TW201610796A - Touch panel and touch display device - Google Patents

Abstract

A touch panel includes a cover plate, a first substrate, and a first conductive layer. The first substrate is disposed at a side of the cover plate and is a flexible substrate. The thickness of the first substrate is about 0.5 micrometers to about 40 micrometers. The first conductive layer is disposed on the surface of the first substrate. The sheet resistance of the first conductive layer is less than or equal to 150 ohms.

Description

Touch panel and touch display device

The present invention relates to a touch panel and a touch display device using the touch panel, and more particularly to a touch panel having a low-impedance transparent conductive layer and a touch display device using the touch panel.

Touch panels have been widely used in smart phones, GPS navigator systems, tablet PCs, personal digital assistants (PDAs), and notebook computers due to their human-computer interaction. (laptop PC) and other electronic products.

The substrate for carrying the touch element in the conventional touch panel is mostly a thick substrate, and the heat resistance is poor, so that a transparent conductive layer with high quality or low impedance cannot be produced when the touch element is fabricated. Therefore, the overall load of the touch element is high. Therefore, the conventional touch panel still has the limitations and challenges of thinning and improving the electrical properties of the touch element.

An object of the present invention is to provide a touch panel and a touch display device, which provide a thin substrate having a thin thickness as a substrate on which a touch element is disposed, and a conductive layer having a low impedance is provided on the basic surface as a The touch component can effectively improve the electrical properties of the touch component, and the overall touch panel is lighter and thinner and has a good touch detection effect.

The invention discloses a touch panel, which comprises a cover plate, a first substrate and a first conductive layer. The first substrate is disposed on one side of the cover plate, and the first substrate is a soft substrate. And the thickness of the first substrate ranges from about 0.5 micrometers to about 40 micrometers, and the first conductive layer is disposed on a surface of the first substrate, and a sheet resistance of the first conductive layer is less than or equal to about 150 ohms.

According to an embodiment of the invention, the first substrate has a thickness ranging from about 0.5 microns to about 25 microns.

According to an embodiment of the invention, the material of the first substrate comprises polyimide (PI).

According to an embodiment of the invention, the material of the first substrate further comprises an inorganic material, but in the material of the first substrate, the content percentage of the inorganic material is less than the percentage of PI in the first substrate material.

According to an embodiment of the invention, the first substrate is a heat resistant substrate having a heat resistant temperature of from about 200 ° C to about 350 ° C.

According to an embodiment of the invention, the sheet resistance of the first conductive layer is less than or equal to about 50 ohms.

According to an embodiment of the invention, the sheet resistance of the first conductive layer is less than or equal to about 15 ohms.

According to an embodiment of the invention, the touch panel further includes a second substrate disposed between the first substrate and the cover plate, and a second conductive layer disposed on a surface of the second substrate.

According to an embodiment of the invention, the sheet resistance of the second conductive layer is greater than or equal to about 100 ohms, and the thickness of the second substrate is greater than about 25 microns.

According to an embodiment of the invention, the sheet resistance of the second conductive layer is less than or equal to about 150 ohms, and the thickness of the second substrate ranges from about 0.5 micrometers to about 25 micrometers.

According to an embodiment of the invention, the second conductive layer comprises at least one touch signal receiving electrode, and the first conductive layer comprises at least one touch signal driving electrode.

According to an embodiment of the invention, the second conductive layer is disposed on a surface of the second substrate facing the cover plate.

According to an embodiment of the invention, the second conductive layer is disposed on a surface of the second substrate opposite to the cover plate.

According to an embodiment of the invention, the touch panel further includes an adhesive layer disposed between the first substrate and the second substrate.

According to an embodiment of the invention, the thickness of the adhesive layer is less than or equal to about 20 microns.

According to an embodiment of the present invention, the touch panel further includes a second conductive layer disposed on a surface of the first substrate facing the cover plate, and the first conductive layer is disposed on the first substrate opposite to the Cover one surface of the board.

According to an embodiment of the invention, the touch panel further includes a buffer layer disposed between the first conductive layer and the first substrate.

According to an embodiment of the invention, the touch panel further includes a second conductive layer The first conductive layer is disposed on a surface of the first substrate opposite to the surface of the first substrate.

According to an embodiment of the invention, the touch panel further includes a second conductive layer The cover plate faces the surface of the first substrate, and the first conductive layer is disposed on a surface of the first substrate facing the cover plate.

According to an embodiment of the invention, the first conductive layer comprises a plurality of first axial directions The electrode extends along a first direction, and the second conductive layer includes a plurality of second axial electrodes extending along a second direction, and the first direction is not parallel to the second direction.

According to an embodiment of the invention, each of the first axial electrodes comprises a plurality of first The sub-electrode and the at least one first connecting line are disposed between the two adjacent first sub-electrodes, the first connecting line electrically connecting two adjacent first sub-electrodes, each of the second axial electrodes The second plurality of sub-electrodes and the at least one second connecting line are disposed between the two adjacent second sub-electrodes, and the second connecting line is electrically connected to the two adjacent second sub-electrodes. In the vertical projection direction, the overlap of the first axial electrodes and the second axial electrodes is only at the intersection of the first connecting lines and the second connecting lines.

According to an embodiment of the invention, the touch panel further includes a buffer layer disposed thereon Between the first conductive layer and the first substrate, wherein the buffer layer comprises at least an inorganic material.

According to an embodiment of the invention, wherein the buffer layer has a thickness smaller than the first conductive layer The thickness.

According to an embodiment of the invention, the touch panel further includes a protective layer disposed thereon The first conductive layer is opposite to one side of the first substrate.

According to an embodiment of the invention, the first conductive layer is disposed on the first substrate One side of the cover plate, and the refractive index of the protective layer and the buffer layer are respectively smaller than the refractive index of the first conductive layer.

According to an embodiment of the invention, the first conductive layer is disposed on the first substrate opposite On one side of the cover panel.

According to an embodiment of the invention, the touch panel further includes a protective layer disposed thereon The first conductive layer is opposite to one side of the first substrate.

According to an embodiment of the invention, the first conductive layer is disposed on the first substrate One side of the cover plate.

According to an embodiment of the invention, the first conductive layer comprises a plurality of first axial directions The electrode and the plurality of second axial electrodes. The first axial electrodes extend along a first direction, each of the first axial electrodes includes a plurality of first sub-electrodes, and at least one first connecting line is disposed on the two adjacent first sub-electrodes. The first connecting line is electrically connected to the two adjacent first sub-electrodes. The plurality of second axial electrodes extend along a second direction, each of the second axial electrodes includes a plurality of second sub-electrodes, and at least one second connecting line is disposed between the two adjacent second Between the sub-electrodes, the second connecting line is electrically connected to the two adjacent second sub-electrodes. The second axial electrodes are electrically insulated from the first axial electrodes, and the first direction is not parallel to the second direction, and the first axial electrodes are in a vertical projection direction. And the intersection of the second axial electrodes is only at the intersection of the first connecting lines and the second connecting lines, and between the first connecting lines and the second connecting lines at the intersections Insulated block is provided.

According to an embodiment of the invention, the first conductive layer comprises a plurality of touch electrodes They are electrically insulated from each other.

The present invention further discloses a touch display device including the foregoing touch panel, The display panel and an adhesive layer for bonding the touch panel to the display panel. The display panel is disposed on one side of the touch panel, and the adhesive layer is disposed between the touch panel and the display panel.

The invention further discloses a method for manufacturing a touch panel, which comprises providing a carrier board, Forming a soft substrate having a thickness ranging from about 0.5 micrometers to about 40 micrometers on the carrier, the flexible substrate comprising at least one first substrate, and then forming at least one first conductive layer on the surface of the flexible substrate. The first conductive layer is correspondingly disposed on the first substrate and has a sheet resistance of about 150 ohms or less. The first conductive layer includes a plurality of electrodes, and then the first substrate is separated from the carrier, and a cover plate is provided. The first substrate is fixed to one side of the cover sheet.

According to an embodiment of the invention, wherein the thickness of the first substrate ranges from about 0.5 micro The meter is about 25 microns.

According to an embodiment of the invention, the material of the flexible substrate comprises PI.

