CN112183168A - Fingerprint identification subassembly and electronic equipment - Google Patents
Fingerprint identification subassembly and electronic equipment Download PDFInfo
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- CN112183168A CN112183168A CN201910601088.5A CN201910601088A CN112183168A CN 112183168 A CN112183168 A CN 112183168A CN 201910601088 A CN201910601088 A CN 201910601088A CN 112183168 A CN112183168 A CN 112183168A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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Abstract
The embodiment of the invention provides a fingerprint identification assembly and electronic equipment, wherein the fingerprint identification assembly comprises a fingerprint sensor and a protective layer, the protective layer is arranged at the bottom of the fingerprint sensor, which is opposite to the top, and the surface of the top is a fingerprint identification sensing surface; the fingerprint sensor is used for emitting and identifying ultrasonic waves, and the protective layer shields electromagnetic interference. By arranging the protective layer, electromagnetic interference can be shielded; in addition, the protective layer can be made very thin, an air layer is not needed to be arranged, the whole thickness of the fingerprint identification assembly can be obviously reduced, and the thickness of the electronic equipment can be made thinner.
Description
Technical Field
The invention belongs to the technical field of fingerprint identification, and particularly relates to a fingerprint identification assembly and electronic equipment.
Background
Ultrasonic fingerprint identification is a new fingerprint identification technology and becomes two main under-screen fingerprint identification schemes together with optical fingerprint identification at present. Ultrasonic wave fingerprint identification module transmission ultrasonic wave, ultrasonic wave pass display screen and glass apron and detect user's fingerprint, and ultrasonic wave reflects back ultrasonic wave fingerprint identification module and is received and discernment.
The degree of accuracy of present ultrasonic fingerprint identification receives the influence of electronic equipment internal environment, and the ultrasonic wave transmission comes out the back, can interfere ultrasonic fingerprint identification module to the inside transmission of electronic equipment, the ultrasonic wave that inside device of electronic equipment reflects back. Therefore, the module of the ultrasonic fingerprint identification needs to be protected from electromagnetic interference, and the current technical means is to wrap the protective cover around the module, however, the protective cover needs to have a space with the module to form a space with an air layer, so that the ultrasonic wave is rapidly attenuated in the air layer. The scheme of setting up the protection casing of prior art makes the whole thickness of fingerprint identification module and protection casing very thick, generally reaches 645 mu m, is unfavorable for electronic equipment's frivolousness.
Disclosure of Invention
The invention aims to provide a fingerprint identification assembly and an electronic device, wherein a protective layer is arranged on the fingerprint identification assembly, so that electromagnetic interference can be shielded, an air layer is not required to be arranged, and the thickness can be reduced.
In order to realize the purpose of the invention, the invention provides the following technical scheme:
in a first aspect, an embodiment of the present invention provides a fingerprint identification assembly, including a fingerprint sensor and a protective layer, where the protective layer is disposed on a bottom of the fingerprint sensor opposite to a top, and a surface of the top is a fingerprint identification sensing surface; the fingerprint sensor is used for transmitting and identifying ultrasonic waves, and the protective layer is used for shielding electromagnetic interference.
Through setting up the protective layer, can shield electromagnetic interference for fingerprint sensor reduces the signal of telecommunication interference by other inside devices of electronic equipment. In addition, the protective layer can be made very thin, and compared with the scheme of the shielding case for reducing the interference of ultrasonic waves and electric signals in the prior art, the scheme does not need to be provided with an air layer, and the whole thickness of the fingerprint identification assembly can be obviously reduced, so that the thickness of the electronic equipment can be made thinner.
The protective layer is made of conductive ink, the components of the conductive ink comprise thermoplastic resin and carbon powder, and the thermoplastic resin and the carbon powder are matched to enable acoustic impedance of the conductive ink to be matched with the fingerprint sensor, so that ultrasonic waves can penetrate through the conductive ink.
