CN105956561B - Push type Fingerprint Identification Unit and its manufacturing method - Google Patents
Push type Fingerprint Identification Unit and its manufacturing method Download PDFInfo
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- CN105956561B CN105956561B CN201610296751.1A CN201610296751A CN105956561B CN 105956561 B CN105956561 B CN 105956561B CN 201610296751 A CN201610296751 A CN 201610296751A CN 105956561 B CN105956561 B CN 105956561B
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- identification unit
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- fingerprint identification
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Abstract
Present invention discloses a kind of push type Fingerprint Identification Units, including substrate and the COF being electrically connected with the substrate；The substrate includes preset fingerprint induction region, the edge of the fingerprint induction region is jagged, fingerprint induction region upper surface is bonded with backing plate, the backing plate is equipped with through-hole, the COF is equipped with fingerprint sensor and inductive layer, the lower surface bonds of the inductive layer have conductive shield, the end of the upper surface of the COF is adhered to the lower surface of the substrate, one end of the COF is folded upward at along the position flushed with the notch so that the fingerprint sensor is completely fitted with the lead to the hole site, the conductive shield is bent downward so that the inductive layer is Chong Die with the fingerprint induction region.Product of the present invention image stabilization, yields improve.
Description
Technical field
The invention belongs to the technical field of figure for identification more particularly to a kind of push type Fingerprint Identification Unit and its manufactures
Method.
Background technique
With the rapid development of electronic technology and the universal use of laptop, the high speed of current network technology is sent out in addition
Exhibition, device fabrication it is more compact more convenient, the personal sensitive information and confidential data saved be faced with loss with
Stolen risk, the safety now only realized with a kind of password authentification form are compared, and the use of fingerprint identification technology makes its safety
Rank is higher.
Currently, during push type Fingerprint Identification Unit is manufactured, because only being leaned between each element in encapsulation process
One layer of two-sided conductive adhesive, while two-sided conducting resinl itself is because former material is processed and subsequent cross cutting processing and fabricating will cause glue
The phenomenon of coating unevenness, to make Fingerprint Identification Unit in entire encapsulation process, because two-sided conductive glue degree unevenly generates
The element layering of fingerprint reading area is bad, and product is caused to be imaged unstable when reading fingerprint, and yields is low, cost waste compared with
It is high.
Summary of the invention
The purpose of the present invention is to solve above-mentioned technical problems, and provide a kind of push type Fingerprint Identification Unit and its manufacture
Method, to realize product image stabilization, yields is improved, save the cost.In order to achieve the above object, technical solution of the present invention
It is as follows:
A kind of push type Fingerprint Identification Unit, including substrate and the COF being electrically connected with the substrate；The substrate includes
The edge of preset fingerprint induction region, the fingerprint induction region is jagged, and fingerprint induction region upper surface is viscous
It is connected to backing plate, the backing plate is equipped with through-hole, and the COF is equipped with fingerprint sensor and inductive layer, the following table of the inductive layer
Face is bonded with conductive shield, and one end of the upper surface of the COF is adhered to the lower surface of the substrate, the other end of the COF
It is folded upward at along the position flushed with the notch so that the fingerprint sensor is completely fitted with the lead to the hole site, it is described
Conductive shield is bent downward so that the inductive layer is Chong Die with the fingerprint induction region.
Specifically, the substrate includes printing board PCB or flexible circuit board FPC.
Specifically, further including set on the base plate bottom for transmitting the light guide plate of display optical signal.
Specifically, the upper and lower surfaces of the backing plate are bonded with double-sided adhesive respectively.
Specifically, the end of the upper surface of the COF is equipped with golden finger area and its lower surface for being adhered to the substrate
Pin field.
Specifically, the upper surface of the conductive shield is adhered to the lower surface of the inductive layer, under the conductive shield
Surface is adhered to the backing plate.