According to an embodiment of the present invention, the material of the flexible substrate further comprises an inorganic material However, in the material of the soft substrate, the content of the inorganic material is less than the percentage of PI in the soft substrate material.

According to an embodiment of the invention, the flexible substrate is a heat resistant substrate, which is resistant The thermal temperature reaches from about 200 ° C to about 350 ° C.

According to an embodiment of the invention, wherein the method further comprises fixing the first substrate Before the side of the cover sheet, a release process is performed to disengage the first substrate from the carrier.

According to an embodiment of the invention, the method further comprises forming an adhesive layer on the surface of the carrier, and forming the flexible substrate on the adhesive layer and one side of the carrier.

According to an embodiment of the present invention, after the forming the first conductive layer, the flexible substrate and the carrier are subjected to a cutting process to cut the flexible substrate into at least one of the first substrate. Panel unit of size.

According to an embodiment of the present invention, the adhesive layer has a frame-shaped pattern, and the flexible substrate is formed in a region surrounded by the frame-shaped pattern, and the first substrate and the carrier are after the cutting process Phase separation.

According to an embodiment of the present invention, the method further includes: providing a second substrate before forming the cover plate, and then forming at least one second conductive layer on the surface of the second substrate, and the second conductive layer includes a plurality of And the second substrate is fixed between the first substrate and the cover plate by an adhesive layer.

According to an embodiment of the invention, the sheet resistance of the second conductive layer is greater than or equal to about 100 ohms, and the thickness of the second substrate is greater than about 25 microns.

According to an embodiment of the invention, the method further includes performing a bonding process to bond a circuit board to the bonding elements of the first conductive layer and the second conductive layer before providing the cover plate.

100‧‧‧ touch panel

102‧‧‧ Covering board

102a, 104a‧‧‧ first surface

102b‧‧‧second surface

102c‧‧‧Week side

104‧‧‧First substrate

106‧‧‧First conductive layer

106C‧‧‧Wire

106R, 114R‧‧‧ touch signal receiving electrode

106S‧‧‧ touch electrode

106T‧‧‧Touch signal drive electrode

106X‧‧‧first axial electrode

106Y, 114Y‧‧‧second axial electrode

108‧‧‧Decorative layer

110, 110', 124, 136, 206, 212, 212' ‧ ‧ adhesive layer

112, 150‧‧ ‧ protective layer

112a‧‧‧ Opening

114‧‧‧Second conductive layer

116‧‧‧Insulation

118‧‧‧Insulation block

120‧‧‧Protective substrate

122‧‧‧Transfer substrate

126, 208‧‧‧ Shield

128‧‧‧Connected circuit board

130‧‧‧buffer layer

132‧‧‧second substrate

134‧‧‧Soft substrate

138, 148‧‧‧ joint hole

140‧‧‧Touch component intermediate products

142‧‧‧ stiff substrate

144‧‧‧First joint element

146‧‧‧Second joint element

148‧‧‧Shielding components

148a‧‧‧ Opening position

152‧‧‧ Panel unit

200‧‧‧ display panel

204‧‧‧ glue layer

210‧‧‧ Carrier Board

300‧‧‧Touch display device

T, T1, T2‧‧‧ thickness

X‧‧‧ first direction

X1‧‧‧ first subelectrode

X2‧‧‧ first cable

Y‧‧‧second direction

Y1‧‧‧Second subelectrode

Y2‧‧‧second cable

R1‧‧‧Light transmission area

R2‧‧‧ surrounding area

Z‧‧‧Vertical projection direction

FIG. 1 is a cross-sectional view showing a first embodiment of a touch display device and a touch panel according to the present invention.

2 is a schematic view of a self-capacitive touch electrode according to a first embodiment of the present invention.

FIG. 3 is a schematic diagram of a mutual capacitance touch electrode according to a first embodiment of the present invention.

FIG. 4 is a schematic diagram of another mutual capacitance type touch electrode according to the first embodiment of the present invention.

FIG. 5 is a cross-sectional view showing a first variation of the first embodiment of the touch display device and the touch panel of the present invention.

FIG. 6 is a cross-sectional view showing a second variation of the first embodiment of the touch display device and the touch panel of the present invention.

FIG. 7 is a cross-sectional view showing a third variation of the first embodiment of the touch display device and the touch panel of the present invention.

FIG. 8 is a cross-sectional view showing a second embodiment of the touch panel of the present invention.

Figure 9 is a cross-sectional view showing a third embodiment of the touch panel of the present invention.

FIG. 10 is a cross-sectional view showing a fourth embodiment of the touch display device and the touch panel of the present invention.

11 is a cross-sectional view showing a fifth embodiment of the touch display device and the touch panel of the present invention.

FIG. 12 is a cross-sectional view showing a fifth embodiment of the touch display device and the touch panel of the present invention.

FIG. 13 is a cross-sectional view showing a sixth embodiment of the touch display device and the touch panel of the present invention.

FIG. 14 is a cross-sectional view showing a seventh embodiment of the touch display device and the touch panel of the present invention.

Figure 15 is a schematic diagram of a mutual capacitance type touch electrode according to a seventh embodiment of the present invention.

FIG. 16 is a schematic diagram of another mutual capacitive touch electrode according to a seventh embodiment of the present invention.

17 is a cross-sectional view showing an eighth embodiment of the touch display device and the touch panel of the present invention.

FIG. 18 is a cross-sectional view showing a ninth embodiment of the touch display device and the touch panel of the present invention.

19 is a cross-sectional view showing a tenth embodiment of the touch display device and the touch panel of the present invention.

20 is a cross-sectional view showing an eleventh embodiment of the touch display device and the touch panel of the present invention.

21 is a cross-sectional view showing a twelfth embodiment of the touch display device and the touch panel of the present invention.

FIG. 22 and FIG. 23 are schematic diagrams showing a process of an embodiment of a method for fabricating a touch panel according to the present invention.

FIG. 24 and FIG. 25 are schematic diagrams showing a process of another embodiment of a method for fabricating a touch panel according to the present invention.

Figure 26 is a cross-sectional view showing a thirteenth embodiment of the touch display device and the touch panel of the present invention.

Figure 27 is a cross-sectional view showing a fourteenth embodiment of the touch display device and the touch panel of the present invention.

The present invention will be further understood by those of ordinary skill in the art to which the present invention pertains. .

Please refer to FIG. 1 . FIG. 1 is a cross-sectional view showing a first embodiment of a touch display device and a touch panel according to the present invention. The touch display device 300 of the present embodiment includes the touch panel 100 and the display panel 200 of the present invention. The display panel 200 can be a liquid crystal display panel, an organic light emitting diode (OLED) display panel, an electro-wetting display panel, an e-ink display panel, a plasma display panel, and field emission. (FED) display panel, quantum dot display panel or other suitable display panel. The touch panel 100 includes a cover plate 102 , a first substrate 104 disposed on one side of the cover plate 102 , and a first conductive layer 106 . The cover plate 102 has a first surface 102a, a second surface 102b and a peripheral side 102c, wherein the first surface 102a faces the first substrate 104, and the second surface 102b is located on the side of the cover plate 102 opposite to the first substrate 104. The peripheral side 102c is adjacent to the first surface 102a and the second surface 102b. According to the present invention, the first surface 102a, the second surface 102b, and the circumferential side 102c of the cover sheet 102 may each include a plane, a curved surface, or a combination of a plane and a curved surface. For example, in the embodiment, the first surface 102a has a curved surface, and the second surface 102b and the circumferential side 102c are respectively planar, but not limited thereto. The first substrate 104 is a flexible substrate having a thickness in the range of from about 0.5 microns to about 40 microns, preferably from about 0.5 microns to about 25 microns. The material of the first substrate 104 preferably comprises a polyimide (PI) material, and the first substrate 104 is preferably a substrate of a PI material, but not limited thereto, the first substrate 104 is not necessarily limited. It is a flexible substrate containing only PI materials. For example, the material of the first substrate 104 may include both the PI material and the inorganic material, but in the bulk material of the first substrate 104, the content percentage of the inorganic material is preferably less than the percentage of PI in the material of the first substrate 104. For example, the first substrate 104 can be mixed A PI substrate having cerium oxide (SiOx), but not limited thereto. In the present embodiment, since the first substrate 104 includes a PI material having good heat resistance, the first substrate 104 is a heat-resistant substrate having a heat-resistant temperature of about 200 ° C to about 350 ° C. In addition, the first conductive layer 106 is disposed on the surface of the first substrate 104. The first conductive layer 106 of the embodiment is located on the first substrate 104 opposite to the first surface 104a of the cover plate 102, and may include a touch component. And the wire component, wherein the touch component can include a plurality of touch electrodes, for example, at least one touch signal receiving electrode and at least one touch signal driving electrode, and the plurality of wires of the first conductive layer 106 can be electrically connected to different ones. Touch electrode. Furthermore, the first conductive layer 106 may also include bonding pads, electrostatic protection lines, or conductive elements required for various general touch panels. In FIG. 1 , only one layer of the first conductive layer 106 is illustrated, and the patterns of components such as the touch electrodes and the wires are not displayed. The first conductive layer 106 may include a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), aluminum zinc oxide (AZO), or the like, and a nanometer. A metal wire, a carbon nanotube, a graphene, a terpene or a composite layer of the above materials, but is not limited thereto. In the process of the touch panel 100 of the present embodiment, when the ITO is formed on the surface of the first substrate 104, since the first substrate 104 can resist heat up to 350 ° C, the thickness can be made by using a high temperature ITO process. The thicker and/or better quality first conductive layer 106 is such that the sheet resistance of the first conductive layer 106 is less than or equal to about 150 ohms, preferably less than or equal to about 100 ohms, more preferably less than or equal to about 80 ohms, and more preferably less than or equal to about 80 ohms. It is equal to about 50 ohms, and can even reach about 30 ohms or 15 ohms. In this structure, since the impedance of the first conductive layer 106 is low, the touch sensitivity can be greatly improved, and the power saving effect can be further achieved.

