CN207182307U - Ultrasonic wave biological identification device and electronic equipment - Google Patents
Ultrasonic wave biological identification device and electronic equipment Download PDFInfo
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- CN207182307U CN207182307U CN201721165658.3U CN201721165658U CN207182307U CN 207182307 U CN207182307 U CN 207182307U CN 201721165658 U CN201721165658 U CN 201721165658U CN 207182307 U CN207182307 U CN 207182307U
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Abstract
It the utility model is related to a kind of ultrasonic wave biological identification device and electronic equipment.The ultrasonic wave biological identification device includes thin film transistor (TFT), piezoelectric layer, conductive layer and acoustic matching layer, and thickness is 195 microns~295 microns, and the thickness of the thinnest part of thin film transistor (TFT) is differed with the thickness in thickness no more than 40 microns；Piezoelectric layer is layered on thin film transistor (TFT), and the thickness of piezoelectric layer is 8 microns~10 microns, and the thinnest part of piezoelectric layer is differed with the thickness in thickness no more than 2 microns；Conductive layer is folded over the piezoelectric layer, and the thickness of conductive layer is 13 microns~19 microns, and the thinnest part of conductive layer is differed with the thickness in thickness no more than 6 microns；Acoustic matching layer is laminated on the electrically conductive, and the thickness of acoustic matching layer is 20 microns~80 microns, and the thinnest part of acoustic matching layer is differed with the thickness in thickness no more than 10 microns.Above-mentioned ultrasonic wave biological identification device can obtain being imaged more clearly image.
Description
Technical field
Touch display field is the utility model is related to, more particularly to a kind of ultrasonic wave biological identification device and electronic equipment.
Background technology
Ultrasonic fingerprint identification technology can be scanned by ultrasonic wave to fingerprint, with traditional fingerprint recognition mode phase
Than the identification of, ultrasonic fingerprint fingerprint can be carried out deeper into analysis, even if finger surface speckles with dirt and does not also hinder ultrasonic wave
Sampling, or even the unique 3D features of fingerprint are identified under the surface that can also penetrate to the skin.Even in there is the feelings such as water, sweat on hand
Under condition, still can accurately it identify.However, there is the unsharp problem of image in current ultrasonic wave identification device.
Utility model content
Based on this, it is necessary to which image more clearly ultrasonic wave biological identification device can be obtained by providing one kind.
In addition, also provide a kind of electronic equipment.
A kind of ultrasonic wave biological identification device, including：
Thin film transistor (TFT), thickness be 195 microns~295 microns, and the thickness of the thinnest part of the thin film transistor (TFT) with most
Thickness difference at thickness is no more than 40 microns；
Piezoelectric layer, it is layered on the thin film transistor (TFT), and the thinnest part of the piezoelectric layer differs with the thickness in thickness
No more than 2 microns；
Conductive layer, it is layered on the thin film transistor (TFT), and the thinnest part of the conductive layer differs with the thickness in thickness
No more than 6 microns；And
Acoustic matching layer, be layered on the conductive layer on the conductive layer, the thickness of the acoustic matching layer for 20 microns~
80 microns, and the thinnest part of the acoustic matching layer is differed with the thickness in thickness no more than 10 microns.
Although ultrasonic wave has the ability for being capable of penetrable material, but ultrasonic wave can occur instead when penetrating unlike material
Penetrate, and ultrasonic wave biological identification device is generally all sandwich construction, every layer of acoustic impedance is general all different, the conduction to ultrasonic wave
The damping capacity of speed and ultrasonic signal is inconsistent, and above-mentioned ultrasonic wave biological identification device is thin by the way that piezoelectric layer is layered in
It is on film transistor, conductive layer is folded over the piezoelectric layer, acoustic matching layer be laminated on the electrically conductive, with realize the transmitting of ultrasonic wave and
The ultrasonic wave being reflected back is received, then it is 8 microns~10 microns to control the thickness of piezoelectric layer by cooperation, and control piezoelectric layer most
Thin place is differed with the thickness in thickness no more than 2 microns, so that the signal intensity for the ultrasonic wave that piezoelectric layer is launched as far as possible one
Cause, meanwhile, by the thickness control of thin film transistor (TFT) be 195 microns~295 microns, the thickness of the thinnest part of thin film transistor (TFT) with most
Thickness difference at thickness is no more than 40 microns, and the thickness control for controlling conductive layer is 13 microns~19 microns, and controls conductive layer
Thinnest part differed with the thickness in thickness no more than 6 microns, the thickness for controlling acoustic matching layer is 20 microns~80 microns, and is controlled
The thinnest part of acoustic matching layer processed is differed with the thickness in thickness no more than 10 microns, to ensure thin film transistor (TFT), conductive layer harmony
Matching layer makes ultrasonic wave in each layer respectively in corresponding thickness range, and each layer possesses respective uniformity respectively
Path difference is consistent as much as possible, so that the ultrasonic wave reflected through each layer can form resonance as much as possible, reducing each layer can not
Interfering between the ultrasonic wave of formation resonant reflection, so that the signal for the ultrasonic wave being reflected back that piezoelectric layer receives is use up
May be consistent, so that the image that ultrasonic wave biological identification device obtains is more clear.
In one of the embodiments, in addition to cover plate, the cover plate with the acoustic matching layer away from the conductive layer
Side is laminated, and the cover plate covers the side of the acoustic matching layer away from the conductive layer；The thickness of the thin film transistor (TFT)
Spend for 195 microns~235 microns, the thickness of the cover plate is 500 microns~800 microns；Or the thickness of the thin film transistor (TFT)
Spend for 255 microns~295 microns, the thickness of the cover plate is 350 microns~500 microns.Cover plate is set to play protection each
The effect of layer, be advantageous to increase the service life of ultrasonic wave biological identification device；According to the thin film transistor (TFT) of above-mentioned different-thickness
Select the cover plate of respective thickness so that the ultrasonic wave of cover plate reflection can with the ultrasonic waveforms of other each layers reflections into resonance, with
Ultrasonic wave of the ultrasonic wave that cover plate reflects as much as possible with other each layer reflections is resonated, and reduce cover plate reflection
Interfered between ultrasonic wave and the ultrasonic wave of other each layer reflections, to ensure that image is clear as much as possible.