Specifically, push type Fingerprint Identification Unit manufacturing method, comprising the following steps:
The lower surface of the inductive layer of the COF after punching is aligned false patch using false sticker with glue by S1, after vacation patch
The COF is transferred to hot press and the conductive shield carries out hot pressing and obtains the packaged COF；
The lower surface of upper surface one end of the packaged COF and the substrate is carried out pressing stickup by S2；
S3 will be bonded the backing plate, by the other end of the COF along the position flushed with the notch on the substrate
It is folded upward at, the conductive shield is bent downward so that the inductive layer is Chong Die with the fingerprint induction region；
Product after bending is put into jig by S4, is toasted together with jig, and oven temperature sets 120 DEG C -130 DEG C, baking
Time sets 30min；
S5 cleans the product after baking；
S6 carries out spray painting processing in fingerprint pressing area.
Specifically, the preheating temperature of the false sticker is set as 118 DEG C -122 DEG C, preheating time 5Sec, board in S1
Pressure 0.5Mpa；The temperature of the hot press is set as 178 DEG C -182 DEG C, hot pressing time 3Min, board pressure 2-3Mpa.
Specifically, peeling force is more than or equal to 1.2kgf between the COF and the substrate after pressing in S2.
Specifically, being divided into four completions in S6, in spray process, it is 9 μm -11 μm that primer spray, which requires film thickness value, is baked
Case baking time is 50Min, and baking temperature is 83-87 DEG C；Painting first layer in spray and requiring film thickness value is 14 μm -16 μm, and oven dries
The roasting time is 50Min, and baking temperature is 83-87 DEG C；Painting the second layer in spray and requiring film thickness value is 14 μm -16 μm, when oven cooking cycle
Between be 50Min, baking temperature be 83-87 DEG C；It is 16 μm -20 μm, preheating time 3Min that topcoating, which requires film thickness value, baking temperature
78-82 DEG C, UV energy: 900-1100mj/cm, chain speed: 3m/Min.
Compared with prior art, push type Fingerprint Identification Unit of the present invention and its beneficial effect major embodiment of manufacturing method
: the part-structure of push type Fingerprint Identification Unit effectively protects the route design in COF, fingerprint sense by bending encapsulation
Answer region notch can to bending part there are spaces, not will cause route folding it is dead caused by open circuit or damaged；In push type fingerprint
In the manufacturing method of identifier, secondary change is carried out by using stringent procedure of processing, and to material state characteristic, through overheating
It is bad that the technique press, toasted solves the problems, such as that each element of fingerprint reading area is layered, and improves yields, and reduction is produced into
This；It is durable that the technique of spray painting is bonded product more.
Detailed description of the invention
Fig. 1 is the explosive view of the embodiment of the present invention 1；
Fig. 2 is the structural schematic diagram of 1 backing plate of the present embodiment；
Fig. 3 is the main view of the present embodiment 1；
Fig. 4 is the side view of the present embodiment 1；
Fig. 5 is the rearview of the present embodiment 1；
Fig. 6 be Fig. 3 along the sectional view of A-A；
Fig. 7 is the structural schematic diagram of the present embodiment 1；
Fig. 8 is lower surface and the conductive shield bonding schematic diagram of the present embodiment 1COF；
Digital representation in figure:
1 substrate, 11 fingerprint induction regions, 12 light guide plates, 13 signal lamps, 2 backing plates, 21 through-holes, 22 first double-sided adhesives, 23
Two double-sided adhesives, 24 location holes, 3COF, 31 fingerprint sensors, 32 inductive layers, 33ACF glue, 4 conductive shields, 41 hot melt adhesive, 42 are led
Electric glue, 43 positioning columns, 5 protective films.
Specific embodiment
With reference to the accompanying drawing by the technical scheme in the embodiment of the invention is clearly and completely described, it is clear that retouched
The embodiment stated is only a part of the embodiment of the present invention, instead of all the embodiments.
Embodiment 1:
Shown in referring to Fig.1, printing electricity is can be selected in a kind of push type Fingerprint Identification Unit of the present embodiment, including substrate 1, substrate 1
Road plate PCB or flexible circuit board FPC, and the COF3 being electrically connected with substrate 1；Substrate 1 includes preset fingerprint induction region 11,
The side outer rim of fingerprint induction region 11 opens up jagged, and the fold of gap position and COF3 are cooperated.
