CN203630748U - Touch panel - Google Patents
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- CN203630748U CN203630748U CN201320592557.XU CN201320592557U CN203630748U CN 203630748 U CN203630748 U CN 203630748U CN 201320592557 U CN201320592557 U CN 201320592557U CN 203630748 U CN203630748 U CN 203630748U
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Abstract
The utility model provides a touch panel comprising a first mask layer, a second mask layer, a sensing electrode layer, and a conductive filler layer. The first mask layer is arranged on one certain surface area of a substrate; the second mask layer is arranged on the first mask layer and provided with a first via-hole; the sensing electrode layer is arranged on the other surface area of the substrate and further extends between the first mask layer and the second mask layer; part of the sensing electrode layer is exposed through the via-hole; the conductive filler layer is arranged in the via-hole and electrically connected with the sensing electrode layer. Therefore, the touch panel has the effect of preventing circuit break when the sensing electrode layer extends on the mask layers, and the yield of the touch panel is effectively increased.
Description
Technical field
The utility model relates to touch technology, relates to especially a kind of contact panel.
Background technology
Along with science and technology progress with rapid changepl. never-ending changes and improvements, the application of consumption electronic products is also more and more diversified, for example many portable electronic products (as personal digital assistant (personal digital assistant, PDA) or mobile phone) use contact panel (touch panel) widely.
The shielding layer of contact panel has the function of the perimeter component of covering, and allows user can not perceive the existence of perimeter component.In addition, shielding layer, along with the design difference of the electronic product of reality collocation, can adopt different colors to design.But scrutable, shielding layer often needs certain thickness just can reach the effect of covering, but too thick the formed height of shielding layer will cause again induction electrode layer in the time extending on shielding layer, cannot climb smoothly on shielding layer and forming open circuit.Therefore, the design of shielding layer is one of key factor affecting yield in the process of whole making contact panel, is necessary design improved in addition.
Utility model content
In view of this, the utility model is improved for the shielding layer structure of contact panel, and the shielding layer that makes contact panel can be because the change of colour planning demand affects screening effect, and extended to smoothly on shielding layer by be allowed equally induction electrode layer.
The utility model provides a kind of contact panel, comprising: one first shielding layer, is arranged on a part of region on surface of a substrate; One second shielding layer, is arranged on this first shielding layer, and has a via; One induction electrode layer, is arranged on another part region on surface of this substrate, and further extends and be arranged between this first shielding layer and this second shielding layer, and some of these induction electrode layers are exposed by this via; And a conductive fill layer, be arranged in this via, and be electrically connected this induction electrode layer.
By above-mentioned design, the shielding layer of contact panel of the present utility model is except providing screening effect, more can meet the diversified requirement of shielding layer color, in addition, the utility model also can avoid induction electrode layer in the time extending on shielding layer, to occur the problem opening circuit, generally speaking, effectively increase the yield of contact panel.
For above and other object, feature and the advantage of the utility model can be become apparent, cited below particularly go out preferred embodiment, and coordinate appended graphicly, be described in detail below:
Accompanying drawing explanation
Fig. 1 shows the sectional view of the contact panel of the utility model the first embodiment.
Fig. 2 shows the manufacture method of the contact panel of Fig. 1 by the sectional view of each fabrication phase of contact panel.
Fig. 3 shows the sectional view of the contact panel of the utility model the second embodiment.
Fig. 4 shows the sectional view of the contact panel of the utility model the 3rd embodiment.
Fig. 5 shows the sectional view of the contact panel of the utility model the 4th embodiment.
Fig. 6 shows the sectional view of the contact panel of the utility model the 5th embodiment.
Embodiment
In following different embodiment, may use label or the sign of repetition, these only repeat to have any association in order simply clearly to narrate the utility model, not represent between the different embodiment that discussed and/or structure.Moreover, when address that one first material layer is positioned on one second material layer or on time, comprise that the first material layer directly contacts with the second material layer or be separated with the situation of one or more other materials layers.In graphic, the shape of embodiment or thickness may expand, to simplify or to highlight its feature.In addition, the assembly that does not illustrate in figure or describe, has the arbitrary form of conventionally knowing known to the knowledgeable in technical field under can be.
