Figure 1A.
[Fig. 2] Fig. 2 is the flow chart of of the fabrication schedule representing above-mentioned capacitance type contact panel.
[Fig. 3] Fig. 3 A, Fig. 3 B, Fig. 3 C, Fig. 3 D, Fig. 3 E are to schematically show the 1st step of above-mentioned fabrication schedule to the 4th
The sectional view of the forming process of the top board in step, Fig. 3 A is the state before representing the 1st step, Fig. 3 B be represent the 1st step after
State, Fig. 3 C is the state after representing second step, and Fig. 3 D is the state after representing third step, and Fig. 3 E is to represent the 4th step
State afterwards.
[Fig. 4] Fig. 4 A, Fig. 4 B, Fig. 4 C are the tops in the 5th step to the 8th step schematically show above-mentioned fabrication schedule
The sectional view of the forming process of plate, Fig. 4 A is to represent that the 5th flow chart 4B is to represent that the 7th flow chart 4C is to represent the 8th step.
[Fig. 5] Fig. 5 A, Fig. 5 B, Fig. 5 C are the formation of the top board in the 9th step schematically show above-mentioned fabrication schedule
The sectional view of process, Fig. 5 A is the state before representing the 5th step, and Fig. 5 B is to represent the state being formed with transparent electrode layer, Fig. 5 C
It is the state representing after transparency electrode pattern layers.
[Fig. 6] Fig. 6 is the figure of the visibility evaluation result banding printing layer representing top board.
[Fig. 7] Fig. 7 A, Fig. 7 B are the patches of top board in the 10th step schematically show above-mentioned fabrication schedule and base plate
The sectional view of conjunction process, Fig. 7 A is the state before representing laminating, and Fig. 7 B is the state after representing laminating.
[Fig. 8] Fig. 8 is the figure representing the image display device with contact panel possessing capacitance type contact panel.
Specific embodiment
Referring to the drawings embodiments of the present invention are described in detail.Further, the present invention be not limited solely to following
Embodiment, without departing from the spirit and scope of the invention it is of course possible to carry out various changes.Further, each portion in accompanying drawing
Point size be schematic, particularly sectional view, in order to explicitly indicate that construction and highlight the size of thickness direction.
The present invention is applied to the capacitance type contact panel 100 of the construction as shown in Figure 1A, Figure 1B.
Figure 1A, Figure 1B are the configuration examples representing the capacitance type contact panel 100 consisting of the construction of the present invention
Figure, Figure 1A is the front view representing capacitance type contact panel 100, and Figure 1B is the section on the AA ' line representing in Figure 1A
Figure.
This capacitance type contact panel 100 is made up of the duplexer of top board 11 and base plate 12.
In this capacitance type contact panel 100, top board 11 is by transparent panel substrate 1, across this transparent panel of covering
The tackifier coating 2 at substrate 1 back side is formed at the black of the outer edge at the back side of above-mentioned transparent panel substrate 1 and 2 layers of structure of white
That makes bands printing layer 3, is formed as covering the rear side throughout above-mentioned transparent panel substrate 1 and the rear side banding printing layer 3
Planarization resin bed 4 and be formed at across external coating 5 above-mentioned planarization resin bed 4 the back side have wiring layer 6A's
Transparent electrode layer 6 is constituted.
Further, this top board 11 directly can also be formed in the outer edge at above-mentioned transparent panel substrate 1 back side above-mentioned bands print
Brush layer 3 or the construction omitting above-mentioned tackifier coating 2.
In addition, base plate 12 by transparent panel substrate 7 and is formed at this transparent panel substrate 7 and comprehensively has wiring layer 8A
Transparent electrode layer 8 constitute.
The transparent electrode layer 6 with wiring layer 6A being formed at above-mentioned top board 11 is joined with being formed at above-mentioned having of base plate 12
The transparent electrode layer 8 of line layer 8A fits in the back side of above-mentioned top board 11 by base plate 12, is arranged to opposite to one another, thus plays and passes
The function of sensor cell.Pass through flexible printed board (FPC) 9 from transparent electrode layer 6,8 via the distribution that wiring layer 6A, 8A draw
Obtain with external circuit and be connected.
This capacitance type contact panel 100 carries out the 1st to the 10th by the program shown in the flow chart according to such as Fig. 2
The process of step (S1～S10) and manufacture.
