TWI566146B - Touch panel and a method of manufacturing the same - Google Patents

Description

Touch panel and method of manufacturing same

The present invention relates to touch technology, and more particularly to a touch panel and a method of fabricating the same.

With the evolution and development of touch technology, touch panels or touch screens are increasingly used in electronic devices, especially portable or handheld electronic devices, such as personal digital assistants (PDAs). ) or mobile phone. In many touch panels, the signals sensed by the touch sensing area are transmitted through the conductive contacts and transmitted to the host of the electronic device via a conductive line and a flexible printed circuit board (FPC) for analysis. In some touch panel processes, the conductive contacts are printed before the masking layer is printed. However, when the conductive contacts are made, the web of the printing screen is soft and easily deflected by the pressing of the printing fixture, so that the conductive contacts are not correctly formed at predetermined positions. Therefore, after the subsequent masking layer printing is completed, the intersection of the shielding layer and the offset conductive contacts is likely to cause pinholes or light leakage, thereby reducing the production yield. How to overcome the problem of the conductive contact offset and make the conductive contact can be accurately made at a predetermined position is a problem to be solved in the touch panel process.

In view of this, one of the objects of the present invention is to enable the conductive contacts to be accurately positioned at predetermined positions to improve production yield. An embodiment of the present invention provides a method for manufacturing a touch panel, including providing a substrate, the substrate is divided into a touch area and a peripheral area surrounding the touch area, and a first patterned conductive layer is formed on the substrate. a touch area and a peripheral area of the part form a first a patterned shielding layer is disposed on a peripheral region of the substrate, the first patterned shielding layer and the first patterned conductive layer partially overlapping an overlapping region, and having a plurality of discontinuous regions in the overlapping region to form a first The second patterned conductive layer is in the plurality of discontinuous regions of the first patterned shielding layer, the second patterned conductive layer filling the plurality of discontinuous regions and covering the first pattern on the periphery of the plurality of discontinuous regions The shielding layer is formed, and a second patterned shielding layer is formed on a peripheral region of the substrate, and the second patterned shielding layer covers the first patterned shielding layer outside the periphery of the plurality of discontinuous regions.

In an embodiment of the invention, the plurality of discontinuous zones have a uniform size.

In an embodiment of the invention, the second patterned conductive layer has a uniform size in the conductive structure filling the plurality of discontinuous regions and covering the first patterned shielding layer located on the periphery of the plurality of discontinuous regions.

In an embodiment of the invention, the material of the second patterned conductive layer comprises one of carbon, nano copper, nano silver, and a polymer conductive resin.

In an embodiment of the invention, the first patterned shielding layer, the second patterned shielding layer, and the second patterned conductive layer are black or gray in color.

In an embodiment of the invention, the method further includes forming a wire layer on the second patterned conductive layer and the second patterned shielding layer; forming an insulating layer on the wire layer, the insulating layer exposing the wire layer a portion; and applying a conductive adhesive to the exposed portion of the wire layer to electrically connect the wire layer to a flexible circuit board.

The embodiment of the present invention further provides a method for manufacturing a touch panel, comprising: providing a substrate, the substrate is divided into a touch area and a peripheral area surrounding the touch area; forming a first patterned conductive layer on the substrate a first patterned shielding layer is formed on a peripheral region of the substrate, and the first patterned shielding layer and the first patterned conductive layer partially overlap an overlapping region, and The overlap region has a plurality of first discontinuous regions; forming a second map The masking layer is disposed on a peripheral region of the substrate, the second patterned shielding layer is located on the first patterned shielding layer, and has a plurality of second discontinuous regions in the covering portion, the plurality of second discontinuous regions Covering the plurality of first discontinuous regions; and forming a second patterned conductive layer, the second patterned conductive layer filling the plurality of first discontinuous regions and the plurality of second discontinuous regions.

In an embodiment of the invention, the plurality of first discontinuous regions have a uniform size.

In an embodiment of the invention, the plurality of second discontinuous regions have a uniform size.

In an embodiment of the invention, the second patterned conductive layer has a uniform size in a conductive structure filled in the plurality of first discontinuous regions and the plurality of second discontinuous regions.

