CN109496085A - Cover plate assembly and its manufacturing method and electronic device - Google Patents
Cover plate assembly and its manufacturing method and electronic device Download PDFInfo
- Publication number
- CN109496085A CN109496085A CN201710818348.5A CN201710818348A CN109496085A CN 109496085 A CN109496085 A CN 109496085A CN 201710818348 A CN201710818348 A CN 201710818348A CN 109496085 A CN109496085 A CN 109496085A
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- China
- Prior art keywords
- ultrasonic sensor
- plate assembly
- cover plate
- layer
- cover board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
Abstract
The invention discloses a kind of cover plate assemblies.Cover plate assembly includes cover board, ink layer, model layer and ultrasonic sensor.Cover board includes visible area and non-visible area.Ink layer is formed in non-visible area.Model layer is arranged on ink layer and is filled in the space that visible area and ink layer limit.Ultrasonic sensor is by viscose in conjunction with side of the model layer far from cover board.Ultrasonic sensor includes faying face in conjunction with model layer and the side that self-bonding extends away from cover board direction.Viscose is covered on faying face and side.Cover plate assembly of the invention is provided with model layer and viscose; when there is external force; model layer and viscose can prevent any one of faying face, side and cover board of ultrasonic sensor to be damaged, thus the cover sheet while fingerprint recognition effect that ensure that ultrasonic sensor.In addition, the invention also discloses a kind of manufacturing method of cover plate assembly and electronic devices.
Description
Technical field
The present invention relates to fingerprint identification technology field, in particular to a kind of cover plate assembly, cover plate assembly manufacturing method and
Electronic device.
Background technique
Currently, the protective cover for the ultrasonic sensor applied in mobile phone is generally arranged at the bottom of ultrasonic sensor, and
The top of ultrasonic wave is directly contacted with display screen or cover board, and supersonic sensing device assembly is easy to be damaged, to influence to refer to
Line recognition effect.
Summary of the invention
Embodiments of the present invention provide the manufacturing method and electronic device of a kind of cover plate assembly, cover plate assembly.
The cover plate assembly of embodiment of the present invention includes:
Cover board, the cover board include visible area and non-visible area；
Ink layer, the ink layer are formed in the non-visible area；
Model layer, the model layer is arranged on the ink layer and is filled in the visible area and the ink layer limits
Space in；And
Ultrasonic sensor, the ultrasonic sensor are tied by viscose and the model layer far from the side of the cover board
Close, the ultrasonic sensor include faying face in conjunction with the model layer and from the combination away from the cover board side
To the side of extension, the viscose covers the faying face and the side.
The cover plate assembly of embodiment of the present invention sequentially forms ink layer, model layer and ultrasonic sensor on the cover board,
And viscose is covered on the faying face of ultrasonic sensor and model layer and the side of ultrasonic sensor.When there is outer masterpiece
Used time, model layer and viscose can prevent any one of faying face, side and cover board of ultrasonic sensor from being damaged
It is bad, thus the cover sheet while fingerprint recognition effect that ensure that ultrasonic sensor.
In some embodiments, the model layer includes hot-setting adhesive (DAF glue).
Hot-setting adhesive curing rate is fast, and bubble is few, and the gel strength after solidification is high, and model layer can be made to have certain intensity.
In some embodiments, the ultrasonic sensor further includes the abutted surface opposite with the faying face, described
Cover plate assembly further includes foam, and the foam is arranged on the abutted surface.
Foam can work as a buffer, for protecting the abutted surface of ultrasonic sensor.Foam can also reflect ultrasonic wave, and one
Aspect enables object to be detected to receive more ultrasonic waves to enhance the fingerprint recognition effect of ultrasonic sensor, another party's papula
Cotton can prevent ultrasonic signal from interfering to the work of other electronic components of electronic device inside.
In some embodiments, the foam is bonded on the abutted surface by double-sided adhesive.
Double-sided adhesive can pull ultrasonic sensor to avoid foam in liquid glue solidification process, keep impression smaller, just
In heavy industry.
In some embodiments, the cover plate assembly further includes shielded layer, and the shielded layer setting is remote in the foam
Side from the ultrasonic sensor, the shielding layer grounding is to shield electromagnetic signal.
The shielded layer being arranged on ultrasonic sensor can be effectively prevented the electric field or magnetic of ultrasonic sensor generation
Other electronic components interfere to electronic device inside for field or electromagnetic field, to ensure the essence of ultrasonic sensor fingerprint recognition
Exactness and sensitivity, to promote user experience.
In some embodiments, the shielded layer by pressure sensitive adhesive (Pressure Sensitive Adhesive,
PSA it) is bonded on the foam.
Pressure sensitive adhesive solidification temperature is low, and viscosity is good, temperature tolerance, so that shielded layer is easy bonding, bonding efficiency is high, and not
It is easily peeled off.
In some embodiments, the ultrasonic sensor includes:
Substrate；
Multiple pixel electrodes, multiple pixel electrode production are on the substrate and in array distribution；
Piezoelectric element, the piezoelectric element are arranged on the substrate and cover multiple pixel electrodes, the piezoelectricity
Element is used to emit ultrasonic wave and generates electric signal, multiple pixel electrodes after the ultrasonic wave for receiving object reflection to be detected
For receiving the electric signal；
Conductive electrode, the conductive electrode are arranged on the piezoelectric element, and the piezoelectric element is located at the pixel electricity
Between pole and the conductive electrode；And
The processing chip connecting with multiple pixel electrodes, the processing chip is for handling the electric signal to be formed
The ultrasonograph of the object to be detected.
Each pixel electrode of the ultrasonic sensor of embodiment of the present invention can determine based on the received electrical signal
The electric signal that position and piezoelectric element of the object pressing to be detected on ultrasonic sensor generate on the position, to reduce
Processing chip data volume to be treated improves the recognition efficiency of ultrasonic sensor.
In some embodiments, the membrane structure that the ultrasonic sensor is integrated.
In this way, convenient for manufacture cover plate assembly.
