TWM481448U - Touch device - Google Patents

Touch device Download PDF

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Publication number
TWM481448U
TWM481448U TW103201341U TW103201341U TWM481448U TW M481448 U TWM481448 U TW M481448U TW 103201341 U TW103201341 U TW 103201341U TW 103201341 U TW103201341 U TW 103201341U TW M481448 U TWM481448 U TW M481448U
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TW
Taiwan
Prior art keywords
substrate
touch device
touch
partially
opening
Prior art date
Application number
TW103201341U
Other languages
Chinese (zh)
Inventor
Chi-Ming Hsieh
Yi-Chen Tsai
Wen-Chun Wang
Kuo-Chang Su
Chih-Jung Teng
Ming-Sin Jian
Original Assignee
Wintek Corp
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Application filed by Wintek Corp filed Critical Wintek Corp
Priority to TW103201341U priority Critical patent/TWM481448U/en
Publication of TWM481448U publication Critical patent/TWM481448U/en

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Abstract

A touch device includes a substrate, a touch unit, traces, an insulation layer and a protection layer. The traces are disposed on the substrate and in a peripheral region. The peripheral region includes one connection region. The traces extend to the connection region. The insulation layer is disposed on the substrate and overlaps the traces in the peripheral region along a vertical projective direction. The protection layer at least partially covers the touch unit, the insulation layer and the traces in the peripheral region. The insulation layer or the protection layer includes one first opening. The insulation layer without the first opening or the protection layer without the first opening includes a plurality of second openings in the connection region. Each of the second openings corresponds to one of the traces and at least partially exposes the corresponding trace. The first opening overlaps at least two of the second openings.

Description

觸控裝置Touch device

本創作係關於一種觸控裝置,尤指一種於接合區之絕緣層與保護層設置開口互相搭配的觸控裝置。The present invention relates to a touch device, and more particularly to a touch device in which an insulating layer of a bonding region and a protective layer are provided with openings.

近年來,觸控感應技術迅速地發展,許多消費性電子產品例如行動電話(mobile phone)、衛星導航系統(GPS navigator system)、平板電腦(tablet PC)、個人數位助理(PDA)以及筆記型電腦(laptop PC)等均有與觸控功能結合的產品推出。在觸控面板的結構中,位於接合區的走線必須至少部分被暴露出來用以與外部元件例如軟性電路板(flexible printed circuit,FPC)進行接合。然而,由於觸控面板中對於觸控元件進行絕緣保護的需求,一般設置有複數層的絕緣層或保護層。若將接合區的絕緣層與保護層全部移除,會使得走線被保護的效果不佳而造成對信賴性的負面影響。另一方面,若對接合區的各走線分別設置對應之開口則會因開口以外之堆疊的絕緣層與保護層於接合區厚度過後而影響到軟性電路板的接合效果。In recent years, touch sensing technology has rapidly developed, and many consumer electronic products such as mobile phones, GPS navigator systems, tablet PCs, personal digital assistants (PDAs), and notebook computers (laptop PC) and other products with touch function. In the structure of the touch panel, the traces at the land should be at least partially exposed for bonding with external components such as a flexible printed circuit (FPC). However, due to the need for insulation protection of the touch elements in the touch panel, a plurality of layers of insulating layers or protective layers are generally provided. If the insulation layer and the protective layer of the joint region are all removed, the effect of the protection of the trace is poor, which has a negative impact on the reliability. On the other hand, if the corresponding openings are provided for the respective traces of the bonding region, the bonding effect of the stacked insulating layer and the protective layer outside the opening after the thickness of the bonding region is excessively affected may affect the flexible circuit board.

本創作之主要目的之一在於提供一種觸控裝置,利用於接合區之絕緣層與保護層中分別設置第一開口或第二開口,藉由彼此至少部分覆蓋且大小不同的第一開口與第二開口互相搭配用以於接合區分別暴露出各走線,並同時保護接合區之走線且降低接合區之絕緣層與保護層的整體厚度,進而達到提升產品信賴性與改善外部元件接合效果之目的。One of the main purposes of the present invention is to provide a touch device for providing a first opening or a second opening in an insulating layer and a protective layer of a bonding region, respectively, by using a first opening and a first opening that are at least partially covered and different in size from each other. The two openings are matched with each other to expose the respective traces in the joint region, and at the same time protect the traces of the joint region and reduce the overall thickness of the insulation layer and the protective layer of the joint region, thereby improving the reliability of the product and improving the joint effect of the external components. The purpose.

為達上述目的,本創作之一實施例提供一種觸控裝置,具有一透 光區以及一周圍區。周圍區係位於透光區之至少一側。觸控裝置包括一基板、一觸控元件、複數條走線、一絕緣層以及一保護層。觸控元件係設置於基板上並至少部分位於透光區。走線係設置於基板上並至少部分位於周圍區。周圍區包括至少一接合區,走線係至少部分延伸至接合區,且至少部分之走線係與觸控元件電性連接。絕緣層係設置於基板上,且絕緣層與位於周圍區之走線於垂直基板之一垂直投影方向上至少部分重疊。保護層係設置於基板上並至少部分覆蓋觸控元件、絕緣層以及位於周圍區之走線。絕緣層與保護層其中一者於接合區具有至少一第一開口,且絕緣層與保護層兩者中不具有第一開口者於接合區具有複數個第二開口。各第二開口係對應一條走線,各第二開口至少部分暴露出對應之走線,且第一開口係與至少兩個第二開口重疊,用以使位於接合區之各走線至少部分由對應之第二開口以及第一開口所暴露出。In order to achieve the above object, an embodiment of the present invention provides a touch device having a transparent Light zone and a surrounding zone. The surrounding area is located on at least one side of the light transmissive area. The touch device includes a substrate, a touch component, a plurality of traces, an insulating layer, and a protective layer. The touch component is disposed on the substrate and at least partially located in the light transmissive region. The wiring system is disposed on the substrate and at least partially located in the surrounding area. The surrounding area includes at least one bonding area, the routing extends at least partially to the bonding area, and at least a portion of the routing is electrically connected to the touch element. The insulating layer is disposed on the substrate, and the insulating layer at least partially overlaps with the trace located in the surrounding area in a vertical projection direction of one of the vertical substrates. The protective layer is disposed on the substrate and at least partially covers the touch element, the insulating layer, and the traces located in the surrounding area. One of the insulating layer and the protective layer has at least one first opening in the bonding region, and the first opening in the insulating layer and the protective layer does not have a plurality of second openings in the bonding region. Each of the second openings corresponds to one of the traces, and each of the second openings at least partially exposes the corresponding trace, and the first opening overlaps with the at least two second openings, so that the traces located in the joint region are at least partially The corresponding second opening and the first opening are exposed.

本創作之另一實施例提供一種觸控裝置,其中絕緣層或保護層係至少部分設置於兩相鄰之第二開口之間。Another embodiment of the present invention provides a touch device in which an insulating layer or a protective layer is at least partially disposed between two adjacent second openings.

本創作之另一實施例提供一種觸控裝置,其中第一開口係位於絕緣層,且第二開口係位於保護層。Another embodiment of the present invention provides a touch device in which a first opening is located in an insulating layer and a second opening is located in a protective layer.

本創作之另一實施例提供一種觸控裝置,其中第一開口係位於保護層,且第二開口係位於該絕緣層。Another embodiment of the present invention provides a touch device in which a first opening is located in a protective layer and a second opening is located in the insulating layer.

本創作之另一實施例提供一種觸控裝置,其中第二開口係完全位於第一開口之內。Another embodiment of the present invention provides a touch device in which a second opening is completely within the first opening.

本創作之另一實施例提供一種觸控裝置,其中各走線係至少部分設置於絕緣層與基板之間。Another embodiment of the present invention provides a touch device in which each trace is at least partially disposed between an insulating layer and a substrate.

本創作之另一實施例提供一種觸控裝置,其中絕緣層係至少部分設置於走線與基板之間。Another embodiment of the present invention provides a touch device in which an insulating layer is at least partially disposed between a trace and a substrate.

本創作之另一實施例提供一種觸控裝置,其中各走線包括一導線以及一接合墊,導線係與接合墊於垂直投影方向上至少部分互相重疊且相連 接,且各第二開口係於接合區至少部分暴露出對應之導線或接合墊。Another embodiment of the present invention provides a touch device, wherein each of the traces includes a wire and a bonding pad, and the wire and the bonding pad are at least partially overlapped and connected in a vertical projection direction. And wherein each of the second openings is at least partially exposed to the corresponding wire or the bonding pad.