In the embodiment of the present invention, the plurality of second discontinuous regions expose the plurality of first discontinuous regions of the first patterned shielding layer and the first patterned masking at the periphery of the plurality of first discontinuous regions Floor.

The embodiment of the invention further provides a touch panel comprising a substrate; a sensing electrode layer on the substrate; a first shielding layer on the substrate, the first shielding layer and the sensing electrode layer portion Superimposed on an overlapping region, and the first shielding layer has a plurality of first discontinuous regions of a predetermined size at a predetermined position of the overlapping region; a second shielding layer is disposed on the first shielding layer, the second shielding layer Having a plurality of second discontinuous regions in the overlap region, the plurality of second discontinuous regions covering the plurality of first discontinuous regions; and the plurality of first discontinuous regions and the plurality of second discontinuous regions And a plurality of electrically conductive structures defined, each electrically conductive structure filling one of the plurality of first discontinuous regions and one of the plurality of second discontinuous regions corresponding thereto.

In an embodiment of the invention, the plurality of first discontinuous regions have a uniform size.

In an embodiment of the invention, the plurality of second discontinuous regions have a uniform size.

In an embodiment of the invention, the plurality of electrically conductive structures have a uniform size.

In an embodiment of the invention, the plurality of second discontinuous regions expose the plurality of first discontinuous regions of the first shielding layer and the first shielding layer at a periphery of the plurality of first discontinuous regions.

In the method embodiment of the present invention, the first patterned shielding layer is fabricated before the second patterned conductive layer is fabricated. The first patterned masking layer facilitates pre-positioning the discontinuous regions such that the conductive structures formed by the subsequent second patterned conductive layer can be formed at such pre-positioned locations. Therefore, the position of the conductive structure of the second patterned conductive layer is not displaced by the pressing of the printing fixture, but can be correctly formed at a predetermined position, effectively overcoming the problem of pinhole or light leakage. In addition, in the device embodiment of the present invention, the discontinuous regions defined by the first shielding layer have the same size, and the conductive structures defined by the first shielding layer and the second shielding layer can also have the same size, so that Conductive structures have consistent performance over electrical characteristics such as impedance.

The technical content and technical features of the present invention have been disclosed as above, but it should be understood by those skilled in the art that the present invention should be understood and disclosed without departing from the spirit and scope of the disclosure. Can be used for various substitutions and modifications. For example, many of the elements disclosed above may be implemented in different structures or in other structures having the same function, or a combination thereof.

10‧‧‧Touch panel

11‧‧‧Substrate

12‧‧‧First patterned conductive layer

14‧‧‧First patterned masking layer

15‧‧‧Insulation

16‧‧‧Electroconductive adhesive

17‧‧‧Flexible circuit board

18‧‧‧Wire layer

20‧‧‧Touch panel

22‧‧‧Second patterned conductive layer

24‧‧‧Second patterned masking layer

31~35‧‧‧ Method steps

41~45‧‧‧ Method steps

53~55‧‧‧ Method steps

64~65‧‧‧ method steps

111‧‧‧ first surface

112‧‧‧ second surface

140‧‧‧discontinuous area

240‧‧‧discontinuous area

L1‧‧‧First discontinuous zone length

L2‧‧‧Second discontinuous zone length

H1‧‧‧First patterned masking layer thickness

H2‧‧‧Second patterned shadow layer thickness

H‧‧‧The total thickness of the first and second patterned masking layers

OVL‧‧‧ overlap zone

S‧‧‧ touch area

P‧‧‧ surrounding area

The foregoing summary of the invention, as well as the following detailed description, For the purposes of illustrating the invention, various embodiments are shown in the drawings. However, the invention is not limited to the precise arrangement and equipment described, and this should be understood.

1A to 1M are schematic diagrams showing a method of fabricating a touch panel according to an embodiment of the present invention; and FIGS. 2A to 2C are diagrams showing a method of fabricating a touch panel according to another embodiment of the present invention; FIG. 3 is a flow chart of a method for fabricating a touch panel according to an embodiment of the present invention; FIG. 4 is a flow chart of a method for fabricating a touch panel according to another embodiment of the present invention; A flow chart of a method for fabricating a touch panel according to an embodiment of the present invention; and FIG. 6 is a flow chart of a method for fabricating a touch panel according to still another embodiment of the present invention.