In one of the embodiments, in addition to it is layered in ink of the cover plate on the side of the acoustic matching layer
Layer, the color of the ink layer is white, and the thickness of the acoustic matching layer is 20 microns~55 microns.Using the ink of white
Layer, and it is 20 microns~55 microns to control the thickness of acoustic matching layer, is more beneficial for making the cover plate for being laminated with the ink layer of white anti-
The ultrasonic wave penetrated resonates with acoustic matching layer as much as possible.
In one of the embodiments, in addition to it is layered in ink of the cover plate on the side of the acoustic matching layer
Layer, the color of the ink layer is black, and the thickness of the acoustic matching layer is 45 microns~80 microns.Using the ink of black
Layer, and be 45 microns~80 microns by controlling the thickness of acoustic matching layer, it is more beneficial for the lid for making the ink layer for being laminated with black
The ultrasonic wave of plate reflection resonates with acoustic matching layer as much as possible.
In one of the embodiments, the thickness of the acoustic matching layer is 45 microns~55 microns.Control acoustic matching layer
Thickness is 45 microns~55 microns, not only contributes to reduce the cover plate for the ink layer for being laminated with black and surpassing for acoustic matching layer reflection
Interfering between sound wave, it is also beneficial to reduce the cover plate assembly for the ink layer for being laminated with white and surpassing for acoustic matching layer reflection
Interference between sound wave, preferably to make acoustic matching layer and the ultrasonic waveform that the cover plate formed with ink layer reflects into resonance.
In one of the embodiments, in addition to the tack coat between the acoustic matching layer and the conductive layer, institute
To state tack coat and fix the bonding acoustic matching layer and the conductive layer, the thickness of the tack coat is 10 microns~20 microns, and
The thinnest part of tack coat is differed with the thickness in thickness no more than 10 microns.By using tack coat by acoustic matching layer and conductive layer
It is fixed together, making is simpler, and by controlling the thickness of tack coat in 10 microns~20 micrometer ranges, and control viscous
The thinnest part of knot layer is differed with the thickness in thickness no more than 10 microns, i.e., while the thickness of tack coat is controlled, control is viscous
The thickness of knot layer has certain uniformity, so that what the ultrasonic wave of tack coat reflection can reflect with other each layers as much as possible
Ultrasonic waveform is into resonance.
In one of the embodiments, the conductive layer is silver layer.Silver layer has good electric conductivity, and controls to be upper
State thickness, material can preferably form resonance for the ultrasonic wave of the conductive layer reflection of silver with the ultrasonic wave of other each layer reflections.
In one of the embodiments, the conductive layer includes plate-like body and side wall, the plate-like body and the pressure
Electric layer is laminated, and the thickness of the plate-like body is 13 microns~19 microns, and the thinnest part of the plate-like body and thickness
Thickness difference is no more than 6 microns, and the side wall ring is set one week around the edge of the plate-like body, to form an accommodating cavity, institute
State side of the side wall away from the plate-like body to be fixedly connected with the thin film transistor (TFT), so that the conductive layer and the film
Transistor coordinates jointly houses the piezoelectric layer, wherein, the acoustic matching layer is layered in the plate-like body away from the piezoelectricity
On the side of layer.By the way that conductive layer is arranged into said structure, is advantageous to piezoelectric layer and launches the consistent ultrasonic wave of signal intensity,
Further improve the definition of image.
In one of the embodiments, formed with step on the outer surface of side of the side wall away from the plate-like body
Portion, the ultrasonic wave biological identification device also include circuit board, and the circuit board is brilliant with the stage portion and the film respectively
Body pipe bonding.By setting stage portion to facilitate the bonding of circuit board and conductive layer.
In one of the embodiments, in addition to cover plate and the bonding between the acoustic matching layer and the conductive layer
Layer, the cover plate are laminated with side of the acoustic matching layer away from the conductive layer, the stage portion and the thin film transistor (TFT)
Bonding is at the same side of the circuit board, side of the circuit board away from the thin film transistor (TFT) and one section of the cover plate interval
Distance.By making side of the circuit board away from thin film transistor (TFT) be spaced a distance with cover plate, to avoid circuit board and cover plate phase
Abut, and causing cover plate to tilt causes the thickness of tack coat unintelligible, and make the path difference of tack coat inconsistent, signal intensity is not
Unanimously influence the definition of image.
A kind of electronic equipment, including above-mentioned ultrasonic wave biological identification device.Due to above-mentioned ultrasonic wave biological identification device
Imaging is more clear so that the imaging of above-mentioned electronic equipment also more definition.
Brief description of the drawings
Fig. 1 is the profile of the ultrasonic wave biological identification device of an embodiment；
Fig. 2 is the profile of the thin film transistor (TFT) of ultrasonic wave biological identification device shown in Fig. 1, piezoelectric layer and conductive layer；
Fig. 3 is the profile of the ultrasonic wave biological identification device of another embodiment；
Fig. 4 is the profile of the ultrasonic wave biological identification device of another embodiment；
Fig. 5 is the profile of the ultrasonic wave biological identification device of another embodiment.
