CN106293172A - Contact panel and preparation method thereof - Google Patents

Contact panel and preparation method thereof Download PDF

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Publication number
CN106293172A
CN106293172A CN201510260104.0A CN201510260104A CN106293172A CN 106293172 A CN106293172 A CN 106293172A CN 201510260104 A CN201510260104 A CN 201510260104A CN 106293172 A CN106293172 A CN 106293172A
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China
Prior art keywords
conductive layer
transparent substrates
wire
lead
contact panel
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CN201510260104.0A
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CN106293172B (en
Inventor
胡丽
叶剑
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Anhui Jingzhuo Optical Display Technology Co Ltd
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Nanchang OFilm Tech Co Ltd
Suzhou OFilm Tech Co Ltd
Shenzhen OFilm Tech Co Ltd
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Priority to CN201510260104.0A priority Critical patent/CN106293172B/en
Publication of CN106293172A publication Critical patent/CN106293172A/en
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Abstract

The present invention relates to a kind of contact panel and preparation method thereof.This contact panel, including: transparent substrates, there is viewing area and non-visible area territory, non-visible area territory is provided with the binding district for binding with flexible PCB;Conductive layer, it is located on transparent substrates one surface, including electrode pattern and lead-in wire, electrode pattern is positioned on viewing area, for obtaining the coordinate information of touch point, lead-in wire is connected with electrode pattern, for being spread out of by flexible PCB by the coordinate information that electrode pattern obtains, wherein, one end that lead-in wire is connected with electrode pattern is the first end, the other end is the second end, and the second end is positioned at binding district;First transparent photosensitive resin layer, is located at conductive layer away from the surface of transparent substrates, and the edge of the first transparent photosensitive resin layer self-induced transparency substrate caves in formation breach, so that the second end exposes.This contact panel can effectively protect conductive layer, it is to avoid conductive layer is scraped off or aoxidizes.

Description

Contact panel and preparation method thereof
Technical field
The present invention relates to technical field of touch control, particularly relate to a kind of contact panel and preparation method thereof.
Background technology
Touch screen, as the inductive arrangement of acceptable touch input signal, the most more and more replaces tradition Mechanical keyboard input, be widely used in the consumer electronics such as smart mobile phone, panel computer, notebook computer Field, and electronic blackboard, automatic vending machine etc. need the place of man-machine interaction.
Traditional touch screen generally with tin indium oxide (ITO) as conductive.Concrete, touch making During screen, first use the mode of magnetron sputtering to form ITO conductive layer, then use the mode of etching to process ITO to lead Electric layer, to make transparent electrode pattern, wherein, transparent electrode pattern is for determining the coordinate information of touch point.
In actual applications, touch screen generally includes cover sheet, and cover sheet has relative load-bearing surface And touch-surface, ITO conductive layer is located on load-bearing surface.And the touch screen of some type, such as OGS (One Glass Solution, i.e. integration touch-control) touch screen, DITO (there is two-layer ITO layer) touch screen etc., Its ITO conductive layer cover sheet side dorsad is exposed outside, is easily scraped off or aoxidizes.
Summary of the invention
Based on this, it is necessary to provide a kind of can effective contact panel protecting conductive layer and preparation method thereof.
A kind of contact panel, including:
Transparent substrates, has viewing area and non-visible area territory, and described non-visible area territory is provided with for soft Property circuit board binding binding district;
Conductive layer, is located on described transparent substrates one surface, including electrode pattern and lead-in wire, described electrode figure Case is positioned on described viewing area, for obtaining the coordinate information of touch point, and described lead-in wire and described electrode figure Case connects, for the coordinate information that described electrode pattern obtains is spread out of by flexible PCB, wherein, and institute Stating the one end being connected with described electrode pattern that goes between is the first end, and the other end is the second end, described second end position In described binding district;And
First transparent photosensitive resin layer, is located on the described conductive layer surface away from described transparent substrates, and institute State the first transparent photosensitive resin layer to cave in formation breach from the edge of described transparent substrates, so that described second End exposes.
Wherein in an embodiment, described transparent substrates is the cover sheet of described contact panel, described Bright substrate has relative touch-surface and load-bearing surface, and the case hardness of described touch-surface is more than or equal to 3H, Described conductive layer is located on described load-bearing surface.
Wherein in an embodiment, described transparent substrates is flexible cover plate;
Described transparent substrates includes plastic rubber substrate and is located at the hardening coat on described plastic rubber substrate surface, described hardening The surface of the most described plastic rubber substrate of coating is described touch-surface, and the most described hardening of described plastic rubber substrate is coated with Layer surface be described load-bearing surface, wherein, the thickness of described plastic rubber substrate is 0.1~0.3mm, described firmly Change the thickness of coating less than 0.05mm;
Or, described transparent substrates is the plastic rubber substrate that a surface is hardened, and described plastic rubber substrate is through hard The surface that change processes is described touch-surface, and another surface is described load-bearing surface, wherein, and described plastic cement base The thickness of material is 0.1~0.3mm.
