TWI566146B - Touch panel and a method of manufacturing the same - Google Patents
Touch panel and a method of manufacturing the same Download PDFInfo
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Description
本發明係有關觸控技術,特別是關於觸控面板以及其製造方法。 The present invention relates to touch technology, and more particularly to a touch panel and a method of fabricating the same.
隨著觸控技術的演進與發展,觸控面板(touch panel)或觸控螢幕(touch screen)逐漸普遍應用於電子裝置中,特別是可攜式或手持式電子裝置,例如個人數位助理(PDA)或行動電話。在許多觸控面板中,觸控感應區所感測到的信號透過導電接點,經由傳導線路與軟性印刷電路板(Flexible Printed Circuit Board;FPC)傳輸至電子裝置的主機做分析處理。在有些觸控面板的製程中,導電接點先製作完成後才進行遮蔽層之印刷。然而在導電接點製作時,因其印刷網版的網膜為柔軟材質,容易受到印刷治具之推壓而偏移,使得這些導電接點未能正確形成於預定之位置上。因此,在完成後續之遮蔽層印刷後,遮蔽層與偏移之導電接點交會處就很有可能造成針孔或漏光之現象,從而使生產良率降低。如何克服導電接點偏移之問題並使導電接點能更精確製作於預定之位置,乃觸控面板製程有待解決之一項課題。 With the evolution and development of touch technology, touch panels or touch screens are increasingly used in electronic devices, especially portable or handheld electronic devices, such as personal digital assistants (PDAs). ) or mobile phone. In many touch panels, the signals sensed by the touch sensing area are transmitted through the conductive contacts and transmitted to the host of the electronic device via a conductive line and a flexible printed circuit board (FPC) for analysis. In some touch panel processes, the conductive contacts are printed before the masking layer is printed. However, when the conductive contacts are made, the web of the printing screen is soft and easily deflected by the pressing of the printing fixture, so that the conductive contacts are not correctly formed at predetermined positions. Therefore, after the subsequent masking layer printing is completed, the intersection of the shielding layer and the offset conductive contacts is likely to cause pinholes or light leakage, thereby reducing the production yield. How to overcome the problem of the conductive contact offset and make the conductive contact can be accurately made at a predetermined position is a problem to be solved in the touch panel process.
有鑑於此,本發明的目的之一在於使導電接點能精確定位於預定之位置以提高生產良率。本發明的實施例提供一種製造觸控面板的方法,包含提供一基板,該基板劃分為一觸控區域與圍繞該觸控區域的一周邊區域,形成一第一圖案化導電層於該基板之觸控區域與部分之周邊區域上,形成一第 一圖案化遮蔽層於該基板之周邊區域,該第一圖案化遮蔽層與該第一圖案化導電層部分重疊於一重疊區,且於該重疊區內具有多個不連續區,形成一第二圖案化導電層於該第一圖案化遮蔽層的該多個不連續區,該第二圖案化導電層填入該多個不連續區並覆蓋位於該多個不連續區周緣之第一圖案化遮蔽層,以及形成一第二圖案化遮蔽層於該基板之周邊區域,該第二圖案化遮蔽層覆蓋位於該多個不連續區之周緣外的該第一圖案化遮蔽層。 In view of this, one of the objects of the present invention is to enable the conductive contacts to be accurately positioned at predetermined positions to improve production yield. An embodiment of the present invention provides a method for manufacturing a touch panel, including providing a substrate, the substrate is divided into a touch area and a peripheral area surrounding the touch area, and a first patterned conductive layer is formed on the substrate. a touch area and a peripheral area of the part form a first a patterned shielding layer is disposed on a peripheral region of the substrate, the first patterned shielding layer and the first patterned conductive layer partially overlapping an overlapping region, and having a plurality of discontinuous regions in the overlapping region to form a first The second patterned conductive layer is in the plurality of discontinuous regions of the first patterned shielding layer, the second patterned conductive layer filling the plurality of discontinuous regions and covering the first pattern on the periphery of the plurality of discontinuous regions The shielding layer is formed, and a second patterned shielding layer is formed on a peripheral region of the substrate, and the second patterned shielding layer covers the first patterned shielding layer outside the periphery of the plurality of discontinuous regions.
本發明的實施例中,該多個不連續區具有一致之尺寸。 In an embodiment of the invention, the plurality of discontinuous zones have a uniform size.
本發明的實施例中,該第二圖案化導電層在填入該多個不連續區並覆蓋位於該多個不連續區周緣之第一圖案化遮蔽層的導電結構具有一致之尺寸。 In an embodiment of the invention, the second patterned conductive layer has a uniform size in the conductive structure filling the plurality of discontinuous regions and covering the first patterned shielding layer located on the periphery of the plurality of discontinuous regions.
本發明的實施例中,該第二圖案化導電層的材料包含碳、奈米銅、奈米銀以及高分子導電樹脂的其中之一。 In an embodiment of the invention, the material of the second patterned conductive layer comprises one of carbon, nano copper, nano silver, and a polymer conductive resin.
本發明的實施例中,該第一圖案化遮蔽層、該第二圖案化遮蔽層以及該第二圖案化導電層的顏色為黑色或灰色。 In an embodiment of the invention, the first patterned shielding layer, the second patterned shielding layer, and the second patterned conductive layer are black or gray in color.
本發明的實施例中,另包含形成一導線層於該第二圖案化導電層與該第二圖案化遮蔽層上;形成一絕緣層於該導線層上,該絕緣層暴露出該導線層之一部分;以及施加一導電黏著劑至該導線層之露出部分以將該導線層電性連接至一可撓性電路板。 In an embodiment of the invention, the method further includes forming a wire layer on the second patterned conductive layer and the second patterned shielding layer; forming an insulating layer on the wire layer, the insulating layer exposing the wire layer a portion; and applying a conductive adhesive to the exposed portion of the wire layer to electrically connect the wire layer to a flexible circuit board.
本發明的實施例另提供一種製造觸控面板的方法,包含提供一基板,該基板劃分為一觸控區域與圍繞該觸控區域的一周邊區域;形成一第一圖案化導電層於該基板之觸控區域與部分之周邊區域上;形成一第一圖案化遮蔽層於該基板之周邊區域,該第一圖案化遮蔽層與該第一圖案化導電層部分重疊於一重疊區,且於該重疊區內具有多個第一不連續區;形成一第二圖 案化遮蔽層於該基板之周邊區域,該第二圖案化遮蔽層位於該第一圖案化遮蔽層上,且於該覆蓋部分具有多個第二不連續區,該多個第二不連續區涵蓋該多個第一不連續區;以及形成一第二圖案化導電層,該第二圖案化導電層填入該多個第一不連續區以及該多個第二不連續區。 The embodiment of the present invention further provides a method for manufacturing a touch panel, comprising: providing a substrate, the substrate is divided into a touch area and a peripheral area surrounding the touch area; forming a first patterned conductive layer on the substrate a first patterned shielding layer is formed on a peripheral region of the substrate, and the first patterned shielding layer and the first patterned conductive layer partially overlap an overlapping region, and The overlap region has a plurality of first discontinuous regions; forming a second map The masking layer is disposed on a peripheral region of the substrate, the second patterned shielding layer is located on the first patterned shielding layer, and has a plurality of second discontinuous regions in the covering portion, the plurality of second discontinuous regions Covering the plurality of first discontinuous regions; and forming a second patterned conductive layer, the second patterned conductive layer filling the plurality of first discontinuous regions and the plurality of second discontinuous regions.
