CN109492472A - Ultrasonic fingerprint identifies mould group and electronic equipment - Google Patents
Ultrasonic fingerprint identifies mould group and electronic equipment Download PDFInfo
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- CN109492472A CN109492472A CN201710819172.5A CN201710819172A CN109492472A CN 109492472 A CN109492472 A CN 109492472A CN 201710819172 A CN201710819172 A CN 201710819172A CN 109492472 A CN109492472 A CN 109492472A
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- 230000008023 solidification Effects 0.000 description 3
- 239000002033 PVDF binder Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
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- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
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- 238000012360 testing method Methods 0.000 description 2
- 238000002604 ultrasonography Methods 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
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- 238000000151 deposition Methods 0.000 description 1
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- 230000005294 ferromagnetic effect Effects 0.000 description 1
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The present invention relates to a kind of ultrasonic fingerprint identification mould group and electronic equipment, ultrasonic fingerprint identifies that mould group includes ultrasonic sensor and driving chip.The top surface of the ultrasonic sensor is towards contact object, and the ultrasonic sensor can emit ultrasonic wave, and is able to detect the ultrasonic wave of reflection.The driving chip is for controlling the ultrasonic sensor.The ultrasonic fingerprint identification mould group further includes memory, and the memory is electrically connected with the driving chip.The memory has the corresponding control information of different temperatures.The driving chip is used to obtain the real time temperature of the ultrasonic fingerprint identification mould group local environment, and control information corresponding with the real time temperature is obtained from the memory, to control the ultrasonic sensor according to the control information of acquisition.Above-mentioned ultrasonic fingerprint identification mould group can be adapted the working condition of control ultrasonic sensor according to real-time temperature conditions, and the accuracy of fingerprint recognition can be improved.
Description
Technical field
The present invention relates to fingerprint identification technology fields, identify that mould group and electronics are set more particularly to a kind of ultrasonic fingerprint
It is standby.
Background technique
Ultrasonic fingerprint identification technology is the ability for having penetrable material using ultrasonic wave, and is generated greatly with the different of material
Small different echo (when i.e. ultrasonic wave reaches unlike material surface, the ultrasonic energy that is reflected back toward and after distance it is different)
And carry out fingerprint recognition.Therefore, using skin and air for the difference of sound impedance, so that it may distinguish fingerprint ridge and valley institute
Position.Ultrasonic fingerprint identification technology fingerprint can be carried out deeper into analytical sampling, or even the table that can penetrate to the skin
The unique three-dimensional feature of fingerprint is identified under face.Moreover, because ultrasonic wave has certain penetrability, therefore have on a small quantity in finger
Work is remained in the case where dirt or humidity, the equipment such as glass, aluminium, stainless steel, sapphire can be penetrated and identified.Therefore,
Ultrasonic fingerprint identification technology is increasingly valued by people.
However, ultrasonic fingerprint identification technology is in initial stage of development, and the performance of ultrasonic fingerprint identification mould group is straight
The accuracy for influencing fingerprint recognition is connect, therefore how the performance of Optimization for Ultrasonic Wave fingerprint recognition mould group is a problem to be solved.
Summary of the invention
Based on this, it is necessary to how Optimization for Ultrasonic Wave fingerprint recognition mould group performance aiming at the problem that, a kind of ultrasound is provided
Wave fingerprint recognition mould group and electronic equipment.
A kind of ultrasonic fingerprint identification mould group, including ultrasonic sensor and driving chip；The ultrasonic sensor
Top surface is towards contact object, and the ultrasonic sensor can emit ultrasonic wave, and is able to detect the ultrasonic wave of reflection；It is described
Driving chip is for controlling the ultrasonic sensor；Ultrasonic fingerprint identification mould group further includes memory, and described is deposited
Reservoir is electrically connected with the driving chip；
The memory has the corresponding control information of different temperatures；The driving chip refers to for obtaining the ultrasonic wave
Line identifies the real time temperature of mould group local environment, and control letter corresponding with the real time temperature is obtained from the memory
Breath, to control the ultrasonic sensor according to the control information of acquisition.Above-mentioned ultrasonic fingerprint identification mould group being capable of root
It is adapted the working condition of control ultrasonic sensor according to real-time temperature conditions, the accuracy of fingerprint recognition can be improved.
