CN207182303U - Ultrasonic wave biological identification device and electronic equipment - Google Patents
Ultrasonic wave biological identification device and electronic equipment Download PDFInfo
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- CN207182303U CN207182303U CN201721165633.3U CN201721165633U CN207182303U CN 207182303 U CN207182303 U CN 207182303U CN 201721165633 U CN201721165633 U CN 201721165633U CN 207182303 U CN207182303 U CN 207182303U
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Abstract
It the utility model is related to a kind of ultrasonic wave biological identification device and electronic equipment.The ultrasonic wave biological identification device includes supersonic sensing component, cover plate assembly and absorbent treatment.Supersonic sensing component can launch ultrasonic wave, and can receive the back wave of ultrasonic wave, and supersonic sensing component has the detection zone for being used for detecting thing to be detected；Cover plate assembly is arranged in the detection zone of supersonic sensing component, and covers detection zone；Absorbent treatment is layered on supersonic sensing component, and absorbent treatment can absorb supersonic sensing component and not launch to the ultrasonic wave of detection zone.Above-mentioned ultrasonic wave biological identification device identification is more accurate.
Description
Technical field
Ultrasonic wave identification technology field is the utility model is related to, more particularly to a kind of ultrasonic wave biological identification device and electronics
Equipment.
Background technology
Ultrasonic fingerprint identification technology is scanned by ultrasonic wave to fingerprint, compared with traditional fingerprint recognition mode,
Ultrasonic fingerprint identification fingerprint can be carried out deeper into analysis, also do not hinder ultrasonic wave even if finger surface speckles with dirt and adopt
The unique 3D features of fingerprint are identified under sample, or even the surface that can also penetrate to the skin.Even in there is situations such as water, sweat on hand
Under, still can accurately it identify.Not enough accurately asked however, current ultrasonic wave biological identification device has identification function
Topic.
Utility model content
Based on this, it is necessary to provide a kind of more accurate ultrasonic wave biological identification device of identification.
In addition, also provide the application of above-mentioned ultrasonic wave biological identification device.
A kind of ultrasonic wave biological identification device, including：
Supersonic sensing component, ultrasonic wave can be launched, and the back wave of ultrasonic wave can be received, the supersonic sensing
Component has the detection zone for being used for detecting thing to be detected；
Cover plate assembly, it is arranged in the detection zone of the supersonic sensing component, and covers the detection zone, and
Absorbent treatment, it is layered on the supersonic sensing component, the absorbent treatment can absorb the supersonic sensing group
Part is not launched to the ultrasonic wave of the detection zone.
Because current ultrasonic sensor can not only launch the ultrasonic wave propagated towards screen orientation, while it can also launch court
The ultrasonic wave that direction away from screen is propagated, the ultrasonic wave propagated towards screen orientation contact the back wave formed after examined object
Received to form image by ultrasonic sensor, if but running into foreign matter etc. towards the ultrasonic wave propagated away from screen orientation can also occur
Reflection, the back wave of formation can also be received by ultrasonic sensor and form image, so as to influence ultrasonic wave biological identification dress
The precision for the identification put, and above-mentioned ultrasonic wave biological identification device by supersonic sensing component set can absorb it is super
The absorbent treatment of sound wave, and absorbent treatment can absorb supersonic sensing component and not launch to the ultrasonic wave of detection zone, it is super to absorb
Ultrasonic wave on conduction to the absorbent treatment of sound wave sensory package transmitting, avoid the ultrasonic wave of absorbent treatment respective regions that reflection occurs
The definition of image is influenceed into image, so as to improve the precision of ultrasonic wave biological identification device.
In one of the embodiments, the absorbent treatment is OCA optical cement layers.OCA optical cements sheet, can as double faced adhesive tape
It is adhered directly on supersonic sensing component, can not only be advantageous to reduce the thickness of ultrasonic wave biological identification device and realize super
The miniaturization of color ripple biological identification device, the weight of ultrasonic wave biological identification device is reduced, can also simplify manufacture craft.
