201102701 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種導電板及應用其之觸控板，特別是一種具有 圖案化導電膜的導電板及應用其之觸控板。 【先前技術】 近年來’感觸式之人機介面，如：觸控面板(Touch Panel)，已 被廣泛地應用至各式各樣之電子產品中，如：全球定位夺统 (GPS)、個人數位助理(PDA)、行動電話(cellularph〇ne)及掌上型電 月自(Hand-held PC)等，以取代傳統之輸入裝置(如：鍵盤及滑鼠等）， 此一設計上之大幅改變，不僅提昇了該等電子裝置之人機介面親 和性，更因省略了傳統輸入裝置，而騰出更多空間，供安裝大型 顯示面板，方便使用者瀏覽資料。 觸控面板包含上導電板與下導電板，其所使用之導電板種類《 括具有氧化鹏(ITO)導電層之透明導電玻軌翻導電塑膠』 材。 八201102701 VI. Description of the Invention: [Technical Field] The present invention relates to a conductive plate and a touch panel using the same, and more particularly to a conductive plate having a patterned conductive film and a touch panel using the same. [Prior Art] In recent years, the touch-sensitive human-machine interface, such as the touch panel, has been widely used in a wide range of electronic products, such as: Global Positioning (GPS), personal Digital assistants (PDAs), mobile phones (cellularph〇ne), and handheld-type handheld devices (Hand-held PCs) to replace traditional input devices (such as keyboards and mice), this design has changed dramatically. It not only enhances the human-machine interface affinity of these electronic devices, but also omits more traditional space for the installation of large display panels for users to browse data. The touch panel comprises an upper conductive plate and a lower conductive plate, and the type of the conductive plate used is a transparent conductive glass-turned conductive plastic material having an ITO conductive layer. Eight
目刖取#使㈣翻導電膜觀P織t CGndu㈣腕， TCF)的主要材質以铜錫氧化物（随咖版⑽ y她，Sn叫氧化鋅㈤e0xide，蝴科主^ 是締紐_爾電性，服細導電基板大多 疋在基板上形成ITO透明導電膜。 _ITO透料電薄膜_導f板在基材彎鱗，I上的IT〇 生變形，絲導致™透_電= 明導電_製程方法繁導電薄膜的的導電板因JT0透 ’、 句勻度控制不易和錮碟含量短缺等問 201102701 題，而無法降低導電板的成本。 的材料成了最主要的課題。 因此尋求替代ITO且具透明導電 【發明内容】 月d提供T.種‘電板及應用其之觸控板，用以避免因銦錫氧化 =η Γ Xlde ’IT0)透日月導電薄膜製程方法繁複、均勻度 控制^易和銦礦含量短缺等問題，而無法降低導電板的成本。目刖取# (4) Turn the conductive film view P woven t CGndu (four) wrist, TCF) The main material is copper tin oxide (with coffee version (10) y her, Sn is called zinc oxide (five) e0xide, the butterfly family ^ is the contraction _ er Sex, the fine conductive substrate is mostly formed on the substrate to form an ITO transparent conductive film. _ITO transmissive electric film _ guide f plate in the substrate curved scale, I on the IT deformation, the wire leads to TM penetration _ electricity = Ming conduction _ The conductive board of the conductive film is difficult to reduce the cost of the conductive plate due to JT0 penetration, the difficulty of controlling the uniformity of the sentence, and the shortage of the content of the disk. The material has become the most important subject. And transparent conductive [invention content] month d provides T. kind of 'electric board and its application of touchpad, in order to avoid the indium tin oxide oxidation = η Γ Xlde 'IT0) through the sun and moon conductive film process method complexity, uniformity Controlling the shortage of content and indium ore, etc., and not reducing the cost of the conductive plate.