Embodiment
For the ease of understanding the utility model, the utility model is more fully retouched below with reference to relevant drawings
State.Preferred embodiment of the present utility model is given in accompanying drawing.But the utility model can come in many different forms
Realize, however it is not limited to embodiment described herein.On the contrary, the purpose for providing these embodiments is made to of the present utility model
The understanding of disclosure more thorough and comprehensive.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to technology of the present utility model
The implication that the technical staff in domain is generally understood that is identical.It is simply in term used in the description of the present utility model herein
The purpose of description specific embodiment, it is not intended that in limitation the utility model.
As shown in figure 1, the electronic equipment of an embodiment, such as mobile phone, computer etc., including ultrasonic wave biological identification device
100, the ultrasonic wave biological identification device 100 for example can be used for the identification of fingerprint.Wherein, the ultrasonic wave biological identification device
100 include cover plate 110, ink layer 120, thin film transistor (TFT) 130, piezoelectric layer 140, conductive layer 150, acoustic matching layer 160, tack coat
170 and circuit board 180.
Cover plate 110 can be inlayed in the housing of the electronics device, can also be laminated with the shell of electronic equipment.Cover plate 110
For Transparent Parts.Cover plate 110 is one kind in transparency glass plate, quartz plate, alumina plate and transparent organic plates, these materials
Cover plate 110 not only there is more suitable mechanical strength, and industrial design (ID, Industrial can also be met
Design requirement).
Ink layer 120 is layered on a surface of cover plate 110.Ink layer 120 can be formed by modes such as silk-screen printings
On cover plate 110.Specifically, ink layer 120 is black ink layer or white ink layer.Wherein, the material of ink layer 120 is ring
Oxygen tree lipid ink, the ink layer of the material differ larger with the acoustic resistance of air, are influenceed to caused by the propagation of ultrasonic wave smaller.
Specifically, the thickness of ink layer 120 is 8 microns~32 microns.
By the way that cover plate 110 is arranged into Transparent Parts, and ink layer 120 is set on cover plate 110, can have cover plate 110
There is required color, and make cover plate 110 have the function that to block extraneous light.
The circuit of picture signal can be converted the electrical signal to by being provided with thin film transistor (TFT) 130.Wherein, thin film transistor (TFT)
130 thickness is 195 microns~295 microns, and the thickness of the thinnest part of thin film transistor (TFT) 130 differs not with the thickness in thickness
More than 40 microns.The thickness of the thin film transistor (TFT) 130 controlled be 195 microns~295 microns with other each layer thickness matchings
While, meet that the thickness of thinnest part of thin film transistor (TFT) 130 and the thickness in thickness are differed no more than 40 microns thin to ensure
The thickness evenness of film transistor 130.Even if the thickness of thin film transistor (TFT) 130 in 195 microns~295 microns, controls film
The thickness of the thinnest part of transistor 130 differs fewer with the thickness in thickness, and the thickness of thin film transistor (TFT) 130 is more uniform, warp
The signal intensity for the ultrasonic wave that thin film transistor (TFT) 130 reflects is more consistent.
Further, the thickness of thin film transistor (TFT) 130 is 195 microns~235 microns, and the thickness of cover plate 110 is 500 microns
~800 microns；Or the thickness of thin film transistor (TFT) 130 is 255 microns~295 microns, the thickness of cover plate 110 for 350 microns~
500 microns.The cover plate 110 of respective thickness is selected according to the thin film transistor (TFT) 130 of above-mentioned different thickness, so that cover plate 110 is anti-
The ultrasonic wave penetrated can be with the ultrasonic waveforms of other each layers reflections into resonance, so that the ultrasonic wave that reflects of cover plate 110 can to the greatest extent can
Energy ground and the ultrasonic wave of other each layer reflections resonate, and reduce what the ultrasonic wave that cover plate 110 reflects reflected with other each layers
Disturbed between ultrasonic wave, to ensure that image is clear as much as possible.
Piezoelectric layer 140 is laminated on thin film transistor (TFT) 130.Piezoelectric layer 140 can launch ultrasonic wave and reception ultrasonic wave is anti-
The ultrasonic wave penetrated, and by reflected wave conversion into electric signal.Wherein, the thickness of piezoelectric layer 140 is 8 microns~10 microns, and is pressed
The thinnest part of electric layer 140 is differed with the thickness in thickness no more than 2 microns.By the thickness control of piezoelectric layer 140 in above range
While, the thinnest part of control piezoelectric layer 140 is differed with the thickness in thickness no more than 2 microns, can have piezoelectric layer 140
More suitable piezoelectric constant D33, and the signal intensity of ultrasonic wave that piezoelectric layer 140 is launched is also more consistent, and piezoelectric layer
140 thinnest part differs smaller with the thickness in thickness, and the thickness of piezoelectric layer 140 is more uniform, the ultrasonic wave that piezoelectric layer 140 is launched
Signal intensity it is more consistent.
Specifically, the material of piezoelectric layer 140 is P (VDF-TrFE) (copolymer of Kynoar and trifluoro-ethylene), should
The piezoelectric layer 140 of material, which is equipped with above-mentioned thickness, can make piezoelectric layer 140 have preferable piezoelectric property, be advantageous to improve piezoelectric layer
The signal intensity of the ultrasonic wave of 140 transmittings.Wherein, in P (VDF-TrFE), the mol ratio of Kynoar and trifluoro-ethylene is
60:40、70:30、80:20 or 90:10.
It should be noted that the material of piezoelectric layer 140 is not limited to above-mentioned material, for example, the material of piezoelectric layer 140 may be used also
Think polyvinylidene chloride (PVDC) homopolymer, the copolymer of polyvinylidene chloride, the homopolymer of polytetrafluoroethylene (PTFE), poly- inclined two
Copolymer, diisopropylamine bromide (DTPAB) or Kynoar of vinyl chloride etc..