1A-1M are schematic diagrams showing a method of fabricating a touch panel according to an embodiment of the invention. Referring to the cross-sectional view of FIG. 1A and the top view of FIG. 1B, the process begins by providing a substrate 11. The substrate 11 has a first surface 111 and a second surface 112 on the opposite side of the substrate 11. The first surface 111 serves as a circuit surface of the substrate 11 for carrying the functional components of the touch panel, and the second surface 112 serves as an active surface of the substrate 11 for the user to operate the touch panel. In addition, the substrate 16 is divided into a touch area S and a peripheral area P surrounding the touch area S. A touch sensing electrode layer (not shown) is disposed in the touch area S for sensing a touch position or a track on the touch panel. A signal wire (not shown) is disposed in the peripheral area P, and is electrically connected to the touch sensing electrode layer.

In an embodiment of the invention, the substrate 11 can be a hard transparent substrate or a flexible transparent substrate, and the material thereof can be selected from the group consisting of glass, acrylic (PMMA), ethylene terephthalate, and poly. Ether oxime, polyacrylate, polyethylene naphthalate, polyphenylene sulfide, polyallyl, polycarbonate, polyethylene terephthalate, polyvinyl chloride (PVC), polypropylene (PP) ), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polystyrene (PS) and other transparent materials material.

Referring to the cross-sectional view of FIG. 1C and the top view of FIG. 1D, a first patterned conductive layer 12 is formed on the touch region S of the substrate 11 and a portion of the peripheral region P of the substrate by a process such as sputtering and etching. The first patterned conductive layer 12 serves as a touch sensing electrode layer of the touch panel, and includes a first axial sensing electrode and a second axial sensing electrode (not shown). The sensing electrodes of the first patterned conductive layer 12 are mainly located in the touch area S, and the external lines are located in the peripheral area P of the portion.

In an embodiment of the present invention, the material of the first patterned conductive layer 12 may include various transparent conductive materials, for example, indium tin oxide (ITO), indium zinc oxide (IZO), oxidation. Cadmium tin oxide (CTO), aluminum zinc oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide, cadmium oxide, cerium oxide (hafnium oxide; HfO), indium gallium zinc oxide (InGaZnO), indium gallium zinc magnesium oxide (InGaZnMgO), indium gallium magnesium oxide (InGaMgO), indium oxide Indium gallium aluminum oxide (InGaAlO), nano metal, carbon nanotube or graphene. In other embodiments of the invention, the material of the electrode may comprise an opaque conductive material, such as a metal mesh (Metal Mesh).

Referring to the cross-sectional view of FIG. 1E and the top view of FIG. 1F, a first patterned shielding layer 14 is formed on the peripheral region P of the substrate 11 by, for example, a printing and baking process. The first patterned shielding layer 14 and the first patterned conductive layer 12 partially overlap an overlap region OVL (the portion of the first patterned conductive layer 12 located in the peripheral region P), and have a plurality of discontinuous regions in the overlap region OVL. 140. The discontinuous region 140 is a hollow portion of the first patterned shielding layer 14, which exposes a portion of the first patterned conductive layer 12 located in the peripheral region P. The discontinuous area 140 is substantially along the touch area within the peripheral area P The domain S is arranged at the boundary of the peripheral region P. For the sake of simplicity, FIG. 1F only shows that the discontinuous area 140 is arranged along both sides of the boundary between the touch area S and the peripheral area P.

The first patterned masking layer 14 is typically made of an opaque material to shield components outside the touch area S, such as signal wires. In an embodiment of the present invention, the material of the first patterned shielding layer 14 may be selected from a black photoresist material, a black resin, a black ink, a low reflectivity film, or the like having other colors.

