CN109492496A - Ultrasonic fingerprint identifies mould group and electronic equipment - Google Patents
Ultrasonic fingerprint identifies mould group and electronic equipment Download PDFInfo
- Publication number
- CN109492496A CN109492496A CN201710819516.2A CN201710819516A CN109492496A CN 109492496 A CN109492496 A CN 109492496A CN 201710819516 A CN201710819516 A CN 201710819516A CN 109492496 A CN109492496 A CN 109492496A
- Authority
- CN
- China
- Prior art keywords
- ultrasonic
- mould group
- cover board
- ultrasonic fingerprint
- ultrasonic sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/302—Sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/308—Membrane type
Landscapes
- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The present invention relates to a kind of ultrasonic fingerprint identification mould group and electronic equipment, ultrasonic fingerprint identifies that mould group includes cover board, ultrasonic sensor and circuit board；The top surface of the cover board is towards contact object, and the cover board is covered in the top surface of the ultrasonic sensor；The ultrasonic sensor can emit ultrasonic wave, and be able to detect ultrasonic wave through reflection；The circuit board is electrically connected with the ultrasonic sensor.In above-mentioned ultrasonic fingerprint identification mould group and electronic equipment, cover board is covered in the top surface of ultrasonic sensor, can play a protective role to ultrasonic sensor, so as to improve the reliability of ultrasonic fingerprint identification mould group.
Description
Technical field
The present invention relates to fingerprint identification technology fields, identify that mould group and electronics are set more particularly to a kind of ultrasonic fingerprint
It is standby.
Background technique
Ultrasonic fingerprint identification technology is the ability for having penetrable material using ultrasonic wave, and is generated greatly with the different of material
Small different echo (when i.e. ultrasonic wave reaches unlike material surface, the ultrasonic energy that is reflected back toward and after distance it is different)
And carry out fingerprint recognition.Therefore, using skin and air for the difference of sound impedance, so that it may distinguish fingerprint ridge and valley institute
Position.Ultrasonic fingerprint identification technology fingerprint can be carried out deeper into analytical sampling, or even the table that can penetrate to the skin
The unique three-dimensional feature of fingerprint is identified under face.Moreover, because ultrasonic wave has certain penetrability, therefore have on a small quantity in finger
Work is remained in the case where dirt or humidity, the equipment such as glass, aluminium, stainless steel, sapphire can be penetrated and identified.Therefore,
Ultrasonic fingerprint identification technology is increasingly valued by people.
However, ultrasonic fingerprint identification technology is in initial stage of development, and the performance of ultrasonic fingerprint identification mould group is straight
The accuracy for influencing fingerprint recognition is connect, therefore how the performance of Optimization for Ultrasonic Wave fingerprint recognition mould group is a problem to be solved.
Summary of the invention
Based on this, it is necessary to how Optimization for Ultrasonic Wave fingerprint recognition mould group performance aiming at the problem that, a kind of ultrasound is provided
Wave fingerprint recognition mould group and electronic equipment.
A kind of ultrasonic fingerprint identification mould group, including cover board, ultrasonic sensor and circuit board；The top surface court of the cover board
To contact object, and the cover board is covered in the top surface of the ultrasonic sensor；The ultrasonic sensor can emit super
Sound wave, and it is able to detect ultrasonic wave through reflection；The circuit board is electrically connected with the ultrasonic sensor.Cover board is covered in super
The top surface of sonic sensor can play a protective role to ultrasonic sensor, so as to improve ultrasonic fingerprint identification mould
The reliability of group.
The ultrasonic fingerprint identification mould group further includes for carrying out the matched matching of acoustic resistance in one of the embodiments,
Layer；The matching layer is located on the same floor between the cover board and the ultrasonic sensor, and with the circuit board.Specifically
Ground, the matching layer are liquid glue or hot pressing glue film.Matching layer in addition to offset can also be filled with the matched effect of acoustic resistance,
To improve the validity of ultrasonic transmission.
The ultrasonic fingerprint identification mould group further includes ink layer in one of the embodiments, and the ink layer is located at
Between the cover board and the matching layer.Ink layer can mix colours to cover board, can be so as to show different appearances
The accurate location of touch is found in user.
The color of the ink layer is black, white, blue or red in one of the embodiments, so as to full
The demand of sufficient different colours product
In one of the embodiments, the thickness of the cover board between 0.4mm between 0.8mm, when the thickness of the cover board
When degree is less than 0.4mm, the intensity decline of cover board is serious, is easy to fracture；When the thickness of cover board is greater than 0.8mm, supersonic sensing
The ultrasonic wave that device is sent is not easy to penetrate cover board and detect user fingerprints, causes fingerprint detection sensitivity inadequate, therefore the lid
Plate with a thickness of 0.4mm~0.8mm when, not only can guarantee cover board intensity but can guarantee ultrasonic fingerprint detection sensitivity.
