CN109492469A - Display module and its manufacturing method and electronic device - Google Patents
Display module and its manufacturing method and electronic device Download PDFInfo
- Publication number
- CN109492469A CN109492469A CN201710818924.6A CN201710818924A CN109492469A CN 109492469 A CN109492469 A CN 109492469A CN 201710818924 A CN201710818924 A CN 201710818924A CN 109492469 A CN109492469 A CN 109492469A
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- Prior art keywords
- foam
- ultrasonic sensor
- metallized film
- far
- light
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Position Input By Displaying (AREA)
Abstract
The invention discloses a kind of manufacturing methods of display module.Manufacturing method includes: to form metallized film far from the side of display screen light-emitting surface in display screen；And ultrasonic wave mould group is formed far from the side of light-emitting surface in metallized film.Ultrasonic wave mould group includes ultrasonic sensor and foam.Ultrasonic sensor is arranged far from the side of light-emitting surface.Foam encapsulates ultrasonic sensor.The manufacturing method of embodiment of the present invention sequentially forms metallized film and ultrasonic wave mould group on a display screen, and encapsulates ultrasonic sensor by foam, can prevent from causing display screen Indentation Damage, and can play the role of protecting ultrasonic sensor and shading.In addition, the invention also discloses a kind of display module and electronic devices.
Description
Technical field
The present invention relates to fingerprint identification technology field, in particular to a kind of manufacturing method of display module, display module and
Electronic device.
Background technique
Currently, the ultrasonic sensor applied in mobile phone is set up directly on the display screen of mobile phone, ultrasonic sensor holds
Indentation Damage easily is caused to display screen, and ultrasonic sensor is also easy to be damaged, to influence fingerprint recognition effect.
Summary of the invention
Embodiment of the present invention provides the manufacturing method, display module and electronic device of a kind of display module.
The manufacturing method of the display module of embodiment of the present invention, comprising:
Metallized film is formed far from the side of the display screen light-emitting surface in display screen；And
Ultrasonic wave mould group is formed far from the side of the light-emitting surface in the metallized film, the ultrasonic wave mould group includes
Ultrasonic sensor and foam, the ultrasonic sensor are arranged far from the side of the light-emitting surface, and the foam encapsulates
The ultrasonic sensor.
The manufacturing method of embodiment of the present invention sequentially forms metallized film and ultrasonic wave mould group on a display screen, and
Ultrasonic sensor is encapsulated by foam, in this way, metallized film can prevent under the effect of external force, ultrasonic sensor
Indentation Damage caused to display screen, foam can carry out shading for display screen, and foam encapsulates ultrasonic sensor can play guarantor
The effect for protecting ultrasonic sensor, to ensure that the fingerprint recognition effect of ultrasonic sensor.
In some embodiments, the foam includes first layer foam and second layer foam, described in the metallization
Film far from the light-emitting surface side formed ultrasonic wave mould group the step of include:
The first layer foam is formed far from the side of the light-emitting surface in the metallized film；
Accommodating space is formed on the first layer foam；
The ultrasonic sensor is arranged in the accommodating space；And
The second layer foam is formed far from the surface of the metallized film in the ultrasonic sensor, described first
Layer foam connects with the second layer foam.
Specifically, the accommodating space formed on first layer foam is for accommodating and protecting ultrasonic sensor.Second layer bubble
Cotton is for protecting ultrasonic sensor.It is thin that ultrasonic sensor is encapsulated in metallization jointly by first layer foam and second layer foam
On film, and play the role of shading to display screen.
In some embodiments, described to form ultrasonic wave mould far from the side of the light-emitting surface in the metallized film
Group the step of include:
Side of the metallized film far from the light-emitting surface is arranged in the ultrasonic sensor；And
The foam is formed so that the foam encapsulates residence far from the side of the light-emitting surface in the metallized film
State ultrasonic sensor.
In this way, manufacturing process is simple.
In some embodiments, the manufacturing method further include: in the metallized film and the ultrasonic wave mould group
Between form shielded layer, the shielding layer grounding is to shield electromagnetic signal.
The shielded layer being arranged between display screen and ultrasonic wave mould group can be effectively prevented display screen generation electric field or
Magnetic field or electromagnetic field interfere ultrasonic sensor, to ensure the accuracy of ultrasonic sensor fingerprint recognition and sensitive
Degree, to promote user experience.
In some embodiments, the manufacturing method further include: in the foam far from the metallized film
Surface forms viscose.
In this way, the display module of embodiment of the present invention can be removably disposed in other structures (example by viscose
Such as, the shell of electronic device).
The display module of embodiment of the present invention, including display screen, metallized film and ultrasonic wave mould group.The display screen
Including light-emitting surface.Side of the display screen far from the light-emitting surface is arranged in the metallized film.The ultrasonic wave mould group
Side of the metallized film far from the light-emitting surface is set.The ultrasonic wave mould group includes ultrasonic sensor and bubble
Cotton.The ultrasonic sensor is arranged far from the side of the light-emitting surface.State ultrasonic sensor in foam encapsulation residence.
The display module of embodiment of the present invention is disposed with metallized film and ultrasonic wave mould group on a display screen,
And ultrasonic sensor is encapsulated by foam, in this way, metallized film can prevent under the effect of external force, supersonic sensing
Device causes Indentation Damage to display screen, and foam can carry out shading for display screen, and foam encapsulates ultrasonic sensor and can play
The effect for protecting ultrasonic sensor, to ensure that the fingerprint recognition effect of ultrasonic sensor.
In some embodiments, the foam includes first layer foam and second layer foam.The first layer foam is set
It sets in side of the metallized film far from the light-emitting surface.The first layer foam offers accommodating space, the ultrasound
Wave sensor is arranged in the accommodating space.The second layer foam is arranged in the ultrasonic sensor far from the metal
Change the surface of film.The first layer foam connects with the second layer foam.Specifically, the receiving formed on first layer foam
Space is for accommodating and protecting ultrasonic sensor.Second layer foam is for protecting ultrasonic sensor.First layer foam and
Ultrasonic sensor is encapsulated on metallized film by two layers of foam jointly, and plays the role of shading to display screen.
In some embodiments, the metallized film is arranged in far from the light-emitting surface in the ultrasonic sensor
Side, the foam are arranged in side of the metallized film far from the light-emitting surface and state supersonic sensing to encapsulate residence
Device.In this way, manufacturing process is simple.
