CN109492480A - Ultrasonic wave biological identification device and electronic equipment - Google Patents
Ultrasonic wave biological identification device and electronic equipment Download PDFInfo
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- CN109492480A CN109492480A CN201710819249.9A CN201710819249A CN109492480A CN 109492480 A CN109492480 A CN 109492480A CN 201710819249 A CN201710819249 A CN 201710819249A CN 109492480 A CN109492480 A CN 109492480A
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Classifications
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- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
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Abstract
The present invention relates to a kind of ultrasonic wave biological identification device and electronic equipments.The ultrasonic wave biological identification device includes supersonic sensing component, supersonic sensing component includes the packaging part that material is glass fibre, packaging part includes bottom plate, side plate and top plate, side plate is arranged one week around the edge of bottom plate, top plate is fixed on side plate far from the side of bottom plate, so that top plate, side plate and bottom plate enclose the accommodating chamber for being set as a sealing jointly, wherein, thin film transistor (TFT), piezoelectric layer and conductive layer are contained in accommodating chamber, and thin film transistor (TFT) is bonded far from the side of piezoelectric layer with bottom plate, conductive layer is bonded far from the side of piezoelectric layer with top plate.The service life of the ultrasonic wave biological identification device is longer and ultrasonic signal strength is higher.
Description
Technical field
The present invention relates to ultrasonic wave identification technology field, in particular to a kind of ultrasonic wave biological identification device and electronics are set
It is standby.
Background technique
Ultrasonic fingerprint identification technology can be scanned fingerprint by ultrasonic wave, with traditional fingerprint recognition mode phase
Than the identification of, ultrasonic fingerprint fingerprint can be carried out deeper into analysis, even if finger surface speckles with dirt and does not also hinder ultrasonic wave
Sampling, or even the unique 3D feature of fingerprint is identified under the surface that can also penetrate to the skin.Even if there is the feelings such as water, sweat on hand
Under condition, still can accurately it identify.However, the conductive layer of ultrasonic fingerprint identification device is easy to be aoxidized by oxygen gas and water etc., and
And after being frequently touched by human hands in transport process, the sweat on manpower will also result in the oxidation corrosion of conductive layer, this not only influences super
The service life of sound wave fingerprint identification device, and will affect the conduction efficiency of ultrasonic wave, reduce the signal strength of ultrasonic wave.
Summary of the invention
Based on this, it is necessary to provide that a kind of service life is longer and the higher ultrasonic wave biological identification of ultrasonic signal strength
Device.
In addition, also providing a kind of electronic equipment.
A kind of ultrasonic wave biological identification device, including supersonic sensing component, wherein the supersonic sensing component packet
It includes:
Thin film transistor (TFT)；
Piezoelectric layer is layered on the thin film transistor (TFT)；
Conductive layer is layered on the piezoelectric layer；
Material is the packaging part of glass fibre, and the packaging part includes bottom plate, side plate and top plate, and the side plate is around described
The edge of bottom plate is arranged one week, and the top plate is fixed on side of the side plate far from the bottom plate, so that the top plate, institute
It states side plate and the bottom plate encloses the accommodating chamber for being set as a sealing jointly, wherein the thin film transistor (TFT), the piezoelectric layer and described
Conductive layer is contained in the accommodating chamber, and side of the thin film transistor (TFT) far from the piezoelectric layer and the bottom plate paste
It closes, side of the conductive layer far from the piezoelectric layer is bonded with the top plate；And
Acoustic matching layer, positioned at the outside of the accommodating chamber, the acoustic matching layer is layered in the top plate far from the conduction
On the side of layer.
The material of above-mentioned ultrasonic wave biological identification device is that top plate, side plate and the bottom plate of the packaging part of glass fibre enclose jointly
It is set as the accommodating chamber of a sealing, thin film transistor (TFT), piezoelectric layer and conductive layer are contained in accommodating chamber, and thin film transistor (TFT) is separate
The side of piezoelectric layer is bonded with bottom plate, and conductive layer is bonded far from the side of piezoelectric layer with top plate, to guarantee ultrasonic wave in ultrasonic wave
The sealing that conductive layer is realized on the basis of biological identification device normal propagation, can be effectively prevented external oxygen and steam and lead
Electric layer contacts and causes the oxidation corrosion of conductive layer, while during also can be avoided and making acoustic matching layer etc. on the electrically conductive,
Contact of the manpower with conductive layer and the oxidation corrosion caused by conductive layer, are conducive to the use for increasing ultrasonic wave biological identification device
Service life；The reduction that conductive layer is oxidized corrosion on the other hand actually also improves ultrasonic wave biological identification to a certain extent
The signal strength of the ultrasonic wave of device, so that the ultrasonic signal strength of above-mentioned ultrasonic wave biological identification device is higher；And material
For glass fibre packaging part acoustic impedance close to glass, influenced caused by the conduction of ultrasonic wave it is smaller, to guarantee ultrasound
The normal use of wave biological identification device.
The thickness of the top plate is no more than 20 microns in one of the embodiments,.The thickness of top plate gets over Bao Yuehao, so that
Ultrasonic wave biological identification device has a lesser thickness.
The material of the conductive layer is silver in one of the embodiments,.Silver has preferable electric conductivity, can make to press
Electric layer emits the ultrasonic signal of higher-strength, and being capable of conduct ultrasound well.