As shown in FIG. 1, the first substrate 104 is attached to the first surface 102a of the cover sheet 102 via an adhesive layer 110. The adhesive layer 110 is exemplified by, but not limited to, an optical adhesive (OCA). In a preferred embodiment, a decorative layer 108 may be disposed on the first surface 102a of the cover sheet 102, for example, having a frame pattern and located in a peripheral region of the cover sheet 102. Furthermore, the touch panel 100 of the present embodiment may further include a connection circuit board 128, such as a flexible printed circuit board, electrically connected to the components of the first conductive layer 106. In addition, the touch panel 100 can also optionally include a protective layer 112 covering The surface of the first conductive layer 106 protects the first conductive layer 106. The surface of the protective layer 112 preferably has at least one opening 112a (or an engaging hole) exposing a portion of the first conductive layer 106 for electrically connecting the connecting circuit board 128 to a part of the first conductive layer 106 via the opening 112a, for example Mating pad. It should be noted that the protective layer 112 in this embodiment can be applied to other embodiments and variations described below for covering the surface of the first conductive layer 106 to protect the first conductive layer 106, especially when the first The conductive layer 106 is located on the surface of the first substrate 104 facing outward (that is, on the surface of the first substrate 104 facing the display panel 200), and will not be described later. In addition, the touch display device 300 can further include an adhesive layer 206 for fixing the touch panel 100 and the display panel 200 to each other. The adhesive layer 206 is exemplified by, but not limited to, an optical glue or a liquid optical glue (LOCA). ). In the embodiment, a glue layer 204 is selectively disposed between the connection circuit board 128 and the display panel 200 to fill the gap between the connection circuit board 128 and the display panel 200.

In addition, it should be noted that the first conductive layer 106 of the embodiment in FIG. 1 is only one. The film layer is illustrated, but in practice the first conductive layer 106 may be composed of two or more conductive layers of the same or different materials, preferably two or more layers of transparent conductive layers. For example, the first conductive layer 106 may have a double-layer ITO structure, wherein the process temperature of the two ITO layers may be lowered (but still higher than the conventional process for fabricating ITO on the stiff substrate). Temperature) and separately forming a thin ITO layer, and the overall thickness of the two ITO layers can be higher than that of the ITO layer in the prior art, thereby still increasing the thickness of the entire first conductive layer 106, and the ITO layer of each layer The quality is also better to further reduce the impedance of the first conductive layer 106. This process design has the advantage of avoiding possible deterioration of the PI substrate, such as degradation. The structure of the first conductive layer 106 of the above two layers may be applied to the subsequent embodiments and variations, and details are not described herein.

For further explanation of the touch electrode of the present embodiment, please refer to FIGS. 2 to 4 . FIG. 2 is a schematic diagram of a self-capacitance touch electrode of the embodiment, and FIGS. 3 to 4 respectively illustrate a mutual capacitance of a different state in the embodiment. touch Schematic diagram of the control electrode. As shown in FIG. 2, in the embodiment, the touch electrode 106S included in the first conductive layer 106 is a self-capacitive touch electrode. The first substrate 104 defines a light-transmissive region R1 and a peripheral region R2. The peripheral region R2 is located on at least one side of the light-transmitting region R1, and the surrounding region R2 preferably surrounds the light-transmitting region R1, but is not limit. The touch electrode 106S is mainly disposed in the light transmitting region R1, and a part of the touch electrode 106S may also partially extend to the surrounding region R2. Each of the touch electrodes 106S is electrically insulated from each other for performing a self-capacitive touch detection, but is not limited thereto. The shape of each touch electrode 106S may be a rectangle, a diamond, a triangle or other suitable geometric shape. The first conductive layer 106 further includes a plurality of wires 106C disposed in the peripheral region R2 and extending to the light-transmitting region R1 for electrically connecting with the corresponding touch electrodes 106S. In FIG. 2, the wires 106C may be made of a transparent or opaque conductive material, which may be the same or different from the material of the touch electrode 106S. It should be noted that even though the wire 106C having a thin line width and the touch electrode 106S are made of the same transparent metal oxide material (for example, ITO), since the transparent metal oxide material can be manufactured by a relatively high temperature process, it can still have The lower impedance allows for increased sensitivity and simplified process requirements. However, in other variations, the wire 106C may also be fabricated from a less transparent or opaque conductive material, such as a metal wire.

Referring to FIG. 3, the first conductive layer 106 may include at least one touch signal driving electrode and at least one touch signal receiving electrode disposed apart from each other for performing a mutual capacitive touch detection, but not Limited. For example, the first conductive layer 106 can include a plurality of touch signal driving electrodes 106T and a plurality of touch signal receiving electrodes 106R disposed on the first substrate 104. It should be noted that, since the portion of the wire 106C in FIG. 3 extends to the light-transmitting region R1, the wire 106C in the light-transmitting region R1 is preferably made of a light-transmitting conductive material, for example, the same as the touch. The material of the signal driving electrode 106T and the touch signal receiving electrode 106R. For example, the wire 106C may comprise an ITO material, but is not limited thereto. As described above, since the first substrate 104 of the present invention is a substrate having good heat resistance, for example, a substrate containing a PI material, a high-quality transparent first conductive layer 104 can be produced at a high temperature, so that the sheet resistance of the first conductive layer 104 can be Less than 150 ohms, or even lower, Therefore, even the wire 106C having a small line width can be made of a transparent metal oxide material which is the same as the touch signal driving electrode 106T and the touch signal receiving electrode 106R, and still does not have too high impedance, so that both can be improved. Sensitivity and simplified process requirements. However, in other variations, the wire 106C may also be fabricated from a less transparent or opaque conductive material, such as a metal wire.

