CN104142749A - Touch panel and production method thereof - Google Patents
Touch panel and production method thereof Download PDFInfo
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- CN104142749A CN104142749A CN201310181224.2A CN201310181224A CN104142749A CN 104142749 A CN104142749 A CN 104142749A CN 201310181224 A CN201310181224 A CN 201310181224A CN 104142749 A CN104142749 A CN 104142749A
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- layer
- light shield
- contact panel
- sensing electrode
- conductive
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Abstract
The invention discloses a touch panel which comprises a substrate, a sensing electrode layer, a shading layer, a conductive filling layer and a signal transmission line, wherein the substrate is provide with at least one peripheral area arranged on one side of a sensing area; the sensing electrode layer extends from the sensing area to the peripheral area; the shading layer is arranged in the peripheral area, the sensing electrode layer located in the peripheral area is covered with the shading layer, and the shading layer is provided with a plurality of penetrating holes so as to expose part of the sensing electrode layer in the peripheral area and adopts a ultraviolet-proof material; the penetrating holes of the shading layer are filled with the conductive filling layer which adopts an ultraviolet curing material; and the signal transmission line is arranged on the shading layer and electrically connected with the sensing electrode layer through the conductive filling layer. The invention further provides a production method of the touch panel. Therefore, the requirement for high printing accuracy of the touch panel in the prior art is met, and the problems of function anomaly and the like caused by printing are solved.
Description
Technical field
The present invention relates to touch technology, particularly relevant for a kind of contact panel and preparation method thereof.
Background technology
Because contact panel can be applicable on portable product and has advantages of user-friendly for operation, and contribute to be widely used in various electronic product, include personal digital assistant (personal digital assistant, PDA), palm PC (palm sized PC), mobile phone, handwriting input device, information household appliances (Information appliance), automatic financial machine (automated teller machine, ATM) and storefront sell automatic teller machine (point of sale, POS) etc.The communication of Portable and consumption electronic products quantity increase day by day, and this series products will use contact panel as its input equipment in a large number, therefore have in recent years many dealers to drop into the technical development relevant with contact panel.
Along with contact panel market is to reducing costs the demand with thickness, printing technology system is applied in contact panel more and more widely, and the mode of printed conductive layer overlap joint up/down line layer is also popularized for the contact panel product of various structures.Along with the resolution increase of product, size and the accuracy requirement of the conducting wire of contact panel are more and more higher.
Conventional art be take printing technology making conducting wire method as first form one deck sensing electrode layer on substrate, by printing technology, in sensing electrode layer neighboring area, form again the light shield layer with through hole, by alignment mode, conductive material is filled in through hole subsequently, thereby realizes electrically conducting of sensing electrode layer and periphery lead-in wire.
But adopt this kind of mode to produce processing procedure is had the greatest impact to problem for very high to printing contraposition requirement, easily occur that conductive material and the through hole contraposition of filling are offset and affect electrically conducting between sensing electrode layer and periphery lead-in wire, and then affect product yield.
Summary of the invention
In view of above-mentioned, for preventing conductive material and the inaccurate problem that electrically conducts producing of through hole contraposition because filling, the invention provides a kind of contact panel, it is characterized in that: a substrate, this substrate has an induction zone and at least one Yi Ce surrounding zone, this induction zone that is arranged on; One sensing electrode layer, be arranged on this substrate and certainly this induction zone extend to this surrounding zone; One light shield layer, is arranged at this surrounding zone, and is covered on this sensing electrode layer of this surrounding zone, and this light shield layer has a plurality of through holes to expose this sensing electrode layer of part that is positioned at this surrounding zone, and wherein this light shield layer is an antiultraviolet material; One conductive fill layer, fills this through hole of this light shield layer, and wherein this conductive fill layer is a ultraviolet curing shaped material; And a signal transmission line, be arranged on this light shield layer, and this signal transmission line is electrically connected this sensing electrode layer by this conductive fill layer.