本創作之另一實施例提供一種觸控裝置,其中各導線係至少部分設置於絕緣層與基板之間。Another embodiment of the present invention provides a touch device in which each of the wires is at least partially disposed between the insulating layer and the substrate.

本創作之另一實施例提供一種觸控裝置,其中絕緣層係至少部分設置於各導線與基板之間。Another embodiment of the present invention provides a touch device in which an insulating layer is at least partially disposed between each of the wires and the substrate.

本創作之另一實施例提供一種觸控裝置,更包括一外部元件以及一導電材料。導電材料係至少部分設置於各第二開口中並與被第二開口暴露出之走線電性連接,且外部元件係透過導電材料與走線電性連接。Another embodiment of the present invention provides a touch device, further comprising an external component and a conductive material. The conductive material is at least partially disposed in each of the second openings and electrically connected to the trace exposed by the second opening, and the external component is electrically connected to the trace through the conductive material.

本創作之另一實施例提供一種觸控裝置,更包括一裝飾層設置於基板上並至少部分位於周圍區。裝飾層係至少部分設置於絕緣層與基板之間。Another embodiment of the present invention provides a touch device, further comprising a decorative layer disposed on the substrate and at least partially located in the surrounding area. The decorative layer is at least partially disposed between the insulating layer and the substrate.

本創作之另一實施例提供一種觸控裝置,更包括一緩衝層設置於基板上並位於周圍區,且裝飾層係至少部分設置於緩衝層與基板之間。Another embodiment of the present invention provides a touch device, further comprising a buffer layer disposed on the substrate and located in the surrounding area, and the decorative layer is at least partially disposed between the buffer layer and the substrate.

本創作之另一實施例提供一種觸控裝置,更包括一遮蔽層設置於基板上並位於周圍區,且遮蔽層係至少部分覆蓋絕緣層或保護層。Another embodiment of the present invention provides a touch device, further comprising a shielding layer disposed on the substrate and located in the surrounding area, and the shielding layer at least partially covering the insulating layer or the protective layer.

本創作之另一實施例提供一種觸控裝置,更包括一保護導電層設置於絕緣層上。Another embodiment of the present invention provides a touch device, further comprising a protective conductive layer disposed on the insulating layer.

本創作之另一實施例提供一種觸控裝置,其中絕緣層於周圍區更具有至少一第三開口。第三開口係至少部分暴露出走線,且觸控元件係通過第三開口與至少部分之走線電性連接。Another embodiment of the present invention provides a touch device, wherein the insulating layer further has at least one third opening in the surrounding area. The third opening is at least partially exposed with a trace, and the touch element is electrically connected to at least a portion of the trace through the third opening.

本創作之另一實施例提供一種觸控裝置,其中觸控元件包括複數個觸控電極彼此互相電性絕緣設置。Another embodiment of the present invention provides a touch device in which a touch element includes a plurality of touch electrodes electrically insulated from each other.

本創作之另一實施例提供一種觸控裝置,其中觸控電極包括至少一觸控訊號驅動電極以及至少一觸控訊號接收電極。Another embodiment of the present invention provides a touch device, wherein the touch electrode includes at least one touch signal driving electrode and at least one touch signal receiving electrode.

本創作之另一實施例提供一種觸控裝置,其中觸控元件包括至少一條第一軸向電極以及至少一條第二軸向電極。第一軸向電極係沿一第一方向延伸設置,且第二軸向電極係沿一第二方向延伸設置。第二軸向電極係與 第一軸向電極電性絕緣。Another embodiment of the present invention provides a touch device in which a touch element includes at least one first axial electrode and at least one second axial electrode. The first axial electrode extends along a first direction, and the second axial electrode extends along a second direction. Second axial electrode system The first axial electrode is electrically insulated.

本創作之另一實施例提供一種觸控裝置,其中第一軸向電極包括複數個第一子電極以及至少一第一連接線設置於兩相鄰之第一子電極之間,第一連接線電性連接兩相鄰之第一子電極,第二軸向電極包括複數個第二子電極以及至少一第二連接線設置於兩相鄰之第二子電極之間,第二連接線電性連接兩相鄰之第二子電極。Another embodiment of the present invention provides a touch device, wherein the first axial electrode includes a plurality of first sub-electrodes and at least one first connecting line is disposed between two adjacent first sub-electrodes, the first connecting line Electrically connecting two adjacent first sub-electrodes, the second axial electrode includes a plurality of second sub-electrodes, and at least one second connecting line is disposed between two adjacent second sub-electrodes, and the second connecting line is electrically Connecting two adjacent second sub-electrodes.

本創作之另一實施例提供一種觸控裝置,其中基板包括一玻璃基板、一塑膠基板、一玻璃膜片、一塑膠膜片、一覆蓋板或一顯示器的基板。Another embodiment of the present invention provides a touch device, wherein the substrate comprises a glass substrate, a plastic substrate, a glass film, a plastic film, a cover plate or a display substrate.

101-103、201-203、301-304、400、500‧‧‧觸控裝置101-103, 201-203, 301-304, 400, 500‧‧‧ touch devices

110‧‧‧基板110‧‧‧Substrate

121‧‧‧裝飾層121‧‧‧Decorative layer

122‧‧‧緩衝層122‧‧‧buffer layer

130‧‧‧走線130‧‧‧Wiring

131‧‧‧導線131‧‧‧Wire

132‧‧‧接合墊132‧‧‧ Bonding mat

140‧‧‧絕緣層140‧‧‧Insulation

150‧‧‧觸控元件150‧‧‧Touch components

150C‧‧‧連接線150C‧‧‧Connecting line

150D‧‧‧保護導電層150D‧‧‧Protective conductive layer

150R‧‧‧觸控訊號接收電極150R‧‧‧ touch signal receiving electrode

150S‧‧‧觸控電極150S‧‧‧ touch electrode

150T‧‧‧觸控訊號驅動電極150T‧‧‧ touch signal drive electrode

150X‧‧‧第一軸向電極150X‧‧‧first axial electrode

150Y‧‧‧第二軸向電極150Y‧‧‧second axial electrode

160‧‧‧保護層160‧‧‧Protective layer

170‧‧‧遮蔽層170‧‧‧Shielding layer

181‧‧‧導電材料181‧‧‧Electrical materials

182‧‧‧外部元件182‧‧‧External components

510‧‧‧覆蓋板510‧‧‧ Covering board

520‧‧‧黏合層520‧‧‧Adhesive layer

R1‧‧‧透光區R1‧‧‧Light transmission area

R2‧‧‧周圍區R2‧‧‧ surrounding area

R3‧‧‧接合區R3‧‧‧ junction area

V1‧‧‧第一開口V1‧‧‧ first opening

V2‧‧‧第二開口V2‧‧‧ second opening

V3‧‧‧第三開口V3‧‧‧ third opening

X‧‧‧第一方向X‧‧‧ first direction

X1‧‧‧第一子電極X1‧‧‧ first subelectrode

X2‧‧‧第一連接線X2‧‧‧ first cable

Y‧‧‧第二方向Y‧‧‧second direction

Y1‧‧‧第二子電極Y1‧‧‧Second subelectrode

Y2‧‧‧第二連接線Y2‧‧‧second cable

Z‧‧‧垂直投影方向Z‧‧‧Vertical projection direction

第1圖繪示了本創作第一實施例之觸控裝置的示意圖。FIG. 1 is a schematic diagram of a touch device according to a first embodiment of the present invention.

第2圖繪示了本創作第一實施例之觸控裝置之接合區的部分放大示意圖。FIG. 2 is a partially enlarged schematic view showing the joint area of the touch device of the first embodiment of the present invention.

第3圖為沿第1圖中A-A’剖線所繪示之剖面示意圖。Fig. 3 is a schematic cross-sectional view taken along line A-A' in Fig. 1.

第4圖繪示了本創作第一實施例之自電容式觸控元件的示意圖。FIG. 4 is a schematic view showing the self-capacitive touch element of the first embodiment of the present invention.

第5圖繪示了本創作第一實施例之互電容式觸控元件的示意圖。FIG. 5 is a schematic diagram showing the mutual capacitive touch element of the first embodiment of the present invention.

第6圖繪示了本創作第一實施例之另一互電容式觸控元件的示意圖。FIG. 6 is a schematic diagram showing another mutual capacitive touch element of the first embodiment of the present invention.

第7圖繪示了本創作第一實施例之另一互電容式觸控元件的示意圖。FIG. 7 is a schematic diagram showing another mutual capacitive touch element of the first embodiment of the present invention.

第8圖為沿第7圖中B-B’剖線所繪示之剖面示意圖。Fig. 8 is a schematic cross-sectional view taken along line B-B' in Fig. 7.

