CN104142749B - A kind of contact panel and preparation method thereof - Google Patents
A kind of contact panel and preparation method thereof Download PDFInfo
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- CN104142749B CN104142749B CN201310181224.2A CN201310181224A CN104142749B CN 104142749 B CN104142749 B CN 104142749B CN 201310181224 A CN201310181224 A CN 201310181224A CN 104142749 B CN104142749 B CN 104142749B
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Abstract
The invention discloses a kind of contact panel, including：One substrate, there is an induction zone and around a peripheral region of the induction zone；One sensing electrode layer, the peripheral region is extended to from the induction zone；One light shield layer, the peripheral region is arranged at, and covers the sensing electrode layer positioned at the peripheral region, the light shield layer has a plurality of through holes and is located at the part of the peripheral region sensing electrode layer to expose, and the wherein light shield layer is an antiultraviolet material；One conductive filler layer, the through hole of the light shield layer is filled, the wherein conductive filler layer is ultraviolet-curable material；One signal transmission line, it is arranged on the light shield layer, and the signal transmission line is electrically connected with the sensing electrode layer by the conductive filler layer.The present invention separately provides a kind of method for manufacturing the contact panel.Thereby, to overcome requirement of the prior art to the high printing precision of contact panel, improve because of the dysfunction caused by printing the problems such as.
Description
Technical field
The present invention relates to touch technology, in particular to a kind of contact panel and preparation method thereof.
Background technology
Because contact panel can be applied on portable product and have the advantages of user-friendly for operation, and help extensively should
For various electronic product, include personal digital assistant (personal digital assistant, PDA), palm PC
(palm sized PC), mobile phone, handwriting input device, information household appliances (Information appliance), automatic gold
Melt machine (automated teller machine, ATM) and storefront sale automatic teller machine (point of sale, POS) etc..Can
The communication and consumption electronic products quantity for taking formula increase day by day, and such product will largely use contact panel as its input
Equipment, therefore there are many dealers to put into the technology development relevant with contact panel in recent years.
As contact panel market is that more and more extensive applying is being touched to reducing the demand of cost and thickness, printing technology
Panel is controlled, the mode of printed conductive layer overlap joint up/down line layer is also popularized for the contact panel product of various structures.With product
Resolution ratio increase, the size and required precision more and more higher of the conducting wire of contact panel.
Conventional art makes conducting wire method as first one layer of sensing electrode layer of formation on substrate, then lead to using printing technology
Cross printing technology and form the light shield layer with through hole in sensing electrode layer neighboring area, then by alignment mode by conduction material
Material filling is into through hole, so as to realize electrically conducting for sensing electrode layer and perimeter leads.
But using such a mode to produce influences greatest problem on processing procedure to be very high to printing contraposition requirement, easily fills out
Conductive material and the through hole contraposition filled offset and influence electrically conducting between sensing electrode layer and perimeter leads, and then influence
Product yield.
The content of the invention
In view of above-mentioned, for prevent because the conductive material of filling and through hole contraposition it is inaccurate and caused by electrically conduct problem,
The present invention provides a kind of contact panel, including：One substrate, the substrate have an induction zone and around a peripheries of the induction zone
Area；One sensing electrode layer, the peripheral region is extended to from the induction zone；One light shield layer, the peripheral region is arranged at, and covers to be located at and be somebody's turn to do
The sensing electrode layer of peripheral region, the light shield layer have a plurality of through holes and are located at the part of the peripheral region sensing to expose
Electrode layer, the wherein light shield layer are an antiultraviolet materials；One conductive filler layer, the through hole of the light shield layer is filled, wherein
The conductive filler layer is ultraviolet-curable material；One signal transmission line, it is arranged on the light shield layer, and the signal transmission line
The sensing electrode layer is electrically connected with by the conductive filler layer.
The present invention further provides a kind of contact panel preparation method, and it includes providing a substrate, including one first side
With one second side；A light shield layer is formed on the first side of the substrate, wherein the shading layer material includes ultraviolet light screener, and
The light shield layer includes a plurality of through holes；Solidify the light shield layer；A conductive layer is formed, the conductive layer is filled in this including a part
The conductive filler layer of a little through holes, a part of conductive surface layer being formed directly on dielectric ink, the wherein conductive layer are can
Ultraviolet hardening material；The conductive layer is irradiated from the second side of the substrate with a ultraviolet, the conductive filler layer is consolidated by light
Change, remove uncured conductive surface layer.