In one of the embodiments, the absorbent treatment is selected from visco-elastic damping layer, foam layer and isocyanates and inhaled
One kind in sound layer.Visco-elastic damping layer, foam layer and isocyanates absorbent treatment are respectively provided with preferable acoustically effective, with reality
The preferable acoustically effective of existing ultrasonic wave.
In one of the embodiments, the visco-elastic damping layer is rubber layer.Rubber has preferable acoustically effective.
In one of the embodiments, the foam layer is polyurethane foam layer or polystyrene foam plastics
Layer.Polyurethane foam layer, polystyrene foam plastics layer have preferable acoustically effective.
In one of the embodiments, the thickness of the absorbent treatment is 25 microns~200 microns.Using OCA optical cement layers,
Visco-elastic damping layer, foam layer or isocyanates absorbent treatment are as absorbent treatment so that the thickness of absorbent treatment only needs 25 micro-
Rice can just sponge supersonic sensing component well towards away from cover plate assembly direction transmitting ultrasonic wave, be advantageous to reduce ultrasound
The volume of ripple biological identification device, and by the thickness control of absorbent treatment below 200 microns, to avoid ultrasonic wave biological identification dress
Put with larger thickness, it is ensured that ultrasonic wave biological identification device has suitable volume, and can be as needed at 25 microns
The thickness of absorbent treatment is adjusted in~200 microns, to realize the controllability of the volume size of above-mentioned ultrasonic wave biological identification device.
In one of the embodiments, in addition to screen layer, the screen layer are laminated in the absorbent treatment away from described super
On the side of sound wave sensory package, the screen layer can shield electromagnetic wave, and light can be prevented to pass through.By absorbing sound
Being set on layer can prevent light from passing through and shield shielding electromagnetic waves layer, to block extraneous light and shielding external electromagnetic waves,
The interference of ambient and electromagnetic wave is avoided, improves the precision of ultrasonic wave biological identification device.
In one of the embodiments, the screen layer is black conductive glued membrane, and the thickness of the screen layer is 20 microns
~150 microns.Black conductive glued membrane can not only block extraneous light, additionally it is possible to shield the interference of external electromagnetic waves, and price
Moderate, material is lighter, advantageously reduces the manufacturing cost and weight of ultrasonic fingerprint identification device；And use black conductive glued membrane
Blocking for 20 microns of shieldings that can be realized as external electromagnetic waves and extraneous light is only needed as shielding thickness, is advantageous to ultrasound
The miniaturization of ripple biological identification device, and by the thickness control of screen layer to avoid ultrasonic wave biological from identifying below 150 microns
Device has larger thickness, it is ensured that ultrasonic wave biological identification device has suitable volume, and can be micro- 20 as needed
The thickness of screen layer is adjusted in rice~150 microns, to realize the adjustable of the volume size of above-mentioned ultrasonic wave biological identification device
Property.
In one of the embodiments, the cover plate assembly includes cover plate and ink layer, and the cover plate is Transparent Parts, described
Ink layer is laminated on a surface of the cover plate, and the ink layer is set close to the detection zone of the supersonic sensing component
Put.By the way that cover plate is arranged into Transparent Parts, and ink layer is set on the cover board, can make cover plate assembly that there is required color,
And cover plate assembly is set to have the function that to block extraneous light.
In one of the embodiments, the supersonic sensing component includes thin film transistor (TFT) and stacked gradually in described thin
Piezoelectric layer, conductive layer and acoustic matching layer on film transistor, the acoustic matching layer are laminated with the cover plate assembly, the absorbent treatment
It is layered on side of the thin film transistor (TFT) away from the piezoelectric layer.The supersonic sensing component of the structure can not only be realized
The transmitting of ultrasonic wave, additionally it is possible to realize the reception of the back wave of ultrasonic wave, and reflected wave conversion is advantageous into ultrasound into electric signal
The miniaturization of ripple biological identification device.
In one of the embodiments, the thickness of the acoustic matching layer is 20 microns~100 microns, the thickness of the piezoelectric layer
Spend for 8 microns~10 microns.The acoustic matching layer of the thickness and the piezoelectric layer of the thickness can be well matched with, to improve ultrasonic wave
The accuracy of the identification function of biological identification device.