The conductive ink further comprises a solvent, an auxiliary agent and a defoaming agent. The thermoplastic resin functions to form a paint film. The carbon powder plays a role in electric conduction and electromagnetic shielding. The additives may add functionality to certain aspects of the conductive ink. The defoaming agent can reduce bubbles in the conductive ink, improve the leveling property of the conductive ink and prevent the defects of shrinkage cavity or pin hole and the like.
Wherein the proportion of the thermoplastic resin is 30-45%; the proportion of the carbon powder is 40-55%; the proportion of the solvent is 10-15%; the proportion of the auxiliary agent is 2-4%, and the proportion of the defoaming agent is 0.5-1%. The proper proportion of the components is set, so that the conductive ink meets the performance requirement of electromagnetic shielding.
Wherein the thermoplastic resin is a 2,2' - [ (1-methylethylidene) bis (4, 1-phenylene carbaldehyde) ] bisoxirane polymer; the solvent is dibasic ester; the auxiliary agent is a leveling agent; the defoaming agent is silicone oil.
The fingerprint sensor comprises a TFT substrate, a piezoelectric layer and an electrode layer which are arranged in a stacked mode, wherein the protective layer is arranged on the surface, opposite to the piezoelectric layer, of the TFT substrate, the TFT substrate and the electrode layer are used for generating voltage on the piezoelectric layer, the piezoelectric layer emits ultrasonic waves, and the piezoelectric layer receives the ultrasonic waves to generate electric signals and transmits the electric signals to the TFT substrate. Through setting up TFT base plate, piezoelectric layer and electrode layer, TFT base plate and electrode layer applys voltage to the electrode layer, realize fingerprint identification subassembly transmission ultrasonic wave and receive the ultrasonic wave.
The fingerprint identification component further comprises a circuit board and a driving chip, the circuit board is connected with the TFT substrate and the electrode layer, and the driving chip is connected with the circuit board. Through setting up circuit board and driver chip for fingerprint sensor can emit the ultrasonic wave under driver chip's effect, and can handle fingerprint sensor's ultrasonic wave's signal of telecommunication and discern the fingerprint.
Wherein, the tip of electrode layer extends to the surface of TFT base plate, the circuit board with the TFT base plate with the end connection of electrode layer, just the circuit board is located the TFT base plate orientation one side of piezoelectric layer, driver chip sets up the circuit board dorsad the surface of TFT base plate. Through setting up circuit board and driver chip's relation of connection and setting up the position for the overall structure that fingerprint identification subassembly constitutes is compact, is convenient for install.
Wherein the fingerprint sensor further comprises a DAF layer and a glue layer laminated on the electrode layer; the adhesive layer is used for being adhered to the cover plate assembly; the DAF layer is used for heightening the height of the fingerprint sensor so as to avoid the interference between the driving chip and the cover plate component.
In a second aspect, an embodiment of the present invention further provides an electronic device, including a cover assembly and the fingerprint identification assembly as described in any of the various embodiments of the first aspect, wherein the fingerprint identification assembly is disposed on an inner surface of the cover assembly opposite to an outer surface of the cover assembly, the outer surface of the cover assembly is configured to contact with a finger, and the fingerprint identification assembly transmits ultrasonic waves and transmits through the cover assembly, and is reflected at a fingerprint of the finger to be received by the fingerprint identification assembly.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic cross-sectional view of a fingerprint identification assembly according to an embodiment;
FIG. 2 is a pattern of fake finger fingerprints identified by the fingerprint identification component;
FIG. 3 is a pattern of authentic finger fingerprints as identified by the fingerprint identification component.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Referring to fig. 1, an embodiment of the invention provides an electronic device, such as a tablet computer, a Personal Digital Assistant (PDA), a smart phone, and the like. The electronic device includes a fingerprint identification assembly and a cover plate assembly 50. The fingerprint identification subassembly includes fingerprint module and protective layer 20. The fingerprint module includes fingerprint sensor 10, circuit board 30 and driver chip 40.