It in one of the embodiments, further include the electricity that one end is arranged in the side plate and is tightly connected with the side plate
Road plate, there are two spaced bonding portion, two bonding portions are respectively positioned in the accommodating chamber circuit board tool, and two
The bonding portion respectively with the thin film transistor (TFT) and the conductive layer bonding.By the way that one end of circuit board is housed in packaging part
It is interior, and be tightly connected with circuit board, and two bonding portions of circuit board are respectively positioned in accommodating chamber, so that circuit board is in accommodating chamber
Bonding is carried out, can realize the hermetically sealed of conductive layer while realizing circuit board and conductive layer, thin film transistor (TFT) bonding.
The conductive layer includes plate-like body and side wall in one of the embodiments, and the plate-like body is layered in institute
It states between piezoelectric layer and the top plate, the side wall ring is arranged one week around the edge of the plate-like body, to form an accommodating cavity,
Side of the side wall far from the plate-like body is fixedly connected with the thin film transistor (TFT), so that the conductive layer and described thin
Film transistor cooperates the receiving piezoelectric layer jointly, and is formed on the outer surface of side of the side wall far from the plate-like body
There is the stage portion with a bonding portion bonding.By the way that conductive layer is arranged to above structure, is conducive to piezoelectric layer and launches
The consistent ultrasonic wave of signal strength, improves the uniformity of image；And stage portion, which is arranged, can facilitate the nation of circuit board and conductive layer
It is fixed.
The supersonic sensing component further includes the first adhesive layer and the second adhesive layer, institute in one of the embodiments,
It states the first adhesive layer to be layered between the conductive layer and the top plate, and the fixed bonding conductive layer and the top plate, institute
It states the second adhesive layer to be layered between the thin film transistor (TFT) and the bottom plate, and the fixed thin film transistor (TFT) and described of bonding
Bottom plate.By the first adhesive layer by conductive layer and the fixed bonding of top plate, the second adhesive layer is fixed viscous by thin film transistor (TFT) and bottom plate
Knot, can not only simplify the production process of ultrasonic wave biological identification device, and the first adhesive layer can also fill conductive layer and
Gap between top plate, to guarantee the normal conduction of ultrasonic wave, the second adhesive layer can be filled between thin film transistor (TFT) and bottom plate
Gap, prevent the dirt side far from piezoelectric layer that is attached to thin film transistor (TFT), and lead to that piezoelectric layer emits towards film crystal
The ultrasonic wave that the direction of pipe passes wave encounters the dirt being attached on thin film transistor (TFT) and reflects back and influence ultrasonic wave biological identification
The problem of normal imaging of device.
It in one of the embodiments, further include cover plate assembly, it is separate that the cover plate assembly is layered in the acoustic matching layer
On the side of the top plate, and cover the acoustic matching layer.Setting cover plate assembly can play the role of each layer of protection, be conducive to
Increase the service life of ultrasonic wave biological identification device.
The ultrasonic wave biological recognizer component further includes adhesive layer in one of the embodiments, the gluing layer stackup
Between the top plate and the acoustic matching layer, and the adhesive layer fixed bonding top plate and the acoustic matching layer.Pass through
The fixed bonding of the top plate of acoustic matching layer and packaging part can be simplified the production process of ultrasonic wave biological identification device by adhesive layer, and
Adhesive layer can also fill the gap between acoustic matching layer and the top plate of packaging part, to guarantee the normal conduction of ultrasonic wave.
It in one of the embodiments, further include the shielding part that can be shielded electromagnetic wave and light is prevented to pass through, the screen
Shield is layered on side of the bottom plate far from the thin film transistor (TFT), and the shielding part can also make ultrasonic wave decline
Subtract.Setting can shield that electromagnetic wave is passed through with prevention light and can make to surpass on side of the bottom plate far from thin film transistor (TFT)
The shielding part that sound wave is decayed can not only prevent external electromagnetic waves and light from doing caused by ultrasonic wave biological identification device
The precision of ultrasonic wave biological identification device is disturbed and influenced, and can also avoid ultrasonic wave towards thin film transistor (TFT) far from acoustic matching
It reflects to form image after the side conduction of layer and influences the precision of ultrasonic wave biological identification device, so that above-mentioned screen is arranged
Shield can be improved the precision of ultrasonic wave biological identification device.
The shielding part is black conductive foamed cotton layer, the black conductive foam layer stackup in one of the embodiments,
On side of the bottom plate far from the thin film transistor (TFT).Black conductive foamed cotton layer itself can reflect ultrasonic wave, while black
The color of color conducting foam layer is black and can be conductive, allows it to shielding electromagnetic wave and light is prevented to pass through, to improve
The precision of ultrasonic wave biological identification device, and black conductive foamed cotton layer lighter weight advantageously reduce ultrasonic wave biological identification
The weight of device.
The shielding part includes the insulation foamed cotton layer and black conductive adhesive film of stacking, institute in one of the embodiments,
State side and bottom plate side layer far from the thin film transistor (TFT) of the insulation foamed cotton layer far from the black conductive adhesive film
It is folded.Insulation foamed cotton layer can reflect ultrasonic wave, and itself also have certain ability to shut out the light, and black conductive adhesive film
Also it can shut out the light, and electromagnetic wave can also be shielded, to improve the precision of ultrasonic wave biological identification device.
The shielding part includes the absorbent treatment and black conductive adhesive film of stacking, the suction in one of the embodiments,
Side of the sound layer far from the black conductive adhesive film and the bottom plate are laminated far from the side of the thin film transistor (TFT), wherein
The absorbent treatment is selected from one of OCA optical adhesive layer and pressure-sensitive adhesive layer.OCA optical adhesive layer and pressure-sensitive adhesive layer can absorb super
Sound wave, and black conductive adhesive film can block extraneous light, and can also shield electromagnetic wave, to improve ultrasonic wave biological
The precision of identification device.