Refer to Fig. 1, show the sectional view of the contact panel of the utility model the first embodiment.As shown in Figure 1, contact panel 100 is defined a relative induction zone 100A and a surrounding zone 100B, and in actual design, surrounding zone 100B can be for example at least one side that is positioned at induction zone 100A, to form relative position relation.The contact panel 100 of the present embodiment comprises a substrate 110, one first shielding layer 120, an induction electrode layer 130, one second shielding layer 140 and a conductive fill layer 160.Wherein, the material of substrate 110 is for example glass, quartz, polyethylene terephthalate (polyethyleneterephthalate), PET), polycarbonate (polycarbonate, PC) or polymethylmethacrylate (polymethylmethacrylate), PMMA).And the substrate 110 of the present embodiment more can further add strong hardness through strengthening processing procedure, in fact carries the parts such as induction electrode layer 130, the first shielding layer 120 except being used for, be more to provide the effect of protection induction electrode layer 130.
The first shielding layer 120 is arranged on a part of region on surface of substrate 110, more specifically, the setting area of first shielding layer 120 of the present embodiment is the surrounding zone 100B for defining aforementioned contact panel 100, and allows region beyond the setting area of the first shielding layer 120 relatively be defined as the induction zone 100A of contact panel 100.The second shielding layer 140 is arranged on the first shielding layer 120, and has a via 150.
The contact panel 100 of the present embodiment more comprises a signal transport layer 170.Signal transport layer 170 is arranged on the second shielding layer 140, and is electrically connected conductive fill layer 160.Signal transport layer 170 can further be come to be electrically connected with a controller (not shown) by a flexible printed wiring board (not shown), to carry out the transmission of signal.
From the above, the present embodiment is by the laminated design of the first shielding layer 120 and the second shielding layer 140, and via 150 by the second shielding layer 140 and be filled in the design of the conductive fill layer 160 of via 150, allow induction electrode layer 130 in the time that induction zone 100A extends to surrounding zone 100B, only need climbing can be electrically connected signal transport layer 170 by conductive fill layer 160 smoothly to the first shielding layer 120, reduce induction electrode layer 130 because of the easily risk of fracture of climbing excessive height.In addition, consider the optical considerations such as absorbability and reflectivity of object for light, the optical density value of supposing the first shielding layer 120 is that the optical density value of D1, the second shielding layer 140 is that the optical density value of D2 and conductive fill layer 160 is D3, the masking structure of the present embodiment is that design meets the condition of covering of D1+D2 >=3 and D1+D3 >=3, the perimeter component that allows the masking structure of contact panel 100 be provided enough screening effects to cover all correspondences to be positioned at surrounding zone 100B (as signal transport layer 170 etc.).
Further for the specification of the masking structure of the present embodiment, in color part, the color of the first shielding layer 120, the second shielding layer 140 and conductive fill layer 160 can adopt the design of the shades of colours such as black, white, grey, silver color, yellow, and the first shielding layer 120, the second shielding layer 140 and conductive fill layer 160 are unrestrictedly also to adopt identical or different color, can adjust and arrange in pairs or groups according to actual design demand if desired.Can cover under the condition of perimeter component at the masking structure of contact panel 100, if the second shielding layer 140 and conductive fill layer 160 are the words that adopt the color that is different from the first shielding layer 120, can the color by the conditional thickness adjustment of the first shielding layer 120 arrange in pairs or groups the second shielding layer 140 and conductive fill layer 160 select, allow the first shielding layer 120 be covered the second shielding layer 140 and the conductive fill layer 160 heterochromatic problem because adopting different colours to cause with the first shielding layer 120.
