CN102999242A - Capacitive touch screen device and preparation method thereof - Google Patents

Capacitive touch screen device and preparation method thereof Download PDF

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Publication number
CN102999242A
CN102999242A CN2012105895432A CN201210589543A CN102999242A CN 102999242 A CN102999242 A CN 102999242A CN 2012105895432 A CN2012105895432 A CN 2012105895432A CN 201210589543 A CN201210589543 A CN 201210589543A CN 102999242 A CN102999242 A CN 102999242A
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CN
China
Prior art keywords
cover plate
adhesive glue
flexible pcb
solder joint
adhesive
Prior art date
Application number
CN2012105895432A
Other languages
Chinese (zh)
Inventor
范伟
代永平
范义
申阳
薛松
Original Assignee
深圳市长江力伟股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 深圳市长江力伟股份有限公司 filed Critical 深圳市长江力伟股份有限公司
Priority to CN2012105895432A priority Critical patent/CN102999242A/en
Publication of CN102999242A publication Critical patent/CN102999242A/en

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Abstract

The invention discloses a capacitive touch screen device and a preparation method thereof. The device is composed of a first cover plate, a first flexible PCB, a first adhesive for gluing the first flexible PCB to the first cover plate, a second cover plate formed by an indium tin oxide (ITO) glass substrate and a second adhesive for gluing the second cover plate to the first cover plate, wherein the ITO glass substrate is electrically connected with the first flexible PCB through a first soldered dot, the wiring width of the first soldered dot is ranging from 0.5CM to 1.5CM, and the distance between the first soldered dot and the first adhesive is ranging from 0.5CM to 3CM. According to the structure of the soldered dot of the flexible PCB, the wiring width of the soldered dot is narrowed, the distance between the soldered dot and the adhesive is increased, therefore the problem of the effect on the adhesiveness of the adhesive is solved, and a key role of improving the efficiency and quality of capacitive touch screen products in production is played.

Description

A kind of capacitance touch screen device and preparation method thereof

Technical field

The present invention relates to the touch-screen field, relate in particular to a kind of capacitance touch screen device and preparation method thereof.Background technology

At present, it is more and more extensive that the range of application of touch screen technology has become, from the control/operating system of the shop equipment of industrial use, the electronic enquiry facility of public information, the cash machine of commercial use, all can see the figure of Touch Screen to the mobile phone of consumer electronics, PDA, digital camera etc.Especially in recent years owing to the appearance of apple smart mobile phone, capacitive touch screen has obtained using widely.The fast development of modernization industry; so that the production of product and supportingly carry out the detailed division of labor in society; during such as the production of intelligent mobile phone; each accessory is such as wiring board; display screen; touch-screen; shell; battery; adapter; the parts such as packing can be produced separately by a plurality of producers or a plurality of department; assembly plant by specialty carries out the smart mobile phone device assembles again; finish whole production and sale; therefore in this process, need the Cellphone Accessories product that each producer and department produce is carried out standardization and scale existence; can carry out large-scale production to reach assembly plant, and Effective Raise product quality texts.

The front signal of touch panel device of the prior art as shown in Figure 1, this device is by the first cover plate 1, the first flexible PCB 3, the second flexible PCB 7, the first flexible PCB 3 is fitted in the first adhesive glue 2 of the first cover plate 1, the second cover plate 5 and the second adhesive glue (not shown) composition that the second cover plate 5 is fitted in the first cover plate 1, wherein, the second cover plate 5 is connected with the first flexible PCB 3 by the first solder joint 31, the second cover plate 5 is connected with the second flexible PCB 7 by the second solder joint 71, the first flexible PCB 3 and the second flexible PCB 7 all adopt the design of long limit, namely the wiring width of the first solder joint 31 and the second solder joint 71 is longer, the wiring width 331 of the first solder joint 31 for example, this wiring width 331 is generally greater than 2CM, when fitting the first flexible PCB 3, can produce capillarity, and flow to its virtual key district 32 along the first flexible PCB 3, this virtual key district 32 is attached on the first cover plate 1 by the first adhesive glue, simultaneously because the spacing 332 between virtual key district 32 and the first adhesive glue 2 is less, this spacing 332 is generally less than 0.3CM, the first adhesive glue 2 that flows out by capillarity so just is easy to flow to the bonding end in virtual key district 32, thereby affect the degree of adhesion of the first adhesive glue 2, cause the problems such as bonding end comes unstuck, and then affect the quality of product.

Summary of the invention

The technical problem to be solved in the present invention is, easily produces capillarity and the defective that affects degree of adhesion when fitting for prior art, provides a kind of capillarity that can not produce to affect capacitance touch screen device of degree of adhesion problem and preparation method thereof with solving.

