CN105573539B - Touch panel and its manufacturing method - Google Patents
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- CN105573539B CN105573539B CN201410554140.3A CN201410554140A CN105573539B CN 105573539 B CN105573539 B CN 105573539B CN 201410554140 A CN201410554140 A CN 201410554140A CN 105573539 B CN105573539 B CN 105573539B
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Abstract
The invention discloses a kind of touch panel and its manufacturing methods.A method of manufacture touch panel, comprising providing a substrate, a sensing electrode layer is formed on the substrate, one first shielding layer is formed on the substrate, first shielding layer and the sensing electrode layer partially overlap an overlay region, and first shielding layer has the locus of discontinuity of multiple predetermined sizes in the predetermined position of the overlay region, a conductive structure is formed in each locus of discontinuity of multiple locus of discontinuity, a part of the conductive structure inserts its corresponding locus of discontinuity, another part protrudes from the surface of first shielding layer, and one second shielding layer is formed on the surface of first shielding layer, and expose the another part of the conductive structure.
Description
Technical field
The present invention relates to touch technologies, more particularly to a kind of touch panel and its manufacturing method.
Background technique
With the evolution and development of touch technology, touch panel (touch panel) or Touch Screen (touch
Screen) increasingly popular to be applied in electronic device, especially portable or portable electric device, such as personal digital assistant
(PDA) or mobile phone.In many touch panels, the signal that touch-control sensing area is sensed is by conductive junction point, via biography
Conducting wire road and flexible printed wiring board (Flexible Printed Circuit Board；FPC) it is transmitted to the master of electronic device
Machine does analysis processing.In the manufacturing process of some touch panels, conductive junction point just carries out the print of shielding layer after first completing
Brush.However in conductive junction point production, because the nethike embrane of its printing screen plate is soft material, be easy the pushing by printing apparatus and
Offset, so that these conductive junction points fail to be properly formed on scheduled position.Therefore, the shielding layer printing continued in the completed
Afterwards, the phenomenon that conductive junction point confluce of shielding layer and offset just very likely results in pin hole or light leakage, to make production yield
It reduces.How to overcome the problems, such as that conductive junction point deviates and conductive junction point is enable more accurately to be made in scheduled position, is touch surface
Board manufacturing process has a project to be solved.
Summary of the invention
In view of this, it is an object of the present invention to so that conductive junction point is accurately located at scheduled position to improve life
Produce yield.The embodiment of the present invention provides a kind of method for manufacturing touch panel, and comprising providing a substrate, which is divided into one
Touch area and the neighboring area for surrounding the touch area form one first patterned conductive layer in the touch area of the substrate
On the neighboring area of part, one first patterned shielding is formed in the neighboring area of the substrate, the first patterning masking
Layer partially overlaps an overlay region with first patterned conductive layer, and in having multiple locus of discontinuities in the overlay region, is formed
One second patterned conductive layer is in multiple locus of discontinuity of first patterned shielding, second patterned conductive layer filling
Multiple locus of discontinuity simultaneously covers the first patterned shielding for being located at multiple locus of discontinuity periphery, and forms one second figure
Case shielding layer is located at outside the periphery of multiple locus of discontinuity in the neighboring area of the substrate, second patterned shielding covering
First patterned shielding.
In the embodiment of the present invention, multiple locus of discontinuity has consistent size.
In the embodiment of the present invention, which is inserting multiple locus of discontinuity and is covering more positioned at this
The conductive structure of first patterned shielding of a locus of discontinuity periphery has consistent size.
In the embodiment of the present invention, the material of second patterned conductive layer includes carbon, Nanometer Copper, nano silver and high score
One of subconductivity resin.
In the embodiment of the present invention, first patterned shielding, second patterned shielding and second pattern
The color for changing conductive layer is black or grey.
In the embodiment of the present invention, additionally comprise to form a conductor layer in second patterned conductive layer and second patterning
On shielding layer；An insulating layer is formed on the conductor layer, which goes out a part of the conductor layer；And applies one and lead
Electric sticker is to the exposed portion of the conductor layer the conductor layer is electrically connected to a flexible circuit board.
The embodiment of the present invention separately provides a kind of method for manufacturing touch panel, and comprising providing a substrate, which is divided
For a touch area and the neighboring area for surrounding the touch area；One first patterned conductive layer is formed in the touch-control of the substrate
On region and partial neighboring area；One first patterned shielding is formed in the neighboring area of the substrate, first patterning
Shielding layer and first patterned conductive layer partially overlap an overlay region, and in discontinuous with multiple first in the overlay region
Area；One second patterned shielding is formed in the neighboring area of the substrate, which is located at first pattern
Change on shielding layer, and there are multiple second locus of discontinuities in the covering part, multiple second locus of discontinuity covers multiple the
One locus of discontinuity；And one second patterned conductive layer is formed, second patterned conductive layer filling multiple first is discontinuous
Area and multiple second locus of discontinuity.