第9圖繪示了本創作第一實施例之另一互電容式觸控元件的示意圖。FIG. 9 is a schematic diagram showing another mutual capacitive touch element of the first embodiment of the present invention.

第10圖繪示了本創作第二實施例之觸控裝置的示意圖。FIG. 10 is a schematic diagram of a touch device according to a second embodiment of the present invention.

第11圖繪示了本創作第三實施例之觸控裝置的示意圖。FIG. 11 is a schematic diagram of a touch device according to a third embodiment of the present invention.

第12圖繪示了本創作第四實施例之觸控裝置的示意圖。FIG. 12 is a schematic diagram of a touch device according to a fourth embodiment of the present invention.

第13圖繪示了本創作第五實施例之觸控裝置的示意圖。FIG. 13 is a schematic view showing the touch device of the fifth embodiment of the present invention.

第14圖繪示了本創作第五實施例之觸控裝置之接合區的部分放大示意圖。FIG. 14 is a partially enlarged schematic view showing the joint area of the touch device of the fifth embodiment of the present invention.

第15圖繪示了本創作第六實施例之觸控裝置的示意圖。FIG. 15 is a schematic view showing the touch device of the sixth embodiment of the present invention.

第16圖繪示了本創作第七實施例之觸控裝置的示意圖。FIG. 16 is a schematic view showing the touch device of the seventh embodiment of the present invention.

第17圖繪示了本創作第八實施例之觸控裝置的示意圖。FIG. 17 is a schematic diagram showing the touch device of the eighth embodiment of the present invention.

第18圖繪示了本創作第九實施例之觸控裝置的示意圖。FIG. 18 is a schematic diagram showing the touch device of the ninth embodiment of the present invention.

第19圖繪示了本創作第十實施例之觸控裝置的示意圖。FIG. 19 is a schematic diagram showing the touch device of the tenth embodiment of the present invention.

第20圖繪示了本創作第十一實施例之觸控裝置的示意圖。FIG. 20 is a schematic view showing the touch device of the eleventh embodiment of the present invention.

第21圖繪示了本創作第十二實施例之觸控裝置的示意圖。Figure 21 is a schematic view showing the touch device of the twelfth embodiment of the present invention.

為使熟習本創作所屬技術領域之一般技藝者能更進一步了解本創作,下文特列舉本創作之數個較佳實施例,並配合所附圖式,詳細說明本創作的構成內容。In order to make the present invention more familiar to those skilled in the art to which the present invention pertains, a number of preferred embodiments of the present invention are listed below, and the composition of the present invention is described in detail in conjunction with the drawings.

如第1圖、第2圖以及第3圖所示,本創作第一實施例之觸控裝置101具有一透光區R1以及一周圍區R2位於透光區R1之至少一側。在本實施例中,周圍區R2較佳係圍繞透光區R1,但並不以此為限。觸控裝置101包括一基板110、一觸控元件150、複數條走線130、一絕緣層140以及一保護層160。基板110可包括一玻璃基板、一塑膠基板、一玻璃膜片、一塑膠膜片、一覆蓋板、一顯示器的基板或其他適合之基板。本實施例之覆蓋板可包括例如玻璃基板、陶瓷基板、塑膠基板、塑膠薄膜或其他適合材料所形成之覆蓋板。當覆蓋板是玻璃基板時,此玻璃基板可以是經化學或是物理強化的強化玻璃,具有高機械強度以保護觸控元件150與搭配的顯示器,且厚度可介於0.25毫米至2毫米之間。上述之顯示器的基板可為一液晶顯示器的彩色濾光基板或一有機發光顯示器的封裝蓋,但並不以此為限。觸控元件150係設置於基板110上並至少部分位於透光區R1。走線130係設置於基板110上並至少部分位於周圍區R2。周圍區R2包括至少一接合區R3。走線130係至少部分延伸至接合區R3,且至少部分之走線130係與觸控元件150電性連接。換句話說,至少部分之走線130係一端與觸控元件150電性連接且另一 端延伸至接合區R3。在本實施例中,觸控元件150可由透光區R1部分延伸至周圍區R2,用以與走線130電性連接,但本創作並不以此為限。在本創作之其他實施例中亦可使至少部分之走線130自周圍區R2延伸至透光區R1,用以與位於透光區R1之觸控元件150電性連接。此外,絕緣層140係設置於基板110上,且絕緣層140與位於周圍區R2之走線130於垂直基板110之一垂直投影方向Z上至少部分重疊。保護層160係設置於基板110上並至少部分覆蓋觸控元件150、絕緣層140以及位於周圍區R2之走線130。絕緣層140與保護層160可分別包括無機材料例如氮化矽(silicon nitride)、氧化矽(silicon oxide)與氮氧化矽(silicon oxynitride)、有機材料例如丙烯酸類樹脂(acrylic resin)、無機-有機複合材料或其它適合之絕緣保護材料。絕緣層140與保護層160其中一者於接合區R3具有至少一第一開口V1,且絕緣層140與保護層160兩者中不具有第一開口V1者於接合區R3具有複數個第二開口V2。各第二開口V2係對應一條走線130,各第二開口V2至少部分暴露出對應之走線130,在本實施例中,各第二開口V2完全重疊於走線130的部份位置,而於其他實施例中,各第二開口V2亦可僅部份重疊於走線130,且第一開口V1係與至少兩個第二開口V2重疊,用以使位於接合區R3之各走線130至少部分由對應之第二開口V2以及第一開口V1所暴露出。在本實施例中,第一開口V1可與全部的第二開口V2重疊,但並不以此為限。值得說明的是,本實施例之各第二開口V2較佳係僅與一條走線130互相對應且部分暴露出此對應之走線130,但本創作並不以此為限。在本創作之其他實施例中亦可使第二開口V2對應複數條走線130,但第一開口V1於垂直投影方向Z上重疊之走線130的數目需大於第二開口V2於垂直投影方向Z上重疊之走線130的數目。藉由上述設計,可使得位於接合區R3之走線130於第二開口V2之外依舊可被絕緣層140或保護層160覆蓋而加強線路保護效果,且藉由第一開口V1與第二開口V2的重疊搭配,可使得在接合區R3於第二開口V2之外的絕緣層140與保護層160的整體厚度減薄,有利於後續之接合製程的進行。As shown in FIG. 1 , FIG. 2 and FIG. 3 , the touch device 101 of the first embodiment of the present invention has a light transmissive area R1 and a surrounding area R2 on at least one side of the light transmissive area R1 . In the present embodiment, the surrounding area R2 preferably surrounds the light transmitting area R1, but is not limited thereto. The touch device 101 includes a substrate 110 , a touch element 150 , a plurality of traces 130 , an insulating layer 140 , and a protective layer 160 . The substrate 110 can include a glass substrate, a plastic substrate, a glass film, a plastic film, a cover plate, a display substrate or other suitable substrate. The cover sheet of this embodiment may include a cover sheet formed of, for example, a glass substrate, a ceramic substrate, a plastic substrate, a plastic film, or other suitable material. When the cover plate is a glass substrate, the glass substrate may be chemically or physically strengthened tempered glass, and has high mechanical strength to protect the touch element 150 and the matched display, and the thickness may be between 0.25 mm and 2 mm. . The substrate of the above display may be a color filter substrate of a liquid crystal display or a package cover of an organic light emitting display, but is not limited thereto. The touch component 150 is disposed on the substrate 110 and at least partially located in the light transmissive region R1. The trace 130 is disposed on the substrate 110 and at least partially located in the peripheral region R2. The surrounding area R2 includes at least one joint area R3. The traces 130 extend at least partially to the landing region R3, and at least a portion of the traces 130 are electrically connected to the touch component 150. In other words, at least a portion of the trace 130 is electrically connected to the touch element 150 at one end and the other The end extends to the junction zone R3. In this embodiment, the touch element 150 can be partially extended from the light-transmitting region R1 to the peripheral region R2 for electrically connecting to the trace 130. However, the present invention is not limited thereto. In other embodiments of the present invention, at least a portion of the traces 130 may extend from the peripheral region R2 to the light-transmitting region R1 for electrically connecting to the touch element 150 located in the light-transmitting region R1. In addition, the insulating layer 140 is disposed on the substrate 110, and the insulating layer 140 at least partially overlaps with the trace 130 located in the peripheral region R2 in a vertical projection direction Z of one of the vertical substrates 110. The protective layer 160 is disposed on the substrate 110 and at least partially covers the touch element 150, the insulating layer 140, and the traces 130 located in the surrounding area R2. The insulating layer 140 and the protective layer 160 may respectively include inorganic materials such as silicon nitride, silicon oxide and silicon oxynitride, organic materials such as acrylic resin, inorganic-organic Composite or other suitable insulation protection material. One of the insulating layer 140 and the protective layer 160 has at least one first opening V1 in the bonding region R3, and the first opening V1 is not included in the insulating layer 140 and the protective layer 160, and the plurality of second openings are formed in the bonding region R3. V2. Each of the second openings V2 corresponds to a plurality of traces 130, and each of the second openings V2 at least partially exposes the corresponding traces 130. In this embodiment, each of the second openings V2 is completely overlapped with a portion of the traces 130. In other embodiments, each of the second openings V2 may only partially overlap the trace 130, and the first opening V1 overlaps with the at least two second openings V2 for the respective traces 130 located in the junction region R3. At least partially exposed by the corresponding second opening V2 and the first opening V1. In this embodiment, the first opening V1 may overlap with all of the second openings V2, but is not limited thereto. It should be noted that each of the second openings V2 of the present embodiment preferably corresponds to only one of the traces 130 and partially exposes the corresponding trace 130. However, the present invention is not limited thereto. In other embodiments of the present invention, the second opening V2 may be corresponding to the plurality of traces 130, but the number of the traces 130 overlapped by the first opening V1 in the vertical projection direction Z is greater than the second opening V2 in the vertical projection direction. The number of traces 130 that overlap on Z. With the above design, the trace 130 located in the junction region R3 can be covered by the insulating layer 140 or the protective layer 160 outside the second opening V2 to enhance the line protection effect, and the first opening V1 and the second opening are provided. The overlapping of V2 can reduce the overall thickness of the insulating layer 140 and the protective layer 160 outside the second opening V2 in the bonding region R3, which is advantageous for the subsequent bonding process.