Above-mentioned contact panel and its contact panel preparation method, as a result of the structure and alignment mode of the present invention
Compared to the demand that prior art reduces conductive filler layer printing precision, it is different to improve the electric connection caused by printing skew
Often (such as short circuit or open circuit) the problems such as.
For the feature of the present invention can be become apparent, special embodiment below, and coordinate institute's accompanying drawings, elaborate
It is as follows：
Brief description of the drawings
Figure 1A-Fig. 1 J show the profile in one embodiment of the invention contact panel preparation method each stage.
Fig. 2 shows Figure 1B plan.
Fig. 3 shows Fig. 1 C plan.
Fig. 4 shows Fig. 1 D plan.
Fig. 5 shows Fig. 1 F plan.
Embodiment
The present invention is described in further detail with embodiment below in conjunction with the accompanying drawings.It is understood that implement
Example provides many applicable inventive concepts, the change that it can be wider.The specific embodiment discussed is only used for disclosing
Using the ad hoc approach of embodiment, and it is not used to limit the category disclosed.
Its " embodiment " refers to certain patterns, structure or the spy related to an at least embodiment of the invention in interior text below
Sign.Therefore, narration below " in one embodiment " does not imply that the same embodiment.In addition, in one or more embodiments
Certain patterns, structure or feature can combine by rights.It is worth noting that, the schema of this specification is not necessarily made to scale
Illustrate, it is only used for disclosing the present invention.
Figure 1A-Fig. 1 J show the profile in one embodiment of the invention contact panel preparation method each stage.Coordinate figure below
1A- Fig. 1 J descriptions disclose one embodiment of the invention contact panel preparation method.First, there is provided a substrate 101, substrate 101 include
One first side 1011 and one relative to first side 1011 the second side 1012, wherein the first side 1011 is the various storehouse of carrying
Touch control component (will in follow-up describe in detail), and the second side 1012 is then the contact for receiving user, such as with finger or touch-control
Pen.Substrate 101 can have the peripheral region 101B that an induction zone 101A and at least one is arranged on induction zone side, in the present embodiment
In, peripheral region 101A is provided in induction zone 101B surrounding.In the present embodiment, substrate 101 can be worn to be any by light
Saturating material composition, if substrate can be glass, acryl (Polymethylmethacrylate, abbreviation PMMA) or poly- carbonic acid
Ester (Polycarbonate, abbreviation PC) forms.Fig. 2 shows that one embodiment of the invention contact panel makes the plane of next stage
Figure, Figure 1B show the profile along Fig. 2 hatchings I-I ', refer to Figure 1B and Fig. 2, form a sensing electrode layer 102 in base
On first side 1011 of plate 101, in one embodiment, sensing electrode layer 102 can be that any transparent conductive material forms, such as
Indium tin oxide (ITO) or indium-zinc oxide (IZO).The method for forming sensing electrode layer 102 can be wire mark method or other.Figure
3 display one embodiment of the invention contact panels make the plan of next stage, and Fig. 1 C show cuing open along Fig. 3 hatchings I-I '
Face figure, Fig. 1 C and Fig. 3 are refer to, a light shield layer 103, wherein light shield layer 103 are formed in the periphery of the first side 1011 of substrate 101
The peripheral region is arranged at, and covers the sensing electrode layer 102 positioned at peripheral region 101B, can so cause the sensing not covered
Electrode layer forms an induction zone 101A, and light shield layer 103 can obstruct ultraviolet 104.Light shield layer 103 has a plurality of through holes
105 are located at peripheral region 101B section senses electrode layer 102 to expose, and the size and location system of through hole 105 is by matching somebody with somebody
Put, for filling conductive filler layer 1061 in subsequent step, signal transmission line 107 is arranged on light shield layer 103, signal transmission line
107 are electrically connected with sensing electrode layer 102 by the conductive filler layer 1061 in through hole 105.
