CN103885578A - Touch panel and production method thereof - Google Patents
Touch panel and production method thereof Download PDFInfo
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- CN103885578A CN103885578A CN201210595781.4A CN201210595781A CN103885578A CN 103885578 A CN103885578 A CN 103885578A CN 201210595781 A CN201210595781 A CN 201210595781A CN 103885578 A CN103885578 A CN 103885578A
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- visible area
- sensing electrode
- electrode layer
- opening
- light shielding
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
Abstract
The invention provides a touch panel. The touch panel is defined to have a visible area and invisible areas. The touch panel comprises a sensing electrode layer and a protecting layer. The sensing electrode layer is positioned in the visible area and the invisible areas correspondingly. The protecting layer comprising first openings is formed on the surface of the sensing electrode layer and completely covers the sensing electrode layer positioned in the visible area. A part, positioned in each invisible area, of the sensing electrode layer is correspondingly exposed through the corresponding first opening of the protecting layer. Further, the invention provides a production method of the touch panel.
Description
[technical field]
The present invention has about touch technology, is particularly to contact panel and manufacture method thereof.
[background technology]
In recent years, contact panel becomes topmost input interface gradually, is widely used in various electronic products, such as mobile phone, personal digital assistant (PDA) or hand held personal computer etc.Contact panel generally includes substrate and some intrawares, and as sensing electrode, black light resistance layer and touching signals wire etc., traditional contact panel first forms sensing electrode conventionally on substrate, and then forms the assemblies such as black light resistance layer and touching signals wire.Afterwards, contact panel can with flexible printed wiring board (flexible printed circuit; FPC) engage and for example, assemble laminating with display module (liquid crystal display device module (LCD module:LCM)).
But, in traditional contact panel, the printing of black light resistance layer and touching signals wire and clean processing procedure easily cause damage to sensing electrode, and the connection process of follow-up contact panel and flexible printed wiring board (FPC), and the assembling of contact panel and display module laminating processing procedure also can damage sensing electrode, cause the touch-control sensing function of traditional contact panel impaired.
[summary of the invention]
Because the problems referred to above that known techniques exists; the invention provides a kind of contact panel and manufacture method thereof; after sensing electrode layer completes; form immediately protective seam and cover sensing electrode layer; then just carry out again the processing procedure of other assemblies of contact panel; so can reduce or prevent that sensing electrode layer is damaged, and then overcome the problem of above-mentioned traditional contact panel.
According to one embodiment of the invention, contact panel is provided, contact panel has been defined Ji Fei visible area, visible area, and this contact panel comprises: correspondence is positioned at the sensing electrode layer of Ji Fei visible area, visible area; And the surface that protective seam comprises the first opening and is formed at sensing electrode layer is comprehensively to cover the sensing electrode layer that is positioned at visible area, exposes a part for the sensing electrode layer that is positioned at non-visible area via the first opening correspondence.
In one embodiment, described contact panel also comprises a protective substrate, and this sensing electrode layer is formed at the surface of this protective substrate.
In one embodiment, described contact panel also comprises: a protective substrate; And an optical match film, be arranged between this protective substrate and this sensing electrode layer.
In one embodiment, described contact panel also comprises: a light shielding part, at least a portion of this light shielding part is formed on this protective seam to define this non-visible area, and this light shielding part comprises one second opening, and this second opening is to this first opening that should protective seam; One conducting resinl, is filled in this first opening and this second opening; And a conductor layer, be formed on this light shielding part of part and corresponding to this second opening, wherein this conductor layer is electrically connected this sensing electrode layer by this conducting resinl.
In one embodiment, described light shielding part comprises at least one decorative layer.
In one embodiment, described contact panel also comprises: an insulation course, is formed on this conductor layer and this light shielding part and correspondence is positioned at this non-visible area.
In one embodiment, described contact panel also comprises: an insulation course, is formed on this protective seam, this conductor layer and this light shielding part and correspondence is positioned at Ji Gaifei visible area, this visible area.
In one embodiment, described contact panel also comprises: a protective substrate; One light shielding part, is formed at the surface of this protective substrate to define this non-visible area, and wherein this sensing electrode layer is to be formed on this light shielding part in this non-visible area, and is to be formed on this protective substrate in this visible area; One conducting resinl, is filled in this first opening; And a conductor layer, be formed on this protective seam of part and corresponding to this first opening, wherein this conductor layer is electrically connected this sensing electrode layer by this conducting resinl.