A kind of electronic equipment, including above-mentioned ultrasonic wave biological identification device.Since above-mentioned ultrasonic wave biological identification device makes
With lasting a long time and ultrasonic signal strength is higher, so that the electronic equipment has longer service life and more accurate knowledge
Other function.
Detailed description of the invention
Fig. 1 is the sectional view of the ultrasonic wave biological identification device of an embodiment；
Fig. 2 is the sectional view of the thin film transistor (TFT) of ultrasonic wave biological identification device shown in FIG. 1, piezoelectric layer and conductive layer；
Fig. 3 is the sectional view of the packaging part of ultrasonic wave biological identification device shown in FIG. 1；
Fig. 4 is the sectional view of the ultrasonic wave biological identification device of another embodiment；
Fig. 5 is the sectional view of the ultrasonic wave biological identification device of another embodiment；
Fig. 6 is the sectional view of the ultrasonic wave biological identification device of another embodiment；
Fig. 7 is the sectional view of the ultrasonic wave biological identification device of another embodiment.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give preferred embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more saturating
It is thorough comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.
As shown in Figure 1, electronic equipment of an embodiment, such as mobile phone, computer etc., including ultrasonic wave biological identification device
100, which for example can be used for the identification of fingerprint.Wherein, the ultrasonic wave biological identification device
100 include cover plate assembly 110, supersonic sensing component 120, circuit board 130 and shielding part 140.
Cover plate assembly 110 can be embedded in the interior of shell of electronic equipment, can also be laminated with the shell of electronic equipment.Lid
Board group part 110 includes cover board 112 and ink layer 114.
Cover board 112 is Transparent Parts.Cover board 112 is in transparency glass plate, quartz plate, alumina plate and transparent organic board
One kind, the cover board 112 of these materials not only have more appropriate mechanical strength, and can satisfy industrial design (ID,
Industrial Design) requirement.Specifically, cover board 112 is inlayed in the housing of the electronics device, alternatively, and electronic equipment
Shell be stacked.
Ink layer 114 is layered on a surface of cover board 112.Ink layer 114 can be formed by modes such as silk-screen printings
On cover board 112.Specifically, ink layer 114 is black ink layer or white ink layer.
By setting Transparent Parts for cover board 112, and ink layer 114 is set on cover board 112, cover plate assembly can be made
110 have required color, and cover plate assembly 110 is made to have the function of blocking extraneous light.
Supersonic sensing component 120 can emit ultrasonic wave, and can receive the ultrasonic wave being reflected back, and will reflect back into
Ultrasonic wave is converted into electric signal.Specifically, cover plate assembly 110 and supersonic sensing component 120 are laminated.Wherein, supersonic sensing
Component 120 includes thin film transistor (TFT) 122, piezoelectric layer 123, conductive layer 124, packaging part 125 and acoustic matching layer 126.
The circuit for converting the electrical signal to image is provided on thin film transistor (TFT) 122.
Piezoelectric layer 123 is layered on thin film transistor (TFT) 122.Piezoelectric layer 123 can emit ultrasonic wave, and can receive reflection
The ultrasonic wave returned.
Specifically, the material of piezoelectric layer 123 is ferroelectric polymers；More specifically, the material of piezoelectric layer 123 is P (VDF-
TrFE) (copolymer of Kynoar and trifluoro-ethylene).Wherein, in P (VDF-TrFE), Kynoar and trifluoro-ethylene
Molar ratio is 60:40,70:30,80:20 or 90:10.It is appreciated that the material of piezoelectric layer 123 is not limited to above-mentioned material, example
Such as, the material of piezoelectric layer 123 can also be the homopolymer of polyvinylidene chloride (PVDC), the copolymer, poly- of polyvinylidene chloride
The homopolymer of tetrafluoroethene, the copolymer of polytetrafluoroethylene (PTFE), Kynoar or diisopropylamine bromide (DTPAB) etc..
Conductive layer 124 is laminated on piezoelectric layer 123.Specifically, it is arranged on piezoelectric layer 123 and thin film transistor (TFT) 122, and
Cooperation accommodates piezoelectric layer 123 jointly with thin film transistor (TFT) 122.
Specifically, the material of conductive layer 124 is silver.Conductive layer 124 can be by silk-screen printing silver paste, then using sintering
It is prepared.
It it should be noted that the material of conductive layer 124 is not limited to silver, such as can also be ITO etc..
Referring to Figure 2 together, specifically, conductive layer 124 includes plate-like body 124a and side wall 124b, plate-like body 124a
It is laminated with piezoelectric layer 123, side wall 124b is arranged one week around the edge of plate-like body 124a, and to form an accommodating cavity, (figure is not
Mark), side of the side wall 124b far from plate-like body 124a is fixedly connected with thin film transistor (TFT) 122, so that conductive layer 124 and film
Cooperation accommodates piezoelectric layer 123 to transistor 122 jointly.By the way that conductive layer 124 is arranged to above structure, be conducive to piezoelectric layer 123
Launch the consistent ultrasonic wave of signal strength, improves the uniformity of image.
Also referring to Fig. 3, the material of packaging part 125 is glass fibre.Packaging part 125 has bottom plate 1252, side plate
1254 and top plate 1256, side plate 1254 is arranged one week around the edge of bottom plate 1252, and it is separate that top plate 1256 is fixed on side plate 1254
On the side of bottom plate 1252, so that top plate 1256, side plate 1254 and bottom plate 1252 enclose the accommodating chamber 1257 for being set as a sealing jointly.