In one of the embodiments, the ultrasonic sensor include thin film transistor (TFT) pel array layer, piezoelectric layer and
Electrode layer；The piezoelectric layer and the electrode layer are successively covered in the thin film transistor (TFT) pel array layer.
The control information is one or more controls corresponding with the piezoelectric layer in one of the embodiments,
Parameter value.In this way, control parameter value is different, the working condition of the piezoelectric layer is then different, makes to find optimum Working
Obtain the efficiency highest of piezoelectric layer transmitting ultrasonic wave.
The ultrasonic fingerprint identification mould group further includes temperature sensor in one of the embodiments,；The temperature passes
Sensor is electrically connected with the driving chip.It, can be fast since temperature sensor is set in ultrasonic fingerprint identification mould group
Speed, the temperature for accurately measuring ultrasonic fingerprint identification mould group local environment.
The temperature sensor is set in the ultrasonic sensor in one of the embodiments,.Due in ultrasonic wave
In fingerprint recognition mould group, ultrasonic sensor is most susceptible to the influence of temperature, therefore temperature sensor is passed set on ultrasonic wave
In sensor, the temperature of ultrasonic sensor ambient enviroment can be directly detected, in order to which driving chip obtains more accurate control
Information processed.
The temperature sensor is located at below the piezoelectric layer in one of the embodiments,；The top of the piezoelectric layer
Towards the contact object.Temperature sensor is set to below piezoelectric layer, it can be to avoid the conducting effect for influencing ultrasonic wave.
The ultrasonic fingerprint identification mould group further includes circuit board in one of the embodiments,；The driving chip and
The memory is mounted on the circuit board.
The ultrasonic fingerprint identification mould group further includes cover board in one of the embodiments,；The cover board is covered in institute
State the top surface of ultrasonic sensor.Cover board shields, so as to improve the reliability of ultrasonic fingerprint identification mould group.
The ultrasonic fingerprint identification mould group further includes for carrying out the matched matching of acoustic resistance in one of the embodiments,
Layer；The matching layer is between the cover board and the ultrasonic sensor.Matching layer in addition to the matched effect of acoustic resistance,
Offset can also be filled, to improve the validity of ultrasonic transmission.
A kind of electronic equipment, which is characterized in that identify mould group including the ultrasonic fingerprint.
In above-mentioned ultrasonic fingerprint identification mould group and electronic equipment, there is the corresponding control letter of different temperatures in memory
Breath, driving chip are used to obtain the real time temperature of ultrasonic fingerprint identification mould group local environment, and obtain from memory with it is real
The corresponding control information of Shi Wendu, to control ultrasonic sensor according to the control information of acquisition.Therefore, above-mentioned ultrasonic fingerprint
It identifies that mould group can be adapted the working condition of control ultrasonic sensor according to real-time temperature conditions, fingerprint can be improved
The accuracy of identification.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
The attached drawing of other embodiments is obtained according to these attached drawings.
Fig. 1 is the structural schematic diagram that the ultrasonic fingerprint that an embodiment provides identifies mould group；
Fig. 2 is the structural schematic diagram that the ultrasonic fingerprint of Fig. 1 illustrated embodiment identifies one of embodiment of mould group；
Fig. 3 is that the ultrasonic fingerprint of Fig. 1 illustrated embodiment identifies circuit block diagram relevant to temperature in mould group.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give presently preferred embodiments of the present invention.But the invention can be realized in many different forms, however it is not limited to this paper institute
The embodiment of description.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more thorough
Comprehensively.
Unless otherwise defined, the skill of all technical and scientific terms used herein and the technical field for belonging to invention
The normally understood meaning of art personnel is identical.It is specific that description is intended merely in the term used in the description of invention herein
The purpose of embodiment, it is not intended that the limitation present invention.Term as used herein "and/or" includes one or more relevant institutes
Any and all combinations of list of items.