In one embodiment, described contact panel also comprises: an insulation course, be formed on this conductor layer and this protective seam, and correspondence is positioned at this non-visible area.
In one embodiment, described contact panel also comprises: an insulation course, is formed on this conductor layer and this protective seam and correspondence is positioned at Ji Gaifei visible area, this visible area.
According to one embodiment of the invention, the manufacture method of contact panel is provided, contact panel has been defined Ji Fei visible area, visible area, and this manufacture method comprises: form sensing electrode layer, wherein sensing electrode layer correspondence is positioned at Ji Fei visible area, visible area; And form the protective seam that comprises the first opening in the surface of sensing electrode layer, wherein protective seam comprehensively covers the sensing electrode layer that is positioned at visible area, and exposes a part for the sensing electrode layer that is positioned at non-visible area via the first opening correspondence.
In one embodiment, the manufacture method of described contact panel also comprises: form a light shielding part that comprises one second opening to define this non-visible area, wherein at least a portion of this light shielding part is formed on this protective seam, and this second opening is to this first opening that should protective seam; Fill a conducting resinl in this first opening and this second opening; And form a conductor layer on this light shielding part of part and corresponding to this second opening, wherein this conductor layer is electrically connected this sensing electrode layer by this conducting resinl.
In one embodiment, the manufacture method of described contact panel also comprises: form an insulation course on this conductor layer and this light shielding part and correspondence be positioned at this non-visible area.
In one embodiment, the manufacture method of described contact panel also comprises: form an insulation course on this protective seam, this conductor layer and this light shielding part and correspondence be positioned at Ji Gaifei visible area, this visible area.
In one embodiment, the manufacture method of described contact panel also comprises: before forming this sensing electrode layer, form a light shielding part and define this non-visible area in the surface of a protective substrate, wherein this sensing electrode layer is to be formed on this light shielding part in this non-visible area, and is to be formed on this protective substrate in this visible area; Fill a conducting resinl in this first opening; And form a conductor layer on this protective seam of part and corresponding to this first opening, wherein this conductor layer is electrically connected this sensing electrode layer by this conducting resinl.
In one embodiment, the manufacture method of described contact panel also comprises: form an insulation course on this conductor layer and this protective seam and correspondence be positioned at this non-visible area.
In one embodiment, the manufacture method of described contact panel also comprises: form an insulation course on this conductor layer and this protective seam and correspondence be positioned at Ji Gaifei visible area, this visible area.
In one embodiment, the manufacture method of described contact panel also comprises: form an optical match film in the surface of a protective substrate; And form this sensing electrode layer in the surface of this optical match film.
In one embodiment, described sensing electrode layer is the surface that is formed at a protective substrate.
For above-mentioned purpose of the present invention, feature and advantage can also be become apparent, below coordinate appended graphicly, be described in detail below:
[brief description of the drawings]
Fig. 1 shows according to one embodiment of the invention, the diagrammatic cross-section of contact panel;
Fig. 2 A to Fig. 2 F is according to one embodiment of the invention, the diagrammatic cross-section in each interstage of the contact panel of shop drawings 1;
Fig. 3 shows according to one embodiment of the invention, the diagrammatic cross-section of contact panel; And
Fig. 4 shows according to one embodiment of the invention, the diagrammatic cross-section of contact panel.
Wherein description of reference numerals is as follows:
100～protective substrate;
100A～inner surface;
100B～outer surface;
100P～non-visible area;
100V～visible area;
102～optical match film;
104～anti-functional coating;
106～sensing electrode layer;
110X, 110Y～conductive pattern;
112～insulation division;
114～bonding line;
116～protective seam;
116a～opening;
118～light shielding part;
118a～opening;
120～conducting resinl;
124～conductor layer;
126～insulation course;
128～anisotropic conductive film;
130～flexible printed wiring board.
[embodiment]
Each graphic in, in order more clearly to represent the feature of the embodiment of the present invention, each assembly of contact panel can not to scale (NTS) be drawn.In addition; in the following description alleged orientation " on " and D score be with protective substrate (cover lens) 100 below direction indication; these orientation are only the position relationships for representing that each assembly is relative; but in the application of contact panel reality, be to use with protective substrate 100 form up.