The material of the light shield layer is that OD value is more than 3, wherein optical density=1g (1/trans) in one embodiment,
Trans is the light transmittance of light shield layer, it follows that when OD value is more than 3, light transmittance is now ultraviolet less than 0.1%
The transmitance of line 104 will be less than 0.1%, and the wherein OD value of light shield layer can be reached by adjusting the thickness of light shield layer 103
, such as when light shield layer 103 is black ink materials, the thickness of light shield layer 103 is more than 10um optical densities value greatly dry 3.
In another embodiment, light shield layer 103 can also own material characteristic and reach function of shielding ultraviolet radiation, such as
Add ultraviolet light screener.Wherein ultraviolet light screener can be inorganic ultraviolet light screener, inorganic ultraviolet light screener
The mainly fine powder of ceramic-like, these powder include kaolin, calcium carbonate, talcum powder or its mixture, pass through fine powder and shading
Layer material, which combines, plays a part of reflection or scatters ultraviolet shielding to incident ultraviolet radiation 104, so as to prevent ultraviolet to be perforated through
Light shield layer 103.The ultraviolet light screener wherein added can also be organic ultraviolet light screener, the organic ultraviolet screen
Covering agent includes salicylic acid esters, benzophenone class, benzotriazole, group-substituted acrylonitrile or triazines and hindered amines mixture, should
Type shielding agent is mainly played a part of absorbing ultraviolet and carries out energy conversion, by the heat energy that ultraviolet is become to low energy
Or the electromagnetic wave that wavelength is shorter, so as to prevent ultraviolet to be perforated through light shield layer 103.
Fig. 4 shows that one embodiment of the invention contact panel makes the plan of next stage, and Fig. 1 D are shown along Fig. 4 sections
Line I-I ' profile, Fig. 1 D and Fig. 4 are refer to, the conductive layer 106 solidify can be reacted ultraviolet in shading by forming one
On layer 103, and insert in those through holes 105, the part that wherein conductive layer 106 is filled in those through holes is conductive fill
Layer 1061, the part being formed directly on light shield layer 103 is conductive surface layer 1062.
In the embodiment, the material of conductive layer 106 is the conductive material of ultraviolet-curable, and further this can be ultraviolet
The conductive material of line curing type is ultraviolet conducting resinl, and ultraviolet conducting resinl mainly includes monomer and light trigger, wherein monomer
Mainly include acrylate, cyanoacrylate, epoxy resin, silicone.
Light trigger in ultraviolet conducting resinl produces the free radical of activation under ultraviolet irradiation, surface active from
By base under ultraviolet (250nm) irradiation, and oxygen chemically reactive generates titanium dioxide base and monomer, internal activation from
Lower chemically reactive is irradiated in ultraviolet (365nm) by base and monomer, generates monomer radical, it is in ultraviolet (365nm) photograph
Penetrate down again with monomer chemically reactive in conjunction with, and so on, polymer is eventually become, so as to be cured.
The present embodiment is not required to accurately be directed at each through hole 105 in the step for forming conductive layer 106, specific contraposition side
Method is as follows, as shown in figure 4, the conductive layer 106 of formation can be the string configuration of a plurality of through holes 105 of covering, it can
To form the frame-shaped construction (as shown in Figure 4) on light shield layer 103.Then, as referring to figure 1E, using (the ultraviolet of a ultraviolet 104
Wave-length coverage is 200-400nm), pass through the through hole 105 in substrate 101 and light shield layer 103 from the second side 1012 of substrate 101
And expose to conductive layer 106, because the OD value of light shield layer 103 is more than 3, light transmittance is less than 0.1%, according to the solid energy of light=
Illumination * times * light transmittance understands that the conductive surface layer 1062 being formed directly on light shield layer 103, energy is too late admittedly for obtained light
The 0.1% of conductive filler layer 1061, therefore after the solidification of conductive filler layer 1061, it is solid that conductive surface layer 1062 will not produce reaction
Change.