In some embodiments, the display screen includes Organic Light Emitting Diode (Organic Light-Emitting
Diode, OLED) display screen.In this way, OLED display screen stable luminescence, thickness are thin, display effect is good, help to promote user's body
It tests.
In some embodiments, the metallized film includes metallized polyester (Polyethylene
Terephthalate, PET) film or metallized polyimide (Polyimide, PI) film.The PET film that metallizes and metal
Changing PI film has preferable barrier property, can prevent moisture and oxygen from entering display screen, and metallize PET film and metallization
PI film can also play the role of buffering, prevent under the effect of external force, ultrasonic sensor causes impression to damage display screen
Wound.
In some embodiments, the display module further includes shielded layer, and the shielded layer is arranged in the metallization
Between film and the ultrasonic wave mould group, the shielding layer grounding is to shield electromagnetic signal.It is arranged in display screen ultrasonic wave mould group
Between shielded layer can be effectively prevented the electric field of display screen generation or magnetic field or electromagnetic field cause to do to ultrasonic sensor
It disturbs, to ensure the accuracy and sensitivity of ultrasonic sensor fingerprint recognition, to promote user experience.
In some embodiments, the display module further includes viscose, and the separate of the foam is arranged in the viscose
The surface of the metallized film.In this way, the display module of embodiment of the present invention can be removably disposed in by viscose
In other structures (for example, shell of electronic device).
In some embodiments, the ultrasonic sensor includes substrate, multiple pixel electrodes, piezoelectric element, conduction
Electrode and processing chip.Multiple pixel electrode production are on the substrate and in array distribution.The piezoelectric element setting
On the substrate and cover multiple pixel electrodes.The piezoelectric element is for emitting ultrasonic wave and to be detected receiving
Electric signal is generated after the ultrasonic wave of object reflection.Multiple pixel electrodes are for receiving the electric signal.The conductive electrode is set
It sets on the piezoelectric element.The piezoelectric element is between the pixel electrode and the conductive electrode.Handle chip with
Multiple pixel electrode connections.The processing chip is for handling the electric signal to form the ultrasonic wave of the object to be detected
Image.Each pixel electrode of the ultrasonic sensor of embodiment of the present invention can determine to be checked based on the received electrical signal
The electric signal that position and piezoelectric element of the object pressing on ultrasonic sensor generate on the position is surveyed, to reduce processing
Chip data volume to be treated improves the recognition efficiency of ultrasonic sensor.
In some embodiments, the membrane structure that the ultrasonic sensor is integrated.In this way, convenient for manufacture display mould
Group.
The electronic device of embodiment of the present invention, which is characterized in that including described in shell and any of the above-described embodiment
Display module.The display module setting is on the housing.
The electronic device of embodiment of the present invention is disposed with metallized film and ultrasonic wave mould group on a display screen,
And ultrasonic sensor is encapsulated by foam, in this way, metallized film can prevent under the effect of external force, supersonic sensing
Device causes Indentation Damage to display screen, and foam can carry out shading for display screen, and foam encapsulates ultrasonic sensor and can play
The effect for protecting ultrasonic sensor, to ensure that the fingerprint recognition effect of ultrasonic sensor.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partially will be from following
Description in become obvious, or the practice of embodiment through the invention is recognized.
Detailed description of the invention
Above-mentioned and/or additional aspect and advantage of the invention is from combining in description of the following accompanying drawings to embodiment by change
It obtains obviously and is readily appreciated that, in which:
Fig. 1 is the flow diagram of the manufacturing method of certain embodiments of the present invention；
Fig. 2 is the cross-sectional view of the display module of certain embodiments of the present invention；
Fig. 3 is the flow diagram of the manufacturing method of certain embodiments of the present invention；
Fig. 4 is the process schematic representation of the manufacturing method of certain embodiments of the present invention；
Fig. 5 is the cross-sectional view of the display module of certain embodiments of the present invention；
Fig. 6 is the flow diagram of the manufacturing method of certain embodiments of the present invention；
Fig. 7 is the process schematic representation of the manufacturing method of certain embodiments of the present invention；
Fig. 8 is the cross-sectional view of the display module of certain embodiments of the present invention；
Fig. 9 is the flow diagram of the manufacturing method of certain embodiments of the present invention；
Figure 10 is the structural schematic diagram of the shielded layer of certain embodiments of the present invention；
Figure 11 is the flow diagram of the manufacturing method of certain embodiments of the present invention；
Figure 12 is the cross-sectional view of the display module of certain embodiments of the present invention；
Figure 13 is the cross-sectional view of the display module of certain embodiments of the present invention；
Figure 14 is the floor map of the electronic device of certain embodiments of the present invention；
Figure 15 is the cross-sectional view of the ultrasonic sensor of certain embodiments of the present invention；
Figure 16 is the decomposition diagram of the ultrasonic sensor of certain embodiments of the present invention；
Figure 17 is the cross-sectional view of the ultrasonic sensor of certain embodiments of the present invention；
Figure 18 is the decomposition diagram of the ultrasonic sensor of certain embodiments of the present invention；
Figure 19 is the decomposition diagram of the ultrasonic sensor of certain embodiments of the present invention；
Figure 20 is the cross-sectional view of the ultrasonic sensor of certain embodiments of the present invention；
Figure 21 is the cross-sectional view of the ultrasonic sensor of certain embodiments of the present invention；
Figure 22 is the cross-sectional view of the ultrasonic sensor of certain embodiments of the present invention；
Figure 23 is the decomposition diagram of the ultrasonic sensor of certain embodiments of the present invention；
Figure 24 is the cross-sectional view of the ultrasonic sensor of certain embodiments of the present invention.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of
The description present invention and simplified description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with spy
Fixed orientation construction and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.
" first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.?
In description of the invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected or can mutually communicate；It can be directly connected, it can also be by between intermediary
It connects connected, can be the connection inside two elements or the interaction relationship of two elements.For the ordinary skill of this field
For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower"
It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it
Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above "
Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of
First feature horizontal height is less than second feature.