本發明的實施例中,該多個第一不連續區具有一致之尺寸。 In an embodiment of the invention, the plurality of first discontinuous regions have a uniform size.
本發明的實施例中,該多個第二不連續區具有一致之尺寸。 In an embodiment of the invention, the plurality of second discontinuous regions have a uniform size.
本發明的實施例中,該第二圖案化導電層在填入該多個第一不連續區與該多個第二不連續區的導電結構具有一致之尺寸。 In an embodiment of the invention, the second patterned conductive layer has a uniform size in a conductive structure filled in the plurality of first discontinuous regions and the plurality of second discontinuous regions.
本發明的實施例中,該多個第二不連續區暴露出該第一圖案化遮蔽層的該多個第一不連續區與位於該多個第一不連續區周緣之第一圖案化遮蔽層。 In the embodiment of the present invention, the plurality of second discontinuous regions expose the plurality of first discontinuous regions of the first patterned shielding layer and the first patterned masking at the periphery of the plurality of first discontinuous regions Floor.
本發明的實施例另提供一種觸控面板,包含一基板;一感測電極層,位於該基板上;一第一遮蔽層,位於該基板上,該第一遮蔽層與該感測電極層部分重疊於一重疊區,且該第一遮蔽層於該重疊區之預定位置具有多個預定尺寸之第一不連續區;一第二遮蔽層,位於該第一遮蔽層上,該第二遮蔽層於該重疊區具有多個第二不連續區,該多個第二不連續區涵蓋該多個第一不連續區;以及由該多個第一不連續區與該多個第二不連續區所界定之多個導電結構,每一導電結構填入該多個第一不連續區之一以及其相對應之該多個第二不連續區之一。 The embodiment of the invention further provides a touch panel comprising a substrate; a sensing electrode layer on the substrate; a first shielding layer on the substrate, the first shielding layer and the sensing electrode layer portion Superimposed on an overlapping region, and the first shielding layer has a plurality of first discontinuous regions of a predetermined size at a predetermined position of the overlapping region; a second shielding layer is disposed on the first shielding layer, the second shielding layer Having a plurality of second discontinuous regions in the overlap region, the plurality of second discontinuous regions covering the plurality of first discontinuous regions; and the plurality of first discontinuous regions and the plurality of second discontinuous regions And a plurality of electrically conductive structures defined, each electrically conductive structure filling one of the plurality of first discontinuous regions and one of the plurality of second discontinuous regions corresponding thereto.
本發明的實施例中,該多個第一不連續區具有一致之尺寸。 In an embodiment of the invention, the plurality of first discontinuous regions have a uniform size.
本發明的實施例中,該多個第二不連續區具有一致之尺寸。 In an embodiment of the invention, the plurality of second discontinuous regions have a uniform size.
本發明的實施例中,該多個導電結構具有一致之尺寸。 In an embodiment of the invention, the plurality of electrically conductive structures have a uniform size.
本發明的實施例中,該多個第二不連續區暴露出該第一遮蔽層的該多個第一不連續區與位於該多個第一不連續區周緣之第一遮蔽層。 In an embodiment of the invention, the plurality of second discontinuous regions expose the plurality of first discontinuous regions of the first shielding layer and the first shielding layer at a periphery of the plurality of first discontinuous regions.
在本發明之方法實施例中,第一圖案化遮蔽層先製作完成後才進行第二圖案化導電層之製作。第一圖案化遮蔽層有助於使不連續區預先定位,從而使後續第二圖案化導電層所形成之導電結構能形成於此等預先定位之位置上。因此,第二圖案化導電層之導電結構位置便不會受到印刷治具之推壓而偏移,而可正確形成於預定之位置上,有效克服針孔或漏光之問題。此外,在本發明之裝置實施例中,第一遮蔽層所界定之不連續區具有一致之尺寸,且第一遮蔽層與第二遮蔽層所共同界定之導電結構也能有一致之尺寸,使得導電結構在電氣特性(例如阻抗)上具有一致之表現。 In the method embodiment of the present invention, the first patterned shielding layer is fabricated before the second patterned conductive layer is fabricated. The first patterned masking layer facilitates pre-positioning the discontinuous regions such that the conductive structures formed by the subsequent second patterned conductive layer can be formed at such pre-positioned locations. Therefore, the position of the conductive structure of the second patterned conductive layer is not displaced by the pressing of the printing fixture, but can be correctly formed at a predetermined position, effectively overcoming the problem of pinhole or light leakage. In addition, in the device embodiment of the present invention, the discontinuous regions defined by the first shielding layer have the same size, and the conductive structures defined by the first shielding layer and the second shielding layer can also have the same size, so that Conductive structures have consistent performance over electrical characteristics such as impedance.
本發明之技術內容及技術特點已揭示如上,然而本發明所屬技術領域中具有通常知識者應瞭解,在不背離後附申請專利範圍所界定之本揭露精神和範圍內,本發明之教示及揭示可作種種之替換及修飾。例如,上文揭示之許多元件可以不同之結構實施或以其它相同功能的結構予以取代,或者採用其組合。 The technical content and technical features of the present invention have been disclosed as above, but it should be understood by those skilled in the art that the present invention should be understood and disclosed without departing from the spirit and scope of the disclosure. Can be used for various substitutions and modifications. For example, many of the elements disclosed above may be implemented in different structures or in other structures having the same function, or a combination thereof.