為了達到上述的目的，本發明揭露 膠體與導電薄膜。 槪/、匕3基板 其中膠體位於基板上，用以使導電薄膜承載於基板上。導電 薄膜與膠财之-係_圖案化處理。 1上述之可係具異向性導電細。導電細可包含有 稷個奈米單凡。該等奈米單元可為奈米碳管或奈米粒子。上述 之圖案化處理過程可透過凹凸轉印法、濕侧法、乾侧法、雷 射圖案化法、刮除法或膠帶撕除法。 於此應用本發明所揭露之導電板的觸控板可包含第一導電 板與第二導電板。其巾第—導電板與第二導電板縣上述之導電 板結構。 根據本發明所揭露之—種導電板及顧其之觸控板 ，藉由將膠 -或導電細先行圖案化處理，以在導電薄膜上形減測線路， 來取代習知觸控板的ΙΤ0導電板，達成降低導電板成本的功效。 有關本發月的特徵與實作，茲配合圖示作最佳實施例詳細說明 如下。 【實施方式】 201102701 請參照「第1A圖」至「第1D圖」，說明本發明導電板—第 一具體實施例。其中「第1A圖」與「第1B圖」分別說明圖案化 後之導電板的俯視結構圖與剖面結構圖。「第1C圖」與「第IQ 圖」分別說明加入導電材之導電板的俯視結構圖與剖面結構圖。 於「第1A圖」與「第1C圖」中虛線aa，係為一剖面線。 首先參照「第1A圖」與「第1B圖」，於本實施例中，導電 板的製作方法中的第一步驟係提供一基板1〇〇與一膠體2〇〇。其中 膠體200形成於基板1〇〇上。 • i述之基板腦可為一透明材質基板或-不透明材質基板。 透明材質基板可&含綱紐、S分子透明㈣基板。其中 高分子透明材質基板可為包含有聚甲基丙烯酸甲'酯 (Polymethylmethacrylate ’ PMMA )、聚對苯二甲酸乙二酉旨 (Polyethylene terep_ate ’ pET )或聚碳酸酯樹脂 (P〇lycarbonate，P C)之基板。然:，在本發明之基板為高分子透 明材質基板之情況下，高分子透日雜錢不社述例為限，亦可 為其他局分子透明材質。 籲不透明材質基板可為金屬基板、半導體基板、印刷電路板與 塑膠基板。其中塑膠基板可為本身具色彩之塑膠基板或係在透明 基板外塗佈色彩來形成。 上述將勝體200形成於基板1〇〇上的方法可透過印刷塗佈、 旋轉塗佈或滴定等方式將膠體·形成於基板腦上。 其中膠體2GG可依固化方式之不同馨用光固化膠、教固化 膠或光細輝。所翻化戦會受特定波⑽光線照射而 固化的賴，例如是料線硬倾（Ultw ) 固化膠則指會在某特定溫度朗以上的環境中賴 而、 201102701 所明的光-熱固化膠則指需要在某特定溫度範圍以上的環境中，同 時受特疋波長的光線照射而固化的膠體。此外，膠體2〇〇亦可選 用具導電性之膠·體，例如是導電高分子膠。In order to achieve the above object, the present invention discloses a colloid and a conductive film.槪/, 匕3 substrate The colloid is located on the substrate to support the conductive film on the substrate. Conductive film and plastic - system - patterned processing. 1 The above may be made of anisotropic conductive fine. The conductive thin can contain one nanometer. The nanocells can be carbon nanotubes or nanoparticles. The above patterning process can be carried out by a bump transfer method, a wet side method, a dry side method, a laser patterning method, a scraping method or a tape peeling method. The touch panel to which the conductive plate disclosed in the present invention is applied may include a first conductive plate and a second conductive plate. The towel-first conductive plate and the second conductive plate county have the above-mentioned conductive plate structure. According to the present invention, a conductive plate and a touch panel of the same type are used to replace the conventional touch panel by patterning the glue- or conductive fine pattern to form a subtractive line on the conductive film. The conductive plate achieves the effect of reducing the cost of the conductive plate. The features and implementations of this month are described in detail below with reference to the preferred embodiment. [Embodiment] 201102701 Please refer to "1A" to "1D" for explaining a conductive plate of the present invention - a first embodiment. "1A" and "1B" respectively illustrate the top view and cross-sectional structure of the patterned conductive plate. "1C" and "IQ" respectively show a top view and a cross-sectional view of a conductive plate to which a conductive material is added. The dotted line aa in "1A" and "1C" is a hatching. Referring first to "1A" and "1B", in the present embodiment, the first step in the method of fabricating the conductive plate provides a substrate 1 and a colloid 2 . The colloid 200 is formed on the substrate 1 . • The substrate brain described in i can be a transparent material substrate or an opaque material substrate. The transparent material substrate can be combined with the S-molecular transparent (four) substrate. The polymer transparent substrate may be composed of polymethylmethacrylate 'PMMA, Polyethylene terep_ate ' pET or polycarbonate resin (PC). The substrate. However, in the case where the substrate of the present invention is a polymer transparent material substrate, the polymer is