Wherein, thin film transistor (TFT) 122, piezoelectric layer 123 and conductive layer 124 are contained in accommodating chamber 1257, and thin film transistor (TFT) 122 is remote
The side of tripping electric layer 123 is bonded with bottom plate 1252, and side of the conductive layer 124 far from piezoelectric layer 123 is bonded with top plate 1256.Tool
Body, the plate-like body 124a of conductive layer 124 is laminated far from the side of piezoelectric layer 123 and top plate 1256.
Specifically, side plate 1254 includes the first plate portion 1254a and the second plate portion 1254b, the first plate portion 1254a around bottom plate
1252 edge is arranged one week, and the second plate portion 1254b is arranged one week around the edge of top plate 1256, and the second plate portion 1254b is remote
One end and the first plate portion 1254a from top plate 1256 are tightly connected far from one end of bottom plate 1252, are set as accommodating chamber to enclose
1257.Wherein, the second plate portion 1254b and the first plate portion 1254a is tightly connected by glass cement；First plate portion 1254a and bottom plate
1252 are an integral molding structure, at this point, forming in a mold after directly melting glass fibre；Second plate portion 1254b and top plate
1256 are an integral molding structure, and form in a mold after can also directly melting glass fibre.It is appreciated that the first plate portion
1254a and bottom plate 1252 can also be separately formed, then fixed with glass cement；Second plate portion 1254b and top plate 1256
Can be separately formed, then fixed with glass cement.
Further, the thickness of top plate 1256 is no more than 20 microns.The thickness of top plate 1256 gets over Bao Yuehao, so that ultrasonic wave
Biological identification device 100 has a lesser thickness.
Further, supersonic sensing component 120 further includes the first adhesive layer 127 and the second adhesive layer 128, the first bonding
Layer 127 is layered between conductive layer 124 and top plate 1256, and fixed bonding conductive layer 124 and top plate 1256, the second adhesive layer
128 are layered between thin film transistor (TFT) 122 and bottom plate 1252, and fixed adhesive film transistor 122 and bottom plate 1252.Pass through
One adhesive layer 127 is by the fixed bonding of conductive layer 124 and top plate 1256, and the second adhesive layer 128 is by thin film transistor (TFT) 122 and bottom plate
1252 fixed bondings can not only simplify the production process of ultrasonic wave biological identification device 100, and the first adhesive layer 127 is also
The gap between conductive layer 124 and top plate 1256 can be filled, to guarantee the normal conduction of ultrasonic wave, 128 energy of the second adhesive layer
The gap between thin film transistor (TFT) 122 and bottom plate 1252 is enough filled, dirt is prevented to be attached to thin film transistor (TFT) 122 far from piezoelectric layer
123 side, and cause piezoelectric layer 123 emit towards thin film transistor (TFT) 122 direction pass wave ultrasonic wave encounter be attached to it is thin
The problem of dirt on film transistor 122 reflects back and influences the normal imaging of ultrasonic wave biological identification device.Specifically scheming
In the embodiment shown, the first adhesive layer 127 is layered between the plate-like body 124a of conductive layer 124 and top plate 1256, and first
The fixed bonding plate-like body 124a of adhesive layer 127 and top plate 1256.Specifically, the first adhesive layer 127 and the second adhesive layer 128
Material is epoxy resin glue, such as the NCA3285 of Henkel.
It should be noted that the first adhesive layer 127 and the second adhesive layer 128 also can be omitted, at this point it is possible to by glass fibers
It is formed on conductive layer 124 and thin film transistor (TFT) 122 after dimension melting.
Acoustic matching layer 126 is located at the outside of accommodating chamber 1257, and acoustic matching layer 126 is layered in top plate 1256 far from conductive layer
On 124 side.Acoustic matching layer 126 is for matching the acoustic impedance of object to be detected (such as crestal line of finger).Specifically
Ground, cover plate assembly 110 is layered on side of the acoustic matching layer 126 far from the top plate 1256 of packaging part 125, and covers acoustic matching layer
126；Acoustic matching layer 126 is layered in the top plate 1256 of packaging part 125 far from the side of the plate-like body 124a of conductive layer 124.
More specifically, cover board 112 is formed with the side and the one of top plate 1256 of the acoustic matching layer 126 far from packaging part 125 of ink layer 114
Side stacking.Wherein, the side of top plate 1256 of the acoustic matching layer 126 far from packaging part 125 is detection zone.
Specifically, acoustic matching layer 126 is that chip attaches film (Die attach film, DAF).
Further, acoustic matching layer 126 with a thickness of 20 microns~100 microns, piezoelectric layer 123 with a thickness of 8 microns~
10 microns.The acoustic matching layer 126 of the thickness can be well matched with the piezoelectric layer 123 of the thickness, to enhance the letter of ultrasonic wave
Number, improve the accuracy that ultrasonic wave biological identification device 100 identifies.
Further, supersonic sensing component 120 further includes adhesive layer 129, and adhesive layer 129 is layered in packaging part 125
Between top plate 1256 and acoustic matching layer 126, and the top plate 1256 and acoustic matching layer of the fixed bonding packaging part 125 of adhesive layer 129
126.Acoustic matching layer 126 and the fixed bonding of top plate 1256 can be simplified into ultrasonic wave biological identification device 100 by adhesive layer 129
Production process, and adhesive layer 129 can also fill the gap between acoustic matching layer 126 and top plate 1256, to guarantee ultrasonic wave
Normal conduction.Wherein, the material of adhesive layer 129 is epoxy resin glue, such as the NCA3285 of Henkel.
It is appreciated that adhesive layer 129 also can be omitted, can directly on the top plate 1256 of packaging part 125 formation sound
With layer 126, such as by techniques such as coating, silk-screen printing, sprayings, at this point, need to be with glue by acoustic matching layer 126 and cover plate assembly
110 are bonded together, and glue is epoxy resin glue, such as the NCA3285 of Henkel.