更明確地說,如第2圖與第3圖所示,本實施例之絕緣層140具 有至少一個第一開口V1,而保護層160具有複數個第二開口V2,即兩相鄰之第二開口V2之間設置有保護層160,且兩相鄰之走線130之間亦設置有保護層160。在本實施例中,各第二開口V2較佳係完全位於第一開口V1之內,但本創作並不以此為限。第一開口V1於垂直投影方向Z上之面積較佳係大於各第二開口V2於垂直投影方向Z上之總面積,但亦不以此為限。在本創作之其他實施例中亦可視設計需要將第二開口V2部分延伸至第一開口V1之外。此外,本實施例之觸控裝置101可更包括一裝飾層121、一緩衝層122、一保護導電層150D、一遮蔽層170、一導電材料181以及一外部元件182。 裝飾層121係設置於基板110上並至少部分位於周圍區R2,且裝飾層121係至少部分設置於保護層160與基板110之間。在本實施例中,裝飾層121可用以定義透光區R1與周圍區R2交界,但並不以此為限。此外,裝飾層121可由單層或多層堆疊之裝飾材料例如油墨或有色光阻等材料所構成。緩衝層122係設置於基板110上並位於周圍區R2,且裝飾層121係至少部分設置於緩衝層122與基板110之間。緩衝層122較佳可由絕緣材料例如氧化矽所形成,用以保護裝飾層121,但並不以此為限。保護導電層150D係設置於絕緣層140上,保護導電層150D較佳係與走線130互相電性絕緣,舉例來說,保護導電層150D可包括一電性浮置(electrically floating)電極或/與一接地線,用以產生電性遮蔽或製程上保護走線130的保護效果。遮蔽層170係設置於基板110上並位於周圍區R2,且遮蔽層170係至少部分覆蓋絕緣層140或保護層160,用以避免周圍區R2未設置裝飾層121之區域發生漏光等缺陷。遮蔽層170亦可由單層或多層堆疊之裝飾材料例如油墨或有色光阻等材料所構成。導電材料181係至少部分設置於各第二開口V2中並與被第二開口V2暴露出之走線130電性連接,且外部元件182係透過導電材料181與走線130電性連接。導電材料181可包括異方性導電膠(anisotropic conductive film,ACF)、銀膠或其他適合之導電材料,而外部元件182可包括軟性電路板 (flexible printed circuit,FPC)或其他適合的外部元件。More specifically, as shown in FIGS. 2 and 3, the insulating layer 140 of the present embodiment has There is at least one first opening V1, and the protective layer 160 has a plurality of second openings V2, that is, a protective layer 160 is disposed between the two adjacent second openings V2, and two adjacent traces 130 are also disposed between Protective layer 160. In this embodiment, each of the second openings V2 is preferably located completely within the first opening V1, but the present invention is not limited thereto. The area of the first opening V1 in the vertical projection direction Z is preferably greater than the total area of each of the second openings V2 in the vertical projection direction Z, but is not limited thereto. In other embodiments of the present invention, it is also contemplated that the second opening V2 portion extends beyond the first opening V1. In addition, the touch device 101 of the present embodiment further includes a decorative layer 121, a buffer layer 122, a protective conductive layer 150D, a shielding layer 170, a conductive material 181, and an external component 182. The decorative layer 121 is disposed on the substrate 110 and at least partially located in the surrounding area R2, and the decorative layer 121 is at least partially disposed between the protective layer 160 and the substrate 110. In this embodiment, the decorative layer 121 can be used to define the boundary between the transparent region R1 and the surrounding region R2, but is not limited thereto. Further, the decorative layer 121 may be composed of a single layer or a plurality of layers of decorative materials such as ink or colored photoresist. The buffer layer 122 is disposed on the substrate 110 and located in the peripheral region R2, and the decorative layer 121 is at least partially disposed between the buffer layer 122 and the substrate 110. The buffer layer 122 is preferably formed of an insulating material such as yttrium oxide to protect the decorative layer 121, but is not limited thereto. The protective conductive layer 150D is disposed on the insulating layer 140. The protective conductive layer 150D is preferably electrically insulated from the traces 130. For example, the protective conductive layer 150D may include an electrically floating electrode or / And a grounding wire for generating electrical shielding or protection effect of the protection trace 130 on the process. The shielding layer 170 is disposed on the substrate 110 and located in the surrounding area R2, and the shielding layer 170 at least partially covers the insulating layer 140 or the protective layer 160 to avoid defects such as light leakage in the area where the decorative layer 121 is not disposed in the surrounding area R2. The shielding layer 170 may also be composed of a single layer or a plurality of layers of decorative materials such as ink or colored photoresist. The conductive material 181 is at least partially disposed in each of the second openings V2 and electrically connected to the traces 130 exposed by the second openings V2, and the external component 182 is electrically connected to the traces 130 through the conductive material 181. Conductive material 181 may comprise an anisotropic conductive film (ACF), silver paste or other suitable electrically conductive material, while external component 182 may comprise a flexible circuit board (flexible printed circuit, FPC) or other suitable external components.