In the embodiment of the present invention, multiple first locus of discontinuity has consistent size.
In the embodiment of the present invention, multiple second locus of discontinuity has consistent size.
In the embodiment of the present invention, which is inserting multiple first locus of discontinuity and multiple the
The conductive structure of two locus of discontinuities has consistent size.
In the embodiment of the present invention, multiple second locus of discontinuity exposes multiple the of first patterned shielding
One locus of discontinuity and the first patterned shielding for being located at multiple first locus of discontinuity periphery.
The embodiment of the present invention separately provides a kind of touch panel, includes a substrate；One sensing electrode layer is located at the substrate
On；One first shielding layer is located on the substrate, and first shielding layer and the sensing electrode layer partially overlap an overlay region, and
First shielding layer has the first locus of discontinuity of multiple predetermined sizes in the predetermined position of the overlay region；One second shielding layer,
On first shielding layer, which has multiple second locus of discontinuities in the overlay region, and multiple second does not connect
Cover multiple first locus of discontinuity in continuous area；And it is defined by multiple first locus of discontinuity and multiple second locus of discontinuity
Multiple conductive structures, each conductive structure insert one of multiple first locus of discontinuity and its corresponding multiple second
One of locus of discontinuity.
In the embodiment of the present invention, multiple first locus of discontinuity has consistent size.
In the embodiment of the present invention, multiple second locus of discontinuity has consistent size.
In the embodiment of the present invention, multiple conductive structure has consistent size.
In the embodiment of the present invention, what multiple second locus of discontinuity exposed first shielding layer multiple first does not connect
Continuous area and the first shielding layer for being located at multiple first locus of discontinuity periphery.
In embodiment of the method for the invention, the first patterned shielding just carries out the second patterning after first completing and leads
The production of electric layer.First patterned shielding helps to be pre-positioned locus of discontinuity, to make subsequent second pattern conductive
Layer, which is formed by conductive structure, can be formed on the position that these are pre-positioned.Therefore, the conductive knot of the second patterned conductive layer
Structure position just not will receive the pushing of printing apparatus and deviate, and can be properly formed on scheduled position, effectively overcome pin hole
Or the problem of light leakage.In addition, the locus of discontinuity that the first shielding layer is defined has consistent in the device of the invention embodiment
Size, and the conductive structure that the first shielding layer and the second shielding layer define jointly can also have consistent size, so that conductive knot
Structure has consistent performance in electrical characteristic (such as impedance).
Technology contents and technical characterstic of the invention have revealed that as above, however ordinary skill in the technical field of the invention
Personnel are it will be appreciated that in the disclosure spirit and scope defined without departing substantially from appended claims, teachings of the present invention and announcement
It can make various replacement and modification.For example, many elements being disclosed above can be different structure implement or with other identical function
The structure of energy is replaced, or uses a combination thereof.
Detailed description of the invention
Aforementioned abstract and detailed description below of the invention is being easier to understand with each attached drawing to read Shi Dangke.
To reach illustration purpose of the invention, figure is painted with preferably each specific embodiment of existing category in each attached drawing.However the present invention and unlimited
The accurate be set with mode and apparatus of Yu Suohui, this point should be appreciated that.
Figure 1A~1M show an embodiment according to the present invention, the schematic diagram of manufacturing method of touch panel；
Fig. 2A~2C is shown according to another embodiment of the present invention, the schematic diagram of manufacturing method of touch panel；
Fig. 3 show an embodiment according to the present invention, the production method flow chart of touch panel；
Fig. 4 is shown according to another embodiment of the present invention, the production method flow chart of touch panel；
Fig. 5 show an embodiment according to the present invention, the production method flow chart of touch panel；And
Fig. 6 is shown according to still another embodiment of the invention, the production method flow chart of touch panel.
Symbol description:
10: touch panel
11: substrate
12: the first patterned conductive layers
14: the first patterned shieldings
15: insulating layer
16: conductive adhesive
17: flexible circuit board
18: conductor layer
20: touch panel
22: the second patterned conductive layers
24: the second patterned shieldings
31~35: method and step
41~45: method and step
53~55: method and step
64~65: method and step
111: first surface
112: second surface
140: locus of discontinuity
240: locus of discontinuity
L1: the first locus of discontinuity length
L2: the second locus of discontinuity length
H1: the first patterned shielding thickness
H2: the second patterned shielding thickness
H: first and second patterned shielding overall thickness
OVL: overlay region
S: touch area
P: neighboring area.