Fig. 1 shows the diagrammatic cross-section according to the contact panel of one embodiment of the invention.The contact panel of the embodiment of the present invention, it is for example capacitance type touch-control panel, visible area 100V and non-visible area 100P are defined, common non-visible area 100P is at least one side that is relatively positioned at visible area 100V, contact panel comprises a sensing electrode layer 106 and a protective seam 116, wherein sensing electrode layer 106 correspondence are positioned at visible area 100V and non-visible area 100P, and protective seam 116 comprises one first opening 116a, and protective seam 116 is formed at the surface of sensing electrode layer 106 comprehensively to cover the sensing electrode layer 106 that is positioned at visible area 100V, and exposed a part for the sensing electrode layer 106 that is positioned at non-visible area 100P by the first opening 116a correspondence.
The contact panel of Fig. 1 also comprises a protective substrate 100, and sensing electrode layer 106 can be formed at the inner surface 100A of protective substrate 100.Further illustrate, whole touch control components of contact panel all can be formed on the side of the inner surface 100A of protective substrate 100, the touching face that the outer surface 100B of protective substrate 100 is contact panel.In addition, the so-called protective substrate 100 of the embodiment of the present invention refers to through strengthening substrate later, be used to provide the function of carrying and protection touch control component, and the material of protective substrate 100 is for example glass or other applicable materials.
The contact panel of Fig. 1 also comprises a light shielding part 118, a conducting resinl 120 and a conductor layer 124, wherein at least a portion of light shielding part 118 can be formed on protective seam 116 to define non-visible area 100P, and light shielding part 118 comprises one second opening 118a, the first opening 116a of the corresponding protective seam 116 of this second opening 118a; Namely protective seam 116 can be between sensing electrode layer 106 and light shielding part 118 in non-visible area 100P.Conducting resinl 120 is to be filled in the first opening 106a and the second opening 118a, and conductor layer 124 can be formed on light shielding part 118 partly and corresponding to the second opening 118a, and wherein conductor layer 124 is electrically connected sensing electrode layer 106 by conducting resinl 120.
Moreover light shielding part 118 can for example comprise at least one decorative layer in actual design, the material of decorative layer can be black photoresistance, black ink or colored ink, and can make by technology such as coating and photolithographic processes or printing process.By the design of Multilayer decorative layer, can increase the more visual effects of contact panel at non-visible area 100P.For example, if the decorative layer that light shielding part 118 comprises two-layer different colours can be designed with pierced pattern at the decorative layer that approaches protective seam 116, and then allow and be able to appear different colors by pierced pattern away from the decorative layer of protective seam 116.If it should be noted that, light shielding part 118 is made up of Multilayer decorative layer, there is no that to be limited be direct stacking forming on the rhythmo structure up and down of those decorative layers, and reality can form according to the architecture design demand of contact panel stacking structure indirectly.
The contact panel of Fig. 1 also comprises that a correspondence is positioned at the insulation course 126 of non-visible area 100P, because conductor layer 124 can be formed on the light shielding part 118 of part as previously mentioned, therefore insulation course 126 can partly be formed on conductor layer 124, partly be formed on light shielding part 118.In this embodiment, insulation course 126 is only corresponding to be partly positioned at non-visible area 100P and to cover the surface of conductor layer 124 and light shielding part 118, is used for further avoiding conductor layer 124 to be subject to the damage of chemistry or physical property.But, if more ensure sensing electrode layer 106 avoid damage, in other embodiments, insulation course 126 also can further be formed on protective seam 116, conductor layer 124 and light shielding part 118 and be positioned at visible area 100V and non-visible area 100P with correspondence.
The another manufacture method that proposes a kind of contact panel of the present invention; as previously mentioned; contact panel has been defined a visible area and a non-visible area; the step of this manufacture method comprises: form a sensing electrode layer; wherein this sensing electrode layer correspondence is positioned at Ji Gaifei visible area, this visible area; form again afterwards a protective seam that comprises one first opening in the surface of this sensing electrode layer; wherein this protective seam comprehensively covers the sensing electrode layer that is positioned at this visible area, and is exposed a part for the sensing electrode layer that is positioned at this non-visible area by this first opening correspondence.Detailed manufacture process, please join following explanation.
Referring to Fig. 2 A-2F, is according to one embodiment of the invention, illustrates the diagrammatic cross-section of each middle fabrication phase of Fig. 1 contact panel.