Referring to the cross-sectional view of FIG. 1G and the top view of FIG. 1H, a second patterned conductive layer 22 is formed on the plurality of discontinuous regions 140 of the first patterned shielding layer 14 by processes such as printing and baking. The second patterned conductive layer 22 is filled in the plurality of discontinuous regions 140 and protrudes from the surface of the first patterned shielding layer 14 to form a conductive structure. In the present embodiment, the conductive structure covers the first patterned shielding layer 14 located at the periphery of the discontinuous region 140. The conductive structure formed by the second patterned conductive layer 22 serves as a conductive contact when the first patterned conductive layer 12 is signal-transmitted with a host (not shown). In detail, the signal sensed by the touch sensing electrodes of the first patterned conductive layer 12 is transmitted through the conductive structure formed by the second patterned conductive layer 22, via a conductive printed circuit board (Flexible Printed Circuit Board; FPC) is transmitted to the host for analysis processing.

In the present disclosure, the first patterned shielding layer 14 is fabricated before the second patterned conductive layer 22 is fabricated. The first patterned masking layer 14 facilitates pre-positioning the discontinuous regions 140 such that the conductive structures formed by the subsequent second patterned conductive layer 22 can be formed at such pre-positioned locations. Therefore, the position of the conductive structure of the second patterned conductive layer 22 is not displaced by the pressing of the printing fixture, but can be correctly formed at a predetermined position, effectively overcoming the problem of pinhole or light leakage. In addition, since the first patterned shielding layer 14 is formed before the second patterned conductive layer 22, the discontinuous region 140 can have a uniform size, so that the conductive structure of the second patterned conductive layer 22 can also be used in subsequent processes. Consistent size for consistent performance on electrical characteristics such as impedance. In this reality In the embodiment, the conductive structure formed by the second patterned conductive layer 22 has a configuration of a narrow upper width and a wider width, which respectively contribute to the positioning of the conductive structure and the reduction of the transmission impedance.

In an embodiment of the invention, the material of the second patterned conductive layer 22 comprises one of carbon, nano copper, nano silver, and a polymer conductive resin. Moreover, the second patterned conductive layer 22 adopts the same or similar conductive material as the color of the first patterned shielding layer 14 so as to be viewed from the active surface 112 of the substrate 11, and the second patterned conductive layer 22 is not perceived. presence. In an embodiment of the invention, the color of the second patterned conductive layer 22 and the first patterned shielding layer 14 is black or gray.

Referring to the cross-sectional view of FIG. 1I and the top view of FIG. 1J, a second patterned shielding layer 24 is formed on the peripheral region P of the substrate 11 by, for example, a printing and baking process. The second patterned masking layer 24 covers the first patterned masking layer 14 that is located outside the perimeter of the plurality of discontinuous regions 140. In another embodiment of the present invention, a portion of the second patterned shielding layer 24 adjacent to the touch region S is retracted to the first patterned shielding layer 14 to expose a portion of the first patterned shielding layer 14 . The second patterned shielding layer 24 compensates for the difference in thickness between the conductive structure of the second patterned conductive layer 22 and the first patterned shielding layer 14 , and the total thickness of the first patterned shielding layer 14 and the second patterned shielding layer 24 . The conductive structure of the second patterned conductive layer 22 is substantially flush with.

In an embodiment of the present invention, the material of the second patterned shielding layer 24 may be selected from a black photoresist material, a black resin, a black ink, a low reflectivity film, or the like having other colors. Moreover, the colors of the second patterned shielding layer 24, the first patterned shielding layer 14 and the second patterned conductive layer 22 may be selected from black or gray.

Referring now to the cross-sectional view of Fig. 1K and the top view of Fig. 1L, Fig. 1K is viewed from the section line AA' of Fig. 1L. After the second patterned shielding layer 24 is formed, a wire layer 18 is formed on the second patterned conductive layer 22 and the second patterned shielding layer 24. In an embodiment of the invention, The screen printing device is used to design a screen of the fine line, and the fine line is formed by silver glue, and the wire layer 18 is printed on the second patterned conductive layer 22 and the second patterned shielding layer 24. The wire layer 18 is in contact with the second patterned conductive layer 22 to be electrically connected to the first patterned conductive layer 12. In addition, in an embodiment of the present invention, the portion of the second patterned shielding layer 24 adjacent to the touch region S is retracted to the first patterned shielding layer 14 and the wire covering the second patterned shielding layer 24. Layer 18 is also relatively constricted to first patterned masking layer 14.