在本實施例中,各走線130係至少部分設置於絕緣層140與基板 110之間,藉由絕緣層140覆蓋走線130來達到保護的效果。更明確地說,本實施例之各走線130較佳可包括一導線131以及一接合墊132,導線131係與接合墊132於垂直投影方向Z上至少部分互相重疊且相連接。各導線131係至少部分設置於絕緣層140與基板110之間,接合墊132較佳係至少部分設置於保護層160與絕緣層140之間,且各第二開口V2係於接合區R3至少部分暴露出對應之接合墊132。在本實施例中,導線131較佳係由導電性較佳之材料例如金屬材料所形成,而接合墊132較佳係由透明導電材料例如金屬氧化物所形成,但並不以此為限。上述之金屬材料可包括鋁、銅、銀、鉻、鈦、鉬、釹之其中至少一者、上述材料之複合層、上述材料之合金或其他適合之金屬導電材料。上述之金屬氧化物可包括氧化銦錫(indium tin oxide,ITO)、氧化銦鋅(indium zinc oxide,IZO)、氧化鋁鋅(aluminum zinc oxide,AZO)或其他適合之金屬氧化物。由於在周圍區R2以及接合區中,與第二開口V2對應區域以外之走線130均被絕緣層140或/與保護層160所覆蓋,故對於走線130的保護效果可因此提升。此外,由於各走線130之間於第一開口V1中以及各第二開口V2至基板110邊緣之區域僅保留保護層160或絕緣層140其中一者,故可藉此降低上述區域之保護層160與絕緣層140所形成的整體厚度,進而降低外部元件182與導電材料181進行接合製程時的製程困難度,達到提升外部元件182的接合效果以及提升產品良率之效果。此外,本實施例之絕緣層140較佳係於周圍區R2更具有至少一第三開口V3,第三開口V3係至少部分暴露出走線130,且觸控元件150較佳係通過第三開口V3與至少部分之走線130電性連接,但本創作並不以此為限。在本創作之其他實施例中亦可視需要使觸控元件150直接覆蓋並接觸走線130靠近透光區R1的一端用以形成電性連接。In this embodiment, each of the traces 130 is at least partially disposed on the insulating layer 140 and the substrate. Between 110, the protective layer 140 is used to cover the traces 130 to achieve the protective effect. More specifically, each of the traces 130 of the present embodiment preferably includes a wire 131 and a bonding pad 132. The wires 131 and the bonding pads 132 are at least partially overlapped and connected to each other in the vertical projection direction Z. Each of the wires 131 is at least partially disposed between the insulating layer 140 and the substrate 110. The bonding pads 132 are preferably disposed at least partially between the protective layer 160 and the insulating layer 140, and each of the second openings V2 is at least partially connected to the bonding region R3. A corresponding bond pad 132 is exposed. In the present embodiment, the wire 131 is preferably formed of a material having a good conductivity, such as a metal material, and the bonding pad 132 is preferably formed of a transparent conductive material such as a metal oxide, but is not limited thereto. The metal material described above may include at least one of aluminum, copper, silver, chromium, titanium, molybdenum, niobium, a composite layer of the above materials, an alloy of the above materials, or other suitable metallic conductive material. The above metal oxide may include indium tin oxide (ITO), indium zinc oxide (IZO), aluminum zinc oxide (AZO) or other suitable metal oxide. Since the traces 130 other than the regions corresponding to the second openings V2 are covered by the insulating layer 140 or/and the protective layer 160 in the peripheral region R2 and the land, the protective effect on the traces 130 can be improved. In addition, since only one of the protective layer 160 or the insulating layer 140 is left in the first opening V1 and the second opening V2 to the edge of the substrate 110 between the traces 130, the protective layer of the above region can be reduced. The overall thickness formed by the insulating layer 140 and 160 further reduces the difficulty in the process of bonding the external component 182 and the conductive material 181, thereby improving the bonding effect of the external component 182 and improving the yield of the product. In addition, the insulating layer 140 of the present embodiment preferably has at least one third opening V3 in the peripheral region R2. The third opening V3 at least partially exposes the trace 130, and the touch element 150 preferably passes through the third opening V3. It is electrically connected to at least part of the trace 130, but the creation is not limited thereto. In other embodiments of the present invention, the touch element 150 may be directly covered and contacted with one end of the trace 130 near the light-transmitting region R1 to form an electrical connection.

關於本實施例之觸控元件150的進一步說明,請參考第4圖至第 9圖。如第4圖所示,本實施例之觸控元件150可包括複數個觸控電極150S以及複數條連接線150C。各連接線150C係與對應之觸控電極150S電性連接。各觸控電極150S係彼此互相電性絕緣設置,用以進行一自電容式(self-capacitance)觸控偵測,但並不以此為限。各觸控電極150S的形狀可為矩形、菱形、三角形或其他適合之幾何形狀。此外,如第5圖所示,觸控電極150S可包括至少一觸控訊號驅動電極150T以及至少一觸控訊號接收電極150R彼此互相分離設置,用以進行一互電容式(mutual capacitance)觸控偵測,但並不以此為限。For further description of the touch element 150 of the present embodiment, please refer to FIG. 4 to 9 picture. As shown in FIG. 4, the touch element 150 of the present embodiment may include a plurality of touch electrodes 150S and a plurality of connection lines 150C. Each of the connecting lines 150C is electrically connected to the corresponding touch electrode 150S. Each of the touch electrodes 150S is electrically insulated from each other for performing a self-capacitance touch detection, but is not limited thereto. The shape of each touch electrode 150S may be a rectangle, a diamond, a triangle or other suitable geometric shape. In addition, as shown in FIG. 5, the touch electrode 150S may include at least one touch signal driving electrode 150T and at least one touch signal receiving electrode 150R disposed apart from each other for performing a mutual capacitance touch. Detection, but not limited to this.

如第6圖所示,觸控元件150亦可包括複數條第一軸向電極150X 以及複數條第二軸向電極150Y。第一軸向電極150X係沿一第一方向X延伸設置,第二軸向電極150Y係沿一第二方向Y延伸設置,第一軸向電極150X係與第二軸向電極150Y於垂直投影方向Z上至少部分互相重疊,且第二軸向電極150Y係與第一軸向電極150X彼此電性絕緣。第一方向X較佳係大體上與第二方向Y互相垂直,但並不以此為限。第一軸向電極150X與第二軸向電極150Y可分別為一觸控訊號驅動電極或一觸控訊號接收電極,用以互相搭配進行互電容式觸控偵測,但並不以此為限。絕緣層140可部分設置於第一軸向電極150X與第二軸向電極150Y之間,用以電性隔離第一軸向電極150X與第二軸向電極150Y,但本創作並不以此為限。在本創作的其他實施例中亦可設置其他絕緣材料來電性隔離第一軸向電極150X與第二軸向電極150Y。As shown in FIG. 6, the touch element 150 can also include a plurality of first axial electrodes 150X. And a plurality of second axial electrodes 150Y. The first axial electrode 150X extends along a first direction X, and the second axial electrode 150Y extends along a second direction Y. The first axial electrode 150X and the second axial electrode 150Y are vertically projected. Z at least partially overlap each other, and the second axial electrode 150Y is electrically insulated from the first axial electrode 150X from each other. The first direction X is preferably substantially perpendicular to the second direction Y, but is not limited thereto. The first axial electrode 150X and the second axial electrode 150Y are respectively a touch signal driving electrode or a touch signal receiving electrode, which are used for mutually mutual capacitive touch detection, but are not limited thereto. . The insulating layer 140 is partially disposed between the first axial electrode 150X and the second axial electrode 150Y for electrically isolating the first axial electrode 150X and the second axial electrode 150Y. limit. Other insulating materials may be provided in the other embodiments of the present invention to electrically isolate the first axial electrode 150X from the second axial electrode 150Y.

如第7圖所示,第一軸向電極150X亦可包括複數個第一子電極 X1以及至少一第一連接線X2設置於兩相鄰之第一子電極X1之間,且第一連接線X2電性連接兩相鄰之第一子電極X1。第二軸向電極150Y可包括複數個第二子電極Y1以及至少一第二連接線Y2設置於兩相鄰之第二子電極Y1之間,且第二連接線Y2電性連接兩相鄰之第二子電極Y1。此外,絕緣層140可部分設置於第一連接線X2與第二連接線Y2之間,用以電性隔離第一 軸向電極150X與第二軸向電極150Y,但並不以此為限。上述之觸控電極150S、連接線150C、第一軸向電極150X、第二軸向電極150Y、第一子電極X1、第一連接線X2、第二子電極Y1以及第二連接線Y2可分別由透明導電材料例如氧化銦錫、氧化銦鋅與氧化鋁鋅、金屬或其他適合之導電材料所形成。上述之金屬可包括金屬材料例如鋁、銅、銀、鉻、鈦、鉬、釹之其中至少一者、上述材料之複合層或上述材料之合金,但並不以此為限,且其型態可以為網格狀,例如金屬網格。上述之導電材料可包括導電粒子、奈米碳管或奈米銀絲,但並不以此為限,且其型態可以為網格狀,例如導電網格。舉例來說,本實施例之第一子電極X1、第二子電極Y1以及第二連接線Y2較佳可由氧化銦錫所形成,而第一連接線X2較佳可由金屬導電材料所形成,但並不以此為限。值得說明的是,如第8圖所示,第一連接線X2可至少部分設置於絕緣層140與第一基板110之間,且第一連接線X2較佳係與上述之走線中的導線以同一金屬材料所形成,但並不以此為限。如第9圖所示,第一連接線X2亦可視需要設置於保護層160與絕緣層140之間,且第一連接線X2可跨過絕緣層140用以電性連接兩相鄰之第一子電極X1。此外,本創作之觸控元件150並不以上述第4圖至第9圖所示之型態為限,而上述第4圖至第9圖所示之各種觸控元件150的型態亦可視需要應用於後述本創作之其他實施例中。As shown in FIG. 7, the first axial electrode 150X may also include a plurality of first sub-electrodes X1 and at least one first connecting line X2 are disposed between two adjacent first sub-electrodes X1, and the first connecting line X2 is electrically connected to two adjacent first sub-electrodes X1. The second axial electrode 150Y may include a plurality of second sub-electrodes Y1 and at least one second connecting line Y2 disposed between two adjacent second sub-electrodes Y1, and the second connecting line Y2 is electrically connected to two adjacent ones. The second sub-electrode Y1. In addition, the insulating layer 140 can be partially disposed between the first connecting line X2 and the second connecting line Y2 for electrically isolating the first The axial electrode 150X and the second axial electrode 150Y are not limited thereto. The touch electrode 150S, the connection line 150C, the first axial electrode 150X, the second axial electrode 150Y, the first sub-electrode X1, the first connection line X2, the second sub-electrode Y1, and the second connection line Y2 are respectively respectively It is formed of a transparent conductive material such as indium tin oxide, indium zinc oxide and aluminum zinc oxide, metal or other suitable conductive material. The metal may include at least one of a metal material such as aluminum, copper, silver, chromium, titanium, molybdenum, niobium, a composite layer of the above materials, or an alloy of the above materials, but is not limited thereto, and its type It can be grid shaped, such as a metal grid. The conductive material may include conductive particles, carbon nanotubes or nano-silver wires, but is not limited thereto, and its shape may be a grid shape, such as a conductive mesh. For example, the first sub-electrode X1, the second sub-electrode Y1, and the second connection line Y2 of the embodiment are preferably formed of indium tin oxide, and the first connection line X2 is preferably formed of a metal conductive material, but Not limited to this. It should be noted that, as shown in FIG. 8 , the first connection line X2 can be at least partially disposed between the insulating layer 140 and the first substrate 110 , and the first connection line X2 is preferably connected to the wire in the above-mentioned trace. It is formed of the same metal material, but it is not limited to this. As shown in FIG. 9, the first connection line X2 can also be disposed between the protective layer 160 and the insulating layer 140, and the first connection line X2 can be electrically connected to the two adjacent first layers. Sub-electrode X1. In addition, the touch element 150 of the present invention is not limited to the types shown in FIG. 4 to FIG. 9 , and the types of the touch elements 150 shown in the fourth to the ninth figures are also visible. It needs to be applied to other embodiments of the present invention described later.