Specific embodiment
Figure 1A~1M show an embodiment according to the present invention, the schematic diagram of manufacturing method of touch panel.Please join together
The top view of sectional view and Figure 1B according to Figure 1A, manufacturing process is to provide a substrate 11 beginning.Substrate 11 has a first surface
111 and a second surface 112, positioned at the opposite side of substrate 11.First surface 111 as substrate 11 circuit surface, to hold
Carry the function element of touch panel, and second surface 112 is then as the actuation face of substrate 11, to operate touch surface to user
Plate.In addition, substrate 16 is divided into a touch area S and surrounds a neighboring area P of touch area S.It is provided in the S of touch area
Touch-control sensing electrode layer (is not illustrated in figure), to sense touch position or track on touch panel.It is set in the P of neighboring area
It is equipped with signal conductor (not being illustrated in figure), is electrically connected touch-control sensing electrode layer.
In one embodiment of this invention, substrate 11 can be a rigid transparent substrates or a bendable transparent substrates, material
Material can be selected from glass, polymethyl methacrylate (PMMA), ethylene terephthalate, polyether sulfone, polyacrylate, poly- naphthalene two
Formic acid glycol ester, polyphenylene sulfide, polyallyl, polycarbonate, polyethylene terephthalate, polyvinyl chloride (PVC), poly- third
Alkene (PP), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyphenyl second
The transparent materials such as alkene (PS).
The top view of sectional view and Fig. 1 D please with reference to Fig. 1 C, using the manufacturing process of such as sputter and etching,
One first patterned conductive layer 12 is formed on the touch area S and partial neighboring area P of substrate 11.First patterning is led
Electric layer 12 is as the touch-control sensing electrode layer of touch panel, and it includes first axis sensing electrodes and the second axial sensing electrode
(not indicated in figure).The sensing electrode of first patterned conductive layer 12 is predominantly located in the S of touch area, and external circuit is then located at
In the neighboring area P of the part.
In one embodiment of this invention, the material of the first patterned conductive layer 12 may include various transparent conductive materials,
For example, tin indium oxide (indium tin oxide；ITO), indium zinc oxide (indium zinc oxide；IZO), cadmium tin
(cadmium tin oxide；CTO), aluminum zinc oxide (aluminum zinc oxide；AZO), indium oxide zinc-tin (indium
tin zinc oxide；ITZO), zinc oxide (zinc oxide), cadmium oxide (cadmium oxide), hafnium oxide (hafnium
oxide；HfO), indium gallium zinc (indium gallium zinc oxide；InGaZnO), indium gallium zinc-magnesium (indium
gallium zinc magnesium oxide；InGaZnMgO), indium gallium magnesium (indium gallium magnesium
oxide；InGaMgO), indium gallium aluminium (indium gallium aluminum oxide；InGaAlO), nano metal, receive
Rice carbon pipe or graphene.In other embodiments of the invention, the material of electrode may include opaque conductive material, such as metal
Grid (Metal Mesh).
The top view of sectional view and Fig. 1 F please with reference to Fig. 1 E will using the manufacturing process for example printed and toasted
One first patterned shielding 14 is formed in the neighboring area P of substrate 11.First patterned shielding 14 is led with the first patterning
Electric layer 12 partially overlaps an overlay region OVL (part that the first patterned conductive layer 12 is located at neighboring area P), and in overlay region
There are multiple locus of discontinuities 140 in OVL.The hollow-out part of 140 first patterned shielding 14 of locus of discontinuity, exposes part
Positioned at the first patterned conductive layer 12 of neighboring area P.Locus of discontinuity 140 generally in the P of neighboring area along touch area S with
The boundary of neighboring area P arranges.To ask attached drawing succinct, Fig. 1 F is only painted locus of discontinuity 140 along touch area S and neighboring area P
Boundary two sides arrangement.
First patterned shielding 14 generallys use opaque material and is made, to cover the element outside the S of touch area for example
Signal conductor.In one embodiment of this invention, the material of the first patterned shielding 14 can be selected from black photoresist, black
Resin, black ink, the film of antiradar reflectivity or the similar material with other colors.
The top view of sectional view and Fig. 1 H please with reference to Fig. 1 G will using the manufacturing process for example printed and toasted
One second patterned conductive layer 22 is formed in multiple locus of discontinuities 140 of the first patterned shielding 14.Second pattern conductive
The surface of the first patterned shielding 14 is inserted in multiple locus of discontinuities 140 and protruded to layer 22, forms a conductive structure.?