Wherein in an embodiment, described contact panel is the touch screen of the support multiple spot of mutual capacitance type;
The number of described conductive layer is one layer, and the electrode pattern of described conductive layer includes the first touch control electrode and Two touch control electrode, the number of described first touch control electrode and the number of described second touch control electrode and with described The number of lead-in wire is identical, each lead-in wire and one first touch control electrode or the electrical connection of one second touch control electrode, wherein, Described first touch control electrode and described second touch control electrode are respectively used to obtain the information of X-axis coordinate and Y-axis is sat Target information;
Or, the number of described conductive layer is two-layer, the respectively first conductive layer and the second conductive layer;Described Transparent substrates, described first conductive layer, described second conductive layer and described first transparent photosensitive resin layer are successively Stacking is arranged, and described first conductive layer and described second conductive layer mutually insulated;Described first conductive layer Electrode pattern includes that the first touch control electrode, the lead-in wire of described first conductive layer are the first lead-in wire, and described first draws The number of line is identical with the number of described first touch control electrode, each first lead-in wire and one first touch control electrode electricity Connect;The electrode pattern of described second conductive layer includes the second touch control electrode, the lead-in wire of described second conductive layer Being the second lead-in wire, the number of described second lead-in wire is identical with the number of described second touch control electrode, and each second Lead-in wire electrically connects with one second touch control electrode;Wherein, described first touch control electrode and described second touch control electrode It is respectively used to obtain information and the information of Y-axis coordinate of X-axis coordinate.
Wherein in an embodiment, described contact panel also includes that ultraviolet glue-line, described ultraviolet glue-line are located at On described transparent substrates one surface, and cover described viewing area and described non-visible area territory, described ultraviolet glue Layer is provided with latticed groove away from the surface of described transparent substrates, is filled with conduction material in described latticed groove Material, the conductive material being filled in described latticed groove constitutes described electrode pattern and described lead-in wire;
Or, described contact panel also includes that ultraviolet glue-line, described ultraviolet glue-line are located at described transparent substrates one On surface, and covering described viewing area and described non-visible area territory, described ultraviolet glue-line is away from described transparent The surface of substrate is provided with latticed groove, and described latticed groove is positioned at described viewing area, described latticed Being filled with conductive material in groove, the conductive material being filled in described latticed groove constitutes described electrode figure Case;Described lead-in wire is located on the described ultraviolet glue-line surface away from described transparent substrates, and be positioned at described non-can Viewed area.
Wherein in an embodiment, described contact panel also includes the second transparent photosensitive resin layer, described Two transparent photosensitive resin layers have relative first surface and second surface, and described first surface is affixed on described In bright substrate, described second surface has been embedded in electrical-conductive nanometer silk thread, embeds the conduction in described second surface Nanometer silk thread is cross-linked to form described conductive layer, described conductive layer be patterned formation described electrode pattern and Described lead-in wire;
Or, described contact panel also includes the second transparent photosensitive resin layer, described second transparent feel photopolymer resin Layer has relative first surface and second surface, and described first surface is affixed in described transparent substrates, described Second surface has been embedded in electrical-conductive nanometer silk thread, and described electrical-conductive nanometer silk thread is positioned at described viewing area, embeds Electrical-conductive nanometer silk thread in described second surface is cross-linked to form conduction region, and described conduction region is patterned shape Become described electrode pattern;Described lead-in wire is located at described second transparent photosensitive resin layer away from described transparent substrates On surface, and it is positioned at described non-visible area territory.
The manufacture method of a kind of contact panel, comprises the steps:
Thering is provided and partly become product, described half becomes product to include that transparent substrates and conductive layer, described transparent substrates have Viewing area and non-visible area territory, described non-visible area territory is provided with the binding for binding with flexible PCB District, described conductive layer is located on described transparent substrates one surface, including electrode pattern and lead-in wire, described electrode Pattern is positioned on described viewing area, for obtaining the coordinate information of touch point, and described lead-in wire and described electrode Pattern connects, for the coordinate information that described electrode pattern obtains is spread out of by flexible PCB, wherein, One end that described lead-in wire is connected with described electrode pattern is the first end, and the other end is the second end, described second end It is positioned at described binding district;
Pending film, described pending film is provided to include hypothallus, described hypothallus is affixed on described conductive layer On surface away from described transparent substrates, wherein, described hypothallus is the transparent photosensitive resin layer of semi-solid preparation;
Thering is provided light shield, described light shield is preset with pattern district, the pattern in described pattern district and described binding district Pattern is identical or complementary, and described light shield is placed in the described hypothallus side away from described conductive layer, and successively It is exposed processing and development treatment, obtains the intermediate products with the breach corresponding to binding district;And
Described intermediate products are carried out cured, i.e. obtains contact panel.
Wherein in an embodiment, described hypothallus is being affixed on described conductive layer away from described transparent substrates Surface on during, use roller hot pressing mode described hypothallus is affixed on described conductive layer away from institute State on the surface of transparent substrates.
Wherein in an embodiment, the actual conditions of described roller hot pressing is: the temperature of press mold is 80~120 DEG C, the speed of press mold is 0.5~5.0m/s, and the pressure of press mold is 0.1~0.5MPa.
