TWM458612U - Touch panels - Google Patents

Abstract

A touch panel having a viewable area and a non-viewable area is provided. The touch panel includes a sensing electrode layer corresponding to the viewable area and the non-viewable area. A protection layer, having a first opening, is formed on a surface of the sensing electrode layer to completely cover the sensing electrode layer at the viewable area. A portion of the sensing electrode layer at the non-viewable area is exposed through the first opening of the protection layer.

Description

Touch panel

This creation is about touch technology, especially about touch panels.

In recent years, touch panels have gradually become the most important input interface, and are widely used in various electronic products, such as mobile phones, personal digital assistants (PDAs) or palm-sized personal computers. The touch panel usually includes a substrate and some internal components, such as a sensing electrode, a black photoresist layer, and a touch signal wire. The conventional touch panel usually forms a sensing electrode on the substrate, and then forms a black photoresist layer and Touch signal wires and other components. Thereafter, the touch panel is bonded to a flexible printed circuit (FPC) and assembled to a display module (for example, a liquid crystal display module (LCD): LCM).

However, in the conventional touch panel, the printing and cleaning processes of the black photoresist layer and the touch signal wires are liable to damage the sensing electrodes, and the bonding process of the subsequent touch panel and the flexible printed circuit board (FPC), and The assembly and bonding process of the touch panel and the display module may also damage the sensing electrodes, resulting in damage to the touch sensing function of the conventional touch panel.

In view of the above problems in the prior art, the present invention provides a touch panel. After the sensing electrode layer is completed, a protective layer is formed to cover the sensing electrode layer, and then the other components of the touch panel are processed. , This can reduce or prevent the sensing electrode layer from being damaged, thereby overcoming the problems of the conventional touch panel described above.

According to an embodiment of the present invention, a touch panel is provided. The touch panel is defined with a visible area and a non-visible area. The touch panel includes: a sensing electrode layer corresponding to the visible area and the non-visible area; and the protective layer includes The first opening is formed on the surface of the sensing electrode layer to comprehensively cover the sensing electrode layer located in the visible region, and a portion of the sensing electrode layer located in the non-visible region is correspondingly exposed via the first opening.

100‧‧‧protective substrate

100A‧‧‧ inside surface

100B‧‧‧ outside surface

100P‧‧‧non-visible area

100V‧‧‧visible area

102‧‧‧Optical matching film

104‧‧‧Anti-functional coating

106‧‧‧Sensing electrode layer

110X, 110Y‧‧‧ conductive pattern

112‧‧‧Insulation

113‧‧‧Connected wire for conductive patterns

114‧‧‧ Jumper

116‧‧‧Protective layer

116a‧‧‧ openings

118‧‧‧Lighting Department

118a‧‧‧ Opening

120‧‧‧ conductive adhesive

124‧‧‧Wire layer

126‧‧‧Insulation

128‧‧‧isotropic conductive film (ACF)

130‧‧‧Soft Printed Circuit Board (FPC)

In order to make the objects, features, and advantages of the present disclosure more comprehensible, the following description is made in conjunction with the accompanying drawings. FIG. 1 is a schematic cross-sectional view of a touch panel according to an embodiment of the present invention; 2F is a schematic cross-sectional view of each intermediate stage of the touch panel of FIG. 1 according to an embodiment of the present invention; FIG. 3 is a cross-sectional view of the touch panel according to an embodiment of the present invention; and FIG. A schematic cross-sectional view of a touch panel according to an embodiment of the present invention is shown.

In the drawings, in order to more clearly illustrate the features of the present embodiments, the elements of the touch panel may not be drawn to scale. In addition, the orientations "upper" and "lower" as used in the following description are to cover the lens 100. In the lower direction, these orientations are only used to indicate the relative positional relationship of the respective components. However, in the practical application of the touch panel, the protection substrate 100 is used in the upper form.