Thereafter, an insulating layer 15 is formed on the wiring layer 18 by, for example, screen printing. The insulating layer 15 prevents the wire layer 18 from being oxidized by exposure to air. In addition, the insulating layer 15 exposes a portion of the wire layer 18 adjacent the outer edge of the peripheral region P to electrically connect the wire layer 18 to subsequent components. In addition, in an embodiment of the present invention, the portion of the second patterned shielding layer 24 and the wire layer 18 adjacent to the touch region S is contracted to the first patterned shielding layer 14 to cover the insulation on the wire layer 18. Layer 15 is also relatively constricted to first patterned masking layer 14. In an embodiment of the present invention, the insulating layer 15 may be made of a transparent material or a similar material of black or other colors (photoresist material, black resin, black ink, low reflectivity film, etc.), and may include inorganic materials. For example, silicon nitride, silicon oxide and silicon oxynitride may also be organic materials, such as acrylic resins, but other suitable materials, but the present invention does not This is limited to this.

Referring now to FIG. 1M, after the insulating layer 15 is formed, a conductive adhesive 16 is applied to the exposed portion of the wiring layer 18 to electrically connect the wiring layer 18 to a flexible circuit board 17, such as a flexible printed circuit board (FPC). ). In an embodiment of the present invention, an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP) is used as the conductive adhesive 16 and can be used by a hot press. The flexible circuit board 17 is press-bonded to the exposed portion of the wire layer 18.

In one embodiment of the present invention, the thickness H1 of the first patterned shielding layer 14 on the first patterned conductive layer 12 is about 7-10 millimeters (mm), and the second patterned shielding layer 24 is in the first pattern. The thickness H2 of the masking layer 14 is about 7 to 10 millimeters (mm) so that the total thickness H is about 15 to 20 millimeters (mm), which is also the thickness of the second patterned conductive layer 22. Moreover, the length L1 of the discontinuous region 140 defined by the first patterned shielding layer 14 in the direction along the boundary of the touch region S is about 3 millimeters (mm), and in the direction perpendicular to the boundary of the touch region S (penetrating) The width of the paper of Figure 1M is about 1 mm (mm). In addition, the length L2 of the second patterned conductive layer 22 on the first patterned shielding layer 14 in the direction of the boundary of the touch region S is about 3.6 millimeters (mm).

As shown in FIG. 1M, the touch panel 10 according to the embodiment of the present invention shown in FIGS. 1A to 1M includes a substrate 11, a sensing electrode layer 12, a first shielding layer 14, and a second shielding layer. 24 and a plurality of electrically conductive structures 22. The sensing electrode layer 12 is located on the substrate 11. The first shielding layer 14 is located on the substrate 11 and partially overlaps the sensing electrode layer 12 with an overlapping area OVL (the portion of the sensing electrode layer 12 located at the peripheral area P), and the first shielding layer 14 is in the overlapping area OVL. The predetermined position has a plurality of first discontinuous zones 140 of a predetermined size. The second shielding layer 24 is located on the first shielding layer 14 , and the second shielding layer 24 has a plurality of second discontinuous regions 240 (the portion of the conductive structure 22 protruding from the surface of the first shielding layer 14 ) in the overlapping region OVL. The second discontinuous zones 240 cover the plurality of first discontinuous zones 140. The first discontinuous region 140 and the second discontinuous region 240 define locations of the plurality of conductive structures 22, each conductive structure 22 filling one of the plurality of first discontinuous regions 140 and corresponding to the plurality of One of the two discontinuous zones 240.

2A-2C are schematic diagrams showing a method of fabricating a touch panel according to another embodiment of the present invention. Referring to FIG. 2A, a first patterned conductive layer 12 and a first patterned shielding layer 14 are formed on the substrate. The related method steps are detailed in FIG. 1A, FIG. 1C and FIG. 1E, and are not further described herein. Moreover, the first shielding layer 14 and the first patterned conductive layer 12 partially overlap an overlap region OVL, and the first shielding layer 14 has a plurality of predetermined first dimensions at a predetermined position of the overlapping region OVL. Continued zone 140.