The present invention further provides a kind of this contact panel method for making, it is characterized in that: a substrate is provided, and this substrate has an induction zone and at least one Yi Ce surrounding zone, this induction zone that is arranged on; Form a sensing electrode layer on this substrate, this sensing electrode layer extends to this surrounding zone from this induction zone on this substrate; Form a light shield layer on this surrounding zone of this substrate, and this light shield layer is covered on this sensing electrode layer of this surrounding zone, this light shield layer has a plurality of through holes to expose this sensing electrode layer of part that is positioned at this surrounding zone, and wherein this light shield layer is an antiultraviolet material; Form a conductive fill layer, be filled in this through hole of this light shield layer, wherein this conductive fill layer is a ultraviolet curing shaped material; And form a signal transmission line on this light shield layer, and this signal transmission line is electrically connected this sensing electrode layer by this conductive fill layer.
Above-mentioned contact panel with and this contact panel method for making, owing to having adopted structure of the present invention and alignment mode to reduce the demand of conductive fill layer printing precision compared to prior art, the problems such as the electric connection causing because of printing skew abnormal (as short circuit or open circuit) have been improved.
For the present invention's feature can be become apparent, special embodiment below, and coordinate appended graphicly, be described in detail below:
Accompanying drawing explanation
Figure 1A-Fig. 1 J shows the sectional view in one embodiment of the invention contact panel each stage of method for making.
Fig. 2 shows the planimetric map of Figure 1B.
Fig. 3 shows the planimetric map of Fig. 1 C.
Fig. 4 shows the planimetric map of Fig. 1 D.
Fig. 5 shows the planimetric map of Fig. 1 F.
Embodiment
Below in conjunction with accompanying drawing and embodiment, the present invention is described in further detail.Be understandable that, embodiment provides many applicable inventive concepts, the change that it can be wider.The specific embodiment of being discussed is only used for disclosing the ad hoc approach that uses embodiment, and is not used for limiting the category disclosing.
In interior literary composition, it " embodiment " refers to certain patterns, structure or the feature relevant at least one embodiment of the present invention below.Therefore the narration of " in one embodiment ", does not refer to same embodiment.In addition, the certain patterns in one or more embodiment, structure or feature combination by rights.It should be noted that the graphic of this instructions proportionally do not illustrate, it is only used for disclosing the present invention.
Figure 1A-Fig. 1 J shows the sectional view in one embodiment of the invention contact panel each stage of method for making.Below coordinate Figure 1A-Fig. 1 J to describe and disclose one embodiment of the invention contact panel method for making.First, one substrate 101 is provided, substrate 101 comprises one first side 1011 and second side 1012 with respect to this first side 1011, wherein the first side 1011 is touch control components (will in follow-up detailed description) of the various storehouse of carrying, the second side 1012 is to accept user's contact, for example, by finger or pointer.Substrate 101 can have an induction zone 101A and at least one Yi Ce surrounding zone, induction zone 101B that is arranged on, and in the present embodiment, surrounding zone 101A is arranged on the surrounding of induction zone 101B.In the present embodiment, substrate 101 can form for any material that can be penetrated by light, as substrate can form for glass, acryl (Polymethylmethacrylate is called for short PMMA) or polycarbonate (Polycarbonate is called for short PC).Fig. 2 shows one embodiment of the invention contact panel making planimetric map of next stage, Figure 1B shows the sectional view along Fig. 2 profile line I-I ', please refer to Figure 1B and Fig. 2, form a sensing electrode layer 102 in the first side 1011 of substrate 101, in one embodiment, sensing electrode layer 102 can form for any transparent conductive material, for example indium tin oxide (ITO) or indium-zinc oxide (IZO).The method that forms sensing electrode layer 102 can be wire mark method or other.Fig. 3 shows one embodiment of the invention contact panel making planimetric map of next stage, Fig. 1 C shows the sectional view along Fig. 3 profile line I-I ', please refer to Fig. 1 C and Fig. 3, periphery in the first side 1011 of substrate 101 forms a light shield layer 103, wherein light shield layer 103 is arranged at this surrounding zone, and cover the sensing electrode layer 102 that is positioned at surrounding zone 101B, so can be so that the sensing electrode layer being covered form an induction zone 101A, light shield layer 103 can intercept ultraviolet ray 104.Light shield layer 103 has a plurality of through holes 105 to expose the part sensing electrode layer 102 that is positioned at surrounding zone 101B, and the size of through hole 105 and position system are through configuration, be used at subsequent step filled conductive packed layer 1061, signal transmission line 107 is arranged on light shield layer 103, and signal transmission line 107 is electrically connected sensing electrode layer 102 by the conductive fill layer 1061 in through hole 105.