In material part, the material of the first shielding layer 120 and the second shielding layer 140 can for example adopt ink or photoresistance.Certainly, due in the masking structure of the contact panel 100 of the present embodiment, the second shielding layer 140 is the screening effects for auxiliary and reinforcement the first shielding layer 120, therefore in actual design, the second shielding layer 140 more can be designed to high refractive index layer, be for example resin bed, in order to the effect of high reflectance and low-transmittance to be provided.The material of conductive fill layer 160 comprises the potpourri of metal material, nonmetallic materials or metal material and nonmetallic materials, and wherein metal material is for example silver (Ag), gold (Au), copper (Cu), aluminium (Al) or above-mentioned combination; Nonmetallic materials are for example electrically conductive ink, and it is mainly made up of with auxiliary agent (additives) pigment (pigment), binder (binder).
In addition, except the thickness limits of aforementioned the first shielding layer 120 is to be less than or equal to 25 μ m, the thickness of the second shielding layer 140 and conductive fill layer 160 can because of to meet aforementioned cover condition and accordingly increase and decrease.
Below for some embodiment, the specifications design between the first shielding layer 120, the second shielding layer 140 and conductive fill layer 160 is described.Special one carries, and the color adopting in following examples is only larger to when convenient explanation for presenting, and is not used for limiting the utility model.
In one embodiment, suppose that the first shielding layer 120 and the second shielding layer 140 adopt white ink design, and conductive fill layer 160 adopts black conductive ink design.The optical considerations such as absorbability and reflectivity based on black conductive ink to light, from experiment, can cover the heterochromatic problem that black conductive ink causes when the optical density value of white ink is approximately more than or equal to 1OD.Wherein, the increment rate of the optical density value of white ink is about 0.05OD/ μ m; The increment rate of the optical density value of black conductive ink is about 0.5OD/ μ m.Therefore, the thickness range of first shielding layer 120 of the present embodiment is to be more than or equal to 20 μ m and to be less than or equal to 25 μ m, and in other words, the scope of the optical density value (D1) of first shielding layer 120 of the present embodiment is 1≤D1≤1.25.
In order to meet the aforesaid condition of covering: the optical density value (D2) >=3 of optical density value (D1)+second shielding layer 140 of the first shielding layer 120, the scope of the optical density value (D2) of second shielding layer 140 of the present embodiment is D2 >=2, after converting, the thickness range of the second shielding layer 140 is to be more than or equal to 40 μ m.In addition, in order to meet the aforementioned condition of covering: the optical density value (D3) >=3 of optical density value (the D1)+conductive fill layer 160 of the first shielding layer 120, the scope of the optical density value (D3) of the conductive fill layer 160 of the present embodiment is D3 >=2, after converting, the thickness range of conductive fill layer 160 is to be more than or equal to 4 μ m.
By this, via above-mentioned calculation specifications, the present embodiment can obtain the first shielding layer 120, the second shielding layer 140 and conductive fill layer 160 in the specification based on selected color and material the thickness of corresponding design.Subsidiary one carry be, the black conductive ink adopting due to the conductive fill layer 160 of the present embodiment is compared to white ink, there is preferably screening effect (increment rate of larger optical density value), therefore the thickness of conductive fill layer 160 can design the thinner required screening effect that just reaches compared to the thickness of the second shielding layer 140, but because being design, the conductive fill layer 160 of the present embodiment is filled in the via 150 of the second shielding layer 140, therefore for the convenience on processing procedure, the packed height of conductive fill layer 160 is (to be more than or equal to m) next corresponding design of 40 μ according to the actual (real) thickness of the second shielding layer 140.
In another embodiment, if the first shielding layer 120, the second shielding layer 140 and conductive fill layer 160 are to adopt respectively different colors to design, the thickness of the first shielding layer 120 will be relatively can cause larger heterochromatic problem person to decide according to the second shielding layer 140 and conductive fill layer 160 so, the first shielding layer 120 can covered under the condition that can cause larger heterochromatic problem person, cover surely and can cause compared with small difference look problem person with regard to one.For example, suppose that the first shielding layer 120 is that Yellow ink, the second shielding layer 140 are that aluminium ink and conductive fill layer 160 are black conductive ink, generally speaking, under Yellow ink, black conductive ink will cause larger heterochromatic problem compared to aluminium ink, therefore the thickness of first shielding layer 120 of the present embodiment will design according to the thickness of conductive fill layer 160 (black conductive ink), but the thickest be 25 μ m.