10‧‧‧觸控面板 10‧‧‧Touch panel
11‧‧‧基板 11‧‧‧Substrate
12‧‧‧第一圖案化導電層 12‧‧‧First patterned conductive layer
14‧‧‧第一圖案化遮蔽層 14‧‧‧First patterned masking layer
15‧‧‧絕緣層 15‧‧‧Insulation
16‧‧‧導電黏著劑 16‧‧‧Electroconductive adhesive
17‧‧‧可撓性電路板 17‧‧‧Flexible circuit board
18‧‧‧導線層 18‧‧‧Wire layer
20‧‧‧觸控面板 20‧‧‧Touch panel
22‧‧‧第二圖案化導電層 22‧‧‧Second patterned conductive layer
24‧‧‧第二圖案化遮蔽層 24‧‧‧Second patterned masking layer
31~35‧‧‧方法步驟 31~35‧‧‧ Method steps
41~45‧‧‧方法步驟 41~45‧‧‧ Method steps
53~55‧‧‧方法步驟 53~55‧‧‧ Method steps
64~65‧‧‧方法步驟 64~65‧‧‧ method steps
111‧‧‧第一表面 111‧‧‧ first surface
112‧‧‧第二表面 112‧‧‧ second surface
140‧‧‧不連續區 140‧‧‧discontinuous area
240‧‧‧不連續區 240‧‧‧discontinuous area
L1‧‧‧第一不連續區長度 L1‧‧‧First discontinuous zone length
L2‧‧‧第二不連續區長度 L2‧‧‧Second discontinuous zone length
H1‧‧‧第一圖案化遮蔽層厚度 H1‧‧‧First patterned masking layer thickness
H2‧‧‧第二圖案化遮蔽層厚度 H2‧‧‧Second patterned shadow layer thickness
H‧‧‧第一與第二圖案化遮蔽層總厚度 H‧‧‧The total thickness of the first and second patterned masking layers
OVL‧‧‧重疊區 OVL‧‧‧ overlap zone
S‧‧‧觸控區域 S‧‧‧ touch area
P‧‧‧周邊區域 P‧‧‧ surrounding area
本發明之前揭摘要以及下文之詳細說明在伴隨各圖式來閱讀時當可更容易瞭解。為達本發明之說明目的,各圖式裏圖繪有現屬較佳之各具體實施例。然而本發明並不限於所繪之精確排置方式及設備裝置,此點應可理解。 The foregoing summary of the invention, as well as the following detailed description, For the purposes of illustrating the invention, various embodiments are shown in the drawings. However, the invention is not limited to the precise arrangement and equipment described, and this should be understood.
圖1A~1M所示為根據本發明之一實施例,觸控面板的製作方法示意圖;圖2A~2C所示為根據本發明之另一實施例,觸控面板的製作方法 示意圖;圖3所示為根據本發明之一實施例,觸控面板的製作方法流程圖;圖4所示為根據本發明之另一實施例,觸控面板的製作方法流程圖;圖5所示為根據本發明之一實施例,觸控面板的製作方法流程圖;以及圖6所示為根據本發明之又一實施例,觸控面板的製作方法流程圖。 1A to 1M are schematic diagrams showing a method of fabricating a touch panel according to an embodiment of the present invention; and FIGS. 2A to 2C are diagrams showing a method of fabricating a touch panel according to another embodiment of the present invention; FIG. 3 is a flow chart of a method for fabricating a touch panel according to an embodiment of the present invention; FIG. 4 is a flow chart of a method for fabricating a touch panel according to another embodiment of the present invention; A flow chart of a method for fabricating a touch panel according to an embodiment of the present invention; and FIG. 6 is a flow chart of a method for fabricating a touch panel according to still another embodiment of the present invention.
圖1A~1M所示為根據本發明之一實施例,觸控面板的製作方法示意圖。請一併參照圖1A之剖面圖與圖1B之俯視圖,製程以提供一基板11開始。基板11具有一第一表面111以及一第二表面112,位於基板11之相反側。第一表面111做為基板11之線路面,用以承載觸控面板的功能元件,而第二表面112則做為基板11之作動面,以俾使用者操作觸控面板。此外,基板16劃分為一觸控區域S與圍繞觸控區域S的一周邊區域P。觸控區域S內設置有觸控感測電極層(未繪示於圖中),用以感測觸控面板上之觸碰位置或軌跡。周邊區域P內設置有信號導線(未繪示於圖中),其電性連接觸控感測電極層。 1A-1M are schematic diagrams showing a method of fabricating a touch panel according to an embodiment of the invention. Referring to the cross-sectional view of FIG. 1A and the top view of FIG. 1B, the process begins by providing a substrate 11. The substrate 11 has a first surface 111 and a second surface 112 on the opposite side of the substrate 11. The first surface 111 serves as a circuit surface of the substrate 11 for carrying the functional components of the touch panel, and the second surface 112 serves as an active surface of the substrate 11 for the user to operate the touch panel. In addition, the substrate 16 is divided into a touch area S and a peripheral area P surrounding the touch area S. A touch sensing electrode layer (not shown) is disposed in the touch area S for sensing a touch position or a track on the touch panel. A signal wire (not shown) is disposed in the peripheral area P, and is electrically connected to the touch sensing electrode layer.
在本發明之一實施例中,基板11可為一硬式透光基板或一可撓式透光基板,其材料可選自玻璃、壓克力(PMMA)、乙烯對苯二甲酸酯、聚醚碸、聚丙烯酸酯、聚萘二甲酸乙二醇酯、聚苯硫醚、聚烯丙基、聚碳酸酯、聚對苯二甲酸乙二酯、聚氯乙烯(PVC)、聚丙烯(PP)、聚對苯二甲酸乙二醇酯(PET)、聚萘二甲酸乙二醇酯(PEN)、聚碳酸酯(PC)、聚苯乙烯(PS)等透明材 料。 In an embodiment of the invention, the substrate 11 can be a hard transparent substrate or a flexible transparent substrate, and the material thereof can be selected from the group consisting of glass, acrylic (PMMA), ethylene terephthalate, and poly. Ether oxime, polyacrylate, polyethylene naphthalate, polyphenylene sulfide, polyallyl, polycarbonate, polyethylene terephthalate, polyvinyl chloride (PVC), polypropylene (PP) ), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polystyrene (PS) and other transparent materials material.
請一併參照圖1C之剖面圖與圖1D之俯視圖,利用例如濺鍍以及蝕刻之製程,將一第一圖案化導電層12形成於基板11之觸控區域S與部分之周邊區域P上。第一圖案化導電層12做為觸控面板的觸控感測電極層,其包含第一軸向感測電極與第二軸向感測電極(圖中未標示)。第一圖案化導電層12之感測電極主要位於觸控區域S內,而外接線路則位於該部分之周邊區域P內。 Referring to the cross-sectional view of FIG. 1C and the top view of FIG. 1D, a first patterned conductive layer 12 is formed on the touch region S of the substrate 11 and a portion of the peripheral region P of the substrate by a process such as sputtering and etching. The first patterned conductive layer 12 serves as a touch sensing electrode layer of the touch panel, and includes a first axial sensing electrode and a second axial sensing electrode (not shown). The sensing electrodes of the first patterned conductive layer 12 are mainly located in the touch area S, and the external lines are located in the peripheral area P of the portion.