Next, referring to FIG. 2B, after the first patterned shielding layer 14 is formed on the peripheral region P of the substrate 11, a second patterned shielding layer 24 is formed on the peripheral region P of the substrate 11 by, for example, a printing and baking process. The second patterned shielding layer 24 is located on the first patterned shielding layer 14 and has a plurality of second discontinuous regions 240 in the overlapping region OVL, the plurality of second discontinuous regions 240 covering the plurality of first discontinuous regions Area 140. In an embodiment of the invention, the plurality of second discontinuous regions 240 expose the plurality of first discontinuous regions 140 of the first patterned shielding layer 14 and the first pattern located at the periphery of the plurality of first discontinuous regions 140 The shielding layer 14 is provided. In addition, in the embodiment of the present invention, the plurality of first discontinuous regions 140 have the same size, and the plurality of second discontinuous regions 240 also have the same size.

Referring to FIG. 2C, a second patterned conductive layer 22 is formed at a location defined by the plurality of first discontinuous regions 140 and the plurality of second discontinuous regions 240 by processes such as printing and baking. The second patterned conductive layer 22 is filled in the plurality of first discontinuous regions 140 and the plurality of second discontinuous regions 240. In an embodiment of the invention, the second patterned conductive layer 22 has a uniform size in the conductive structures filled in the plurality of first discontinuous regions 140 and the plurality of second discontinuous regions 240. After the second patterned conductive layer 22 is formed, the subsequent method steps are detailed in FIG. 1K and FIG. 1M, and are not further described herein.

In the touch panel 20 shown in FIG. 2C, the thickness H1 of the first patterned shielding layer 14 on the first patterned conductive layer 12 is about 7-10 millimeters (mm), and the second patterned shielding layer 24 is The thickness H2 of the first patterned shielding layer 14 is about 7-10 mm, so that the total thickness H is about 15-20 mm, which is also the thickness of the second patterned conductive layer 22. Moreover, the length L1 of the discontinuous region 140 defined by the first patterned shielding layer 14 in the direction along the boundary of the touch region S is about 3 millimeters (mm), and in the direction perpendicular to the boundary of the touch region S (penetrating) The width of the paper of Figure 1M is about 1.75 millimeters (mm). In addition, the length L2 of the second patterned conductive layer 22 on the first patterned shielding layer 14 in the direction of the boundary of the touch region S is about 4 millimeters (mm).

FIG. 3 is a flow chart of a method for fabricating a touch panel according to an embodiment of the invention. Referring to FIG. 3, a substrate 11 is provided in step 31, which is divided into a touch area S and a peripheral area P surrounding the touch area S.

In step 32, a first patterned conductive layer 12 is formed on the touch region S of the substrate 11 and a portion of the peripheral region P.

In step 33, a first patterned shielding layer 14 is formed on the peripheral region P of the substrate 11. The first patterned shielding layer 14 and the first patterned conductive layer 12 partially overlap an overlap region OVL, and The overlap region OVL has a plurality of discontinuous regions 140.

In step 34, a second patterned conductive layer 22 is formed on the plurality of discontinuous regions 140 of the first patterned shielding layer 14, and the second patterned conductive layer 22 is filled in the plurality of discontinuous regions 140 and covered. A first patterned masking layer 14 is located on the periphery of the plurality of discontinuous regions 140.

In step 35, a second patterned shielding layer 24 is formed on the peripheral region P of the substrate 11. The second patterned shielding layer 24 covers the first patterned shielding layer outside the periphery of the plurality of discontinuous regions 140. 14.

FIG. 4 is a flow chart of a method for fabricating a touch panel according to another embodiment of the present invention. Referring to FIG. 4, a substrate 11 is provided in step 41. A sensing electrode layer 12 is then formed on the substrate 11 in step 42.

In step 43, a first shielding layer 14 is formed on the substrate 11. The first shielding layer 14 and the sensing electrode layer 12 partially overlap an overlap region OVL, and the first shielding layer 14 is in the overlap region OVL. The predetermined position has a plurality of discontinuous regions 140 of a predetermined size.

In step 44, a conductive structure 22 is formed in each of the plurality of discontinuous regions 140. One of the conductive structures 22 is partially filled with its corresponding discontinuous region 140, and the other portion is protruded. On the surface of the first shielding layer 14.