下文將針對本創作之觸控裝置的不同實施例進行說明,且為簡化 說明,以下說明主要針對各實施例不同之處進行詳述,而不再對相同之處作重覆贅述。此外,本創作之各實施例中相同之元件係以相同之標號進行標示,以利於各實施例間互相對照。Different embodiments of the touch device of the present invention will be described below, and simplified The description below is mainly for the details of the differences between the embodiments, and the details are not repeated. In addition, the same elements in the embodiments of the present invention are denoted by the same reference numerals to facilitate the comparison between the embodiments.

如第10圖所示,本創作之第二實施例提供一觸控裝置102。與上 述第一實施例不同的地方在於,本實施例之走線130中的導線131係延伸至第二開口V2。換句話說,第二開口V2係於垂直投影方向Z上與導線131以及接合墊132至少部分互相重疊,且位於第二開口V2中的導電材料181亦 與導線131以及接合墊132互相重疊。由於一般來說以氧化銦錫所形成之接合墊132的韌性較以金屬材料形成之導線131差,故當導電材料181下壓接合墊132力量過大時容易造成接合墊132破裂。然而,藉由本實施例之導線131延伸至接合墊132下方的設計,可確保當接合墊132破裂時導電材料181仍可接觸到導線131而形成電性連接。As shown in FIG. 10, a second embodiment of the present invention provides a touch device 102. With The difference in the first embodiment is that the wires 131 in the trace 130 of the present embodiment extend to the second opening V2. In other words, the second opening V2 is at least partially overlapped with the wire 131 and the bonding pad 132 in the vertical projection direction Z, and the conductive material 181 located in the second opening V2 is also The wire 131 and the bonding pad 132 overlap each other. Since the toughness of the bonding pad 132 formed of indium tin oxide is generally inferior to that of the wire 131 formed of a metal material, when the conductive material 181 presses the bonding pad 132 too much, the bonding pad 132 is easily broken. However, with the design in which the wire 131 of the present embodiment extends below the bond pad 132, it is ensured that the conductive material 181 can still contact the wire 131 to form an electrical connection when the bond pad 132 is broken.

如第11圖所示,本創作之第三實施例提供一觸控裝置103。與上 述第一實施例不同的地方在於,本實施例之走線130可僅由導線131構成而不包括上述實施例之接合墊,且導線131係至少部分設置於絕緣層140與基板110之間。在本實施例中,導線131係延伸至第二開口V2,並被第二開口V2部分暴露出。位於第二開口V2中的導電材料181係與被第二開口V2暴露出之導線131接觸而形成電性連接。As shown in FIG. 11, a third embodiment of the present invention provides a touch device 103. With The difference between the first embodiment is that the trace 130 of the present embodiment can be composed only of the wires 131 and does not include the bonding pads of the above embodiment, and the wires 131 are at least partially disposed between the insulating layer 140 and the substrate 110. In the present embodiment, the wire 131 extends to the second opening V2 and is partially exposed by the second opening V2. The conductive material 181 located in the second opening V2 is in contact with the wire 131 exposed by the second opening V2 to form an electrical connection.

如第12圖所示,本創作之第四實施例提供一觸控裝置201。與上 述第三實施例不同的地方在於,在觸控裝置201中,絕緣層140具有第二開口V2,而保護層160具有第一開口V1。As shown in FIG. 12, a fourth embodiment of the present invention provides a touch device 201. With The third embodiment differs in that, in the touch device 201, the insulating layer 140 has a second opening V2, and the protective layer 160 has a first opening V1.

如第13圖與第14圖所示,本創作之第五實施例提供一觸控裝置 202。與上述第四實施例不同的地方在於,本實施例之各走線130較佳可包括導線131以及接合墊132,導線131係與接合墊132於垂直投影方向Z上至少部分互相重疊且相連接。此外,本實施例之第二開口V2係部分延伸至第一開口V1之外,藉此使保護層160部分設置於第二開口V2中,用以部分覆蓋接合墊132而形成保護效果。而使兩相鄰之第二開口V2之間設置有絕緣層140,且兩相鄰之走線130之間設置有絕緣層140。As shown in FIGS. 13 and 14, the fifth embodiment of the present invention provides a touch device. 202. The difference from the fourth embodiment is that each of the traces 130 of the present embodiment preferably includes a wire 131 and a bonding pad 132. The wires 131 and the bonding pads 132 are at least partially overlapped and connected to each other in the vertical projection direction Z. . In addition, the second opening V2 of the embodiment extends partially beyond the first opening V1, whereby the protective layer 160 is partially disposed in the second opening V2 to partially cover the bonding pad 132 to form a protective effect. An insulating layer 140 is disposed between the two adjacent second openings V2, and an insulating layer 140 is disposed between the two adjacent traces 130.

如第15圖所示,本創作之第六實施例提供一觸控裝置203。與上 述第五實施例不同的地方在於,本實施例之走線130中的導線131係延伸至第二開口V2。第二開口V2係於垂直投影方向Z上與導線131以及接合墊132至少部分互相重疊,且位於第二開口V2中的導電材料181亦與導線131以及接合墊132互相重疊。此設計之效果與上述第二實施例相似,故在此並不 再贅述。As shown in FIG. 15, a sixth embodiment of the present invention provides a touch device 203. With The fifth embodiment differs in that the wires 131 in the trace 130 of the present embodiment extend to the second opening V2. The second opening V2 is at least partially overlapped with the wire 131 and the bonding pad 132 in the vertical projection direction Z, and the conductive material 181 located in the second opening V2 also overlaps the wire 131 and the bonding pad 132. The effect of this design is similar to that of the second embodiment described above, so it is not here. Let me repeat.

如第16圖所示,本創作之第七實施例提供一觸控裝置301。與上 述第五實施例不同的地方在於,在觸控裝置301中,絕緣層140係至少部分設置於走線130與基板110之間,且絕緣層140係至少部分設置於觸控元件150與基板110之間。此外,走線130中的導線131係設置於絕緣層140上且至少部分覆蓋接合墊132與觸控元件150。此外,本實施例之觸控元件150較佳可包括上述第9圖的結構,藉由以同一金屬材料形成本實施例之導線131與第9圖中的第一連接線X2來達到簡化製程的效果,但並不以此為限。As shown in FIG. 16, a seventh embodiment of the present invention provides a touch device 301. With The difference in the fifth embodiment is that, in the touch device 301, the insulating layer 140 is at least partially disposed between the trace 130 and the substrate 110, and the insulating layer 140 is at least partially disposed on the touch element 150 and the substrate 110. between. In addition, the wires 131 in the traces 130 are disposed on the insulating layer 140 and at least partially cover the bonding pads 132 and the touch elements 150. In addition, the touch element 150 of the present embodiment preferably includes the structure of the above-mentioned FIG. 9 to simplify the process by forming the wire 131 of the embodiment and the first connection line X2 of FIG. 9 with the same metal material. Effect, but not limited to this.