在本發明之一實施例中,第一圖案化導電層12的材料可包括各種透明導電材料,例如,氧化銦錫(indium tin oxide;ITO)、氧化銦鋅(indium zinc oxide;IZO)、氧化鎘錫(cadmium tin oxide;CTO)、氧化鋁鋅(aluminum zinc oxide;AZO)、氧化銦鋅錫(indium tin zinc oxide;ITZO)、氧化鋅(zinc oxide)、氧化鎘(cadmium oxide)、氧化鉿(hafnium oxide;HfO)、氧化銦鎵鋅(indium gallium zinc oxide;InGaZnO)、氧化銦鎵鋅鎂(indium gallium zinc magnesium oxide;InGaZnMgO)、氧化銦鎵鎂(indium gallium magnesium oxide;InGaMgO)、氧化銦鎵鋁(indium gallium aluminum oxide;InGaAlO)、奈米金屬、奈米碳管或石墨烯。在本發明之其他實施例中,電極的材料可包括不透明導電材料,例如金屬網格(Metal Mesh)。 In an embodiment of the present invention, the material of the first patterned conductive layer 12 may include various transparent conductive materials, for example, indium tin oxide (ITO), indium zinc oxide (IZO), oxidation. Cadmium tin oxide (CTO), aluminum zinc oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide, cadmium oxide, cerium oxide (hafnium oxide; HfO), indium gallium zinc oxide (InGaZnO), indium gallium zinc magnesium oxide (InGaZnMgO), indium gallium magnesium oxide (InGaMgO), indium oxide Indium gallium aluminum oxide (InGaAlO), nano metal, carbon nanotube or graphene. In other embodiments of the invention, the material of the electrode may comprise an opaque conductive material, such as a metal mesh (Metal Mesh).
請一併參照圖1E之剖面圖與圖1F之俯視圖,利用例如印刷及烘烤之製程,將一第一圖案化遮蔽層14形成於基板11之周邊區域P。第一圖案化遮蔽層14與第一圖案化導電層12部分重疊於一重疊區OVL(第一圖案化導電層12位於周邊區域P的部分),且於重疊區OVL內具有多個不連續區140。不連續區140係第一圖案化遮蔽層14之鏤空部分,其暴露出部分位於周邊區域P的第一圖案化導電層12。不連續區140大致上在周邊區域P內沿觸控區 域S與周邊區域P之邊界排列。為求圖式簡潔,圖1F僅繪示不連續區140沿觸控區域S與周邊區域P之邊界的兩側邊排列。 Referring to the cross-sectional view of FIG. 1E and the top view of FIG. 1F, a first patterned shielding layer 14 is formed on the peripheral region P of the substrate 11 by, for example, a printing and baking process. The first patterned shielding layer 14 and the first patterned conductive layer 12 partially overlap an overlap region OVL (the portion of the first patterned conductive layer 12 located in the peripheral region P), and have a plurality of discontinuous regions in the overlap region OVL. 140. The discontinuous region 140 is a hollow portion of the first patterned shielding layer 14, which exposes a portion of the first patterned conductive layer 12 located in the peripheral region P. The discontinuous area 140 is substantially along the touch area within the peripheral area P The domain S is arranged at the boundary of the peripheral region P. For the sake of simplicity, FIG. 1F only shows that the discontinuous area 140 is arranged along both sides of the boundary between the touch area S and the peripheral area P.
第一圖案化遮蔽層14通常採用不透明材料製成,以遮蔽觸控區域S外之元件例如信號導線。在本發明之一實施例中,第一圖案化遮蔽層14的材料可選自黑色光阻材料、黑色樹脂、黑色油墨、低反射率的薄膜或具有其他顏色的類似材料。 The first patterned masking layer 14 is typically made of an opaque material to shield components outside the touch area S, such as signal wires. In an embodiment of the present invention, the material of the first patterned shielding layer 14 may be selected from a black photoresist material, a black resin, a black ink, a low reflectivity film, or the like having other colors.
請一併參照圖1G之剖面圖與圖1H之俯視圖,利用例如印刷及烘烤之製程,將一第二圖案化導電層22形成於第一圖案化遮蔽層14的多個不連續區140。第二圖案化導電層22填入多個不連續區140中並且突出於第一圖案化遮蔽層14之表面,形成一導電結構。在本實施例中,此導電結構覆蓋位於該不連續區140周緣之第一圖案化遮蔽層14。由第二圖案化導電層22所形成之導電結構做為第一圖案化導電層12與一主機(圖中未標示)做信號傳輸時之導電接點。詳言之,第一圖案化導電層12之觸控感測電極所感測到的信號透過第二圖案化導電層22所形成之導電結構,經由傳導線路與軟性印刷電路板(Flexible Printed Circuit Board;FPC)傳輸至主機做分析處理。 Referring to the cross-sectional view of FIG. 1G and the top view of FIG. 1H, a second patterned conductive layer 22 is formed on the plurality of discontinuous regions 140 of the first patterned shielding layer 14 by processes such as printing and baking. The second patterned conductive layer 22 is filled in the plurality of discontinuous regions 140 and protrudes from the surface of the first patterned shielding layer 14 to form a conductive structure. In the present embodiment, the conductive structure covers the first patterned shielding layer 14 located at the periphery of the discontinuous region 140. The conductive structure formed by the second patterned conductive layer 22 serves as a conductive contact when the first patterned conductive layer 12 is signal-transmitted with a host (not shown). In detail, the signal sensed by the touch sensing electrodes of the first patterned conductive layer 12 is transmitted through the conductive structure formed by the second patterned conductive layer 22, via a conductive printed circuit board (Flexible Printed Circuit Board; FPC) is transmitted to the host for analysis processing.
在本揭露中,第一圖案化遮蔽層14先製作完成後才進行第二圖案化導電層22之製作。第一圖案化遮蔽層14有助於使不連續區140預先定位,從而使後續第二圖案化導電層22所形成之導電結構能形成於此等預先定位之位置上。因此,第二圖案化導電層22之導電結構位置便不會受到印刷治具之推壓而偏移,而可正確形成於預定之位置上,有效克服針孔或漏光之問題。此外,因第一圖案化遮蔽層14先於第二圖案化導電層22製作,不連續區140能具有一致之尺寸,以俾於後續製程中第二圖案化導電層22之導電結構也能有一致之尺寸,從而在電氣特性(例如阻抗)上具有一致之表現。在本實 施例中,由第二圖案化導電層22所形成之導電結構具有一下窄上寬之構形,分別有助於導電結構之定位與傳輸阻抗之降低。 In the present disclosure, the first patterned shielding layer 14 is fabricated before the second patterned conductive layer 22 is fabricated. The first patterned masking layer 14 facilitates pre-positioning the discontinuous regions 140 such that the conductive structures formed by the subsequent second patterned conductive layer 22 can be formed at such pre-positioned locations. Therefore, the position of the conductive structure of the second patterned conductive layer 22 is not displaced by the pressing of the printing fixture, but can be correctly formed at a predetermined position, effectively overcoming the problem of pinhole or light leakage. In addition, since the first patterned shielding layer 14 is formed before the second patterned conductive layer 22, the discontinuous region 140 can have a uniform size, so that the conductive structure of the second patterned conductive layer 22 can also be used in subsequent processes. Consistent size for consistent performance on electrical characteristics such as impedance. In this reality In the embodiment, the conductive structure formed by the second patterned conductive layer 22 has a configuration of a narrow upper width and a wider width, which respectively contribute to the positioning of the conductive structure and the reduction of the transmission impedance.