In one of the embodiments, the ultrasonic sensor include thin film transistor (TFT) pel array layer, piezoelectric layer and
Electrode layer.
The material of the electrode layer is silver paste in one of the embodiments,.
The cover board is that the shell of electronic equipment or the cover board are embedded in electronics and set in one of the embodiments,
In standby shell or the cover board is installed below the shell of electronic equipment.
A kind of electronic equipment, including the ultrasonic fingerprint identify mould group.
In above-mentioned ultrasonic fingerprint identification mould group and electronic equipment, cover board is covered in the top surface of ultrasonic sensor, can be with
It plays a protective role to ultrasonic sensor, so as to improve the reliability of ultrasonic fingerprint identification mould group.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
The attached drawing of other embodiments is obtained according to these attached drawings.
Fig. 1 is the structural schematic diagram that the ultrasonic fingerprint that an embodiment provides identifies mould group；
Fig. 2 is that the ultrasonic fingerprint of Fig. 1 illustrated embodiment identifies one of concrete structure schematic diagram of mould group.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give presently preferred embodiments of the present invention.But the invention can be realized in many different forms, however it is not limited to this paper institute
The embodiment of description.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more thorough
Comprehensively.
Unless otherwise defined, the skill of all technical and scientific terms used herein and the technical field for belonging to invention
The normally understood meaning of art personnel is identical.It is specific that description is intended merely in the term used in the description of invention herein
The purpose of embodiment, it is not intended that the limitation present invention.Term as used herein "and/or" includes one or more relevant institutes
Any and all combinations of list of items.
One embodiment provides a kind of ultrasonic fingerprint identification mould group, and it is super which identifies that mould group can utilize
The fingerprint of ultra sonic scanner user, and fingerprint is identified, it can be installed in electronic equipment (electronic equipment is, for example, mobile phone).
In present embodiment, referring to FIG. 1, ultrasonic fingerprint identification mould group includes cover board 110, ultrasonic sensor 120 and circuit board
130。
Cover board 110 is covered in the top surface of ultrasonic sensor 120, and the top surface of cover board 110 is towards contact object (contact pair
Finger as being, for example, user).In Fig. 1, the top surface of ultrasonic sensor 120 is the upper surface of ultrasonic sensor 120, lid
The top surface of plate 110 is the upper surface of cover board 110.Wherein, cover board 110 has protective effect to ultrasonic sensor 120, so as to
To improve the reliability of ultrasonic fingerprint identification mould group.Cover board 110 can be the material that can be penetrated by ultrasonic wave, such as glass
Glass, plastics or metal (such as aluminium) etc..
Specifically, cover board 110 directly can be embedded in electronic equipment for the shell of electronic equipment or cover board 110
Shell in or cover board 110 be installed below the shell of electronic equipment.Specifically, the thickness of cover board 110 between 0.4mm extremely
Between 0.8mm, for example, 0.4mm, 0.55mm, 0.65mm or 0.8mm.Cover board 110 with a thickness of above-mentioned each value when, it is ensured that
Ultrasonic wave can penetrate cover board 110.Also, cover board 110 has different types of thickness value, can satisfy multiple types product
Demand.When the thickness of cover board 110 is less than 0.4mm, the intensity decline of cover board 110 is serious, is easy to fracture；When the thickness of cover board 110
When degree is greater than 0.8mm, the ultrasonic wave that ultrasonic sensor 120 is sent is not easy to penetrate cover board 110 and detect user fingerprints, causes
Fingerprint detection sensitivity is inadequate, thus cover board 110 with a thickness of 0.4mm~0.8mm when, not only can guarantee 110 intensity of cover board but also energy
Guarantee the sensitivity of ultrasonic fingerprint detection.
Ultrasonic sensor 120 can emit ultrasonic wave, and be able to detect ultrasonic wave through reflection.Ultrasonic sensor
120 for example including thin film transistor (TFT) pel array layer, piezoelectric layer and electrode layer.
Wherein, thin film transistor (TFT) pel array layer is referred to as TFT substrate, refers to and is equipped with several film crystals above
The substrate of pipe and the line related being electrically connected with each thin film transistor (TFT), can be handled received electric signal.Electrode layer
It is electrically conductive, it is made of an electrically conducting material.Conductive material is, for example, silver paste.
Specifically, when conductive material is silver paste, the solidification temperature of silver paste is lower than second threshold.In other words, conductive material
The lower silver paste of solidification temperature is selected, such as (it is the thick film using superfine flake silver powder as conductive phase to selection low-temperature solidified silver paste
Conductor paste).Due to piezoelectric layer non-refractory, conductive material selects the lower silver paste of solidification temperature, can reduce high temperature
It is influenced caused by piezoelectric layer, to improve the reliability of ultrasonic fingerprint identification mould group.