In this embodiment, the cover assembly 50 includes a cover bottom ink 51, a cover plate 52, and a protective film 53, which are stacked. The cover plate 52 may be made of a rigid material such as glass, or may be made of a flexible material such as PET or PC, that is, the cover plate 52 may be rigid or flexible. When the fingerprint recognition module is disposed on the display surface side of the electronic device, the cover bottom ink 51 surrounds the peripheral edge of the cover plate 52 to shield the terminal area of the display screen. When the fingerprint recognition assembly is disposed on a side of the electronic device facing away from the display surface (i.e., the back cover), the cover bottom ink 51 may cover the entire cover plate 52. The protective film 53 may be a common plastic film, a tempered film, or an anti-fingerprint film (AF Coating). In other embodiments, the cover plate assembly 50 may further include a display screen, preferably an OLED screen, which is transparent to ultrasonic waves, disposed on a side of the cover bottom ink 51 facing away from the cover plate 52. Further, the cover plate assembly 50 may further include a touch layer, which may be disposed between the display screen and the cover bottom ink 51.
The fingerprint recognition assembly is disposed on an inner surface of the cover assembly 50 opposite to an outer surface thereof, i.e., a surface of the cover ink 51 facing away from the cover 52, the outer surface being for contact with the fingerprint of the user's finger. The fingerprint recognition assembly transmits ultrasonic waves through the cover assembly 50, which are reflected at the fingerprint of the user's finger and received by the fingerprint recognition assembly to acquire fingerprint information through the reflected ultrasonic waves.
This electronic equipment can realize ultrasonic fingerprint identification at apron subassembly 50 surface through set up the fingerprint identification subassembly at apron subassembly 50 internal surface. Compared with the existing digging hole pressing or wiping type capacitance fingerprint identification, the structure of the cover plate component 50 does not need to be changed, and the device is simple in structure, easy to realize and low in cost.
In one embodiment, the fingerprint recognition component is disposed in a visible region of the cover component 50 relative to a non-visible region, the non-visible region is disposed at the periphery of the visible region, and the visible region is a display region of the display screen. The fingerprint identification component is arranged below the display screen, so that the function of fingerprint identification under the screen is realized. The embodiment can make the visible area as large as possible, and can reduce the area of the non-visible area as much as possible, thereby realizing a narrow frame.
In another embodiment, the fingerprint identification assembly is disposed at an edge of the cover assembly 50 and is located in the non-display area. The display screen and the fingerprint identification component are arranged in a staggered mode and do not overlap. The ultrasonic wave that the fingerprint identification subassembly of this embodiment was emitted need not see through the display screen, can promote discernment speed and accuracy. The disadvantage is that the area of the non-display area on one side is slightly larger, and the method can be applied to electronic equipment with a 'chin'.
The fingerprint sensor 10 includes a TFT substrate 11, an electrode connection layer 12, a piezoelectric layer 13, and an electrode layer 14, which are stacked. The protective layer 20 is provided on the surface of the TFT substrate 11 facing away from the electrode connection layer 12. The electrode connecting layer 12 is used to connect the TFT substrate 11 and the piezoelectric layer 13. The TFT substrate 11 and the electrode layer 14 are used to generate a voltage on the piezoelectric layer 13, so that the piezoelectric layer 13 emits ultrasonic waves. The piezoelectric layer 13 receives the ultrasonic waves to generate an electric signal and transmits the electric signal to the TFT substrate 11.
The TFT substrate 11 includes a substrate, a plurality of thin film transistors arranged in an array on the substrate, and a circuit on the substrate for connecting the thin film transistors. The TFT substrate 11 may amplify or otherwise process the electrical signal. In one embodiment, the TFT substrate 11 is a thin film and the cover plate assembly 50 is a flexible material, so as to meet the flexibility requirement of the whole electronic device. In another embodiment, the TFT substrate 11 is made of glass. The TFT substrate functions to transmit an electrical signal to the piezoelectric layer 13 and may receive an electrical signal, which may be an electrical signal at any position including the piezoelectric layer 13.