In another embodiment when light shield layer 103 is added with ultraviolet light screener, ultraviolet 104 can be by light shield layer 103
Ultraviolet light screener absorb or reflection, therefore ultraviolet 104 can not be irradiated to conductive surface layer 1062 through light shield layer 103,
Therefore conductive surface layer 1062 will not react solidification.And because through hole 105 is not present added with ultraviolet light screener
Light shield layer 103, therefore ultraviolet 104 will not be absorbed or be reflected away, and can shine directly into leading in through hole 105
Electric packed layer 1061, and be allowed to produce solidification.
Fig. 5 shows that one embodiment of the invention contact panel makes the plan of next stage, and Fig. 1 F are shown along Fig. 5 sections
Line I-I ' profile, refer to Fig. 1 F and Fig. 5, carry out a cleaning step, and cleaning removal is carried out using cleaning machine in the step
Uncured conductive surface layer 1062, only leave in through hole by above-mentioned UV radiation curing conductive filler layer
1061, and this partial electroconductive layer is really to play electric connection to act on.
It is worth noting that, the present embodiment passes through through hole 105 using ultraviolet 104 from the second side 1012 of substrate 101
Conductive layer 106 is irradiated, so as to solidify the conductive filler layer 1061 in through hole, then is removed using follow-up cleaning step and is not led
Conducting surface layer 1062, it is not required to using the preparation method of the present invention compared with prior art when forming conductive filler layer 1061 and through hole
105 exactitude positions, therefore be not in that electrically leading between sensing electrode layer and signal transmission line is influenceed due to contraposition deviation
It is logical to make, and then influence product yield.
Next, refer to Fig. 1 G, a signal transmission line 107 is formed on light shield layer 110, and be electrically connected with conductive fill
Layer 1161.Wire mark method can be used in signal transmission line 107, the half tone of matching design circuit, the printing of signal transmission line 107 is covered in
On light shield layer 103, and contacted with the conductive filler layer 1061 in through hole 105, such signal transmission line 107 can pass through conduction and fill out
Layer 1061 is filled to be electrically connected with sensing electrode layer 102.
Then it refer to Fig. 1 H, insulating barrier 108 formed on signal transmission line 107, to avoid signal transmission line 107 from exposing
Cause to aoxidize in air, insulating barrier 108 can be formed with wire mark, and insulating barrier 108 is preferably transparent material composition, such as insulate
The composition material of layer includes urethane acrylates, resin.Insulating barrier 108 may include an opening 1081, exposure its underpart letter
Number transmission line 108.
Refer to Fig. 1 I again, by a flexible circuit board (flexible printed circuit, abbreviation FPC) 109 via
One conductive adhesive layer 110, which sticks together, to be fixed on insulating barrier 108, to be electrically connected with through conductive adhesive layer 110 with signal transmission line 107.
In one embodiment, it is that using anisotropic conductive adhesive paste as conductive adhesive layer 110, pressing is sticked together by flexible circuit board using hot press
In on the signal transmission line 107 that insulating barrier 108 exposes.
Subsequently, Fig. 1 J are refer to, one is coated between flexible circuit board 109 and substrate 101 and strengthens glue-line 111, it is soft to increase
Property the intensity fixed of circuit board 109, avoid improperly acting when successive process steps or assembling and cause flexible circuit board 109 de-
From.
Referring once again to Fig. 1 J, further to disclose the implementation structure of contact panel, the contact panel includes a kind of touch-control
Device, it includes：There is an induction zone 101A and at least one to be arranged on induction zone 101A sides for one substrate 101, the substrate 101
Peripheral region 101B；One sensing electrode layer 102, it is arranged on the substrate 101 and extends to the peripheral region from induction zone 101A
101B；One light shield layer 103, peripheral region 101B is arranged at, and is covered on the peripheral region 101B sensing electrode layer 102,
The light shield layer has a plurality of through holes 105 and is located at the peripheral region 101B part sensing electrode layer 103 to expose, wherein
The light shield layer 103 is an antiultraviolet material；One conductive filler layer 1061, the through hole 105 of the light shield layer is filled, wherein should
Conductive filler layer 1061 is a ultraviolet hardening material；And a signal transmission line 107, it is arranged on the light shield layer 103, and
The signal transmission line 107 is electrically connected with the sensing electrode layer 102 by the conductive filler layer 1061.