One embodiment provides a kind of ultrasonic fingerprint identification mould group, and it is super which identifies that mould group can utilize
The fingerprint of ultra sonic scanner user, and fingerprint is identified, it can be installed in electronic equipment.In present embodiment, please refer to
Fig. 1, Fig. 3, ultrasonic fingerprint identify that mould group includes ultrasonic sensor 110 and driving chip 120.Driving chip 120 and ultrasound
Wave sensor 110 is electrically connected (this connection relationship is not shown in the figure).
Wherein, the top surface of ultrasonic sensor 110 is towards contact object (finger that contact object is, for example, user), and surpasses
Sonic sensor 110 can emit ultrasonic wave, and be able to detect the ultrasonic wave of reflection.Specifically, ultrasonic sensor 110 will be anti-
The ultrasonic wave penetrated is converted to electric signal, and electric signal is sent to driving chip 120.
Driving chip 120 is for controlling ultrasonic sensor 110.Driving chip 120 is, for example, ASIC (Application
Specific Integrated Circuit) chip.Specifically, driving chip 120 controls the mode of ultrasonic sensor 110
Are as follows: driving chip 120 to ultrasonic sensor 110 provide control signal (such as to ultrasonic sensor 110 send high frequency telecommunications
Number), so that ultrasonic sensor 110 emits ultrasonic wave；In addition, driving chip 120 is also received from ultrasonic sensor 110
The electric signal that the ultrasonic wave of reflection is converted to, to be identified to fingerprint.
In present embodiment, ultrasonic fingerprint identifies that mould group further includes memory 130.Memory 130 and driving chip 120
Electrical connection.Memory 130 be, for example, Flash Memory (flash memory), ROM (Read-Only Memory, read-only memory),
EEPROM (Electrically Erasable Programmable Read and-Write Memory, electric erazable programmable
Read-write memory), FRAM (ferromagnetic random access memory, ferroelectric memory) etc..
Wherein, there is the corresponding control information of different temperatures in memory 130.The corresponding control information of different temperatures can be with
Mould group is identified when dispatching from the factory test for ultrasonic fingerprint, the control information obtained after testing in the environment of different temperatures respectively.
The working condition that information is used to control ultrasonic sensor 110 for driving chip 120 is controlled, such as: control information is different, can make
Frequency or the intensity for obtaining the ultrasonic wave that ultrasonic sensor 110 emits are different.Therefore, at a temperature of each, driving chip 120
Ultrasonic sensor 110 is controlled using control information corresponding with the temperature, finally obtained fingerprint recognition effect is best.
Driving chip 120 is used to obtain the real time temperature of ultrasonic wave identification mould group local environment, and obtains from memory 130
Control information corresponding with real time temperature is taken, to control ultrasonic sensor 110 according to the control information of acquisition.Specifically, it drives
Dynamic chip 120 can obtain the real time temperature that ultrasonic fingerprint identifies mould group every set period of time.Wherein, about setting time
The value of section, (i.e. set period of time is the value that can take in the faster situation of variation of ambient temperature frequency lower than given threshold
Lesser value)；In the case where variation of ambient temperature frequency is relatively slow, set period of time can be taken as the value higher than given threshold
(i.e. set period of time is biggish value), in this way, the accuracy of identification temperature can be improved and save power consumption.
Since ultrasonic sensor 110 emits ultrasonic wave usually using piezoelectric material, (piezoelectric material is, for example, PVDF (poly-
Vinylidene) or PVDF polymer piezo material), and piezoelectric material to temperature have biggish dependence (such as piezoelectric constant with
The raising of temperature have increase tendency, and piezoelectric constant directly affects the intensity of ultrasonic signal), therefore, in different environment
At a temperature of, it needs to input ultrasonic sensor 110 adaptable control signal, the transmitting and receive process of ultrasonic wave can be made
Reach optimal effect.In present embodiment, based on the data that memory 130 stores, allow driving chip 120 according to obtaining
The real time temperature taken, to select the control information being adapted with Current Temperatures to control ultrasonic sensor 110, so as to so that
Preferable fingerprint recognition effect can be reached in the environment of various temperature by obtaining ultrasonic fingerprint identification mould group, to improve
The performance of ultrasonic fingerprint identification mould group.