Wherein in an embodiment, in exposure process, uv-exposure energy is 10mj~1000mj; During development treatment, developer solution be concentration be the weak base of 0.1wt%~2.0wt%;In cured During, ultra-violet curing is 500mj~1000mj.
Above-mentioned first transparent feel photopolymer resin laminating, on the side of conductive layer transparent substrates dorsad, is avoided that conduction Layer transparent substrates side dorsad is exposed outside, it is thus possible to effectively shield electrode pattern and lead-in wire, it is to avoid electrode figure Case is scraped off with lead-in wire or aoxidizes.
Above-mentioned manufacture method uses pending film to protect conductive layer as dielectric film, on very convenient dielectric film The making of pattern so that the making of dielectric film is the simplest.And use pending film to make first Transparent photosensitive resin layer, relative to first coating precuring again with the obtain semi-solid preparation first transparent photosensitive resin layer Manufacture method, it is possible to save one manufacturing process (precuring operation).And use pending film to make One transparent photosensitive resin layer, it is possible to preferably control the thickness of the first transparent photosensitive resin layer, and pending Hypothallus in film is the transparent photosensitive resin layer of semi-solid preparation, has the form determined, in cured process In, do not have the situation causing surface irregularity because of contraction, so that the first transparent photosensitive resin layer Thickness uniform, surfacing, be not likely to produce and cause because of diffraction of light visually seeing showing of multicolour pattern As.
Accompanying drawing explanation
Fig. 1 is the structural representation of the contact panel of an embodiment;
Fig. 2 is the structural representation of the transparent substrates in Fig. 1;
Fig. 3 is the sectional view of the transparent substrates in Fig. 1;
Fig. 4 is conductive layer and the structural representation of the second transparent photosensitive resin layer;
Fig. 5 is conductive layer and the profile of the second transparent photosensitive resin layer;
Fig. 6 is the conductive layer in another embodiment and the profile of the second transparent photosensitive resin layer;
Fig. 7 is the profile of the transparent substrates in another embodiment and ultraviolet glue-line;
Fig. 8 is to fill the schematic diagram after conductive material forms conductive layer in the figure 7;
Fig. 9 is the structural representation of the latticed groove constituted for unit with rhombus;
Figure 10 is the structural representation of the latticed groove constituted for unit with regular hexagon;
Figure 11 is the structural representation of the latticed groove constituted for unit with square;
Figure 12 is the structural representation of the latticed groove being made up of irregular unit;
Figure 13 is the profile of the pending film for making the first transparent photosensitive resin layer;
Figure 14 is the schematic diagram of the roller heat-press step during making the first transparent photosensitive resin layer;
Figure 15 is the schematic diagram of the step of exposure during making the first transparent photosensitive resin layer;
Figure 16 is the schematic diagram of the development step during making the first transparent photosensitive resin layer;
Figure 17 is the schematic diagram of the curing schedule during making the first transparent photosensitive resin layer;
Figure 18 is the profile of the pending film for making the second transparent photosensitive resin layer and conductive layer;
Figure 19 is showing of the roller heat-press step during making the second transparent photosensitive resin layer and conductive layer It is intended to.
Detailed description of the invention
Below in conjunction with the accompanying drawings and contact panel and preparation method thereof is described further by specific embodiment.
As it is shown in figure 1, the contact panel 10 of an embodiment, including transparent substrates 100, conductive layer 200 And the first transparent photosensitive resin layer 300.
As in figure 2 it is shown, transparent substrates 100 has viewing area 110 and non-visible area territory 120, non-visible area Territory 120 is provided with the binding district 130 for binding with flexible PCB.
Contact panel 10 needs have cover sheet.In the present embodiment, transparent substrates 100 namely touch-control The cover sheet of panel 10.Namely transparent substrates 100 has relative touch-surface 140 and load-bearing surface 150. Wherein, the case hardness of touch-surface 140 is more than or equal to 3H (3H is pencil hardness grade), it is thus possible to have Effect avoids scratch.Being appreciated that in other embodiments, contact panel 10 can also include folding successively and sets The transparent photosensitive resin layer of cover sheet, transparent substrates, conductive layer and first, namely transparent substrates not as The cover sheet of contact panel 10, now transparent substrates can be PET film layer, transparent photosensitive resin layer (with The material of the first transparent photosensitive resin layer is identical) etc..
Traditional contact panel 10 generally use strengthening glass as cover sheet, namely traditional cover sheet For rigid cover plate, and rigid, it is impossible to bending, therefore cannot meet such as intelligent watch on the horizon Deng the wearable device demand to flexible touch screen.In the present embodiment, transparent substrates 100 is flexible cover Plate.Being appreciated that in other embodiments, transparent substrates 100 can also be for strengthening glass.
Further, in the present embodiment, as it is shown on figure 3, transparent substrates 100 includes plastic rubber substrate 160 And it is located at the hardening coat 170 on plastic rubber substrate 160 surface, the table of hardening coat 170 plastic rubber substrate 160 dorsad Face is touch-surface 140, and the surface of plastic rubber substrate 160 hardening coat 170 dorsad is load-bearing surface 150.Its In, the thickness of plastic rubber substrate 160 is 0.1~0.3mm, and the thickness of hardening coat 170 is less than 0.05mm.Tool Body, plastic rubber substrate 160 is PET (polyethylene terephthalate, polyethylene terephthalate) Film material, PC (Polycarbonate, Merlon) film material and PMMA (PolymethylMethacrylate, Polymethyl methacrylate) one or more in film material are combined.Hardening coat 170 be frp layer, two The mixing chopped fiber of silicon oxide layer or carbon fiber and glass fibre.