In some embodiments, the piezoelectric element is layer structure whole made of piezoelectric material；Or
The piezoelectric element includes multiple piezo columns, and multiple piezo column settings are on the substrate and in array point
Cloth, multiple piezo columns are corresponding with multiple pixel electrodes, and each piezo column covers the corresponding pixel electrode.
Piezoelectric element is convenient for the manufacture of piezoelectric element in whole layer structure and manufacturing cost is lower.Piezoelectric element includes
Piezo column corresponding with multiple pixel electrodes, in this way, the electric signal that piezoelectric element generates under ultrasonic wave effect is more acurrate, in turn
It is more acurrate to handle the ultrasonograph that the chip processing signal is formed.
The electronic device of embodiment of the present invention, comprising:
Shell；And
Cover plate assembly described in any of the above-described embodiment, the cover plate assembly setting is on the housing.
The cover plate assembly of embodiment of the present invention sequentially forms ink layer, model layer and ultrasonic sensor on the cover board,
And viscose is covered on the faying face of ultrasonic sensor and model layer and the side of ultrasonic sensor.When there is outer masterpiece
Used time, model layer and viscose can prevent any one of faying face, side and cover board of ultrasonic sensor from being damaged
It is bad, thus the cover sheet while fingerprint recognition effect that ensure that ultrasonic sensor.
The manufacturing method of the cover plate assembly of embodiment of the present invention, comprising:
Ink layer is formed in the non-visible area of cover board；
Model layer is formed on the ink layer, and make the model layer be filled in the cover board visible area and the oil
In the space that layer of ink limits；
There is provided ultrasonic sensor, the ultrasonic sensor include faying face and from the combination away from the knot
The side that conjunction face direction extends；And
By viscose by the faying face of the ultrasonic sensor and the model layer far from the faying face one
Side combines, and the viscose is made to cover the faying face and the side.
The cover plate assembly of embodiment of the present invention sequentially forms ink layer, model layer and ultrasonic sensor on the cover board,
And viscose is covered on the faying face of ultrasonic sensor and model layer and the side of ultrasonic sensor.When there is outer masterpiece
Used time, model layer and viscose can prevent any one of faying face, side and cover board of ultrasonic sensor from being damaged
It is bad, thus the cover sheet while fingerprint recognition effect that ensure that ultrasonic sensor.
In some embodiments, the ultrasonic sensor further includes the abutted surface opposite with the faying face, described
Manufacturing method further include:
The foam is bonded on the abutted surface by double-sided adhesive.
Foam can work as a buffer, for protecting the abutted surface of ultrasonic sensor.Foam can also reflect ultrasonic wave, and one
Aspect enables object to be detected to receive more ultrasonic waves to enhance the fingerprint recognition effect of ultrasonic sensor, another party's papula
Cotton can prevent ultrasonic signal from interfering to the work of other electronic components of electronic device inside.In addition, using double-sided adhesive
Foam is bonded on abutted surface, ultrasonic sensor can be pullled to avoid foam in liquid glue solidification process, make impression
It is smaller, it is convenient for heavy industry.
In some embodiments, the manufacturing method further include:
Shielded layer is bonded in side of the foam far from the ultrasonic sensor by pressure sensitive adhesive；With
Make the shielding layer grounding.
Shielded layer is bonded on ultrasonic sensor, and is grounded, on the one hand, shielded layer can be effectively prevented ultrasonic wave
To electronic device inside, other electronic components interfere the electric field or magnetic field or electromagnetic field that sensor generates, to ensure to surpass
The accuracy and sensitivity of sonic sensor fingerprint recognition, to promote user experience.On the other hand, pressure sensitive adhesive solidification temperature
Low, viscosity is good, temperature tolerance, so that shielded layer is easy bonding, bonding efficiency is high, and does not allow easily peelable.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partially will be from following
Description in become obvious, or the practice of embodiment through the invention is recognized.
Detailed description of the invention
Above-mentioned and/or additional aspect and advantage of the invention is from combining in description of the following accompanying drawings to embodiment by change
It obtains obviously and is readily appreciated that, in which:
Fig. 1 is the flow diagram of the manufacturing method of certain embodiments of the present invention；
Fig. 2 is the process schematic representation of the manufacturing method of certain embodiments of the present invention；
Fig. 3 is the structural schematic diagram of the cover board of certain embodiments of the present invention；
Fig. 4 is the cross-sectional view of the cover plate assembly of certain embodiments of the present invention；
Fig. 5 is the flow diagram of the manufacturing method of certain embodiments of the present invention；
Fig. 6 is the structural schematic diagram of the shielded layer of certain embodiments of the present invention；
Fig. 7 is the cross-sectional view of the cover plate assembly of certain embodiments of the present invention；
Fig. 8 is the cross-sectional view of the cover plate assembly of certain embodiments of the present invention；
Fig. 9 is the floor map of the electronic device of certain embodiments of the present invention；
Figure 10 is the cross-sectional view of the ultrasonic sensor of certain embodiments of the present invention；
Figure 11 is the decomposition diagram of the ultrasonic sensor of certain embodiments of the present invention；
Figure 12 is the cross-sectional view of the ultrasonic sensor of certain embodiments of the present invention；
Figure 13 is the decomposition diagram of the ultrasonic sensor of certain embodiments of the present invention；
Figure 14 is the decomposition diagram of the ultrasonic sensor of certain embodiments of the present invention；
Figure 15 is the cross-sectional view of the ultrasonic sensor of certain embodiments of the present invention；
Figure 16 is the cross-sectional view of the ultrasonic sensor of certain embodiments of the present invention；
Figure 17 is the cross-sectional view of the ultrasonic sensor of certain embodiments of the present invention；
Figure 18 is the decomposition diagram of the ultrasonic sensor of certain embodiments of the present invention；
Figure 19 is the cross-sectional view of the ultrasonic sensor of certain embodiments of the present invention.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of embodiment is shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of
The description present invention and simplified description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with spy
Fixed orientation construction and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.