Further, conductive material is also an option that partial size is less than the silver paste of setting partial size threshold value, so as to reduce silver
Starch the crenellated phenomena and roughness at edge.Due on ultrasonic wave conducting path, perpendicular to the border surface in path it is more smooth more
It is easy conduct ultrasound, therefore conductive material selects the lesser silver paste of partial size, electrode layer conduction ultrasound can also be further increased
The performance of wave.
Piezoelectric layer is made out of a piezoelectric material.The piezoelectricity after electrode layer has been applied the high frequency electrical signal from circuit board 130
Layer can produce ultrasonic wave, also, piezoelectric layer can also will be converted to electric signal by reflected ultrasonic wave from contact object,
The electric signal is sent to circuit board 130 after corresponding processing (such as amplification) through thin film transistor (TFT) pel array layer again.
Circuit board 130 is electrically connected with ultrasonic sensor 120.Specifically, circuit board 130 and ultrasonic sensor 120
Side electrical connection.Circuit board 130 be used for ultrasonic sensor 120 provide control signal (such as to piezoelectric layer send high-frequency electrical
Signal) so that ultrasonic sensor 120 can emit ultrasonic wave.In addition, circuit board 130 may also receive from film crystalline substance
The electric signal of body pipe pel array layer forms fingermark image, to identify to fingerprint.Specifically, ultrasonic sensor 120 with
Circuit board 130 can be connected with bonding.Specifically, circuit board 130 is flexible circuit board.
In conclusion cover board 110 is covered in 120 top surface of ultrasonic sensor in above-mentioned ultrasonic fingerprint identification mould group,
So as to play a protective role to ultrasonic sensor 120, the reliability of ultrasonic fingerprint identification mould group is improved.
In one of the embodiments, with continued reference to FIG. 1, ultrasonic fingerprint identification mould group further includes for carrying out acoustic resistance
Matched matching layer 140.Matching layer 140 is located at together between cover board 110 and ultrasonic sensor 120, and with circuit board 130
One layer.
Wherein, matching layer 140 is for carrying out acoustic resistance matching, with reduce the piezoelectric layer of ultrasonic sensor 120 with contact pair
Acoustic resistance as between is poor, so that ultrasonic wave can be transmitted effectively.Specifically, matching layer 140 is liquid glue or hot pressing glue film.
Also, the material of matching layer 140 need to guarantee that ultrasonic wave can be penetrated.Wherein, hot pressing glue film refers to membranaceous hot pressing glue.Hot pressing
Glue refers to a kind of glue material that hot-press solidifying is needed after being glued, and for example, includes the hot pressing glue of epoxy resin.
In addition, circuit board 130 and ultrasonic sensor 120 will form ladder offset, therefore, in the present embodiment, by setting
Matching layer 140 is set, and is located at the region that 120 top surface of ultrasonic sensor is not covered by circuit board 130, so as to more
Mend existing ladder offset between ultrasonic sensor 120 and circuit board 130.Therefore, matching layer 140 with acoustic resistance in addition to matching
Effect, offset can also be filled, to improve the validity of ultrasonic transmission.
Further, when the thickness difference of cover board 110, the thickness of matching layer 140 does adaptable adjustment, to guarantee ultrasonic wave
The effect of conduction.
In one of the embodiments, referring to FIG. 2, above-mentioned ultrasonic fingerprint identification mould group further includes ink layer 150.Oil
The material of layer of ink 150 is, for example, ink.Ink layer 150 is between cover board 110 and matching layer 140.Ink layer 150 can be to lid
Plate 110 is mixed colours, to show different appearances, consequently facilitating user finds the accurate location of touch.
Specifically, the color of ink layer 150 is, for example, black, white, blue or red etc., so as to meet different face
The demand of color product.
Another embodiment provides a kind of electronic equipment, such as can be computer, tablet computer, individual digital and help
Reason, mobile phone etc..The electronic equipment includes the ultrasonic fingerprint identification mould group that above embodiment provides.
It should be noted that the ultrasonic fingerprint identification mould group and upper one in the electronic equipment that present embodiment provides is implemented
The principle of mode is identical, just repeats no more here.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of ultrasonic fingerprint identifies mould group, which is characterized in that including cover board, ultrasonic sensor and circuit board；The lid
The top surface of plate is towards contact object, and the cover board is covered in the top surface of the ultrasonic sensor；The ultrasonic sensor
Ultrasonic wave can be emitted, and be able to detect ultrasonic wave through reflection；The circuit board is electrically connected with the ultrasonic sensor.