FIG. 1 is a cross-sectional view showing a touch panel according to an embodiment of the present invention. The touch panel of the present embodiment is, for example, a capacitive touch panel, defined as a visible area 100V and a non-visible area 100P. Generally, the non-visible area 100P is located at least on one side of the visible area 100V, and the touch panel includes A sensing electrode layer 106 and a protective layer 116, wherein the sensing electrode layer 106 is correspondingly located in the visible region 100V and the non-visible region 100P, and the protective layer 116 includes a first opening 116a, and the protective layer 116 is formed on the sensing electrode layer The surface of 106 is to cover the sensing electrode layer 106 at the visible region 100V in a comprehensive manner, and a portion of the sensing electrode layer 106 located in the non-visible region 100P is correspondingly exposed by the first opening 116a.

The touch panel of FIG. 1 further includes a protective substrate 100, and the sensing electrode layer 106 can be formed on the inner surface 100A of the protective substrate 100. Further, all the touch elements of the touch panel can be formed on the side of the inner surface 100A of the protection substrate 100, and the outer surface 100B of the protection substrate 100 is the touch surface of the touch panel. In addition, the protective substrate 100 in the present embodiment refers to a reinforced substrate for providing functions for carrying and protecting the touch element, and the material of the protective substrate 100 is, for example, glass or other suitable material.

The touch panel of FIG. 1 further includes a light shielding portion 118, a conductive paste 120, and a wire layer 124. At least a portion of the light shielding portion 118 may be formed on the protective layer 116 to define the non-visible region 100P, and the light shielding portion 118 A second opening 118a is included, and the second opening 118a corresponds to the first opening 116a of the protective layer 116; that is, the protective layer 116 may be interposed between the sensing electrode layer 106 and the mask in the non-visible area 100P. Between the light portions 118. The conductive paste 120 is filled in the first opening 106a and the second opening 118a, and the wire layer 124 is formed on the partial light shielding portion 118 and corresponds to the second opening 118a, wherein the wire layer 124 is electrically connected by the conductive adhesive 120. The electrode layer 106.

In addition, the light shielding portion 118 may include at least one decorative layer in actual design, and the material of the decorative layer may be black photoresist, black ink or color ink, and may be coated and photolithographic, or printed, etc. Made with technology. By designing the multi-layer decorative layer, more visual effects of the touch panel in the non-visible area 100P can be increased. For example, if the light shielding portion 118 includes two decorative layers of different colors, the decorative layer adjacent to the protective layer 116 may be designed with a hollow pattern, so that the decorative layer away from the protective layer 116 can be exposed to different colors through the hollow pattern. It should be noted that if the opaque portion 118 is composed of a plurality of decorative layers, the upper and lower laminated layers of the decorative layers are not directly limited and are directly stacked, which may be formed according to the architectural design requirements of the touch panel. The aspect of indirect stacking.

The touch panel of FIG. 1 further includes an insulating layer 126 corresponding to the non-visible area 100P. Since the wire layer 124 can be formed on the partial light shielding portion 118 as described above, the insulating layer 126 can be partially formed on the wire layer 124. The upper portion is partially formed on the light shielding portion 118. In this embodiment, the insulating layer 126 is only partially disposed on the surface of the wire layer 124 and the light shielding portion 118 corresponding to the non-visible area 100P for further avoiding chemical or physical damage of the wire layer 124. However, in order to further protect the sensing electrode layer 106 from damage, in other embodiments, the insulating layer 126 may be further formed on the protective layer 116, the wire layer 124, and the light shielding portion 118 to correspond to the visible region 100V and the non-visible region. 100P.

The present invention further provides a method for manufacturing a touch panel. As described above, the touch panel is defined with a visible area and a non-visible area. The manufacturing method includes the steps of: forming a sensing electrode layer, wherein the sensing electrode The layer is corresponding to the visible area and the non-visible area, and then a protective layer including a first opening is formed on the surface of the sensing electrode layer, wherein the protective layer comprehensively covers the sensing electrode layer located in the visible area. And a portion of the sensing electrode layer located in the non-visible area is correspondingly exposed by the first opening. For detailed manufacturing process, please refer to the following instructions.

Please refer to FIG. 2A-2F for a cross-sectional view of each intermediate manufacturing stage of the touch panel of FIG. 1 according to an embodiment of the present invention.