In the present embodiment, the covering of this conductive structure is located at the first patterned shielding 14 of 140 periphery of locus of discontinuity.By the second pattern
Change conductive layer 22 is formed by conductive structure and does signal biography as the first patterned conductive layer 12 and a host (not indicating in figure)
Conductive junction point when defeated.In detail, the signal that the touch-control sensing electrode of the first patterned conductive layer 12 is sensed passes through second
Patterned conductive layer 22 is formed by conductive structure, via transmission line and flexible printed wiring board (Flexible Printed
Circuit Board；FPC it) is transmitted to host and does analysis processing.
In the disclosure, the system of the second patterned conductive layer 22 is just carried out after the first patterned shielding 14 first completes
Make.First patterned shielding 14 helps to be pre-positioned locus of discontinuity 140, to make subsequent second patterned conductive layer 22
Being formed by conductive structure can be formed on the position that these are pre-positioned.Therefore, the conductive knot of the second patterned conductive layer 22
Structure position just not will receive the pushing of printing apparatus and deviate, and can be properly formed on scheduled position, effectively overcome pin hole
Or the problem of light leakage.In addition, because the first patterned shielding 14 makes prior to the second patterned conductive layer 22, locus of discontinuity 140
There can be consistent size, so that the conductive structure of the second patterned conductive layer 22 can also have unanimously in subsequent manufacturing processes
Size, thus in electrical characteristic (such as impedance) have consistent performance.In the present embodiment, by the second pattern conductive
Layer 22 is formed by conductive structure has narrow wide configuration, respectively assists in the positioning and transfer impedance of conductive structure
It reduces.
In one embodiment of this invention, the material of the second patterned conductive layer 22 include carbon, Nanometer Copper, nano silver and
One of conductive polymer resin.Also, the second patterned conductive layer 22 is using the color with the first patterned shielding 14
Identical or approximate conductive materials, so that 112 sight of actuation face of self-reference substrate 11, will not discover has the second patterned conductive layer 22
Presence.In one embodiment of this invention, the color of the second patterned conductive layer 22 and the first patterned shielding 14 is black
Color or grey.
The top view of sectional view and Fig. 1 J please with reference to Fig. 1 I will using the manufacturing process for example printed and toasted
One second patterned shielding 24 is formed in the neighboring area P of substrate 11.Second patterned shielding 24 covering be located at it is multiple not
The first patterned shielding 14 outside the periphery of continuum 140.In another embodiment of the invention, the second patterned shielding
24 are recessed in the first patterned shielding 14 close to the part of touch area S and expose the first patterned shielding of part
14.The conductive structure that second patterned shielding 24 makes up the second patterned conductive layer 22 protrudes from the first patterned shielding 14
Thickness difference, make the overall thickness of the first patterned shielding 14 and the second patterned shielding 24 and the second patterned conductive layer 22
Conductive structure be generally flush.
In one embodiment of this invention, the material of the second patterned shielding 24 can be selected from black photoresist, black
Resin, black ink, the film of antiradar reflectivity or the similar material with other colors.Also, the second patterned shielding 24,
One patterned shielding 14 and the color of the second patterned conductive layer 22 can be selected from as black or grey.
Now please with reference to the top view of the sectional view of Fig. 1 K and Fig. 1 L, wherein Fig. 1 K sees it from the hatching AA' of Fig. 1 L.
After forming the second patterned shielding 24, a conductor layer 18 is formed in the second patterned conductive layer 22 and the second patterning covers
On layer 24.In one embodiment of this invention, using the halftone of wire mark equipment matching design fine rule road, and filament is formed with elargol
The printing of conductor layer 18 is covered on the second patterned conductive layer 22 and the second patterned shielding 24 by road.Conductor layer 18 and
Two patterned conductive layers 22 are in contact, to be electrically connected with the first patterned conductive layer 12.In addition, in one embodiment of the invention
In, because the second patterned shielding 24 is recessed in the first patterned shielding 14 close to the part of touch area S, it is covered on second
Conductor layer 18 in patterned shielding 24 is also recessed in the first patterned shielding 14 relatively.
