CN208240683U - Electronic equipment - Google Patents
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- CN208240683U CN208240683U CN201820921132.1U CN201820921132U CN208240683U CN 208240683 U CN208240683 U CN 208240683U CN 201820921132 U CN201820921132 U CN 201820921132U CN 208240683 U CN208240683 U CN 208240683U
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- electronic equipment
- sensor element
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- flexible part
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Abstract
The disclosure is directed to a kind of electronic equipment.Including display panel, display panel includes the display main body and substrate for stacking setting, and substrate includes the main part being correspondingly arranged with display main body and the carrier portion for protruding from display body rim；Flexible circuit board, flexible circuit board include the second flexible part for being connected to first flexible part in carrier portion and bending and extend to form towards main part along the edge in carrier portion；Sensor element, sensor element are connected to the surface on main part towards the second flexible part；Wherein, the second flexible part includes opening, and opening is located at the region that the second flexible part corresponds to main part, and sensor element can be stretched out from opening.The disclosure on the thickness direction of electronic equipment the projection of sensor element is overlapped with the projection of flexible circuit board, can be laid on substrate to avoid flexible circuit board and sensor element, be conducive to the arrangement compactedness of electronic equipment internal electronic component.
Description
Technical field
This disclosure relates to field of terminal technology more particularly to a kind of electronic equipment.
Background technique
Currently, screen accounting is improved by reducing the border width of electronic equipment, increase electronic equipment aesthetic appearance has become
Driving chip can be fixed by COG (chip on glass) technology in the related art for the development trend in industry
On the glass substrate of screen mould group；Alternatively, core can also will be driven by COF (Chip On Film, flip chip) technology
Piece is fixed on the flexible substrate for being attached at screen mould group.
Utility model content
The disclosure provides a kind of electronic equipment, to solve deficiency in the related technology.
In accordance with an embodiment of the present disclosure, a kind of electronic equipment is provided characterized by comprising
Display panel, the display panel include stack setting display main body and substrate, the substrate include with it is described
The main part and protrude from the carrier portion for showing body rim that display main body is correspondingly arranged；
Flexible circuit board, the flexible circuit board include being connected to first flexible part in the carrier portion and along the load
The second flexible part that the edge in body portion bends and extends to form towards the main part；
Sensor element, the sensor element are connected on the main part towards the surface of second flexible part；
Wherein, second flexible part includes opening, and the opening is located at second flexible part and corresponds to the main body
The region in portion, and the sensor element can be stretched out from the opening.
It optionally, further include battery, on the thickness direction of the electronic equipment, the projection of the battery and the sensing
The projection of device element separates.
Optionally, further include function element, on the thickness direction of the electronic equipment, the projection of the function element with
The projection of the battery separates, and there is at least part with the projection of second flexible part and/or the sensor element
Overlapping.
Optionally, the function element includes at least one following:
Microphone device, motor, charging module.
Optionally, the sensor element includes fingerprint mould group, and the fingerprint mould group is adhered to direction on the main part
The surface of second flexible part.
Optionally, the fingerprint mould group includes optical finger print mould group.
Optionally, the opening is adapted to the fingerprint mould group.
Optionally, the opening is recessed inwardly by the edge of second flexible part forms.
Optionally, the opening is located in the middle part of the region for corresponding to main part setting on second flexible part.
Optionally, the display panel further includes chip assembly, and the chip assembly is adhered to second flexible part.
The technical scheme provided by this disclosed embodiment can include the following benefits:
As can be seen from the above embodiments, the disclosure on the thickness direction of electronic equipment the projection of sensor element with it is soft
Property wiring board projection be overlapped, can be laid on substrate to avoid flexible circuit board and sensor element, be conducive to electronic equipment
The arrangement compactedness of internal electronic element.
It should be understood that above general description and following detailed description be only it is exemplary and explanatory, not
The disclosure can be limited.
Detailed description of the invention
The drawings herein are incorporated into the specification and forms part of this specification, and shows the implementation for meeting the disclosure
Example, and together with specification for explaining the principles of this disclosure.
Fig. 1 is the structural schematic diagram of a kind of electronic equipment shown according to an exemplary embodiment.
Fig. 2 is the schematic partial cross-sectional view that a kind of electronic equipment is shown according to an exemplary embodiment.
Fig. 3 is the schematic cross-section of a kind of electronic equipment shown according to an exemplary embodiment.
Fig. 4 is a kind of structural schematic diagram of second flexible part shown according to an exemplary embodiment.
Fig. 5 is the structural schematic diagram of another two flexible part shown according to an exemplary embodiment.
Specific embodiment
Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to
When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment
Described in embodiment do not represent all embodiments consistent with the application.On the contrary, they be only with it is such as appended
The example of the consistent device and method of some aspects be described in detail in claims, the application.