如第17圖所示,本創作之第八實施例提供一觸控裝置302。與上 述第七實施例不同的地方在於,本實施例之走線130中的導線131係延伸至第二開口V2。第二開口V2係於垂直投影方向Z上與導線131以及接合墊132至少部分互相重疊,且位於第二開口V2中的導電材料181亦與導線131以及接合墊132互相重疊。絕緣層140之第二開口V2可部分暴露出導線131。As shown in FIG. 17, the eighth embodiment of the present invention provides a touch device 302. With The seventh embodiment differs in that the wires 131 in the trace 130 of the present embodiment extend to the second opening V2. The second opening V2 is at least partially overlapped with the wire 131 and the bonding pad 132 in the vertical projection direction Z, and the conductive material 181 located in the second opening V2 also overlaps the wire 131 and the bonding pad 132. The second opening V2 of the insulating layer 140 may partially expose the wires 131.

如第18圖所示,本創作之第九實施例提供一觸控裝置303。與上 述第七實施例不同的地方在於,本實施例之第一開口V1係位於絕緣層140,且第二開口V2係位於保護層160。此外,由於本實施例之第二開口V2係位於保護層160,故走線130於第二開口V2之邊緣之區域可被保護層160覆蓋而達到保護效果。As shown in FIG. 18, the ninth embodiment of the present invention provides a touch device 303. With The seventh embodiment differs in that the first opening V1 of the embodiment is located on the insulating layer 140, and the second opening V2 is located in the protective layer 160. In addition, since the second opening V2 of the embodiment is located on the protective layer 160, the area of the trace 130 at the edge of the second opening V2 can be covered by the protective layer 160 to achieve a protective effect.

如第19圖所示,本創作之第十實施例提供一觸控裝置304。與上 述第九實施例不同的地方在於,本實施例之走線130可僅由導線131構成而不包括上述實施例之接合墊,且導線131係設置於絕緣層140與緩衝層122上。在本實施例中,導線131係延伸至第二開口V2,並被第二開口V2部分暴露出。位於第二開口V2中的導電材料181係與被第二開口V2暴露出之導線131接觸而形成電性連接。As shown in FIG. 19, a tenth embodiment of the present invention provides a touch device 304. With The difference between the ninth embodiment is that the trace 130 of the present embodiment can be composed only of the wires 131 and does not include the bonding pads of the above embodiment, and the wires 131 are disposed on the insulating layer 140 and the buffer layer 122. In the present embodiment, the wire 131 extends to the second opening V2 and is partially exposed by the second opening V2. The conductive material 181 located in the second opening V2 is in contact with the wire 131 exposed by the second opening V2 to form an electrical connection.

如第20圖所示,本創作之第十一實施例提供一觸控裝置400。與上述第一實施例不同的地方在於,本實施例之絕緣層140並不具有上述之第 三開口,而觸控元件150係延伸至周圍區R2並直接部分覆蓋且接觸走線130靠近透光區R1的一端用以形成電性連接。值得說明的是,上述之使觸控元件150不透過絕緣層140之開口而直接接觸走線130之設計亦可視需要應用於本創作其他實施例之結構中。As shown in FIG. 20, the eleventh embodiment of the present invention provides a touch device 400. The difference from the first embodiment described above is that the insulating layer 140 of the present embodiment does not have the above-mentioned The three openings are formed, and the touch element 150 extends to the surrounding area R2 and directly covers the end of the contact line 130 close to the transparent area R1 for forming an electrical connection. It should be noted that the above design for directly contacting the touch element 150 with the opening of the insulating layer 140 without contacting the opening of the insulating layer 140 can be applied to the structure of other embodiments of the present invention as needed.

如第21圖所示,本創作之第十二實施例提供一觸控裝置500。與 上述第一實施例不同的地方在於,觸控裝置500更包括一覆蓋板510以及一黏合層520。覆蓋板510係與基板110相對設置。此外,本實施例之裝飾層121較佳係設置於覆蓋板510上,而黏合層520係設置於覆蓋板510與基板110之間,用以黏合設置有裝飾層121之覆蓋板510以及設置有觸控元件150之基板110。黏合層520可包括固態光學膠(optical clear adhesive,OCA)、感壓膠(pressure sensitive adhesive,PSA)或其他適合之黏合材料。值得說明的是,覆蓋板510與形成有觸控元件150之基板110進行搭配之設計亦可視需要應用於本創作其他實施例之結構中。As shown in FIG. 21, a twelfth embodiment of the present invention provides a touch device 500. versus The first embodiment is different in that the touch device 500 further includes a cover plate 510 and an adhesive layer 520. The cover plate 510 is disposed opposite to the substrate 110. In addition, the decorative layer 121 of the present embodiment is preferably disposed on the cover plate 510, and the adhesive layer 520 is disposed between the cover plate 510 and the substrate 110 for bonding the cover plate 510 provided with the decorative layer 121 and provided with The substrate 110 of the touch element 150. The adhesive layer 520 may comprise an optical clear adhesive (OCA), a pressure sensitive adhesive (PSA) or other suitable bonding material. It should be noted that the design of the cover plate 510 and the substrate 110 on which the touch element 150 is formed may also be applied to the structure of other embodiments of the present invention as needed.

綜上所述,本創作之觸控裝置係利用於接合區之絕緣層與保護層 中分別設置第一開口或第二開口,藉由彼此至少部分覆蓋且大小不同的第一開口與第二開口互相搭配用以於接合區分別暴露出各走線,並可同時保護接合區之走線且降低接合區之絕緣層與保護層的整體厚度,進而達到提升產品信賴性與改善外部元件接合效果之目的。In summary, the touch device of the present invention utilizes the insulating layer and the protective layer of the bonding region. The first opening or the second opening is respectively disposed, and the first opening and the second opening which are at least partially covered and different in size are mutually matched to expose the respective lines in the joint area, and at the same time, the joint area is protected. The wire reduces the overall thickness of the insulating layer and the protective layer of the bonding region, thereby achieving the purpose of improving product reliability and improving the bonding effect of external components.

101‧‧‧觸控裝置101‧‧‧ touch device

110‧‧‧基板110‧‧‧Substrate

121‧‧‧裝飾層121‧‧‧Decorative layer

122‧‧‧緩衝層122‧‧‧buffer layer

130‧‧‧走線130‧‧‧Wiring

131‧‧‧導線131‧‧‧Wire

132‧‧‧接合墊132‧‧‧ Bonding mat

140‧‧‧絕緣層140‧‧‧Insulation

150‧‧‧觸控元件150‧‧‧Touch components

160‧‧‧保護層160‧‧‧Protective layer

170‧‧‧遮蔽層170‧‧‧Shielding layer

181‧‧‧導電材料181‧‧‧Electrical materials

182‧‧‧外部元件182‧‧‧External components

R1‧‧‧透光區R1‧‧‧Light transmission area

R2‧‧‧周圍區R2‧‧‧ surrounding area

R3‧‧‧接合區R3‧‧‧ junction area

V1‧‧‧第一開口V1‧‧‧ first opening

V2‧‧‧第二開口V2‧‧‧ second opening

V3‧‧‧第三開口V3‧‧‧ third opening

Z‧‧‧垂直投影方向Z‧‧‧Vertical projection direction

Claims (21)