A kind of electronic equipment, including above-mentioned ultrasonic wave biological identification device, the cover plate assembly are the electronic equipment
Shell.Because the identification function of above-mentioned ultrasonic wave biological identification device is more accurate, so that using above-mentioned ultrasonic wave biological
The electronic equipment of identification device also has more accurate identification function.
A kind of electronic equipment, including shell and above-mentioned ultrasonic wave biological identification device, the cover plate assembly are embedded in described
In shell, or side of the cover plate assembly away from the supersonic sensing component is laminated with the shell.Due to above-mentioned super
The identification function of acoustic wave biological identification device is more accurate, so that being set using the electronics of above-mentioned ultrasonic wave biological identification device
It is standby that also there is more accurate identification function.
Brief description of the drawings
Fig. 1 is the profile of the ultrasonic wave biological identification device of an embodiment；
Fig. 2 is the profile of the ultrasonic wave biological identification device of another embodiment；
Fig. 3 is the profile of the ultrasonic wave biological identification device of another embodiment；
Fig. 4 is the profile of the ultrasonic wave biological identification device of another embodiment；
Fig. 5 is the profile of the ultrasonic wave biological identification device of another embodiment.
Embodiment
For the ease of understanding the utility model, the utility model is more fully retouched below with reference to relevant drawings
State.Preferred embodiment of the present utility model is given in accompanying drawing.But the utility model can come in many different forms
Realize, however it is not limited to embodiment described herein.On the contrary, the purpose for providing these embodiments is made to of the present utility model
The understanding of disclosure more thorough and comprehensive.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to technology of the present utility model
The implication that the technical staff in domain is generally understood that is identical.It is simply in term used in the description of the present utility model herein
The purpose of description specific embodiment, it is not intended that in limitation the utility model.
As shown in figure 1, the electronic equipment of an embodiment, such as can be mobile phone, computer etc., including ultrasonic wave biological is known
Other device 100, such as can be used for the identification of fingerprint.Wherein, the ultrasonic wave biological identification device 100 include cover plate assembly 110,
Supersonic sensing component 120, absorbent treatment 130, screen layer 135 and circuit board 140.
Cover plate assembly 110 can be for the shell of electronic equipment, the part as direct body contact；It is appreciated that cover plate
Component 110 is not limited to the shell of electronic equipment, and cover plate assembly 110 can also be inlayed in the housing of the electronics device, or, lid
The shell of board component 110 and electronic equipment is laminated.Wherein, cover plate assembly 110 includes cover plate 112 and ink layer 114.
Cover plate 112 is Transparent Parts.Cover plate 112 is in transparency glass plate, quartz plate, alumina plate and transparent organic plates
One kind, the cover plate 112 of these materials not only have more suitable mechanical strength, and can also meet industrial design (ID,
Industrial Design) requirement.Specifically, cover plate 112 can be the preposition cover plate of electronic equipment, directly be connect for human body
Tactile part, it can also inlay in the housing of the electronics device, or, it is stacked with the shell of electronic equipment.
Ink layer 114 is layered on a surface of cover plate 112.Ink layer 114 can be formed by modes such as silk-screen printings
On cover plate 112.Specifically, ink layer 114 is black ink layer or white ink layer.Wherein, the material of ink layer 114 is ring
Oxygen tree lipid ink, the ink of the material differ larger with the acoustic resistance of air, will not reflectance ultrasound ripple, i.e., hardly to ultrasound
The propagation of ripple impacts.
By the way that cover plate 112 is arranged into Transparent Parts, and ink layer 114 is set on cover plate 112, cover plate assembly can be made
110 have required color, and make cover plate assembly 110 have the function that to block extraneous light.
Supersonic sensing component 120 can launch ultrasonic wave, and can receive the back wave of ultrasonic wave, and back wave is turned
Change electric signal into.Wherein, supersonic sensing component 120 has the detection zone 121 for being used for detecting thing to be detected, cover plate assembly
110 are arranged in the detection zone of supersonic sensing component 120, and cover detection zone 121.Specifically, supersonic sensing group
Part 120 is laminated with cover plate assembly 110, and ink layer 114 is set close to supersonic sensing component 120.Specifically in the embodiment of diagram
In, supersonic sensing component 120 include thin film transistor (TFT) 122 and stack gradually in the piezoelectric layer 124 on thin film transistor (TFT) 122,
Conductive layer 126 and acoustic matching layer 128.