Following disclosure provides many different embodiments or example is used to realize different structure of the invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Fig. 1 and Fig. 2 are please referred to, the manufacturing method of the display module 200 of embodiment of the present invention includes:
S10: metallized film 220 is formed far from the side of 210 light-emitting surface 210a of display screen in display screen 210；And
S20: ultrasonic wave mould group 100a, ultrasonic wave mould group are formed far from the side of light-emitting surface 210a in metallized film 220
100a includes ultrasonic sensor 100 and foam 230, and ultrasonic sensor 100 is arranged far from the side of light-emitting surface 210a, bubble
Cotton 230 encapsulates ultrasonic sensor 100.
Referring to Fig. 2, the manufacturing method of embodiment of the present invention can be used for manufacturing the display module of embodiment of the present invention
200.The display module 200 of embodiment of the present invention includes display screen 210, metallized film 220 and ultrasonic wave mould group 100a.It is aobvious
Display screen 210 includes light-emitting surface 210a.Side of the display screen 210 far from light-emitting surface 210a is arranged in metallized film 220.Ultrasonic wave
Side of the metallized film 220 far from light-emitting surface 210a is arranged in mould group 100a.Ultrasonic wave mould group 100a includes supersonic sensing
Device 100 and foam 230.Ultrasonic sensor 100 is arranged far from the side of light-emitting surface 210a.Foam 230 encapsulates ultrasonic wave
Sensor 100.
The manufacturing method and display module 200 of embodiment of the present invention, sequentially form metallized film on the display screen 210
220 and ultrasonic wave mould group 100a, and ultrasonic sensor 100 is encapsulated by foam 230, in this way, metallized film 220 can be with
It prevents under the effect of external force, ultrasonic sensor 100 causes Indentation Damage to display screen 210, and foam 230 can be display screen
210 carry out shading, and foam 230 encapsulates ultrasonic sensor 100 and can play the role of protecting ultrasonic sensor 100, from
And it ensure that the fingerprint recognition effect of ultrasonic sensor 100.
In the embodiment shown in figure 2, when object to be detected (including finger, test template etc.) is placed on display module
When on 200, the ultrasonic wave that ultrasonic sensor 100 emits sequentially passes through metallized film 220 and display screen 210, and through finger
After reflection, again passes through display screen 210 and metallized film 220 is passed back to ultrasonic sensor 100.Ultrasonic sensor 100
According to the finger print information of the signal acquisition received object to be detected.The display module 200 of embodiment of the present invention can be applied to but
It is not limited to the application scenarios such as unlock, file encryption, payment verification, authentication.
In some embodiments, metallized film 220 includes metallization PET film or metallization PI film.Metallization
PET film and metallization PI film have preferable barrier property, can prevent moisture and oxygen from entering display screen 210, and metal
Buffering can also be played the role of by changing PET film and metallization PI film, be prevented under the effect of external force, ultrasonic sensor
100 pairs of display screens 210 cause Indentation Damage.In the display module 200 of embodiment of the present invention, when the originals such as made mistakes due to processing procedure
Because when resulting in the need for heavy industry, it is only necessary to metallized film 220 be torn, heavy industry is facilitated.
Foam 230 can play the role of buffering, protection and shading, when display module 200 or ultrasonic sensor 100 by
When shock or unexpected external force, foam 230 can protect ultrasonic sensor 100, so that ultrasonic sensor 100 is not
It is easy to damage, it ensure that the service life of display module 200 and ultrasonic sensor 100.It should be pointed out that foam 230 encapsulates
Firmly ultrasonic sensor 100 indicates the covering of foam 230, package ultrasonic sensor 100.As shown in Fig. 2, foam 230 will be ultrasonic
Wave sensor 100 is encapsulated on metallized film 220.
Fig. 2-Fig. 4 is please referred to, in some embodiments, foam 230 includes first layer foam 232 and second layer foam
234.Forming ultrasonic wave mould group 100a far from the side of light-emitting surface 210a in metallized film 220 includes:
S21: first layer foam 232 is formed far from the side of light-emitting surface 210a in metallized film 220；
S22: accommodating space 232a is formed on first layer foam 232；
S23: ultrasonic sensor 100 is arranged in accommodating space 232a；And
S24: second layer foam 234, first layer are formed far from the surface of metallized film 220 in ultrasonic sensor 100
Foam 232 connects with second layer foam 234.
Fig. 2 and Fig. 4 are please referred to, the foam 230 of embodiment of the present invention includes first layer foam 232 and second layer foam
234.Side of the metallized film 220 far from light-emitting surface 210a is arranged in first layer foam 232.First layer foam 232 offers
Accommodating space 232a.Ultrasonic sensor 100 is arranged in accommodating space 232a.The setting of second layer foam 234 is passed in ultrasonic wave
Surface of the sensor 100 far from metallized film 220.First layer foam 232 connects with second layer foam 234.
Specifically, the accommodating space 232a formed on first layer foam 232 is for accommodating and protecting ultrasonic sensor
100.Second layer foam 234 is for protecting ultrasonic sensor 100.First layer foam 232 is set around ultrasonic sensor 100
It sets.Surface of the ultrasonic sensor 100 far from metallized film 220 is arranged in second layer foam 234.232 He of first layer foam
Ultrasonic sensor 100 is encapsulated on metallized film 220 by second layer foam 234 jointly, and can play screening to display screen 210
The effect of light.
Referring to Fig. 2, the accommodating space 232a formed on first layer foam 232 can be through-hole.Ultrasonic sensor 100
The side of light-emitting surface 210a of close display screen 210 connect with metallized film 220.First layer foam 232 surrounds ultrasonic wave
The surrounding of sensor 100.In this way, the thickness of first layer foam 232 it is smaller (thickness of first layer foam 232 equal or approximate to etc.
In the thickness of ultrasonic sensor 100), so it is thinner convenient for doing display module 200.Referring to Fig. 5, first layer steeps
The accommodating space 232a formed on cotton 232 can be slot.First layer foam 232 surrounds the surrounding of ultrasonic sensor 100 and surpasses
The side of the light-emitting surface 210a of the close display screen 210 of sonic sensor 100.In this way, first layer foam 232 and second layer foam
234 common fully enclosed ultrasonic sensors 100 can better play the effect of protection ultrasonic sensor 100, and the
Metallized film 220 is completely covered in one layer of foam 232, and then display screen 210 is completely covered, and plays the work of protection display screen 210
With.