Consult Fig. 2 A, form sensing electrode layer 106 (being on inner surface 100A) above protective substrate 100, and the formation position of sensing electrode layer 106 is that correspondence is positioned at visible area 100V and non-visible area 100P.In one embodiment, sensing electrode layer 106 comprises a plurality of conductive pattern 110X that are arranged in parallel along first axial (as X-axis), a plurality of conductive pattern 110Y and insulation divisions 112 that are arranged in parallel along second axial (as Y-axis), and conductive pattern 110X and conductive pattern 110Y are electrically insulated from each other by insulation division 112.The conductive pattern 110X of sensing electrode layer 106 and 110Y there is no and limited its shape, structure or arrangement mode, the sensing electrode layer 106 of the present embodiment is the design that for example adopts single layer structure, wherein insulation division 112 is arranged between the bonding line 114 of conductive pattern 110X and the connecting line 113 of conductive pattern 110Y, allows the bonding line 114 of conductive pattern 110X form bridging structure.
The material of above-mentioned conductive pattern 110X and 110Y is for example tin indium oxide (indium tin oxide, ITO), indium zinc oxide (indium zinc oxide, IZO), aluminum zinc oxide (aluminum zinc oxide, AZO) or other applicable transparent conductive materials, can utilize the long-pending and photolithographic processes in Shen to form these conductive patterns 110X and 110Y.The material of insulation division 112 can be the insulating material of organic or inorganic, for example, be pi (polyimide), can, by deposition and photolithographic processes or printing process by this insulating material patterning, form insulation division 112.
Consult Fig. 2 B; after all components of sensing electrode layer 106 completes; form immediately the protective seam 116 that comprises opening 116a in the surface of sensing electrode layer 106; allow protective seam 116 comprehensively cover all components of the sensing electrode layer 106 that is positioned at visible area 100V; comprise conductive pattern 110X and 110Y, insulation division 112 etc., and exposed a part for the sensing electrode layer 106 that is positioned at non-visible area 100P by opening 116a correspondence.More specifically, the protective seam 116 of the present embodiment is that the mode that directly contacts conductive pattern 110X and 110Y, insulation division 112 is covered in the surface of sensing electrode layer 106.
The material of protective seam 116 can be the transparent insulation material of organic or inorganic; be for example the materials such as pi (polyimide), silicon dioxide (SiO2), transparent insulation glue; in the time that the material of protective seam 116 is organic photoresist, can form by photolithographic processes the opening 116a of protective seam 116 and protective seam 116.In addition,, in the time that the material of protective seam 116 is other transparent insulation materials, for example, when silicon dioxide (SiO2) or transparent insulation glue, also can use printing process or other film-plating process to form the opening 116a of protective seam 116 and protective seam 116.
In this embodiment, the coverage of protective seam 116 is to lay according to the full wafer area of protective substrate 100, but in other embodiments, protective seam 116 can be also only to lay according to the formation region of sensing electrode layer 106.As long as can carry out immediately the various variations of covering protection sensing electrode layer 106 by protective seam 116 after the complete formation of sensing electrode layer 106, all belong to the scope that the present invention can be contained.
Consult Fig. 2 C, form light shielding part 118 on protective seam 116, light shielding part 118 is used for defining described non-visible area 100P.What remark additionally is; because the coverage of the protective seam 116 of the present embodiment is to lay according to the full wafer area of protective substrate 100; therefore the whole light shielding part 118 of the present embodiment is formed on protective seam 116; in another embodiment; if the coverage of protective seam 116 is only to lay according to the formation region of sensing electrode layer 106, the light shielding part 118 that only has part is formed on protective seam 116.According to the framework of the present embodiment, protective seam 116 is between sensing electrode layer 106 and light shielding part 118 in non-visible area 100P.
The light shielding part 118 of the present embodiment further comprises an opening 118a, the opening 116a of the corresponding protective seam 116 of this opening 118a.In this embodiment, by reserved opening 118a and 116a, allow the conductor layer 124 of follow-up formation be electrically connected with sensing electrode layer 106.
Consult Fig. 2 D, filled conductive glue 120 in the opening 116a of the protective seam 116 corresponding to each other and the opening 118a of light shield layer 118, makes conducting resinl 120 sensing electrode layer 106 in electrical contact.The conducting resinl 120 of the present embodiment can for example adopt the opaque conductive rubber with light shielding part 118 same colors, allows light shielding part 118 can not reduce the effect of covering because of opening 118a.Certainly; conducting resinl 120 also can adopt electrically conducting transparent colloid; light shielding part 118 is the design that adopts aforesaid Multilayer decorative layer, allows and is provided the background color of electrically conducting transparent colloid away from the decorative layer of protective seam 116, and reach the screening effect of light shielding part 118.