The circuit for converting the electrical signal to image is provided with thin film transistor (TFT) 122.
Piezoelectric layer 124 is laminated on thin film transistor (TFT) 122.Piezoelectric layer 124 can launch ultrasonic wave, and can receive ultrasound
The back wave of ripple, and by reflected wave conversion into electric signal.
Specifically, the material of piezoelectric layer 124 is ferroelectric polymers；More specifically, the material of piezoelectric layer 124 is P (VDF-
TrFE) (copolymer of Kynoar and trifluoro-ethylene).Wherein, in P (VDF-TrFE), Kynoar and poly- trifluoro-ethylene
Mol ratio be 60:40、70:30、80:20 or 90:10.It is appreciated that the material of piezoelectric layer 124 is not limited to above-mentioned material,
For example, the material of piezoelectric layer 124 can also be the homopolymer of polyvinylidene chloride (PVDC), polyvinylidene chloride copolymer,
The homopolymer of polytetrafluoroethylene (PTFE), the copolymer of polytetrafluoroethylene (PTFE), diisopropylamine bromide (DTPAB) or Kynoar etc..
Conductive layer 126 is laminated on side of the piezoelectric layer 124 away from thin film transistor (TFT) 122, wherein, 128 layers of acoustic matching layer
It is stacked on side of the conductive layer 126 away from piezoelectric layer 124.
Specifically, conductive layer 126 is two layers, and two conductive layers 126 are sequentially laminated on piezoelectric layer 124.Specifically, two layers
The material of conductive layer 126 is silver.Then two conductive layers 126 can be obtained through oversintering again by silk-screen printing silver paste, if
Conductive layer 126 can be made more uniformly by putting two conductive layers 126, and make the surface of the conductive layer 126 away from piezoelectric layer 124 more
It is smooth, be advantageous to the conduction of electric charge.Either it is more than two layers it is appreciated that conductive layer 126 can also be one layer.
Acoustic matching layer 128 is layered on conductive layer 126, and acoustic matching layer 128 is laminated with cover plate assembly 110.That is acoustic matching
128 side away from conductive layer 126 of layer are detection zone 121；Ink layer 114 is set close to acoustic matching layer 128.Specifically, sound
Matching layer 128 is laminated on a conductive layer 126 away from piezoelectric layer 124；Side of the acoustic matching layer 128 away from conductive layer 126
It is laminated with ink layer 114.Acoustic matching layer 128 is used to be matched the acoustic impedance of examined object.For example, thing to be detected can
Think finger.Specifically, acoustic matching layer 128 is that chip attaches film (Die attach film, DAF).
Wherein, the thickness of acoustic matching layer 128 is 20 microns~100 microns, and the thickness of piezoelectric layer 124 is micro- for 8 microns~10
Rice.The acoustic matching layer 128 of the thickness can be well matched with the piezoelectric layer 124 of the thickness, to strengthen the signal of ultrasonic wave, be carried
The accuracy of the identification of praetersonic biological identification device 100.
Further, ultrasonic wave biological identification device 100 also includes the first adhesive layer 150, and the first adhesive layer 150 is arranged on
Between supersonic sensing component 120 and cover plate assembly 110, and fixed bonding supersonic sensing component 120 and cover plate assembly 110.
Specifically, the first adhesive layer 150 is arranged between acoustic matching layer 128 and ink layer 114.Wherein, the material of the first adhesive layer 150
For liquid glue, liquid glue is epoxy resin glue, such as the NCA3285 of Henkel.
It is appreciated that the first adhesive layer 150 can also omit, acoustic matching layer directly can be formed on ink layer 114
128, such as by techniques such as coating, silk-screen printings, now, conductive layer 126 and matching layer 128 need to be bonded in one with glue
Rise, glue can be the NCA3285 of Henkel.