In some embodiments, the size and supersonic sensing of the accommodating space 232a formed on first layer foam 232
The size of device 100 matches (size that the size of accommodating space 232a is equal or slightly larger than ultrasonic sensor 100).In this way,
Ultrasonic sensor 100 will not move left and right when being located in accommodating space 232a, positioned at 100 side of ultrasonic sensor
Ultrasonic sensor 100 can be better secured in accommodating space 232a by foam 230.The shape of accommodating space 232a can be with
For circle, triangle, rectangle, square or other irregular shapes, here with no restriction.
Please refer to Fig. 2, Fig. 6 and Fig. 7, in some embodiments, metallized film 220 far from light-emitting surface 210a one
Side forms ultrasonic wave mould group 100a
S25: side of the metallized film 220 far from light-emitting surface 210a is arranged in ultrasonic sensor 100；And
S26: foam 230 is formed so that foam 230 encapsulates and surpasses far from the side of light-emitting surface 210a in metallized film 220
Sonic sensor 100.
Fig. 2 and Fig. 7 are please referred to, in some embodiments, the setting of ultrasonic sensor 100 is remote in metallized film 220
Separate out the side of smooth surface 210a.Side of the metallized film 220 far from light-emitting surface 210a is arranged in encapsulate ultrasound in foam 230
Wave sensor 100.
In this way, manufacturing process is simple.It is appreciated that the side of the close light-emitting surface 210a of foam 230 is formed with receiving sky
Between 232a so that by foam 230 be arranged when on metallized film 220, accommodating space 232a can accommodate ultrasonic wave biography
Ultrasonic sensor 100 is encapsulated on metallized film 220 by sensor 100, in other words, foam 230.
In some embodiments, display screen 210 includes OLED display screen.
Specifically, OLED display screen includes active-matrix Organic Light Emitting Diode (Active Matrix Organic
Light Emitting Diode, AMOLED) display screen and passive-matrix Organic Light Emitting Diode (Passive Matrix
Organic Light Emitting Diode, PMOLED) display screen.Preferably, display screen 210 is AMOLED display screen.
AMOLED display screen has installed thin film transistor (TFT) and capacitor layers additional on each light emitting diode to control Organic Light Emitting Diode
Brightness, to realize that more rapidly and more accurately pixel light emission controls, and AMOLED display screen stable luminescence, thickness are thin, aobvious
Show that effect is good, helps to promote user experience.
In some embodiments, display screen 210 includes flexible OLED display.Flexible OLED display is flexible, function
Consume it is low, in this way, helping to promote user experience convenient for display module 200 is made thinner.
Referring to Fig. 8, in some embodiments, display module 200 further includes cover board 260.The setting of cover board 260 is being shown
The side of the light-emitting surface 210a of screen 210.In other words, display screen 210 is fitted in the lower surface of cover board 260.In this way, cover board 260
It can play the role of protection to display screen 210.The material of cover board 260 can be glass, sapphire, polyvinyl chloride
Any one in (Polyvinyl chloride, PVC).The shape of cover board 260 can be with the shape phase of display screen 210
Match.
In embodiment shown in Fig. 8, when object to be detected (including finger, test template etc.) is placed on display module
When on 200, the ultrasonic wave that ultrasonic sensor 100 emits sequentially passes through metallized film 220, display screen 210 and cover board 260,
And after handling digital reflex, again passes through cover board 260, display screen 210 and metallized film 220 and be passed back to ultrasonic sensor 100.
Ultrasonic sensor 100 is according to the finger print information of the signal acquisition received object to be detected.
Fig. 2 and Fig. 9 are please referred to, in some embodiments, manufacturing method may also include that
S30: between metallized film 220 and ultrasonic wave mould group 100a formed shielded layer 240, shielded layer 240 ground connection with
Shield electromagnetic signal.
Referring to Fig. 3, in some embodiments, display module 200 further includes shielded layer 240.The setting of shielded layer 240 exists
Between metallized film 220 and ultrasonic wave mould group 100a.Shielded layer 240 is grounded to shield electromagnetic signal.
Specifically, S30 is executed after S10.Manufacturing method is formed between metallized film 220 and ultrasonic wave mould group 100a
The mode of shielded layer 240 can there are two types of, a kind of mode is: first in light-emitting surface of the metallized film 220 far from display screen 210
Shielded layer 240 is formed on the side of 210a, then the shape on side of the shielded layer 240 far from the light-emitting surface 210a of display screen 210
At ultrasonic wave mould group 100a, so that shielded layer 240 is located between metallized film 220 and ultrasonic wave mould group 100a.Another kind side
Formula is: shielded layer 240 is first formed on the side of the light-emitting surface 210a of the close display screen 210 of ultrasonic wave mould group 100a, then
The ultrasonic wave mould group 100a for being formed with shielded layer 240 is formed in light-emitting surface 210a of the metallized film 220 far from display screen 210
Side.
Sheet or layered, transparent metal oxide materials can be selected in shielded layer 240, are fitted in gold using attaching process
Between categoryization film 220 and ultrasonic wave mould group 100a.Transparent metal oxide material can be tin indium oxide (Indium tin
Oxide, ITO), transparent polymer material, at least one of graphene or carbon nanotube.Shielded layer 240 also can be selected by not
Conductive grid is made in transparent conductive metal or alloy.For example, shielded layer 240 can be gold, silver, copper, aluminium, zinc, plating gold and silver or extremely
Conductive grid made of the nano material of any one in both few alloy.The line width of conductive grid can be tens microns
To tens nanometers.Referring to Fig. 10, in the present embodiment, shielded layer 240 using the conductive grid being made of copper, with reduce at
This.In some embodiments, shielded layer 240 can be the circuit board made of copper and PI.Circuit board ground is to shield electromagnetism
Signal.
It should be pointed out that shielding electromagnetic signal mentioned here includes in shielding electric signal, magnetic signal or electromagnetic signal
At least one.The shielded layer 240 being arranged between display screen 210 and ultrasonic wave mould group 100a can be effectively prevented display screen
210 electric fields generated or magnetic field or electromagnetic field interfere ultrasonic sensor 100, to ensure that ultrasonic sensor 100 refers to
The accuracy and sensitivity of line identification, to promote user experience.