In addition, aforementionedly mention that conductive fill layer 160 is to be filled in the via 150 of the second shielding layer 140, for convenient on processing procedure, the second shielding layer 140 and conductive fill layer 160 form last be highly preferably consistent.Therefore, can meet aforementioned covering under condition, the second shielding layer 140 and conductive fill layer 160 are that the thickness of the increment rate smaller's (desired thickness is thicker) take optical density value is the foundation of last height between the two.
In order to further describe the contact panel of the utility model, please come referring to Fig. 2 based on the framework of Fig. 1, show the manufacture method of the contact panel of Fig. 1 by the sectional view of each fabrication phase of contact panel.The manufacture method of the contact panel 100 of the present embodiment comprises: form the first shielding layer 120 on a part of region on the surface of substrate 110, be used for defining the surrounding zone 100B of contact panel 100 and relative induction zone 100A.
The material of the first shielding layer 120 comprises ink or photoresistance.If adopt ink, the method that forms the first shielding layer 120 comprises rotary coating (spin coating), bar-shaped coating (bar coating), dip coated (dip coating), cylinder coating (roll coating), spraying coating (spray coating), intaglio plate formula coating (gravure coating), ink jet printing (ink jet printing), slot coated (slot coating) or scraper for coating (blade coating).If adopt the words of photoresistance, to form the first shielding layer 120 by photolithographic processes (photolithography), photolithographic processes comprises that light blockage coating (photoresist coating), soft baking (soft baking), light shield are aimed at (mask aligning), exposure (exposure), postexposure bake (post-exposure), photoresistance develops (developing photoresist) and hard baking (hard baking), these processing procedures, by this area personage is known, do not repeat them here.
Next, form induction electrode layer 130 on another part region on the surface of substrate 110, and extend to form on the first shielding layer 120.Specifically, the sensing part 1301 of induction electrode layer 130 is that to be formed at the surface of substrate 110 upper and be positioned at induction zone 100A, and 1302 of the extensions of induction electrode layer 130 are to be formed on the first shielding layer 120 and to be positioned at surrounding zone 100B.
The transparent conductive material that induction electrode layer 130 adopts comprises tin indium oxide (indium tin oxide, ITO), indium zinc oxide (indium zinc oxide, IZO), cadmium tin (cadmium tin oxide, CTO), aluminum zinc oxide (aluminum zinc oxide, AZO), tin indium oxide zinc (indium tin zinc oxide, ITZO), zinc paste (zinc oxide), cadmium oxide (cadmium oxide, CdO), hafnia (hafnium oxide, HfO), indium oxide gallium zinc (indium gallium zinc oxide, InGaZnO), indium oxide gallium zinc-magnesium (indium gallium zinc magnesium oxide, InGaZnMgO), indium oxide gallium magnesium (indium gallium magnesium oxide, or indium oxide gallium aluminium (indium gallium aluminum oxide InGaMgO), InGaAlO).The method that forms induction electrode layer 130 can be utilized chemical vapour deposition technique (chemical vapor deposition method) or sputtering method (sputter) deposit transparent conductive material, recycles afterwards photolithographic processes and carries out patterning process to form induction electrode layer 130.
Next, in the formation region of the first shielding layer 120, namely in the 100B of surrounding zone, form second shielding layer 140 with via 150 on the first shielding layer 120 and induction electrode layer 130, allow the induction electrode layer 130 of via 150 expose portions.Wherein, the part being formed in the 100B of surrounding zone between the first shielding layer 120 and the second shielding layer 140 due to induction electrode layer 130 is to belong to extension 1302, and therefore via 150 is extensions 1302 that correspondence has exposed part.The material of the second shielding layer 140 and formation method can for example adopt identical material and formation method with the first shielding layer 120 in actual design, are also just no longer repeated at this.