Referring to FIG. 2A, the sensing electrode layer 106 is formed over the protective substrate 100 (ie, on the inner side surface 100A), and the formation position of the sensing electrode layer 106 is correspondingly located in the visible region 100V and the non-visible region 100P. In one embodiment, the sensing electrode layer 106 includes a plurality of conductive patterns 110X arranged in parallel along the first axial direction (such as the X axis), and a plurality of conductive patterns 110Y arranged in parallel along the second axial direction (such as the Y axis). The insulating portion 112, the conductive pattern 110X, and the conductive pattern 110Y are electrically isolated from each other through the insulating portion 112. The conductive patterns 110X and 110Y of the sensing electrode layer 106 are not limited in shape, structure or arrangement. The sensing electrode layer 106 of the present embodiment is designed, for example, by a single layer structure, wherein the insulating portion 112 is disposed on the conductive pattern. Between the jumper 114 of the 110X and the connection line 113 of the conductive pattern 110Y, the jumper 114 of the conductive pattern 110X forms a bridging pattern.

The materials of the conductive patterns 110X and 110Y are, for example, indium tin oxide (ITO), indium zinc oxide (IZO), aluminum zinc oxide (AZO) or other suitable transparent conductive materials. These conductive patterns 110X can be formed by a deposition and photolithography process. 110Y. The material of the insulating portion 112 may be an organic or inorganic insulating material, such as polyimide. The insulating material may be patterned by a deposition and photolithography process or a printing process to form the insulating portion 112.

Referring to FIG. 2B, after all the components of the sensing electrode layer 106 are completed, a protective layer 116 including the opening 116a is formed on the surface of the sensing electrode layer 106, so that the protective layer 116 comprehensively covers the sense of being located in the visible region 100V. All of the elements of the electrode layer 106, including the conductive patterns 110X and 110Y, the insulating portion 112, and the like, are correspondingly exposed by the opening 116a to a portion of the sensing electrode layer 106 located in the non-visible area 100P. More specifically, the protective layer 116 of the present embodiment covers the surface of the sensing electrode layer 106 in such a manner as to directly contact the conductive patterns 110X and 110Y and the insulating portion 112.

The material of the protective layer 116 may be an organic or inorganic transparent insulating material, such as polyimide, cerium oxide (SiO2), transparent insulating rubber, etc., when the material of the protective layer 116 is an organic photoresist material. The protective layer 116 and the opening 116a of the protective layer 116 may be formed by a photolithography process. In addition, when the material of the protective layer 116 is other transparent insulating material, such as cerium oxide (SiO2) or transparent insulating glue, the protective layer 116 and the opening 116a of the protective layer 116 may be formed using a printing process or other coating process.

In this embodiment, the coverage of the protective layer 116 is arranged according to the entire area of the protective substrate 100. However, in other embodiments, the protective layer 116 may also be based only on the formation region of the sensing electrode layer 106. Just arrange it. Any variation that can protect the sensing electrode layer 106 by the protective layer 116 after the sensing electrode layer 106 is completely formed is within the scope of this creation.

Referring to FIG. 2C, a light shielding portion 118 is formed on the protective layer 116, and the light shielding portion 118 is used to define the non-visible region 100P. It is to be noted that, since the coverage of the protective layer 116 of the present embodiment is arranged according to the entire area of the protective substrate 100, all the light shielding portions 118 of the present embodiment are formed on the protective layer 116, and in another implementation. In the example, if the coverage of the protective layer 116 is only arranged according to the formation region of the sensing electrode layer 106, only a part of the light shielding portion 118 is formed on the protective layer 116. According to the architecture of the embodiment, the protective layer 116 is interposed between the sensing electrode layer 106 and the light blocking portion 118 in the non-visible area 100P.

The light shielding portion 118 of the embodiment further includes an opening 118a corresponding to the opening 116a of the protective layer 116. In this embodiment, the subsequently formed wire layer 124 and the sensing electrode layer 106 are electrically connected by the reserved openings 118a and 116a.

Referring to FIG. 2D, the conductive paste 120 is filled in the opening 116a of the protective layer 116 corresponding to each other and the opening 118a of the light shielding layer 118 such that the conductive paste 120 electrically contacts the sensing electrode layer 106. The conductive paste 120 of the present embodiment can adopt, for example, an opaque conductive paste of the same color as the light shielding portion 118, so that the light shielding portion 118 does not reduce the shielding effect due to the opening 118a. Of course, the conductive adhesive 120 can also be a transparent conductive paste, and the light shielding portion 118 is designed by using the above-mentioned multilayer decorative layer, so that the decorative layer farther away from the protective layer 116 can provide the background color of the transparent conductive gel and reach the light shielding portion 118. Shading effect.