The piezoelectric layer 13 is made of a piezoelectric material, such as a ferroelectric polymer P (VDF-TrFE). The piezoelectric layer 13 is capable of converting electrical and mechanical signals into each other, i.e., transmitting and receiving ultrasonic waves.
The electrode layer 14 is made of a conductive material, such as silver paste. The electrode layer 14 can form a voltage with the TFT substrate 11 to be applied to the surface of the piezoelectric layer 13, so that the piezoelectric layer 13 starts to emit ultrasonic waves or receive ultrasonic waves.
By arranging the TFT substrate 11, the piezoelectric layer 13 and the electrode layer 14, the TFT substrate 11 and the electrode layer 14 apply voltage to the electrode layer 14, and the fingerprint identification component can transmit ultrasonic waves and receive the ultrasonic waves.
The fingerprint recognition assembly further includes a circuit board 30 and a driving chip 40. The circuit board 30, the TFT substrate 11, and the electrode layer 14 are connected by the connection terminals 31, and the driver chip 40 is connected to the circuit board 30. By arranging the circuit board 30 and the driving chip 40, the fingerprint sensor 10 can emit ultrasonic waves under the action of the driving chip 40, and can process electric signals of the ultrasonic waves of the fingerprint sensor 10 to identify fingerprints.
Among them, the circuit board 30 is preferably a Flexible Printed Circuit (FPC), which is thin and space-saving. Alternatively, the circuit board 30 may be a Printed Circuit Board (PCB).
The driving chip 40 is, for example, an asic (application Specific Integrated circuit) chip. The driving chip 40 provides a control signal to the fingerprint sensor 10 (e.g., sends a high frequency electrical signal to the fingerprint sensor 10) to cause the fingerprint sensor 10 to emit ultrasonic waves. Specifically, the driving chip 40 sends a control signal to the TFT substrate 11 and the electrode layer 14 through the circuit board 30, so that the TFT substrate 11 and the electrode layer 14 generate a voltage and apply it to the piezoelectric layer 13, so that the piezoelectric layer 13 emits an ultrasonic wave. The driving chip 40 also receives an electrical signal obtained by converting the reflected ultrasonic waves by the fingerprint sensor 10 to identify the fingerprint. Specifically, the piezoelectric layer 13 receives the reflected ultrasonic waves and generates an electric signal, which is transmitted to the TFT substrate 11 and to the driving chip 40 via the circuit board 30.
An end portion of the electrode layer 14 extends to the surface of the TFT substrate 11, and the circuit board 30 is connected to the end portions of the TFT substrate 11 and the electrode layer 14 through a connection terminal 31. The circuit board 30 is located on a side of the TFT substrate 11 facing the piezoelectric layer 13, and the driving chip 40 is disposed on a surface of the circuit board 30 facing away from the TFT substrate 11. By setting the connection relationship and the setting position of the circuit board 30 and the driving chip 40, the whole structure formed by the fingerprint identification component is compact and convenient to install.
The fingerprint sensor 10 further includes a DAF (Die Attach Film) layer 15 and an adhesive layer 16 laminated on the electrode layer 14. The adhesive layer 16 is used to adhere to the cover assembly 50, and may be adhered to the cover bottom ink 51 or the cover plate 52 to secure the fingerprint sensor 10. The DAF layer 15 is used to raise the height of the fingerprint sensor 10 to avoid interference of the driving chip 50 with the cover assembly 50.
If the DAF layer 15 is not provided, and the electrode layer 14 is directly connected to the cover assembly 50 through the adhesive layer 16, the overall height of the fingerprint sensor 10 is insufficient, which may cause the driving chip 40 on the circuit board 30 to interfere with the cover assembly 50, and the mounting is impossible. Therefore, the DAF layer 15 can be raised to the height of the fingerprint sensor 10 to ensure that no interference occurs and to facilitate installation. In addition, the DAF layer 15 can protect the electrode layer 14 from oxidation of the electrode layer 14. In addition, the DAF layer may also adjust the frequency of the electrical signal of the electrode layer 14.