Conductive layer 150 is layered on piezoelectric layer 140.Wherein, the thickness of conductive layer 150 is 13 microns~19 microns, and is led
The thinnest part of electric layer 150 is differed with the thickness in thickness no more than 6 microns.It is above-mentioned thickness by controlling the thickness of conductive layer 150
Degree, and makes the thickness of conductive layer 150 meet certain uniformity so that the signal intensity for the ultrasonic wave that conductive layer 150 reflects compared with
To be consistent, be advantageous to improve the definition of image.I.e. while controlling the thickness of conductive layer 150 to be 13 microns~19 microns,
The thinnest part of conductive layer 150 differs smaller with the thickness in thickness, and the thickness of conductive layer 150 is more uniform, what conductive layer 150 reflected
The signal intensity of ultrasonic wave is more consistent.
Also referring to Fig. 2, further, conductive layer 150 includes plate-like body 152 and side wall 154, plate-like body 152
It is laminated with piezoelectric layer 140, side wall 154 is set one week around the edge of plate-like body 152, and to form an accommodating cavity, side wall 154 is remote
Side from plate-like body 152 is fixedly connected with thin film transistor (TFT) 130, so that conductive layer 150 and thin film transistor (TFT) 130 are matched somebody with somebody jointly
Close and house piezoelectric layer 140.Launch signal intensity one by setting a layer said structure to be advantageous to piezoelectric layer 140 conductive layer 150
The ultrasonic wave of cause, further improve the definition of imaging.Now, the thickness of plate-like body 152 is 13 microns~19 microns, and plate
The thinnest part of shape body 152 is differed with the thickness in thickness no more than 6 microns.
Further, conductive layer 150 is silver layer.Silver layer has electric conductivity well, and controls as above-mentioned thickness, material
Resonance can be preferably formed for the ultrasonic wave that the conductive layer 150 of silver reflects with the ultrasonic wave of other each layer reflections.Specifically, lead
Electric layer 150 can be directly by coating silver paste, and then sintering is prepared.
It should be noted that the material of conductive layer 150 is not limited to silver, such as can also be ITO.
Acoustic matching layer 160 is layered on conductive layer 150.Wherein, side of the acoustic matching layer 160 away from conductive layer 150 is inspection
Survey region.Specifically, acoustic matching layer 160 is layered on side of the plate-like body 152 away from piezoelectric layer 140, and cover plate 110 is close to oil
The side of layer of ink 120 is laminated with side of the acoustic matching layer 160 away from conductive layer 150.Cover plate 110 and ink layer 120 can play
Protection and the effect of shading, to avoid interference of the extraneous light to ultrasonic wave biological identification device 100.
Specifically, the material of acoustic matching layer 160 is that chip attaches film (Die attach film, DAF).Acoustic matching layer 160
Directly it can be formed by techniques such as coating, silk-screen printing, sprayings on ink layer 120.
The thickness of acoustic matching layer 160 is 20 microns~80 microns, and the thinnest part of acoustic matching layer 160 and the thickness in thickness
Difference is no more than 10 microns.The acoustic matching layer 160 of the thickness can be well matched with the piezoelectric layer 140 of above-mentioned thickness, so that
The ultrasonic wave that the ultrasonic wave that acoustic matching layer 160 reflects reflects with piezoelectric layer 140 as much as possible resonates；And control acoustic matching layer
160 thinnest part is differed with the thickness in thickness no more than 10 microns, to ensure the uniformity of the thickness of acoustic matching layer 160, is made
Ultrasonic wave is consistent as much as possible in the path difference of acoustic matching layer 160.For example, the thickness of acoustic matching layer 160 is 50 microns, then,
The thickness in the thickness of acoustic matching layer 160 is no more than 55 microns, and the thickness of thinnest part is not less than 45 microns.It should be noted that
While controlling the thickness of acoustic matching layer 160 to be 20 microns~80 microns, the thinnest part of acoustic matching layer 160 and the thickness in thickness
Degree difference is smaller, and the signal intensity for the ultrasonic wave that acoustic matching layer 160 reflects is more consistent.
Further, when the color of ink layer 120 is white, the thickness of acoustic matching layer 160 is 20 microns~55 microns.Adopt
With the ink layer 120 of white, and it is 20 microns~55 microns to control the thickness of acoustic matching layer 160, is more beneficial for making being laminated with white
The ultrasonic wave that the cover plate 110 of the ink layer 120 of color reflects resonates with acoustic matching layer 160 as much as possible.
When the color of ink layer 120 is black, the thickness of acoustic matching layer 160 is 45 microns~80 microns.Using black
Ink layer 120, and control acoustic matching layer 160 thickness be 45 microns~80 microns, be more beneficial for making the ink for being laminated with black
The ultrasonic wave that the cover plate 110 of layer 120 reflects resonates with acoustic matching layer 160 as much as possible.
Preferably, the thickness of acoustic matching layer 160 is 45 microns~55 microns.Control the thickness of acoustic matching layer 160 micro- 45
Rice~55 microns in change, not only contribute to reduce be laminated with black ink layer 120 cover plate 110 and acoustic matching layer 160 it is anti-
Interference between the ultrasonic wave penetrated, it is also beneficial to reduce the component of cover plate 110 and acoustic matching layer of the ink layer 120 for being laminated with white
Interference between the ultrasonic waves of 160 reflections, preferably reflect acoustic matching layer 160 and cover plate 110 formed with ink layer 120
Ultrasonic waveform into resonance.
Tack coat 170 is located between acoustic matching layer 160 and conductive layer 150, and fixed bonding acoustic matching layer 160 and conduction
Layer 150, the thickness of tack coat 170 is 10 microns~20 microns, and the thinnest part of tack coat 170 differs not with the thickness in thickness
More than 10 microns, so that the ultrasonic waveform that the ultrasonic wave that tack coat 170 reflects can be as much as possible with other each layer reflections is into altogether
Shake, and acoustic matching layer 160 and conductive layer 150 are fixed together by using tack coat 170, make simpler.Need
Bright, while controlling the thickness of tack coat 170 to be 20 microns~80 microns, thinnest part is differed with the thickness in thickness and got over
Small, the signal intensity for the ultrasonic wave that tack coat 170 reflects is more consistent.