Circuit board 130 is flexible circuit board.One end of circuit board 130 be arranged in the side plate 1254 of packaging part 125 and with envelope
The side plate 1254 of piece installing 125 is tightly connected.There are two spaced bonding portion 132, two bonding portions 132 for the tool of circuit board 130
Be respectively positioned in accommodating chamber 1257, two bonding portions 132 respectively with thin film transistor (TFT) 122 and 124 bonding of conductive layer (bonding).
It is tightly connected by the way that one end of circuit board 130 to be housed in packaging part 125, and with circuit board 130, two bonding portions 132 divide
Not with 124 bonding of thin film transistor (TFT) 122 and conductive layer, conductive layer 124 can be realized while realizing 130 bonding of circuit board
It is hermetically sealed.
Further, power circuit board 130 is offered at least one of the first plate portion 1254a and the second plate portion 1254b
The notch 1258 passed through, circuit board 130 pass through after the notch 1258 by using glue fill circuit board 130 and side plate 1254 it
Between gap, with realize be tightly connected.Wherein, the glue of filling is glass cement.Specifically in the illustrated embodiment, notch 1258
On the second side of the plate portion 1254b far from top plate 1256.
It is appreciated that notch 1258 is not limited to be located on the second side of the plate portion 1254b far from top plate 1256, for example, lacking
Mouth 1258 is located on the first side of the plate portion 1254a far from bottom plate 1252；Alternatively, the second plate portion 1254b is far from top plate 1256
Jagged 1258 are opened up on side and on first side of the plate portion 1254a far from bottom plate 1252, two common shapes of notch 1258
The hole passed through at a power circuit board 130.
Further, stage portion 124c, platform are formed on the outer surface of side of the side wall 124b far from plate-like body 124a
132 bonding of bonding portion of rank portion 124c and circuit board 130.130 He of circuit board can be facilitated by the way that stage portion 124c is arranged
The bonding of conductive layer 124.
Shielding part 140 is layered on side of the bottom plate 1252 far from thin film transistor (TFT) 122, and shielding part 140 can shield electricity
Magnetic wave and prevention light pass through, and shielding part 140 can also make ultrasonic wave decay.
Wherein, shielding part 140 is black conductive foamed cotton layer, and shielding part 140 is layered in bottom plate 1252 far from thin film transistor (TFT)
On 122 side.Black conductive foamed cotton layer itself can reflect ultrasonic wave, at the same the color of black conductive foamed cotton layer be black and
Can be conductive, it allows it to shielding electromagnetic wave and light is prevented to pass through, to improve the accurate of ultrasonic wave biological identification device 100
Degree, and black conductive foamed cotton layer lighter weight, advantageously reduce the weight of ultrasonic wave biological identification device 100.Specifically, it shields
Part 140 can be bonded on bottom plate 1252 by glue, and glue for example can be acrylic resin adhesive；Shielding part 140 can also
It is fixedly connected in a manner of through hot melt with bottom plate 1252.
It should be noted that shielding part 140 is not limited to black conductive foamed cotton layer, shielding part 140 can also be other knots
Structure, for example, shielding part 140 includes the insulation foamed cotton layer and black conductive adhesive film of stacking, the foamed cotton layer that insulate is far from black conductive
The side of adhesive film and bottom plate 1252 are laminated far from the side of thin film transistor (TFT) 122, which can shut out the light, shield
Electromagnetic wave is covered, and can also be reflected ultrasonic wave.Alternatively, shielding part 140 is not limited to reflect ultrasonic wave, it can also be absorption ultrasonic wave
To improve the accuracy of its identification function, for example, shielding part 140 includes the absorbent treatment and black conductive adhesive film of stacking, sound absorption
Side and bottom plate 1252 of the layer far from black conductive adhesive film are laminated far from the side of thin film transistor (TFT) 122, wherein sound absorption layer choosing
From one of OCA optical adhesive layer and pressure-sensitive adhesive layer, which can shut out the light, shield electromagnetic wave, and can also inhale
Receive the ultrasonic wave being in contact with it.
It should be noted that conductive layer 124 is not limited to above structure, conductive layer 124 can moreover be only a plate structure,
At this point, conductive layer 124 is directly layered on piezoelectric layer 123.Wherein, shielding part 140 also can be omitted；Cover plate assembly 110 can also
To omit, at this point, acoustic matching layer 126 is directly laminated with the shell of electronic equipment, i.e., the shell of electronic equipment replaces cover plate assembly
110；Adhesive layer 129 also can be omitted, at this point it is possible to which acoustic matching layer 126 is painted on top plate 1256.