The material of this light shield layer is that optical density value is greater than 3 in one embodiment, optical density=1g (1/trans) wherein, trans is the transmittance of light shield layer, hence one can see that, and when optical density value is greater than 3, transmittance is less than 0.1%, now ultraviolet 104 transmitances will be less than 0.1%, wherein the optical density value of light shield layer can reach by adjusting light shield layer 103 thickness, and as when light shield layer 103 is black ink material, when the thickness of light shield layer 103 is greater than 10um, optical density value is greater than 3.
In another embodiment, light shield layer 103 also can self properties of materials and is reached function of shielding ultraviolet radiation, for example, add ultraviolet screening agent.Wherein ultraviolet screening agent can be mineral-type ultraviolet screening agent, mineral-type ultraviolet screening agent is mainly the fine powder of ceramic-like, these powder comprise porcelain earth, calcium carbonate, talcum powder or its potpourri, are combined incident ultraviolet ray are played to the effect of reflection or scatters ultraviolet shielding by fine powder with light shield layer material, thereby prevent that ultraviolet ray from penetrating light shield layer 103.The ultraviolet screening agent that wherein added can be also organic ultraviolet screening agent, this organic ultraviolet screening agent comprises salicylate class, benzophenone class, benzotriazole, group-substituted acrylonitrile or triazines and hindered amines potpourri, such screener is mainly to play absorb ultraviolet ray and carry out the effect of energy conversion, by ultraviolet ray being become to the shorter electromagnetic wave of low-energy heat energy or wavelength, thereby prevent that ultraviolet ray from penetrating light shield layer 103.The ultraviolet screening agent that wherein added can be also mineral compound and its potpourri of organic compound, by incident ultraviolet ray being played to reflection or scattering and ultraviolet ray being become to low-energy heat energy or the shorter electromagnetic double action of wavelength, thereby prevent that ultraviolet ray from penetrating light shield layer 103.
Fig. 4 shows one embodiment of the invention contact panel making planimetric map of next stage, Fig. 1 D shows the sectional view along Fig. 4 profile line I-I ', please refer to Fig. 1 D and Fig. 4, form a conductive layer 106 that can be cured ultraviolet ray reaction on light shield layer 103, and insert in those through holes 105, this conductive layer 106 is strip, and to be wherein filled in the part of those through holes be conductive fill layer 1061 to this conductive layer 106, and the part being directly formed on light shield layer 103 is conductive surface layer 1062.
In this embodiment, the material of conductive layer 106 is conductive materials of ultraviolet-curable, further the conductive material of this ultraviolet-curable is ultraviolet conducting resinl, ultraviolet ray conducting resinl mainly comprises monomer and light trigger, wherein monomer mainly comprises acrylate, cyanoacrylate, epoxy resin, silicone.
Light trigger in ultraviolet ray conducting resinl produces the free radical of activation under ultraviolet irradiation, the free radical of surface active is under ultraviolet ray (250nm) is irradiated, with oxygen chemically reactive, generate titanium dioxide base and monomer, the free radical of inner activation and monomer be chemically reactive under ultraviolet ray (365nm) is irradiated, generate monomer free radical, it is combined with monomer chemically reactive again under ultraviolet ray (365nm) is irradiated again, so analogize, finally become polymkeric substance, thereby be cured.
The present embodiment does not need to aim at accurately each through hole 105 in the step that forms conductive layer 106, concrete alignment method is as follows, as shown in Figure 4, the conductive layer 106 of formation can be the strip structure of a plurality of through holes 105 of a covering, and it can form the frame-shaped construction (as shown in Figure 4) on light shield layer 103.Then, as shown in Fig. 1 E, use a ultraviolet ray 104 (ultraviolet range is 200-400nm), from the second side 1012 of substrate 101, through the through hole 105 substrate 101 and light shield layer 103, expose to conductive layer 106, because the optical density value of light shield layer 103 is greater than 3, transmittance is less than 0.1%, known according to the solid energy=illumination * time * transmittance of light, directly be formed at the conductive surface layer 1062 on light shield layer 103, the solid energy of light obtaining is not as good as 0.1% of conductive fill layer 1061, therefore after conductive fill layer 1061 solidifies, conductive surface layer 1061 can not produce reaction and solidify.