Referring to FIG. 4, the first electrode 106 may also include a plurality of first axial electrodes 106X. And a plurality of second axial electrodes 106Y. The first axial electrode 106X extends along the first direction X, and the second axial electrode 106Y extends along the second direction Y, wherein the first direction X is not parallel to the second direction Y, and the second axial electrode 106Y The first axial electrodes 106X are electrically insulated from each other. The first axial electrode 106X and the second axial electrode 106Y are respectively a touch signal driving electrode and a touch signal receiving electrode, which are used for mutually mutual capacitive touch detection, but are not limited thereto. . The first axial electrode 106X may include a plurality of first sub-electrodes X1 and at least one first connection line X2 is disposed between two adjacent first sub-electrodes X1, and the first connection line X2 is electrically connected to two adjacent ones. The first sub-electrode X1. The second axial electrode 106Y may include a plurality of second sub-electrodes Y1 and at least one second connecting line Y2 disposed between two adjacent second sub-electrodes Y1, and the second connecting line Y2 is electrically connected to two adjacent ones. The second sub-electrode Y1. In the vertical projection direction Z, the overlap of the first axial electrode 106X and the second axial electrode 106Y is only at the intersection of the first connecting line X2 and the second connecting line Y2, and the first connecting line at each intersection An insulating block 118 is disposed between the X2 and the second connecting line Y2 to electrically isolate the first axial electrode 106X and the second axial electrode 106Y, but is not limited thereto. For example, the insulating block 118 may cover at least the light-transmitting region and be disposed between the first connecting line X2 and the second connecting line Y2, and corresponding to the two adjacent first sub-electrodes X1 or corresponding to two adjacent ones. The position of the second sub-electrode Y1 is an opening design, and the first connection line X2 or the second connection line Y2 is electrically connected to the two adjacent first sub-electrodes X1 via the opening of the insulating block 118, or is electrically connected to two adjacent The second sub-electrode Y1. Insulating block 118 may comprise inorganic materials such as tantalum nitride, tantalum oxide and niobium oxynitride, organic materials such as acrylics or other suitable materials. It should be noted that the touch element or the touch electrode of the present invention is not limited to the types shown in the above FIGS. 2 to 4, and the second figure is The various touch elements or touch electrode types shown in FIG. 4 can also be applied to other embodiments of the present invention to be described later.

Hereinafter, different embodiments and modified embodiments of the present invention will be described and simplified. The description below is mainly for the details of the different embodiments and the different embodiments, and the details are not repeated. In addition, the same components in the various embodiments of the present invention are denoted by the same reference numerals to facilitate the comparison between the embodiments.

Please refer to FIG. 5 to FIG. 7 , wherein FIG. 5 is a touch display device and touch of the present invention. FIG. 6 is a cross-sectional view showing a second variation of the first embodiment of the touch display device and the touch panel according to the first embodiment of the present invention, and FIG. A cross-sectional view showing a third modified embodiment of the first embodiment of the touch display device and the touch panel of the present invention. The first variation embodiment shown in FIG. 5 is mainly different from the first embodiment in that the second surface 102b of the cover plate 102 is formed as a plane, and the circumferential side 102c is formed by a curved surface, and the first The surface 102a is still a flat surface, and the cover plate 102 of this shape can be regarded as a so-called 2.25D cover plate, but is not limited thereto. The main difference between the sixth embodiment and the first embodiment shown in FIG. 1 is that the circumferential side 102c of the cover panel 102 is formed by a curved surface, and the first surface 102a and the second surface 102b are still respectively formed by a plane and a curved surface. The cover plate 102 of this shape can be regarded as a so-called 2.5D cover plate, but is not limited thereto. On the other hand, the main difference between the third variation embodiment shown in FIG. 7 and the first embodiment is that the first surface 102a of the cover panel 102 is formed by a curved surface concave toward the second surface 102b. It is said that the first surface 102a has an arc shape, and the second surface 102b and the peripheral side 102c are respectively formed by a curved surface and a plane. The cover plate 102 of this shape can be regarded as a so-called 3D cover plate, but this is not limit. In FIG. 7 , the display panel 100 can be bonded to the flexible display panel 200 to form a touch display device 300 having flexible characteristics. The types of the cover sheets 102 shown in the above-mentioned FIGS. 5 to 7 and the type of the display panel 200 to be matched may be applied to other embodiments of the present invention to be described later, and will not be described again.

Please refer to FIG. 8. FIG. 8 is a cross-sectional view showing a second embodiment of the touch panel of the present invention. intention. The difference between this embodiment and the first embodiment is that a protective substrate 120 is disposed on the side of the first conductive layer 106 opposite to the cover plate 102 to hide the thinner first substrate 104 and the first conductive layer 106. Inside the touch panel 100, the protective substrate 120 may even cover a portion of the outer surface of the connection circuit board 128 to protect the first substrate 104, the first conductive layer 106, and the connection circuit board 128. In other words, the thickness of the protective substrate 120 is greater than the thickness of the first substrate 104. The protective substrate 120 may be a transfer substrate in the process of the touch panel 100, such as a release film. The release film. In various embodiments, the protective substrate 120 can also have voided regions or openings to expose portions of the first conductive layer 106, such as bond pads, for the connection circuit board 128 to bond the first conductive layer 106 from its outside. The protective substrate 120 may be a stiff substrate, such as a polyethylene terephthalate (PET) substrate, but is not limited thereto. It should be noted that the protective substrate 120 and the first conductive layer 106 may be bonded by a glue, which is not shown in FIG. 8. In addition, the protective substrate 120 is transferred during the process. The thickness of the substrate is preferably less than 30 microns, more preferably less than 20 microns. Furthermore, in a variant embodiment, the underside of the first conductive layer 106 can still be provided with a protective layer 112 as shown in FIG. In addition, the display panel 200 shown in FIG. 1 can be disposed on the lower side of the touch panel 100 of the present embodiment, and the two are attached and fixed by an adhesive layer to form the touch display device of the present invention.

Please refer to FIG. 9. FIG. 9 is a cross-sectional view showing a third embodiment of the touch panel of the present invention. intention. The difference between this embodiment and the previous embodiment is mainly that a shielding layer 126 is disposed on the lowermost side of the touch panel 100, and preferably includes a transparent conductive material such as ITO or the same material as the first conductive layer 106. The shielding layer 126 is mainly used to shield the noise of the display panel (not shown) disposed on the lower side of the touch panel 100 to improve the touch detection effect of the touch panel 100. Therefore, the shielding layer 126 may include a ground electrode. Further, similar to the previous embodiment, the transfer substrate 122 may be attached to the lower surface of the first conductive layer 106 by the adhesive layer 124 to provide protection. Transfer substrate 122 can be touch The secondary transfer substrate or the release film in the process of the control panel 100 does not need to be subjected to a release process after bonding the cover plate 102 and the first substrate 104, and the secondary transfer substrate or the release film is retained. Come down. The adhesive layer 124, the transfer substrate 122 and the shielding layer 126 in this embodiment can be regarded as a shielding component 148, and provide the function of shielding the display panel noise. The shielding component 148 can be applied to various embodiments and variant embodiments of the present invention. No longer repeat them. Similarly, if the adhesive layer 124 is a layer of adhesive existing on the substrate 122, its thickness is preferably less than 30 microns, more preferably less than 20 microns, or even 10 microns. In addition, the transfer substrate 122 can optionally have openings, such as the left dotted line and the open position 148a indicated by the arrows, to facilitate subsequent bonding of the connection circuit board 128. In various embodiments, the first conductive layer 106 and the shield layer 126 can also each be bonded to a different connection circuit board.

Please refer to FIG. 10 , which is the first embodiment of the touch display device and the touch panel of the present invention. A schematic cross-sectional view of four embodiments. The main difference between the touch panel 100 of the present embodiment and the first embodiment is that the first conductive layer 106 is disposed on a side surface of the first substrate 104 facing the cover plate 102, and thus the first substrate 104 is opposite to the cover plate 102. The protective layer 112 shown in Fig. 1 can be omitted on the surface. However, the touch panel 100 may also include the protective substrate 120, the transfer substrate 122, or the shield member 148 as shown in the second embodiment (FIG. 8) and the third embodiment (FIG. 9), and details are not described herein again. Further, although the connection circuit board is omitted in FIG. 10, the connection circuit board may be disposed on one side of the first conductive layer 106 as in the foregoing embodiment.

Please refer to FIG. 11 , which is the first embodiment of the touch display device and the touch panel of the present invention. A schematic cross-sectional view of a fifth embodiment. The difference between this embodiment and the fourth embodiment is mainly that an insulating protective layer 112 is additionally disposed between the first conductive layer 106 and the cover plate 102, which can protect the components of the first conductive layer 106. The protective layer 112 may be provided with an opening such that a connection circuit board (not shown) is bonded to the first conductive layer 106 from the upper side of the first conductive layer 106 via the opening of the protective layer 112.