In other embodiments, transparent substrates 100 can be the plastic rubber substrate that a surface is hardened, The hardened surface of plastic rubber substrate is touch-surface 140, and another surface is load-bearing surface 150.Wherein, The thickness of transparent substrates 100 is 0.1~0.3mm.Concrete, plastic rubber substrate can be PET film material, PC film One or more in material and PMMA film material are combined.
Further, in the present embodiment, the transmitance of transparent substrates 100 is more than or equal to 90%, haze value Less than or equal to 1%.Concrete, in the present embodiment, the thickness of transparent substrates 100 is 0.1mm, passes through Rate is more than 91%, and haze value is less than 0.55%.
As shown in Fig. 1 and Fig. 4, conductive layer 200 is located on the load-bearing surface 150 of transparent substrates 100, bag Include electrode pattern 210 and lead-in wire 220.Electrode pattern 210 is positioned on viewing area 110, is used for obtaining touch The coordinate information of point.Lead-in wire 220 is connected with electrode pattern 210, for the seat obtained by electrode pattern 210 Mark information is spread out of by flexible PCB.Wherein, one end of being connected with electrode pattern 210 of lead-in wire 220 are the One end 222, the other end is the second end 224, and the second end 224 is positioned at binding district 130.
First transparent photosensitive resin layer 300 is located on the conductive layer 200 surface away from transparent substrates 100, and The edge of the first transparent photosensitive resin layer 300 self-induced transparency substrate 100 caves in and forms breach 310, so that second End 224 exposes.Wherein, the thickness of the first transparent photosensitive resin layer 300 is 1~5 micron, and preferably 2.5 is micro- Rice.
Above-mentioned first transparent photosensitive resin layer 300 is affixed on the side of conductive layer 200 transparent substrates 100 dorsad, It is avoided that conductive layer 200 transparent substrates 100 side dorsad is exposed outside, it is thus possible to effectively shield electrode pattern 210 with lead-in wire 220, it is to avoid electrode pattern 210 220 is scraped off with going between or aoxidizes.
In the present embodiment, contact panel 10 is the touch screen of support multiple spot of mutual capacitance type.Concrete, When the number of conductive layer 200 is one layer, the electrode pattern of conductive layer 200 includes the first touch control electrode and Two touch control electrode, the number of the first touch control electrode and the number of the second touch control electrode and with lead-in wire 220 number Mesh is identical, and each lead-in wire 220 electrically connects with one first touch control electrode or one second touch control electrode.Wherein, One touch control electrode and the second touch control electrode are respectively used to obtain information and the information of Y-axis coordinate of X-axis coordinate.
When the number of conductive layer 200 is two-layer, the respectively first conductive layer and the second conductive layer.Transparent base The end the 100, first conductive layer, the second conductive layer and the first transparent photosensitive resin layer 300 are cascading, and First conductive layer and the second conductive layer mutually insulated.The electrode pattern of the first conductive layer includes the first touch control electrode, The lead-in wire of the first conductive layer is the first lead-in wire.The number of the first lead-in wire and the number of the first touch control electrode are identical, Each first lead-in wire electrically connects with one first touch control electrode.The electrode pattern of the second conductive layer includes the second touch-control Electrode, the lead-in wire of the second conductive layer is the second lead-in wire.The number of the second lead-in wire and the number of the second touch control electrode Identical, each second lead-in wire electrically connects with one second touch control electrode.Wherein, the first touch control electrode and second is touched Control electrode is respectively used to obtain information and the information of Y-axis coordinate of X-axis coordinate.
Being appreciated that in other embodiments, contact panel 10 can also be the support single-point of mutual capacitance type Touch screen.
As shown in Figures 4 and 5, in the present embodiment, contact panel 10 also includes the second transparent photosensitive tree Lipid layer 400.Second transparent photosensitive resin layer 400 has relative first surface 410 and second surface 420, First surface 410 is affixed in transparent substrates 100, and second surface 420 has been embedded in electrical-conductive nanometer silk thread 230, And electrical-conductive nanometer silk thread 230 is positioned at viewing area 110.Embed the electrical-conductive nanometer silk thread in second surface 420 230 are cross-linked to form conduction region 240, and conduction region 240 is patterned formation electrode pattern 210.Lead-in wire 220 It is located on the second transparent photosensitive resin layer 400 surface away from transparent substrates 100, and is positioned at non-visible area territory 120。
Namely in the present embodiment, after being initially formed electrode pattern 210, then form lead-in wire 220.Concrete, The generation type of electrode pattern 210 is discussed in detail at further part.Formed after electrode pattern 210, then the On the region that two transparent photosensitive resin layers 400 are corresponding with non-visible area territory 120, use the mode of silk screen printing Printing elargol obtains going between 220.