Above-mentioned ultrasonic wave biological identification device 100 at least has the advantage that
(1) material of above-mentioned ultrasonic wave biological identification device is top plate 1256, the side plate of the packaging part 125 of glass fibre
1254 and bottom plate 1252 enclose the accommodating chamber 1257 for being set as a sealing, thin film transistor (TFT) 122, piezoelectric layer 123 and conductive layer 124 jointly
It is contained in accommodating chamber 1257, and side of the thin film transistor (TFT) 122 far from piezoelectric layer 123 is bonded with bottom plate 1252, conductive layer
124 side far from piezoelectric layer 123 is bonded with top plate 1256, to guarantee ultrasonic wave in ultrasonic wave biological identification device normal propagation
On the basis of realize conductive layer 124 sealing, external oxygen and steam can be effectively prevented and contact and cause with conductive layer 124
The oxidation corrosion of conductive layer 124, at the same also can be avoided made on conductive layer 124 acoustic matching layer 126 it is equal durings, manpower with
The contact of conductive layer 124 and to oxidation corrosion caused by conductive layer 124, be conducive to increase ultrasonic wave biological identification device 100
Service life；It reduces conductive layer 124 to the greatest extent simultaneously and is oxidized corrosion, guarantee normal conduction of the ultrasonic wave in conductive layer 124,
The reduction that another aspect conductive layer 124 is oxidized corrosion actually also improves ultrasonic wave biological identification device to a certain extent
The signal strength of 100 ultrasonic wave, so that the ultrasonic signal strength of above-mentioned ultrasonic wave biological identification device 100 is higher；And material
Matter be glass fibre packaging part 125 acoustic impedance close to glass, influenced caused by the conduction of ultrasonic wave it is smaller, to guarantee
The normal use of ultrasonic wave biological identification device 100
And above-mentioned ultrasonic wave biological identification device 100 is subjected to fingerprint recognition test, the resolution ratio of the image of formation is 3.5
More than pixel per inch, i.e., the above-mentioned ultrasonic wave biological identification device 100 for being provided with packaging part 125 still has preferable identification
Function.
(2) setting can shield electromagnetic wave and light is prevented to wear on side of the bottom plate 1252 far from thin film transistor (TFT) 122
Shielding part 140 cross and that ultrasonic wave can be made to decay, can not only be to prevent external electromagnetic waves and light to ultrasonic wave
The precision of ultrasonic wave biological identification device 100 is interfered and influenced caused by biological identification device 100, but also can be made and be shielded
The ultrasonic wave that shield 140 contacts is decayed, while can also avoid ultrasonic wave towards thin film transistor (TFT) 122 far from acoustic matching layer
It reflects to form image after 126 side conduction and influences the precision of ultrasonic wave biological identification device 100.
In addition, making since above-mentioned 100 service life of ultrasonic wave biological identification device is longer and ultrasonic signal strength is higher
Obtaining the electronic equipment has longer service life and more accurate identification function.
As shown in figure 4, the ultrasonic wave biological identification device 200 of another embodiment and ultrasonic wave biological identification device 100
Structure it is roughly the same, difference is, the shielding part 210 of the ultrasonic wave biological identification device 200 of present embodiment includes stacking
Insulation foamed cotton layer 212 and black conductive adhesive film 214, insulate side of the foamed cotton layer 212 far from black conductive adhesive film 214 with
Bottom plate 220 is laminated far from the side of thin film transistor (TFT) 230.Wherein, insulation foamed cotton layer 212 can be bonded in bottom plate 220 by glue
On, and it can be adhered to by way of hot melt on bottom plate 220.
Due to the structure and ultrasonic wave biological identification device 100 of the ultrasonic wave biological identification device 200 of present embodiment
Structure is roughly the same, and therefore, ultrasonic wave biological identification device 200 also has the similar effect of ultrasonic wave biological identification device 100.
And insulation foamed cotton layer 212 can reflect ultrasonic wave, and itself have certain ability to shut out the light, and black conductive adhesive film
214 can also shut out the light, and can also shield electromagnetic wave, to improve the precision of ultrasonic wave biological identification device.
As shown in figure 5, the ultrasonic wave biological identification device 300 of another embodiment and ultrasonic wave biological identification device 100
Structure it is roughly the same, difference is, the shielding part 310 of the ultrasonic wave biological identification device 300 of present embodiment includes stacking
Absorbent treatment 312 and black conductive adhesive film 314.Side of the absorbent treatment 312 far from black conductive adhesive film 314 and bottom plate 320
Side far from thin film transistor (TFT) 330 is laminated, wherein absorbent treatment 312 is selected from one of OCA optical adhesive layer and pressure-sensitive adhesive layer.
Since OCA optical adhesive layer and pressure-sensitive adhesive layer all have viscosity, can be directly bonded on bottom plate 320；Black conductive adhesive film 314
Also there is viscosity, can directly be bonded with absorbent treatment 312, ultrasonic wave biological can be simplified using the shielding part 310 of the structure and known
The production of other device 300 improves production efficiency.
Due to the structure and ultrasonic wave biological identification device 100 of the ultrasonic wave biological identification device 300 of present embodiment
Structure is roughly the same, and therefore, ultrasonic wave biological identification device 300 also has the similar effect of ultrasonic wave biological identification device 100.
And OCA optical adhesive layer and pressure-sensitive adhesive layer can absorb ultrasonic wave, and black conductive adhesive film 314 can block extraneous light,
And electromagnetic wave can also be shielded, to improve the precision of ultrasonic wave biological identification device 300.
As shown in fig. 6, the ultrasonic wave biological identification device 400 of another embodiment and ultrasonic wave biological identification device 100
Structure it is roughly the same, difference is, the acoustic matching layer 410 of the ultrasonic wave biological identification device 400 of present embodiment is directly logical
It crosses the techniques such as coating, silk-screen printing to be formed on side of the top plate 420 far from conductive layer 430, at this point it is possible to pass through adhesive layer
Acoustic matching layer 410 and cover plate assembly 450 are bonded together by 440 (such as NCA glue).
Due to the structure and ultrasonic wave biological identification device 100 of the ultrasonic wave biological identification device 400 of present embodiment
Structure is roughly the same, and therefore, ultrasonic wave biological identification device 400 also has the similar effect of ultrasonic wave biological identification device 100.