Fig. 2 and Figure 11 are please referred to, in some embodiments, manufacturing method may also include that
S40: viscose 250 is formed on the surface of the separate metallized film 220 of foam 230.
In some embodiments, display module 200 further includes viscose 250.The separate of foam 230 is arranged in viscose 250
The surface of metallized film 220.
Specifically, viscose 250 can be double-sided adhesive.The display module 200 of embodiment of the present invention can pass through double-sided adhesive
It is removably disposed in other structures the shell 301 of electronic device 300 (for example, in Figure 14), is convenient for heavy industry, and double-sided adhesive
Fixed form is relatively simple, easy to operate.
Referring to Fig. 2, in embodiments of the present invention, viscose 250 can be completely covered foam 230 and (paste on foam 230
One flood viscose 250).In this way, display module 200 can be securely bonded in other structures by viscose 250.Please refer to figure
12, viscose 250 can also partially cover foam 230 (for example, viscose 250 is only formed on first layer foam 232).Viscose 250
It is arranged around second layer foam 234, at this point, the sum of first layer foam 232 and the thickness of viscose 250 can be equal or approximately equal to
The sum of the thickness of ultrasonic sensor 100 and second layer foam 234.In this way, the thickness of display module 200 is smaller, convenient for that will show
Show that mould group 200 is done thinner, and display module 200 by the separate display screen 210 of foam 230 and ultrasonic sensor 100
It is more smooth that the side of light-emitting surface 210a is formed by surface, is applied to electronic device 300 convenient for display module 200.
Referring to Fig. 2, in some embodiments, display screen 210 is completely covered in metallized film 220.Foam 230 and aobvious
Display screen 210 is located at the opposite two sides of metallized film 220.In this way, metallized film 220 is the structure of flood, be conducive to
Heat dissipation.
Figure 13 is please referred to, in some embodiments, 220 covering part display screen 210 of metallized film.First layer foam
The opposite end of 232 package metallized films 220.When 220 covering part display screen 210 of metallized film, first layer foam
The position of the accommodating space 232a formed on 232 is corresponding with the position of metallized film 220.Ultrasonic sensor 100 is arranged
On metallized film 220, and 220 covering part display screen 210 of metallized film, prevent ultrasonic sensor 100 to aobvious
Display screen 210 causes to be conducive to save cost while Indentation Damage, moreover, first layer foam 232 wraps metallized film 220
Opposite end, not only protect ultrasonic sensor 100, also protect metallized film 220.
Figure 14 is please referred to, the display module 200 of embodiment of the present invention can be applied to the electronics of embodiment of the present invention
Device 300.Electronic device 300 includes the display module 200 of shell 301 and any of the above-described embodiment.Display module 200 is arranged
On shell 301.
Specifically, electronic device 300 include but is not limited to mobile phone, tablet computer, E-book reader, wearable device,
The electronic device 300 of the usable ultrasonic fingerprint identification function such as remote controler, entrance guard device, ATM machine, automatic navigator.
For example, display module 200 can be used for unlocking, file encryption, payment verification, body when electronic device 300 is mobile phone
The application scenarios such as part verifying.
Figure 15 and Figure 16 is please referred to, the ultrasonic sensor 100 of embodiment of the present invention includes substrate 10, multiple pixels electricity
Pole 20, piezoelectric element 30, conductive electrode 40 and processing chip 50.Multiple pixel electrodes 20 are produced on substrate 10 and in arrays point
Cloth.Piezoelectric element 30 is arranged on substrate 10 and covers multiple pixel electrodes 20, piezoelectric element 30 for emit ultrasonic wave and
Electric signal is generated after receiving the ultrasonic wave of object reflection to be detected, multiple pixel electrodes 20 are for receiving the electric signal.Conductive electricity
Pole 40 is arranged on piezoelectric element 30, and piezoelectric element 30 is between pixel electrode 20 and conductive electrode 40.Handle chip 50 with
Multiple pixel electrodes 20 connect, and processing chip 50 is for handling the electric signal to form the ultrasonograph of object to be detected.Ultrasound
The membrane structure that wave sensor 100 can be integrated.
It should be noted that the production in " multiple pixel electrodes 20 are produced on substrate 10 " mentioned in the present invention includes
Pixel electrode 20 is directly produced on base by techniques such as plated film, light blockage coating/development/exposure, etching, removal photoresist, annealing
On material 10." layer structure " mentioned in the present invention is whole piece structure, alternatively referred to as " laminated structure ".
Object to be detected can be finger, test template etc..When processing chip 50 controls conductive electrode 40 and pixel electrode 20
When being powered so as to be applied with high frequency voltage (such as: frequency is greater than the voltage of 20KHZ) on conductive electrode 40 and pixel electrode 20, pressure
Electric device 30 generates ultrasonic wave under the action of high frequency voltage and launches outward ultrasonic wave；If finger is placed on display module 200
On, then finger can reflect the ultrasonic wave of the transmitting of piezoelectric element 30 and transmit back to piezoelectric element 30, due on finger there are fingerprint,
The finger that thus each position receives on piezoelectric element 30 reflect ultrasonic wave it is not exactly the same, thus each position of piezoelectric element 30
It is also not exactly the same to set the electric signal (or piezoelectric signal) generated under ultrasonic wave effect, each position generation on piezoelectric element 30
Electric signal the fingerprint pattern of finger can be collectively formed；Processing chip 50 controls multiple pixel electrodes 20 and receives piezoelectric element 30
Each position on the electric signal that generates, which is transmitted on processing chip 50 by multiple pixel electrodes 20, handles core
Piece 50 handles the electric signal to form the fingerprint pattern of finger.
Each pixel electrode 20 of the ultrasonic sensor 100 of embodiment of the present invention can be based on the received electrical signal
Determine the electric signal that position and piezoelectric element 30 of the finger pressing on ultrasonic sensor 100 generate on the position, thus
Reduce the processing data volume to be treated of chip 50, improve the recognition efficiency of ultrasonic sensor 100.
The material of substrate 10 is glass or Kapton.The substrate 10 made of glass or polyimide film material
Cost is relatively low, translucency is preferable, therefore, cost is relatively low for the ultrasonic sensor 100 made of the substrate 10, translucency compared with
It is good.The integral color that ultrasonic sensor 100 is able to maintain display screen 210 unanimously keeps display screen 210 more beautiful.