Specifically, the material of tack coat 170 is liquid glue, and liquid glue for example can be the NCA3285 of Henkel.
It is appreciated that acoustic matching layer 160 can not also be laminated by tack coat 170 and conductive layer 150, can also directly lead to
Cross the techniques such as coating, silk-screen printing, spraying to be formed on conductive layer 150, now, tack coat 170 is arranged on the He of acoustic matching layer 160
Between ink layer 120, together with acoustic matching layer 160 is adhesively fixed with cover plate 110.
Circuit board 180 is flexible PCB.Circuit board 180 and the circuit bonding on conductive layer 150, thin film transistor (TFT) 130
(bonding)。
In the illustrated embodiment, shape on the outer surface of side of the side wall 154 of conductive layer 150 away from plate-like body 152
Into there is a stage portion 156, circuit board 180 respectively with stage portion 156 and the bonding of thin film transistor (TFT) 130.By setting the energy of stage portion 156
Enough facilitate the bonding of circuit board 180 and conductive layer 150.
Further, stage portion 156 and the bonding of thin film transistor (TFT) 130 are remote in the same side of circuit board 180, circuit board 180
The side of scrapping off film transistor 130 is spaced a distance with cover plate 110.By making circuit board 180 away from thin film transistor (TFT) 130
Side is spaced a distance with cover plate 110, to avoid circuit board 180 from being abutted against with cover plate 110, and causes cover plate 110 to tilt and causes
Make the in uneven thickness of tack coat 170, and make the path difference of tack coat 170 inconsistent, signal intensity is inconsistent and influences imaging
Definition.
It should be noted that can also not have stage portion 156 in the side wall 154 of conductive layer 150, now, circuit board 180 is straight
Connect and the bonding of the side wall of conductive layer 150 154；Or conductive layer 150 be also not necessarily limited to can also be for said structure, conductive layer 150
One platy structure；Ink layer 120 can also omit, and now, cover plate 110 is nontransparent material, and cover plate 110 is directly and acoustic matching
Side stacking of the layer 160 away from conductive layer 150；Cover plate 110 can also omit, and now, acoustic matching layer 160 is directly and electronic equipment
Shell stacking, i.e., electronic equipment shell substitution cover plate 110.
Above-mentioned ultrasonic wave biological identification device 100 at least has the advantage that：
(1) although ultrasonic wave has the ability for being capable of penetrable material, but ultrasonic wave can occur when penetrating unlike material
Reflection, and ultrasonic wave biological identification device 100 is generally all sandwich construction, every layer of acoustic impedance is general all different, to ultrasonic wave
Conduction of velocity and ultrasonic signal damping capacity it is inconsistent, and above-mentioned ultrasonic wave biological identification device 100 is by by piezoelectricity
Layer 140 is layered on thin film transistor (TFT) 130, conductive layer 150 is layered on piezoelectric layer 140, acoustic matching layer 160 is layered in conduction
On layer 150, to realize ultrasonic wave that the transmitting of ultrasonic wave and reception are reflected back, then the thickness of piezoelectric layer 140 is controlled by coordinating
For 8 microns~10 microns, and the thinnest part of piezoelectric layer is controlled to be differed with the thickness in thickness no more than 2 microns, so that piezoelectric layer
The signal intensity of 140 ultrasonic waves launched is as consistent as possible, meanwhile, it is 195 microns by the thickness control of thin film transistor (TFT) 130
~295 microns, the thickness of the thinnest part of thin film transistor (TFT) 130 is differed with the thickness in thickness no more than 40 microns, and control is conductive
The thickness control of layer 150 is 13 microns~19 microns, and controls the thinnest part of conductive layer 150 to be differed with the thickness in thickness and do not surpass
Cross 6 microns, the thickness for controlling acoustic matching layer 160 is 20 microns~80 microns, and control the thinnest part of acoustic matching layer 160 with it is most thick
The thickness difference at place is no more than 10 microns, to ensure thin film transistor (TFT) 130, conductive layer 150 and acoustic matching layer 160 respectively corresponding
Thickness range in, and each thickness degree possesses respective uniformity respectively so that ultrasonic wave to the greatest extent may be used in the path difference of each layer
Energy ground is consistent, so that the ultrasonic wave reflected through each layer can form resonance as much as possible, resonance can not be formed by reducing each layer
Interfering between the ultrasonic wave being reflected back, so that the signal for the ultrasonic wave being reflected back that piezoelectric layer 140 receives to the greatest extent may be used
Can be consistent, so that the image that ultrasonic wave biological identification device 100 obtains is more clear.
(2) after due to the bonding of circuit board 180, its height is higher than conductive layer 150, and cover plate 110 can be caused to tilt, cause to bond
It is thin on one side behind one side of tack coat 170 of cover plate 110 and silver layer, it is in uneven thickness, cause path difference of the tack coat 170 to ultrasonic wave
It is inconsistent, and the acoustic matching layer 160 of above-mentioned thickness can not only make up the segment difference that conductive layer 150 is higher by after the bonding of circuit board 180,
To ensure that cover plate 110 is higher by the segment distance of circuit board 180 1, and enable tack coat 170 as much as possible uniformly, and acoustic matching layer
160 can also be matched the acoustic impedance of cover plate 110 with the acoustic impedance of examined object.
Further, since the image that above-mentioned ultrasonic wave biological identification device 100 obtains is more clear so that uses the ultrasonic wave
The image of the electronic equipment of biological identification device 100 is more clear.