Absorbent treatment 130 is layered on supersonic sensing component 120, and absorbent treatment 130 can absorb supersonic sensing component 120
Do not launch to the ultrasonic wave of detection zone 121, with the direction towards remote cover plate 112 for preventing supersonic sensing component 120 from launching
Ultrasonic reflections to supersonic sensing component 120 and influence imaging.Specifically, absorbent treatment 130 is layered in thin film transistor (TFT) 122
On side away from piezoelectric layer 124.
It is appreciated that absorbent treatment 130 is not limited to be layered on side of the thin film transistor (TFT) 122 away from piezoelectric layer 124, sound absorption
Layer 130 can be coated with supersonic sensing component 120, and only allow detection zone 121 to be exposed, to absorb supersonic sensing group simultaneously
Part 120 is launched to the ultrasonic wave of side.
Wherein, absorbent treatment 130 is OCA optical cement layers.Because OCA optical cement sheets are as double faced adhesive tape so that optical cement absorbs sound
Layer 130 can be adhered directly on thin film transistor (TFT) 122, i.e., material can simplify manufacture craft for the absorbent treatment 130 of optical cement.
In addition, absorbent treatment 130 is directly overlayed on side of the supersonic sensing component 100 away from cover plate assembly 110, additionally it is possible to after avoiding
Continuous debris is attached on side of the supersonic sensing component 120 away from cover plate assembly 110.
The thickness of absorbent treatment 130 is 25 microns~200 microns.Using material of the OCA optical cements as absorbent treatment 130, make
The thickness of absorbent treatment 130 only needs 25 microns and can just sponge supersonic sensing component 120 well towards away from cover plate group
Ultrasonic wave is launched in the direction of part 110, is advantageous to reduce the volume of ultrasonic wave biological identification device 100, and by the thickness of absorbent treatment 130
Control is below 200 microns, to avoid ultrasonic wave biological identification device 100 from having larger thickness, it is ensured that ultrasonic wave biological is known
Other device 100 has suitable volume, and can adjust the thickness of absorbent treatment 130 in 25 microns~200 microns as needed,
To realize the controllability of the volume size of above-mentioned ultrasonic wave biological identification device 100.
Screen layer 135 is layered on side of the absorbent treatment 130 away from supersonic sensing component 120, and screen layer 135 can hinder
Only light passes through and shielded electromagnetic wave.Wherein, screen layer 135 is black conductive glued membrane, and black conductive glued membrane can not only block
Extraneous light, additionally it is possible to the interference of external electromagnetic waves is shielded, and it is moderate, material is lighter, advantageously reduces ultrasonic fingerprint
The manufacturing cost and weight of identification device 100.
Wherein, the thickness of screen layer 135 is 20 microns~150 microns.The thickness of screen layer 135 is only needed as 20 microns with regard to energy
Enough play a part of shielding external electromagnetic waves and block extraneous light, be advantageous to the miniaturization of ultrasonic wave biological identification device 100,
If screen layer 135 is blocked up, the volume of ultrasonic wave biological identification device 100 can be caused excessive.It is appreciated that it can adjust as needed
The thickness of screen layer 135, to realize the controllability of the volume size of ultrasonic wave biological identification device 100.
Circuit board 140 is used for the chip for electrically connecting supersonic sensing component 120 and ultrasonic fingerprint identification device 100.Tool
Body, circuit board 140 is flexible PCB.Specifically, circuit board 140 is the strip structure containing EMI screen layers, circuit board
140 one end electrically connects with supersonic sensing component 120, and the other end is repeatedly bent to form bending segment 142, bending segment 142 and screen
Cover layer 135 to be laminated, by the way that the circuit board 140 containing screen layer is bent to form into bending segment 142, and itself and screen layer 135 are consolidated
Given layer is folded, and can further increase the electromagnetic wave shielding function of ultrasonic wave biological identification device 100, makes ultrasonic wave biological identification dress
Put 100 identification function it is more accurate.More specifically, the one end of circuit board 140 away from bending segment 142 and conductive layer 126, thin
Circuit on film transistor 122 electrically connects.