The adhesive layer 16 may be an optical adhesive for bonding the cover plate assembly 50 and the fingerprint sensor 10. The young's modulus of the adhesive layer 16 should be as high as possible to avoid weakening the ultrasonic waves.
Further, the fingerprint recognition assembly further comprises a protective layer 20. The protective layer 20 is disposed on the bottom of the fingerprint sensor 10 opposite to the top, wherein the surface of the top is an ultrasonic wave emitting surface and a fingerprint recognition sensing surface. The protective layer 20 serves to shield electromagnetic interference.
By providing the protective layer 20, electromagnetic interference can be shielded such that the fingerprint sensor 10 is reduced from being disturbed by electrical signals of other devices inside the electronic device.
In addition, the protective layer 20 can be made very thin, for example, 5 μm to 20 μm, and preferably 10 μm, so that the overall thickness of the fingerprint sensor 10 and the protective layer 20 can be 325 μm, and compared with the prior art shielding cover solution for reducing the interference of ultrasonic waves and electric signals, the method does not need to provide an air layer, can significantly reduce the overall thickness of the fingerprint identification component, and can make the thickness of the electronic device thinner.
The protective layer 20 is conductive ink, the components of the conductive ink include thermoplastic resin and carbon powder, and the thermoplastic resin and the carbon powder are matched to enable the acoustic impedance of the conductive ink to be matched with the fingerprint sensor 10. So that the ultrasound can be transmitted through the conductive ink.
In order to realize the functions, the components of the selected conductive ink comprise thermoplastic resin, carbon powder, solvent, auxiliary agent and defoaming agent. The thermoplastic resin functions as a functional resin to form a paint film. The carbon powder plays a role in electric conduction and electromagnetic shielding, and can be used for shading because the material is black. The solvent serves as a solvent for the conductive ink, and the auxiliary agent can add functions to certain aspects of the conductive ink. The defoaming agent can reduce bubbles in the conductive ink, improve the leveling property of the conductive ink and prevent the defects of shrinkage cavity or pin hole and the like.
The proportion of the thermoplastic resin is 30% to 45%, and may be, for example, 30%, 31%, 32%, 33%, 34%, 35%, 36%, 37%, 38%, 39%, 40%, 41%, 42%, 43%, 44%, 45%, and preferably 35% to 40%. The carbon powder proportion is 40-55%, for example, 40%, 41%, 42%, 43%, 44%, 45%, 46%, 47%, 48%, 49%, 50%, 51%, 52%, 53%, 54%, 55%, preferably 45-50%. . The solvent proportion is 10% to 15%, and may be, for example, 10%, 11%, 12%, 13%, 14%, 15%, with a preferred proportion being 12% to 15%. The proportion of the auxiliary is 2% to 4%, and may be, for example, 2%, 3%, 4% or more. The proportion of the defoaming agent is 0.5% to 1%, and may be, for example, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, 1%. The proper proportion of the components is set, so that the conductive ink meets the performance requirement of electromagnetic shielding.
Preferably, the thermoplastic resin is a 2,2' - [ (1-methylethylidene) bis (4, 1-phenylene carbaldehyde) ] bisoxirane polymer; the solvent is dibasic ester; the auxiliary agent is a leveling agent; the defoaming agent is silicone oil. The assistant can be 1-hydroxycyclohexyl phenyl ketone, so that the leveling property of the ink can be improved, and the surface of the ink is flat and smooth.