According to above-mentioned contact panel and its contact panel preparation method, as a result of the present invention structure with it is right
Position mode reduces the demand of conductive filler layer printing precision compared to prior art, improves caused by printing skew electrically
Turn on the problems such as abnormal.
Although the preferred embodiment explanation of this announcement is as above, so it is not limited to the present invention, any to be familiar with this skill
Person, without departing from the spirit and scope of the invention, when can make a little change with retouching, therefore the protection domain of the present invention ought
It is defined depending on rear attached claim institute defender.
Claims (12)
- A kind of 1. contactor control device, it is characterised in that：One substrate, the substrate are arranged on the peripheral region of the induction zone side with an induction zone and at least one；One sensing electrode layer, set on the substrate and extend to the peripheral region from the induction zone；One light shield layer, the peripheral region is arranged at, and be covered on the sensing electrode layer of the peripheral region, the light shield layer has plural number Individual through hole is located at the part of the peripheral region sensing electrode layer to expose, and the wherein light shield layer is an antiultraviolet material；One conductive filler layer, the through hole in the light shield layer is only filled with, the wherein conductive filler layer is a ultraviolet hardening Conductive material；AndOne signal transmission line, it is arranged on the light shield layer, and the signal transmission line is electrically connected with the sense by the conductive filler layer Survey electrode layer.
- 2. contactor control device according to claim 1, it is characterised in that：The light shield layer is OD value at least above 3.
- 3. contactor control device according to claim 1, it is characterised in that：The light shield layer thickness is at least above 10um.
- 4. contactor control device according to claim 1, it is characterised in that：The light shield layer is added with ultraviolet light screener.
- 5. contactor control device according to claim 4, it is characterised in that：The ultraviolet light screener is inorganic compound, organic Compound or its mixture.
- 6. contactor control device according to claim 1, it is characterised in that：The material of the conductive filler layer is that ultraviolet is conductive Glue.
- 7. contactor control device according to claim 6, it is characterised in that：The ultraviolet conducting resinl includes monomer and light-initiated Agent.
- 8. a kind of preparation method of contact panel, including：A substrate is provided, the substrate is arranged on the peripheral region of the induction zone side with an induction zone and at least one；A sensing electrode layer is formed on the substrate, the sensing electrode layer from the induction zone on the substrate in extending to the periphery Area；A light shield layer is formed on the peripheral region of the substrate, and the light shield layer is covered in the sensing electrode layer of the peripheral region On, the light shield layer has a plurality of through holes and is located at the part of the peripheral region sensing electrode layer, the wherein shading to expose Layer is an antiultraviolet material；A conductive filler layer is formed, is only filled with the through hole of the light shield layer, wherein the conductive filler layer is a ultraviolet The conductive material of curing type；AndA signal transmission line is formed on the light shield layer, and the signal transmission line is electrically connected with the sensing by the conductive filler layer Electrode layer.
- 9. contact panel preparation method according to claim 8, it is characterised in that：Wherein form the step of the conductive filler layer Suddenly include：A conductive layer is formed, the conductive layer includes a part of conductive filler layer being only filled with those through holes, another part The conductive surface layer being formed directly into for one on the light shield layer；The conductive layer is exposed to relative to the opposite side of the sensing electrode layer from the substrate with a ultraviolet, wherein the conductive fill Layer is by direct irradiation and uncured by the shielding of the light shield layer by photocuring, the conductive surface layer；AndRemove the conductive surface layer.
- 10. contact panel preparation method according to claim 9, it is characterised in that：The conductive layer is strip.
- 11. contact panel preparation method according to claim 9, it is characterised in that：The method for removing the conductive surface layer Including being cleaned using cleaning machine.