As shown in Figure 6, in other embodiments, contact panel 10 also includes the second transparent photosensitive resin layer 400.Second transparent photosensitive resin layer 400 has relative first surface 410 and a second surface 420, and first Surface 410 is affixed in transparent substrates 100, and second surface 420 has been embedded in electrical-conductive nanometer silk thread 230.Embed Electrical-conductive nanometer silk thread 230 in second surface 420 is cross-linked to form conductive layer 200, and conductive layer 200 is schemed Caseization forms electrode pattern 210 and lead-in wire 220.Namely electrode pattern 210 concurrently forms with lead-in wire 220, this Time lead-in wire 220 the most transparent with electrode pattern 210, from without the both sides of the edge off-set oil at cover sheet Layer of ink, to cover opaque lead-in wire 220, such that it is able to obtain the contact panel of Rimless.
In the present embodiment, electrical-conductive nanometer silk thread 230 is electrical-conductive nanometer filamentary silver line.Electrical-conductive nanometer silk thread 230 A length of 30~50 μm, a diameter of the 30 of electrical-conductive nanometer silk thread 230~50nm.Partially electronically conductive nanometer silk thread 230 expose second surface 420.
Because electrical-conductive nanometer silk thread 230 is Nano grade (Nano grade, opaque, naked eyes are invisible), when depositing When outside voltage difference and steam, the chemical property of electrical-conductive nanometer silk thread 230 is the most unstable, quilt easily occurs The problem that oxidation or generation migrate, and then cause the electric conductivity of conductive layer 200 to reduce, even open The problems such as road.And the first transparent photosensitive resin layer 300 can effectively protect electrical-conductive nanometer silk thread 230, it is to avoid above-mentioned The generation of problem.
Owing to ITO enbrittles, it is impossible to bending, and electrical-conductive nanometer silk thread 230 has preferable pliability, Can bend.And the first transparent photosensitive resin layer 300 and the second transparent photosensitive resin layer 400 also have soft Toughness, it is possible to bending.When the cover sheet that transparent substrates 100 is contact panel 10, and transparent substrates 100 During for flexible cover plate, above-mentioned contact panel 10 has flexibility, can meet such as intelligent watch on the horizon etc. The wearable device demand to flexible touch screen.
As shown in Figures 7 and 8, in other embodiments, contact panel 10 also includes ultraviolet glue-line 500, Ultraviolet glue-line 500 is for the replacement as the second transparent photosensitive resin layer 400.Ultraviolet glue-line 500 is located at On bright substrate 100 1 surface, and cover viewing area 110 and non-visible area territory 120.Ultraviolet glue-line 500 is remote It is provided with latticed groove 510 from the surface of transparent substrates 100, in latticed groove 510, is filled with conductive material, The conductive material being filled in latticed groove 510 constitutes electrode pattern 210 and lead-in wire 220.Namely electrode figure Case 210 is adopted with lead-in wire 220 and is concurrently formed in the same way.
Wherein, during forming electrode pattern 210 and lead-in wire 220, the mode of impressing is first used to be formed Latticed groove 510, then toward latticed groove 510 using the mode of silk screen printing or coating be packed into Conductive material forms electrode pattern 210 and lead-in wire 220.
In other embodiments, contact panel 10 also includes that ultraviolet glue-line 500, ultraviolet glue-line 500 are located at On transparent substrates 100 1 surface, and cover viewing area 110 and non-visible area territory 120.Ultraviolet glue-line 500 Surface away from transparent substrates 100 is provided with latticed groove 510, and latticed groove 510 is positioned at viewing area 110, the conductive material being filled in latticed groove 510 constitutes electrode pattern 210.Purple is located at by lead-in wire 220 On the outer glue-line 500 surface away from transparent substrates 100, and it is positioned at 120 non-visible area territories.
Namely after being initially formed electrode pattern 210, then form lead-in wire 220.After forming electrode pattern 210, at purple On the region that outer glue-line 500 is corresponding with non-visible area territory 120, use the mode of silk screen printing to print elargol and obtain To lead-in wire 220.
Wherein, latticed groove 510 can be made up of rules unit, it is also possible to is made up of irregular unit. As shown in Fig. 9-Figure 12, the latticed groove 510 in Fig. 9 is made up of diamond-shaped element, the grid in Figure 10 Shape groove 510 is made up of regular hexagon unit, and the latticed groove 510 in Figure 11 is made up of square shaped cells, Latticed groove 510 in Figure 10 is made up of irregular unit.
In the present embodiment, conductive material be nanoscale metal particles or powder, CNT, Graphene, PEDOT (polymer of 3,4-ethylenedioxy thiophene monomer) etc..Wherein, nano level metal can be nanometer gold Belong to silver, nano-metallic copper, nano metal aluminum, Nanoalloy etc..
In the present embodiment, also provide for the manufacture method of a kind of contact panel, comprise the steps:
Step S610, it is provided that partly become product.As shown in FIG. 13 and 14, half becomes product 700 to include transparent Substrate and conductive layer, transparent substrates has viewing area and non-visible area territory, non-visible area territory be provided with for With the binding district of flexible PCB binding, conductive layer is located on transparent substrates one surface, including electrode pattern and Lead-in wire, electrode pattern is positioned on viewing area, for obtaining the coordinate information of touch point, lead-in wire and electrode figure Case connect, for by electrode pattern obtain coordinate information spread out of by flexible PCB, wherein, lead-in wire and One end that electrode pattern connects is the first end, and the other end is the second end, and the second end is positioned at binding district.