That is, first, in the 1st step S1, at the back side with flexual transparent panel substrate 1, formation is covered
Cover and state the comprehensive tackifier coating in transparent panel substrate 1 back side 2 (reference picture 3A, Fig. 3 B).
Secondly, in second step S2, at the back side of transparent panel substrate 1, across above-mentioned tackifier coating 2 described transparent
The outer edge formation black at display panel substrate 1 back side bands printing layer 3 (reference picture 3C) with 2 layers of construction of white.
Above-mentioned printing layer 3 of banding is to be laminated with black to band printing layer 3B and white 2 layers of construction banding printing layer 3W.Should
It is to be contacted with the 1st layer of above-mentioned transparent panel substrate 1 back side and formed by black ink that black bands printing layer 3B, and this white adds
Decorations printing layer 3W is to be contacted with the 2nd layer of above-mentioned planarization resin bed 4 and formed by white ink.
Further, above-mentioned 1st step S1 can also be omitted, and in above-mentioned second step S2, by banding of above-mentioned 2 layers construction
Printing layer 3 is formed directly into the outer edge at above-mentioned transparent panel substrate 1 back side.
Secondly, in third step S3, be formed with above-mentioned 2 layers of construction to band having of printing layer 3 flexual transparent
Above-mentioned in display panel substrate 1 back side is banded inside the segment difference of printing layer 3 and this bands the back side of printing layer 3, and coated UV line is hard
Change resin and form planarization resin bed 4 (reference picture 3D).
Secondly, in the 4th step S4, form external coating 5 (reference picture at the back side of above-mentioned planarization resin bed 4 comprehensively
3E).
Do so, forms by transparent panel substrate 1, bands the top board material that printing layer 3, planarization resin bed 4 etc. are constituted
10A.
Here, band the outer edge that printing layer 3 is formed in the liquid crystal panel constituting smart mobile phone, tablet terminal etc.,
The layer being formed based on following purposes：The region making electrode or distribution etc. necessary to contact panel function will be formed with
As marginal area cannot cover in the way of outside is depending on recognizing.Band printing layer 3 e.g. by silk screen printing by example
Colored ink as employed two-component-type urethanes repeats coating multiple and is formed.In order to be formed at marginal zone
The mode that the electrode in domain, distribution etc. will not pass through is coated with fixed thickness, because thick painting being the once coated with easily becomes not
Uniformly, so needing the coating layer of thinning every 1 time and being divided into repeatedly forming multi-sheet printed layer.For example, it is difficult to transmission in light
In the case of heavy colour ink, it is coated with to form printing layer by 2 times, in the situation of light color (white etc.) ink of the easy transmission of light
Under, need to carry out 4 times about repeat be coated with.In the case that the coating thickness of every 1 time is 8 μm about, the layer of light color ink
There is 32 μm about of thickness.
In the 5th step S5 secondarily, as shown in Figure 4 A, by the back side of above-mentioned planarization resin bed 4 and flat substrate
In the state of 30 tabular surface laminating, pressurized treatments are implemented to above-mentioned planarization resin bed 4.
Specifically, in the 5th step S5, using a kind of laminating apparatus, this laminating apparatus is possessing attraction work(first
Such as glass plate is adsorbed on the top board 20 of energy as flat substrate 30, clamp above-mentioned top board material with above-mentioned flat substrate 30 with roller 21
10A, and so that above-mentioned roller 21 is rolled to the direction of arrow, thus above-mentioned flat substrate 30 is fitted with top board material 10A, using this laminating
Device implements pressurized treatments to above-mentioned planarization resin bed 4 by above-mentioned roller 21 from above-mentioned transparent panel substrate 1 side.
As described above, above-mentioned roller 21 is passed through to above-mentioned planarization resin bed 4 from above-mentioned transparent panel substrate 1 side to implement pressurization
Process, and flat substrate 30 of fitting on above-mentioned planarization resin bed 4, thus transfer at the back side of above-mentioned planarization resin bed 4
The tabular surface of above-mentioned flat substrate 30, the back side of above-mentioned planarization resin bed 4 is that have for example to make as above-mentioned flat substrate 30
The tabular surface of the surface accuracy of such as glass plate, i.e. flatness, surface roughness etc..