Thereafter, one insulating layer 15 is formed on conductor layer 18 using such as screen painting.Insulating layer 15 can avoid conducting wire
Layer 18 caused by being exposed in air because aoxidizing.In addition, insulating layer 15 exposes conductor layer 18 close to one of neighboring area P outer rim
Point, to be electrically connected to conductor layer 18 and subsequent element.In addition, in one embodiment of this invention, because the second patterning hides
It covers layer 24 and conductor layer 18 and is recessed in the first patterned shielding 14 close to the part of touch area S, be covered on conductor layer 18
Also opposite first patterned shielding 14 that is recessed in of insulating layer 15.In one embodiment of this invention, insulating layer 15 can be
(photoresist, black resin, black ink, antiradar reflectivity is made in bright material or black or similar material with other colors
Film etc.), it may include inorganic material, for example, silicon nitride (silicon nitride), silica (silicon oxide) with
Silicon oxynitride (silicon oxynitride) can also be organic material, such as acrylic resin (acrylic resin) etc.
Other suitable material, but the present invention is not limited thereto.
Referring now to Fig. 1 M, after forming insulating layer 15, apply a conductive adhesive 16 to the exposed portion of conductor layer 18
Conductor layer 18 is electrically connected to a flexible circuit board 17, such as flexible printed wiring board (FPC).It is real of the invention one
It applies in example, with anisotropic conductive film (Anisotropic Conductive Film；) or anisotropic conductive adhesive paste ACF
(Anisotropic Conductive Paste；ACP it) is used as conductive adhesive 16, and utilizes a hot press by flexible circuit
The pressing of plate 17 is adhered on the exposed portion of conductor layer 18.
In one embodiment of this invention, thickness H1 of first patterned shielding 14 on the first patterned conductive layer 12
About 7~10 millimeters (mm), and thickness H2 of second patterned shielding 24 in the first patterned shielding 14 is about 7~10
Millimeter (mm), making its overall thickness H is about 15~20 millimeters (mm), this is also the thickness of the second patterned conductive layer 22.Also, first
Length L1 of the locus of discontinuity 140 that patterned shielding 14 is defined in the direction along the touch area boundary S is about 3 millimeters
(mm), and the width in the direction (penetrating Fig. 1 M paper) perpendicular to the touch area boundary S is about 1 millimeter (mm).In addition, second
For patterned conductive layer 22 in the first patterned shielding 14, the length L2 along the direction on the touch area boundary S is about 3.6 millimeters
(mm)。
As depicted in figure iM, touch panel 10 made by the embodiment according to the present invention as shown in Figure 1A~1M includes a base
Plate 11, a sensing electrode layer 12, one first shielding layer 14, one second shielding layer 24 and multiple conductive structures 22.Sensing electrode layer
12 are located on the substrate 11.First shielding layer 14 is located on substrate 11, and partially overlaps an overlay region with sensing electrode layer 12
OVL (part that sensing electrode layer 12 is located at neighboring area P), and the first shielding layer 14 has in the predetermined position of overlay region OVL
There is the first locus of discontinuity 140 of multiple predetermined sizes.Second shielding layer 24 is located on the first shielding layer 14, and the second shielding layer 24
There are multiple second locus of discontinuities 240 (part on prominent first shielding layer, 14 surface of conductive structure 22) in overlay region OVL, it should
Multiple second locus of discontinuities 240 cover multiple first locus of discontinuity 140.First locus of discontinuity 140 and the second locus of discontinuity 240
Define the position of multiple conductive structures 22, each conductive structure 22 insert one of multiple first locus of discontinuity 140 and its
One of corresponding multiple second locus of discontinuity 240.
Fig. 2A~2C is shown according to another embodiment of the present invention, the schematic diagram of manufacturing method of touch panel.It please refers to
Fig. 2A, in forming the first patterned conductive layer 12 and the first patterned shielding 14 on substrate.Its correlation technique step has been described in detail
In Figure 1A, Fig. 1 C and Fig. 1 E, does not go to live in the household of one's in-laws on getting married separately and chat in this.Also, the first shielding layer 14 partly overlaps with the first patterned conductive layer 12
In an overlay region OVL, and the first shielding layer 14 has the first of multiple predetermined sizes not connect in the predetermined position of overlay region OVL
Continuous area 140.
Then B referring to figure 2., in forming the first patterned shielding 14 after the neighboring area P of substrate 11, using for example
The manufacturing process of printing and baking forms one second patterned shielding 24 in the neighboring area P of substrate 11.Second patterning hides
It covers layer 24 to be located in the first patterned shielding 14, and there are multiple second locus of discontinuities 240 in overlay region OVL, it is multiple
Second locus of discontinuity 240 covers multiple first locus of discontinuity 140.In one embodiment of this invention, multiple second is discontinuous
Area 240 exposes multiple first locus of discontinuities 140 of the first patterned shielding 14 and is located at multiple first locus of discontinuities 140 weeks
First patterned shielding 14 of edge.In addition, in an embodiment of the present invention, multiple first locus of discontinuities 140 have consistent ruler
It is very little, in addition, multiple second locus of discontinuities 240 also have consistent size.