Multiple pixel electrodes 20 are produced on substrate 10 and in array distributions, that is to say, that multiple pixel electrodes 20 include
The pixel electrode 20 and the spaced pixel electrode 20 of multiple row of higher order interlace setting.The material of pixel electrode 20 is tin indium oxide
(Indium tin oxide, ITO), nano-silver thread (Agnanowire), metal grill (metal mesh), carbon nanotubes and
Any one in graphene (Graphene), the pixel electrode 20 made of above-mentioned material have preferable toughness and light transmission
Property, so that the ultrasonic sensor 100 made of the pixel electrode 20 has preferable toughness and translucency.Pixel electrode 20
Light transmittance is greater than 90%, so that ultrasonic sensor 100 made of the pixel electrode 20 is had preferable translucency, thus ultrasonic wave
Sensor 100 will not influence the display of display screen 210, and ultrasonic sensor 100 is able to maintain the integral color one of display screen 210
It causes and keeps display screen 210 more beautiful.Pixel electrode 20 can be used for receiving electric signal, and each pixel electrode 20 can be according to reception
To electric signal determine a position of display module 200 (or ultrasonic sensor 100), pixel electrode 20 is on substrate 10
The acquisition precision of density and ultrasonic sensor 100 is positively correlated, and the density of pixel electrode 20 of the invention can be such that ultrasonic wave passes
Sensor 100 detects the fingermark image of object to be detected.
Piezoelectric element 30 is arranged on substrate 10 and covers multiple pixel electrodes 20.Piezoelectric element 30 is made of piezoelectric material
Whole laminated structure, the shape of piezoelectric element 30 and the shape of substrate 10 match.The material of piezoelectric element 30 is poly- inclined
Vinyl fluoride (Polyvinylidene fluoride, PVDF) makes since Kynoar has preferable toughness and translucency
Piezoelectric element 30 has preferable flexibility and translucency, and the flexibility and translucency of ultrasonic sensor 100 are also preferable at this time.
Piezoelectric element 30 can generate under high frequency voltage (such as: frequency is greater than the voltage of 20KHZ) effect and to the hair of display screen 210
Light direction emits ultrasonic wave.After piezoelectric element 30 receives the ultrasonic wave of object reflection to be detected, piezoelectric element 30 is in ultrasonic wave
It can be generated electric signal (or piezoelectric signal) under effect, object to be detected can be finger, test template etc..
The side of the separate pixel electrode 20 of piezoelectric element 30 is arranged in conductive electrode 40, that is to say, that piezoelectric element 30
Between pixel electrode 20 and conductive electrode 40.Conductive electrode 40 is layer structure (i.e. piece whole made of conductive material
Shape structure), the shape of conductive electrode 40 and the shape of piezoelectric element 30 match.The material of conductive electrode 40 be tin indium oxide,
Any one in nano-silver thread, metal grill, carbon nanotubes and graphene.The light transmittance of conductive electrode 40 is greater than 90%.
Conductive electrode 40 and pixel electrode 20 can apply high frequency voltage to piezoelectric element 30 after leading to high frequency voltage, to make piezoelectric element
30 generate ultrasonic wave.Conductive electrode 40 and pixel electrode 20 can also receive the electric signal of the generation of piezoelectric element 30.
Processing chip 50 is all connected with multiple pixel electrodes 20 and conductive electrode 40.Processing chip 50, which can be used for controlling, leads
The energization of electrode 40 and pixel electrode 20.It is connected to high frequency voltage for example, processing chip 50 can control conductive electrode 40 and controls
Pixel electrode 20 processed is grounded, so that piezoelectric element 30 is applied high frequency voltage, to make piezoelectric element 30 generate and launch outward
Ultrasonic wave.Processing chip 50 piezoelectric signal that also controllable pixels electrode 20 and conductive electrode 40 generate piezoelectric element 30 transmits
Onto processing chip 50.Processing chip 50 is also used to handle the electric signal of the generation of piezoelectric element 30 to form the ultrasound of object to be detected
Wave image.Processing chip 50 can be set also can be set outside substrate 10 on substrate 10.
When processing chip 50 controls conductive electrode 40 and the energization of pixel electrode 20 so that conductive electrode 40 and pixel electrode 20
On be applied with high frequency voltage (such as: frequency be greater than 20KHZ voltage) when, piezoelectric element 30 generates under the action of high frequency voltage
Ultrasonic wave simultaneously launches outward ultrasonic wave；If finger is placed in display module 200, finger can reflect the transmitting of piezoelectric element 30
Ultrasonic wave is simultaneously transmitted back to piezoelectric element 30, and since there are fingerprints on finger, thus each position receives on piezoelectric element 30
Finger reflect ultrasonic wave it is not exactly the same, thus each position of piezoelectric element 30 electric signal for generating under ultrasonic wave effect
(or piezoelectric signal) is also not exactly the same, and the finger of finger can be collectively formed in the electric signal that each position generates on piezoelectric element 30
Line pattern；Processing chip 50 controls multiple pixel electrodes 20 and receives the electric signal generated on each positions of piezoelectric elements 30,
The electric signal is transmitted on processing chip 50 by multiple pixel electrodes 20, and processing chip 50 handles the electric signal to form finger
Fingerprint pattern.
The electronic device 300 and display module 200 of embodiment of the present invention also have the advantages that first, ultrasound
The membrane structure that wave sensor 100 is integrated, convenient for manufacture display module 200.
Second, multiple pixel electrodes 20 are produced on substrate 10, convenient for the production higher pixel electrode 20 of precision, to mention
Rise the precision that ultrasonic sensor 100 identifies fingerprint.
Second, the light transmittance of pixel electrode 20 and conductive electrode 40 is all larger than 90%, makes to surpass made of the pixel electrode 20
Sonic sensor 100 has preferable translucency, so that ultrasonic sensor 100 will not influence the display of display screen 210, ultrasound
The integral color that wave sensor 100 is able to maintain display screen 210 unanimously keeps display screen 210 more beautiful.
Third, conductive electrode 40 control the energization of conductive electrode 40 convenient for processing chip 50, together in whole laminated structure
When make that conductive electrode 40 is easy to manufacture and cost of manufacture is lower.
