SUMMERY OF THE UTILITY MODEL
In view of the above, it is desirable to provide a display panel and an electronic device that can prevent bubbles from being generated when a fingerprint recognition module is attached to a display screen.
The utility model provides a display panel, is including display screen and the fingerprint identification subassembly of equipment together, display panel still including being located the display screen and the bonding subassembly between the fingerprint identification subassembly, the bonding subassembly includes two at least solid-state glue films and at least one glue film support piece, each glue film support piece is in the orientation one side of display screen and orientation one side of fingerprint identification subassembly all is provided with solid-state glue film, and at least one glue film support piece's at least one side the light transmittance of solid-state glue film is less than 30%.
In one embodiment, the solid adhesive layer on at least one side of at least one adhesive layer support is black.
In one embodiment, the number of the adhesive layer supporting members in the bonding assembly is one, and the thickness of the adhesive layer supporting member is 4 μm to 8 μm.
In one embodiment, the thicknesses of the solid adhesive layers on the two sides of the adhesive layer supporting member are the same.
In one embodiment, the thickness of the solid adhesive layer on both sides of the adhesive layer support is 13-17 μm.
In one embodiment, the solid adhesive layer is acrylic adhesive.
In one embodiment, the material of the rubber layer support is PET.
In one embodiment, the fingerprint identification component is an ultrasonic fingerprint identification component and comprises a TFT substrate, a piezoelectric layer, an electrode layer and a protective layer which are sequentially stacked.
In one embodiment, the display panel further includes a flexible circuit board bonded to the TFT substrate.
An electronic device comprising the display panel of any of the above.
Above-mentioned display panel has the bonding subassembly between display screen and the fingerprint identification subassembly. Each glue film support piece all is provided with solid-state glue film in one side towards the display screen and one side towards the fingerprint identification subassembly. Glue film support piece can have the support carrier effect to solid-state glue film, and its both sides all are equipped with solid-state glue film 310 to can effectively increase the glue film thickness between display screen and the fingerprint identification subassembly, and then can effectively get rid of the bubble when fingerprint identification subassembly and display screen laminating.
And, set up the solid-state glue film of at least one side of at least one glue film support piece in this application and have shading performance. Therefore, the color difference between the area where the display screen is attached to the fingerprint identification component and other areas can be reduced, and the appearance experience of a user is improved.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
In one embodiment, an electronic device is provided that includes display panels assembled together. The electronic equipment can be a mobile phone, a tablet computer, a computer display and the like.
Referring to fig. 1, the display panel includes a display screen 100 and a fingerprint recognition assembly 200. The display screen 100 is used for displaying a screen. The display mode may be an organic light emitting display mode, and may also be other types of display modes, such as a liquid crystal display mode. The fingerprinting component 200 is used for fingerprinting.
When the fingerprint recognition module 200 is an ultrasonic fingerprint recognition module, the fingerprint recognition mode is an ultrasonic fingerprint recognition mode. At this time, the fingerprint recognition assembly 200 includes a TFT substrate 210, a piezoelectric layer 220, an electrode layer 230, and a protective layer 240, which are sequentially stacked.
The TFT substrate 210 includes various transistors, switches, and other circuits, and is configured to transmit an electrical signal to the piezoelectric layer 220 and emit an ultrasonic signal, where the ultrasonic signal is reflected back by a finger, and the TFT substrate can also receive an electrical signal converted from the ultrasonic signal at any position. The piezoelectric layer 220 may be a laminated polymer layer capable of converting an electric signal and an ultrasonic signal to each other, that is, transmitting and receiving ultrasonic waves. The electrode layer 230 and the TFT substrate 210 form a voltage applied to the surface of the piezoelectric layer 220, so that the piezoelectric layer 220 can activate the function of converting the electrical signal and the ultrasonic signal. The protective layer 240 is an insulating layer, which can protect the electrode layer 230.
Of course, the fingerprint identification module 200 may not be an ultrasonic fingerprint identification module, and the fingerprint identification mode may also be other types of fingerprint identification modes, which is not limited in this embodiment.