not limited to the examples, and may be other molecular transparent materials. The opaque material substrate can be a metal substrate, a semiconductor substrate, a printed circuit board, and a plastic substrate. The plastic substrate may be formed by a plastic substrate having a color or a color applied to the outside of the transparent substrate. The method of forming the winning body 200 on the substrate 1 can form the colloid on the substrate brain by printing, spin coating or titration. Among them, the colloid 2GG can be used as a curing adhesive or a curing gel according to the curing method. The smashed sputum will be cured by the specific wave (10) light, for example, the hard line (Ultw) curing glue refers to the light-heat curing which will be in the environment above a certain temperature, 201102701 Glue refers to a colloid that needs to be cured in the environment above a certain temperature range and is exposed to light of a special wavelength. In addition, the colloidal body 2 can also be provided with a conductive gel body, such as a conductive polymer glue.
導電板的製作方法中的第二步驟係提供一導電薄膜300，並利 用膠體200使導電薄膜300承載於基板1〇〇上。詳言之，將導電 薄膜300設置於膠體200背對於基板1〇〇的一側表面1附近。因而， 當導電薄膜300承載於基板1〇〇上時，膠體2〇〇係存在於導電薄 膜遞與基板励之間。上述之導電薄膜3〇〇可以係經過拉伸處 理而具電異向性。導電薄膜300亦可包含有複數個奈米單元（圖 中未示）’且該特米單元大致呈現—特定方向排顺置，使該導 電薄膜具電異向性。上述之奈米單元可包含奈米碳管與奈米粒子 等。所謂的電異向性又稱導電異向性或稱電阻抗異向性，係不同 方向上具有不同的導電性質或電阻抗性質之謂。 導電板的製作方法中的第三步驟係對上述之導 , 行-圖案化處理。詳言之，圖案化處理的過程可透過凹凸轉印法 濕餘刻法、乾働j法、雷射隨化法、刮除法與膠帶撕除法等。 其中刮除法是直触刀#、搓刀等工具將膠體·表面不丨 要的導電薄膜3⑻部分刮除掉，只留下欲形成之圖案化導電 3〇〇 ;膠帶撕除法是郷帶_於賴絲不需要的導電薄月 3〇〇部分，當膠帶撕除時，膠帶上的黏膠會帶走膠體綱表面不; 要的導電薄膜綱部分，只留下欲形成之圖案化導電薄膜 ; | 射圖案化法是以雷射照射於膠體20峰面的導電薄膜細，由雷^ f接加熱財除所照射到的導電薄膜部分，藉由控制雷射日 5位置以留下欲形成之_化導電_胤.乾_法_钱亥 白是先行簡影製程的方式在導電_ 上留下圖案化㈣ 201102701 阻，再/刀別以離子撞擊或液體钱刻的方式將導電薄膜· 膜3°0;凹凸轉印法是利用設計的模具將絕 =細靡¥電_ 上，讓導膜曝露出的部 為欲形成之瞧b導膜。S，在本發明之 圖案化的方式，圖荦化處理#;^7 μ、+、… ，电顯300 化處理。口茱化處理亚不以上述例為限’亦可為其他圖案 其他亦可在導電薄膜3〇〇尚未配置於膠體朋之一側 近時，先行將導電薄膜300圖案化。接著，將已圖案化的導電薄 膜300直接貼附於膠體期上，或是以轉印貼紙的方式，= 薄膜300轉印於勝體2〇〇上。 再參照「第1C圖」與「第1D圖」，導電板的製作方法中的 第四步驟係提供-導電材，並將導電材_電性連接導 3〇〇。其中導電材.可係一端位於導電薄膜上，另一端位於 基板100或膠H2〇〇上。導電材_可係為導電膠、導線、金屬 等具導電特性之材料。由於具電異向性之導電薄膜細因其本身 的電異向性特性，在沿著特定方向上的電阻抗較小，在沿著相異 於特定方_電阻抗較大’目此可_導電材將流經圖案化 後的導電薄膜3〇0導5丨至其他方向。藉由導電材侧與圖案化後 的導電薄膜3⑻可具有以往具即導電義的導電板功效。 上述導電薄膜-300所形成的圖案之間的線距D係實質介於工 微米至1毫米，且線寬d係實質介於i微米至工毫米。 請合併參照「第2A圖」至「第2D圖」，說明本發明導電板 的-第二具體實施例。其中「第2A圖」與「第2β圖」分別說明 圖案化後之導電板的俯視結構圖與剖面結構圖。「第2C圖」與「第 2D圖」分別說明加入導電材之導電板的俯視結構圖與剖面結構 201102701 圖。於第2A圖」與「第2C圖」中虛線从，係為一剖面線。 首先請參照「第Μ圖」與「第2B圖」，於本實施例中， 電板的製作方法令的第-步驟係提供一基板1〇〇與一膠體 帽體勘職於基板勘上。其中基板勘娜體·同於第 弟一實施例’在此不作贅述。 弟 導電板的製作方法中的第二步驟係對上述之膠體進 圖案化處理。詳言之’圖案化處理的過程可透過凹凸轉印法、渴 侧法、乾侧法、雷棚案化法、刮除法娜帶撕除法等。The second step in the method of fabricating the conductive plate provides a conductive film 300, and the conductive film 300 is carried on the substrate 1 by the colloid 200. In detail, the conductive film 300 is disposed in the vicinity of the side surface 1 of the colloid 200 facing the substrate 1A. Therefore, when the electroconductive thin film 300 is carried on the substrate 1 , the colloid 2 is present between the electroconductive thin film and the substrate. The above-mentioned conductive film 3 can be subjected to stretching treatment to have electrical anisotropy. The conductive film 300 may also include a plurality of nano-cells (not shown) and the meta-units are substantially arranged to be aligned in a specific