一種觸控裝置,具有一透光區以及一周圍區,該周圍區係位於該透光區之至少一側,該觸控裝置包括:一基板;一觸控元件,設置於該基板上並至少部分位於該透光區;複數條走線,設置於該基板上並至少部分位於該周圍區,其中該周圍區包括至少一接合區,該等走線係至少部分延伸至該接合區,且至少部分之該等走線係與該觸控元件電性連接;一絕緣層,設置於該基板上,其中該絕緣層與位於該周圍區之該等走線於垂直該基板之一垂直投影方向上至少部分重疊;以及一保護層,設置於該基板上並至少部分覆蓋該觸控元件、該絕緣層以及位於該周圍區之該等走線,其中該絕緣層與該保護層其中一者於該接合區具有至少一第一開口,且該絕緣層與該保護層兩者中不具有該第一開口者於該接合區具有複數個第二開口,其中各該第二開口係對應一條該走線,各該第二開口至少部分暴露出對應之該走線,且該第一開口係至少與兩個該等第二開口重疊,用以使位於該接合區之各該走線至少部分由對應之該第二開口以及該第一開口所暴露出。A touch device has a light-transmissive region and a peripheral region, the peripheral region is located on at least one side of the light-transmitting region, the touch device includes: a substrate; a touch component disposed on the substrate and at least a portion of the plurality of traces disposed on the substrate and at least partially located in the peripheral region, wherein the peripheral region includes at least one junction region, the traces extending at least partially to the junction region, and at least And a portion of the wiring is electrically connected to the touch element; an insulating layer is disposed on the substrate, wherein the insulating layer and the traces located in the surrounding area are perpendicular to a vertical projection direction of the substrate At least partially overlapping; and a protective layer disposed on the substrate and at least partially covering the touch element, the insulating layer, and the traces in the surrounding area, wherein the insulating layer and the protective layer are The lands have at least one first opening, and the first opening of the insulating layer and the protective layer has a plurality of second openings in the lands, wherein each of the second openings corresponds to one of the openings Each of the second openings is at least partially exposed to the corresponding one of the traces, and the first opening is overlapped with at least two of the second openings for at least partially corresponding to each of the traces located in the joint region The second opening and the first opening are exposed. 如請求項1所述之觸控裝置,其中該絕緣層或該保護層係至少部分設置於兩相鄰之該等第二開口之間。The touch device of claim 1, wherein the insulating layer or the protective layer is at least partially disposed between the two adjacent second openings. 如請求項1所述之觸控裝置,其中該第一開口係位於該絕緣層,且該等第二開口係位於該保護層。The touch device of claim 1, wherein the first opening is located in the insulating layer, and the second openings are located in the protective layer. 如請求項1所述之觸控裝置,其中該第一開口係位於該保護層,且該等第二開口係位於該絕緣層。The touch device of claim 1, wherein the first opening is located in the protective layer, and the second openings are located in the insulating layer. 如請求項1所述之觸控裝置,其中該等第二開口係完全位於該第一開口之內。The touch device of claim 1, wherein the second openings are completely within the first opening. 如請求項1所述之觸控裝置,其中各該走線係至少部分設置於該絕緣層與該基板之間。The touch device of claim 1, wherein each of the traces is at least partially disposed between the insulating layer and the substrate. 如請求項1所述之觸控裝置,其中該絕緣層係至少部分設置於該走線與該基板之間。The touch device of claim 1, wherein the insulating layer is at least partially disposed between the trace and the substrate. 如請求項1所述之觸控裝置,其中各該走線包括一導線以及一接合墊,該導線係與該接合墊於該垂直投影方向上至少部分互相重疊且相連接,且各該第二開口係於該接合區至少部分暴露出對應之該導線或該接合墊。The touch device of claim 1, wherein each of the traces comprises a wire and a bonding pad, the wire and the bonding pad are at least partially overlapped and connected to each other in the vertical projection direction, and each of the second The opening is at least partially exposed to the corresponding wire or the bonding pad. 如請求項8所述之觸控裝置,其中各該導線係至少部分設置於該絕緣層與該基板之間。The touch device of claim 8, wherein each of the wires is at least partially disposed between the insulating layer and the substrate. 如請求項8所述之觸控裝置,其中該絕緣層係至少部分設置於各該導線與該基板之間。The touch device of claim 8, wherein the insulating layer is at least partially disposed between each of the wires and the substrate. 如請求項1所述之觸控裝置,更包括一外部元件以及一導電材料,其中該導電材料係至少部分設置於各該第二開口中並與被該等第二開口暴露出之該等走線電性連接,且該外部元件係透過該導電材料與該等走線電性連接。The touch device of claim 1, further comprising an external component and a conductive material, wherein the conductive material is at least partially disposed in each of the second openings and exposed to the second openings The wires are electrically connected, and the external component is electrically connected to the wires through the conductive material. 如請求項1所述之觸控裝置,更包括一裝飾層,設置於該基板上並至少部分位於該周圍區,其中該裝飾層係至少部分設置於該絕緣層與該基板之 間。The touch device of claim 1, further comprising a decorative layer disposed on the substrate and at least partially located in the surrounding area, wherein the decorative layer is at least partially disposed on the insulating layer and the substrate between. 如請求項12所述之觸控裝置,更包括一緩衝層,設置於該基板上並位於該周圍區,其中該裝飾層係至少部分設置於該緩衝層與該基板之間。The touch device of claim 12, further comprising a buffer layer disposed on the substrate and located in the peripheral region, wherein the decorative layer is at least partially disposed between the buffer layer and the substrate. 如請求項1所述之觸控裝置,更包括一遮蔽層,設置於該基板上並位於該周圍區,其中該遮蔽層係至少部分覆蓋該絕緣層或該保護層。The touch device of claim 1, further comprising a shielding layer disposed on the substrate and located in the surrounding area, wherein the shielding layer at least partially covers the insulating layer or the protective layer. 如請求項1所述之觸控裝置,更包括一保護導電層,設置於該絕緣層上。The touch device of claim 1, further comprising a protective conductive layer disposed on the insulating layer. 如請求項1所述之觸控裝置,其中該絕緣層於該周圍區更具有至少一第三開口,該第三開口係至少部分暴露出該等走線,且該觸控元件係通過該第三開口與至少部分之該等走線電性連接。The touch device of claim 1, wherein the insulating layer further has at least one third opening in the surrounding area, the third opening at least partially exposing the traces, and the touch element passes the first The three openings are electrically connected to at least a portion of the traces. 如請求項1所述之觸控裝置,其中該觸控元件包括複數個觸控電極彼此互相電性絕緣設置。The touch device of claim 1, wherein the touch element comprises a plurality of touch electrodes electrically insulated from each other. 如請求項17所述之觸控裝置,其中該等觸控電極包括至少一觸控訊號驅動電極以及至少一觸控訊號接收電極。The touch device of claim 17, wherein the touch electrodes comprise at least one touch signal driving electrode and at least one touch signal receiving electrode. 如請求項1所述之觸控裝置,其中該觸控元件包括:至少一條第一軸向電極,沿一第一方向延伸設置;以及至少一條第二軸向電極,沿一第二方向延伸設置,其中該第二軸向電極係與該第一軸向電極電性絕緣。The touch device of claim 1, wherein the touch element comprises: at least one first axial electrode extending along a first direction; and at least one second axial electrode extending along a second direction The second axial electrode is electrically insulated from the first axial electrode. 如請求項19所述之觸控裝置,其中該第一軸向電極包括複數個第一子電極以及至少一第一連接線設置於兩相鄰之該等第一子電極之間,該第一連 接線電性連接兩相鄰之該等第一子電極,該第二軸向電極包括複數個第二子電極以及至少一第二連接線設置於兩相鄰之該等第二子電極之間,該第二連接線電性連接兩相鄰之該等第二子電極。The touch device of claim 19, wherein the first axial electrode comprises a plurality of first sub-electrodes and at least one first connecting line is disposed between the two adjacent first sub-electrodes, the first even The wiring electrically connects the two adjacent first sub-electrodes, the second axial electrode includes a plurality of second sub-electrodes, and at least one second connecting line is disposed between the two adjacent second sub-electrodes, The second connecting line is electrically connected to the two adjacent second sub-electrodes. 如請求項1所述之觸控裝置,其中該基板包括一玻璃基板、一塑膠基板、一玻璃膜片、一塑膠膜片、一覆蓋板或一顯示器的基板。The touch device of claim 1, wherein the substrate comprises a glass substrate, a plastic substrate, a glass film, a plastic film, a cover plate or a display substrate.
TW103201341U 2014-01-22 2014-01-22 Touch device TWM481448U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160018927A1 (en) * 2014-07-21 2016-01-21 Mstar Semiconductor, Inc. Self-capacitive touch device and calculation method thereof
CN105739732A (en) * 2014-12-08 2016-07-06 纬创资通股份有限公司 Touch module and manufacturing method for touch module

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160018927A1 (en) * 2014-07-21 2016-01-21 Mstar Semiconductor, Inc. Self-capacitive touch device and calculation method thereof
CN105302392A (en) * 2014-07-21 2016-02-03 晨星半导体股份有限公司 Self-capacitive touch device and calculation method thereof
US10372273B2 (en) * 2014-07-21 2019-08-06 Ili Technology Corp. Self-capacitive touch device and calculation method thereof
CN105739732A (en) * 2014-12-08 2016-07-06 纬创资通股份有限公司 Touch module and manufacturing method for touch module
TWI557614B (en) * 2014-12-08 2016-11-11 緯創資通股份有限公司 Touch module and manufacturing method thereof
CN105739732B (en) * 2014-12-08 2018-08-14 纬创资通股份有限公司 The manufacturing method of touch-control module and touch-control module

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