The technical solution adopted for the present invention to solve the technical problems is: a kind of capacitance touch screen device is provided, its by the first cover plate, the first flexible PCB, with described the first flexible PCB fit in the first adhesive glue of described the first cover plate, the second cover plate of being formed by ito glass substrate and the second adhesive glue that described the second cover plate fits in described the first cover plate formed, described ito glass substrate is made by transparent conductive material; Described ito glass substrate is electrically connected with described the first flexible PCB by the first solder joint, and wherein, the span of described the first solder joint is 0.5CM to 1.5CM, and the span of the distance between described the first solder joint and described the first adhesive glue is 0.5CM to 3CM.

In device of the present invention, described device also comprises the second flexible PCB that is electrically connected by the second solder joint with described ito glass substrate.

In device of the present invention, the distance between described the first solder joint and described the first adhesive glue is 0.8CM.

In device of the present invention, described the first flexible PCB and described the second flexible PCB are expanded respectively the first virtual key and the second virtual key.

In device of the present invention, described the first adhesive glue is heat-sensitive glue, pressure sensitive adhesive or glue.

In device of the present invention, described the second adhesive glue is solid-state glue.

In device of the present invention, described the first cover plate is tempered glass.

In device of the present invention, described device also comprises the diaphragm that fits in described the second cover plate and protect described the second cover plate.

In device of the present invention, described the second cover plate is touch-screen.

The present invention also provides a kind of preparation method of capacitance touch screen device, and described device is above-mentioned device, and described preparation method may further comprise the steps:

S1. the first flexible wires circuit board and the second flexible circuitry circuit board are electrically connected with the ito glass substrate of the second cover plate by the first solder joint and the second solder joint respectively;

S2. the first adhesive glue is applied on the ito glass substrate of described the second cover plate;

The second cover plate and first cover plate that S3. will be coated with the first adhesive glue are fitted and pressing;

S4. by the second cover plate after ultraviolet light irradiation applying and the pressing and the first cover plate the first adhesive glue is solidified;

S5. the first virtual key with the first flexible wires circuit board is fitted on the first cover plate by the second adhesive glue.

Implement technical scheme of the present invention, has following beneficial effect: according to the welding spot structure of flexible PCB, by dwindling the wiring width of solder joint, increase simultaneously the distance between solder joint and the adhesive glue, thereby solved the problem of the viscosity that affects adhesive glue, and to the capacitance touch screen products aborning the lifting of efficient and product quality played crucial effect.

Description of drawings

The invention will be further described below in conjunction with drawings and Examples, in the accompanying drawing:

Fig. 1 is the front schematic view of the present invention's touch panel device of the prior art;

Fig. 2 is the side schematic view of capacitance touch screen device of the present invention;

Fig. 3 is the front schematic view of capacitance touch screen device of the present invention;

Fig. 4 is the preparation method's of capacitance touch screen device of the present invention process flow diagram.

Embodiment

In order to make purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.

Please in conjunction with consulting Fig. 2 and Fig. 3; wherein; Fig. 2 is the side schematic view of capacitance touch screen device of the present invention; Fig. 3 is the front schematic view of capacitance touch screen device of the present invention; shown in Fig. 2 and 3; this capacitance touch screen device is by the first cover plate 1; the first flexible PCB 3; the second flexible PCB 7; described the first flexible PCB 3 is fitted in the first adhesive glue 2 of described the first cover plate 1; by ITO(nano indium tin metal oxide) the second cover plate 5 of forming of glass substrate and the second adhesive glue 6 that described the second cover plate 5 fits in described the first cover plate 1 formed; in the present embodiment; described device also comprises the second flexible PCB 7 and fits in described the second cover plate 5 and protect the diaphragm 4 of described the second cover plate 5; those skilled in the art should understand; in other embodiment; the second flexible PCB 7 and diaphragm 4 can omit, and do not give unnecessary details one by one at this.

Preferably, described the first cover plate 1 is tempered glass; Described the second cover plate 5 is touch-screen, and in actual production process, the first cover plate 1 and the second cover plate 5 that the user can satisfy the demands according to the process characteristic selection of product do not repeat them here.

It should be explained that, described ito glass substrate is made by transparent conductive material, and wherein, described ito glass substrate is electrically connected with described the first flexible PCB 3 by the first solder joint 31, correspondingly, described ito glass substrate is electrically connected with described the second flexible PCB 7 by the second solder joint 71.