Specifically, the second adhesive layer 160 is provided between the bending segment 142 and screen layer 135 of circuit board 140, by circuit
Plate 140 is fixedly connected with screen layer 135.Specifically, the material of the second adhesive layer 160 is pressure sensitive adhesive, such as acrylic size
Stick.
It is appreciated that screen layer 135 can omit, now, the bending segment 142 of circuit board 140 is directly solid with screen layer 135
It is fixed to bond；Circuit board 140 can not also be bent, and now, the second adhesive layer 160 can omit.
Above-mentioned ultrasonic wave biological identification device 100 at least has the advantage that：
(1) because ultrasonic sensor can not only launch the ultrasonic wave propagated towards screen orientation, while can also launch towards remote
The ultrasonic wave that the direction of off screen curtain is propagated, the ultrasonic wave propagated towards screen orientation contact the back wave quilt formed after examined object
Ultrasonic sensor receives to form image, if but running into foreign matter etc. towards the ultrasonic wave propagated away from screen orientation can also occur instead
Penetrate, the back wave of formation can also be received by ultrasonic sensor and form image, so as to influence ultrasonic wave biological identification device
Identification precision, and above-mentioned ultrasonic wave biological identification device 100 can be inhaled by being set on supersonic sensing component 120
The absorbent treatment 130 of ultrasonic wave is received, and absorbent treatment 130 can absorb supersonic sensing component 120 and not launch to detection zone 121
Ultrasonic wave, to absorb the ultrasonic wave on conduction to the absorbent treatment 130 of the transmitting of supersonic sensing component 120, avoid the phase of absorbent treatment 130
The ultrasonic wave in region is answered to reflect to form image and influence the definition of image, so as to improve ultrasonic wave biological identification device
100 precision.
(2) while absorbent treatment 130 is OCA optical cement layers, and OCA optical cements sheet can be adhered directly to surpass as double faced adhesive tape
On sound wave sensory package 120, and screen layer 135 can be adhered to, can not only be advantageous to reduce ultrasonic wave biological identification dress
100 thickness is put, in favor of the miniaturization of ultrasonic wave biological identification device, can also simplify manufacture craft.And screen layer 135 is
Black conductive glued membrane, black conductive glued membrane can be also adhered directly on absorbent treatment 130, and the absorbent treatment 130 of material optical cement is matched somebody with somebody
It is lighter as the mass of screen layer 135 of black conductive glued membrane using material, ultrasonic wave biological identification device 100 can be effectively reduced
Weight.
Further, since the identification function of above-mentioned ultrasonic wave biological identification device 100 is more accurate, small volume, and quality
It is lighter so that also there is preferable recognition performance using the electronic equipment of the ultrasonic wave biological identification device 100, be advantageous to electronics
The miniaturization of equipment and the mitigation of weight.
As shown in Fig. 2 the ultrasonic wave biological identification device 200 of another embodiment and ultrasonic wave biological identification device 100
Structure it is roughly the same, difference is, the other end of the circuit board 210 of the ultrasonic wave biological identification device 200 of present embodiment
Without bending, now, circuit board 210 is not fixed with screen layer 220.
Due to the structure and ultrasonic wave biological identification device 100 of the ultrasonic wave biological identification device 200 of present embodiment
Structure is roughly the same, and therefore, ultrasonic wave biological identification device 200 also has the similar effect of ultrasonic wave biological identification device 100.
As shown in figure 3, the ultrasonic wave biological identification device 300 of another embodiment and ultrasonic wave biological identification device 100
Structure it is roughly the same, difference is, the absorbent treatment 310 of the ultrasonic wave biological identification device 300 of present embodiment is selected from viscoelastic
One kind in property damping layer, foam layer and isocyanates absorbent treatment.Wherein, visco-elastic damping layer is rubber.Foamed plastics
Layer is polyurethane foam layer or polystyrene foam plastics layer.Now, absorbent treatment 310 is adhered to by pressure-sensitive adhesive layer 320
On thin film transistor (TFT) 330.
It is appreciated that pressure-sensitive adhesive layer 320 can also omit, directly absorbent treatment 310 can be coated or is screen printed onto
On thin film transistor (TFT) 330.