Step S620, it is provided that pending film.As shown in FIG. 13 and 14, pending film 800 includes substrate Layer 810 and two protecting film 820, two protecting film 820 are respectively arranged on two surfaces that hypothallus 810 is relative.Remove After removing two protecting film 820, hypothallus 810 is affixed on conductive layer away from the surface of transparent substrates, wherein, Hypothallus 810 is the transparent photosensitive resin layer of semi-solid preparation.
In the present embodiment, use the mode of roller hot pressing that hypothallus 810 is affixed on conductive layer away from transparent On the surface of substrate.Wherein, roller 20 at the uniform velocity moves along certain orientation, and the actual conditions of roller hot pressing is: The temperature of press mold is 80~120 DEG C, and the speed of press mold is 0.5~5.0m/s, and the pressure of press mold is 0.1~0.5MPa.
Wherein, the transparent feel photopolymer resin of semi-solid preparation includes each component of following parts by weight: 60~80 parts of film forming trees Fat, 1~10 part of photosensitizer, 5~20 parts of solvents, 0.1~5 part of stabilizer, 0.1~5 part of levelling agent, 0.1~5 part Defoamer, the number sum of each component is 100.
The transparent feel photopolymer resin of solidification includes each component of following parts by weight: 30~50 parts of film-forming resins, 1~10 Part photosensitizer, 0.1~5 part of stabilizer, 0.1~5 part of levelling agent and 0.1~5 part of defoamer.
Film-forming resin is polymethyl methacrylate, linear phenolic resin, epoxy resin .beta.-methylacrylic acid, propylene Acid esters, vinyl ethers and at least one in M Cr.Photosensitizer be diazobenzene quinone, diazo naphthoquinone ester, Polyvinyl cinnamate, poly-Cortex Cinnamomi fork malonic acid glycol ester polyester, aromatic diazo salt, aromatic sulfonium salts, Aromatic iodonium salt and at least one in ferrocene salt.Solvent be oxolane, methyl ethyl ketone, Ketohexamethylene, Propylene glycol, N,N-dimethylformamide, ethyl cellosolve acetate, ethyl acetate and butyl acetate, toluene, Dimethylbenzene, tripropylene glycol diacrylate, trimethylolpropane trimethacrylate, ethoxylation trihydroxy methyl Propane triacrylate, dipentaerythrite six acrylate, 1,6-HD methoxyl group mono acrylic ester and second At least one in epoxide neopentyl glycol methoxyl group mono acrylic ester.Stabilizer is hydroquinone, to methoxy Base phenol, 1,4-benzoquinone, 2,6 1 di-t-butyl cresols, phenothiazine and at least one in anthraquinone.Levelling agent For polyacrylate, acetate butyrate fiber, nitrocellulose and at least one in polyvinyl butyral resin. Defoamer is at least one of phosphate ester, fatty acid ester and organosilicon.
Wherein, the semi-cured state of transparent feel photopolymer resin has a photosensitive property, and the solidification of transparent feel photopolymer resin Shape body does not have photosensitive property.
Step S630, it is provided that light shield.As shown in figure 15, light shield 900 is preset with pattern district 910, pattern district Pattern on 910 is identical or complementary with the pattern in binding district.Light shield 900 is placed in hypothallus away from conductive layer Side, and be exposed successively processing and development treatment, obtain the centre with the breach corresponding to binding district Product.
In the present embodiment, the transparent feel photopolymer resin forming hypothallus 810 is negative photosensitive resin, i.e. light According to place insoluble in developer solution.Owing to not dissolving in developer solution at illumination, if wanting retention criteria pattern, should use There is the light shield 900 in the pattern district identical with standard pattern.Figure 15 is exposure process, uses ultraviolet light to irradiate Light shield 900 is away from the side of hypothallus 810, and wherein, the part that hypothallus 810 is irradiated by light is area of illumination 812, the part not being irradiated by light is non-area of illumination 814.Figure 16 is developing process, non-area of illumination 814 quilt Remove.
Wherein, in exposure process, uv-exposure energy is 10mj~1000mj.Mistake in development treatment Cheng Zhong, developer solution be concentration be the weak base aqueous solution of 0.1wt%~2.0wt%.Weak base be potassium carbonate, sodium carbonate, Organic amine etc..
Being appreciated that in other embodiments, the transparent feel photopolymer resin forming hypothallus 810 can also be It is dissolved in developer solution at positive type photosensitive, i.e. illumination.Owing to being dissolved in developer solution at illumination, if mark to be retained Quasi-pattern, should use the light shield 900 with the pattern district complementary with standard pattern.
Intermediate products are carried out cured by step S640, and (namely it is saturating to obtain first i.e. to obtain contact panel Bright photosensitive resin layer).
In the present embodiment, the mode of ultraviolet lighting is used to carry out cured.If Figure 17 is at solidification Reason process, wherein, ultra-violet curing is 500mj~1000mj.