It should be noted that, the span of the wiring width of described the first solder joint 31 is 0.5CM to 1.5CM, in the present embodiment, the solder joint 71 of the second flexible PCB 7 has the wiring width and gets final product, at this this wiring width is not limited, should be noted that, the occurrence of the wiring width of this first solder joint 31 can arrange according to the welding spot structure of flexible PCB, in the present embodiment, take the wiring width 333 of the first solder joint 31 as example, compare greater than 2CM with the wiring width 331 of the first solder joint 31 among Fig. 1, dwindled the wiring width 333 of the first solder joint 31, so just can not produce in the prior art because the long problem that easily produces capillarity of the wiring width of solder joint.

Simultaneously, the span of the distance between described the first solder joint 31 and described the first adhesive glue 2 is 0.5CM to 3CM, should be noted that, distance between this first solder joint 31 and the first adhesive glue 2 also can arrange according to the welding spot structure of flexible PCB, in the present embodiment, take the distance 334 between the first solder joint 31 and the first adhesive glue 2 as example, compare less than 0.3CM with the distance 332 between the first solder joint 31 among Fig. 1 and the first adhesive glue 2, increased the distance 334 between the first solder joint 31 and the first adhesive glue 2, thereby solved the problem of the viscosity that affects the first adhesive glue 2, preferably, facts have proved, the distance 334 between the first solder joint 31 and the first adhesive glue 2 is 0.8CM.

In the present embodiment, described the first flexible PCB 3 and described the second flexible PCB 7 are expanded respectively the first virtual key 32 and the second virtual key 72, should be noted that, in other embodiments, the first flexible PCB 3 and the second flexible PCB 7 all can be expanded a plurality of virtual keys, do not repeat them here.

In the present embodiment, described the first adhesive glue 2 is heat-sensitive glue, pressure sensitive adhesive or glue, and this first adhesive glue 2 has the advantages that light transmission is high and be easy to solidify, and in other embodiment, the first adhesive glue 2 can be other solid-state glue.

Preferably, described the second adhesive glue 6 is solid-state glue, and in this enforcement, the user can select double faced adhesive tape, in other embodiments, also can select other solid-state glue, does not repeat them here.

Please in conjunction with consulting Fig. 4, Fig. 4 is the preparation method's of capacitance touch screen device of the present invention process flow diagram, and as shown in Figure 4, described preparation method may further comprise the steps:

In step S1, the first flexible wires circuit board 3 and the second flexible circuitry circuit board 7 are electrically connected with the ito glass substrate of the second cover plate 5 by the first solder joint 31 and the second solder joint 71 respectively;

In step S2, the first adhesive glue 2 is applied on the ito glass substrate of described the second cover plate 5;

In step S3, the second cover plate 5 and the first cover plate 1 that are coated with the first adhesive glue 2 are fitted and pressing;

In step S4, by the second cover plate 5 after ultraviolet light irradiation applying and the pressing and the first cover plate 1 the first adhesive glue 2 is solidified;

In step S5, the first virtual key 32 of the first flexible wires circuit board 3 is fitted on the first cover plate 1 by the second adhesive glue 6.

Compared to prior art, welding spot structure according to flexible PCB, by dwindling the wiring width of solder joint, increase simultaneously the distance between solder joint and the adhesive glue, thereby solved the problem of the viscosity that affects adhesive glue, and to the capacitance touch screen products aborning the lifting of efficient and product quality played crucial effect.

The above is the preferred embodiments of the present invention only, is not limited to the present invention, and for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any modification of doing, be equal to replacement, improvement etc., all should be included within the claim scope of the present invention.

Claims (10)