- 12. contact panel preparation method according to claim 8, it is characterised in that：The wave-length coverage of the ultraviolet is 200nm-400nm。
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310181224.2A CN104142749B (en) | 2013-05-09 | 2013-05-09 | A kind of contact panel and preparation method thereof |
| TW102129755A TWI521399B (en) | 2013-05-09 | 2013-08-20 | Touch device and method for forming touch panel |
| TW102215601U TWM467118U (en) | 2013-05-09 | 2013-08-20 | Touch device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310181224.2A CN104142749B (en) | 2013-05-09 | 2013-05-09 | A kind of contact panel and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104142749A CN104142749A (en) | 2014-11-12 |
| CN104142749B true CN104142749B (en) | 2018-01-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310181224.2A Active CN104142749B (en) | 2013-05-09 | 2013-05-09 | A kind of contact panel and preparation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104142749B (en) |
| TW (2) | TWM467118U (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104951156A (en) * | 2014-03-31 | 2015-09-30 | 宸盛光电有限公司 | Capacitive touch control device |
| CN105094472B (en) * | 2014-05-15 | 2018-08-07 | 宸鸿科技(厦门)有限公司 | A kind of touch panel |
| CN105573539B (en) * | 2014-10-17 | 2019-05-03 | 宸鸿光电科技股份有限公司 | Touch panel and its manufacturing method |
| CN106126001B (en) * | 2016-06-29 | 2019-04-16 | 业成光电（深圳）有限公司 | Touch panel and its manufacturing method |
| CN106997442A (en) * | 2017-05-16 | 2017-08-01 | 金龙机电（杭州）有限公司 | A kind of touch-screen with anti-tamper circuit |
| CN107168588A (en) * | 2017-07-14 | 2017-09-15 | 业成科技（成都）有限公司 | Touch module structure and its manufacture method |
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| JP2005183875A (en) * | 2003-12-24 | 2005-07-07 | Fujikura Ltd | Method for filling through-hole of printed circuit board with resin |
| CN1996524A (en) * | 2005-12-26 | 2007-07-11 | 毅嘉科技股份有限公司 | A making method for thin key |
| CN102243544A (en) * | 2010-05-12 | 2011-11-16 | 群康科技(深圳)有限公司 | Touch screen, touch screen manufacturing method and touch display device |
| CN102929454A (en) * | 2011-08-12 | 2013-02-13 | 宸鸿科技(厦门)有限公司 | Capacitive touch panel and method for reducing visibility of metal conductors thereof |
| CN103049121A (en) * | 2011-10-13 | 2013-04-17 | 宸鸿科技(厦门)有限公司 | Touch control device and manufacture method thereof |
| CN203480450U (en) * | 2013-05-09 | 2014-03-12 | 宸正光电（厦门）有限公司 | Touch panel |
-
2013
- 2013-05-09 CN CN201310181224.2A patent/CN104142749B/en active Active
- 2013-08-20 TW TW102215601U patent/TWM467118U/en not_active IP Right Cessation
- 2013-08-20 TW TW102129755A patent/TWI521399B/en active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005183875A (en) * | 2003-12-24 | 2005-07-07 | Fujikura Ltd | Method for filling through-hole of printed circuit board with resin |
| CN1996524A (en) * | 2005-12-26 | 2007-07-11 | 毅嘉科技股份有限公司 | A making method for thin key |
| CN102243544A (en) * | 2010-05-12 | 2011-11-16 | 群康科技(深圳)有限公司 | Touch screen, touch screen manufacturing method and touch display device |
| CN102929454A (en) * | 2011-08-12 | 2013-02-13 | 宸鸿科技(厦门)有限公司 | Capacitive touch panel and method for reducing visibility of metal conductors thereof |
| CN103049121A (en) * | 2011-10-13 | 2013-04-17 | 宸鸿科技(厦门)有限公司 | Touch control device and manufacture method thereof |
| CN203480450U (en) * | 2013-05-09 | 2014-03-12 | 宸正光电（厦门）有限公司 | Touch panel |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM467118U (en) | 2013-12-01 |
| CN104142749A (en) | 2014-11-12 |
| TW201443728A (en) | 2014-11-16 |
| TWI521399B (en) | 2016-02-11 |
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Effective date of registration: 20170714 Address after: 361009 intellectual property department, No. 199, Shang Lu Road, information hi tech Zone, torch hi tech Zone, Fujian, Xiamen Applicant after: XIANGDA OPTICAL (XIAMEN) CO., LTD. Address before: 361009 RST factory area, No. 195 Sakamoto Road, torch hi tech Zone, Xiamen, Fujian Applicant before: Chenzheng Photoelectric (Xiamen) Co., Ltd. |
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