As shown in Fig. 2 the ultrasonic wave biological identification device 200 of another embodiment and ultrasonic wave biological identification device 100
Structure it is roughly the same, difference is, the acoustic matching layer 210 of the ultrasonic wave biological identification device 200 of present embodiment is directly logical
Cross the techniques such as coating, silk-screen printing to be formed on side of the conductive layer 220 away from piezoelectric layer 230, at this point it is possible to pass through tack coat
240 are bonded together ink layer 250 and acoustic matching layer 210.
Due to the structure and ultrasonic wave biological identification device 100 of the ultrasonic wave biological identification device 200 of present embodiment
Structure is roughly the same, and therefore, ultrasonic wave biological identification device 200 also has the similar effect of ultrasonic wave biological identification device 100.
As shown in figure 3, the ultrasonic wave biological identification device 300 of another embodiment and ultrasonic wave biological identification device 200
Structure it is roughly the same, difference is, does not have on the acoustic matching layer 310 of the ultrasonic wave biological identification device 300 of present embodiment
Cover plate and ink layer are set, and now, the shell that acoustic matching layer 310 can be directly with electronic equipment is laminated.
Due to the structure and ultrasonic wave biological identification device 200 of the ultrasonic wave biological identification device 300 of present embodiment
Structure is roughly the same, and therefore, ultrasonic wave biological identification device 300 also has the similar effect of ultrasonic wave biological identification device 200.
As shown in figure 4, the ultrasonic wave biological identification device 400 of another embodiment and ultrasonic wave biological identification device 100
Structure it is roughly the same, difference is, the cover plate 410 and acoustic matching layer of the ultrasonic wave biological identification device 400 of present embodiment
Ink layer is not provided between 420, cover plate 410 can be nontransparent material, or cover plate 410 is transparent material, now, cover plate
410 shell directly with electronic equipment is laminated.
Due to the structure and ultrasonic wave biological identification device 100 of the ultrasonic wave biological identification device 400 of present embodiment
Structure is roughly the same, and therefore, ultrasonic wave biological identification device 400 also has the similar effect of ultrasonic wave biological identification device 100.
It is specific embodiment part below (below by taking ultrasonic wave biological identification device 100 as an example)：
Embodiment 1
The thickness and material of each layer of the ultrasonic wave biological identification device of the present embodiment are as follows：
The material of cover plate is glass plate, and thickness is 800 microns；Ink layer is white, and thickness is 20 microns；Thin film transistor (TFT)
Thickness be 215 microns, and the thinnest part of thin film transistor (TFT) differs 20 microns with the thickness in thickness；The material of piezoelectric layer is poly-
(mol ratio of Kynoar and trifluoro-ethylene is 60 to the copolymer of vinylidene and trifluoro-ethylene:40), thickness is 9 microns,
And the thinnest part of piezoelectric layer is differed at 2 microns with the thickness in thickness；Conductive layer is silver layer, the thickness of the plate-like body of conductive layer
For 16 microns, and thinnest part differs 6 microns with the thickness in thickness；The material of acoustic matching layer is that chip attaches film, acoustic matching layer
Thickness be 50 microns, and the thinnest part of acoustic matching layer differs 8 microns with the thickness in thickness；The material of tack coat is
NCA3285, thickness are 15 microns, and the thinnest part of tack coat differs 10 microns with the thickness in thickness.
Embodiment 2
The thickness and material of each layer of the ultrasonic wave biological identification device of the present embodiment are as follows：
The material of cover plate is glass plate, and thickness is 550 microns；Ink layer is white, and thickness is 20 microns；Thin film transistor (TFT)
Thickness be 215 microns, and the thinnest part of thin film transistor (TFT) differs 40 microns with the thickness in thickness；The material of piezoelectric layer is poly-
(mol ratio of Kynoar and trifluoro-ethylene is 60 to the copolymer of vinylidene and trifluoro-ethylene:40), thickness is 9 microns,
And the thinnest part of piezoelectric layer is differed at 2 microns with the thickness in thickness；Conductive layer is silver layer, the thickness of the plate-like body of conductive layer
For 16 microns, and thinnest part differs 6 microns with the thickness in thickness；The material of acoustic matching layer is that chip attaches film, acoustic matching layer
Thickness be 25 microns, and the thinnest part of acoustic matching layer differs 10 microns with the thickness in thickness；The material of tack coat is
NCA3285, thickness is 15 microns, and the thinnest part of tack coat differs 10 microns with the thickness in thickness.
Embodiment 3
The thickness and material of each layer of the ultrasonic wave biological identification device of the present embodiment are as follows：
The material of cover plate is glass plate, and thickness is 350 microns；Ink layer is white, and thickness is 20 microns；Thin film transistor (TFT)
Thickness be 275 microns, and the thinnest part of thin film transistor (TFT) differs 30 microns with the thickness in thickness；The material of piezoelectric layer is poly-
(mol ratio of Kynoar and trifluoro-ethylene is 60 to the copolymer of vinylidene and trifluoro-ethylene:40), thickness is 9 microns,
And the thinnest part of piezoelectric layer is differed at 1 micron with the thickness in thickness；Conductive layer is silver layer, the thickness of the plate-like body of conductive layer
For 15 microns, thinnest part differs 4 microns with the thickness in thickness；The material of acoustic matching layer is that chip attaches film, acoustic matching layer
Thickness is 25 microns, and the thinnest part of acoustic matching layer differs 10 microns with the thickness in thickness；The material of tack coat is
NCA3285, thickness is 15 microns, and the thinnest part of acoustic matching layer differs 6 microns with the thickness in thickness.
Test to obtain the image of the ultrasonic wave biological identification device of the present embodiment using the identical method of testing of embodiment 1
Situation is shown in Table 1.