direction to make the conductive film electrically anisotropic. The above nano unit may include a carbon nanotube, a nano particle, or the like. The so-called electrical anisotropy, also known as conductive anisotropy or electrical anisotropy, has different electrical or electrical resistance properties in different directions. The third step in the method of fabricating the conductive plate is the above-described conduction, patterning, and patterning process. In detail, the process of patterning can be carried out through the concave and convex transfer method, the wet residual method, the dry method, the laser ionization method, the scraping method and the tape tearing method. The scraping method is a direct contact knife #, a trowel and the like to scrape off the conductive film 3 (8) which is not suitable for the surface of the gel, leaving only the patterned conductive 3 欲 to be formed; the tape tearing method is 郷 _ The conductive thin moon 3〇〇 part that is not needed by Laisi, when the tape is torn off, the adhesive on the tape will take away the surface of the colloid; the desired conductive film outline leaves only the patterned conductive film to be formed; The patterning method is a thin film of a conductive film which is irradiated onto the peak surface of the colloid 20 by a laser, and is irradiated with a portion of the conductive film which is irradiated by the thunder, and is controlled to be formed by controlling the position of the laser day 5 _ 导电 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ 3°0; the uneven transfer method is to use the designed mold to make the film exposed to the film, and the portion exposed by the film is the film to be formed. S, in the patterning method of the present invention, the image processing #; ^7 μ, +, ..., electric display 300 processing. The orthodontic treatment is not limited to the above examples. Other patterns may be used. Alternatively, the conductive film 300 may be patterned first when the conductive film 3 is not disposed on one side of the colloid. Next, the patterned conductive film 300 is directly attached to the colloidal period, or the transfer film is applied, and the film 300 is transferred onto the winning body 2 . Referring again to "1C" and "1D", the fourth step in the method of fabricating the conductive plate is to provide a conductive material and electrically connect the conductive material. The conductive material may be located on the conductive film at one end and on the substrate 100 or the glue H2〇〇 at the other end. The conductive material _ can be a conductive adhesive, a wire, a metal, or the like having a conductive property. Due to the electrical anisotropy of the electrically conductive anisotropic film, the electrical impedance in a specific direction is small, and the resistance is larger along the specific side. The conductive material will flow through the patterned conductive film 3〇0 to other directions. The conductive material 3 (8) on the side of the conductive material and the patterned conductive film can have the function of a conductive plate which is conventionally conductive. The line spacing D between the patterns formed by the above-mentioned conductive film-300 is substantially between 1 micrometer and 1 millimeter, and the line width d