Consult Fig. 2 E, on part light shielding part 118, form conductor layer 124, and allow formed conductor layer 124 corresponding to opening 118a.The material of conductor layer 124 is for example metal, metal oxide, can be long-pending by Shen, exposure imaging and etch process, or form conductor layer 124 by printing process.Above-mentioned formed conductor layer 124 can, with to be filled in conducting resinl 120 in opening 116a and 118a in electrical contact, make conductor layer 124 be electrically connected sensing electrode layer 106 by the conducting resinl 120 being filled in opening 116a and 118a.
Consult Fig. 2 F, on conductor layer 124 and light shielding part 118, form insulation course 126, in the present embodiment, because conductor layer 124 is only formed on part light shielding part 118, therefore insulation course 126 has that part folded is located at conductor layer 124, part is folded is located on light shielding part 118.Because the sensing electrode layer 106 of embodiments of the invention has been protected layers 116 protection after forming; as discussed previously; insulation course 126 is can be only corresponding to be partly positioned at non-visible area 100P and to cover the surface of conductor layer 124 and light shielding part 118, or is further formed on protective seam 116, conductor layer 124 and light shielding part 118 and is positioned at visible area 100V and non-visible area 100P with correspondence.
In one embodiment, the material of insulation course 126 can be identical with the material of protective seam 116, for example, be the transparent insulation material of organic or inorganic, can form insulation course 126 by coating and photolithographic processes, printing process or other film-plating process.
Finally, after the processing procedure of above-mentioned Fig. 2 F, allow conductor layer 124 again via anisotropic conductive film (anisotropic conductive film; ACF) 128 engage with flexible printed wiring board (FPC) 130, complete contact panel as shown in Figure 1.By this, sensing electrode layer 106 can be electrically connected with flexible printed wiring board (FPC) 130 by conducting resinl 120, conductor layer 124 and anisotropic conductive film (ACF) 128, and then is able to calculate actual touch points position according to the electrical variation of 106 sensing of sensing electrode layer with the signal processor (not drawing) that flexible printed wiring board 130 is electrically connected.
According to embodiments of the invention; after all components of sensing electrode layer 106 completes; form immediately protective seam 116 and cover sensing electrode layer 106; therefore the conductive pattern 110X of sensing electrode layer 106 and 110Y and insulation division 112 can be protected the protection of layer 116 during the processing procedure of follow-up light shielding part 118, conducting resinl 120, conductor layer 124 insulation courses 126; can do not damaged by the required action of the processing procedure of follow-up these assemblies; the frictioning action of for example print steps, or the wiping action scratch of cleaning.In addition, protective seam 116 can also help sensing electrode layer 106 to resist static discharge (ESD), therefore, according to embodiments of the invention, can promote the fiduciary level of contact panel.
In addition; according to embodiments of the invention; when contact panel carries out follow-up and connection process flexible printed wiring board (FPC) 130; and during with the laminating of display module (LCM), assembling processing procedure; protective seam 116 also can continue the effect of the sensing electrode layer 106 that protection contact panel is provided, and further promotes the fiduciary level of the sensing electrode layer 106 of contact panel.
Consult Fig. 3, Fig. 3 shows the diagrammatic cross-section according to the contact panel of one embodiment of the invention.Touch panel structure provided roughly the same shown in the embodiment of the present embodiment and Fig. 1; discrepancy is; in Fig. 3 embodiment; be formed at protective substrate 100 surperficial 100A be an optical match film (index match film) 102, optical match film 102 can be arranged between protective substrate 100 and sensing electrode layer 106.Difference in manufacture method was before Fig. 2 A; the present embodiment is first manufactured with optical match film 102 on the inner surface 100A of protective substrate 100; allow the lower surface of optical match film 102 and the inner surface 100A of protective substrate 100 contact; and make to continue in posterior Fig. 2 A stage, sensing electrode layer 106 is the upper surfaces that are further formed on optical match film 102.The optical match film 102 of the present embodiment can be used for preventing that the etching line of sensing electrode layer 106 from causing reflected light color distortion, reduces the visual effect of sensing electrode layer 106.
In addition, the present embodiment is also provided with anti-functional coating 104 on the outer surface 100B of protective substrate 100, as anti-finger mark (anti-finger; AF), anti-soil (anti-smudge; AS), anti-dizzy (anti-glare; AG) etc.In manufacture method, anti-functional coating 104 can more first be formed on the outer surface 100B of protective substrate 100 compared with other assemblies, or after other assemblies all form, is formed on the outer surface 100B of protective substrate 100 again.Certainly, optical match film 102 and anti-functional coating 104 whether selecting is separately to decide according to the design requirement of actual contact panel, at this not by the present invention is limited.