In one of the embodiments, referring to FIG. 2, ultrasonic sensor 110 includes thin film transistor (TFT) pel array layer
111, piezoelectric layer 112 and electrode layer 113.Specifically, electrode layer 113 and thin film transistor (TFT) pel array layer 111 respectively with driving
Chip 120 is electrically connected.Wherein, piezoelectric layer 112 and electrode layer 113 are successively covered in thin film transistor (TFT) pel array layer 111.It needs
Although being noted that in ultrasonic sensor 110 shown in Fig. 2 from top to bottom successively are as follows: electrode layer 113, piezoelectric layer
112, thin film transistor (TFT) pel array layer 111, but the specific composition mode of ultrasonic sensor 110 is not limited to a kind of this feelings
Condition, such as top-down sequence can be with are as follows: piezoelectric layer 112, electrode layer 113, thin film transistor (TFT) pel array layer 111.
Wherein, piezoelectric layer 112 is made of piezoelectric material, can emit and receive ultrasonic wave.Thin film transistor (TFT) pixel battle array
Column layer 111, the route including several thin film transistor (TFT)s according to array manner arrangement and each thin film transistor (TFT) of connection, film crystal
Pipe pel array layer 111 can amplify the operation such as processing to electric signal.Electrode layer 113 is constructed from a material that be electrically conducting.Conduction material
Material for example, silver paste.When conductive material is silver paste, the solidification temperature of silver paste is lower than second threshold.In other words, conductive material is selected
The lower silver paste of solidification temperature, such as (it is the thick film conductor using superfine flake silver powder as conductive phase to selection low-temperature solidified silver paste
Slurry).Due to 112 non-refractory of piezoelectric layer, conductive material selects the lower silver paste of solidification temperature, can reduce high temperature pair
It is influenced caused by piezoelectric layer 112, to improve the reliability of ultrasonic fingerprint identification mould group.
Further, based on the above-mentioned specific structure of ultrasonic sensor 110, above-mentioned control information is and piezoelectric layer 112
One or more corresponding control parameter values.In other words, control parameter value is different, and the working condition of piezoelectric layer 112 is then not
Together, so as to find optimum Working make piezoelectric layer transmitting ultrasonic wave efficiency highest.Wherein, control parameter value is, for example, to press
The resonance frequency of electric layer 112.When control parameter value is resonance frequency, driving chip 120, which is got, is adapted to Current Temperatures
After resonance frequency, then apply frequency high frequency electrical signal identical with the resonance frequency of acquisition, at this moment, piezoelectric layer to electrode layer 113
The efficiency highest of 112 transmitting ultrasonic waves.
It is understood that control parameter value can also be other kinds of parameter value, for example, propagation of ultrasonic wave is fast
Rate, since the propagation rate of ultrasonic wave increases with the raising of temperature, temperature often increases 1 DEG C, ultrasonic wave biography per second in air
The distance broadcast about increases 0.6m, therefore driving chip 120 can be adapted control piezoelectric layer 112 according to the propagation rate of acquisition
Working condition, matched with the propagation rate with ultrasonic wave under current environment.
The working principle of above-mentioned ultrasonic sensor 110 are as follows: driving chip 120 is according to the real time temperature of current environment from depositing
Adaptable control information is obtained in reservoir 130, and corresponding high-frequency electrical is applied to electrode layer 113 according to the control information of acquisition
Signal.After electrode layer 113 has been applied high frequency electrical signal, so that piezoelectric layer 112 emits ultrasonic wave.Ultrasonic wave upwardly propagates directly
To contact object back reflection is reached, at this point, piezoelectric layer 112 receives the ultrasonic wave of reflection, and electric signal is converted to, the electric signal is again
It is sent to driving chip 120 after corresponding processing (such as amplification) through thin film transistor (TFT) pel array layer 111, to fingerprint
It is identified.
Fig. 2, Fig. 3 are please referred in one of the embodiments, and ultrasonic fingerprint identifies that mould group further includes temperature sensor
140.Temperature sensor 140 is electrically connected with driving chip 120.