In addition, pressurized treatments are implemented by above-mentioned roller 21 to above-mentioned planarization resin bed 4 from above-mentioned transparent panel substrate 1 side
And in the back side of above-mentioned planarization resin bed 4 laminating flat substrate 30, by the rolling speed of above-mentioned roller 21 is set to be determined
Constant speed, can reduce and remain in by the bubble banding segment difference part produced by printing layer 3 of above-mentioned top board 11.
Planarization resin bed in the 6th step S6 secondarily, to the above-mentioned top board material 10A having been carried out above-mentioned pressurized treatments
4 implement steam pressure further is processed.
Specifically, in the 6th step S6, stop the attraction to flat substrate 30 for the above-mentioned top board 20, make above-mentioned top board
Material 10A departs from from above-mentioned top board 20 together with above-mentioned flat substrate 30, and puts it into autoclaving (Autoclave) pressure
Power pot is implemented steam pressure and is processed.
Remain in the segment difference part produced by printing layer 3 of banding of the above-mentioned top board material 10A having been carried out above-mentioned pressurized treatments
Bubble can by implement steam pressure process and reduce further and remain in above-mentioned banding inside printing layer 3 such that it is able to eliminate
Image display area in bubble.
Secondly, in the 7th step S7 secondarily, make to have been carried out the planarization of the above-mentioned top board material 10A that above-mentioned steam pressure is processed
Resin bed 4 hardens.
Specifically, in the 7th step S7, as shown in Figure 4 B, from above-mentioned flat substrate 30 side to have been carried out above-mentioned plus
The planarization resin bed 4 of the above-mentioned top board material 10A that pressure is processed and steam pressure is processed passes through ultraviolet light source 22 irradiation ultraviolet radiation, thus
Above-mentioned planarization resin bed 4 is made to harden.
Here, by using the high transparency glass plate of ultraviolet transmittance as above-mentioned flat substrate 30, can be effective
Ground makes above-mentioned planarization resin bed 4 harden from above-mentioned flat substrate 30 side irradiation ultraviolet radiation.
Further, as the succedaneum of above-mentioned glass plate, above-mentioned flat substrate 30 can use and for example be implemented with release process
And can pass through Merlon substrate or acrylic resin substrate of ultraviolet etc..
In the 8th step S8 secondarily, as shown in Figure 4 C, peel off from the above-mentioned planarization resin bed 4 of hardening above-mentioned
Flat substrate 30.
Further, in order that above-mentioned flat substrate 30 is easily peeled off from the planarization resin bed 4 of hardening, the material of substrate is excellent
Selection of land is made up of the glass plate that such as thickness is 0.5mm～2mm, furtherly, it is preferred to use be implemented with hydrophobic in surface coating
Agent, the material of the release process of remover.
Then, in the 9th step S9 secondarily, as shown in Fig. 5 A, Fig. 5 B, Fig. 5 C, by flat in above-mentioned top board material 10B
The back side of smoothization resin bed 4 forms the transparent electrode layer 6 with wiring layer 6A, to complete top board 11.
Specifically, in the 9th step S9, formed at the back side of the planarization resin bed 4 of above-mentioned top board material 10B and have
The transparent electrode layer 6 (reference picture 5A, Fig. 5 B) of wiring layer 6A, and then as shown in Figure 5 C, be used as by infrared laser will be used
The transparent electrode layer 6 with wiring layer 6A is patterned, thus completing top board 11 by the Laser Processing of LASER Light Source.
Do so, by the process of above-mentioned 1st～the 9th step (S1～S9), can make the structure as shown in Fig. 3 A, Fig. 3 B
The top board 10B making.
Here, the printing layer 3 of banding of above-mentioned top board material 10B is that black bands printing layer 3B and white bands printing layer 3W
2 layers construction, it is to be contacted with the 1st layer of above-mentioned transparent panel substrate 1 back side and by black ink that this black bands printing layer 3B
Formed, it is to be contacted with the 2nd layer of above-mentioned planarization resin bed 4 and formed by white ink that this white bands printing layer 3W.Therefore
When the transparent electrode layer 6 with wiring layer 6A that will be formed in above-mentioned planarization resin bed 4 back side is laser machined, make by
The infrared ray that infrared laser irradiates bands printing layer 3W in above-mentioned white and is absorbed, thus reduce banding printing layer 3B to black
Infrared ray amount of reach, band the damage of printing layer 3B thus, it is possible to lower the above-mentioned black banding printing.