In another embodiment when light shield layer 103 is added with ultraviolet screening agent, ultraviolet ray 104 can be absorbed or reflection by the ultraviolet screening agent in light shield layer 103, therefore ultraviolet ray 104 can not see through light shield layer 103 and be irradiated to conductive surface layer 1062, so conductive surface layer 1062 can not react curing.And because through hole 105 does not exist the light shield layer 103 that is added with ultraviolet screening agent, therefore ultraviolet ray 104 can not be absorbed or reflect away, can shine directly into the conductive fill layer 1061 that is arranged in through hole 105, and make it to produce curing.
Fig. 5 shows one embodiment of the invention contact panel making planimetric map of next stage, Fig. 1 F shows the sectional view along Fig. 5 profile line I-I ', please refer to Fig. 1 F and Fig. 5, carry out a cleaning step, in this step, adopt cleaning machine to clean and remove the conductive surface layer 1062 not being cured, only stay and be arranged in through hole by the curing conductive fill layer 1161 of above-mentioned ultraviolet ray irradiation, and this part conductive layer is really to play electric connection effect.
It should be noted that, the present embodiment is used ultraviolet ray 104 through through hole 105, to irradiate conductive layer 106 from the second side 1012 of substrate 101, thereby solidify the conductive fill layer 1061 in through hole, adopt again follow-up cleaning step to remove not by conductive surface layer 1062, adopt method for making of the present invention not need and through hole 105 exactitude positions when forming conductive fill layer 1061 compared with prior art, therefore there will not be because contraposition deviation affects electrically conducting between sensing electrode layer and signal transmission line and make, and then affect product yield.
Next, please refer to Fig. 1 G, form a signal transmission line 122 on light shield layer 110, and be electrically connected conductive fill layer 1161.Signal transmission line 107 can be used wire mark method, the half tone of matching design circuit, signal transmission line 107 printings are covered on light shield layer 103, and contact with the conductive fill layer 1061 in through hole 105, so signal transmission line 107 can see through conductive fill layer 1061 and 102 electric connection of sensing electrode layer.
Then please refer to Fig. 1 H, form insulation course 108 on signal transmission line 107, to avoid signal transmission line 107 to be exposed to, in air, cause oxidation, insulation course 108 can form by wire mark, insulation course 108 is preferably transparent material and forms, for example the composition material of insulation course comprises urethane acrylates, resin.Insulation course 108 can comprise an opening 1081, exposes its underpart signal transmission line 108.
Please refer to again Fig. 1 I, a flexible circuit board (flexible printed circuit is called for short FPC) 109 is sticked together and is fixed on insulation course 108 via a conductive adhesive layer 110, to see through conductive adhesive layer 110, be electrically connected with signal transmission line 107.In one embodiment, be to use hot press by flexible circuit board, using anisotropic conductive as conductive adhesive layer 110, pressing is attached on the signal transmission line 107 that insulation course 108 exposes.
Follow-up, please refer to Fig. 1 J, in flexible circuit board 109 and 101 coatings of substrate, one strengthening glue-line 111, to increase the fixing intensity of flexible circuit board 109, avoid moving improperly and causing flexible circuit board 109 to depart from when successive process steps or assembling.
Please referring again to Fig. 1 J, further to disclose the enforcement structure of contact panel, this contact panel comprises a kind of contact panel, and it comprises: a substrate 101, and this substrate 101 has an induction zone 101A and at least one surrounding zone 101B that is arranged on this induction zone 101A mono-side; One sensing electrode layer 102, be arranged on this substrate 101 and certainly this induction zone 101A extend to this surrounding zone 101B; One light shield layer 103, be arranged at this surrounding zone 101B, and be covered on this sensing electrode layer 102 of this surrounding zone 101B, this light shield layer has a plurality of through holes 105 to expose this sensing electrode layer 103 of part that is positioned at this surrounding zone 101B, and wherein this light shield layer 103 is antiultraviolet materials; One conductive fill layer 1061, fills this through hole 105 of this light shield layer, and wherein this conductive fill layer 1061 is a ultraviolet curing shaped material; And a signal transmission line 107, be arranged on this light shield layer 103, and this signal transmission line 107 is electrically connected these sensing electrode layers 102 by this conductive fill layer 1061.