is substantially between i micrometers and millimeters. Please refer to "2A" to "2D" in conjunction with the second embodiment of the conductive plate of the present invention. The "2A map" and the "2β map" respectively show a plan view and a cross-sectional structure view of the patterned conductive sheet. "2C" and "2D" respectively illustrate the top view and cross-sectional structure of the conductive plate to which the conductive material is added. The dotted line in Figure 2A and Figure 2C is a section line. First, please refer to "Fig. 2" and "Fig. 2B". In the present embodiment, the first step of the method for fabricating the electric board is to provide a substrate 1 and a colloidal cap for investigation on the substrate. The substrate of the substrate is the same as that of the first embodiment, and the details are not described herein. The second step in the method of fabricating the conductive plate is to pattern the above-mentioned colloid. In detail, the process of patterning can be performed by the bump transfer method, the thirst side method, the dry side method, the thunder case method, and the scraping method.
其中刮除法是直細別、搓轉工麟賴不需 :分刮除掉’只留下欲形成之圖案化膠體期；膠帶撕除法是將膠 帶黏附於職2GG不需要的部分，#膠帶撕除時，膠帶上的轉 會帶走不需要的膠體測部分，只留下欲形成之圖案化膠體2〇〇: 雷射圖案化法是以雷射照射於膠體絲的導電薄膜獅，由兩 魅接加熱以去除所照射到的導電_通部分，藉由控制雷二 照射的位置以留下欲形成之_化膠體2⑻；乾朗法與卿刻法 皆是先行以微影製程的方式在導電薄獏則上留下圖案化的光 阻’再分取離子撞擊歧體侧的方式料電細3⑻敍刻出 欲形成之_化賴2⑻；凹凸轉印法是_輯_具將圖案化 的膠體形成於導電薄膜3〇〇上。1，在本發明之將導電薄膜· 圖案化的方式’ B案化處理並不以上補為限，亦可為其他圖案 化虑;揮。 於本實施例中，導電板的製作方法中的第三步驟係提供一導 電薄膜300 ’並利用上述圖案化後之膠體2〇〇使導電薄膜承載 於基板100上。詳言之，將導電薄膜3〇〇設置於膠體2〇〇背對於 基板100的一侧表面附近。因而，當導電薄膜3〇〇承載於基板1〇〇 201102701 ^時’膠體2〇〇係存在於導電薄膜3〇〇與基板娜之間。上述之 導電薄膜300可於置於圖案化後之膠體2〇〇之—側表面附近，藉 由谬體2〇〇之黏性將導電薄膜3〇〇黏附後，將導電薄膜3〇〇未被 點附之部分去除。去除導電薄膜3〇〇未被黏附之部分可透過撕除、 切割等方式。 、上述之導電薄膜300可係先經過拉伸處理而具電異向性。導 ^薄膜300亦可包含有複數個奈米單元（圖中未示），且該等奈米 早元大致呈現-特定方向_設置，使該料_具電異向性。 上述之奈米單元可包含奈米碳管與奈米粒子等。所謂的電異向性 又稱^電異向性或稱電阻抗異向性，係不同方向上具有不同的導 電性質或電阻抗性質之謂。 再參照「第2C圖」與「第2〇圖」，於本實施例，導電板的 製作方法中的第四步驟係提供一導電材·，並將導電材4〇〇電性 連接導電薄膜300。其中導電材4〇〇可係一端位於導電薄膜3〇〇 上，另一端位於基板100或膠體200上。導電材4〇〇可係為導電 膠、導線、金屬等具導電特性之材料。由於具電里向性導 模300因其本身的電異向性特性，在沿著特定方向上的電阻抗較 小，在沿著相異於特定方向的電阻抗較大，因此可透過導電材奶〇 將流經圖案化後的導電薄膜300導引至其他方向。藉由導電材4〇〇 與圖案化後的導電薄膜300可具有以往具IT〇#電薄膜的導電板 功效。 於此，根據上述之本發明之導電板可包含基板1〇〇、膠體2〇〇 與導電薄膜300。其中膠體200位於基板1〇〇上，且導電薄膜3〇〇 配置於膠體200之一側表面附近，且導電薄膜3〇〇與膠體2〇〇中 之一係經過圖案化處理。 201102701 上述導電薄膜300所形成的圖案之間的線距D係實質介於1 微米至1毫米，且線寬d係實質介於i微米至2毫米。 請合併參照「第3圖」’說明應用本發明之導電板的觸控板的 一第一具體實施例。 觸控板包含第一導電板6〇〇、第二導電板7〇〇與複數個絕緣間 隔物500。其中第二導電板7〇〇係對應第一導電板6〇〇設置。複數 個絕緣間隔物500位於第一導電板6〇〇與第二導電板7〇〇之間。 第一導電板600包含第一基板61〇、第一膠體620與第一導電 • 薄膜630。第一膠體620位於第一基板610上，且第一導電薄膜 630配置於第一膠體62〇之一侧表面附近。其中第一膠體62〇或第 一導電薄膜630可係經過第一圖案化處理。 第二導電板700包含第二基板71〇、第二膠體72〇與第二導電 薄膜730。第二膠體720位於第二基板71〇上且朝向第一膠體62〇。 第二導電薄膜730配置於第二膠體72〇之一側表面附近。其中第 二膠體720或第二導電薄膜730可係經過第二圖案化處理f 於本實施例，第一導電板600與第二導電板7〇〇皆係為上述之 魯本發明第二具體實施例之導電板，然非本發明之限制，第一導電 板600與第二導電板700亦可皆係為上述之本發明第一具體實施 例之導電板。 ~ 如上所述，故第-基板_與第二基板⑽同於上述之基板 100’第一膠體620與第二膠體720同於上述之膠體2〇〇,第一導 電薄膜630與第二導電薄膜630同於上述之導電薄膜3〇〇，且第一 圖案化處理與第二圖案化處理皆係對膠體先行進行圖案化處理， 再將導電薄膜貼附於膠體上，同於上述之_化處理過程， 此不作贅述。 11 201102701 第一導電板600更包含第一導電材640，且第二導電板700更 包含第二導電材740。其中第一導電材640電性連接第一導電薄膜 630，且第二導電材740電性連接第二導電薄膜73〇。第一導電材 640與第二導電材740同於上述之導電材4〇〇，故在此不作贅述。 請合併參照「第4圖」，說明應用本發明之導電板的觸控板的 一弟一具體實施例。 本實施例與前述實施例大致相同，其差異在於本實施例中第一 導電板600係為上述之本發明第一具體實施例之導電板，第二導 φ電板7〇0係為上述之本發明第二具體實施例之導電板。然非本發 明之限制，第—導電板_亦可為上狀本發明第二具體實施^ 之導電板，第二導電板700係為上述之本發明第一具體實施例之 導電板。 