Here, for the top board material 10B of this construction, it is fabricated to and black is banded printing layer 3B and white bands printing
The sample that the thickness of layer 3W, the thickness of planarization resin bed 4 are changed, after have rated the visibility banding printing layer 3, obtains
Result as shown in Figure 6.
For the ultraviolet hardening resin forming planarization resin bed 4, limited using three long-drawn-out (sanyu-rec) resin shares
Company system " RL-9262 resin ", and by as laser machine Pian Gang manufacturing company system " fibre laser (1060 ±
10nm) ", the transparent electrode layer 6 with wiring layer 6A is patterned, carried out the evaluation of the visibility banding printing layer 3.For
Black bands printing layer 3B, using Seiko ink (seikoadvance) limited company system " HAC concentrate 710 black ", for
White bands printing layer 3W, using Seiko ink limited company system " it is white that HAC concentrates 120 ".
The evaluation of visibility is carried out as follows：Using the transmission of optical microscope with fall to penetrating, observe the surface of duplexer respectively
And the back side, if defect can be detected in banding printing layer 3.
The thickness that black is banded printing layer 3B is 6 μm, no white bands printing layer 3W, the thickness of planarization resin bed 4
For 10 μm of samples as comparative example 1.
The thickness that black is banded printing layer 3B is 6 μm, no white bands printing layer 3W, the thickness of planarization resin bed 4
For 30 μm of samples as comparative example 2.
The thickness that black is banded printing layer 3B is 12 μm, no white bands printing layer 3W, the thickness of planarization resin bed 4
For 10 μm of samples as comparative example 3.
The thickness that black is banded printing layer 3B is 6 μm, the white thickness banding printing layer 3W is 6 μm, planarization resin
The thickness of layer 4 is 10 μm of sample as embodiment 1.
The thickness that black is banded printing layer 3B is 6 μm, the white thickness banding printing layer 3W is 12 μm, planarization resin
The thickness of layer 4 is 10 μm of sample as embodiment 2.
In comparative example 1～3, any one is banded printing layer 3B all due to Laser Processing in black and produces defect, from
And have visibility problem.
In this regard, in embodiment 1,2, the white banding the printing layer 3B back side by being formed at black bands printing layer 3W,
Irradiate in Laser Processing ultrared 3.7～3.8% reflected, 96.1% is absorbed, this infrared ray is attenuated to 0.1～
Reach black after 0.2% and band printing layer 3B, any one does not all have to lack banding printing layer 3 and producing because of Laser Processing
Fall into, be obtained for good visibility.
Then, it is right before the back side of top board 11 and base plate 12 in the 10th step S10 secondarily, as shown in Figure 7 A, to make
To, and as shown in Figure 7 B, by above-mentioned top board 11 is fitted with base plate 12, thus completing with transparent electrode layer 6 and transparent electrical
Pole layer 8 and the capacitance type contact panel 100 of its performance sensor unit function.This transparent electrode layer 6 is formed at above-mentioned top
On plate 11 and have wiring layer 6A, this transparent electrode layer 8 is formed on above-mentioned base plate 12 and has wiring layer 8A.
Further, be formed on above-mentioned base plate 12 have the transparent electrode layer 8 of wiring layer 8A using be formed at above-mentioned top
The same method of transparent electrode layer 6 with wiring layer 6A on plate 11, the Laser Processing by using infrared laser will have
The transparent electrode layer 8 having wiring layer 8A patterns, thus forming fine interconnection pattern.
Here, transparent electrode layer 6,8 is preferably used the material comprising Ag or Cu Nanowire, ITO or ZnO etc..Transparent
Electrode layer 6,8 is made up of many distributions, and with clip insulant and intersect, the mode as equivalent for the electrostatic capacitance is formed.