Fig. 4 shows the diagrammatic cross-section according to the contact panel of one embodiment of the invention.The light shielding part 118 that the difference of the embodiment of the present embodiment and Fig. 1 is to be used in the present embodiment to define non-visible area 100P is formed on the inner surface 100A of protective substrate 100; sensing electrode layer 106 is still on the inner surface 100A that is formed at protective substrate 100 at visible area 100A, but is formed on light shielding part 118 at non-visible area 100P.In other words, the light shielding part 118 of the present embodiment is formed in sensing electrode layer 106 below.Same; after all components of sensing electrode layer 106 completes; form immediately protective seam 116 in the upper surface of sensing electrode layer 106; therefore; the conductive pattern 110X of the sensing electrode layer 106 of this embodiment and 110Y and insulation division 112 can be protected the protection of layer 116 during the processing procedure of follow-up formation conducting resinl 120, conductor layer 124 and insulation course 126, can not damaged by the required action of the processing procedure of follow-up these assemblies.
In addition; the difference of the embodiment of the present embodiment and Fig. 1 is that the conducting resinl 120 of the present embodiment is to be filled in the opening 116a of protective seam 116; and conductor layer 124 is to be formed in partial protection layer 116 and corresponding to opening 116a, make conductor layer 124 be electrically connected sensing electrode layer 106 by the conducting resinl 120 being filled in opening 116a.According to the framework of the present embodiment, protective seam 116 part in non-visible area 100P is between sensing electrode layer 106 and conductor layer 124.Moreover; the insulation course 126 of the present embodiment is that for example correspondence is positioned at non-visible area 100P and is formed on conductor layer 124 and protective seam 116; according to another embodiment, insulation course 126 also further correspondence be positioned at visible area 100V and non-visible area 100P and be formed on conductor layer 124 and protective seam 116.
Difference in manufacture method is; the present embodiment is before forming the sensing electrode layer 106 of Fig. 2 A; first to form light shielding part 118 to define non-visible area 100P in the inner surface 100A of protective substrate 100; allow the lower surface of light shielding part 118 and the inner surface 100A of protective substrate 100 contact; and make to continue in posterior Fig. 2 A stage; sensing electrode layer 106 is the upper surface that is further formed on light shielding part 118 at non-visible area 100P, is still formed in the inner surface 100A of protective substrate 100 in the 100V of visible area.For another example form afterwards the protective seam 116 that comprises the first opening 116a as Fig. 2 B on sensing electrode layer 106; in the present embodiment; if in non-visible area 100P; sensing electrode layer 106 only part is formed on light shielding part 118; protective seam 116 is upper outside except being partly formed on sensing electrode layer 106 in non-visible area 100P, also has part and is formed on light shielding part 118.
Due in the present embodiment; the position of light shielding part 118 changes; causing subsequent components also can produce position changes; as the conducting resinl 120 forming in Fig. 2 D only can be filled in the first opening 116a of protective seam 116, and the conductor layer 124 forming at Fig. 2 E can be formed on protective seam 116 partly and corresponding to the first opening 116a in non-visible area 100P.The insulation course 126 forming at Fig. 2 F can be formed on conductor layer 124 and protective seam 116 at non-visible area 100P, and in another embodiment, the design of insulation course 126 can extend to visible area 100V and non-visible area 100P.
What remark additionally is, because the sensing electrode layer 106 of the present embodiment is just to make after light shielding part 118 forms, therefore sensing electrode layer 106 can be because of the existence of light shielding part 118 between visible area 100V and non-visible area 100P but not is formed on same level.But; according to actual design demand; can be further before making formation sensing electrode layer 106; in the 100V of visible area, first form a smooth layer (SmoothingLayer) (not shown) in the inner surface 100A of protective substrate 100; allow smooth layer and light shielding part 118 co-altitudes; make sensing electrode layer 106 be formed on the surface of the same level that light shielding part 118 and smooth layer form, increase the fiduciary level of sensing electrode layer 106.
In sum; according to embodiments of the invention; the all components of the sensing electrode layer 106 of contact panel can be protected the complete preservation of layer 116, avoids sensing electrode layer 106 to sustain damage in the processing procedure of follow-up other assemblies, therefore can improve the fiduciary level of contact panel.In addition,, by the setting of protective seam 116, can also promote the sensing electrode layer 106 of contact panel for the resistivity of static discharge (ESD).