" first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.In this hair
In bright description, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected or can mutually communicate；It can be directly connected, it can also be by between intermediary
It connects connected, can be the connection inside two elements or the interaction relationship of two elements.For the ordinary skill of this field
For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
Fig. 1 and Fig. 2 is please referred to, the manufacturing method of the cover plate assembly 200 of embodiment of the present invention includes:
S10: ink layer 220 is formed on the non-visible area 210b of cover board 210；
S20: forming model layer 230 on ink layer 220, and model layer 230 is made to be filled in the visible area 210a of cover board 210
In the space 210c limited with ink layer 220；
S30: provide ultrasonic sensor 100, ultrasonic sensor 100 include faying face 100a and self-bonding face 100a to
The side 100b extended far from the direction faying face 100a；And
S40: by viscose 240 by the faying face 100a of ultrasonic sensor 100 and model layer 230 far from cover board 210
Side combines, and viscose 240 is made to cover faying face 100a and side 100b.
The manufacturing method of the cover plate assembly 200 of embodiment of the present invention specifically: first in the non-visible area 210b of cover board 210
Upper formation ink layer 220.The position of ink layer 220 is corresponding with the position of non-visible area 210b.Then it is formed on ink layer 220
Model layer 230.In the space 210c that model layer 230 is filled in the visible area 210a of cover board 210 and ink layer 220 limits.It provides
Ultrasonic sensor 100, ultrasonic sensor 100 faying face 100a and self-bonding face 100a to far from the faying face side 100a
Viscose 240 is formed on the side 100b of extension.Then by viscose 240 by the faying face 100a of ultrasonic sensor 100 with
Model layer 230 is combined far from the side of faying face 100a.
Fig. 2 and Fig. 4 are please referred to, the manufacturing method of embodiment of the present invention can be used for manufacturing the cover board of embodiment of the present invention
Component 200.Cover plate assembly 200 includes cover board 210, ink layer 220, model layer 230 and ultrasonic sensor 100.Cover board 210 wraps
Include visible area 210a and non-visible area 210b.Ink layer 220 is formed on the non-visible area 210b of cover board 210.Model layer 230 is set
It sets on ink layer 220 and is filled in the space 210c that visible area 210a and ink layer 220 limit.Ultrasonic sensor 100
Through viscose 240 in conjunction with side of the model layer 230 far from cover board 210.Ultrasonic sensor 100 includes and 230 knot of model layer
The side 100b that the faying face 100a and self-bonding face 100a of conjunction extend to separate 210 direction of cover board.Viscose 240 covers faying face
100a and side 100b.
The working principle of the cover plate assembly 200 of embodiment of the present invention specifically: when object to be detected (including finger, test
Template etc. is illustrated so that object to be detected is " finger " as an example below) when being placed on cover plate assembly 200, ultrasonic sensor
The ultrasonic waves of 100 transmittings sequentially pass through model layer 230 and cover board 210, and after handling digital reflex, again pass through cover board 210 and mould
Type layer 230 is passed back to ultrasonic sensor 100.Ultrasonic sensor 100 is believed according to the fingerprint of the signal acquisition finger received
Breath.Ultrasonic sensor 100 in the cover plate assembly 200 of embodiment of the present invention can be applied to but be not limited to unlock, file adds
The application scenarios such as close, payment verification, authentication.
In some embodiments, the material of cover board 210 can be glass, sapphire, polyvinyl chloride (Polyvinyl
Chloride, PVC) in any one.
Referring to Fig. 3, the cover board 210 of embodiment of the present invention includes visible area 210a and non-visible area 210b.Ink layer
220 are formed on non-visible area 210b.Ink layer 220 can play the role of shading and decoration.It can be set on ink layer 220
Conductive electrode.In some embodiments, non-visible area 210b is arranged around visible area 210a.Therefore, step S10 is in cover board
It is the position the non-visible area 210b formation ink layer for being looped around visible area 210a that 210 non-visible area 210b, which forms ink layer 220,
220。
Referring to Fig. 4, viscose 240 can be liquid optical cement.Ultrasonic sensor 100 is bonded in by viscose 240
Side with model layer 230 far from cover board 210.Moreover, because viscose 240 is also covered on the side of ultrasonic sensor 100
On 100b, protect the side 100b of ultrasonic sensor 100 also.
In some embodiments, model layer 230 includes hot-setting adhesive.
Hot-setting adhesive curing rate is fast, and bubble is few, and the gel strength after solidification is high, and model layer 230 can be made to have centainly strong
Degree.In this way, by model layer 230 is filled in the visible area 210a of cover board 210 and ink layer 22 limits space 210c, it can be to lid
Plate 210 provides enough support strengths.When having external force when on cover board 210, model layer 230 can play protection ultrasonic wave
The effect of sensor 100.
Referring to Figure 4 together and Fig. 5, in some embodiments, ultrasonic sensor 100 further includes and faying face 100a
Opposite abutted surface 100c, manufacturing method further include:
S50: foam 250 is bonded on abutted surface 100c by double-sided adhesive 260.
The manufacturing method of the cover plate assembly 200 of embodiment of the present invention can be executed by serial number, that is, first carry out step S40,
Then step S50 is executed again.In other words, first in the faying face 100a of ultrasonic sensor 100 and self-bonding face 100a to remote
Viscose 240 is formed from the side 100b that 210 direction of cover board extends.Then pass through viscose 240 for the combination of ultrasonic sensor 100
Face 100a is in conjunction with side of the model layer 230 far from cover board 210.Then again on the abutted surface 100c of ultrasonic sensor 100
Form double-sided adhesive 260.Foam 250 is bonded on the abutted surface of ultrasonic sensor 100 finally by double-sided adhesive 260.In this way,
Ultrasonic sensor 100 and foam 250 are successively bonded in model layer 230, laminating step is simple, it is not easy to patch mistakes and omissions patch occur
The case where foam 250.