In addition, as being formed as covering comprehensively throughout the back side of transparent panel substrate 1 and the back side banding printing layer 3
The material of planarization resin bed 4, can use transparent acrylic resin coating or the ammonia for ultraviolet ray hardening type ink
Base Ethyl formate system cold coating etc..More specifically, can use with urethanes (methyl) acrylate, epoxy
(methyl) acrylate, polyester (methyl) acrylate, polyester urethanes (methyl) acrylate, polyethers (methyl) third
Olefin(e) acid ester, Merlon (methyl) acrylate, polycarbonate urethane (methyl) acrylate etc. are as material
Coating.For planarizing the material of resin bed 4 under the optical characteristics not affecting contact panel, more preferably as diffuse transmission light phase
Mist degree for the ratio of whole light transmitted lights is less than 1% material.As described above, being banded using light color ink
In the case of printing, because the thickness banding layer 3 is 32 μm about, as long as to become the side of such as 35 μm of left and right thicknesses
Formula, to form planarization resin throughout the back side of transparent panel substrate 1 with the backsize Acrylic coatings banding printing layer 3
Layer 4.When coating forms the Acrylic coatings of planarization resin bed 4, in addition to silk screen printing, it is possible to use die coating
Cloth machine (Die coater) is directly coated with.Form planarization resin bed 4 like this, because known coating technique can be used,
So there is no need to introduce special installation, can use identical with the equipment used in the print steps banding printing layer 3
Equipment, manufacturing cost can be reduced.Planarization resin bed 4 the back side formed transparent electrode layer 6A in the case of it is also possible to
Prevent the distribution fracture that this segment difference is led to.
The planarization resin bed 4 of the top board 11 in this capacitance type contact panel 100 is to make ultraviolet hard with absorption
Change the resin bed of the ultrared function after hardening of resin, before in a manufacturing process, making the hardening of above-mentioned resin bed, with
The flat substrate that glass plate etc. has tabular surface covers enforcement compression process in the state of the back side planarizing resin bed 4, thus
The back side of above-mentioned planarization resin bed 4 is made to become the tabular surface of the tabular surface transferred with above-mentioned flat substrate.Therefore, add above-mentioned
Image display area in decorations printing layer 3, the surface roughness at above-mentioned planarization resin bed 4 back side above-mentioned will not be put down by depending on recognizing
The surface roughness at smoothization resin bed 4 back side will not make the quality of this capacitance type contact panel 100 reduce.This electrostatic capacitance
Type contact panel 100 becomes the capacitance type contact panel of high-quality, and it is used for eliminating the outer rim being formed at top board 11 back side
The surface roughness at planarization resin bed 4 back side banding the segment difference that printing layer 3 is led in portion will not be by depending on recognizing.
In addition, with regard to the top board 11 in this capacitance type contact panel 100, because band the back of the body of printing layer 3B in black
Face is formed with white and bands printing layer 3W, even if so from banding the rear side of printing layer 3 by using infrared laser conduct
Wiring layer 6A and transparent electrode layer 6 are patterned by the Laser Processing of LASER Light Source, and the infrared ray irradiating during Laser Processing also can be by
Reach black after being attenuated to 0.1～0.2% and band printing layer 3B, thus not being produced banding printing layer 3 due to Laser Processing
Raw defect, is obtained in that good visibility.
Above-mentioned capacitance type contact panel 100 is as shown in figure 8, image displaying part by being arranged on liquid crystal panel etc.
Before 200, thus constituting the image display device 300 with contact panel.
The explanation of symbol
11 top boards
1,7 transparent panel substrate
2 tackifier coatings
3 band printing layer
3B black bands printing layer
3W white bands printing layer
4 planarization resin beds
5 external coatings
6,8 transparent electrode layers
6A, 8A wiring layer
12 base plates
100 capacitance type contact panels
Claims (16)
1. a kind of duplexer, wherein, possesses：
Transparent panel substrate；
The outer edge banded printing layer, be formed at the back side of described transparent panel substrate of 2 layers of construction, with described transparent panel base
The parallel stacking of plate；
Planarization resin bed, have in the formation of described transparent panel substrate described in band printing layer face on, be formed as cover time
And the described region banding printing layer and described transparent panel substrate；And
Transparent electrode layer, is formed at the back side of described planarization resin bed, has wiring layer,
In banding in printing layer of described 2 layers construction, the 2nd layer that is contacted with described planarization resin bed is white.
2. duplexer according to claim 1, wherein, described printing layer of banding directly is layered in described transparent panel substrate
The back side.
3. duplexer according to claim 1, wherein, described printing layer of banding is across the described transparent panel substrate of covering
The tackifier coating stacking at the back side.
4. the duplexer according to Claims 2 or 3, wherein, bands in printing layer described, described 2nd layer of infrared ray
Absorbtivity is 92%～95% when wavelength is for 1060nm.
5. duplexer according to claim 4, wherein, described transparency conducting layer is by comprising silver-colored Nanowire or Cu Nanowire
Material is constituted.