Although the present invention has disclosed preferred embodiment as above, so it is not in order to limit the present invention, and those having an ordinary knowledge in this technical field work as and can understand, without departing from the spirit and scope of the present invention, and when doing a little change and retouching.Therefore, protection scope of the present invention is when defining and be as the criterion depending on claim.
Claims (20)
1. a contact panel, has been defined a visible area and a non-visible area, it is characterized in that, this contact panel comprises:
One sensing electrode layer, correspondence is positioned at Ji Gaifei visible area, this visible area; And
One protective seam, comprises one first opening, and this protective seam is formed on this sensing electrode layer comprehensively to cover this sensing electrode layer that is positioned at this visible area, and is exposed a part for this sensing electrode layer that is positioned at this non-visible area by this first opening correspondence.
2. contact panel according to claim 1, is characterized in that, also comprises a protective substrate, and this sensing electrode layer is formed at the surface of this protective substrate.
3. contact panel according to claim 1, is characterized in that, also comprises:
One protective substrate; And
One optical match film, is arranged between this protective substrate and this sensing electrode layer.
4. contact panel according to claim 1, is characterized in that, also comprises:
One light shielding part, at least a portion of this light shielding part is formed on this protective seam to define this non-visible area, and this light shielding part comprises one second opening, and this second opening is to this first opening that should protective seam;
One conducting resinl, is filled in this first opening and this second opening; And
One conductor layer, is formed on this light shielding part partly and corresponding to this second opening, and wherein this conductor layer is electrically connected this sensing electrode layer by this conducting resinl.
5. contact panel according to claim 4, is characterized in that, this light shielding part comprises at least one decorative layer.
6. contact panel according to claim 4, is characterized in that, also comprises:
One insulation course, is formed on this conductor layer and this light shielding part and correspondence is positioned at this non-visible area.
7. contact panel according to claim 4, is characterized in that, also comprises:
One insulation course, is formed on this protective seam, this conductor layer and this light shielding part and correspondence is positioned at Ji Gaifei visible area, this visible area.
8. contact panel according to claim 1, is characterized in that, also comprises:
One protective substrate;
One light shielding part, is formed at the surface of this protective substrate to define this non-visible area, and wherein this sensing electrode layer is to be formed on this light shielding part in this non-visible area, and is to be formed on this protective substrate in this visible area;
One conducting resinl, is filled in this first opening; And
One conductor layer, is formed on this protective seam partly and corresponding to this first opening, and wherein this conductor layer is electrically connected this sensing electrode layer by this conducting resinl.
9. contact panel according to claim 8, is characterized in that, this light shielding part comprises at least one decorative layer.
10. contact panel according to claim 8, also comprises:
One insulation course, is formed on this conductor layer and this protective seam, and correspondence is positioned at this non-visible area.
11. contact panels according to claim 8, is characterized in that, also comprise:
One insulation course, is formed on this conductor layer and this protective seam and correspondence is positioned at Ji Gaifei visible area, this visible area.
The manufacture method of 12. 1 kinds of contact panels, wherein this contact panel has been defined a visible area and a non-visible area, it is characterized in that, and the step of this manufacture method comprises:
Form a sensing electrode layer, wherein this sensing electrode layer correspondence is positioned at Ji Gaifei visible area, this visible area; And
Form a protective seam that comprises one first opening on this sensing electrode layer, wherein this protective seam comprehensively covers this sensing electrode layer that is positioned at this visible area, and is exposed a part for this sensing electrode layer that is positioned at this non-visible area by this first opening correspondence.
The manufacture method of 13. contact panels according to claim 12, is characterized in that, also comprises:
Form a light shielding part that comprises one second opening to define this non-visible area, wherein at least a portion of this light shielding part is formed on this protective seam, and this second opening is to this first opening that should protective seam;
Fill a conducting resinl in this first opening and this second opening; And
Form a conductor layer on this light shielding part of part and corresponding to this second opening, wherein this conductor layer is electrically connected this sensing electrode layer by this conducting resinl.
14. according to the manufacture method of the contact panel described in claim 13, it is characterized in that, also comprises:
Form an insulation course on this conductor layer and this light shielding part and correspondence be positioned at this non-visible area.
The manufacture method of 15. contact panels according to claim 13, is characterized in that, also comprises:
Form an insulation course on this protective seam, this conductor layer and this light shielding part and correspondence be positioned at Ji Gaifei visible area, this visible area.