Please refer to FIG. 12 , which is the first embodiment of the touch display device and the touch panel of the present invention. A schematic cross-sectional view of a fifth embodiment. The difference between this embodiment and the fourth embodiment is mainly that a transfer substrate 122 is additionally disposed between the first conductive layer 106 and the cover plate 102, which can be via a very thin adhesive layer 124 (for example, less than 15 micrometers in thickness). The transfer substrate 122 can be a stiff substrate or a stiff substrate, such as a PET substrate, but not limited thereto, and the transfer substrate 122 can be unreleased in the original process. The substrate can be transferred or attached. In addition, in different embodiments, the transfer substrate 122 may be provided with an opening, and the connection circuit board 128 may be disposed on the upper side of the transfer substrate 122 to bond the first conductive layer 106 via the opening of the transfer substrate 122. The arrangement of the transfer substrate 122 can reinforce the effect that the first substrate 104 is too thin to have on the process. In other embodiments, the transfer substrate 122 and the adhesive layer 124 on the surface thereof may be disposed on the lower side of the first substrate 104, that is, between the first substrate 104 and the adhesive layer 206. This arrangement can also be improved. The strength of the overall touch panel 100.

Please refer to FIG. 13 , which is the first embodiment of the touch display device and the touch panel of the present invention. A schematic cross-sectional view of a six embodiment. The main difference between this embodiment and the fifth embodiment is that a buffer layer 130 is disposed between the first substrate 104 and the first conductive layer 106. The buffer layer 130 may be an inorganic insulating layer mixed with or without an organic material, such as a layer of yttrium oxide material. Of course, the buffer layer 130 may also be an organic insulating layer or a mixed or mixed insulating material of an organic material and an inorganic material. The layer, but the material of the buffer layer 130 is not limited to the above examples. The arrangement of the buffer layer 130 is mainly to improve the adhesion of the first conductive layer 106. The buffer layer 130 made of the above material has good adhesion to the first substrate 104 (for example, a PI substrate) having good heat resistance and a small thickness, and can provide a better film formation surface of the subsequent first conductive layer 106, and The material of a conductive layer 106 (for example, ITO) also has good adhesion to the buffer layer 130 made of the above material, so the arrangement of the buffer layer 130 can improve the overall reliability of the touch panel 100. Moreover, if the first conductive layer 106 having a high film thickness is to be formed to lower the impedance, the advantage of providing the buffer layer 130 is more remarkable. It should be noted that the thickness T2 of the buffer layer 130 is preferably smaller than the thickness T1 of the first conductive layer 106. For example, the thickness T1 of the first conductive layer 106 may range from about 700 angstroms to 1400 angstroms, and the buffer layer 130 The thickness T2 can range from about 200 angstroms to 500 angstroms. But not limited to this. In addition, the protective layer 112 of the present embodiment is disposed on the side of the first conductive layer 106 opposite to the first substrate 104, and the material thereof may be exemplified by the material of the buffer layer 130, but is not limited thereto. Preferably, the refractive indices of the buffer layer 130 and the protective layer 112 are respectively smaller than the refractive index of the first conductive layer 106. For example, the material of the protective layer 112 may be an inorganic material, and its refractive index is about 1.7, but not limited thereto. Under this design, the protective layer 112 can also be regarded as an optical matching layer, which can reduce the visibility of the conductive layer 106 pattern on the surface of the touch panel 100. In addition, the touch panel 100 can optionally include another protective layer 150 disposed between the protective layer 112 and the adhesive layer 110. The thickness of the protective layer 150 can be greater than the thickness of the protective layer 112, so that the first substrate 104 and The release operation of the components thereon can be smoother and obtain better yield. Of course, in the modified embodiment, the protective layer 150 in FIG. 13 may also be omitted.

Please refer to FIG. 14 and FIG. 15 , FIG. 14 is a touch display device and touch of the present invention. A cross-sectional view of a seventh embodiment of the panel, and FIG. 15 is a schematic view of the mutual capacitive touch electrode of the seventh embodiment. Compared with the fifth embodiment shown in FIG. 11 , the touch panel 100 of the present embodiment further includes a second conductive layer 114 disposed between the first conductive layer 106 and the cover plate 102 , wherein the second conductive layer 114 can include The plurality of touch electrodes are matched with the touch electrodes of the first conductive layer 106 for mutual capacitive touch detection, and an insulating layer 116 is disposed between the first conductive layer 106 and the second conductive layer 114. The first conductive layer 106 is covered to insulate the first conductive layer 106 and the second conductive layer 114 from each other. As shown in FIG. 15, the first conductive layer 106 of the embodiment may include a plurality of first axial electrodes, for example, the touch signal driving electrode 106T extends along the first direction X, and the second conductive layer 114 may include a plurality of The second axial electrode, such as the touch signal receiving electrode 114R, extends in the second direction Y. The touch signal driving electrode 106T and the touch signal receiving electrode 114R at least partially overlap each other in a vertical projection direction Z for mutually matching the mutual capacitive touch detection, but not limited thereto. The first direction X is preferably substantially perpendicular to the second direction Y, and the vertical projection direction Z is substantially orthogonal to the first direction X and the second direction Y, but is not limited thereto. In addition, the embodiment may further include a shielding layer 208 disposed on the display panel 200 and the first conductive layer 106. The shielding layer 208 can include a ground electrode to prevent the noise of the display panel 200 from affecting the touch detection effect of the touch panel 100. In other embodiments, the shielding layer 208 can also be disposed between the adhesive layer 206 and the first substrate 104. The advantage of this embodiment is that the touch signal driving electrode 106T is composed of the first conductive layer 106, and because the first conductive layer 106 is formed on the surface of the high temperature resistant first substrate 104, it can be processed under relatively high temperature conditions. The first conductive layer 106 is formed to obtain the touch signal driving electrode 106T having a lower impedance. As described above, the sheet resistance of the touch signal driving electrode 106T can be even lower than 15 ohms. This design can improve the touch signal driving electrode 106T. The ability to shield the underlying display panel 200 noise can also reduce the driving voltage of the touch signal driving electrode 106T to improve touch sensitivity and save power. According to the embodiment, since the touch signal driving electrode 106T sequentially supplies driving voltages to enable the touch panel 100 to perform touch sensing, each of the touch signal driving electrodes 106T can be grounded when no driving voltage is supplied. The above-mentioned shielding noise function is achieved. Furthermore, the shield layer 208 can also be omitted in the modified embodiment of the embodiment.

Please refer to Figure 16, Figure 16 is another display panel that can be applied to Figure 14. Schematic diagram of a 100-structure mutual capacitive touch electrode. The first conductive layer 106 and the second conductive layer 114 respectively include a plurality of first axial electrodes 106X and a plurality of second axial electrodes 114Y. The first axial electrode 106X extends along the first direction X, and the second axial electrode 114Y extends along the second direction Y, wherein the first direction X is not parallel to the second direction Y, and the second axial electrode 114Y The first axial electrodes 106X are electrically insulated from each other. The first axial electrode 106X and the second axial electrode 114Y are respectively a touch signal driving electrode or a touch signal receiving electrode, which are used for mutually mutual capacitive touch detection, but are not limited thereto. . The first axial electrode 106X may include a plurality of first sub-electrodes X1 and at least one first connection line X2 is disposed between two adjacent first sub-electrodes X1, and the first connection line X2 is electrically connected to two adjacent ones. The first sub-electrode X1. The second axial electrode 114Y may include a plurality of second sub-electrodes Y1 and at least one second connecting line Y2 disposed between two adjacent second sub-electrodes Y1, and the second connecting line Y2 is electrically connected to two adjacent ones. The second sub-electrode Y1. In the vertical projection direction Z, the overlap of the first axial electrode 106X and the second axial electrode 114Y is only in the first The intersection of a connecting line X2 and the second connecting line Y2. Therefore, in FIG. 16, the overlapping area of the first axial electrode 106X and the second axial electrode 114Y in the vertical projection direction Z is small, even if the thickness of the insulating layer 116 is not very thick, the first axial electrode 106X and the second axis The coupling capacitance between the two electrodes 121Y is not large, and still has a good sensing effect.