Referring to shown in Fig. 2, backing plate 2 is corresponding with 11 size of fingerprint induction region and same position at open up jagged, pad
The center of plate 2 is also provided with through-hole 21, and two ends of the notch of backing plate 2 offer location hole 24, the lower surface of backing plate 2 respectively
It is bonded with band the first double-sided adhesive 22 jaggy corresponding with its shape, the upper surface of backing plate 2 is bonded with exposing through-hole 21
The second double-sided adhesive 23 with 24 position of location hole is set, backing plate 2 is pasted on fingerprint induction region 11 using pressing machine effect.
Referring to shown in Fig. 3-5, COF3 is equipped with inductive layer 32, and inductive layer 32 is folded on fingerprint induction region 11, fingerprint
11 lower surface of induction region is equipped with light guide plate 12, and fingerprint induction region 11 and turnup fitting fingerprint are extended in the side of light guide plate 12
The side of induction region 11, the bottom of substrate 1 are equipped with the LED signal lamp connecting with light guide plate 12, and light guide plate 12 is transparent material
The optical signal of bottom can be shown to the fingerprint that can be sensed according to Fingerprint Identification Unit in the side of fingerprint induction region 11, signal lamp
Situation makes prompt.
Referring to Fig.1 and shown in Fig. 6 and Fig. 8, COF3 is equipped with fingerprint sensor 31, and fingerprint recognition data pass through fingerprint sensing
Device 31 converts analog circuit signal to computer for image data, and inductive layer 32 is the partial region of COF3, inductive layer 32
Lower surface is bonded with conductive shield 4 by hot melt adhesive 41, and the lower surface bonds of conductive shield 4 have corresponding with 2 shape of backing plate
With conducting resinl 42 jaggy, the lower surface of conductive shield 4 is set there are two positioning column 43；The one end of the upper surface of COF3 is equipped with
The pin field (not shown) of golden finger area and its lower surface that substrate 1 is adhered to by ACF glue 33, COF3 is along leading
The edge of electric 4 edges of baffle, that is, inductive layer 32 is folded upward at along the position flushed with notch, and then conductive shield 4 is turned under
Folding, so that the inductive layer 32 of COF3 is Chong Die with preset fingerprint induction region 11, the through-hole 21 in fingerprint sensor 31 and backing plate 2
Position is completely fitted, and the positioning column 43 and the location hole 24 in backing plate 2 of 4 lower surface of conductive shield are connected to each other positioning.Due to COF3
Structure qualification, in addition the limitation of Fingerprint Identification Unit size structure itself, COF3 needs to bend could be bonded outer dimension twice
Requirement, i.e. S type bending effectively protects the design of the route in COF3, and the notch of fingerprint induction region 11 can be bent to S type
There are spaces in portion, not will cause the dead caused open circuit or damaged of route folding.
Referring to shown in Fig. 7,32 surface of inductive layer of push type Fingerprint Identification Unit attaches protective film 5, the optional PET of protective film 5
Plastics, dust-proof, induction sensitivity is good.
Embodiment 2:
According to 1 push type Fingerprint Identification Unit manufacturing method of embodiment, step 1: the punching of COF3, coil type is encapsulated and is given birth to
The COF3 of production is punched out using soft board bicker and mold according to specification, and the finished product allowance control after punching exists
It within 0.005mm, is inspected by random samples using 100 times of magnifying glasses, it is ensured that the smooth no flash defective products of COF3 surrounding after punching, mold
Production requires mold notch and formed punch fit clearance tolerance to be less than 0.002mm；Step 2: the encapsulation of COF, by the COF3 after punching
Lower surface and solid-state conductive glue be aligned false patch using false sticker, solid-state conductive glue is hot melt adhesive 41, the preheating temperature of false sticker
Be set as 118 DEG C -122 DEG C, preheating time 5Sec, board pressure 0.5Mpa, then by the COF3 after false patch be transferred to hot press with
Conductive shield 4 carries out hot pressing, and the temperature of hot press is set as 178 DEG C -182 DEG C, hot pressing time 3Min, board pressure 2-3Mpa,
Need to carry out ultrasonic cleaning with isopropanol before 4 hot pressing of conductive shield, scavenging period 3Min, prevent its surface because greasy dirt with