4th, the material of pixel electrode 20 and conductive electrode 40 is tin indium oxide, nano-silver thread, metal grill, nanometer
Any one in carbon pipe and graphene, pixel electrode 20 and conductive electrode 40 made of above-mentioned material all have preferably
Toughness and translucency, so that the ultrasonic sensor 100 made of the pixel electrode 20 and conductive electrode 40 is with preferable tough
Property and translucency；The integral color that ultrasonic sensor 100 is able to maintain display screen 210 unanimously keeps display screen 210 more beautiful
It sees.
5th, piezoelectric element 30 is convenient for the manufacture of piezoelectric element 30 in whole layer structure and manufacturing cost is lower.
Figure 17 and Figure 18 is please referred to, in some embodiments, the piezoelectric element 30 of above embodiment includes multiple pressures
Electric column 32 and the insulating layer 34 being filled between multiple piezo columns 32.Multiple piezo columns 32 are arranged on substrate 10 and in arrays point
Cloth, multiple piezo columns 32 are corresponding with multiple pixel electrodes 20, and each piezo column 32 covers corresponding pixel electrode 20.Due to piezoelectricity
32 array of multiple piezo columns setting on element 30, therefore the electrical property that each piezo column 32 is generated by adjacent piezo column 32 is dry
It disturbs and vibration interference is smaller, thus compared to the whole laminated structure being made out of a piezoelectric material, the piezoelectricity member of present embodiment
The electric signal that part 30 generates under ultrasonic wave effect is more acurrate, and then handles chip 50 and handle the ultrasonic wave shadow that the electric signal is formed
As more acurrate.The material of piezo column 32 is Kynoar.The material of insulating layer 34 can be epoxy resin.Due to epoxy resin
There is excellent adhesive strength to the surface of metal and nonmetallic materials, dielectric properties are good, and deformation retract rate is small, product size
Stability is good, and hardness is high, and flexibility is preferable, the features such as to alkali and most of solvent-stable.Therefore, insulating layer 34 uses asphalt mixtures modified by epoxy resin
Rouge convenient for encapsulation piezo column 32 and makes the structure of piezoelectric element 30 more stable as filled media.
Figure 19 is please referred to, in some embodiments, multiple pixel circuits 12 in array distribution are formed on substrate 10
And a plurality of conducting wire 14 corresponding with multiple pixel circuits 12, multiple pixel circuits 12 are corresponding with multiple pixel electrodes 20, each picture
Plain circuit 12 is connected with corresponding pixel electrode 20, and every conducting wire 14 is for connecting corresponding pixel circuit 12 and processing chip
50.Pixel circuit 12 is arranged between substrate 10 and pixel electrode 20, and in substrate 10 and pixel circuit can be set in conducting wire 14
On 12 the same side.In this way, convenient for the production of pixel circuit 12 and conducting wire 14, and connect convenient for pixel electrode 20 and processing chip 50
It connects.In other embodiments, conducting wire 14 also can be set on the opposite side with pixel circuit 12 of substrate 10.
Figure 20 is please referred to, in some embodiments, the ultrasonic sensor 100 of above embodiment further includes connection electricity
Pole 60 and lead 70.Connection electrode 60 is arranged in the side far from multiple pixel electrodes 20 of substrate 10 and connects with processing chip 50
It connects.Pixel electrode 20 is connected to connection electrode 60 by lead 70, and conductive electrode 40 is connected to connection electrode 60 by lead 70.
Lead 70 includes a plurality of pixel electrode lead 72 connecting with pixel electrode 20, every pixel electrode lead 72 respectively with a picture
Plain electrode 20 connects.Lead 70 further includes the conductive electrode lead 74 being correspondingly connected with conductive electrode 40, when conductive electrode 40 is
When the layer structure of entirety, conductive electrode lead 74 is one；When conductive electrode 40 is a plurality of spaced strip structure
When conductive electrode 40, the quantity of conductive electrode lead 74 and the quantity of conductive electrode 40 of strip structure are consistent.Present embodiment
By setting lead 70 and connection electrode 60, it is electrically connected respectively with processing chip 50 convenient for pixel electrode 20 with conductive electrode 40.
Please refer to Figure 21, in some embodiments, the conductive electrode 40 of above embodiment include layer structure 42 and
The extended structure 44 each extended over from the both ends of layer structure 42, layer structure 42 and extended structure 44 wrap piezoelectricity member jointly
Part 30.Extended structure 44 can integrally extend outward to form for the edge of layer structure 42, and extended structure 44 can be stratiform knot
The a part at the edge of structure 42 extends outward to form.Processing chip 50 is electrically connected by extended structure 44 with conductive electrode 40.Such as
This, is electrically connected convenient for processing chip 50 with conductive electrode 40 by setting extended structure 44.
Figure 22 and Figure 23 is please referred to, in some embodiments, the conductive electrode 40 of above embodiment includes multiple
Every the conductive electrode 40 of the strip structure of setting, the conductive electrode 40 of each strip structure and the pixel electrode 20 in same row are right
It answers.In other embodiments, the conductive electrode 40 of each strip structure is corresponding with the pixel electrode 20 in same a line.Pixel electricity
Pole 20 is corresponding with the conductive electrode 40 of strip structure to apply height convenient for pixel electrode 20 and conductive electrode 40 on piezoelectric element 30
Frequency voltage (such as: frequency is greater than the voltage of 20KHZ), while being used for convenient for pixel electrode 20 and conductive electrode 40 by piezoelectric element
30 electric signals generated under piezoelectric effect are transmitted in other elements.Relative to the conductive electrode 40 of layer structure, strip knot
The conductive electrode 40 of structure is more convenient for handling signal input and output that chip 50 controls conductive electrode 40, to improve ultrasonic wave
The precision of the identification fingerprint of sensor 100.
Figure 24 is please referred to, in some embodiments, the ultrasonic sensor 100 of above embodiment further includes circuit board
80, multiple pixel electrodes 20, conductive electrode 40 and processing chip 50 are electrically connected with circuit board 80.Handling chip 50 can be with
It is arranged on circuit board 80.Specifically, circuit board 80 can be flexible circuit board, and circuit board 80 can be set in the remote of substrate 10
On side from pixel electrode 20.Circuit board 80 is provided with connector in order to which ultrasonic sensor 100 passes through on circuit board 80
Connector be electrically connected with other electronic components.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " etc. means in conjunction with the embodiment party
Formula or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the invention
In.In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover,
Particular features, structures, materials, or characteristics described can be in any one or more embodiments or example with suitable
Mode combine.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one described feature.In the description of the present invention, the meaning of " plurality " is at least two, such as two,
Three etc., unless otherwise specifically defined.