Therefore, temperature sensor 140 can identify the temperature of mould group local environment with real-time detection ultrasonic fingerprint, and will inspection
The real time temperature of survey is sent to driving chip 120.Driving chip 120 can be obtained from memory 130 according to the real time temperature
Adaptable control information.It, can be quick, quasi- since temperature sensor 140 is set in ultrasonic fingerprint identification mould group
Really measure the temperature of ultrasonic fingerprint identification mould group local environment.
Specifically, temperature sensor 140 is set in ultrasonic sensor 110.Due to being identified in mould group in ultrasonic fingerprint,
Ultrasonic sensor 110 is most susceptible to the influence of temperature, therefore temperature sensor 140 is set in ultrasonic sensor 110,
The temperature of 110 ambient enviroment of ultrasonic sensor can be detected, directly in order to which driving chip 120 obtains more accurate control
Information.
Further, in the specific structure of above-mentioned ultrasonic sensor 110, temperature sensor 140 is located at piezoelectric layer 112
Lower section.The top of piezoelectric layer 112 is towards contact object.In other words, temperature sensor 140 is not installed on ultrasonic wave by piezoelectric layer
On 112 paths propagated to contact object.Since piezoelectric layer 112 is for emitting ultrasonic wave, temperature sensor 140 is set
It, can be to avoid the conducting effect for influencing ultrasonic wave in 112 lower section of piezoelectric layer.Specifically, referring to FIG. 2, temperature sensor 140 can
To be set in thin film transistor (TFT) pel array layer 111.
It is understood that the mode that driving chip 120 obtains temperature is not limited to a kind of above-mentioned situation, and such as: driving core
The real time temperature for the ultrasonic fingerprint identification mould group that piece 120 can be sent with wireless receiving by other equipment.
In one of the embodiments, please continue to refer to Fig. 1, Fig. 2, above-mentioned ultrasonic fingerprint identification mould group further includes circuit
Plate 150.Driving chip 120 and memory 130 are mounted on circuit board 150.
Specifically, ultrasonic sensor 110 can be connect with circuit board 150 with bonding.Further, circuit board 150 is soft
Property circuit board.
It is understood that above-mentioned temperature sensor 140 also may be mounted on circuit board 150.
In one of the embodiments, please continue to refer to Fig. 1, Fig. 2, above-mentioned ultrasonic fingerprint identification mould group further includes cover board
160.Cover board 160 is covered in the top surface of ultrasonic sensor 110.The top surface of cover board 160 is towards contact object.
Wherein, cover board 160 shields, so as to improve the reliability of ultrasonic fingerprint identification mould group.Cover board 160
It can be the material that can be penetrated by ultrasonic wave, such as glass, plastics or metal (such as aluminium).In addition, cover board 160 can be direct
For the shell of electronic equipment, perhaps cover board 160 can be embedded in the shell of electronic equipment or cover board 160 is installed on electronics
Below the shell of equipment.
Further, please continue to refer to Fig. 1, Fig. 2, ultrasonic fingerprint identifies that mould group further includes matching layer 170.Matching layer
170 between cover board 160 and ultrasonic sensor 110.
Wherein, matching layer 170 is for carrying out acoustic resistance matching, reduce the piezoelectric layer 112 of ultrasonic sensor 110 with contact pair
Acoustic resistance as between is poor, so that ultrasonic wave can be transmitted effectively.Specifically, matching layer 170 is, for example, hot pressing glue film.And
And matching layer 170 need to guarantee that ultrasonic wave can be penetrated.Wherein, hot pressing glue film refers to membranaceous hot pressing glue.Hot pressing glue, refers to and applies
A kind of glue material of hot-press solidifying is needed after glue, for example, includes the hot pressing glue of epoxy resin.
In addition, matching layer 170 can be located on the same floor with circuit board 150, to make up ultrasonic sensor 110 and circuit
Existing ladder offset between plate 150.Therefore, matching layer 170 be in addition to that can also fill offset with the matched effect of acoustic resistance,
To improve the validity of ultrasonic transmission.
Another embodiment provides a kind of electronic equipment, such as can be computer, tablet computer, individual digital and help
Reason, mobile phone etc..The electronic equipment includes the ultrasonic fingerprint identification mould group that above embodiment provides.