Finally, form conductive fill layer 160 in via 150, in order to be electrically connected induction electrode layer 130, and form again signal transport layer 170 on the second shielding layer 140, in order to be electrically connected conductive fill layer 160, allow signal transport layer 170 be electrically connected by this conductive fill layer 160 and induction electrode layer 130.Supplementary notes, if signal transport layer 170 is to adopt same material design with conductive fill layer 160, conductive fill layer 160 and signal transport layer 170 can form in same fabrication steps, at this not by the present embodiment is limited.
It is worth mentioning that, the first shielding layer 120 of contact panel 100 of the present utility model and the second shielding layer 140 can be respectively the designs of lamination layer structure, and namely the first shielding layer 120 and/or the second shielding layer 140 are stacked and formed by two-layer above minor structure layer.Wherein, the color material of the number of plies of minor structure layer and each layer is surely to there is no and limited according to actual design, and the design of lamination layer structure can allow the frame of contact panel 100 have more the diversified effect of color, also more flexible on frame design.Following examples will further illustrate the framework aspect of other embodiment of contact panel 100.In addition, because the Toutch control panel structure of following embodiment is roughly identical with contact panel 100 frameworks of Fig. 1, discrepancy is only the difference of the lamination layer structure design that the first shielding layer 120 and/or the second shielding layer 140 adopt, therefore in the framework of whole contact panel and effect, be just no longer repeated in this description, first chatted bright at this.
Refer to Fig. 3, show the sectional view of the contact panel of the utility model the second embodiment.In the present embodiment, the first shielding layer 120 is the designs that adopt lamination layer structure, is formed by minor structure layer 121 and two-layer the stacking of minor structure layer 122, and the second shielding layer 140 still adopts the design of single layer structure.Wherein, the integral thickness of the first shielding layer 120 of lamination layer structure still meets the restriction that is less than or equal to 25 μ m in design, and in fact the distribution of the thickness of minor structure layer 121 and minor structure layer 122 is determined according to design requirement certainly, there is no and is limited at this.
In addition, the calculating of the optical density value (D1) of first shielding layer 120 of the present embodiment is to be added up and formed by the optical density value of minor structure layer 121 and the optical density value of minor structure layer 122.Generally speaking, the masking structure of the contact panel 100 of the present embodiment is still optical density value (the D2) >=3OD of optical density value (D1)+second shielding layer 140 that design can meet the first shielding layer 120; And the condition of covering of optical density value (the D3) >=3OD of the optical density value of the first shielding layer 120 (D1)+conductive fill layer 160.
Refer to Fig. 4, show the sectional view of the contact panel of the utility model the 3rd embodiment.In the present embodiment, the first shielding layer 120 is the designs that adopt single layer structure, and the second shielding layer 140 adopts the design of lamination layer structure, is formed by minor structure layer 141 and two-layer the stacking of minor structure layer 142.Wherein, minor structure layer 141 and minor structure layer 142 have corresponding perforated portion in design, in order to stack the via 150 that forms the second shielding layer 140.
In addition, the calculating of the optical density value (D2) of second shielding layer 140 of the present embodiment is to be added up and formed by the optical density value of minor structure layer 141 and the optical density value of minor structure layer 142.Generally speaking, the masking structure of the contact panel 100 of the present embodiment is still the optical density value (D2) >=3 of optical density value (D1)+second shielding layer 140 that design can meet the first shielding layer 120; And the condition of covering of the optical density value (D3) >=3 of the optical density value of the first shielding layer 120 (D1)+conductive fill layer 160.
Moreover, if the second shielding layer 140 wants further to provide high reflectance to assist and the screening effect of reinforcement the first shielding layer 140, the present embodiment can be for example designed to high refractive index layer to major general's minor structure layer 141 or minor structure layer 142 and reaches the effect that high reflectance and low-transmittance are provided.