In step 45, a second shielding layer 24 is formed on the surface of the first shielding layer 14, and the conductive structure 22 is exposed to protrude from the other portion of the surface of the first shielding layer 14.

FIG. 5 is a flow chart of a method for fabricating a touch panel according to an embodiment of the invention. Referring to FIG. 5, step 31 and step 32 are detailed as shown in FIG. 3, and are not further described herein. In step 53, a first patterned shielding layer 14 is formed on the peripheral region P of the substrate 11. The first patterned shielding layer 14 and the first patterned conductive layer 12 partially overlap an overlap region OVL, and overlap. There are a plurality of first discontinuous regions 140 within the region OVL.

In step 54, a second patterned shielding layer 24 is formed on the peripheral region P of the substrate 11. The second patterned shielding layer 24 is located on the first patterned shielding layer 14 and has a plurality of regions in the overlap region OVL. The second discontinuous area 240 covers the plurality of first discontinuous areas 140.

In step 55, a second patterned conductive layer 22 is formed. The second patterned conductive layer 22 fills the plurality of first discontinuous regions 140 and the plurality of second discontinuous regions 240.

FIG. 6 is a flow chart showing a method of fabricating a touch panel according to still another embodiment of the present invention. Please refer to FIG. 6. Step 41, Step 42 and Step 43 are detailed as shown in FIG. 4, and are not further described herein. In step 64, a second shielding layer 24 is formed on the first shielding layer 14. The second shielding layer 24 has a plurality of second discontinuous regions 240 in the overlapping region OVL, and the plurality of second discontinuous regions 240. The plurality of first discontinuous regions 140 are covered.

In step 65, a plurality of conductive structures 22 are formed, each conductive structure 22 filling one of the corresponding ones of the plurality of first discontinuous regions 140 and one of the plurality of second discontinuous regions 240.

The technical content and technical features of the disclosure have been disclosed above, but the technical disclosure of the present disclosure It will be appreciated by those of ordinary skill in the art that the teachings and disclosures of the present disclosure may be variously substituted and modified without departing from the spirit and scope of the disclosure. For example, many of the elements disclosed above may be implemented in different structures or in other structures having the same function, or a combination of the two.

Further, the scope of the present invention is not limited to the apparatus, elements or structures of the specific embodiments disclosed above. It should be understood by those of ordinary skill in the art that, in light of the teachings and disclosures of the present disclosure, the present invention, which is present in the present invention, The functions, while achieving substantially the same results, can also be used in this disclosure. Therefore, the following patent claims are intended to cover such devices, elements or structures.

10‧‧‧Touch panel

11‧‧‧Substrate

12‧‧‧First patterned conductive layer

14‧‧‧First patterned masking layer

15‧‧‧Insulation

16‧‧‧Electroconductive adhesive

17‧‧‧Flexible circuit board

18‧‧‧Wire layer

22‧‧‧Second patterned conductive layer

24‧‧‧Second patterned masking layer

140‧‧‧First discontinuity

240‧‧‧Second discontinuous zone

L1‧‧‧First discontinuous zone length

L2‧‧‧Second discontinuous zone length

H1‧‧‧First patterned masking layer thickness

H2‧‧‧Second patterned shadow layer thickness

H‧‧‧The total thickness of the first and second patterned masking layers

OVL‧‧‧ overlap zone

P‧‧‧ surrounding area

S‧‧‧ touch area

Claims (20)