於此’應用本發明之導電板之觸控板，當使用者以手指、筆或 其他介質直接碰觸第二導電板7〇〇上之某—位置時該位置之第 -導電薄膜730將與第-導電薄膜63〇形成電氣上之導通，並在 對應位置產生電位差，由外部驅動元件感_之不同電位差，進 出碰觸位置所在之座標值，並在該觸如板之對應座標 位置上顯示游標。 根據本發崎揭露之―鱗·及顧其之触板，藉 來膜先繼蝴’卿物上糊測線路二 取^知觸控板的1Τ〇導電板，達成降低導電板成本的功效。 杯明、、、树3肢前狀紐銳_露如上，然其並非用以限定 此習相像技^，在不脫離本發明之精神和範圍内， :書所因此本發明之專利保護範圍須視本說 曰所附之申请專利範圍所界定者為準。 12 201102701 【圖式簡單說明】 第1A圖〜第1D圖係為本發明之導電板一第一具體實施例； 第2A圖〜第2D圖係為本發明之導電板一第二具體實施例； 第3圖係為應用本發明之導電板的觸控板的一第一具體實施 例； 第4圖係為應用本發明之導電板的觸控板的一第二具體實施 例0Among them, the scraping method is straight and fine, and it is not necessary to: smash and remove 'only leave the patterned colloidal period to be formed; the tape tearing method is to stick the tape to the unneeded part of the 2GG, # tape tearing off When the transfer on the tape takes away the unwanted gel test part, leaving only the patterned colloid to be formed 2: The laser patterning method is a conductive film lion that is irradiated onto the colloidal wire by laser, by two charms Heating is performed to remove the irradiated conductive-pass portion, by controlling the position of the Ray II illumination to leave the _ colloid 2 (8) to be formed; both the dry method and the etch method are first in the lithography process in the conductive thin貘 留下 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案It is formed on the conductive film 3〇〇. 1. In the present invention, the method of patterning the conductive film is not limited to the above, and may be other patterning; In the present embodiment, the third step in the method of fabricating the conductive plate provides a conductive film 300' and the conductive film is carried on the substrate 100 by using the patterned colloid 2'. In detail, the electroconductive film 3 is placed in the vicinity of the side surface of the colloid 2 on the substrate 100. Therefore, when the electroconductive thin film 3 is carried on the substrate 1 201102701 ^, the colloid 2 is present between the electroconductive thin film 3 and the substrate Na. The conductive film 300 can be placed adjacent to the side surface of the patterned colloid 2, and the conductive film 3〇〇 is adhered by the adhesiveness of the body 2〇〇, and the conductive film 3 is not The part attached is removed. The portion of the conductive film 3 that is not adhered can be removed by peeling, cutting, or the like. The conductive film 300 described above may be subjected to a stretching treatment to have electrical anisotropy. The film 300 may also include a plurality of nano-cells (not shown), and the nano-early elements generally exhibit a specific direction-setting, such that the material has an electrical anisotropy. The above nano unit may include a carbon nanotube, a nano particle, or the like. The so-called electrical anisotropy, also known as electrical anisotropy or electrical anisotropy, has different electrical or electrical impedance properties in different directions. Referring to the "2Cth drawing" and the "2nd drawing", in the present embodiment, the fourth step in the manufacturing method of the conductive plate provides a conductive material and electrically connects the conductive material 4 to the conductive film 300. . The conductive material 4 can be located on the conductive film 3A at one end and on the substrate 100 or the colloid 200 at the other end. The conductive material 4 can be made of a