6. a kind of manufacture method of duplexer, wherein,
Constitute duplexer, described duplexer possesses：Transparent panel substrate；2 layers construction band printing layer, be formed at described transparent
The outer edge at the back side of display panel substrate, with the stacking of described transparent panel substrate-parallel；Planarization resin bed, in described transparent panel
The formation of substrate is banded on the face of printing layer described in having, and is formed as covering and bands printing layer and described transparent panel base throughout described
The region of plate；And transparent electrode layer, it is formed at the back side of described planarization resin bed, there is wiring layer；And at described 2 layers
Construct bands in printing layer, and the 2nd layer that is contacted with described planarization resin bed is white,
The back of the body of printing layer will be banded by using infrared laser as the Laser Processing of LASER Light Source described in described duplexer
Described wiring layer on face and described transparency electrode pattern layers.
7. a kind of capacitance type contact panel, wherein, possesses：
Transparent panel substrate；
2 layers construction band printing layer, be formed as and described transparent panel in the outer edge at the back side of described transparent panel substrate
Substrate-parallel；
Planarization resin bed, have in the formation of described transparent panel substrate described in band printing layer face on, be formed as cover time
And the described region banding printing layer and described transparent panel substrate；And
Transparent electrode layer, is formed at the back side of described planarization resin bed, has wiring layer,
In banding in printing layer of described 2 layers construction, the 2nd layer that is contacted with described planarization resin bed is white,
Described wiring layer on the described back side banding printing layer and described transparent electrode layer swashing by using infrared laser
Light is processed and is patterned.
8. capacitance type contact panel according to claim 7, wherein, described band printing layer be directly layered in described
The back side of transparent panel substrate.
9. capacitance type contact panel according to claim 7, wherein, described band printing layer across cover described
The tackifier coating stacking at the back side of bright display panel substrate.
10. capacitance type contact panel according to claim 8 or claim 9, wherein, bands in printing layer described, described
2nd layer of infrared ray absorbing amount is 92%～95% when wavelength is for 1060nm.
11. capacitance type contact panels according to claim 10, wherein, described transparency conducting layer is by comprising silver-colored nm
The material of line or Cu Nanowire is constituted.
A kind of 12. image display devices, it possesses capacitance type contact panel in display picture comprehensively, wherein,
Described capacitance type contact panel possesses：
Transparent panel substrate；
2 layers construction band printing layer, be formed as and described transparent panel in the outer edge at the back side of described transparent panel substrate
Substrate-parallel；
Planarization resin bed, have in the formation of described transparent panel substrate described in band printing layer face on, be formed as cover time
And the described region banding printing layer and described transparent panel substrate；And
Transparent electrode layer, is formed at the back side of described planarization resin bed, has wiring layer,
In banding in printing layer of described 2 layers construction, the 2nd layer that is contacted with described planarization resin bed is white,
Described wiring layer on the described back side banding printing layer and described transparent electrode layer swashing by using infrared laser
Light is processed and is patterned.
13. image display devices according to claim 12, wherein, described band printing layer be directly layered in described transparent
The back side of display panel substrate.
14. image display devices according to claim 12, wherein, described printing layer of banding is across the described transparent area of covering
The tackifier coating stacking at the back side of plate substrate.
15. image display devices according to claim 13 or 14, wherein, band in printing layer described, described 2nd layer
Infrared ray absorbing amount be 92%～95% when wavelength is for 1060nm.