2. ultrasonic fingerprint according to claim 1 identifies mould group, which is characterized in that the ultrasonic fingerprint identifies mould group
It further include for carrying out the matched matching layer of acoustic resistance；The matching layer between the cover board and the ultrasonic sensor,
And it is located on the same floor with the circuit board.
3. ultrasonic fingerprint according to claim 2 identifies mould group, which is characterized in that the matching layer is liquid glue or heat
Moulding film.
4. ultrasonic fingerprint according to claim 2 identifies mould group, which is characterized in that the ultrasonic fingerprint identifies mould group
It further include ink layer, the ink layer is between the cover board and the matching layer.
5. ultrasonic fingerprint according to claim 4 identifies mould group, which is characterized in that the color of the ink layer is black
Color, white, blue or red.
6. identifying mould group to ultrasonic fingerprint described in any one of 5 claims according to claim 1, which is characterized in that institute
The thickness of cover board is stated between 0.4mm between 0.8mm.
7. identifying mould group to ultrasonic fingerprint described in any one of 5 claims according to claim 1, which is characterized in that institute
Stating ultrasonic sensor includes thin film transistor (TFT) pel array layer, piezoelectric layer and electrode layer.
8. ultrasonic fingerprint according to claim 7 identifies mould group, which is characterized in that the material of the electrode layer is silver
Slurry.
9. identifying mould group to ultrasonic fingerprint described in any one of 5 claims according to claim 1, which is characterized in that institute
Stating the shell that cover board is electronic equipment, perhaps the cover board is embedded in the shell of electronic equipment or the cover board is installed on
Below the shell of electronic equipment.
10. a kind of electronic equipment, which is characterized in that refer to including ultrasonic wave described in any one of claim 1-9 claim
Line identifies mould group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710819516.2A CN109492496A (en) | 2017-09-12 | 2017-09-12 | Ultrasonic fingerprint identifies mould group and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710819516.2A CN109492496A (en) | 2017-09-12 | 2017-09-12 | Ultrasonic fingerprint identifies mould group and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109492496A true CN109492496A (en) | 2019-03-19 |
Family
ID=65689070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710819516.2A Withdrawn CN109492496A (en) | 2017-09-12 | 2017-09-12 | Ultrasonic fingerprint identifies mould group and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109492496A (en) |
-
2017
- 2017-09-12 CN CN201710819516.2A patent/CN109492496A/en not_active Withdrawn
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109492472A (en) | Ultrasonic fingerprint identifies mould group and electronic equipment | |
| US11346930B2 (en) | Method and apparatus of user verification by ultrasonic subdermal probe | |
| US9793465B2 (en) | Ultrasonic sensor utilizing chemically strengthened glass as substrate | |
| CN207182332U (en) | Ultrasonic fingerprint identifies module and electronic equipment | |
| CN207182317U (en) | Ultrasonic fingerprint identifies module and electronic equipment | |
| CN105447470A (en) | Electronic apparatus | |
| WO2017173739A1 (en) | Capacitive fingerprint recognition touch panel | |
| CN109492504A (en) | Ultrasonic wave biological identification device and preparation method thereof and electronic equipment | |
| US10445549B2 (en) | Fingerprint identification device and electronic device using same | |
| CN109669544A (en) | Finger-print region determines method and device, terminal and readable storage medium storing program for executing | |
| CN109492493A (en) | Ultrasonic fingerprint identifies mould group and electronic equipment | |
| CN106824735B (en) | Two-dimensional array ultrasonic probe and preparation method thereof | |
| CN108196732A (en) | Ultrasonic wave touch device and display device | |
| CN108268156A (en) | Touch screen and electronic device with fingerprint identification function | |
| CN207182310U (en) | Ultrasonic wave biological identification device and electronic equipment | |
| CN207690100U (en) | Ultrasonic fingerprint identifies module and electronic equipment | |
| CN109492480A (en) | Ultrasonic wave biological identification device and electronic equipment | |
| CN109492474A (en) | Ultrasonic fingerprint identifies mould group and electronic equipment | |
| CN109492496A (en) | Ultrasonic fingerprint identifies mould group and electronic equipment | |
| CN207182328U (en) | Ultrasonic fingerprint identifies module and electronic equipment | |
| CN108268816A (en) | Touch screen and electronic device with fingerprint identification function | |
| WO2018045740A1 (en) | Fingerprint recognition module and terminal | |
| CN109492502A (en) | Cover board, ultrasonic wave biological identification device and electronic equipment | |
| CN207182331U (en) | Ultrasonic fingerprint identifies module and electronic equipment | |
| CN109492488A (en) | Ultrasonic fingerprint identifies mould group and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330029 No. 1189 Jingdong Avenue, Nanchang high tech Zone, Jiangxi Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |
|
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190319 |