conductive adhesive such as a conductive paste, a wire, or a metal. Since the electrically conductive guiding die 300 has a small electrical impedance along a specific direction due to its own electrical anisotropy, it has a large electrical impedance along a specific direction, and thus is permeable to a conductive material. The milk thistle guides the patterned conductive film 300 to other directions. The conductive material 4 〇〇 and the patterned conductive film 300 can have the effect of a conventional conductive plate having an IT film. Here, the conductive plate according to the present invention described above may include the substrate 1 胶, the colloid 2 〇〇 and the conductive film 300. The colloid 200 is disposed on the substrate 1 and the conductive film 3 is disposed near one side surface of the colloid 200, and one of the conductive film 3 and the colloid 2 is patterned. 201102701 The line spacing D between the patterns formed by the above conductive film 300 is substantially between 1 micrometer and 1 millimeter, and the line width d is substantially between i micrometers and 2 millimeters. Please refer to "Fig. 3" for a first embodiment of a touch panel to which the conductive plate of the present invention is applied. The touch panel includes a first conductive plate 6A, a second conductive plate 7A, and a plurality of insulating spacers 500. The second conductive plate 7 is disposed corresponding to the first conductive plate 6〇〇. A plurality of insulating spacers 500 are located between the first conductive plate 6'' and the second conductive plate 7''. The first conductive plate 600 includes a first substrate 61, a first colloid 620, and a first conductive film 630. The first colloid 620 is disposed on the first substrate 610, and the first conductive film 630 is disposed near a side surface of the first colloid 62. The first colloid 62 or the first conductive film 630 may be subjected to a first patterning process. The second conductive plate 700 includes a second substrate 71, a second colloid 72, and a second conductive film 730. The second colloid 720 is located on the second substrate 71A and faces the first colloid 62〇. The second conductive film 730 is disposed near one side surface of the second colloid 72. The second colloid 720 or the second conductive film 730 may be subjected to a second patterning process. In the embodiment, the first conductive plate 600 and the second conductive plate 7 are both described above. For example, the conductive plate of the first conductive plate 600 and the second conductive plate 700 may be the conductive plates of the first embodiment of the present invention described above. As described above, the first substrate _ and the second substrate (10) are the same as the substrate 100', the first colloid 620 and the second colloid 720 are the same as the colloid 2, the first conductive film 630 and the second conductive film. 630 is the same as the above-mentioned conductive film 3〇〇, and the first patterning process and the second patterning process are both patterning the colloid first, and then attaching the conductive film to the colloid, similar to the above-mentioned treatment. The process, this will not be described. 