A method for manufacturing a touch panel includes: providing a substrate, the substrate is divided into a touch area and a peripheral area surrounding the touch area; forming a first patterned conductive layer on the touch area and the part of the substrate Forming a first patterned shielding layer on a peripheral region of the substrate, the first patterned shielding layer and the first patterned conductive layer partially overlapping an overlapping region, and having a plurality of overlapping regions a discontinuous region; forming a second patterned conductive layer on the plurality of discontinuous regions of the first patterned shielding layer, the second patterned conductive layer filling the plurality of discontinuous regions and covering the plurality of regions a first patterned shielding layer on a periphery of the discontinuous region; and forming a second patterned shielding layer on a peripheral region of the substrate, the second patterned shielding layer covering the first portion outside the periphery of the plurality of discontinuous regions Patterned masking layer. The method of claim 1, wherein the plurality of discontinuous regions have a uniform size. The method of claim 1, wherein the second patterned conductive layer has a uniform size in a conductive structure filling the plurality of discontinuous regions and covering the first patterned shielding layer at a periphery of the plurality of discontinuous regions. The method of claim 1, wherein the material of the second patterned conductive layer comprises one of carbon, nano copper, nano silver, and a polymer conductive resin. The method of claim 1, wherein the first patterned shielding layer, the second patterned shielding layer, and the second patterned conductive layer are black or gray in color. The method of claim 1, further comprising: forming a wire layer on the second patterned conductive layer and the second patterned shielding layer; forming an insulating layer on the wire layer, the insulating layer exposing the wire layer And applying a conductive adhesive to the exposed portion of the wire layer to electrically connect the wire layer to a flexible circuit board. A method for manufacturing a touch panel includes: providing a substrate, the substrate is divided into a touch area and a peripheral area surrounding the touch area; forming a first patterned conductive layer on the touch area and the part of the substrate Forming a first patterned shielding layer on a peripheral region of the substrate, the first patterned shielding layer and the first patterned conductive layer partially overlapping an overlapping region, and having a plurality of overlapping regions a first discontinuous region; forming a second patterned shielding layer on a peripheral region of the substrate, the second patterned shielding layer is located on the first patterned shielding layer, and having a plurality of second regions in the overlapping region a plurality of second discontinuous regions covering the plurality of first discontinuous regions; and forming a second patterned conductive layer, the second patterned conductive layer filling the plurality of first discontinuous regions and The plurality of second discontinuous regions. The method of claim 7, wherein the plurality of first discontinuous regions have a uniform size. The method of claim 7, wherein the plurality of second discontinuous regions have a uniform size. The method of claim 7, wherein the second patterned conductive layer has a uniform size in a conductive structure filled in the plurality of first discontinuous regions and the plurality of second discontinuous regions. The method of claim 7, wherein the material of the second patterned conductive layer comprises one of carbon, nano copper, nano silver, and a polymer conductive resin. The method of claim 7, wherein the first patterned shielding layer, the second patterned shielding layer, and the second patterned conductive layer are black or gray in color. The method of claim 7, wherein the plurality of second discontinuous regions expose the plurality of first discontinuous regions of the first patterned masking layer and the first patterning at a periphery of the plurality of first discontinuous regions Masking layer. The method of claim 7, further comprising: forming a wire layer on the second patterned conductive layer and the second patterned shielding layer; forming an insulating layer on the wire layer, the insulating layer exposing the wire layer And applying a conductive adhesive to the exposed portion of the wire layer to electrically connect the wire layer to a flexible circuit board. A touch panel includes: a substrate; a sensing electrode layer on the substrate; a first shielding layer on the substrate, the first shielding layer and the sensing electrode layer partially overlapping an overlap region, And the first shielding layer has a plurality of first discontinuous regions of a predetermined size at a predetermined position of the overlapping region; a second shielding layer is disposed on the first shielding layer, the second shielding layer has a plurality of second discontinuous regions in the overlapping region, the plurality of second discontinuous regions covering the plurality of first discontinuous regions; And a plurality of conductive structures defined by the plurality of first discontinuous regions and the plurality of second discontinuous regions, each conductive structure filling one of the plurality of first discontinuous regions and corresponding thereto One of the second discontinuous zones. The touch panel of claim 15, wherein the plurality of first discontinuous regions have a uniform size. The touch panel of claim 15, wherein the plurality of second discontinuous regions have a uniform size. The touch panel of claim 15, wherein the plurality of conductive structures have a uniform size. The touch panel of claim 15, wherein the material of the plurality of conductive structures comprises one of carbon, nano copper, nano silver, and a polymer conductive resin. The touch panel of claim 15, wherein the plurality of second discontinuous regions expose the plurality of first discontinuous regions of the first shielding layer and the first shielding layer at a periphery of the plurality of first discontinuous regions .