16. image display devices according to claim 15, wherein, described transparency conducting layer is by comprising silver-colored Nanowire or Cu
The material of Nanowire is constituted.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014060098A JP2015184881A (en) | 2014-03-24 | 2014-03-24 | Laminate, manufacturing method of laminate, electrostatic capacitance type touch panel, and image display device |
| JP2014-060098 | 2014-03-24 | ||
| PCT/JP2015/053200 WO2015146302A1 (en) | 2014-03-24 | 2015-02-05 | Laminate, method for producing laminate, capacitive touch panel and image display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106471448A true CN106471448A (en) | 2017-03-01 |
Family
ID=54194841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580016098.2A Pending CN106471448A (en) | 2014-03-24 | 2015-02-05 | Duplexer, the manufacture method of duplexer, capacitance type contact panel and image display device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2015184881A (en) |
| CN (1) | CN106471448A (en) |
| TW (1) | TW201537429A (en) |
| WO (1) | WO2015146302A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109976591A (en) * | 2017-12-28 | 2019-07-05 | 盈天实业(深圳)有限公司 | Touch sensing and its preparation method and application |
| WO2020019441A1 (en) * | 2018-07-26 | 2020-01-30 | 武汉华星光电技术有限公司 | Backlight module and display device |
| CN111354263A (en) * | 2018-12-21 | 2020-06-30 | 细美事有限公司 | Display device and method for manufacturing display device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012174578A (en) * | 2011-02-23 | 2012-09-10 | Gunze Ltd | Transparent electrode film and transparent touch panel |
| JP6016050B2 (en) * | 2012-01-25 | 2016-10-26 | 大日本印刷株式会社 | Front protective plate for display device and display device |
| JP5803825B2 (en) * | 2012-06-28 | 2015-11-04 | 日立化成株式会社 | Capacitive coupling type touch panel and manufacturing method thereof |
-
2014
- 2014-03-24 JP JP2014060098A patent/JP2015184881A/en active Pending
-
2015
- 2015-02-05 WO PCT/JP2015/053200 patent/WO2015146302A1/en active Application Filing
- 2015-02-05 CN CN201580016098.2A patent/CN106471448A/en active Pending
- 2015-02-10 TW TW104104314A patent/TW201537429A/en unknown
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109976591A (en) * | 2017-12-28 | 2019-07-05 | 盈天实业(深圳)有限公司 | Touch sensing and its preparation method and application |
| CN109976591B (en) * | 2017-12-28 | 2022-11-18 | 盈天实业(深圳)有限公司 | Touch sensor and preparation method and application thereof |
| WO2020019441A1 (en) * | 2018-07-26 | 2020-01-30 | 武汉华星光电技术有限公司 | Backlight module and display device |
| CN111354263A (en) * | 2018-12-21 | 2020-06-30 | 细美事有限公司 | Display device and method for manufacturing display device |
| CN111354263B (en) * | 2018-12-21 | 2023-12-12 | 细美事有限公司 | Display device and method for manufacturing display device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015146302A1 (en) | 2015-10-01 |
| JP2015184881A (en) | 2015-10-22 |
| TW201537429A (en) | 2015-10-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101957192B1 (en) | UV film sensor, manufacturing method thereof, and touch screen | |
| WO2015146303A1 (en) | Laminate, method for producing laminate, capacitive touch panel and image display device | |
| CN102077155A (en) | Window panel integrated capacitive-type touch sensor and a fabrication method therefor | |
| WO2013094561A1 (en) | Touch sensor with ornament, method of manufacturing same, and touch sensor used in same | |
| TW201339937A (en) | Capacitive touch screen and manufacturing method thereof | |
| CN104850267B (en) | A kind of touch-screen, its preparation method and display device | |
| WO2015025710A1 (en) | Capacitive touch panel and method for manufacturing same | |
| CN105630233B (en) | Touch control display apparatus and preparation method thereof | |
| WO2015033569A1 (en) | Capacitive touch panel | |
| CN106471448A (en) | Duplexer, the manufacture method of duplexer, capacitance type contact panel and image display device | |
| CN204808272U (en) | Touch panel with fingerprint identification function | |
| JP5795357B2 (en) | Capacitive touch panel | |
| CN103116426A (en) | Composite material type touch screen and production technology thereof | |
| CN106553789B (en) | intelligent screen film and preparation method thereof | |
| CN104834400B (en) | Electrostatic transducer with protective film | |
| CN104881173A (en) | Touch panel structure and production technology thereof | |
| WO2015146304A1 (en) | Laminate, method for producing laminate, capacitive touch panel and image display device | |
| CN104866152A (en) | Preparation process of capacitive touch screen, and capacitive touch screen | |
| JP2021194908A (en) | Transparent conductive laminated structure and touch panel | |
| CN103472964A (en) | Flexible capacitive screen and production process thereof | |
| CN113508315A (en) | Laminate and image display device | |
| US20150059161A1 (en) | Touch panel producing method | |
| CN220171289U (en) | Ultrathin light-transmitting sheet and display screen | |
| TW201445387A (en) | Printing method for shielding layer of touch panel | |
| CN210091148U (en) | Capacitive touch display screen for face brushing payment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170301 |
|
| WD01 | Invention patent application deemed withdrawn after publication |