Referring to FIG. 2E, a wire layer 124 is formed on a portion of the light shielding portion 118, and the formed wire layer 124 corresponds to the opening 118a. The material of the wire layer 124 is, for example, a metal or a metal oxide, which can be deposited, exposed, developed, and etched. The wiring layer 124 is formed by a process or by a printing process. The wire layer 124 formed above is in electrical contact with the conductive paste 120 filled in the openings 116a and 118a such that the wire layer 124 is electrically connected to the sensing electrode layer 106 through the conductive paste 120 filled in the openings 116a and 118a.

Referring to FIG. 2F, an insulating layer 126 is formed on the wire layer 124 and the light shielding portion 118. In the embodiment, since the wire layer 124 is formed only on the partial light shielding portion 118, the insulating layer 126 is partially overlapped on the wire layer. 124 is partially stacked on the light shielding portion 118. Since the sensing electrode layer 106 of the embodiment of the present invention has been protected by the protective layer 116 after being formed, as previously described, the insulating layer 126 may only partially correspond to the invisible region 100P to cover the wire layer 124 and the light shielding portion. The surface of the 118 is further formed on the protective layer 116, the wire layer 124, and the light shielding portion 118 to correspond to the visible region 100V and the non-visible region 100P.

In an embodiment, the material of the insulating layer 126 may be the same as the material of the protective layer 116, such as an organic or inorganic transparent insulating material, and the insulating layer may be formed by coating and photolithography processes, printing processes or other coating processes. 126.

Finally, after the process of the above FIG. 2F, the wire layer 124 is further joined to the flexible printed circuit board (FPC) 130 via an anisotropic conductive film (ACF) 128 to complete the touch as shown in FIG. Control panel. Thereby, the sensing electrode layer 106 can be electrically connected to the flexible printed circuit board (FPC) 130 by the conductive paste 120, the wire layer 124 and the anisotropic conductive film (ACF) 128, and further electrically connected to the flexible printed circuit board 130. A signal processor (not shown) that is connected is capable of calculating the actual touch point position based on the electrical changes sensed by the sensing electrode layer 106.

According to an embodiment of the present invention, all elements of the sensing electrode layer 106 are After the fabrication of the device is completed, the protective layer 116 is formed to cover the sensing electrode layer 106. Therefore, the conductive patterns 110X and 110Y of the sensing electrode layer 106 and the insulating portion 112 are in the subsequent light shielding portion 118, the conductive paste 120, and the insulating layer 126 of the conductive layer 124. The process can be protected by the protective layer 116 during the process, and is not damaged by the actions required for the subsequent processes of the components, such as the squeegee action of the printing step or the wiping action of the cleaning step. In addition, the protective layer 116 can also help the sensing electrode layer 106 resist electrostatic discharge (ESD). Therefore, according to the embodiment of the present invention, the reliability of the touch panel can be improved.

In addition, according to the embodiment of the present invention, when the touch panel performs a subsequent bonding process with the flexible printed circuit board (FPC) 130 and the bonding and assembly process with the display module (LCM), the protective layer 116 may continue. The function of the sensing electrode layer 106 for protecting the touch panel is provided to further improve the reliability of the sensing electrode layer 106 of the touch panel.

Referring to FIG. 3, FIG. 3 is a cross-sectional view showing a touch panel according to an embodiment of the present invention. This embodiment is substantially the same as the touch panel structure shown in the embodiment of FIG. 1. The difference is that in the embodiment of FIG. 3, an optical matching film (index match film) is formed on the surface 100A of the protective substrate 100. The optical matching film 102 may be disposed between the protective substrate 100 and the sensing electrode layer 106. The difference in the manufacturing method is that, prior to FIG. 2A, the optical matching film 102 is first formed on the inner side surface 100A of the protective substrate 100, that is, the lower surface of the optical matching film 102 and the inner side surface 100A of the protective substrate 100. The sensing electrode layer 106 is further formed on the upper surface of the optical matching film 102 in the subsequent step 2A. The optical matching film 102 of the present embodiment can be used to prevent the etching line of the sensing electrode layer 106 from causing a reflected light. The color difference reduces the visible effect of the sensing electrode layer 106.