In some embodiments, step S50 can also be first carried out, then executes step S40 again.In other words, first exist
Double-sided adhesive 260 is formed on the abutted surface 100c of ultrasonic sensor 100.Then foam 250 is bonded in by double-sided adhesive 260 super
On the abutted surface 100c of sonic sensor 100.Then in the faying face 100a for the ultrasonic sensor 100 for being pasted with foam 250
And self-bonding face 100a forms viscose 240 to the side 100b extended far from 210 direction of cover board.It will surpass finally by viscose 240
The faying face 100a of sonic sensor 100 is in conjunction with side of the model layer 230 far from cover board 210.In this way, foam will be pasted with
250 ultrasonic sensor 100 is directly bonded in model layer 230 by viscose 240, can be also uncured to avoid viscose 240,
It will carry out the case where attaching foam 250.
The manufacturing method of embodiment of the present invention can be used for manufacturing the cover plate assembly 200 of embodiment of the present invention.Cover board group
Ultrasonic sensor also 100 in part 200 further comprises the abutted surface 100c opposite with faying face 100a, cover plate assembly 200
It further include foam 250, foam 250 is arranged on abutted surface 100c.
Foam 250 can work as a buffer.When cover plate assembly 200 is hit or when unexpected external force, foam
The 250 abutted surface 100c that can protect ultrasonic sensor 100 ensure that cover board so that ultrasonic sensor 100 is hardly damaged
The service life of component 200 and ultrasonic sensor 100.In addition, foam 250 can also reflect ultrasonic wave.Ultrasonic sensor
The ultrasonic wave of 100 transmittings is while sequentially passing through filled layer 230 and cover board 210, the also reachable foam of some ultrasonic wave
250.Foam 250 is formed with loose stomata, can be by the ultrasonic reflections of outgoing to finger or the ultrasound that will be reflected from finger
Ultrasonic sensor 100 is returned in wave reflection.On the one hand, so that object to be detected is received more ultrasonic waves, pass through cover board 210 and mould
The ultrasonic wave that type layer 230 is passed back to also accordingly increases, to enhance the fingerprint recognition effect of ultrasonic sensor 100；Another party
Face, foam 250 prevent ultrasonic signal from interfering to the work of other electronic components of electronic device inside.
Double-sided adhesive 260 can make to press to avoid the pullling to ultrasonic sensor 100 of foam 250 in liquid glue solidification process
Trace is smaller, is convenient for heavy industry.
Referring to Fig. 5, the manufacturing method of cover plate assembly 200 further include:
S60: shielded layer 270 is bonded in by side of the foam 250 far from ultrasonic sensor 100 by pressure sensitive adhesive 280；And
S70: it is grounded shielded layer 270.
Shielded layer 270 is bonded on foam 250 by pressure sensitive adhesive 280, so that foam 250 is arranged in ultrasonic sensor
Between 100 and shielded layer 270.Shielded layer 270 is grounded to shield electromagnetic signal.Shielding on ultrasonic sensor 100 is set
Layer 270 can be effectively prevented the generation of ultrasonic sensor 100 electric field or magnetic field or electromagnetic field to electronic device inside other
Electronic component interferes, to ensure the accuracy and sensitivity of 100 fingerprint recognition of ultrasonic sensor, to promote user
Experience.Pressure sensitive adhesive 280 is suitable for all kinds of conductive coppers, aluminum foil and adhesive tape coating process.Preferably, conductive pressure sensitive adhesive 280 is more suitable for
On the device for shielding electromagnetic wave.
Production method may is that in side of the foam 250 far from ultrasonic sensor 100, shielded layer 270 be passed through pressure-sensitive
Glue 280 is bonded on foam 250, is then grounded shielded layer 270.
Please continue to refer to Fig. 4, in some embodiments, the manufacturing method of embodiment of the present invention can be used for manufacturing this hair
The cover plate assembly 200 of bright embodiment.Cover plate assembly 200 further includes shielded layer 270.The setting of shielded layer 270 is separate in foam 250
The side of ultrasonic sensor 100.Shielded layer 270 is grounded to shield electromagnetic signal.
In some embodiments, shielded layer 270 by pressure sensitive adhesive 280 (Pressure Sensitive Adhesive,
PSA it) is bonded on foam 250.
Sheet or layered, transparent metal oxide materials can be selected in shielded layer 270.Transparent metal oxide material can be
At least one of tin indium oxide (Indium tin oxide, ITO), transparent polymer material, graphene or carbon nanotube.Screen
It covers layer 270 and also can be selected and conductive grid is made by opaque conductive metal or alloy.For example, shielded layer 270 can for gold, silver,
Conductive grid made of the nano material of any one in copper, aluminium, zinc, plating gold and silver or alloy both at least.Conductive grid
Line width can be tens microns to tens nanometers.Referring to Fig. 6, being the knot of the shielded layer 270 of certain embodiments of the present invention
Structure schematic diagram.In the present embodiment, shielded layer 270 is grid-shaped using being made of copper.It should be pointed out that mentioned here
Shielding electromagnetic signal includes at least one of shielding electric signal, magnetic signal or electromagnetic signal.It is arranged in ultrasonic sensor 100
On the electric field that can be effectively prevented the generation of ultrasonic sensor 100 of shielded layer 270 or magnetic field or electromagnetic field to electronic device
Other internal electronic components of 300 (shown in Fig. 9) interfere, to ensure the accuracy of 100 fingerprint recognition of ultrasonic sensor
And sensitivity, to promote user experience.
In some embodiments, referring to Fig. 7, viscose 240 cover region in addition to ultrasonic sensor 100 combination
Face 100a and side 100b can also include the side 250a of foam 250.In this way, foam 250 can further seal ultrasonic wave
Sensor 100.
In some embodiments, referring to Fig. 8, viscose 240 cover region in addition to ultrasonic sensor 100 combination
The side 250a of face 100a, side 100b and foam 250 can also include the side 270a of shielded layer 270.So, on the one hand,
The electric field or magnetic field or electromagnetic field that shielded layer 270 can further prevent ultrasonic sensor 100 to generate are to electronic device inside
Other electronic components interfere, to ensure the accuracy and sensitivity of 100 fingerprint recognition of ultrasonic sensor, to be promoted
User experience.On the other hand, 280 solidification temperature of pressure sensitive adhesive is low, and viscosity is good, temperature tolerance, so that shielded layer 270 is easy to glue
Knot, bonding efficiency is high, and does not allow easily peelable.