在本發明之一實施例中,第二圖案化導電層22的材料包含碳、奈米銅、奈米銀以及高分子導電樹脂的其中之一。又,第二圖案化導電層22採用與第一圖案化遮蔽層14之顏色相同或近似的導電物質,以使自基板11之作動面112觀之,不致察覺有第二圖案化導電層22之存在。在本發明之一實施例中,第二圖案化導電層22與第一圖案化遮蔽層14之顏色為黑色或灰色。 In an embodiment of the invention, the material of the second patterned conductive layer 22 comprises one of carbon, nano copper, nano silver, and a polymer conductive resin. Moreover, the second patterned conductive layer 22 adopts the same or similar conductive material as the color of the first patterned shielding layer 14 so as to be viewed from the active surface 112 of the substrate 11, and the second patterned conductive layer 22 is not perceived. presence. In an embodiment of the invention, the color of the second patterned conductive layer 22 and the first patterned shielding layer 14 is black or gray.
請一併參照圖1I之剖面圖與圖1J之俯視圖,利用例如印刷及烘烤之製程,將一第二圖案化遮蔽層24形成於基板11之周邊區域P。第二圖案化遮蔽層24覆蓋位於多個不連續區140之周緣外的第一圖案化遮蔽層14。在本發明之另一實施例中,第二圖案化遮蔽層24靠近觸控區域S之部分係內縮於第一圖案化遮蔽層14而暴露出部分之第一圖案化遮蔽層14。第二圖案化遮蔽層24彌補第二圖案化導電層22之導電結構突出於第一圖案化遮蔽層14之厚度差,使第一圖案化遮蔽層14與第二圖案化遮蔽層24之總厚度與第二圖案化導電層22之導電結構大致上相齊平。 Referring to the cross-sectional view of FIG. 1I and the top view of FIG. 1J, a second patterned shielding layer 24 is formed on the peripheral region P of the substrate 11 by, for example, a printing and baking process. The second patterned masking layer 24 covers the first patterned masking layer 14 that is located outside the perimeter of the plurality of discontinuous regions 140. In another embodiment of the present invention, a portion of the second patterned shielding layer 24 adjacent to the touch region S is retracted to the first patterned shielding layer 14 to expose a portion of the first patterned shielding layer 14 . The second patterned shielding layer 24 compensates for the difference in thickness between the conductive structure of the second patterned conductive layer 22 and the first patterned shielding layer 14 , and the total thickness of the first patterned shielding layer 14 and the second patterned shielding layer 24 . The conductive structure of the second patterned conductive layer 22 is substantially flush with.
在本發明之一實施例中,第二圖案化遮蔽層24的材料可選自黑色光阻材料、黑色樹脂、黑色油墨、低反射率的薄膜或具有其他顏色的類似材料。又,第二圖案化遮蔽層24、第一圖案化遮蔽層14與第二圖案化導電層22之顏色可選自為黑色或灰色。 In an embodiment of the present invention, the material of the second patterned shielding layer 24 may be selected from a black photoresist material, a black resin, a black ink, a low reflectivity film, or the like having other colors. Moreover, the colors of the second patterned shielding layer 24, the first patterned shielding layer 14 and the second patterned conductive layer 22 may be selected from black or gray.
現請一併參照圖1K之剖面圖與圖1L之俯視圖,其中圖1K係自圖1L之剖面線AA'觀之。在形成第二圖案化遮蔽層24後,一導線層18形成於第二圖案化導電層22與第二圖案化遮蔽層24上。在本發明之一實施例中, 係採用網印設備配合設計細線路之網版,並以銀膠形成細線路,將導線層18印刷覆蓋在第二圖案化導電層22與第二圖案化遮蔽層24上。導線層18與第二圖案化導電層22相接觸,以與第一圖案化導電層12電性連接。另,在本發明之一實施例中,因第二圖案化遮蔽層24靠近觸控區域S之部分係內縮於第一圖案化遮蔽層14,覆蓋在第二圖案化遮蔽層24上的導線層18亦相對內縮於第一圖案化遮蔽層14。 Referring now to the cross-sectional view of Fig. 1K and the top view of Fig. 1L, Fig. 1K is viewed from the section line AA' of Fig. 1L. After the second patterned shielding layer 24 is formed, a wire layer 18 is formed on the second patterned conductive layer 22 and the second patterned shielding layer 24. In an embodiment of the invention, The screen printing device is used to design a screen of the fine line, and the fine line is formed by silver glue, and the wire layer 18 is printed on the second patterned conductive layer 22 and the second patterned shielding layer 24. The wire layer 18 is in contact with the second patterned conductive layer 22 to be electrically connected to the first patterned conductive layer 12. In addition, in an embodiment of the present invention, the portion of the second patterned shielding layer 24 adjacent to the touch region S is retracted to the first patterned shielding layer 14 and the wire covering the second patterned shielding layer 24. Layer 18 is also relatively constricted to first patterned masking layer 14.
其後,利用例如網版印刷將一絕緣層15形成於導線層18上。絕緣層15可避免導線層18因暴露於空氣中造成氧化。此外,絕緣層15暴露出導線層18靠近周邊區域P外緣之一部分,以俾導線層18與後續之元件電性連接。另,在本發明之一實施例中,因第二圖案化遮蔽層24與導線層18靠近觸控區域S之部分係內縮於第一圖案化遮蔽層14,覆蓋在導線層18上的絕緣層15亦相對內縮於第一圖案化遮蔽層14。在本發明之一實施例中,絕緣層15可為透明材料或黑色或具有其他顏色的類似材料製成(光阻材料、黑色樹脂、黑色油墨、低反射率的薄膜等),可包括無機材料,例如氮化矽(silicon nitride)、氧化矽(silicon oxide)與氮氧化矽(silicon oxynitride),也可為有機材料,例如丙烯酸類樹脂(acrylic resin)等其它適合的材料,但本發明並不以此為限。 Thereafter, an insulating layer 15 is formed on the wiring layer 18 by, for example, screen printing. The insulating layer 15 prevents the wire layer 18 from being oxidized by exposure to air. In addition, the insulating layer 15 exposes a portion of the wire layer 18 adjacent the outer edge of the peripheral region P to electrically connect the wire layer 18 to subsequent components. In addition, in an embodiment of the present invention, the portion of the second patterned shielding layer 24 and the wire layer 18 adjacent to the touch region S is contracted to the first patterned shielding layer 14 to cover the insulation on the wire layer 18. Layer 15 is also relatively constricted to first patterned masking layer 14. In an embodiment of the present invention, the insulating layer 15 may be made of a transparent material or a similar material of black or other colors (photoresist material, black resin, black ink, low reflectivity film, etc.), and may include inorganic materials. For example, silicon nitride, silicon oxide and silicon oxynitride may also be organic materials, such as acrylic resins, but other suitable materials, but the present invention does not This is limited to this.
現請參照圖1M,在形成絕緣層15後,施加一導電黏著劑16至導線層18之露出部分以將導線層18電性連接至一可撓性電路板17,例如軟性印刷電路板(FPC)。在本發明之一實施例中,係以異方性導電膜(Anisotropic Conductive Film;ACF)或異方性導電膠(Anisotropic Conductive Paste;ACP)作為導電黏著劑16,並利用一熱壓機將可撓性電路板17壓合黏著於導線層18之露出部分上。 Referring now to FIG. 1M, after the insulating layer 15 is formed, a conductive adhesive 16 is applied to the exposed portion of the wiring layer 18 to electrically connect the wiring layer 18 to a flexible circuit board 17, such as a flexible printed circuit board (FPC). ). In an embodiment of the present invention, an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP) is used as the conductive adhesive 16 and can be used by a hot press. The flexible circuit board 17 is press-bonded to the exposed portion of the wire layer 18.