Above-mentioned manufacture method uses pending film to protect conductive layer as dielectric film, on very convenient dielectric film The making of pattern so that the making of dielectric film is the simplest.And use pending film to make first Transparent photosensitive resin layer, relative to first coating precuring again with the obtain semi-solid preparation first transparent photosensitive resin layer Manufacture method, it is possible to save one manufacturing process (precuring operation).And use pending film to make One transparent photosensitive resin layer, it is possible to preferably control the thickness of the first transparent photosensitive resin layer, and pending Hypothallus in film is the transparent photosensitive resin layer of semi-solid preparation, has the form determined, in cured process In, do not have the situation causing surface irregularity because of contraction, so that the first transparent photosensitive resin layer Thickness uniform, surfacing, be not likely to produce and cause because of diffraction of light visually seeing showing of multicolour pattern As.
When contact panel includes the second transparent photosensitive resin layer, it is provided that transparent substrates and pending film.Such as figure Shown in 18 and Figure 19, pending film 12 includes body 11 and two protecting film 13, and two protecting film 13 set respectively On two surfaces that body 11 is relative.Body 11 includes hypothallus 14 and is interlocked by electrical-conductive nanometer silk thread 15 Connect the conductive layer 16 formed.Hypothallus 14 has relative connection surface 14a and finished surface 14b, leads Susceptance rice silk thread 15 embeds finished surface 14b, and wherein, hypothallus 14 has been embedded in electrical-conductive nanometer silk thread 15 Region be conduction region 14c, the region not being embedded with electrical-conductive nanometer silk thread 15 is nonconductive regions 14d.Base Matter layer 14 is the transparent photosensitive resin layer of semi-solid preparation.After removing two protecting film 13, body 11 is located at transparent In substrate 100, and connection surface 14a is near transparent substrates.
In the present embodiment, partially electronically conductive nanometer silk thread 15 exposes finished surface 14b.By roller hot pressing Mode body 11 is located in transparent substrates.Nonconductive regions 14d is equivalent to tack coat by conduction region 14c even It is connected in transparent substrates.
Conduction region 14c is being exposed successively process, development treatment and cured, these processes and shape Become essentially identical, the different pattern district that only light shield has during the first transparent photosensitive resin layer Pattern.When being exposed successively conduction region 14c processing, the pattern in mask pattern district and electrode pattern Identical or complementary;Or the pattern that the pattern in mask pattern district is constituted with electrode pattern and lead-in wire is identical or complementary.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes more concrete and detailed, But therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that, for this area Those of ordinary skill for, without departing from the inventive concept of the premise, it is also possible to make some deformation and Improving, these broadly fall into protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be with appended Claim is as the criterion.

Claims (10)

1. a contact panel, it is characterised in that including:
Transparent substrates, has viewing area and non-visible area territory, and described non-visible area territory is provided with for soft Property circuit board binding binding district;
Conductive layer, is located on described transparent substrates one surface, including electrode pattern and lead-in wire, described electrode figure Case is positioned on described viewing area, for obtaining the coordinate information of touch point, and described lead-in wire and described electrode figure Case connects, for the coordinate information that described electrode pattern obtains is spread out of by flexible PCB, wherein, and institute Stating the one end being connected with described electrode pattern that goes between is the first end, and the other end is the second end, described second end position In described binding district;And
First transparent photosensitive resin layer, is located on the described conductive layer surface away from described transparent substrates, and institute State the first transparent photosensitive resin layer to cave in formation breach from the edge of described transparent substrates, so that described second End exposes.
Contact panel the most according to claim 1, it is characterised in that described transparent substrates is described touching The cover sheet of control panel, described transparent substrates has relative touch-surface and load-bearing surface, described touch The case hardness on surface is more than or equal to 3H, and described conductive layer is located on described load-bearing surface.
Contact panel the most according to claim 2, it is characterised in that described transparent substrates is flexible cover Plate;
Described transparent substrates includes plastic rubber substrate and is located at the hardening coat on described plastic rubber substrate surface, described hardening The surface of the most described plastic rubber substrate of coating is described touch-surface, and the most described hardening of described plastic rubber substrate is coated with Layer surface be described load-bearing surface, wherein, the thickness of described plastic rubber substrate is 0.1~0.3mm, described firmly Change the thickness of coating less than 0.05mm;
Or, described transparent substrates is the plastic rubber substrate that a surface is hardened, and described plastic rubber substrate is through hard The surface that change processes is described touch-surface, and another surface is described load-bearing surface, wherein, and described plastic cement base The thickness of material is 0.1~0.3mm.