According to above-mentioned contact panel with and this contact panel method for making, owing to having adopted structure of the present invention and alignment mode to reduce the demand of conductive fill layer printing precision compared to prior art, improved because of problems such as electrically conducting of causing of printing skew are abnormal.
Although the preferred embodiment of this announcement explanation as above; so it is not in order to limit the present invention, anyly has the knack of this skill person, without departing from the spirit and scope of the invention; when doing a little change and retouching, thus the present invention's protection domain when depending on after the attached claim person of defining be as the criterion.
Claims (14)
1. a contact panel, is characterized in that:
One substrate, this substrate has an induction zone and at least one Yi Ce surrounding zone, this induction zone that is arranged on;
One sensing electrode layer, be arranged on this substrate and certainly this induction zone extend to this surrounding zone;
One light shield layer, is arranged at this surrounding zone, and is covered on this sensing electrode layer of this surrounding zone, and this light shield layer has a plurality of through holes to expose this sensing electrode layer of part that is positioned at this surrounding zone, and wherein this light shield layer is an antiultraviolet material;
One conductive fill layer, fills this through hole of this light shield layer, and wherein this conductive fill layer is a ultraviolet curing shaped material; And
One signal transmission line, is arranged on this light shield layer, and this signal transmission line is electrically connected this sensing electrode layer by this conductive fill layer.
2. contact panel according to claim 1, is characterized in that: this light shield layer is that optical density value is at least greater than 3.
3. contact panel according to claim 1, is characterized in that: this light shield layer thickness is at least greater than 10um.
4. contact panel according to claim 1, is characterized in that: this light shield layer is added with ultraviolet screening agent.
5. contact panel according to claim 4, is characterized in that: this ultraviolet screening agent is mineral compound, organic compound or its potpourri.
6. as contact panel according to claim 5, it is characterized in that: this mineral compound comprises calcium carbonate, porcelain earth, talcum powder or its potpourri.
7. contact panel according to claim 5, is characterized in that: this organic compound comprises salicylate class, benzophenone class, benzotriazole, group-substituted acrylonitrile or triazines and hindered amines potpourri.
8. contact panel according to claim 1, is characterized in that: the material of this conductive fill layer is ultraviolet conducting resinl.
9. contact panel according to claim 1, is characterized in that: this ultraviolet ray conducting resinl comprises monomer and light trigger.
10. a method for making for contact panel, comprising:
One substrate is provided, and this substrate has an induction zone and at least one Yi Ce surrounding zone, this induction zone that is arranged on;
Form a sensing electrode layer on this substrate, this sensing electrode layer extends to this surrounding zone from this induction zone on this substrate;
Form a light shield layer on this surrounding zone of this substrate, and this light shield layer is covered on this sensing electrode layer of this surrounding zone, this light shield layer has a plurality of through holes to expose this sensing electrode layer of part that is positioned at this surrounding zone, and wherein this light shield layer is an antiultraviolet material;
Form a conductive fill layer, be filled in this through hole of this light shield layer, wherein this conductive fill layer is a ultraviolet curing shaped material; And
Form a signal transmission line on this light shield layer, and this signal transmission line is electrically connected this sensing electrode layer by this conductive fill layer.
11. contact panel method for makings according to claim 10, is characterized in that: the step that wherein forms this conductive fill layer comprises:
Form a conductive layer, this conductive layer comprises that this conduction that a part is filled in those through holes fills out
Fill layer, another part is one to be directly formed at the conductive surface layer on this light shield layer;
With a ultraviolet ray, from this substrate, with respect to the opposite side of this sensing electrode layer, expose to this conductive layer, wherein this conductive fill layer is subject to direct irradiation and by photocuring, this conductive surface layer is subject to the shielding of this light shield layer and is not cured; And
Remove this conductive surface layer.
12. contact panel method for makings according to claim 11, is characterized in that: this conductive layer is strip.