Refer to Fig. 5, show the sectional view of the contact panel of the utility model the 4th embodiment.In the present embodiment, the first shielding layer 120 and the second shielding layer 140 all adopt the design of lamination layer structure, the first shielding layer 120 is formed by minor structure layer 121 and two-layer the stacking of minor structure layer 122, and the second shielding layer 140 is formed by minor structure layer 141, minor structure layer 142 and stacking the establishing of minor structure layer 143 3.Wherein, the integral thickness of the first shielding layer 120 of lamination layer structure still meets the restriction that is less than or equal to 25 μ m in design.Minor structure layer 141, minor structure layer 142 and the minor structure layer 143 of the second shielding layer 140 have corresponding perforated portion in design, in order to stack the via 150 that forms the second shielding layer 140.
In addition, the calculating of the optical density value (D1) of first shielding layer of the present embodiment is to be added up and formed by the optical density value of minor structure layer 121 and the optical density value of minor structure layer 122, and the calculating of the optical density value (D2) of the second shielding layer 140 is to be added up and formed by the optical density value of minor structure layer 141, the optical density value of minor structure layer 142 and the optical density value of minor structure layer 143.Generally speaking, the masking structure of the contact panel 100 of the present embodiment is still optical density value (the D2) >=3OD of optical density value (D1)+second shielding layer 140 that design can meet the first shielding layer 120; And the condition of covering of optical density value (the D3) >=3OD of the optical density value of the first shielding layer 120 (D1)+conductive fill layer 160.
Moreover, if the second shielding layer 140 wants further to provide high reflectance to assist and the screening effect of reinforcement the first shielding layer 140, the present embodiment can be for example by minor structure layer 141, minor structure layer 142 and minor structure layer 143 at least one of them is designed to high refractive index layer and reaches the effect that high reflectance and low-transmittance are provided.
Refer to Fig. 6, show the sectional view of the contact panel of the utility model the 5th embodiment.The present embodiment is roughly identical with the embodiment of Fig. 5 in the lamination layer structure design of the first shielding layer 120 and the second shielding layer 140, and further discrepancy is the aspect difference of the via 150 in the second shielding layer 140.The aperture of the via 150 of the present embodiment changes to some extent along with the height and position difference of the second shielding layer 140, specifically, the via 150 of the present embodiment is being the aperture that is greater than adjacent signals transport layer 170 parts in abutting connection with the aperture of induction electrode layer 130 part, if and with three straton structural sheets 141, 142 and 143 stack structure, the aperture of via 150 minimums in minor structure layer 141 is the apertures that are greater than via 151 maximums in minor structure layer 142, the aperture of via 151 minimums in minor structure layer 142 is the apertures that are greater than via 152 maximums in minor structure layer 143.
In a better implementation column, via 150 in minor structure layer 141, via 151 in minor structure layer 142, via 152 in minor structure layer 143 can stagger mutually, and conductive fill layer 160 is filled in respectively via 150, via 151, in via 152, and keeps being electrically connected each other.
Certainly, in actual design, the aspect of via 150 is not limited in this, only requires signal transport layer 170 to be electrically connected with this induction electrode layer 130 by the conductive fill layer 160 being filled in via 150.
Subsidiary one carry be, except aforementioned conductive fill layer 160 can be because different from the color of the first shielding layer 120 and cause having heterochromatic problem, via 150 in the second shielding layer 140 also may have impact at the pore size of adjacent signals transport layer 170 parts, and the excessive color of the conductive fill layer 160 being filled in via 150 that easily causes in aperture is visual.Therefore, except can selecting by the color of the conditional thickness adjustment of the first shielding layer 120 arrange in pairs or groups the second shielding layer 140 and conductive fill layer 160, in one embodiment, more the sectional area of via 150 adjacent signals transport layer 170 parts can be designed to 0.0625mm
2-0.25mm
2, this design is able to, under the condition of contraposition degree of accuracy that can not affect via 150 and induction electrode layer 130, further avoid causing heterochromatic problem.
It is noted that in sum, know the demand of the personage Ke Yi practical application of this area, change the lamination layer structure number of plies of the first shielding layer and/or the second shielding layer to meet the multifarious demand of different shieldings and appearance colour, allow the shielding layer of contact panel provided by the utility model except good screening effect can be provided, more can meet the diversified requirement of shielding layer color.In addition, design of the present utility model also can avoid induction electrode layer in the time extending on shielding layer, to occur the problem opening circuit, and effectively increases the yield of contact panel.