Referring to Fig. 9, the cover plate assembly 200 of embodiment of the present invention can be applied to the electronics dress of embodiment of the present invention
Set 300.Electronic device 300 includes the cover plate assembly 200 of shell 301 and any of the above-described embodiment.The setting of cover plate assembly 200 exists
On shell 301.
Specifically, electronic device 300 include but is not limited to mobile phone, tablet computer, E-book reader, wearable device,
The electronic device 300 of the usable ultrasonic fingerprint identification function such as remote controler, entrance guard device, ATM machine, automatic navigator.
For example, when electronic device 300 is mobile phone, the ultrasonic sensor 100 in cover plate assembly 200 can be used for unlocking,
The application scenarios such as file encryption, payment verification, authentication.
Please continue to refer to Fig. 4, in some embodiments, electronic device can also include display screen 290.Display screen 290
It can be set in side of the ultrasonic sensor 100 far from cover board 210.The shape of cover board 210 can be with the shape of display screen 290
Match.When side of the ultrasonic sensor 100 far from cover board 210 is arranged in display screen 290, due on cover plate assembly 200
Model layer 230 is made of the high hot-setting adhesive of light transmittance, and the material of ultrasonic sensor 100 is (such as using the high base of light transmittance
Material material, substrate material can be glass or polyimide film material) light transmission is preferable, it will not influence the display of display screen 290
Effect.The material of shielded layer 270 preferably selects sheet or layered, transparent metal oxide materials.Transparent metal oxide material
Can in tin indium oxide (Indium tin oxide, ITO), transparent polymer material, graphene or carbon nanotube at least
It is a kind of.Therefore, shielded layer 270 will not influence the display effect of display screen 290.
In some embodiments, when shielded layer 270 is the conductive grid made of opaque conductive metal or alloy,
Electronic device 300 can be not provided with shielded layer 270.
Display screen 290 can be with liquid crystal display (Liquid Crystal Display, LCD).Liquid crystal display is two
Liquid crystal cell is placed in the parallel glass substrate of piece, and TFT (thin film transistor (TFT)) is set on lower baseplate glass, is set on upper substrate glass
Set colored filter.Liquid crystal display is to be changed by the signal on TFT with voltage to control the rotation direction of liquid crystal molecule, from
And reaches whether controlling the outgoing of each pixel polarised light and reach display purpose.Liquid crystal display mature production technology, cost
It is lower, it can be widely used on electronic device 300.
In some embodiments, display screen includes Organic Light Emitting Diode (Organic Light-Emitting
Diode, OLED) display screen.
Specifically, OLED display screen includes active-matrix Organic Light Emitting Diode (Active Matrix Organic
Light Emitting Diode, AMOLED) display screen and passive-matrix Organic Light Emitting Diode (Passive Matrix
Organic Light Emitting Diode, PMOLED) display screen.Preferably, display screen 290 is AMOLED display screen.
AMOLED display screen has installed thin film transistor (TFT) and capacitor layers additional on each light emitting diode to control Organic Light Emitting Diode
Brightness, light emitting control, and AMOLED display screen stable luminescence, thickness more rapidly and more accurately are carried out to pixel to realize
It is thin, display effect is good, facilitate promoted user experience.
In some embodiments, display screen 290 includes flexible OLED display.Flexible OLED display is flexible, function
Consume it is low, in this way, helping to promote user experience convenient for electronic device 300 is made thinner.
Figure 10 and Figure 11 is please referred to, the ultrasonic sensor 100 of embodiment of the present invention includes substrate 10, multiple pixels electricity
Pole 20, piezoelectric element 30, conductive electrode 40 and processing chip 50.Multiple pixel electrodes 20 are produced on substrate 10 and in arrays point
Cloth.Piezoelectric element 30 is arranged on substrate 10 and covers multiple pixel electrodes 20, piezoelectric element 30 for emit ultrasonic wave and
Electric signal is generated after receiving the ultrasonic wave of object reflection to be detected, multiple pixel electrodes 20 are for receiving the electric signal.Conductive electricity
Pole 40 is arranged on piezoelectric element 30, and piezoelectric element 30 is between pixel electrode 20 and conductive electrode 40.Handle chip 50 with
Multiple pixel electrodes 20 connect, and processing chip 50 is for handling the electric signal to form the ultrasonograph of object to be detected.Ultrasound
The membrane structure that wave sensor 100 can be integrated.
It should be noted that the production in " multiple pixel electrodes 20 are produced on substrate 10 " mentioned in the present invention includes
Pixel electrode 20 is directly produced on base by techniques such as plated film, light blockage coating/development/exposure, etching, removal photoresist, annealing
On material 10." layer structure " mentioned in the present invention is whole piece structure, alternatively referred to as " laminated structure ".
Object to be detected can be finger, test template etc..When processing chip 50 controls conductive electrode 40 and pixel electrode 20
When being powered so as to be applied with high frequency voltage (such as: frequency is greater than the voltage of 20KHZ) on conductive electrode 40 and pixel electrode 20, pressure
Electric device 30 generates ultrasonic wave under the action of high frequency voltage and launches outward ultrasonic wave；If finger is placed on cover plate assembly 200
On, then finger can reflect the ultrasonic wave of the transmitting of piezoelectric element 30 and transmit back to piezoelectric element 30, due on finger there are fingerprint,
The finger that thus each position receives on piezoelectric element 30 reflect ultrasonic wave it is not exactly the same, thus each position of piezoelectric element 30
It is also not exactly the same to set the electric signal (or piezoelectric signal) generated under ultrasonic wave effect, each position generation on piezoelectric element 30
Electric signal the fingerprint pattern of finger can be collectively formed；Processing chip 50 controls multiple pixel electrodes 20 and receives piezoelectric element 30
Each position on the electric signal that generates, which is transmitted on processing chip 50 by multiple pixel electrodes 20, handles core
Piece 50 handles the electric signal to form the fingerprint pattern of finger.