Embodiment 4
The thickness and material of each layer of the ultrasonic wave biological identification device of the present embodiment are as follows：
The material of cover plate is glass plate, and thickness is 800 microns；Ink layer is black, and thickness is 20 microns；Thin film transistor (TFT)
Thickness be 215 microns, and the thinnest part of thin film transistor (TFT) differs 40 microns with the thickness in thickness；The material of piezoelectric layer is poly-
(mol ratio of Kynoar and trifluoro-ethylene is 60 to the copolymer of vinylidene and trifluoro-ethylene:40), thickness is 9 microns,
And the thinnest part of piezoelectric layer is differed at 2 microns with the thickness in thickness；Conductive layer is silver layer, the thickness of the plate-like body of conductive layer
For 16 microns, and thinnest part differs 6 microns with the thickness in thickness；The material of acoustic matching layer is that chip attaches film, acoustic matching layer
Thickness be 75 microns, and the thinnest part of acoustic matching layer differs 10 microns with the thickness in thickness；The material of tack coat is
NCA3285, thickness is 15 microns, and the thinnest part of tack coat differs 10 microns with the thickness in thickness.
Embodiment 5
The thickness and material of each layer of the ultrasonic wave biological identification device of the present embodiment are as follows：
The material of cover plate is glass plate, and thickness is 400 microns；Ink layer is black, and thickness is 20 microns；Thin film transistor (TFT)
Thickness be 275 microns, and the thinnest part of thin film transistor (TFT) differs 20 microns with the thickness in thickness；The material of piezoelectric layer is poly-
(mol ratio of Kynoar and trifluoro-ethylene is 60 to the copolymer of vinylidene and trifluoro-ethylene:40), thickness is 9 microns,
And the thinnest part of piezoelectric layer is differed at 2 microns with the thickness in thickness；Conductive layer is silver layer, the thickness of the plate-like body of conductive layer
For 16 microns, and thinnest part differs 6 microns with the thickness in thickness；The material of acoustic matching layer is that chip attaches film, acoustic matching layer
Thickness be 50 microns, and the thinnest part of acoustic matching layer differs 10 microns with the thickness in thickness；The material of tack coat is
NCA3285, thickness is 15 microns, and the thinnest part of tack coat differs 10 microns with the thickness in thickness.
Embodiment 6
The thickness and material of each layer of the ultrasonic wave biological identification device of the present embodiment are as follows：
The material of cover plate is glass plate, and thickness is 400 microns；Ink layer is white, and thickness is 20 microns；Thin film transistor (TFT)
Thickness be 215 microns, and the thinnest part of thin film transistor (TFT) differs 20 microns with the thickness in thickness；The material of piezoelectric layer is poly-
(mol ratio of Kynoar and trifluoro-ethylene is 60 to the copolymer of vinylidene and trifluoro-ethylene:40), thickness is 9 microns,
And the thinnest part of piezoelectric layer is differed at 2 microns with the thickness in thickness；Conductive layer is silver layer, the thickness of the plate-like body of conductive layer
For 16 microns, and thinnest part differs 6 microns with the thickness in thickness；The material of acoustic matching layer is that chip attaches film, acoustic matching layer
Thickness be 50 microns, and the thinnest part of acoustic matching layer differs 8 microns with the thickness in thickness；The material of tack coat is
NCA3285, thickness are 15 microns, and the thinnest part of tack coat differs 10 microns with the thickness in thickness.
Embodiment 7
The thickness and material of each layer of the ultrasonic wave biological identification device of the present embodiment are as follows：
The material of cover plate is glass plate, and thickness is 800 microns；Ink layer is white, and thickness is 20 microns；Thin film transistor (TFT)
Thickness be 215 microns, and the thinnest part of thin film transistor (TFT) differs 20 microns with the thickness in thickness；The material of piezoelectric layer is poly-
(mol ratio of Kynoar and trifluoro-ethylene is 60 to the copolymer of vinylidene and trifluoro-ethylene:40), thickness is 10 microns,
And the thinnest part of piezoelectric layer is differed at 2 microns with the thickness in thickness；Conductive layer is silver layer, the thickness of the plate-like body of conductive layer
For 16 microns, and thinnest part differs 6 microns with the thickness in thickness；The material of acoustic matching layer is that chip attaches film, acoustic matching layer
Thickness be 50 microns, and the thinnest part of acoustic matching layer differs 8 microns with the thickness in thickness；The material of tack coat is
NCA3285, thickness are 15 microns, and the thinnest part of tack coat differs 10 microns with the thickness in thickness.
Embodiment 8
The thickness and material of each layer of the ultrasonic wave biological identification device of the present embodiment are as follows：
The material of cover plate is glass plate, and thickness is 800 microns；Ink layer is white, and thickness is 20 microns；Thin film transistor (TFT)
Thickness be 245 microns, and the thinnest part of thin film transistor (TFT) differs 20 microns with the thickness in thickness；The material of piezoelectric layer is poly-
(mol ratio of Kynoar and trifluoro-ethylene is 60 to the copolymer of vinylidene and trifluoro-ethylene:40), thickness is 8 microns,
And the thinnest part of piezoelectric layer is differed at 2 microns with the thickness in thickness；Conductive layer is silver layer, the thickness of the plate-like body of conductive layer
For 20 microns, and thinnest part differs 6 microns with the thickness in thickness；The material of acoustic matching layer is that chip attaches film, acoustic matching layer
Thickness be 50 microns, and the thinnest part of acoustic matching layer differs 8 microns with the thickness in thickness；The material of tack coat is
NCA3285, thickness are 15 microns, and the thinnest part of tack coat differs 20 microns with the thickness in thickness.
Test：The ultrasonic wave biological identification device of embodiment 1~8 is subjected to fingerprint recognition, to observe whether it can obtain
To clearly fingermark image, the resolution ratio of the fingermark image of the ultrasonic wave biological identification device formation of embodiment 1~8 is shown in Table 1.