在本發明之一實施例中,第一圖案化遮蔽層14在第一圖案化導電層12上之厚度H1約為7~10毫米(mm),而第二圖案化遮蔽層24在第一圖案化遮蔽層14上之厚度H2約為7~10毫米(mm),使其總厚度H約為15~20毫米(mm),此亦為第二圖案化導電層22之厚度。又,第一圖案化遮蔽層14所界定之不連續區140在沿觸控區域S邊界之方向的長度L1約為3毫米(mm),而在垂直於觸控區域S邊界之方向(穿入圖1M紙面)的寬度約為1毫米(mm)。另外,第二圖案化導電層22在第一圖案化遮蔽層14上,沿觸控區域S邊界之方向的長度L2約為3.6毫米(mm)。 In one embodiment of the present invention, the thickness H1 of the first patterned shielding layer 14 on the first patterned conductive layer 12 is about 7-10 millimeters (mm), and the second patterned shielding layer 24 is in the first pattern. The thickness H2 of the masking layer 14 is about 7 to 10 millimeters (mm) so that the total thickness H is about 15 to 20 millimeters (mm), which is also the thickness of the second patterned conductive layer 22. Moreover, the length L1 of the discontinuous region 140 defined by the first patterned shielding layer 14 in the direction along the boundary of the touch region S is about 3 millimeters (mm), and in the direction perpendicular to the boundary of the touch region S (penetrating) The width of the paper of Figure 1M is about 1 mm (mm). In addition, the length L2 of the second patterned conductive layer 22 on the first patterned shielding layer 14 in the direction of the boundary of the touch region S is about 3.6 millimeters (mm).
如圖1M所示,由圖1A~1M所示根據本發明之實施例所製作之觸控面板10包含一基板11、一感測電極層12、一第一遮蔽層14、一第二遮蔽層24與多個導電結構22。感測電極層12位於該基板11上。第一遮蔽層14位於基板11上,並與感測電極層12部分重疊於一重疊區OVL(感測電極層12位於周邊區域P的部分),且第一遮蔽層14於該重疊區OVL之預定位置具有多個預定尺寸之第一不連續區140。第二遮蔽層24位於第一遮蔽層14上,且第二遮蔽層24於該重疊區OVL具有多個第二不連續區240(導電結構22突出第一遮蔽層14表面之部分),該多個第二不連續區240涵蓋該多個第一不連續區140。第一不連續區140與第二不連續區240界定出多個導電結構22之位置,每一導電結構22填入該多個第一不連續區140之一以及其相對應之該多個第二不連續區240之一。 As shown in FIG. 1M, the touch panel 10 according to the embodiment of the present invention shown in FIGS. 1A to 1M includes a substrate 11, a sensing electrode layer 12, a first shielding layer 14, and a second shielding layer. 24 and a plurality of electrically conductive structures 22. The sensing electrode layer 12 is located on the substrate 11. The first shielding layer 14 is located on the substrate 11 and partially overlaps the sensing electrode layer 12 with an overlapping area OVL (the portion of the sensing electrode layer 12 located at the peripheral area P), and the first shielding layer 14 is in the overlapping area OVL. The predetermined position has a plurality of first discontinuous zones 140 of a predetermined size. The second shielding layer 24 is located on the first shielding layer 14 , and the second shielding layer 24 has a plurality of second discontinuous regions 240 (the portion of the conductive structure 22 protruding from the surface of the first shielding layer 14 ) in the overlapping region OVL. The second discontinuous zones 240 cover the plurality of first discontinuous zones 140. The first discontinuous region 140 and the second discontinuous region 240 define locations of the plurality of conductive structures 22, each conductive structure 22 filling one of the plurality of first discontinuous regions 140 and corresponding to the plurality of One of the two discontinuous zones 240.
圖2A~2C所示為根據本發明之另一實施例,觸控面板的製作方法示意圖。請參照圖2A,係於基板上形成第一圖案化導電層12與第一圖案化遮蔽層14。其相關方法步驟已詳述於圖1A、圖1C與圖1E中,於此不另贅敘。又,第一遮蔽層14與第一圖案化導電層12部分重疊於一重疊區OVL,且第一遮蔽層14於該重疊區OVL之預定位置具有多個預定尺寸之第一不連 續區140。 2A-2C are schematic diagrams showing a method of fabricating a touch panel according to another embodiment of the present invention. Referring to FIG. 2A, a first patterned conductive layer 12 and a first patterned shielding layer 14 are formed on the substrate. The related method steps are detailed in FIG. 1A, FIG. 1C and FIG. 1E, and are not further described herein. Moreover, the first shielding layer 14 and the first patterned conductive layer 12 partially overlap an overlap region OVL, and the first shielding layer 14 has a plurality of predetermined first dimensions at a predetermined position of the overlapping region OVL. Continued zone 140.
接著請參照圖2B,於形成第一圖案化遮蔽層14於基板11之周邊區域P後,利用例如印刷及烘烤之製程,形成一第二圖案化遮蔽層24於基板11之周邊區域P。第二圖案化遮蔽層24位於第一圖案化遮蔽層14上,且於該重疊區OVL具有多個第二不連續區240,該多個第二不連續區240涵蓋該多個第一不連續區140。在本發明之一實施例中,多個第二不連續區240暴露出第一圖案化遮蔽層14的多個第一不連續區140與位於多個第一不連續區140周緣之第一圖案化遮蔽層14。另,在本發明之實施例中,多個第一不連續區140具有一致之尺寸,又,多個第二不連續區240亦具有一致之尺寸。 Next, referring to FIG. 2B, after the first patterned shielding layer 14 is formed on the peripheral region P of the substrate 11, a second patterned shielding layer 24 is formed on the peripheral region P of the substrate 11 by, for example, a printing and baking process. The second patterned shielding layer 24 is located on the first patterned shielding layer 14 and has a plurality of second discontinuous regions 240 in the overlapping region OVL, the plurality of second discontinuous regions 240 covering the plurality of first discontinuous regions Area 140. In an embodiment of the invention, the plurality of second discontinuous regions 240 expose the plurality of first discontinuous regions 140 of the first patterned shielding layer 14 and the first pattern located at the periphery of the plurality of first discontinuous regions 140 The shielding layer 14 is provided. In addition, in the embodiment of the present invention, the plurality of first discontinuous regions 140 have the same size, and the plurality of second discontinuous regions 240 also have the same size.