Please refer to FIG. 17, which is the first embodiment of the touch display device and the touch panel of the present invention. A schematic cross-sectional view of an eight embodiment. The main difference between the present embodiment and the first embodiment is that the touch panel 100 further includes a second conductive layer 114 disposed on the surface of the first substrate 104 facing the cover plate 102, because the first substrate 104 is disposed on the first conductive layer. Between the 106 and the second conductive layer 114, the second conductive layer 114 and the first conductive layer 106 are insulated from each other. The touch elements included in the first conductive layer 106 and the second conductive layer 114 may include a first axial electrode and a second axial electrode respectively as the touch signal driving electrodes, as shown in FIG. 15 or FIG. Mutual capacitive touch detection with the touch signal receiving electrode, but not limited to this. It is to be noted that since the first substrate 104 can use a flexible substrate having a thickness ranging from 0.25 micrometers to 40 micrometers or less than 25 micrometers as described in the foregoing embodiments, and in order to avoid the thickness of the first substrate 104 being too thin, There is a large coupling capacitance between the conductive layer 106 and the second conductive layer 114. Therefore, the patterns of the first axial electrode and the second axial electrode included in the first conductive layer 106 and the second conductive layer 114 are preferably As shown in FIG. 16, the overlap between the two in the vertical projection direction Z is only at the intersection of the first connecting line and the second connecting line to reduce the vertical projected area of the first conductive layer 106 and the second conductive layer 114. However, not limited thereto, any mutual capacitance electrode pattern and design capable of making the first conductive layer 106 and the second conductive layer 114 have a small overlapping area can be applied to the embodiment.

Please refer to FIG. 18 , which is the first embodiment of the touch display device and the touch panel of the present invention. A schematic cross-sectional view of a nine embodiment. The main difference between the present embodiment and the previous embodiment is that the touch panel 100 further includes a buffer layer 130 disposed between the first substrate 104 and the first conductive layer 106. The buffer layer 130 is disposed to increase the first conductive layer. 106 and the second conductive layer 114 in the vertical projection direction Z The shortest distance to reduce the coupling capacitance between the two. Furthermore, the arrangement of the buffer layer 130 can also achieve the effect of increasing the adhesion of the first conductive layer 106 as described in the thirteenth diagram. In a variant embodiment, the touch panel 100 can also include another buffer layer (not shown) disposed between the second conductive layer 114 and the first substrate 104 to enhance the adhesion of the second conductive layer 114. The coupling capacitance between the first conductive layer 106 and the second conductive layer 114 can also be adjusted by using the total thickness of the other buffer layer, the first substrate 104 and the buffer layer 130. Of course, in another variation, the buffer layer 130 of the touch panel 100 may be disposed between the first substrate 104 and the second conductive layer 114, and is not disposed between the first substrate 104 and the first conductive layer 106. The buffer layer.

Please refer to FIG. 19, which is the first embodiment of the touch display device and the touch panel of the present invention. A schematic cross-sectional view of a ten embodiment. The main difference between this embodiment and the eighth embodiment shown in FIG. 17 is that the second conductive layer 114 is disposed on the surface of the cover plate 102 facing the first substrate 104, and the second conductive layer 114 can partially cover the decoration. Layer 108 surface. In addition, although the protective layer 112 and the shielding layer 208 shown in FIG. 18 are not illustrated in the figure, in the modified embodiment, the touch panel 100 may further include the protective layer 112 disposed on the first conductive layer 106. Between the adhesive layer 206 and the adhesive layer 206, a shielding layer 208 may also be selectively disposed on the lower side of the first conductive layer 106. The design of this embodiment can increase the distance between the first conductive layer 106 and the second conductive layer 114 to reduce the coupling capacitance between the two.

Please refer to FIG. 20 , which is a diagram of a touch display device and a touch panel according to the present invention. A schematic cross-sectional view of an eleventh embodiment. The difference between this embodiment and the previous embodiment is that the first conductive layer 106 is disposed on a side surface of the first substrate 104 facing the cover plate 102. In a preferred embodiment, the smaller the overlapping area of the touch electrodes of the first conductive layer 106 and the second conductive layer 114 in the vertical projection direction Z, the better. As shown in Figure 16, but not limited to this.

Please refer to FIG. 21 , which is the first embodiment of the touch display device and the touch panel of the present invention. A schematic cross-sectional view of a twelve embodiment. The touch panel 100 of the present embodiment further includes a second substrate 132 disposed between the first substrate 104 and the cover plate 102, and the second conductive layer 114 is disposed on the surface of the second substrate 132. For example, on the surface of the second substrate 132 facing the cover plate 102, but not limited thereto, in different embodiments, the second conductive layer 114 may be disposed on the surface of the second substrate 132 facing the first substrate 104. . The second substrate 132 and the first substrate 104 can be adhered and fixed by the adhesive layer 136, and the first conductive layer 106 of the embodiment is disposed on the surface of the first substrate 104 facing the second substrate 132. The pattern of the touch electrodes or the touch elements included in the first conductive layer 106 and the second conductive layer 114 may be any one of the foregoing mutual capacitive touch electrodes, and is not limited to the foregoing. The material of the second substrate 132 may be a stiff substrate or a flexible substrate. The stiff substrate is exemplified as a transfer substrate in the process, such as a PET substrate or a polycarbonate (PC) substrate, but not The flexible substrate is, for example, the foregoing material related to the first substrate 104, and the material of the second substrate 132 may be the same or different from the first substrate 104. When the material of the second substrate 132 is the same as that of the first substrate 104, the advantage is that the thickness is thin and the heat resistance is high, so the thickness of the second substrate 132 may range from about 0.5 micrometers to about 25 micrometers or less, and the second The conductive layer 114 can have good quality and low impedance, such as an impedance of less than 150 ohms or less, such as less than 30, 15 or 10 ohms, which improves touch sensitivity and is designed in large-sized panels. Compared with the conventional touch panel manufactured by the heat-resistant substrate, the second conductive layer 114 has the advantage of low impedance, so that the touch panel 100 of the present invention has a more remarkable touch detection effect. However, in a preferred embodiment, the thickness of the first substrate 104 is preferably greater than the thickness of the second substrate 132, such as at least greater than 15 microns, preferably 20 microns to 25 microns, to avoid the overall thickness of the touch panel 100. It is thin and easily damaged during the process, and thus provides a function of protecting the touch panel 100. Alternatively, if the thickness of the first substrate 104 is less than 15 micrometers, a protective substrate may be disposed on the outer side (the lower side in the figure) of the first substrate 104, which may be an additional attached substrate or an original first substrate. 104 is a non-detached substrate, and a grounding electrode, such as the aforementioned shielding layer, can also be selectively disposed on the protective substrate. On the other hand, if the second substrate 132 is a transfer substrate or a stiff substrate, the advantage is that the overall thickness of the touch panel 100 is prevented from being too thin to reduce the difficulty of the process. Under this design, even if the aforementioned stiff material PET and PC materials are less resistant to high temperatures, Because the second conductive layer 114 including the touch signal receiving electrode does not necessarily need to have a very low impedance, for example, it may have a chip resistance of 100 or 120 ohms or more to avoid the impedance of the touch receiving electrode being too low. The noise is disturbed, so that the second conductive layer 114 meeting the above requirements can be fabricated in a relatively low temperature process. When the second substrate 132 is a stiff substrate, its thickness is exemplified by more than about 25 microns.

22 and 23 are schematic diagrams of a process for fabricating a touch panel according to the present invention. It depicts the flow of the touch panel 100 of the twelfth embodiment of the present invention. This process is exemplified by making a small-sized touch panel, and the second substrate 132 is exemplified by a stiff substrate, but is not intended to limit the application size and process of the touch panel of the present invention. First, please refer to FIG. 22, in which a large-size carrier 210 is provided in step A, for example, transparent glass, and then a frame-shaped adhesive layer 212, such as an adhesive-promoting adhesive (AP adhesive), is applied on the surface of the carrier 210, and then As shown in step B, a PI material is applied in a frame-shaped region surrounded by the adhesive layer 212, followed by solid baking to form a cured large-size soft substrate 134. It should be noted that in other embodiments, the entire surface of the carrier 210 may be formed on the surface of the carrier 210, and then the flexible substrate 134 may be formed on the entire surface of the adhesive. Then, in step C, the touch device process is performed. For example, a plurality of parallel parallel first conductive layers 106 are formed on the flexible substrate 134, which may include the touch signal driving electrodes as described above, but not limited thereto. . Six first conductive layers 106 are shown in step C, that is, the first substrate 104 is cut into six pieces by the flexible substrate 134 of a large size to fabricate six touch panels 100 of the present invention.