Each pixel electrode 20 of the ultrasonic sensor 100 of embodiment of the present invention can be based on the received electrical signal
Determine the electric signal that position and piezoelectric element 30 of the finger pressing on ultrasonic sensor 100 generate on the position, thus
Reduce the processing data volume to be treated of chip 50, improve the recognition efficiency of ultrasonic sensor 100.
The material of substrate 10 is glass or Kapton.The substrate 10 made of glass or polyimide film material
Cost is relatively low, translucency is preferable, therefore, cost is relatively low for the ultrasonic sensor 100 made of the substrate 10, translucency compared with
It is good.The integral color that ultrasonic sensor 100 is able to maintain cover board 210 unanimously keeps cover board 210 more beautiful.
Multiple pixel electrodes 20 are produced on substrate 10 and in array distributions, that is to say, that multiple pixel electrodes 20 include
The pixel electrode 20 and the spaced pixel electrode 20 of multiple row of higher order interlace setting.The material of pixel electrode 20 is tin indium oxide
(Indium tin oxide, ITO), nano-silver thread (Agnanowire), metal grill (metal mesh), carbon nanotubes and
Any one in graphene (Graphene), the pixel electrode 20 made of above-mentioned material have preferable toughness and light transmission
Property, so that the ultrasonic sensor 100 made of the pixel electrode 20 has preferable toughness and translucency.Pixel electrode 20
Light transmittance is greater than 90%, so that ultrasonic sensor 100 made of the pixel electrode 20 is had preferable translucency, thus ultrasonic wave
Sensor 100 will not influence the display of display screen 290, while ultrasonic sensor 100 is able to maintain the integral color of cover board 210
Unanimously keep cover board 210 more beautiful.Pixel electrode 20 can be used for receiving electric signal, and each pixel electrode 20 can be according to reception
To electric signal determine a position of cover plate assembly 200 (or ultrasonic sensor 100), pixel electrode 20 is on substrate 10
The acquisition precision of density and ultrasonic sensor 100 is positively correlated, and the density of pixel electrode 20 of the invention can be such that ultrasonic wave passes
Sensor 100 detects the fingermark image of object to be detected.
Piezoelectric element 30 is arranged on substrate 10 and covers multiple pixel electrodes 20.Piezoelectric element 30 is made of piezoelectric material
Whole laminated structure, the shape of piezoelectric element 30 and the shape of substrate 10 match.The material of piezoelectric element 30 is poly- inclined
Vinyl fluoride (Polyvinylidene fluoride, PVDF) makes since Kynoar has preferable toughness and translucency
Piezoelectric element 30 has preferable flexibility and translucency, and the flexibility and translucency of ultrasonic sensor 100 are also preferable at this time.
Piezoelectric element 30 can generate and to the luminous of cover board 210 high frequency voltage (such as: frequency is greater than the voltage of 20KHZ) effect is lower
Direction emits ultrasonic wave.After piezoelectric element 30 receives the ultrasonic wave of object reflection to be detected, piezoelectric element 30 is made in ultrasonic wave
It can be generated under electric signal (or piezoelectric signal), object to be detected can be finger, test template etc..
Side of the piezoelectric element 30 far from pixel electrode 20 is arranged in conductive electrode 40, that is to say, that piezoelectric element 30
Between pixel electrode 20 and conductive electrode 40.Conductive electrode 40 is layer structure (i.e. sheet whole made of conductive material
Structure), the shape of conductive electrode 40 and the shape of piezoelectric element 30 match.The material of conductive electrode 40 is tin indium oxide, receives
Rice silver wire, metal grill, any one in carbon nanotubes and graphene.The light transmittance of conductive electrode 40 is greater than 90%.It leads
Electrode 40 and pixel electrode 20 can apply high frequency voltage to piezoelectric element 30 after leading to high frequency voltage, to make piezoelectric element 30
Generate ultrasonic wave.Conductive electrode 40 and pixel electrode 20 can also receive the electric signal of the generation of piezoelectric element 30.
Processing chip 50 is all connected with multiple pixel electrodes 20 and conductive electrode 40.Processing chip 50, which can be used for controlling, leads
The energization of electrode 40 and pixel electrode 20.It is connected to high frequency voltage for example, processing chip 50 can control conductive electrode 40 and controls
Pixel electrode 20 processed is grounded, so that piezoelectric element 30 is applied high frequency voltage, to make piezoelectric element 30 generate and launch outward
Ultrasonic wave.Processing chip 50 piezoelectric signal that also controllable pixels electrode 20 and conductive electrode 40 generate piezoelectric element 30 transmits
Onto processing chip 50.Processing chip 50 is also used to handle the electric signal of the generation of piezoelectric element 30 to form the ultrasound of object to be detected
Wave image.Processing chip 50 can be set also can be set outside substrate 10 on substrate 10.
When processing chip 50 controls conductive electrode 40 and the energization of pixel electrode 20 so that conductive electrode 40 and pixel electrode 20
On be applied with high frequency voltage (such as: frequency be greater than 20KHZ voltage) when, piezoelectric element 30 generates under the action of high frequency voltage
Ultrasonic wave simultaneously launches outward ultrasonic wave；If finger is placed on cover plate assembly 200, finger can reflect the transmitting of piezoelectric element 30
Ultrasonic wave is simultaneously transmitted back to piezoelectric element 30, and since there are fingerprints on finger, thus each position receives on piezoelectric element 30
Finger reflect ultrasonic wave it is not exactly the same, thus each position of piezoelectric element 30 electric signal for generating under ultrasonic wave effect
(or piezoelectric signal) is also not exactly the same, and the finger of finger can be collectively formed in the electric signal that each position generates on piezoelectric element 30
Line pattern；Processing chip 50 controls multiple pixel electrodes 20 and receives the electric signal generated on each positions of piezoelectric elements 30,
The electric signal is transmitted on processing chip 50 by multiple pixel electrodes 20, and processing chip 50 handles the electric signal to form finger
Fingerprint pattern.