13. contact panel method for makings according to claim 11, is characterized in that: the method that removes this conductive surface layer comprises that employing cleaning machine cleans.
14. contact panel method for makings according to claim 10, is characterized in that: this ultraviolet wavelength coverage is 200nm-400nm.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310181224.2A CN104142749B (en) | 2013-05-09 | 2013-05-09 | A kind of contact panel and preparation method thereof |
| TW102129755A TWI521399B (en) | 2013-05-09 | 2013-08-20 | Touch device and method for forming touch panel |
| TW102215601U TWM467118U (en) | 2013-05-09 | 2013-08-20 | Touch device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310181224.2A CN104142749B (en) | 2013-05-09 | 2013-05-09 | A kind of contact panel and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104142749A true CN104142749A (en) | 2014-11-12 |
| CN104142749B CN104142749B (en) | 2018-01-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310181224.2A Active CN104142749B (en) | 2013-05-09 | 2013-05-09 | A kind of contact panel and preparation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104142749B (en) |
| TW (2) | TWI521399B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106126001A (en) * | 2016-06-29 | 2016-11-16 | 业成光电（深圳）有限公司 | Contact panel and manufacture method thereof |
| CN106997442A (en) * | 2017-05-16 | 2017-08-01 | 金龙机电（杭州）有限公司 | A kind of touch-screen with anti-tamper circuit |
| CN107168588A (en) * | 2017-07-14 | 2017-09-15 | 业成科技（成都）有限公司 | Touch module structure and its manufacture method |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104951156A (en) * | 2014-03-31 | 2015-09-30 | 宸盛光电有限公司 | Capacitive touch control device |
| CN105094472B (en) * | 2014-05-15 | 2018-08-07 | 宸鸿科技(厦门)有限公司 | A kind of touch panel |
| CN105573539B (en) * | 2014-10-17 | 2019-05-03 | 宸鸿光电科技股份有限公司 | Touch panel and its manufacturing method |
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| JP2005183875A (en) * | 2003-12-24 | 2005-07-07 | Fujikura Ltd | Method for filling through-hole of printed circuit board with resin |
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2013
- 2013-05-09 CN CN201310181224.2A patent/CN104142749B/en active Active
- 2013-08-20 TW TW102129755A patent/TWI521399B/en active
- 2013-08-20 TW TW102215601U patent/TWM467118U/en not_active IP Right Cessation
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| JP2005183875A (en) * | 2003-12-24 | 2005-07-07 | Fujikura Ltd | Method for filling through-hole of printed circuit board with resin |
| CN1996524A (en) * | 2005-12-26 | 2007-07-11 | 毅嘉科技股份有限公司 | A making method for thin key |
| CN102243544A (en) * | 2010-05-12 | 2011-11-16 | 群康科技(深圳)有限公司 | Touch screen, touch screen manufacturing method and touch display device |
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| CN106126001A (en) * | 2016-06-29 | 2016-11-16 | 业成光电（深圳）有限公司 | Contact panel and manufacture method thereof |
| CN106126001B (en) * | 2016-06-29 | 2019-04-16 | 业成光电（深圳）有限公司 | Touch panel and its manufacturing method |
| CN106997442A (en) * | 2017-05-16 | 2017-08-01 | 金龙机电（杭州）有限公司 | A kind of touch-screen with anti-tamper circuit |
| CN107168588A (en) * | 2017-07-14 | 2017-09-15 | 业成科技（成都）有限公司 | Touch module structure and its manufacture method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104142749B (en) | 2018-01-02 |
| TWM467118U (en) | 2013-12-01 |
| TW201443728A (en) | 2014-11-16 |
| TWI521399B (en) | 2016-02-11 |
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Effective date of registration: 20170714 Address after: 361009 intellectual property department, No. 199, Shang Lu Road, information hi tech Zone, torch hi tech Zone, Fujian, Xiamen Applicant after: XIANGDA OPTICAL (XIAMEN) CO., LTD. Address before: 361009 RST factory area, No. 195 Sakamoto Road, torch hi tech Zone, Xiamen, Fujian Applicant before: Chenzheng Photoelectric (Xiamen) Co., Ltd. |
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