As shown in fig. 7, the ultrasonic wave biological identification device 500 of another embodiment and ultrasonic wave biological identification device 100
Structure it is roughly the same, difference is only that, is not had on the acoustic matching layer 510 of the ultrasonic wave biological identification device 500 of present embodiment
There is setting cover plate assembly, acoustic matching layer 510 is directly formed in top plate 520 far from conductive layer by techniques such as coating, silk-screen printings
On 530 side, at this point, acoustic matching layer 510 can be directly laminated by the shell of glue and electronic equipment.
Due to the structure and ultrasonic wave biological identification device 100 of the ultrasonic wave biological identification device 500 of present embodiment
Structure is roughly the same, and therefore, ultrasonic wave biological identification device 500 also has the similar effect of ultrasonic wave biological identification device 100.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (13)
1. a kind of ultrasonic wave biological identification device, which is characterized in that including supersonic sensing component, wherein the ultrasonic wave passes
Feeling component includes:
Thin film transistor (TFT)；
Piezoelectric layer is layered on the thin film transistor (TFT)；
Conductive layer is layered on the piezoelectric layer；
Material is the packaging part of glass fibre, and the packaging part includes bottom plate, side plate and top plate, and the side plate is around the bottom plate
Edge be arranged one week, the top plate is fixed on side of the side plate far from the bottom plate, so that the top plate, the side
Plate and the bottom plate enclose the accommodating chamber for being set as a sealing jointly, wherein the thin film transistor (TFT), the piezoelectric layer and the conduction
Layer is contained in the accommodating chamber, and side of the thin film transistor (TFT) far from the piezoelectric layer is bonded with the bottom plate, institute
Side of the conductive layer far from the piezoelectric layer is stated to be bonded with the top plate；And
Acoustic matching layer, positioned at the outside of the accommodating chamber, the acoustic matching layer is layered in the top plate far from the conductive layer
On side.
2. ultrasonic wave biological identification device according to claim 2, is characterized in that, it is micro- that the thickness of the top plate is no more than 20
Rice.
3. ultrasonic wave biological identification device according to claim 1, which is characterized in that the material of the conductive layer is silver.
4. ultrasonic wave biological identification device according to claim 1, which is characterized in that further include that one end is arranged in the side
Plate and the circuit board being tightly connected with the side plate, there are two spaced bonding portion, two nations for the circuit board tool
Determine portion to be respectively positioned in the accommodating chamber, two bonding portions respectively with the thin film transistor (TFT) and the conductive layer bonding.
5. ultrasonic wave biological identification device according to claim 4, which is characterized in that the conductive layer includes plate-like body
And side wall, the plate-like body are layered between the piezoelectric layer and the top plate, the side wall ring is around the plate-like body
Edge is arranged one week, and to form an accommodating cavity, side of the side wall far from the plate-like body and the thin film transistor (TFT) are solid
Fixed connection, so that the conductive layer and the thin film transistor (TFT) cooperate the receiving piezoelectric layer jointly, and the side wall is far from institute
State the stage portion being formed on the outer surface of the side of plate-like body with a bonding portion bonding.
6. ultrasonic wave biological identification device according to claim 1, which is characterized in that the supersonic sensing component also wraps
The first adhesive layer and the second adhesive layer are included, first adhesive layer is layered between the conductive layer and the top plate, and fixed
The conductive layer and the top plate are bonded, second adhesive layer is layered between the thin film transistor (TFT) and the bottom plate, and
It is fixed to bond the thin film transistor (TFT) and the bottom plate.
7. ultrasonic wave biological identification device according to claim 1, which is characterized in that it further include cover plate assembly, the lid
Board group part is layered on side of the acoustic matching layer far from the top plate, and covers the acoustic matching layer.
8. ultrasonic wave biological identification device according to claim 1, which is characterized in that the ultrasonic wave biological recognizer component
It further include adhesive layer, the adhesive layer is layered between the top plate and the acoustic matching layer, and the fixed bonding of the adhesive layer
The top plate and the acoustic matching layer.
9. ultrasonic wave biological identification device according to claim 1, which is characterized in that further include can shield electromagnetic wave and
The shielding part for preventing light from passing through, the shielding part is layered on side of the bottom plate far from the thin film transistor (TFT), described
Shielding part can also make ultrasonic wave decay.
10. ultrasonic wave biological identification device according to claim 9, which is characterized in that the shielding part is black conductive
Foamed cotton layer, the black conductive foamed cotton layer are layered on side of the bottom plate far from the thin film transistor (TFT).
11. ultrasonic wave biological identification device according to claim 9, which is characterized in that the shielding part includes stacking
Insulate foamed cotton layer and black conductive adhesive film, the side and the bottom of the insulation foamed cotton layer far from the black conductive adhesive film
Plate is laminated far from the side of the thin film transistor (TFT).
12. ultrasonic wave biological identification device according to claim 9, which is characterized in that the shielding part includes stacking
Absorbent treatment and black conductive adhesive film, side of the absorbent treatment far from the black conductive adhesive film and the bottom plate are far from institute
State the side stacking of thin film transistor (TFT), wherein the absorbent treatment is selected from one of OCA optical adhesive layer and pressure-sensitive adhesive layer.
13. a kind of electronic equipment, including the ultrasonic wave biological identification device as described in claim 1~12 any one.