It is bad that layering is generated after COF3 hot pressing；Step 3: ACF is assembled, packaged COF3 is utilized to the lower surface of ACF glue and substrate 1
Pressing stickup is carried out, it is strip that the model of ACF glue, which requires TGP20508G, and peeling force is big between the COF3 after pressing and substrate 1
In equal to 1.2kgf；Step 4: COF bending assembles, the assembling of backing plate 2 is carried out again on substrate 1, the front and back sides of backing plate 2 utilize pressure
COF3 is then placed on dedicated bending jig by conjunction machine sticking two-faced adhesive tape, carries out S type bending assembling, COF3 is along neat with notch
Flat position is folded upward at, and conductive shield 4 is bent downward so that inductive layer 32 is Chong Die with fingerprint induction region 11；Step 5: drying
It is roasting, the product after bending is put into jig, is toasted together with jig, oven temperature sets 120 DEG C -130 DEG C, baking time setting
30min；Step 6: cleaning, the product after baking is put into Plasma equipment, is cleaned using oxygen, product surface is made
Complete deoxidation is conducive to the adhesion effect and product dust fall more easy-clear of subsequent paint；Step 7: spraying, presses in fingerprint
Region carries out spray painting processing, i.e., in 32 face of the inductive layer of COF3, four completions is divided into spray process, primer spray requires film
Thickness value is 9 μm -11 μm, oven cooking times 50Min, and baking temperature is 83-87 DEG C；First layer requirement film thickness value is painted in spray is
14 μm -16 μm, oven cooking times 50Min, baking temperature is 83-87 DEG C；In spray paint the second layer require film thickness value be 14 μm-
16 μm, oven cooking times 50Min, baking temperature is 83-87 DEG C；It is 16 μm -20 μm, when preheating that topcoating, which requires film thickness value,
Between 3Min, 78-82 DEG C of baking temperature, UV energy: 900-1100mj/cm, chain speed: 3m/Min, finishing coat be the UV colored varnish, UV equipment
Chain setting chain speed after, the speed for irradiating solid paint is fast, and effect is good.The present invention is and right by using stringent procedure of processing
Material state characteristic carries out secondary change, and the technique by hot pressing, baking solves each element layering of fingerprint reading area not
Good problem improves yields, reduces production cost.
Above-described is only some embodiments of the present invention.For those of ordinary skill in the art, not
Under the premise of being detached from the invention design, various modifications and improvements can be made, these belong to protection model of the invention
It encloses.
Claims (10)
1. a kind of push type Fingerprint Identification Unit, it is characterised in that: including substrate and the COF being electrically connected with the substrate；It is described
Substrate includes preset fingerprint induction region, and the edge of the fingerprint induction region is jagged, the fingerprint induction region
Upper surface is bonded with backing plate, and the backing plate is equipped with through-hole, and the COF is equipped with fingerprint sensor and inductive layer, the induction
The lower surface bonds of layer have conductive shield, and one end of the upper surface of the COF is adhered to the lower surface of the substrate, the COF
The other end be folded upward at along the position flushed with the notch so that the fingerprint sensor and the lead to the hole site are complete
Chimeric, the conductive shield is bent downward so that the inductive layer is Chong Die with the fingerprint induction region.
2. push type Fingerprint Identification Unit according to claim 1, it is characterised in that: the substrate includes printed circuit board
PCB or flexible circuit board FPC.
3. push type Fingerprint Identification Unit according to claim 1, it is characterised in that: further include being set to the base plate bottom
For transmitting the light guide plate of display optical signal.
4. push type Fingerprint Identification Unit according to claim 1, it is characterised in that: the upper and lower surfaces of the backing plate
It is bonded with double-sided adhesive respectively.
5. push type Fingerprint Identification Unit according to claim 1, it is characterised in that: the end of the upper surface of the COF is set
There is golden finger area and the pin field of its lower surface for being adhered to the substrate.
6. push type Fingerprint Identification Unit according to claim 1, it is characterised in that: the upper surface of the conductive shield is bonded
To the lower surface of the inductive layer, the lower surface bonds of the conductive shield to the backing plate.