C referring to figure 2. forms one second patterned conductive layer 22 in more using the manufacturing process for example printed and toasted
The position that a first locus of discontinuity 140 is defined with multiple second locus of discontinuities 240.Second patterned conductive layer 22 is inserted multiple
In first locus of discontinuity 140 and multiple second locus of discontinuities 240.In an embodiment of the present invention, the second patterned conductive layer
22 have consistent size in the conductive structure for inserting multiple first locus of discontinuities 140 and multiple second locus of discontinuities 240.Second
After patterned conductive layer 22 is formed, relevant method and step has been specified in Fig. 1 K and Fig. 1 M thereafter, is not gone to live in the household of one's in-laws on getting married separately and is chatted in this.
In touch panel 20 shown in fig. 2 C, thickness of first patterned shielding 14 on the first patterned conductive layer 12
Spending H1 is about 7~10 millimeters (mm), and thickness H2 of second patterned shielding 24 in the first patterned shielding 14 is about 7
~10 millimeters (mm), making its overall thickness H is about 15~20 millimeters (mm), this is also the thickness of the second patterned conductive layer 22.Also,
Length L1 of the locus of discontinuity 140 that first patterned shielding 14 is defined in the direction along the touch area boundary S is about 3 millimeters
(mm), and the width in the direction (penetrating Fig. 1 M paper) perpendicular to the touch area boundary S is about 1.75 millimeters (mm).In addition,
For second patterned conductive layer 22 in the first patterned shielding 14, the length L2 along the direction on the touch area boundary S is about 4 millis
Rice (mm).
Fig. 3 show an embodiment according to the present invention, the production method flow chart of touch panel.Referring to figure 3., in step
Rapid 31 provide a substrate 11, are divided into the neighboring area P that a touch area S and one surrounds touch area S.
In step 32, touch area S and partial peripheral region of one first patterned conductive layer 12 in the substrate 11 are formed
On the P of domain.
In step 33, one first patterned shielding 14 is formed in the neighboring area P of the substrate 11, which hides
It covers layer 14 and first patterned conductive layer 12 partially overlaps an overlay region OVL, and do not connect in overlay region OVL with multiple
Continuous area 140.
In step 34, one second patterned conductive layer 22 is formed in the multiple discontinuous of first patterned shielding 14
Area 140, which, which inserts multiple locus of discontinuity 140 and cover, is located at multiple locus of discontinuity 140 weeks
First patterned shielding 14 of edge.
In step 35, one second patterned shielding 24 is formed in the neighboring area P of the substrate 11, which hides
Cover first patterned shielding 14 that the covering of layer 24 is located at outside the periphery of multiple locus of discontinuity 140.
Fig. 4 is shown according to another embodiment of the present invention, the production method flow chart of touch panel.Referring to figure 4., exist
Step 41 provides a substrate 11.Then a sensing electrode layer 12 is formed on the substrate 11 in step 42.
In step 43, one first shielding layer 14 is formed on the substrate 11, first shielding layer 14 and the sensing electrode layer
12 partially overlap an overlay region OVL, and first shielding layer 14 has multiple pre- scales in the predetermined position of overlay region OVL
Very little locus of discontinuity 140.
In step 44, a conductive structure 22 is formed in each locus of discontinuity of multiple locus of discontinuity 140, the conductive structure
22 a part inserts its corresponding locus of discontinuity 140, and another part protrudes from the surface of first shielding layer 14.
In step 45, one second shielding layer 24 is formed on the surface of first shielding layer 14, and expose conduction and tie
Structure 22 protrudes from the another part on 14 surface of the first shielding layer.
Fig. 5 show an embodiment according to the present invention, the production method flow chart of touch panel.Referring to figure 5., step
31 with step 32 in detail such as Fig. 3, separately not superfluous chatted in this.In step 53, one first patterned shielding 14 is formed in the substrate 11
Neighboring area P, first patterned shielding 14 and first patterned conductive layer 12 partially overlap an overlay region OVL,
And there are multiple first locus of discontinuities 140 in the OVL of overlay region.
In step 54, one second patterned shielding 24 is formed in the neighboring area P of the substrate 11, which hides
It covers layer 24 to be located in first patterned shielding 14, and there are multiple second locus of discontinuities 240 in the OVL of overlay region, this is more
A second locus of discontinuity 240 covers multiple first locus of discontinuity 140.
In step 55, one second patterned conductive layer 22 is formed, which inserts multiple first
Locus of discontinuity 140 and multiple second locus of discontinuity 240.