1. capacitance touch screen device, its by the first cover plate (1), the first flexible PCB (3), with described the first flexible PCB (3) fit in first adhesive glue (2) of described the first cover plate (1), the second cover plate (5) of being formed by ito glass substrate and the second adhesive glue (6) that described the second cover plate (5) fits in described the first cover plate (1) formed, described ito glass substrate is made by transparent conductive material; It is characterized in that, described ito glass substrate is electrically connected with described the first flexible PCB (3) by the first solder joint (31), wherein, the span of the wiring width of described the first solder joint (31) is 0.5CM to 1.5CM, and the span of the distance between described the first solder joint (31) and described the first adhesive glue (2) is 0.5CM to 3CM.
2. device according to claim 1 is characterized in that, described device also comprises the second flexible PCB (7) that is electrically connected by the second solder joint (71) with described ito glass substrate.
3. device according to claim 1 is characterized in that, the distance between described the first solder joint (31) and described the first adhesive glue (2) is 0.8CM.
4. device according to claim 2 is characterized in that, described the first flexible PCB (3) and described the second flexible PCB (7) are expanded respectively the first virtual key (32) and the second virtual key (72).
5. device according to claim 1 is characterized in that, described the first adhesive glue (2) is heat-sensitive glue, pressure sensitive adhesive or glue.
6. device according to claim 1 is characterized in that, described the second adhesive glue (6) is solid-state glue.
7. device according to claim 1 is characterized in that, described the first cover plate (1) is tempered glass.
8. device according to claim 1 is characterized in that, described device also comprises the diaphragm (4) that fits in described the second cover plate (5) and protect described the second cover plate (5).
9. device according to claim 8 is characterized in that, described the second cover plate (5) is touch-screen.
10. the preparation method of a capacitance touch screen device is characterized in that, described device is the claims 1 to 9 each described devices, and described preparation method may further comprise the steps:
S1. the first flexible wires circuit board (3) and the second flexible circuitry circuit board (7) are electrically connected with the ito glass substrate of the second cover plate (5) by the first solder joint (31) and the second solder joint (71) respectively;
S2. the first adhesive glue (2) is applied on the ito glass substrate of described the second cover plate (5);
Second cover plate (5) that S3. will be coated with the first adhesive glue (2) is fitted and pressing with the first cover plate (1);
S4. by the second cover plate (5) after ultraviolet light irradiation applying and the pressing and the first cover plate (1) the first adhesive glue (2) is solidified;
S5. the first virtual key (32) with the first flexible wires circuit board (3) is fitted on the first cover plate (1) by the second adhesive glue (6).
CN2012105895432A 2012-12-29 2012-12-29 Capacitive touch screen device and preparation method thereof CN102999242A (en)

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Application Number Priority Date Filing Date Title
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104199515A (en) * 2014-08-29 2014-12-10 深圳市中兴移动通信有限公司 Mobile terminal
CN104571692A (en) * 2014-12-16 2015-04-29 广东欧珀移动通信有限公司 Touch control key wire distribution structure and terminal
CN104598062A (en) * 2013-11-01 2015-05-06 瀚宇彩晶股份有限公司 Touch display device
CN106814902A (en) * 2015-11-30 2017-06-09 蓝思科技(长沙)有限公司 A kind of method that curved side in contact panel realizes virtual key

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101462423A (en) * 2007-12-18 2009-06-24 上海晨兴电子科技有限公司 Method for manufacturing touch screen
CN102043184A (en) * 2009-10-09 2011-05-04 Lg化学株式会社 Integrated touch polarizer and touch panel comprising the same
CN201945986U (en) * 2011-01-19 2011-08-24 漳州市百昱工贸有限公司 Multipoint touch control pad structure
CN202600666U (en) * 2012-05-09 2012-12-12 深圳市志凌伟业技术有限公司 Capacitive touch screen
CN202615368U (en) * 2012-05-29 2012-12-19 格林精密部件(惠州)有限公司 Single-layer Film double-side ITO structured capacitive touch screen
CN203025676U (en) * 2012-12-29 2013-06-26 深圳市长江力伟股份有限公司 Capacitive touch screen device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101462423A (en) * 2007-12-18 2009-06-24 上海晨兴电子科技有限公司 Method for manufacturing touch screen
CN102043184A (en) * 2009-10-09 2011-05-04 Lg化学株式会社 Integrated touch polarizer and touch panel comprising the same
CN201945986U (en) * 2011-01-19 2011-08-24 漳州市百昱工贸有限公司 Multipoint touch control pad structure
CN202600666U (en) * 2012-05-09 2012-12-12 深圳市志凌伟业技术有限公司 Capacitive touch screen
CN202615368U (en) * 2012-05-29 2012-12-19 格林精密部件(惠州)有限公司 Single-layer Film double-side ITO structured capacitive touch screen
CN203025676U (en) * 2012-12-29 2013-06-26 深圳市长江力伟股份有限公司 Capacitive touch screen device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104598062A (en) * 2013-11-01 2015-05-06 瀚宇彩晶股份有限公司 Touch display device
CN104199515A (en) * 2014-08-29 2014-12-10 深圳市中兴移动通信有限公司 Mobile terminal
CN104199515B (en) * 2014-08-29 2016-06-01 努比亚技术有限公司 A kind of mobile terminal
CN104571692A (en) * 2014-12-16 2015-04-29 广东欧珀移动通信有限公司 Touch control key wire distribution structure and terminal
CN106814902A (en) * 2015-11-30 2017-06-09 蓝思科技(长沙)有限公司 A kind of method that curved side in contact panel realizes virtual key

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Application publication date: 20130327

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