The electronic device 300 and cover plate assembly 200 of embodiment of the present invention also have the advantages that first, ultrasound
The membrane structure that wave sensor 100 is integrated, convenient for manufacture cover plate assembly 200.
Second, multiple pixel electrodes 20 are produced on substrate 10, convenient for the production higher pixel electrode 20 of precision, to mention
Rise the precision that ultrasonic sensor 100 identifies fingerprint.
Second, the light transmittance of pixel electrode 20 and conductive electrode 40 is all larger than 90%, makes to surpass made of the pixel electrode 20
Sonic sensor 100 has preferable translucency, so that ultrasonic sensor 100 will not influence the display of display screen 290, simultaneously
The integral color that ultrasonic sensor 100 is able to maintain cover board 210 unanimously keeps cover board 210 more beautiful.
Third, conductive electrode 40 control the energization of conductive electrode 40 convenient for processing chip 50, together in whole laminated structure
When make that conductive electrode 40 is easy to manufacture and cost of manufacture is lower.
4th, the material of pixel electrode 20 and conductive electrode 40 is tin indium oxide, nano-silver thread, metal grill, nanometer
Any one in carbon pipe and graphene, pixel electrode 20 and conductive electrode 40 made of above-mentioned material all have preferably
Toughness and translucency, so that the ultrasonic sensor 100 made of the pixel electrode 20 and conductive electrode 40 is with preferable tough
Property and translucency；The integral color that ultrasonic sensor 100 is capable of cover board 210 unanimously keeps cover board 210 more beautiful.
5th, piezoelectric element 30 is convenient for the manufacture of piezoelectric element 30 in whole layer structure and manufacturing cost is lower.
Figure 12 and Figure 13 is please referred to, in some embodiments, the piezoelectric element 30 of above embodiment includes multiple pressures
Electric column 32 and the insulating layer 34 being filled between multiple piezo columns 32.Multiple piezo columns 32 are arranged on substrate 10 and in arrays point
Cloth, multiple piezo columns 32 are corresponding with multiple pixel electrodes 20, and each piezo column 32 covers corresponding pixel electrode 20.Due to piezoelectricity
32 array of multiple piezo columns setting on element 30, therefore the electrical property that each piezo column 32 is generated by adjacent piezo column 32 is dry
It disturbs and vibration interference is smaller, thus compared to the whole laminated structure being made out of a piezoelectric material, the piezoelectricity member of present embodiment
The electric signal that part 30 generates under ultrasonic wave effect is more acurrate, and then handles chip 50 and handle the ultrasonograph that the signal is formed
It is more acurrate.The material of piezo column 32 is Kynoar.The material of insulating layer 34 can be epoxy resin.Due to epoxy resin pair
The surface of metal and nonmetallic materials has excellent adhesive strength, and dielectric properties are good, and deformation retract rate is small, and product size is steady
Qualitative good, hardness is high, and flexibility is preferable, the features such as to alkali and most of solvent-stable.Therefore, insulating layer 34 uses epoxy resin
As filled media, convenient for encapsulation piezo column 32 and make the structure of piezoelectric element 30 more stable.
Figure 14 is please referred to, in some embodiments, multiple pixel circuits 12 in array distribution are formed on substrate 10
And a plurality of conducting wire 14 corresponding with multiple pixel circuits 12, multiple pixel circuits 12 are corresponding with multiple pixel electrodes 20, each picture
Plain circuit 12 is connected with corresponding pixel electrode 20, and every conducting wire 14 is for connecting corresponding pixel circuit 12 and processing chip
50.Pixel circuit 12 is arranged between substrate 10 and pixel electrode 20, and in substrate 10 and pixel circuit can be set in conducting wire 14
On 12 the same side.In this way, convenient for the production of pixel circuit 12 and conducting wire 14, and connect convenient for pixel electrode 20 and processing chip 50
It connects.In other embodiments, conducting wire 14 also can be set on the opposite side with pixel circuit 12 of substrate 10.
Figure 15 is please referred to, in some embodiments, the ultrasonic sensor 100 of above embodiment further includes connection electricity
Pole 60 and lead 70.Connection electrode 60 is arranged in side of the substrate 10 far from multiple pixel electrodes 20 and connects with processing chip 50
It connects.Pixel electrode 20 is connected to connection electrode 60 by lead 70, and conductive electrode 40 is connected to connection electrode 60 by lead 70.
Lead 70 includes a plurality of pixel electrode lead 72 connecting with pixel electrode 20, every pixel electrode lead 72 respectively with a picture
Plain electrode 20 connects.Lead 70 further includes the conductive electrode lead 74 being correspondingly connected with conductive electrode 40, when conductive electrode 40 is
When the layer structure of entirety, conductive electrode lead 74 is one；When conductive electrode 40 is a plurality of spaced strip structure
When conductive electrode 40, the quantity of conductive electrode lead 74 and the quantity of conductive electrode 40 of strip structure are consistent.Present embodiment
By setting lead 70 and connection electrode 60, it is electrically connected respectively with processing chip 50 convenient for pixel electrode 20 with conductive electrode 40.
Please refer to Figure 16, in some embodiments, the conductive electrode 40 of above embodiment include layer structure 42 and
The extended structure 44 each extended over from the both ends of layer structure 42, layer structure 42 and extended structure 44 wrap piezoelectricity member jointly
Part 30.Extended structure 44 can integrally extend outward to form for the edge of layer structure 42, and extended structure 44 can be stratiform knot
The a part at the edge of structure 42 extends outward to form.Processing chip 50 is electrically connected by extended structure 44 with conductive electrode 40.Such as
This, is electrically connected convenient for processing chip 50 with conductive electrode 40 by setting extended structure 44.