Contact panel the most according to claim 1, it is characterised in that described contact panel is mutual capacitance The touch screen of the support multiple spot of formula;
The number of described conductive layer is one layer, and the electrode pattern of described conductive layer includes the first touch control electrode and Two touch control electrode, the number of described first touch control electrode and the number of described second touch control electrode and with described The number of lead-in wire is identical, each lead-in wire and one first touch control electrode or the electrical connection of one second touch control electrode, wherein, Described first touch control electrode and described second touch control electrode are respectively used to obtain the information of X-axis coordinate and Y-axis is sat Target information;
Or, the number of described conductive layer is two-layer, the respectively first conductive layer and the second conductive layer;Described Transparent substrates, described first conductive layer, described second conductive layer and described first transparent photosensitive resin layer are successively Stacking is arranged, and described first conductive layer and described second conductive layer mutually insulated;Described first conductive layer Electrode pattern includes that the first touch control electrode, the lead-in wire of described first conductive layer are the first lead-in wire, and described first draws The number of line is identical with the number of described first touch control electrode, each first lead-in wire and one first touch control electrode electricity Connect;The electrode pattern of described second conductive layer includes the second touch control electrode, the lead-in wire of described second conductive layer Being the second lead-in wire, the number of described second lead-in wire is identical with the number of described second touch control electrode, and each second Lead-in wire electrically connects with one second touch control electrode;Wherein, described first touch control electrode and described second touch control electrode It is respectively used to obtain information and the information of Y-axis coordinate of X-axis coordinate.
Contact panel the most according to claim 1, it is characterised in that described contact panel also includes purple Outer glue-line, described ultraviolet glue-line is located on described transparent substrates one surface, and is covered described viewing area and institute Stating non-visible area territory, described ultraviolet glue-line is provided with latticed groove away from the surface of described transparent substrates, described Being filled with conductive material in latticed groove, the conductive material being filled in described latticed groove constitutes described Electrode pattern and described lead-in wire;
Or, described contact panel also includes that ultraviolet glue-line, described ultraviolet glue-line are located at described transparent substrates one On surface, and covering described viewing area and described non-visible area territory, described ultraviolet glue-line is away from described transparent The surface of substrate is provided with latticed groove, and described latticed groove is positioned at described viewing area, described latticed Being filled with conductive material in groove, the conductive material being filled in described latticed groove constitutes described electrode figure Case;Described lead-in wire is located on the described ultraviolet glue-line surface away from described transparent substrates, and be positioned at described non-can Viewed area.
Contact panel the most according to claim 1, it is characterised in that described contact panel also includes Two transparent photosensitive resin layers, described second transparent photosensitive resin layer has relative first surface and second surface, Described first surface is affixed in described transparent substrates, and described second surface has been embedded in electrical-conductive nanometer silk thread, embedding Entering the electrical-conductive nanometer silk thread in described second surface and be cross-linked to form described conductive layer, described conductive layer is schemed Case forms described electrode pattern and described lead-in wire;
Or, described contact panel also includes the second transparent photosensitive resin layer, described second transparent feel photopolymer resin Layer has relative first surface and second surface, and described first surface is affixed in described transparent substrates, described Second surface has been embedded in electrical-conductive nanometer silk thread, and described electrical-conductive nanometer silk thread is positioned at described viewing area, embeds Electrical-conductive nanometer silk thread in described second surface is cross-linked to form conduction region, and described conduction region is patterned shape Become described electrode pattern;Described lead-in wire is located at described second transparent photosensitive resin layer away from described transparent substrates On surface, and it is positioned at described non-visible area territory.
7. the manufacture method of a contact panel, it is characterised in that comprise the steps:
Thering is provided and partly become product, described half becomes product to include that transparent substrates and conductive layer, described transparent substrates have Viewing area and non-visible area territory, described non-visible area territory is provided with the binding for binding with flexible PCB District, described conductive layer is located on described transparent substrates one surface, including electrode pattern and lead-in wire, described electrode Pattern is positioned on described viewing area, for obtaining the coordinate information of touch point, and described lead-in wire and described electrode Pattern connects, for the coordinate information that described electrode pattern obtains is spread out of by flexible PCB, wherein, One end that described lead-in wire is connected with described electrode pattern is the first end, and the other end is the second end, described second end It is positioned at described binding district;
Pending film, described pending film is provided to include hypothallus, described hypothallus is affixed on described conductive layer On surface away from described transparent substrates, wherein, described hypothallus is the transparent photosensitive resin layer of semi-solid preparation;
Thering is provided light shield, described light shield is preset with pattern district, the pattern in described pattern district and described binding district Pattern is identical or complementary, and described light shield is placed in the described hypothallus side away from described conductive layer, and successively It is exposed processing and development treatment, obtains the intermediate products with the breach corresponding to binding district;And
Described intermediate products are carried out cured, i.e. obtains contact panel.
The manufacture method of contact panel the most according to claim 7, it is characterised in that by described base Matter laminating, during described conductive layer is away from the surface of described transparent substrates, uses the side of roller hot pressing Described hypothallus is affixed on the described conductive layer surface away from described transparent substrates by formula.
The manufacture method of contact panel the most according to claim 8, it is characterised in that described roller heat The actual conditions of pressure is: the temperature of press mold is 80~120 DEG C, and the speed of press mold is 0.5~5.0m/s, press mold Pressure is 0.1~0.5MPa.
The manufacture method of contact panel the most according to claim 7, it is characterised in that at exposure During reason, uv-exposure energy is 10mj~1000mj;During development treatment, developer solution is concentration Weak base for 0.1wt%~2.0wt%;During cured, ultra-violet curing is 500mj~1000mj.
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