Although the utility model discloses as above with several preferred embodiments; so it is not in order to limit the utility model; under any, in technical field, have and conventionally know the knowledgeable; not departing from the spirit and scope of the utility model; when doing any change and retouching, therefore the protection domain of the utility model when depending on after the attached claim person of defining be as the criterion.
Claims (12)
1. a contact panel, is characterized in that, comprising:
One first shielding layer, is arranged on a part of region on surface of a substrate;
One second shielding layer, is arranged on this first shielding layer, and has a via;
One induction electrode layer, is arranged on another part region on surface of this substrate, and further extends and be arranged between this first shielding layer and this second shielding layer, and some of these induction electrode layers are exposed by this via; And
One conductive fill layer, is arranged in this via, and is electrically connected this induction electrode layer.
2. contact panel according to claim 1, is characterized in that: the optical density value of this first shielding layer is that the optical density value of D1, this second shielding layer is that the optical density value of D2 and this conductive fill layer is D3 and meets D1+D2 >=3 and the condition of covering of D1+D3 >=3.
3. contact panel according to claim 1, is characterized in that: the thickness of this first shielding layer is less than or equal to 25 μ m.
4. contact panel according to claim 1, is characterized in that: this conductive fill layer material comprises metal material, nonmetallic materials or its potpourri.
5. contact panel according to claim 1, is characterized in that: this via sectional area is 0.0625mm
2-0.25mm
2.
6. contact panel according to claim 1, is characterized in that: this first shielding layer is lamination layer structure.
7. contact panel according to claim 6, is characterized in that: the thickness of this first shielding layer is less than or equal to 25 μ m.
8. according to the contact panel described in claim 1 or 6, it is characterized in that: this second shielding layer is lamination layer structure.
9. contact panel according to claim 1, is characterized in that: this second shielding layer is high refractive index layer.
10. contact panel according to claim 9, is characterized in that: this high refractive index layer is resin bed.
11. contact panels according to claim 1, is characterized in that: also comprise a signal transport layer, be arranged on this second shielding layer, and be electrically connected this conductive fill layer.
12. contact panels according to claim 1, it is characterized in that: this induction electrode layer comprises a sensing part and an extension, wherein this sensing part is arranged on this another part region on surface of this substrate, and this extension is arranged on this first shielding layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320592557.XU CN203630748U (en) | 2013-09-25 | 2013-09-25 | Touch panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320592557.XU CN203630748U (en) | 2013-09-25 | 2013-09-25 | Touch panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203630748U true CN203630748U (en) | 2014-06-04 |
Family
ID=50817205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320592557.XU Expired - Fee Related CN203630748U (en) | 2013-09-25 | 2013-09-25 | Touch panel |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104461102A (en) * | 2013-09-25 | 2015-03-25 | 宸鸿科技(厦门)有限公司 | Touch panel and manufacturing method thereof |
| CN105573539A (en) * | 2014-10-17 | 2016-05-11 | 宸鸿光电科技股份有限公司 | Touch panel and manufacture method thereof |
| CN107664887A (en) * | 2016-07-29 | 2018-02-06 | 株式会社日本显示器 | The manufacture method of electronic equipment and display device |
-
2013
- 2013-09-25 CN CN201320592557.XU patent/CN203630748U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104461102A (en) * | 2013-09-25 | 2015-03-25 | 宸鸿科技(厦门)有限公司 | Touch panel and manufacturing method thereof |
| CN105573539A (en) * | 2014-10-17 | 2016-05-11 | 宸鸿光电科技股份有限公司 | Touch panel and manufacture method thereof |
| CN105573539B (en) * | 2014-10-17 | 2019-05-03 | 宸鸿光电科技股份有限公司 | Touch panel and its manufacturing method |
| CN107664887A (en) * | 2016-07-29 | 2018-02-06 | 株式会社日本显示器 | The manufacture method of electronic equipment and display device |
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