The manufacture method of 16. contact panels according to claim 12, is characterized in that, also comprises:
Before forming this sensing electrode layer, form a light shielding part and define this non-visible area in the surface of a protective substrate, wherein this sensing electrode layer is to be formed on this light shielding part in this non-visible area, and is to be formed on this protective substrate in this visible area;
Fill a conducting resinl in this first opening; And
Form a conductor layer on this protective seam of part and corresponding to this first opening, wherein this conductor layer is electrically connected this sensing electrode layer by this conducting resinl.
The manufacture method of 17. contact panels according to claim 16, is characterized in that, also comprises:
Form an insulation course on this conductor layer and this protective seam and correspondence be positioned at this non-visible area.
The manufacture method of 18. contact panels according to claim 16, is characterized in that, also comprises:
Form an insulation course on this conductor layer and this protective seam and correspondence be positioned at Ji Gaifei visible area, this visible area.
The manufacture method of 19. contact panels according to claim 12, is characterized in that, also comprises:
Form an optical match film in the surface of a protective substrate; And
Form this sensing electrode layer in the surface of this optical match film.
The manufacture method of 20. contact panels according to claim 12, is characterized in that, this sensing electrode layer is the surface that is formed at a protective substrate.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210595781.4A CN103885578B (en) | 2012-12-20 | 2012-12-20 | Contact panel and its manufacture method |
| TW102206361U TWM458612U (en) | 2012-12-20 | 2013-04-09 | Touch panels |
| TW102112457A TWI526890B (en) | 2012-12-20 | 2013-04-09 | Touch panels and fabrication methods thereof |
| PCT/CN2013/085746 WO2014094494A1 (en) | 2012-12-20 | 2013-10-23 | Touch panel and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210595781.4A CN103885578B (en) | 2012-12-20 | 2012-12-20 | Contact panel and its manufacture method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103885578A true CN103885578A (en) | 2014-06-25 |
| CN103885578B CN103885578B (en) | 2017-04-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210595781.4A Active CN103885578B (en) | 2012-12-20 | 2012-12-20 | Contact panel and its manufacture method |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN103885578B (en) |
| TW (2) | TWM458612U (en) |
| WO (1) | WO2014094494A1 (en) |
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| CN105573539A (en) * | 2014-10-17 | 2016-05-11 | 宸鸿光电科技股份有限公司 | Touch panel and manufacture method thereof |
| CN106155387A (en) * | 2015-04-10 | 2016-11-23 | 宸鸿科技(厦门)有限公司 | Contact panel and manufacture method thereof |
| CN107256099A (en) * | 2017-05-11 | 2017-10-17 | 昆山龙腾光电有限公司 | A kind of touch-screen manufacture method |
| CN110377179A (en) * | 2019-06-27 | 2019-10-25 | 云谷（固安）科技有限公司 | The preparation method and display device of touch panel, touch panel |
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| TWI571782B (en) * | 2013-04-09 | 2017-02-21 | 宸正光電（廈門）有限公司 | Touch panels and fabrication methods thereof |
| TWI509483B (en) * | 2013-08-28 | 2015-11-21 | Rtr Tech Technology Co Ltd | Touch panel and manufacturing method |
| CN104516577B (en) * | 2013-09-29 | 2016-06-01 | 宸鸿科技(厦门)有限公司 | Contact panel |
| TWI494821B (en) * | 2013-10-31 | 2015-08-01 | Au Optronics Corp | Touch panel |
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| CN104731397A (en) * | 2013-12-19 | 2015-06-24 | 胜华科技股份有限公司 | Touch panel and touch display device |
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Also Published As
| Publication number | Publication date |
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| TWI526890B (en) | 2016-03-21 |
| TW201426449A (en) | 2014-07-01 |
| CN103885578B (en) | 2017-04-05 |
| WO2014094494A1 (en) | 2014-06-26 |
| TWM458612U (en) | 2013-08-01 |
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Effective date of registration: 20170711 Address after: 361009 intellectual property department, No. 199, Shang Lu Road, information hi tech Zone, torch hi tech Zone, Fujian, Xiamen Patentee after: XIANGDA OPTICAL (XIAMEN) CO., LTD. Address before: 361009 Fujian Province, Xiamen torch hi tech Zone information photoelectric park is Sakamoto Road No. 199 Patentee before: Chenzheng Photoelectric (Xiamen) Co., Ltd. |