Fig. 6 is shown according to still another embodiment of the invention, the production method flow chart of touch panel.Fig. 6 is please referred to, is walked
Rapid 41, step 42 and step 43 are not gone to live in the household of one's in-laws on getting married separately in this and are chatted in detail such as Fig. 4.In step 64, formed one second shielding layer 24 in this first
On shielding layer 14, which has multiple second locus of discontinuities 240 in overlay region OVL, and multiple second does not connect
Cover multiple first locus of discontinuity 140 in continuous area 240.
In step 65, multiple conductive structures 22 are formed, each conductive structure 22 does not insert its corresponding multiple first not
One of continuum 140 and one of multiple second locus of discontinuity 240.
The technology contents and technical characterstic of the disclosure have revealed that as above, however ordinary skill in disclosure technical field
Personnel the teaching of the disclosure and take off it will be appreciated that in the spirit and scope of the present disclosure defined without departing substantially from appended claims
Various replacement and modification can be made by showing.For example, many elements being disclosed above can be different structure implement or with other identical
The structure of function is replaced, or using the combination of above-mentioned two kinds of modes.
In addition, claims hereof is not limited to the device, element or structure for the specific embodiment being disclosed above.
Those of ordinary skill in disclosure technical field is it will be appreciated that be based on disclosure teaching and disclosed device, element or structure, nothing
By now existing or developer in the future, executed in substantially the same manner with the embodiment of the present application announcement person substantially identical
Function, and reach substantially identical as a result, can be used with the disclosure.Therefore, claim is to cover such device, element
Or structure.
Claims (18)
1. a kind of method for manufacturing touch panel, comprising:
A substrate is provided, the substrate is divided into a touch area and surrounds a neighboring area of the touch area；
One first patterned conductive layer is formed on the touch area and partial neighboring area of the substrate；
One first patterned shielding is formed in the neighboring area of the substrate, first patterned shielding and described first
Patterned conductive layer partially overlaps an overlay region, and in having multiple locus of discontinuities in the overlay region；
One second patterned conductive layer is formed in multiple locus of discontinuities of first patterned shielding, second patterning
Conductive layer inserts the multiple locus of discontinuity and covers the first patterned shielding for being located at the multiple locus of discontinuity periphery；With
And
One second patterned shielding is formed in the neighboring area of the substrate, the second patterned shielding covering is located at institute
State first patterned shielding outside the periphery of multiple locus of discontinuities, first patterned shielding and second figure
The overall thickness of case shielding layer and the conductive structure thickness of second patterned conductive layer are flush.
2. the method for manufacture touch panel according to claim 1, wherein the multiple locus of discontinuity has consistent ruler
It is very little.
3. the method for manufacture touch panel according to claim 1, wherein second patterned conductive layer is in filling institute
It states multiple locus of discontinuities and the conductive structure for covering the first patterned shielding for being located at the multiple locus of discontinuity periphery has
Consistent size.
4. the method for manufacture touch panel according to claim 1, wherein the material packet of second patterned conductive layer
One of carbon containing, Nanometer Copper, nano silver and conductive polymer resin.
5. the method for manufacture touch panel according to claim 1, wherein first patterned shielding, described second
Patterned shielding and the color of second patterned conductive layer are black or grey.
6. the method for manufacture touch panel according to claim 1, further comprising:
A conductor layer is formed on second patterned conductive layer and second patterned shielding；
An insulating layer is formed on the conductor layer, the insulating layer exposing goes out a part of the conductor layer；And
Apply a conductive adhesive to the exposed portion of the conductor layer so that the conductor layer is electrically connected to a flexible electricity
Road plate.
7. a kind of method for manufacturing touch panel, comprising:
A substrate is provided, the substrate is divided into a touch area and surrounds a neighboring area of the touch area；
One first patterned conductive layer is formed on the touch area and partial neighboring area of the substrate；
One first patterned shielding is formed in the neighboring area of the substrate, first patterned shielding and described first
Patterned conductive layer partially overlaps an overlay region, and in having multiple first locus of discontinuities in the overlay region；
One second patterned shielding is formed in the neighboring area of the substrate, second patterned shielding is located at described the
In one patterned shielding, and in having multiple second locus of discontinuities in the overlay region, the multiple second locus of discontinuity is contained
The multiple first locus of discontinuity is covered, the multiple second locus of discontinuity exposes multiple the of first patterned shielding
One locus of discontinuity and the first patterned shielding for being located at the multiple first locus of discontinuity periphery；And
One second patterned conductive layer is formed, second patterned conductive layer inserts the multiple first locus of discontinuity and institute
It states multiple second locus of discontinuities and forms narrow wide conductive structure.