In addition, the present embodiment further provides an anti-functional coating 104 on the outer surface 100B of the protective substrate 100, such as anti-finger (AF), anti-smudge (AS), anti-glare (anti-glare). ; AG) and so on. In the manufacturing method, the anti-functional coating layer 104 may be formed on the outer side surface 100B of the protective substrate 100 earlier than other elements, or may be formed on the outer side surface 100B of the protective substrate 100 after other elements are formed. Of course, the selection of the optical matching film 102 and the anti-functional coating 104 is determined according to the design requirements of the actual touch panel, and is not limited by the creation.

4 is a cross-sectional view showing a touch panel according to an embodiment of the present invention. The difference between this embodiment and the embodiment of FIG. 1 is that the light shielding portion 118 for defining the non-visible region 100P in the present embodiment is formed on the inner side surface 100A of the protective substrate 100 such that the sensing electrode layer 106 is in the visible region. 100A is still formed on the inner side surface 100A of the protective substrate 100, but the non-visible area 100P is formed on the light shielding portion 118. In other words, the light shielding portion 118 of the present embodiment is formed under the sensing electrode layer 106. Similarly, after all the components of the sensing electrode layer 106 are completed, the protective layer 116 is formed on the upper surface of the sensing electrode layer 106. Therefore, the conductive patterns 110X and 110Y of the sensing electrode layer 106 of this embodiment are insulated. The portion 112 can be protected by the protective layer 116 during the subsequent process of forming the conductive paste 120, the wire layer 124, and the insulating layer 126, and is not damaged by the actions required for the subsequent processes of these components.

In addition, the difference between the embodiment and the embodiment of FIG. 1 is that the conductive paste 120 of the present embodiment is filled in the opening 116a of the protective layer 116, and the wire layer 124 is formed on the partial protective layer 116 and corresponds to the opening 116a. To make the wire The layer 124 is electrically connected to the sensing electrode layer 106 by a conductive paste 120 filled in the opening 116a. According to the architecture of the present embodiment, the protective layer 116 is partially interposed between the sensing electrode layer 106 and the wiring layer 124 in the non-visible area 100P. Furthermore, the insulating layer 126 of the present embodiment is formed on the wire layer 124 and the protective layer 116, for example, corresponding to the non-visible area 100P. According to another embodiment, the insulating layer 126 may further correspond to the visible area 100V and non-visual. The region 100P is formed on the wire layer 124 and the protective layer 116.

The difference in the manufacturing method is that, before forming the sensing electrode layer 106 of FIG. 2A, the first embodiment forms the light shielding portion 118 on the inner surface 100A of the protective substrate 100 to define the non-visible region 100P, that is, the light shielding portion. The lower surface of the 118 is in contact with the inner side surface 100A of the protective substrate 100, so that in the subsequent second stage of FIG. 2A, the sensing electrode layer 106 is further formed on the upper surface of the light shielding portion 118 in the non-visible area 100P in the visible area. The inner surface 100A of the protective substrate 100 is still formed in 100V. Then, the protective layer 116 including the first opening 116a is formed on the sensing electrode layer 106 as shown in FIG. 2B. In the embodiment, in the non-visible area 100P, the sensing electrode layer 106 is only partially formed in the light shielding portion. 118, the protective layer 116 is partially formed on the sensing electrode layer 106 in the non-visible area 100P, and is partially formed on the light shielding portion 118.

Since the position of the light shielding portion 118 is changed in the present embodiment, the subsequent elements are also changed in position, and the conductive paste 120 formed in the 2D drawing is only filled in the first opening 116a of the protective layer 116, and The wire layer 124 formed in FIG. 2E is formed in the non-visible area 100P on a portion of the protective layer 116 and corresponds to the first opening 116a. The insulating layer 126 formed in FIG. 2F is formed on the wire layer 124 and the protective layer 116 in the invisible region 100P, in another embodiment. The design of the insulating layer 126 can be extended to the visible area 100V and the non-visible area 100P.