On the other hand, steps D to F depict the second substrate 132 in FIG. 21 Process. In step D, a large-sized stiff substrate 142 is provided, which is then used to cut into a plurality of second substrates 132. The process is based on the second substrate 132 being a PET substrate, but is not intended to limit the process of the present invention. With a touch panel. A plurality of second conductive layers 114 are formed on the stiff substrate 142, which may include the aforementioned touch signal receiving electrodes. An adhesive layer 136 is also provided, exemplified by an optical film layer. As shown in step E, the adhesive layer 136 is bonded to the underside of the stiff substrate 142. Then at the steps A laser or punch process is performed in F to form the bonding holes 138 in the second conductive layer 114, the stiff substrate 142, and the adhesive layer 136. Next, in step G, the stiff substrate 142 of the step F and the soft substrate 134 of the step C are bonded and fixed by the adhesive layer 136 to obtain the combined touch element intermediate product 140.

Next, please refer to Figure 23, in step H, providing an adhesive layer 110, which can be The laser processing process forms a plurality of bonding holes 148, and then the adhesive layer 110 is attached to the touch component intermediate product 140 fabricated in step G. The touch component intermediate product 140 includes six panel units 152, wherein the bonding holes 148 are respectively Corresponding to one side of the surrounding area of one panel unit 152. Then, in step I, a punching or cutting process is performed to cut out each panel unit 152, including the first substrate 104 and the second substrate 132, and the first conductive layer 106 and the second conductive layer 114 thereon, the first conductive layer 106. The first conductive element 144 and the second joint element 146 may be included with the second conductive layer 114, respectively. The engagement holes 148 of the original adhesive layer 110 expose the first engagement element 144 and the second engagement element 146 after cutting. Further, in the cutting process, the carrier 210 is separated from the first substrate 104. The bonding process of the connection board 128 is then performed in step J to electrically connect the connection board 128 with the first bonding element 144 and the second bonding element 146, respectively. It should be noted that if the soft substrate 134 in the step A and the step B is formed on the entire surface rubber, the carrier 210 can be separated from the panel unit 152 after the step J by the release process. Then, the cover panel 102 is provided in the step K, and the panel unit 152 is adhered to the lower side of the cover panel 102 by the adhesive layer 110, that is, the touch panel 100 of the present invention is completed, as shown in step L. It should be noted that in the modified embodiment, the cutting or punching process of step I may not cut the carrier 210, and the carrier 210 is separated from the panel unit 152 after the bonding process of connecting the circuit board 128 is performed. In addition, the present invention is not limited to the above process, for example, the first substrate 104 and the second substrate 132 may be separately fabricated and/or separately attached. Furthermore, the adhesive layers 136, 110 in the step D and the step H may not be a large piece size but a plurality of small piece sizes, that is, have a small size of the panel unit 152.

Please refer to FIG. 24 and FIG. 25, FIG. 24 and FIG. 25 for making touch according to the present invention. A process schematic diagram of another embodiment of the panel method, which also illustrates the flow of the touch panel 100 of the twelfth embodiment of the present invention, and the embodiment is only different from the 22nd to 23rd drawings. Description. First, referring to Fig. 24, a large-size carrier 210 is provided in step A', and a full-surface adhesive layer 212' is formed on the surface of the carrier 210, and then formed on the surface of the adhesive layer 212' as shown in step B'. A large piece of soft substrate 134. Next, step C' is performed to perform a touch element process. On the other hand, the process from step D to step F can be similar to that in FIG. 22 and will not be described again. In the step G', the stiff substrate 142 of the step F and the flexible substrate 134 of the step C' are bonded and fixed by the adhesive layer 136 to obtain the combined touch element intermediate product 140.

Referring to Figure 25, the main difference between this embodiment and the previous embodiment is at step G'. After the stiffening substrate 142 and the flexible substrate 134 are bonded, the adhesive layer is not provided on the surface of the touch element intermediate product 140 first, and therefore the step H in FIG. 23 is omitted. Next, step I' is directly performed, and a punching or cutting process is performed to cut out each panel unit 152. The panel unit 152 includes a first substrate 104 and a second substrate 132 and a first conductive layer 106, a second conductive layer 114, and an adhesive layer 136 disposed on a surface thereof, or any insulating layer and protective layer that may exist (omitted not shown in In the steps I' and J'), the first conductive layer 106 and the second conductive layer 114 may include a first bonding element 144 and a second bonding element 146, respectively. Since the first substrate 104 is fixed to the surface of the carrier 210 by the entire adhesive layer 212', the carrier 210 is not separated from the first substrate 104 during the cutting process. Next, a bonding process for connecting the circuit boards 128 is performed in step J' to electrically connect the connection circuit board 128 to the first bonding element 144 and the second bonding element 146, respectively. Then, the release process shown in step M is performed to separate the panel unit 152 from the adhesive layer 212' and the carrier 210. Then, the adhesive layer 110' and the cover sheet 102 are provided in the step K', and the panel unit 152 is adhered to the lower side of the cover sheet 102 by the adhesive layer 110', that is, the touch panel 100 of the present invention is completed, as shown in step L. It should be noted that, in a variant embodiment, the cutting or punching process of step I' may not cut the carrier 210, but first perform the bonding process of connecting the circuit board 128 and then directly perform the release process to make the carrier 210 And panel unit 152 Separation.

Please refer to FIG. 26 and FIG. 27 , FIG. 26 is a touch display device and a touch surface according to the present invention. FIG. 27 is a cross-sectional view showing a fourteenth embodiment of the touch display device and the touch panel of the present invention. Compared with the twelfth embodiment of the touch panel of the present invention, the first conductive layer 104 of the thirteenth embodiment is disposed on the lower side of the first substrate 104. With this configuration, the second substrate 132 and the first substrate 104 can be bonded together first, and then joined by the branching type connection board 128, and then attached to the cover sheet 102. In addition, in the fourteenth embodiment of FIG. 27, the second conductive layer 114 is disposed on the surface of the second substrate 132 facing the first substrate 104, and may be formed for the first conductive layer 106 and the second conductive layer. 114, the bonding process is performed individually, and then the attaching process is performed, and finally the upper and lower connecting circuit boards 128 are bonded together.

Compared with the prior art, the touch panel and the touch display device of the present invention utilize high resistance A flexible substrate having a thickness of less than 40 μm or even 25 μm is used to fabricate the touch element, thereby reducing the overall thickness of the touch panel, and a low-impedance conductive layer can be formed on the surface of the flexible substrate by a high-temperature process, in particular, a touch is produced. The signal-driven electrode can improve the touch detection sensitivity and effectively block the noise interference of the display panel. In some designs of mutual capacitance or self-capacitive touch electrodes, when the transparent wires are distributed in the light-transmitting region, the transparent wires fabricated through the high-temperature process described above can also have better electrical performance. In addition, when the flexible substrate is applied to a medium-sized and large-sized touch panel and a touch display device, the touch component fabricated by the low-resistance conductive layer can effectively improve the overall touch effect of the touch panel.

The above description is only a preferred embodiment of the present invention, and the scope of the patent application according to the present invention is Equal variations and modifications are intended to be within the scope of the present invention.