It should be noted that the ultrasonic fingerprint identification mould group and upper one in the electronic equipment that present embodiment provides is implemented
The principle of mode is identical, just repeats no more here.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of ultrasonic fingerprint identifies mould group, including ultrasonic sensor and driving chip；The top of the ultrasonic sensor
Facing towards contact object, and the ultrasonic sensor can emit ultrasonic wave, and be able to detect the ultrasonic wave of reflection；The drive
Dynamic chip is for controlling the ultrasonic sensor；It is characterized in that, the ultrasonic fingerprint identification mould group further includes memory,
And the memory is electrically connected with the driving chip；
The memory has the corresponding control information of different temperatures；The driving chip is known for obtaining the ultrasonic fingerprint
The real time temperature of other mould group local environment, and control information corresponding with the real time temperature is obtained from the memory, with
The ultrasonic sensor is controlled according to the control information of acquisition.
2. ultrasonic fingerprint according to claim 1 identifies mould group, which is characterized in that the ultrasonic sensor includes thin
Film transistor pel array layer, piezoelectric layer and electrode layer；It is brilliant that the piezoelectric layer and the electrode layer are successively covered in the film
In body pipe pel array layer.
3. ultrasonic fingerprint according to claim 2 identifies mould group, which is characterized in that the control information for and the pressure
One or more corresponding control parameter values of electric layer.
4. ultrasonic fingerprint according to claim 2 identifies mould group, which is characterized in that the ultrasonic fingerprint identifies mould group
It further include temperature sensor；The temperature sensor is electrically connected with the driving chip.
5. ultrasonic fingerprint according to claim 4 identifies mould group, which is characterized in that the temperature sensor is set to described
In ultrasonic sensor.
6. ultrasonic fingerprint according to claim 5 identifies mould group, which is characterized in that the temperature sensor is located at described
Below piezoelectric layer；The top of the piezoelectric layer is towards the contact object.
7. identifying mould group to ultrasonic fingerprint described in any one of 6 claims according to claim 1, which is characterized in that institute
Stating ultrasonic fingerprint identification mould group further includes circuit board；The driving chip and the memory are mounted on the circuit board
On.
8. ultrasonic fingerprint according to claim 7 identifies mould group, which is characterized in that the ultrasonic fingerprint identifies mould group
It further include cover board；The cover board is covered in the top surface of the ultrasonic sensor.
9. ultrasonic fingerprint according to claim 8 identifies mould group, which is characterized in that the ultrasonic fingerprint identifies mould group
It further include for carrying out the matched matching layer of acoustic resistance；The matching layer is between the cover board and the ultrasonic sensor.
10. a kind of electronic equipment, which is characterized in that refer to including ultrasonic wave described in any one of claim 1-9 claim
Line identifies mould group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201710819172.5A CN109492472A (en) | 2017-09-12 | 2017-09-12 | Ultrasonic fingerprint identifies mould group and electronic equipment |
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| CN201710819172.5A CN109492472A (en) | 2017-09-12 | 2017-09-12 | Ultrasonic fingerprint identifies mould group and electronic equipment |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110443019A (en) * | 2019-08-08 | 2019-11-12 | Oppo广东移动通信有限公司 | Fingerprint identification method and Related product |
| CN111866680A (en) * | 2020-07-15 | 2020-10-30 | 深圳市汇顶科技股份有限公司 | Ultrasonic transducer and electronic equipment |
| CN112070017A (en) * | 2020-09-08 | 2020-12-11 | 深圳市汇顶科技股份有限公司 | Ultrasonic fingerprint identification method, device, equipment and storage medium |
| CN115311695A (en) * | 2022-09-16 | 2022-11-08 | 深圳市汇顶科技股份有限公司 | Ultrasonic fingerprint identification method, ultrasonic fingerprint device and electronic equipment |
| CN116482511A (en) * | 2023-03-29 | 2023-07-25 | 上海芯丑半导体设备有限公司 | Chip comprehensive testing device and chip comprehensive testing method |
| WO2023230866A1 (en) * | 2022-05-31 | 2023-12-07 | 深圳市汇顶科技股份有限公司 | Ultrasonic fingerprint recognition apparatus and electronic device |
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