請參照圖2C,利用例如印刷及烘烤之製程,形成一第二圖案化導電層22於多個第一不連續區140與多個第二不連續區240所界定之位置。第二圖案化導電層22填入多個第一不連續區140以及多個第二不連續區240中。在本發明之實施例中,第二圖案化導電層22在填入多個第一不連續區140與多個第二不連續區240的導電結構具有一致之尺寸。第二圖案化導電層22形成後,其後相關之方法步驟已詳述於圖1K與圖1M中,於此不另贅敘。 Referring to FIG. 2C, a second patterned conductive layer 22 is formed at a location defined by the plurality of first discontinuous regions 140 and the plurality of second discontinuous regions 240 by processes such as printing and baking. The second patterned conductive layer 22 is filled in the plurality of first discontinuous regions 140 and the plurality of second discontinuous regions 240. In an embodiment of the invention, the second patterned conductive layer 22 has a uniform size in the conductive structures filled in the plurality of first discontinuous regions 140 and the plurality of second discontinuous regions 240. After the second patterned conductive layer 22 is formed, the subsequent method steps are detailed in FIG. 1K and FIG. 1M, and are not further described herein.
在圖2C所示之觸控面板20中,第一圖案化遮蔽層14在第一圖案化導電層12上之厚度H1約為7~10毫米(mm),而第二圖案化遮蔽層24在第一圖案化遮蔽層14上之厚度H2約為7~10毫米(mm),使其總厚度H約為15~20毫米(mm),此亦為第二圖案化導電層22之厚度。又,第一圖案化遮蔽層14所界定之不連續區140在沿觸控區域S邊界之方向的長度L1約為3毫米(mm),而在垂直於觸控區域S邊界之方向(穿入圖1M紙面)的寬度約為1.75毫米(mm)。另外,第二圖案化導電層22在第一圖案化遮蔽層14上,沿觸控區域S邊界之方向的長度L2約為4毫米(mm)。 In the touch panel 20 shown in FIG. 2C, the thickness H1 of the first patterned shielding layer 14 on the first patterned conductive layer 12 is about 7-10 millimeters (mm), and the second patterned shielding layer 24 is The thickness H2 of the first patterned shielding layer 14 is about 7-10 mm, so that the total thickness H is about 15-20 mm, which is also the thickness of the second patterned conductive layer 22. Moreover, the length L1 of the discontinuous region 140 defined by the first patterned shielding layer 14 in the direction along the boundary of the touch region S is about 3 millimeters (mm), and in the direction perpendicular to the boundary of the touch region S (penetrating) The width of the paper of Figure 1M is about 1.75 millimeters (mm). In addition, the length L2 of the second patterned conductive layer 22 on the first patterned shielding layer 14 in the direction of the boundary of the touch region S is about 4 millimeters (mm).
圖3所示為根據本發明之一實施例,觸控面板的製作方法流程圖。請參照圖3,於步驟31提供一基板11,其劃分為一觸控區域S以及一圍繞該觸控區域S的周邊區域P。 FIG. 3 is a flow chart of a method for fabricating a touch panel according to an embodiment of the invention. Referring to FIG. 3, a substrate 11 is provided in step 31, which is divided into a touch area S and a peripheral area P surrounding the touch area S.
於步驟32,形成一第一圖案化導電層12於該基板11之觸控區域S與部分之周邊區域P上。 In step 32, a first patterned conductive layer 12 is formed on the touch region S of the substrate 11 and a portion of the peripheral region P.
於步驟33,形成一第一圖案化遮蔽層14於該基板11之周邊區域P,該第一圖案化遮蔽層14與該第一圖案化導電層12部分重疊於一重疊區OVL,且於該重疊區OVL具有多個不連續區140。 In step 33, a first patterned shielding layer 14 is formed on the peripheral region P of the substrate 11. The first patterned shielding layer 14 and the first patterned conductive layer 12 partially overlap an overlap region OVL, and The overlap region OVL has a plurality of discontinuous regions 140.
於步驟34,形成一第二圖案化導電層22於該第一圖案化遮蔽層14的該多個不連續區140,該第二圖案化導電層22填入該多個不連續區140並覆蓋位於該多個不連續區140周緣之第一圖案化遮蔽層14。 In step 34, a second patterned conductive layer 22 is formed on the plurality of discontinuous regions 140 of the first patterned shielding layer 14, and the second patterned conductive layer 22 is filled in the plurality of discontinuous regions 140 and covered. A first patterned masking layer 14 is located on the periphery of the plurality of discontinuous regions 140.
於步驟35,形成一第二圖案化遮蔽層24於該基板11之周邊區域P,該第二圖案化遮蔽層24覆蓋位於該多個不連續區140之周緣外的該第一圖案化遮蔽層14。 In step 35, a second patterned shielding layer 24 is formed on the peripheral region P of the substrate 11. The second patterned shielding layer 24 covers the first patterned shielding layer outside the periphery of the plurality of discontinuous regions 140. 14.
圖4所示為根據本發明之另一實施例,觸控面板的製作方法流程圖。請參照圖4,於步驟41提供一基板11。然後於步驟42形成一感測電極層12於該基板11上。 FIG. 4 is a flow chart of a method for fabricating a touch panel according to another embodiment of the present invention. Referring to FIG. 4, a substrate 11 is provided in step 41. A sensing electrode layer 12 is then formed on the substrate 11 in step 42.
於步驟43,形成一第一遮蔽層14於該基板11上,該第一遮蔽層14與該感測電極層12部分重疊於一重疊區OVL,且該第一遮蔽層14於該重疊區OVL之預定位置具有多個預定尺寸之不連續區140。 In step 43, a first shielding layer 14 is formed on the substrate 11. The first shielding layer 14 and the sensing electrode layer 12 partially overlap an overlap region OVL, and the first shielding layer 14 is in the overlap region OVL. The predetermined position has a plurality of discontinuous regions 140 of a predetermined size.
於步驟44,形成一導電結構22於該多個不連續區140之每一不連續區,該導電結構22之一部分填入其相對應之不連續區140,另一部份突出 於該第一遮蔽層14之表面。 In step 44, a conductive structure 22 is formed in each of the plurality of discontinuous regions 140. One of the conductive structures 22 is partially filled with its corresponding discontinuous region 140, and the other portion is protruded. On the surface of the first shielding layer 14.
於步驟45,形成一第二遮蔽層24於該第一遮蔽層14之表面上,並暴露出該導電結構22突出於第一遮蔽層14表面之該另一部份。 In step 45, a second shielding layer 24 is formed on the surface of the first shielding layer 14, and the conductive structure 22 is exposed to protrude from the other portion of the surface of the first shielding layer 14.
圖5所示為根據本發明之一實施例,觸控面板的製作方法流程圖。請參照圖5,步驟31與步驟32已詳如圖3,於此不另贅敘。於步驟53,形成一第一圖案化遮蔽層14於該基板11之周邊區域P,該第一圖案化遮蔽層14與該第一圖案化導電層12部分重疊於一重疊區OVL,且於重疊區OVL內具有多個第一不連續區140。 FIG. 5 is a flow chart of a method for fabricating a touch panel according to an embodiment of the invention. Referring to FIG. 5, step 31 and step 32 are detailed as shown in FIG. 3, and are not further described herein. In step 53, a first patterned shielding layer 14 is formed on the peripheral region P of the substrate 11. The first patterned shielding layer 14 and the first patterned conductive layer 12 partially overlap an overlap region OVL, and overlap. There are a plurality of first discontinuous regions 140 within the region OVL.