It is only to be not intended to be limiting the application merely for for the purpose of describing particular embodiments in term used in this application.
It is also intended in the application and the "an" of singular used in the attached claims, " described " and "the" including majority
Form, unless the context clearly indicates other meaning.It is also understood that term "and/or" used herein refers to and wraps
It may be combined containing one or more associated any or all of project listed.
It will be appreciated that though various information, but this may be described using term first, second, third, etc. in the application
A little information should not necessarily be limited by these terms.These terms are only used to for same type of information being distinguished from each other out.For example, not departing from
In the case where the application range, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as
One information.Depending on context, word as used in this " if " can be construed to " ... when " or " when ...
When " or " in response to determination ".
It is according to an example that Fig. 1, which is the structural schematic diagram of a kind of electronic equipment shown according to an exemplary embodiment, Fig. 2,
Property implement exemplify the schematic partial cross-sectional view of a kind of electronic equipment.As shown in Figure 1 and Figure 2, electronic equipment 100 may include showing
Show panel 1, which may include the substrate 12 for stacking the display main body 11 of setting and connecting with display main body 11,
The substrate 12 may include the main part 121 being correspondingly arranged with display main body 11 and the carrier portion for protruding from display 11 edge of main body
122.Wherein, which may include OLED screen curtain, correspondingly, display main body 11 may include coating of organic material, base
Plate 12 can be glass substrate, and the carrier portion 122 of substrate 12 slightly protrudes from the edge of display main body 11, as shown in Fig. 2, the load
Body portion 122 can be used for connecting flexible circuit board 2, to form " chin " region of electronic equipment 100.
Specifically, flexible circuit board 2 may include being connected to first flexible part 21 in carrier portion 122 and along carrier portion
The second flexible part 22 that 122 edge bends and extends to form towards main part 121.Wherein, display panel 1 can also include core
Piece component 13, the chip assembly 13 collect the internal wiring of display panel 1, and can be adhered to second soft for the chip assembly 13
Property portion 22, relative to by chip assembly 13 be set in carrier portion 122 towards display 11 surface based fashion of main body, be conducive to reduce electricity
" chin " width of sub- equipment 100 promotes aesthetics.For example, COF can be passed through between chip assembly 13 and flexible circuit board 2
Encapsulation technology is packaged.
The electronic equipment 100 can also include sensor element 4, which is connected to direction on main part 121
The surface of second flexible part 22, second flexible part 22 may include opening 221, which is located on the second flexible part 22
Corresponding to the region of main part 121, sensor element 4 is stretched out from opening 221, thus in the thickness of electronic equipment 100
It spends on direction, the projection of sensor element 4 is overlapped with the projection of flexible circuit board 2, can be to avoid flexible circuit board 2 and sensor
Element 4 is laid on substrate 12, is conducive to the arrangement compactedness of 100 internal electronic element of electronic equipment.
In the present embodiment, as shown in figure 3, electronic equipment 100 can also include battery 5, also, in electronic equipment 100
Thickness direction on, the projection of battery 5 is separated with the projection of sensor element 4, so as to avoid sensor element 4 from influencing electricity
The capacity in pond 5.Specifically, as shown in figure 3, battery 5 be substantially corresponding to substrate 12 121 part of main part be arranged, if
On the thickness direction of electronic equipment 100, if the projection of battery 5 is overlapped with the projection of sensor element 4, it is believed that sensor
Element 4 is directed towards battery 5, then, when sensor element 4 is thicker, battery 5 may need to avoid sensor element 4, thus
It may need to reduce thickness, so that the capacity of battery 5 reduces.And due to the projection of battery 5 and sensor element 4 in the disclosure
Projection separation is conducive to the capacity for promoting battery 5 so that battery 5 is not necessarily to be avoided for sensor element 4.
In above-mentioned each embodiment, still with shown in Fig. 3, electronic equipment 100 can also include function element 6, in electronics
On the thickness direction of equipment 100, the projection of function element 6 is separated with the projection of battery 5, and the projection of the function element 6 with
There is at least part and be overlapped in the projection of sensor element 4.Specifically, still with shown in Fig. 3, the function element 6 and sensor
Element 4 can be the thickness direction setting along electronic equipment 100, further strengthen the compactedness of 100 internal structure of electronic equipment.
In the present embodiment, which may include at least one of microphone device, motor and charging module.
The microphone device may include loudspeaker.In some other embodiment, on the thickness direction of electronic equipment 100, Functional Unit
The projection of part 6 be also possible to the projection of the second flexible part 122 in the presence of at least part is overlapped, or with the second flexible part
There is the part that projection is overlapped between 122 and sensor element 4, the disclosure is limited not to this.