Figure 17 and Figure 18 is please referred to, in some embodiments, the conductive electrode 40 of above embodiment includes multiple
Every the conductive electrode 40 of the strip structure of setting, the conductive electrode 40 of each strip structure and the pixel electrode 20 in same row are right
It answers.In other embodiments, the conductive electrode 40 of each strip structure is corresponding with the pixel electrode 20 in same a line.Pixel electricity
Pole 20 is corresponding with the conductive electrode 40 of strip structure to apply height convenient for pixel electrode 20 and conductive electrode 40 on piezoelectric element 30
Frequency voltage (such as: frequency is greater than the voltage of 20KHZ), while being used for convenient for pixel electrode 20 and conductive electrode 40 by piezoelectric element
30 electric signals generated under piezoelectric effect are transmitted in other elements.Relative to the conductive electrode 40 of layer structure, strip knot
The conductive electrode 40 of structure is more convenient for handling signal input and output that chip 50 controls conductive electrode 40, to improve ultrasonic wave
The precision of the identification fingerprint of sensor 100.
Figure 19 is please referred to, in some embodiments, the ultrasonic sensor 100 of above embodiment further includes substrate
80, multiple pixel electrodes 20, conductive electrode 40 and processing chip 50 are electrically connected with substrate 80.Processing chip 50 can be set
It sets on substrate 80.Specifically, substrate 80 can be flexible circuit board, and substrate 80 can be set in substrate 10 far from pixel electrode
On 20 side.Substrate 80 is provided with connector in order to which ultrasonic sensor 100 passes through connector on substrate 80 and other
Electronic component electrical connection.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " etc. mean to combine embodiment or
Example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the invention.?
In this specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, description
Particular features, structures, materials, or characteristics can be in any one or more embodiments or example in an appropriate manner
In conjunction with.
Although embodiments of the present invention have been shown and described above, it is to be understood that above embodiment is
Illustratively, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be right
Above embodiment is changed, modifies, replacement and variant, and the scope of the present invention is defined by the claims and their equivalents.
Claims (13)
1. a kind of cover plate assembly, which is characterized in that the cover plate assembly includes:
Cover board, the cover board include visible area and non-visible area；
Ink layer, the ink layer are formed in the non-visible area；
Model layer, the model layer are arranged on the ink layer and are filled in the sky that the visible area and the ink layer limit
In；And
Ultrasonic sensor, the ultrasonic sensor pass through viscose in conjunction with side of the model layer far from the cover board,
The ultrasonic sensor include faying face in conjunction with the model layer and from the combination away from the cover board direction
The side of extension, the viscose cover the faying face and the side.
2. cover plate assembly according to claim 1, which is characterized in that the model layer includes hot-setting adhesive.
3. cover plate assembly according to claim 1, which is characterized in that the ultrasonic sensor further includes and the combination
The opposite abutted surface in face, the cover plate assembly further include foam, and the foam is arranged on the abutted surface.
4. cover plate assembly according to claim 3, which is characterized in that the foam is bonded in described connect by double-sided adhesive
On face.
5. cover plate assembly according to claim 1, which is characterized in that the cover plate assembly further includes shielded layer, the screen
It covers layer and side of the foam far from the ultrasonic sensor is set, the shielding layer grounding is to shield electromagnetic signal.
6. cover plate assembly according to claim 5, which is characterized in that the shielded layer is bonded in the bubble by pressure sensitive adhesive
On cotton.
7. cover plate assembly according to claim 1, which is characterized in that the ultrasonic sensor includes:
Substrate；
Multiple pixel electrodes, multiple pixel electrode production are on the substrate and in array distribution；
Piezoelectric element, the piezoelectric element are arranged on the substrate and cover multiple pixel electrodes, the piezoelectric element
For emitting ultrasonic wave and generating electric signal after the ultrasonic wave for receiving object reflection to be detected, multiple pixel electrodes are used for
Receive the electric signal；
Conductive electrode, the conductive electrode are arranged on the piezoelectric element, the piezoelectric element be located at the pixel electrode and
Between the conductive electrode；And
The processing chip connecting with multiple pixel electrodes, the processing chip form described for handling the electric signal
The ultrasonograph of object to be detected.
8. cover plate assembly according to claim 1, which is characterized in that the film knot that the ultrasonic sensor is integrated
Structure.
9. cover plate assembly according to claim 7, which is characterized in that the piezoelectric element is whole made of piezoelectric material
Layer structure；Or
The piezoelectric element includes multiple piezo columns, and multiple piezo column settings are more on the substrate and in array distribution
A piezo column is corresponding with multiple pixel electrodes, and each piezo column covers the corresponding pixel electrode.
10. a kind of electronic device, which is characterized in that the electronic device includes:
Shell；
Cover plate assembly described in any one of claim 1-9, the cover plate assembly are arranged on shell.
11. a kind of manufacturing method of cover plate assembly, which is characterized in that the manufacturing method includes:
Ink layer is formed in the non-visible area of cover board；
Model layer is formed on the ink layer, and make the model layer be filled in the cover board visible area and the ink layer
In the space of restriction；
There is provided ultrasonic sensor, the ultrasonic sensor include faying face and from the combination away from the faying face
The side that direction extends；And
By viscose by the faying face of the ultrasonic sensor in conjunction with side of the model layer far from the cover board,
And the viscose is made to cover the faying face and the side.
12. manufacturing method according to claim 11, which is characterized in that the ultrasonic sensor further includes and the knot
The opposite abutted surface in conjunction face, the manufacturing method further include:
The foam is bonded on the abutted surface by double-sided adhesive.
13. manufacturing method according to claim 12, which is characterized in that the manufacturing method further include:
Shielded layer is bonded in side of the foam far from the ultrasonic sensor by pressure sensitive adhesive；With
Make the shielding layer grounding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710818348.5A CN109496085A (en) | 2017-09-12 | 2017-09-12 | Cover plate assembly and its manufacturing method and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710818348.5A CN109496085A (en) | 2017-09-12 | 2017-09-12 | Cover plate assembly and its manufacturing method and electronic device |
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| Publication Number | Publication Date |
|---|---|
| CN109496085A true CN109496085A (en) | 2019-03-19 |
Family
ID=65687786
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710818348.5A Withdrawn CN109496085A (en) | 2017-09-12 | 2017-09-12 | Cover plate assembly and its manufacturing method and electronic device |
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| Country | Link |
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| CN (1) | CN109496085A (en) |
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Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Applicant before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Applicant after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |
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Application publication date: 20190319 |