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| CN201710819249.9A CN109492480A (en) | 2017-09-12 | 2017-09-12 | Ultrasonic wave biological identification device and electronic equipment |
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| CN201710819249.9A CN109492480A (en) | 2017-09-12 | 2017-09-12 | Ultrasonic wave biological identification device and electronic equipment |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110295018A (en) * | 2019-06-24 | 2019-10-01 | Oppo广东移动通信有限公司 | Screen protecting film and preparation method thereof and electronic equipment |
| CN111914776A (en) * | 2020-08-07 | 2020-11-10 | 业泓科技(成都)有限公司 | Display device |
| WO2021000426A1 (en) * | 2019-07-04 | 2021-01-07 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification assembly and electronic device |
| CN114442807A (en) * | 2022-01-18 | 2022-05-06 | 惠州Tcl移动通信有限公司 | Ultrasonic wave generating assembly and electronic equipment |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5436873A (en) * | 1994-05-31 | 1995-07-25 | The Babcock & Wilcox Company | Electrostatic shield for electromagnetic acoustic transducer noise rejection |
| US20150036065A1 (en) * | 2013-08-05 | 2015-02-05 | Apple Inc. | Fingerprint Sensor in an Electronic Device |
| WO2016036177A1 (en) * | 2014-09-04 | 2016-03-10 | 크루셜텍(주) | Image sensing-enabled display apparatus |
| CN105574964A (en) * | 2015-12-08 | 2016-05-11 | 重庆市江津区华茂机械有限责任公司 | Control meter box glass cover-plate with fingerprint identification function |
| US20160315246A1 (en) * | 2015-04-22 | 2016-10-27 | Miics & Partners Inc. | Method for manufacturing fingerprint identification modules |
| CN206209792U (en) * | 2016-11-09 | 2017-05-31 | 南昌欧菲生物识别技术有限公司 | Ultrasonic fingerprint sensor and fingerprint recognition module |
| US20180015711A1 (en) * | 2016-07-15 | 2018-01-18 | Shenzhen GOODIX Technology Co., Ltd. | Fingerprint identification module and method for manufacturing the same |
| CN109492478A (en) * | 2017-09-12 | 2019-03-19 | 南昌欧菲生物识别技术有限公司 | Ultrasonic wave biological identification device and electronic equipment |
| CN109492500A (en) * | 2017-09-12 | 2019-03-19 | 南昌欧菲生物识别技术有限公司 | Ultrasonic wave biological identification device and preparation method thereof and electronic equipment |
| KR20190061673A (en) * | 2017-11-28 | 2019-06-05 | 주식회사 엘지화학 | A sheet and an optical fingerprint scanner |
| US20200218866A1 (en) * | 2016-09-18 | 2020-07-09 | Boe Technology Group Co., Ltd. | Fingerprint identification device, touch display panel, and method for driving fingerprint identification device |
| WO2021000426A1 (en) * | 2019-07-04 | 2021-01-07 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification assembly and electronic device |
-
2017
- 2017-09-12 CN CN201710819249.9A patent/CN109492480A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5436873A (en) * | 1994-05-31 | 1995-07-25 | The Babcock & Wilcox Company | Electrostatic shield for electromagnetic acoustic transducer noise rejection |
| US20150036065A1 (en) * | 2013-08-05 | 2015-02-05 | Apple Inc. | Fingerprint Sensor in an Electronic Device |
| WO2016036177A1 (en) * | 2014-09-04 | 2016-03-10 | 크루셜텍(주) | Image sensing-enabled display apparatus |
| US20160315246A1 (en) * | 2015-04-22 | 2016-10-27 | Miics & Partners Inc. | Method for manufacturing fingerprint identification modules |
| CN105574964A (en) * | 2015-12-08 | 2016-05-11 | 重庆市江津区华茂机械有限责任公司 | Control meter box glass cover-plate with fingerprint identification function |
| US20180015711A1 (en) * | 2016-07-15 | 2018-01-18 | Shenzhen GOODIX Technology Co., Ltd. | Fingerprint identification module and method for manufacturing the same |
| US20200218866A1 (en) * | 2016-09-18 | 2020-07-09 | Boe Technology Group Co., Ltd. | Fingerprint identification device, touch display panel, and method for driving fingerprint identification device |
| CN206209792U (en) * | 2016-11-09 | 2017-05-31 | 南昌欧菲生物识别技术有限公司 | Ultrasonic fingerprint sensor and fingerprint recognition module |
| CN109492478A (en) * | 2017-09-12 | 2019-03-19 | 南昌欧菲生物识别技术有限公司 | Ultrasonic wave biological identification device and electronic equipment |
| CN109492500A (en) * | 2017-09-12 | 2019-03-19 | 南昌欧菲生物识别技术有限公司 | Ultrasonic wave biological identification device and preparation method thereof and electronic equipment |
| KR20190061673A (en) * | 2017-11-28 | 2019-06-05 | 주식회사 엘지화학 | A sheet and an optical fingerprint scanner |
| WO2021000426A1 (en) * | 2019-07-04 | 2021-01-07 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification assembly and electronic device |
Non-Patent Citations (1)
| Title |
|---|
| 吴丽华: "超声波指纹识别技术在汽车进入系统中的应用", 《汽车工程师》 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110295018A (en) * | 2019-06-24 | 2019-10-01 | Oppo广东移动通信有限公司 | Screen protecting film and preparation method thereof and electronic equipment |
| WO2021000426A1 (en) * | 2019-07-04 | 2021-01-07 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification assembly and electronic device |
| CN111914776A (en) * | 2020-08-07 | 2020-11-10 | 业泓科技(成都)有限公司 | Display device |
| CN111914776B (en) * | 2020-08-07 | 2023-12-22 | 业泓科技(成都)有限公司 | display device |
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| CN114442807B (en) * | 2022-01-18 | 2024-01-19 | 惠州Tcl移动通信有限公司 | Ultrasonic wave generating assembly and electronic equipment |
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Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330029 Nanchang Avenue, Nanchang high tech Zone, Nanchang, Jiangxi 1189 Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |
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Effective date of abandoning: 20231117 |