Technical solution based on the disclosure, sensor element 4 may include fingerprint mould group, which is adhered to main body
Toward the surface of the second flexible part 22 in portion 121, and it is pierced by from opening 221.Wherein, going back fingerprint mould group may include that optics refers to
Line mould group can be conducive to improve screen accounting to avoid the display area for occupying electronic equipment 100.
In one embodiment, as shown in figure 4, opening 221 can be to be recessed inwardly by the edge of the second flexible part 22 and be formed.
In other words, which can be formed at the fringe region of the second flexible part 22.In another embodiment, as shown in figure 5,
The opening 221 can be the middle part for corresponding to the region that main part 121 is arranged on the second flexible part 22, and the opening 221
Specification can be adapted to the specification of fingerprint mould group.
In the above-described embodiments, which may include mobile phone, tablet computer, electronic reader etc., the disclosure
It is limited not to this.
Those skilled in the art will readily occur to its of the disclosure after considering specification and practicing disclosure disclosed herein
Its embodiment.This application is intended to cover any variations, uses, or adaptations of the disclosure, these modifications, purposes or
Person's adaptive change follows the general principles of this disclosure and including the undocumented common knowledge in the art of the disclosure
Or conventional techniques.The description and examples are only to be considered as illustrative, and the true scope and spirit of the disclosure are by following
Claim is pointed out.
It should be understood that the present disclosure is not limited to the precise structures that have been described above and shown in the drawings, and
And various modifications and changes may be made without departing from the scope thereof.The scope of the present disclosure is only limited by the accompanying claims.
Claims (10)
1. a kind of electronic equipment characterized by comprising
Display panel, the display panel includes the display main body for stacking setting and substrate, the substrate include and the display
The main part and protrude from the carrier portion for showing body rim that main body is correspondingly arranged；
Flexible circuit board, the flexible circuit board include being connected to first flexible part in the carrier portion and along the carrier portion
Edge bend and the second flexible part for being extended to form towards the main part；
Sensor element, the sensor element are connected on the main part towards the surface of second flexible part；
Wherein, second flexible part includes opening, and the opening, which is located on second flexible part, corresponds to the main part
Region, and the sensor element can be stretched out from the opening.
2. electronic equipment according to claim 1, which is characterized in that further include battery, in the thickness of the electronic equipment
On direction, the projection of the battery is separated with the projection of the sensor element.
3. electronic equipment according to claim 2, which is characterized in that further include function element, in the electronic equipment
On thickness direction, the projection of the function element is separated with the projection of the battery, and with second flexible part and/or described
There is at least part and be overlapped in the projection of sensor element.
4. electronic equipment according to claim 3, which is characterized in that the function element includes at least one following:
Microphone device, motor, charging module.
5. electronic equipment according to claim 1, which is characterized in that the sensor element includes fingerprint mould group, described
Fingerprint mould group is adhered on the main part towards the surface of second flexible part.
6. electronic equipment according to claim 5, which is characterized in that the fingerprint mould group includes optical finger print mould group.
7. electronic equipment according to claim 5, which is characterized in that the opening is adapted to the fingerprint mould group.
8. electronic equipment according to claim 1, which is characterized in that it is described opening from the edge of second flexible part to
Sunken inside is formed.
9. electronic equipment according to claim 1, which is characterized in that the opening is located at corresponding on second flexible part
In the middle part of the region of main part setting.
10. electronic equipment according to claim 1, which is characterized in that the display panel further includes chip assembly, described
Chip assembly is adhered to second flexible part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820921132.1U CN208240683U (en) | 2018-06-14 | 2018-06-14 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820921132.1U CN208240683U (en) | 2018-06-14 | 2018-06-14 | Electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208240683U true CN208240683U (en) | 2018-12-14 |
Family
ID=64576825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820921132.1U Active CN208240683U (en) | 2018-06-14 | 2018-06-14 | Electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208240683U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111258447A (en) * | 2020-01-02 | 2020-06-09 | 京东方科技集团股份有限公司 | Display module and electronic equipment |
| CN111901455A (en) * | 2019-05-06 | 2020-11-06 | 北京小米移动软件有限公司 | Electronic device |
| WO2023025089A1 (en) * | 2021-08-27 | 2023-03-02 | 维沃移动通信有限公司 | Electronic device |
-
2018
- 2018-06-14 CN CN201820921132.1U patent/CN208240683U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111901455A (en) * | 2019-05-06 | 2020-11-06 | 北京小米移动软件有限公司 | Electronic device |
| CN111258447A (en) * | 2020-01-02 | 2020-06-09 | 京东方科技集团股份有限公司 | Display module and electronic equipment |
| CN111258447B (en) * | 2020-01-02 | 2023-09-01 | 京东方科技集团股份有限公司 | Display module and electronic equipment |
| WO2023025089A1 (en) * | 2021-08-27 | 2023-03-02 | 维沃移动通信有限公司 | Electronic device |
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