7. push type Fingerprint Identification Unit manufacturing method according to claim 1, it is characterised in that the following steps are included:
The lower surface of the COF after punching is aligned false patch using false sticker with hot melt adhesive by S1, by the COF after false patch
It is transferred to hot press and the conductive shield carries out hot pressing and obtains the packaged COF；
The lower surface of upper surface one end of the packaged COF and the substrate is carried out pressing stickup by S2；
S3 will be bonded the backing plate on the substrate, the other end of the COF is upward along the position flushed with the notch
Bending, the conductive shield is bent downward so that the inductive layer is Chong Die with the fingerprint induction region；
Product after bending is put into jig by S4, is toasted together with jig, and oven temperature sets 120 DEG C -130 DEG C, baking time
Set 30min；
S5 cleans the product after baking；
S6 carries out spray painting processing in fingerprint pressing area.
8. push type Fingerprint Identification Unit manufacturing method according to claim 7, it is characterised in that: in S1, the false patch
The preheating temperature of machine is set as 118 DEG C -122 DEG C, preheating time 5Sec, board pressure 0.5Mpa；The temperature of the hot press is set
It is set to 178 DEG C -182 DEG C, hot pressing time 3Min, board pressure 2-3Mpa.
9. push type Fingerprint Identification Unit manufacturing method according to claim 7, it is characterised in that: in S2, after pressing
Peeling force is more than or equal to 1.2kgf between the COF and the substrate.
10. push type Fingerprint Identification Unit manufacturing method according to claim 7, it is characterised in that: in S6, spray process
In be divided into four times completion, primer spray require film thickness value be 9 μm -11 μm, oven cooking times 50Min, baking temperature 83-
87℃；Painting first layer in spray and requiring film thickness value is 14 μm -16 μm, oven cooking times 50Min, and baking temperature is 83-87 DEG C；
Painting the second layer in spray and requiring film thickness value is 14 μm -16 μm, oven cooking times 50Min, and baking temperature is 83-87 DEG C；Spray plane
Qi Yaoqiu film thickness value is 16 μm -20 μm, preheating time 3Min, 78-82 DEG C of baking temperature, UV energy: 900-1100mj/cm, chain
Speed: 3m/Min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201610296751.1A CN105956561B (en) | 2016-05-06 | 2016-05-06 | Push type Fingerprint Identification Unit and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610296751.1A CN105956561B (en) | 2016-05-06 | 2016-05-06 | Push type Fingerprint Identification Unit and its manufacturing method |
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| Publication Number | Publication Date |
|---|---|
| CN105956561A CN105956561A (en) | 2016-09-21 |
| CN105956561B true CN105956561B (en) | 2019-08-06 |
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| CN201610296751.1A Active CN105956561B (en) | 2016-05-06 | 2016-05-06 | Push type Fingerprint Identification Unit and its manufacturing method |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106270023B (en) * | 2016-09-29 | 2018-04-03 | 东莞市柏新自动化有限公司 | Fingerprint recognition module bender |
| CN107877876A (en) * | 2017-12-15 | 2018-04-06 | 昆山建皇光电科技有限公司 | LGA products automatic assembling and packaging technology |
| CN108196626B (en) * | 2018-01-17 | 2023-08-29 | 南昌黑鲨科技有限公司 | Screen assembly and intelligent terminal with same |
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| CN2795945Y (en) * | 2005-05-08 | 2006-07-12 | 全量工业股份有限公司 | Micro and thin contact type image sensing device |
| CN104036173A (en) * | 2014-07-02 | 2014-09-10 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition detection assembly and electronic device thereof |
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| CN104866814A (en) * | 2015-04-17 | 2015-08-26 | 麦克思股份有限公司 | Fingerprint identification device and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US8421890B2 (en) * | 2010-01-15 | 2013-04-16 | Picofield Technologies, Inc. | Electronic imager using an impedance sensor grid array and method of making |
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|---|---|---|---|---|
| CN2795945Y (en) * | 2005-05-08 | 2006-07-12 | 全量工业股份有限公司 | Micro and thin contact type image sensing device |
| CN104036173A (en) * | 2014-07-02 | 2014-09-10 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition detection assembly and electronic device thereof |
| CN104700084A (en) * | 2015-03-06 | 2015-06-10 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition device, touch screen with same and terminal device |
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