於步驟54,形成一第二圖案化遮蔽層24於該基板11之周邊區域P,該第二圖案化遮蔽層24位於該第一圖案化遮蔽層14上,且於重疊區OVL內具有多個第二不連續區240,該多個第二不連續區240涵蓋該多個第一不連續區140。 In step 54, a second patterned shielding layer 24 is formed on the peripheral region P of the substrate 11. The second patterned shielding layer 24 is located on the first patterned shielding layer 14 and has a plurality of regions in the overlap region OVL. The second discontinuous area 240 covers the plurality of first discontinuous areas 140.
於步驟55,形成一第二圖案化導電層22,該第二圖案化導電層22填入該多個第一不連續區140以及該多個第二不連續區240。 In step 55, a second patterned conductive layer 22 is formed. The second patterned conductive layer 22 fills the plurality of first discontinuous regions 140 and the plurality of second discontinuous regions 240.
圖6所示為根據本發明之又一實施例,觸控面板的製作方法流程圖。請參照圖6,步驟41、步驟42與步驟43已詳如圖4,於此不另贅敘。於步驟64,形成一第二遮蔽層24於該第一遮蔽層14上,該第二遮蔽層24於該重疊區OVL具有多個第二不連續區240,該多個第二不連續區240涵蓋該多個第一不連續區140。 FIG. 6 is a flow chart showing a method of fabricating a touch panel according to still another embodiment of the present invention. Please refer to FIG. 6. Step 41, Step 42 and Step 43 are detailed as shown in FIG. 4, and are not further described herein. In step 64, a second shielding layer 24 is formed on the first shielding layer 14. The second shielding layer 24 has a plurality of second discontinuous regions 240 in the overlapping region OVL, and the plurality of second discontinuous regions 240. The plurality of first discontinuous regions 140 are covered.
於步驟65,形成多個導電結構22,每一導電結構22填入其相對應之該多個第一不連續區140之一以及該多個第二不連續區240之一。 In step 65, a plurality of conductive structures 22 are formed, each conductive structure 22 filling one of the corresponding ones of the plurality of first discontinuous regions 140 and one of the plurality of second discontinuous regions 240.
本揭露之技術內容及技術特點已揭示如上,然而本揭露所屬技術領 域中具有通常知識者應瞭解,在不背離後附申請專利範圍所界定之本揭露精神和範圍內,本揭露之教示及揭示可作種種之替換及修飾。例如,上文揭示之許多元件可以不同之結構實施或以其它相同功能的結構予以取代,或者採用上述二種方式之組合。 The technical content and technical features of the disclosure have been disclosed above, but the technical disclosure of the present disclosure It will be appreciated by those of ordinary skill in the art that the teachings and disclosures of the present disclosure may be variously substituted and modified without departing from the spirit and scope of the disclosure. For example, many of the elements disclosed above may be implemented in different structures or in other structures having the same function, or a combination of the two.
此外,本案之權利範圍並不侷限於上文揭示之特定實施例的裝置、元件或結構。本揭露所屬技術領域中具有通常知識者應瞭解,基於本揭露教示及揭示裝置、元件或結構,無論現在已存在或日後開發者,其與本案實施例揭示者係以實質相同的方式執行實質相同的功能,而達到實質相同的結果,亦可使用於本揭露。因此,以下之申請專利範圍係用以涵蓋此類裝置、元件或結構。 Further, the scope of the present invention is not limited to the apparatus, elements or structures of the specific embodiments disclosed above. It should be understood by those of ordinary skill in the art that, in light of the teachings and disclosures of the present disclosure, the present invention, which is present in the present invention, The functions, while achieving substantially the same results, can also be used in this disclosure. Therefore, the following patent claims are intended to cover such devices, elements or structures.
10‧‧‧觸控面板 10‧‧‧Touch panel
11‧‧‧基板 11‧‧‧Substrate
12‧‧‧第一圖案化導電層 12‧‧‧First patterned conductive layer
14‧‧‧第一圖案化遮蔽層 14‧‧‧First patterned masking layer
15‧‧‧絕緣層 15‧‧‧Insulation
16‧‧‧導電黏著劑 16‧‧‧Electroconductive adhesive
17‧‧‧可撓性電路板 17‧‧‧Flexible circuit board
18‧‧‧導線層 18‧‧‧Wire layer
22‧‧‧第二圖案化導電層 22‧‧‧Second patterned conductive layer
24‧‧‧第二圖案化遮蔽層 24‧‧‧Second patterned masking layer
140‧‧‧第一不連續區 140‧‧‧First discontinuity
240‧‧‧第二不連續區 240‧‧‧Second discontinuous zone
L1‧‧‧第一不連續區長度 L1‧‧‧First discontinuous zone length
L2‧‧‧第二不連續區長度 L2‧‧‧Second discontinuous zone length
H1‧‧‧第一圖案化遮蔽層厚度 H1‧‧‧First patterned masking layer thickness
H2‧‧‧第二圖案化遮蔽層厚度 H2‧‧‧Second patterned shadow layer thickness
H‧‧‧第一與第二圖案化遮蔽層總厚度 H‧‧‧The total thickness of the first and second patterned masking layers
OVL‧‧‧重疊區 OVL‧‧‧ overlap zone
P‧‧‧周邊區域 P‧‧‧ surrounding area
S‧‧‧觸控區域 S‧‧‧ touch area
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CN105786264B (en) * | 2016-05-20 | 2020-07-28 | 京东方科技集团股份有限公司 | Touch screen, manufacturing method thereof and touch device |
KR20180026348A (en) * | 2016-09-02 | 2018-03-12 | 스템코 주식회사 | A method of fabricating flexible printed circuit boards and the flexble printed circuit boards made by using the same |
CN114327110A (en) | 2020-09-30 | 2022-04-12 | 宸美(厦门)光电有限公司 | Touch control module |
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CN114385020B (en) * | 2020-10-21 | 2024-04-19 | 宸美(厦门)光电有限公司 | Touch panel and touch device |
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TWM454581U (en) * | 2012-05-16 | 2013-06-01 | Tpk Touch Solutions Xiamen Inc | Touch panel and touch sensing display using the same |
TWM467118U (en) * | 2013-05-09 | 2013-12-01 | Ray Star System Solutions Xiamen Inc | Touch device |
TWM517367U (en) * | 2014-10-17 | 2016-02-11 | 宸鴻光電科技股份有限公司 | Touch panel |
Also Published As
Publication number | Publication date |
---|---|
CN105573539A (en) | 2016-05-11 |
CN105573539B (en) | 2019-05-03 |
TWM517367U (en) | 2016-02-11 |
TW201626190A (en) | 2016-07-16 |
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