In application, please refer to fig. 2 and fig. 3, wherein fig. 2 is a diagram of a fake finger fingerprint pattern identified by the fingerprint identification component, and fig. 3 is a diagram of a real finger fingerprint pattern identified by the fingerprint identification component. Taking the cover plate assembly 50 as a glass cover plate as an example, the fingerprint identification assembly provided by the invention is used for testing fingerprints of real fingers and fake fingers, and according to fig. 2 and 3, the fingerprint outline can be seen clearly, and the fingerprint unlocking function can be realized. Meanwhile, in order to avoid the interference of the fingerprint of the fake finger, the FRR (False Rejection Rate, colloquially understood as the probability of "regarding the fingerprints that should be successfully matched with each other as the fingerprints that cannot be matched") of the fingerprint of the real finger is 0.97%, and the FAR (False Acceptance Rate, colloquially understood as the probability of "regarding the fingerprints that should not be matched as the fingerprints that cannot be matched") is 0.0002% through the optimization of the fingerprint identification algorithm.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. The fingerprint identification assembly is characterized by comprising a fingerprint sensor and a protective layer, wherein the protective layer is arranged at the bottom of the fingerprint sensor, which is opposite to the top of the fingerprint sensor, and the surface of the top of the protective layer is a fingerprint identification sensing surface; the fingerprint sensor is used for transmitting and identifying ultrasonic waves, and the protective layer is used for shielding electromagnetic interference.
2. The fingerprint identification assembly of claim 1, wherein the protective layer is a conductive ink, the conductive ink comprising a thermoplastic resin and a carbon powder, the thermoplastic resin and the carbon powder cooperating to match an acoustic impedance of the conductive ink to the fingerprint sensor.
3. The fingerprint identification assembly of claim 2, wherein the conductive ink composition further comprises a solvent, an adjuvant, and a defoamer.
4. The fingerprint identification assembly of claim 3, wherein the thermoplastic resin ratio is 30% -45%; the proportion of the carbon powder is 40-55%; the proportion of the solvent is 10-15%; the proportion of the auxiliary agent is 2-4%, and the proportion of the defoaming agent is 0.5-1%.
5. The fingerprint identification assembly of claim 4, wherein the thermoplastic resin is a 2,2' - [ (1-methylethylidene) bis (4, 1-phenylene carbaldehyde) ] bisoxirane polymer; the solvent is dibasic ester; the auxiliary agent is a leveling agent; the defoaming agent is silicone oil.
6. The fingerprint identification assembly of claim 1, wherein the fingerprint sensor comprises a TFT substrate, a piezoelectric layer, and an electrode layer, wherein the TFT substrate, the piezoelectric layer, and the electrode layer are stacked, the protective layer is disposed on a surface of the TFT substrate facing away from the piezoelectric layer, the TFT substrate and the electrode layer are configured to generate a voltage on the piezoelectric layer, such that the piezoelectric layer emits ultrasonic waves, and the piezoelectric layer receives the ultrasonic waves to generate an electrical signal and transmit the electrical signal to the TFT substrate.
7. The fingerprint identification assembly of claim 6, further comprising a circuit board and a driver chip, the circuit board being connected to the TFT substrate and the electrode layer, the driver chip being connected to the circuit board.
8. The assembly of claim 7, wherein an end of the electrode layer extends to a surface of the TFT substrate, the circuit board is connected to the TFT substrate and the end of the electrode layer, the circuit board is located on a side of the TFT substrate facing the piezoelectric layer, and the driving chip is disposed on a surface of the circuit board facing away from the TFT substrate.
9. The fingerprint identification assembly of claim 8, wherein the fingerprint sensor further comprises a DAF layer and a glue layer laminated on the electrode layer; the adhesive layer is used for being adhered to the cover plate assembly; the DAF layer is used for heightening the height of the fingerprint sensor so as to avoid the interference between the driving chip and the cover plate component.