100‧‧‧ touch panel

102‧‧‧ Covering board

104‧‧‧First substrate

106‧‧‧First conductive layer

108‧‧‧Decorative layer

110, 136, 206‧‧‧ adhesive layer

114‧‧‧Second conductive layer

132‧‧‧second substrate

200‧‧‧ display panel

300‧‧‧Touch display device

Z‧‧‧Vertical projection direction

Claims (43)

A touch panel includes: a cover plate; a first substrate disposed on one side of the cover plate, the first substrate is a soft substrate, and the first substrate has a thickness ranging from about 0.5 micrometers to about 40 And a first conductive layer disposed on the surface of the first substrate, and the sheet resistance of the first conductive layer is less than or equal to about 150 ohms. The touch panel of claim 1, wherein the first substrate has a thickness ranging from about 0.5 micrometers to about 25 micrometers. The touch panel of claim 1, wherein the material of the first substrate comprises polyimide (PI). The touch panel of claim 3, wherein the material of the first substrate further comprises an inorganic material, but in the material of the first substrate, the content percentage of the inorganic material is less than the percentage of PI in the first substrate material . The touch panel of claim 1, wherein the first substrate is a heat resistant substrate having a heat resistant temperature of from about 200 ° C to about 350 ° C. The touch panel of claim 1, wherein the first conductive layer has a sheet resistance of about 50 ohms or less. The touch panel of claim 1, wherein the first conductive layer has a sheet resistance of about 15 ohms or less. The touch panel of claim 1, further comprising: a second substrate disposed between the first substrate and the cover plate; and a second conductive layer disposed on a surface of the second substrate. The touch panel of claim 8, wherein a sheet resistance of the second conductive layer is greater than or equal to about 100 ohms, and a thickness of the second substrate is greater than about 25 micrometers. The touch panel of claim 8, wherein the second conductive layer has a sheet resistance of about 150 ohms or less, and the second substrate has a thickness ranging from about 0.5 micrometers to about 25 micrometers. The touch panel of claim 8, wherein the second conductive layer comprises at least one touch signal receiving electrode, and the first conductive layer comprises at least one touch signal driving electrode. The touch panel of claim 8, wherein the second conductive layer is disposed on a surface of the second substrate facing the cover plate. The touch panel of claim 8, wherein the second conductive layer is disposed on a surface of the second substrate opposite to the cover plate. The touch panel of claim 8, further comprising an adhesive layer disposed between the first substrate and the second substrate. The touch panel of claim 14, wherein the adhesive layer has a thickness of about 20 μm or less. The touch panel of claim 1, further comprising a second conductive layer disposed on a surface of the first substrate facing the cover plate, wherein the first conductive layer is disposed on the first substrate opposite to the cover One of the plates surface. The touch panel of claim 16, further comprising a buffer layer disposed between the first conductive layer and the first substrate. The touch panel of claim 1, further comprising a second conductive layer disposed on the surface of the cover plate facing the first substrate, wherein the first conductive layer is disposed on the first substrate opposite to the cover One of the surfaces of the board. The touch panel of claim 1, further comprising a second conductive layer disposed on the surface of the cover plate facing the first substrate, wherein the first conductive layer is disposed on the first substrate facing the cover One of the surfaces of the board. The touch panel of any one of claims 18, 18 and 19, wherein the first conductive layer comprises a plurality of first axial electrodes extending along a first direction, and the second conductive layer comprises a plurality The second axial electrode extends along a second direction, and the first direction is not parallel to the second direction. The touch panel of claim 20, wherein each of the first axial electrodes comprises a plurality of first sub-electrodes, and at least one first connecting line is disposed between the two adjacent first sub-electrodes, the first a connecting line electrically connecting the two adjacent first sub-electrodes, each of the second axial electrodes comprising a plurality of second sub-electrodes and at least one second connecting line disposed on the two adjacent second sub-electrodes The second connecting line is electrically connected to the two adjacent second sub-electrodes. In a vertical projection direction, the overlapping of the first axial electrodes and the second axial electrodes is only in the Waiting at the intersection of the first connecting line and the second connecting lines. The touch panel of claim 1, further comprising a buffer layer disposed between the first conductive layer and the first substrate, wherein the buffer layer comprises at least an inorganic material. The touch panel of claim 22, wherein the buffer layer has a thickness smaller than a thickness of the first conductive layer. The touch panel of claim 23, further comprising a protective layer disposed on a side of the first conductive layer opposite to the first substrate. The touch panel of claim 24, wherein the first conductive layer is disposed on a side of the first substrate facing the cover plate, and the refractive indices of the protective layer and the buffer layer are respectively smaller than the first conductive The refractive index of the layer. The touch panel of claim 1, wherein the first conductive layer is disposed on a side of the first substrate opposite to the cover plate. The touch panel of claim 26, further comprising a protective layer disposed on a side of the first conductive layer opposite to the first substrate. The touch panel of claim 1, wherein the first conductive layer is disposed on a side of the first substrate facing the cover plate. The touch panel of claim 28, wherein the first conductive layer comprises: a plurality of first axial electrodes extending along a first direction, each of the first axial electrodes comprising a plurality of first sub-electrodes And the at least one first connecting line is disposed between the two adjacent first sub-electrodes, the first connecting line electrically connecting the two adjacent first sub-electrodes; and the plurality of second axial electrodes, Extending along a second direction, each of the second axial electrodes includes a plurality of second sub-electrodes and at least one second connecting line is disposed between the two adjacent second sub-electrodes, the second connecting line Electrically connecting the two adjacent second sub-electrodes; The second axial electrodes are electrically insulated from the first axial electrodes, and the first direction is not parallel to the second direction. In a vertical projection direction, the first axial electrodes and the first axial electrodes The overlap of the second axial electrodes is only at the intersection of the first connecting lines and the second connecting lines, and between the first connecting lines at the intersections and the second connecting lines There are insulating blocks. The touch panel of claim 28, wherein the first conductive layer comprises a plurality of touch electrodes electrically insulated from each other. A touch display device comprising: one touch panel as claimed in claim 1; a display panel disposed on one side of the touch panel; and an adhesive layer disposed on the display panel and the touch panel Between the touch panel and the display panel. A method of manufacturing a touch panel, comprising: providing a carrier; forming a soft substrate on the carrier, and having a thickness ranging from about 0.5 micrometers to about 40 micrometers, the flexible substrate defining at least one first substrate Forming at least one first conductive layer on the surface of the flexible substrate, the first conductive layer is correspondingly disposed on the first substrate, the sheet resistance of the first conductive layer is less than or equal to about 150 ohms, and the first conductive layer comprises a plurality of electrodes; separating the first substrate from the carrier; and providing a cover plate to fix the first substrate to one side of the cover plate. The method of fabricating a touch panel of claim 32, wherein the first substrate has a thickness ranging from about 0.5 micrometers to about 25 micrometers. The method of fabricating a touch panel of claim 32, wherein the material of the flexible substrate comprises PI. The method of manufacturing a touch panel according to claim 34, wherein the material of the flexible substrate further comprises an inorganic material, but in the material of the soft substrate, the content of the inorganic material is less than PI in the soft substrate material. The percentage in . The method of producing a touch panel according to claim 32, wherein the flexible substrate is a heat resistant substrate having a heat resistant temperature of from about 200 ° C to about 350 ° C. The method for manufacturing a touch panel according to claim 32, further comprising performing a release process to disengage the first substrate from the carrier before fixing the first substrate to one side of the cover plate. . The method of manufacturing a touch panel according to claim 32, further comprising forming an adhesive layer on the surface of the carrier, and forming the flexible substrate on the adhesive layer and one side of the carrier. The method of fabricating a touch panel of claim 38, further comprising: after forming the first conductive layer, performing a cutting process on the flexible substrate and the carrier to cut the flexible substrate into at least one A panel unit having the size of the first substrate. The method of manufacturing a touch panel according to claim 39, wherein the adhesive layer has a frame-shaped pattern, and the flexible substrate is formed in a region surrounded by the frame-shaped pattern, and the first is after the cutting process The substrate is separated from the carrier. The method of fabricating a touch panel of claim 32, further comprising: providing a second substrate before providing the cover plate; forming at least one second conductive layer on the surface of the second substrate, and the second The conductive layer includes a plurality of electricity And fixing the second substrate between the first substrate and the cover plate by an adhesive layer. The method of fabricating a touch panel according to claim 41, wherein a sheet resistance of the second conductive layer is greater than or equal to about 100 ohms, and a thickness of the second substrate is greater than about 25 micrometers. The method of fabricating a touch panel according to claim 41, further comprising: performing a bonding process to bond a circuit board to the bonding component of the first conductive layer and the second conductive layer before providing the cover plate .