Although embodiments of the present invention have been shown and described above, it is to be understood that above embodiment is
Illustratively, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be right
Above embodiment is changed, modifies, replacement and variant, and the scope of the present invention is defined by the claims and their equivalents.
Claims (15)
1. a kind of manufacturing method of display module, which is characterized in that the manufacturing method includes:
Metallized film is formed far from the side of the display screen light-emitting surface in display screen；And
Ultrasonic wave mould group is formed far from the side of the light-emitting surface in the metallized film, the ultrasonic wave mould group includes ultrasound
Wave sensor and foam, the ultrasonic sensor are arranged far from the side of the light-emitting surface, and foam encapsulation residence is stated
Ultrasonic sensor.
2. the manufacturing method according to claim 1, which is characterized in that the foam includes first layer foam and second layer bubble
Cotton, it is described to include: the step of the metallized film forms ultrasonic wave mould group far from the side of the light-emitting surface
The first layer foam is formed far from the side of the light-emitting surface in the metallized film；
Accommodating space is formed on the first layer foam；
The ultrasonic sensor is arranged in the accommodating space；And
The second layer foam, the first layer bubble are formed far from the surface of the metallized film in the ultrasonic sensor
Cotton connects with the second layer foam.
3. the manufacturing method according to claim 1, which is characterized in that described to go out light far from described in the metallized film
The side in face forms the step of ultrasonic wave mould group and includes:
Side of the metallized film far from the light-emitting surface is arranged in the ultrasonic sensor；And
Far from the side of the light-emitting surface form the foam in the metallized film so that foam encapsulation residence state it is super
Sonic sensor.
4. the manufacturing method according to claim 1, which is characterized in that the manufacturing method further include:
Shielded layer is formed between the metallized film and the ultrasonic wave mould group, the shielding layer grounding is to shield electromagnetism letter
Number.
5. the manufacturing method according to claim 1, which is characterized in that the manufacturing method further include:
Viscose is formed on the surface far from the metallized film of the foam.
6. a kind of display module characterized by comprising
Display screen, the display screen include light-emitting surface；
Side of the display screen far from the light-emitting surface is arranged in metallized film, the metallized film；And
Ultrasonic wave mould group, side of the metallized film far from the light-emitting surface is arranged in the ultrasonic wave mould group, described super
Sound wave mould group includes ultrasonic sensor and foam, and the ultrasonic sensor is arranged far from the side of the light-emitting surface, institute
It states foam encapsulation residence and states ultrasonic sensor.
7. display module according to claim 6, which is characterized in that the foam includes:
First layer foam, the first layer foam are arranged in side of the metallized film far from the light-emitting surface, and described
One layer of foam offers accommodating space, and the ultrasonic sensor is arranged in the accommodating space；And
Surface of the ultrasonic sensor far from the metallized film is arranged in second layer foam, the second layer foam,
The first layer foam connects with the second layer foam.
8. display module according to claim 6, which is characterized in that the ultrasonic sensor is arranged in the metallization
Side of the metallized film far from the light-emitting surface is arranged in seal in side of the film far from the light-emitting surface, the foam
Load the ultrasonic sensor.
9. display module according to claim 6, which is characterized in that the display screen includes organic light-emitting diode display
Screen.
10. display module according to claim 6, which is characterized in that the metallized film includes that metallized polyester is thin
Film or metallized polyimide film.
11. display module according to claim 6, which is characterized in that the display module further includes shielded layer, the screen
It covers layer to be arranged between the metallized film and the ultrasonic wave mould group, the shielding layer grounding is to shield electromagnetic signal.
12. display module according to claim 6, which is characterized in that the display module further includes viscose, the viscose
The surface far from the metallized film of the foam is set.
13. display module according to claim 6, which is characterized in that the ultrasonic sensor includes:
Substrate；
Multiple pixel electrodes, multiple pixel electrode production are on the substrate and in array distribution；
Piezoelectric element, the piezoelectric element are arranged on the substrate and cover multiple pixel electrodes, the piezoelectric element
For emitting ultrasonic wave and generating electric signal after the ultrasonic wave for receiving object reflection to be detected, multiple pixel electrodes are used for
Receive the electric signal；
Conductive electrode, the conductive electrode are arranged on the piezoelectric element, the piezoelectric element be located at the pixel electrode and
Between the conductive electrode；And
The processing chip connecting with multiple pixel electrodes, the processing chip form described for handling the electric signal
The ultrasonograph of object to be detected.
14. display module according to claim 6, which is characterized in that the film knot that the ultrasonic sensor is integrated
Structure.
15. a kind of electronic device characterized by comprising
Shell；And
Display module described in claim 6-14 any one, the display module setting is on the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710818924.6A CN109492469A (en) | 2017-09-12 | 2017-09-12 | Display module and its manufacturing method and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710818924.6A CN109492469A (en) | 2017-09-12 | 2017-09-12 | Display module and its manufacturing method and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109492469A true CN109492469A (en) | 2019-03-19 |
Family
ID=65688927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710818924.6A Withdrawn CN109492469A (en) | 2017-09-12 | 2017-09-12 | Display module and its manufacturing method and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109492469A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111914776A (en) * | 2020-08-07 | 2020-11-10 | 业泓科技(成都)有限公司 | Display device |
| CN114172982A (en) * | 2020-09-10 | 2022-03-11 | 北京小米移动软件有限公司 | Protection substrate, display module and terminal equipment |
-
2017
- 2017-09-12 CN CN201710818924.6A patent/CN109492469A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111914776A (en) * | 2020-08-07 | 2020-11-10 | 业泓科技(成都)有限公司 | Display device |
| CN111914776B (en) * | 2020-08-07 | 2023-12-22 | 业泓科技(成都)有限公司 | display device |
| CN114172982A (en) * | 2020-09-10 | 2022-03-11 | 北京小米移动软件有限公司 | Protection substrate, display module and terminal equipment |
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Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Applicant before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Applicant after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |
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Application publication date: 20190319 |