Table 1
| Resolution ratio (pixel per inch) | |
| Embodiment 1 | 4.0 |
| Embodiment 2 | 3.6 |
| Embodiment 3 | 3.8 |
| Embodiment 4 | 3.7 |
| Embodiment 5 | 3.6 |
| Embodiment 6 | 3.6 |
| Embodiment 7 | 3.5 |
| Embodiment 8 | 3.0 |
From table 1 it follows that the resolution ratio of the fingermark image of the ultrasonic wave biological identification device of embodiment 1~7 is
3.5 pixel per inch, and the high resolution of the fingermark image of the ultrasonic wave biological identification device of embodiment 1 up to 4.0 pixels per English
It is very little, and the resolution ratio of the fingermark image of the ultrasonic wave biological identification device of embodiment 8 is only 3.0 pixel per inch, it is clear that implement
The fingermark image of the ultrasonic wave biological identification device of example 1~7 has higher resolution ratio, the ultrasonic wave of this explanation embodiment 1~7
The fingermark image of biological identification device has higher definition.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that the common skill for this area
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (11)
- A kind of 1. ultrasonic wave biological identification device, it is characterised in that including：Thin film transistor (TFT), thickness is 195 microns~295 microns, and the thickness of the thinnest part of the thin film transistor (TFT) and thickness Thickness difference be no more than 40 microns；Piezoelectric layer, it is layered on the thin film transistor (TFT), the thickness of the piezoelectric layer is 8 microns~10 microns, and the piezoelectricity The thinnest part of layer is differed with the thickness in thickness no more than 2 microns；Conductive layer, it is layered on the piezoelectric layer, the thickness of the conductive layer is 13 microns~19 microns, and the conductive layer Thinnest part is differed with the thickness in thickness no more than 6 microns；AndAcoustic matching layer, it is layered on the conductive layer, the thickness of the acoustic matching layer is 20 microns~80 microns, and the sound Thinnest part with layer is differed with the thickness in thickness no more than 10 microns.
- 2. ultrasonic wave biological identification device according to claim 1, it is characterised in that also including cover plate, the cover plate with Side stacking of the acoustic matching layer away from the conductive layer, and the cover plate covers the acoustic matching layer away from the conduction The side of layer；The thickness of the thin film transistor (TFT) is 195 microns~235 microns, and the thickness of the cover plate is 500 microns~800 Micron；Or the thickness of the thin film transistor (TFT) is 255 microns~295 microns, the thickness of the cover plate is 350 microns~500 Micron.
- 3. ultrasonic wave biological identification device according to claim 2, it is characterised in that also leaned on including being layered in the cover plate Ink layer on the side of the nearly acoustic matching layer, the color of the ink layer is white, and the thickness of the acoustic matching layer is 20 Micron~55 microns.
- 4. ultrasonic wave biological identification device according to claim 2, it is characterised in that also leaned on including being layered in the cover plate Ink layer on the side of the nearly acoustic matching layer, the color of the ink layer is black, and the thickness of the acoustic matching layer is 45 microns~80 microns.
- 5. the ultrasonic wave biological identification device according to claim 3 or 4, it is characterised in that the thickness of the acoustic matching layer For 45 microns~55 microns.
- 6. ultrasonic wave biological identification device according to claim 2, it is characterised in that also include being located at the acoustic matching layer Tack coat between the conductive layer, the tack coat, which is fixed, bonds the acoustic matching layer and the conductive layer, the bonding The thickness of layer is 10 microns~20 microns, and the thinnest part of the tack coat is differed with the thickness in thickness no more than 10 microns.
- 7. ultrasonic wave biological identification device according to claim 1, it is characterised in that the conductive layer is silver layer.
- 8. ultrasonic wave biological identification device according to claim 1, it is characterised in that the conductive layer includes plate-like body And side wall, the plate-like body and the piezoelectricity layer stackup, the thickness of the plate-like body is 13 microns~19 microns, and described The thinnest part of plate-like body is differed with the thickness in thickness no more than 6 microns, and the side wall ring is around the edge of the plate-like body Set one week, to form an accommodating cavity, side of the side wall away from the plate-like body is fixed with the thin film transistor (TFT) to be connected Connect, so that the conductive layer and the thin film transistor (TFT) coordinate jointly houses the piezoelectric layer, wherein, the acoustic matching layer stacking On side of the plate-like body away from the piezoelectric layer.
- 9. ultrasonic wave biological identification device according to claim 8, it is characterised in that the side wall is away from the tabular sheet Also include circuit board, the circuit board formed with stage portion, the ultrasonic wave biological identification device on the outer surface of the side of body Respectively with the stage portion and the thin film transistor (TFT) bonding.
- 10. ultrasonic wave biological identification device according to claim 9, it is characterised in that also including cover plate and positioned at described Tack coat between acoustic matching layer and the conductive layer, the cover plate and side layer of the acoustic matching layer away from the conductive layer Folded, the stage portion and the thin film transistor (TFT) bonding are in the same side of the circuit board, and the circuit board is away from the film The side of transistor is spaced a distance with the cover plate.
- 11. a kind of electronic equipment, it is characterised in that know including the ultrasonic wave biological as described in claim 1~10 any one Other device.
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| CN201721165658.3U CN207182307U (en) | 2017-09-12 | 2017-09-12 | Ultrasonic wave biological identification device and electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108921074A (en) * | 2018-06-26 | 2018-11-30 | 业成科技（成都）有限公司 | Ultrasonic fingerprint identifies mould group and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108921074A (en) * | 2018-06-26 | 2018-11-30 | 业成科技（成都）有限公司 | Ultrasonic fingerprint identifies mould group and preparation method thereof |
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