8. the method for manufacture touch panel according to claim 7, wherein the multiple first locus of discontinuity has unanimously
Size.
9. the method for manufacture touch panel according to claim 7, wherein the multiple second locus of discontinuity has unanimously
Size.
10. the method for manufacture touch panel according to claim 7, wherein second patterned conductive layer is in filling institute
The conductive structure for stating multiple first locus of discontinuities and the multiple second locus of discontinuity has consistent size.
11. the method for manufacture touch panel according to claim 7, wherein the material packet of second patterned conductive layer
One of carbon containing, Nanometer Copper, nano silver and conductive polymer resin.
12. the method for manufacture touch panel according to claim 7, wherein first patterned shielding, described the
Two patterned shieldings and the color of second patterned conductive layer are black or grey.
13. the method for manufacture touch panel according to claim 7, further comprising:
A conductor layer is formed on second patterned conductive layer and second patterned shielding；
An insulating layer is formed on the conductor layer, the insulating layer exposing goes out a part of the conductor layer；And
Apply a conductive adhesive to the exposed portion of the conductor layer so that the conductor layer is electrically connected to a flexible electricity
Road plate.
14. a kind of touch panel, comprising:
One substrate；
One sensing electrode layer is located on the substrate；
One first shielding layer is located on the substrate, and first shielding layer and sensing electrode layer partially overlap an overlay region,
And first shielding layer has multiple first locus of discontinuities of predetermined size in the predetermined position of the overlay region；
One second shielding layer is located on first shielding layer, and second shielding layer does not have multiple second not in the overlay region
Continuum, the multiple second locus of discontinuity cover the multiple first locus of discontinuity, the multiple second locus of discontinuity exposure
Multiple first locus of discontinuities of first shielding layer and the first shielding layer for being located at the multiple first locus of discontinuity periphery out；
And
Narrow wide multiple conductive knots are defined down by the multiple first locus of discontinuity and the multiple second locus of discontinuity
Structure, each conductive structure insert one of the multiple first locus of discontinuity and its corresponding the multiple second locus of discontinuity
One of.
15. touch panel according to claim 14, wherein the multiple first locus of discontinuity has consistent size.
16. touch panel according to claim 14, wherein the multiple second locus of discontinuity has consistent size.
17. touch panel according to claim 14, wherein the multiple conductive structure has consistent size.
18. touch panel according to claim 14, wherein the material of the multiple conductive structure include carbon, Nanometer Copper,
One of nano silver and conductive polymer resin.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410554140.3A CN105573539B (en) | 2014-10-17 | 2014-10-17 | Touch panel and its manufacturing method |
| TW104132900A TWI566146B (en) | 2014-10-17 | 2015-10-06 | Touch panel and a method of manufacturing the same |
| TW104216015U TWM517367U (en) | 2014-10-17 | 2015-10-06 | Touch panel |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410554140.3A CN105573539B (en) | 2014-10-17 | 2014-10-17 | Touch panel and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105573539A CN105573539A (en) | 2016-05-11 |
| CN105573539B true CN105573539B (en) | 2019-05-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410554140.3A Active CN105573539B (en) | 2014-10-17 | 2014-10-17 | Touch panel and its manufacturing method |
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| Country | Link |
|---|---|
| CN (1) | CN105573539B (en) |
| TW (2) | TWI566146B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105573539B (en) * | 2014-10-17 | 2019-05-03 | 宸鸿光电科技股份有限公司 | Touch panel and its manufacturing method |
| CN105786264B (en) * | 2016-05-20 | 2020-07-28 | 京东方科技集团股份有限公司 | Touch screen, manufacturing method thereof and touch device |
| KR20180026348A (en) * | 2016-09-02 | 2018-03-12 | 스템코 주식회사 | A method of fabricating flexible printed circuit boards and the flexble printed circuit boards made by using the same |
| CN114327110A (en) | 2020-09-30 | 2022-04-12 | 宸美（厦门）光电有限公司 | Touch control module |
| TWI755889B (en) * | 2020-10-14 | 2022-02-21 | 大陸商宸美（廈門）光電有限公司 | Touch module |
| CN114385020B (en) * | 2020-10-21 | 2024-04-19 | 宸美（厦门）光电有限公司 | Touch panel and touch device |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN105573539A (en) | 2016-05-11 |
| TWI566146B (en) | 2017-01-11 |
| TWM517367U (en) | 2016-02-11 |
| TW201626190A (en) | 2016-07-16 |
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