It is to be noted that since the sensing electrode layer 106 of the present embodiment is fabricated after the light shielding portion 118 is formed, the sensing electrode layer 106 may exist between the visible region 100V and the non-visible region 100P due to the presence of the light shielding portion 118. Instead of forming on the same level. However, according to actual design requirements, a smoothing layer (not shown) may be formed in the visible region 100V to form the smoothing layer on the inner side surface 100A of the protective substrate 100 before forming the sensing electrode layer 106. The same height as the light shielding portion 118 is such that the sensing electrode layer 106 is formed on the surface of the same horizontal plane formed by the light shielding portion 118 and the smoothing layer, increasing the reliability of the sensing electrode layer 106.

In summary, according to the embodiment of the present invention, all components of the sensing electrode layer 106 of the touch panel can be completely protected by the protective layer 116, thereby preventing the sensing electrode layer 106 from being damaged in the process of subsequent components. Can improve the reliability of the touch panel. In addition, by the arrangement of the protective layer 116, the resistance of the sensing electrode layer 106 of the touch panel to electrostatic discharge (ESD) can also be improved.

Although the present invention has been disclosed as a preferred embodiment, it is not intended to limit the present invention, and those of ordinary skill in the art can understand that a certain change can be made without departing from the spirit and scope of the present invention. Retouching. Therefore, the scope of protection of this creation is subject to the definition of the scope of the patent application.

100‧‧‧protective substrate

100A‧‧‧ inside surface

100B‧‧‧ outside surface

100P‧‧‧non-visible area

100V‧‧‧visible area

106‧‧‧Sensing electrode layer

110X, 110Y‧‧‧ conductive pattern

112‧‧‧Insulation

113‧‧‧Connected wire for conductive patterns

114‧‧‧ Jumper

116‧‧‧Protective layer

116a‧‧‧ openings

118‧‧‧Lighting Department

118a‧‧‧ Opening

120‧‧‧ conductive adhesive

124‧‧‧Wire layer

126‧‧‧Insulation

128‧‧‧ anisotropic conductive film

130‧‧‧Soft printed circuit board

Claims (11)

A touch panel is defined as a visible area and a non-visible area, the touch panel includes: a sensing electrode layer corresponding to the visible area and the non-visible area; and a protective layer including a first opening, and The protective layer is formed on the sensing electrode layer to comprehensively cover the sensing electrode layer located in the visible region, and the first opening correspondingly exposes a portion of the sensing electrode layer located in the non-visible region. The touch panel of claim 1, further comprising a protective substrate, the sensing electrode layer being formed on a surface of the protective substrate. The touch panel of claim 1, further comprising: a protective substrate; and an optical matching film disposed between the protective substrate and the sensing electrode layer. The touch panel of claim 1, further comprising: a light shielding portion, at least a portion of the light shielding portion is formed on the protective layer to define the non-visible area, and the light shielding portion includes a second opening, The second opening corresponds to the first opening of the protective layer; a conductive paste is filled in the first opening and the second opening; and a wire layer is formed on the portion of the light shielding portion and corresponds to the second opening An opening, wherein the wire layer is electrically connected to the sensing electrode layer through the conductive adhesive. The touch panel of claim 4, wherein the shading The part contains at least one decorative layer. The touch panel of claim 4, further comprising: an insulating layer formed on the wire layer and the light shielding portion and correspondingly located in the non-visible area. The touch panel of claim 4, further comprising: an insulating layer formed on the protective layer, the wire layer and the light shielding portion and correspondingly located in the visible area and the non-visible area. The touch panel of claim 1, further comprising: a protective substrate; a light shielding portion formed on a surface of the protective substrate to define the non-visible area, wherein the sensing electrode layer is in the non-visible area Formed on the light shielding portion, wherein the visible region is formed on the protective substrate; a conductive paste is filled in the first opening; and a wire layer is formed on the portion of the protective layer and corresponds to the first An opening, wherein the wire layer is electrically connected to the sensing electrode layer through the conductive adhesive. The touch panel of claim 8, wherein the light shielding portion comprises at least one decorative layer. The touch panel of claim 8, further comprising: an insulating layer formed on the wire layer and the protective layer, and correspondingly located in the non-visible area. The touch panel of claim 8, further comprising: an insulating layer formed on the wire layer and the protective layer and correspondingly located in the visible area and the non-visible area.