10. An electronic device comprising a cover member and a fingerprint identification member according to any one of claims 1 to 9, the fingerprint identification member being disposed on an inner surface of the cover member opposite an outer surface thereof, the outer surface of the cover member being adapted to contact a finger, the fingerprint identification member transmitting ultrasonic waves through the cover member and being reflected at the finger fingerprint to be received by the fingerprint identification member.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910601088.5A CN112183168A (en) | 2019-07-04 | 2019-07-04 | Fingerprint identification subassembly and electronic equipment |
| PCT/CN2019/106231 WO2021000426A1 (en) | 2019-07-04 | 2019-09-17 | Fingerprint identification assembly and electronic device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910601088.5A CN112183168A (en) | 2019-07-04 | 2019-07-04 | Fingerprint identification subassembly and electronic equipment |
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| CN112183168A true CN112183168A (en) | 2021-01-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910601088.5A Pending CN112183168A (en) | 2019-07-04 | 2019-07-04 | Fingerprint identification subassembly and electronic equipment |
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| CN (1) | CN112183168A (en) |
| WO (1) | WO2021000426A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113011264A (en) * | 2021-02-22 | 2021-06-22 | 业泓科技(成都)有限公司 | Identification sensing structure, fingerprint identification assembly and terminal |
| WO2024055157A1 (en) * | 2022-09-13 | 2024-03-21 | 深圳市汇顶科技股份有限公司 | Ultrasonic fingerprint apparatus and electronic device |
| WO2024055165A1 (en) * | 2022-09-13 | 2024-03-21 | 深圳市汇顶科技股份有限公司 | Ultrasonic fingerprint apparatus and electronic device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109492480A (en) * | 2017-09-12 | 2019-03-19 | 南昌欧菲生物识别技术有限公司 | Ultrasonic wave biological identification device and electronic equipment |
| CN113483750A (en) * | 2021-07-06 | 2021-10-08 | 中铁十九局集团第五工程有限公司 | Data recorder with positioning function for development construction site inspection |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109492479A (en) * | 2017-09-12 | 2019-03-19 | 南昌欧菲生物识别技术有限公司 | Ultrasonic wave biological identification device and preparation method thereof and electronic equipment |
| CN109492494A (en) * | 2017-09-12 | 2019-03-19 | 南昌欧菲生物识别技术有限公司 | Electronic equipment |
| CN109492471A (en) * | 2017-09-12 | 2019-03-19 | 南昌欧菲生物识别技术有限公司 | Electronic equipment |
| CN109492475A (en) * | 2017-09-12 | 2019-03-19 | 南昌欧菲生物识别技术有限公司 | Ultrasonic wave biological identification device and electronic equipment |
| CN109492480A (en) * | 2017-09-12 | 2019-03-19 | 南昌欧菲生物识别技术有限公司 | Ultrasonic wave biological identification device and electronic equipment |
| CN109492504B (en) * | 2017-09-12 | 2023-07-04 | 江西欧迈斯微电子有限公司 | Ultrasonic biological recognition device, preparation method thereof and electronic equipment |
| CN109492478A (en) * | 2017-09-12 | 2019-03-19 | 南昌欧菲生物识别技术有限公司 | Ultrasonic wave biological identification device and electronic equipment |
| KR102489440B1 (en) * | 2017-12-27 | 2023-01-16 | 엘지디스플레이 주식회사 | Fingerprint sensing display apparatus |
-
2019
- 2019-07-04 CN CN201910601088.5A patent/CN112183168A/en active Pending
- 2019-09-17 WO PCT/CN2019/106231 patent/WO2021000426A1/en active Application Filing
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113011264A (en) * | 2021-02-22 | 2021-06-22 | 业泓科技(成都)有限公司 | Identification sensing structure, fingerprint identification assembly and terminal |
| CN113011264B (en) * | 2021-02-22 | 2024-02-02 | 业泓科技(成都)有限公司 | Identification sensing structure, fingerprint identification component and terminal |
| WO2024055157A1 (en) * | 2022-09-13 | 2024-03-21 | 深圳市汇顶科技股份有限公司 | Ultrasonic fingerprint apparatus and electronic device |
| WO2024055165A1 (en) * | 2022-09-13 | 2024-03-21 | 深圳市汇顶科技股份有限公司 | Ultrasonic fingerprint apparatus and electronic device |
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| WO2021000426A1 (en) | 2021-01-07 |
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