11 201102701 The first conductive plate 600 further includes a first conductive material 640, and the second conductive plate 700 further includes a second conductive material 740. The first conductive material 640 is electrically connected to the first conductive film 630, and the second conductive material 740 is electrically connected to the second conductive film 73A. The first conductive material 640 and the second conductive material 740 are the same as the above-mentioned conductive material 4, and thus will not be described herein. Please refer to "Fig. 4" for a description of a specific embodiment of a touch panel to which the conductive plate of the present invention is applied. This embodiment is substantially the same as the foregoing embodiment, and the difference is that the first conductive plate 600 is the conductive plate of the first embodiment of the present invention, and the second conductive φ electric plate 7 〇 0 is the above. A conductive plate according to a second embodiment of the present invention. However, not limited to the present invention, the first conductive plate _ may also be a conductive plate of the second embodiment of the present invention, and the second conductive plate 700 is the conductive plate of the first embodiment of the present invention described above. Herein, the touch panel using the conductive plate of the present invention, when the user directly touches a certain position on the second conductive plate 7 with a finger, a pen or other medium, the first conductive film 730 at the position will be The first conductive film 63〇 is electrically turned on, and generates a potential difference at a corresponding position, and the difference between the external driving element senses, the coordinate value of the touch position, and the corresponding coordinate position of the touch panel. cursor. According to the squad and the contact panel of the singer, this film is used to reduce the cost of the conductive plate by taking the first conductive board of the touch panel. The cups of the present invention are not limited to the spirit and scope of the present invention, and therefore the scope of patent protection of the present invention is required by the present invention. This is subject to the definition of the scope of the patent application attached to this statement. 12 201102701 [Simple description of the drawings] 1A to 1D are a first embodiment of the conductive plate of the present invention; 2A to 2D are a second embodiment of the conductive plate of the present invention; 3 is a first embodiment of a touch panel to which the conductive plate of the present invention is applied; and FIG. 4 is a second embodiment of the touch panel to which the conductive plate of the present invention is applied.
【主要元件符號說明】 100 基板 200 膠體 300 導電薄膜 400 導電材 500 絕緣間隔物 600 第一導電板 610 第一基板 620 第一膠體 630 第一導電薄膜 640 第一導電材 700 第二導電板 710 第二基板 720 第二膠體 730 ' 第二導電薄膜 740 第二導電材 D 線距 d 線寬 13[Main component symbol description] 100 substrate 200 colloid 300 conductive film 400 conductive material 500 insulating spacer 600 first conductive plate 610 first substrate 620 first colloid 630 first conductive film 640 first conductive material 700 second conductive plate 710 Two substrates 720 second colloid 730 'second conductive film 740 second conductive material D line spacing d line width 13