In this embodiment, the display panel further includes an adhesive member 300 between the display screen 100 and the fingerprint recognition assembly 200. The adhesive assembly 300 includes at least two solid adhesive layers 310 and at least one adhesive layer support 320. When the fingerprint recognition device 200 is an ultrasonic fingerprint recognition device, the adhesive member 300 is located between the display panel 100 and the TFT substrate 210.
Each adhesive layer support 320 is provided with a solid adhesive layer 310 on a side facing the display screen 100 and a side facing the fingerprint recognition assembly 200. Specifically, the solid glue layer 310 is coated on both sides of the glue layer support 320 by spin coating, printing, or slit coating. The solid glue layer 310 may be acrylic glue, but may also be other types of glue that may be used.
Glue film support 320 can have the support carrier effect to solid-state glue film 310, and its both sides all are equipped with solid-state glue film 310, and then can effectively increase the glue film thickness between display screen 100 and the fingerprint identification subassembly 200, and then can effectively get rid of the bubble when fingerprint identification subassembly 100 and display screen 200 laminate. Therefore, the size of the fingerprint identification assembly 200 of the present application can be effectively enlarged, for example, 20 × 30mm, so as to effectively increase the area of various fingerprint functions (e.g., fingerprint unlocking).
In addition, in the embodiment, the light transmittance of the solid adhesive layer 310 on at least one side of the at least one adhesive layer supporting member 320 is less than 30%, so that the solid adhesive layer has a light shielding performance. Therefore, the color difference between the area where the display screen 100 is attached to the fingerprint identification component 300 and other areas can be reduced, and the appearance experience of a user can be improved.
Further, at least one side of the solid glue layer 310 of the at least one glue layer support 320 may be arranged to be black. At this time, the region where the display screen 100 is attached to the fingerprint identification device 300 and other regions are both black or nearly black in the dark state. Therefore, in the dark state, the user hardly sees any color difference in the regions of the display screen 100. The number of the adhesive layer supporting members 320 can be set according to the requirement.
When the fingerprint recognition assembly 200 is an ultrasonic fingerprint recognition assembly, the adhesive layer supporting member 320 can also effectively transmit ultrasonic signals. In order to save the production cost, the material of the glue layer support 320 can be designed to be PET. Of course, the material of the adhesive layer supporting member 320 may also be other materials, such as copper foil.
Specifically, referring to fig. 1, in the embodiment of the present application, the number of the glue layer supporting members 320 in the bonding assembly 300 may be set to be one, and the thickness of the glue layer supporting members is 4 μm to 8 μm, so that the glue layer supporting members 320 can support the solid glue layer 310 with a certain thickness on two sides without greatly affecting the overall thickness of the display panel. At this time, further, in order to make the bonding assembly of the display panel more uniform, the thicknesses of the solid glue layers 310 on both sides of the glue layer support 320 may be set to be the same. Specifically, the thickness of the solid adhesive layer 310 on both sides of the adhesive layer supporting member 320 may be 13 μm to 17 μm.
Of course, in the embodiment of the present application, the number of the glue line supporters 320 in the adhesive assembly 300 can also be set to be plural. For example, referring to FIG. 2, a plurality of adhesive supports 320 may be positioned side-by-side between the display screen 100 and the fingerprint recognition assembly 200. The specific number of the adhesive layer supports 320 in the adhesive assembly 300 can be set according to practical requirements, and the application is not limited thereto.
In addition, the display panel may further include a flexible circuit board 400 and a cover glass 500. The flexible circuit board 400 may be bonded to the fingerprint recognition assembly 200 to provide a signal thereto. When the fingerprint recognition assembly 200 is an ultrasonic fingerprint recognition assembly, the flexible circuit board 400 may be specifically bonded to the TFT substrate 210. The cover glass 500 may have a thickness of 0.4mm to 0.8 mm. The thickness of the display screen 100 may be 300 μm to 600 μm.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.