Due to the structure and ultrasonic wave biological identification device 100 of the ultrasonic wave biological identification device 300 of present embodiment
Structure is roughly the same, and therefore, ultrasonic wave biological identification device 300 also has the similar effect of ultrasonic wave biological identification device 100.
As shown in figure 4, the ultrasonic wave biological identification device 400 of another embodiment and ultrasonic wave biological identification device 100
Structure it is roughly the same, difference is, the supersonic sensing component 410 of the ultrasonic wave biological identification device 400 of present embodiment
Acoustic matching layer 412 directly by the techniques such as coating, silk-screen printing formed on cover plate assembly 420, at this point it is possible to by pressure-sensitive
The acoustic matching layer 412 of supersonic sensing component 410 and conductive layer 414 are bonded together by glue-line 430.
Due to the structure and ultrasonic wave biological identification device 100 of the ultrasonic wave biological identification device 400 of present embodiment
Structure is roughly the same, and therefore, ultrasonic wave biological identification device 400 also has the similar effect of ultrasonic wave biological identification device 100.
As shown in figure 5, the ultrasonic wave biological identification device 500 of another embodiment and ultrasonic wave biological identification device 100
Structure it is roughly the same, differ only in, the absorbent treatment 510 of the ultrasonic wave biological identification device 500 of present embodiment is away from super
The side of sound wave sensory package 520 is not provided with screen layer, and the bending segment 532 of circuit board 530 directly bonds admittedly with absorbent treatment 510
It is fixed.
Due to the structure and ultrasonic wave biological identification device 100 of the ultrasonic wave biological identification device 500 of present embodiment
Structure is roughly the same, and therefore, ultrasonic wave biological identification device 500 also has the similar effect of ultrasonic wave biological identification device 100.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that the common skill for this area
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (13)
- A kind of 1. ultrasonic wave biological identification device, it is characterised in that including：Supersonic sensing component, ultrasonic wave can be launched, and the back wave of ultrasonic wave can be received, the supersonic sensing component With the detection zone for detecting thing to be detected；Cover plate assembly, it is arranged in the detection zone of the supersonic sensing component, and covers the detection zone；AndAbsorbent treatment, it is layered on the supersonic sensing component, the absorbent treatment can absorb the supersonic sensing component not Launch to the ultrasonic wave of the detection zone.
- 2. ultrasonic wave biological identification device according to claim 1, it is characterised in that the absorbent treatment is OCA optical cements Layer.
- 3. ultrasonic wave biological identification device according to claim 1, it is characterised in that the absorbent treatment hinders selected from viscoplasticity One kind in Buddhist nun's layer, foam layer and isocyanates absorbent treatment.
- 4. ultrasonic wave biological identification device according to claim 3, it is characterised in that the visco-elastic damping layer is rubber Layer.
- 5. ultrasonic wave biological identification device according to claim 3, it is characterised in that the foam layer is polyurethane Foam layer or polystyrene foam plastics layer.
- 6. the ultrasonic wave biological identification device according to Claims 2 or 3, it is characterised in that the thickness of the absorbent treatment is 25 microns~200 microns.
- 7. ultrasonic wave biological identification device according to claim 1, it is characterised in that also including screen layer, the shielding For layer stackup on side of the absorbent treatment away from the supersonic sensing component, the screen layer can shield electromagnetic wave, and And light can be prevented to pass through.
- 8. ultrasonic wave biological identification device according to claim 7, it is characterised in that the screen layer is black conductive glue Film, the thickness of the screen layer is 20 microns~150 microns.
- 9. ultrasonic wave biological identification device according to claim 1, it is characterised in that the cover plate assembly includes cover plate and oil Layer of ink, the cover plate are Transparent Parts, and the ink layer is laminated on a surface of the cover plate, and the ink layer is close to described The detection zone of supersonic sensing component is set.
- 10. ultrasonic wave biological identification device according to claim 1, it is characterised in that the supersonic sensing component bag Include thin film transistor (TFT) and stack gradually in the piezoelectric layer on the thin film transistor (TFT), conductive layer and acoustic matching layer, the acoustic matching Layer is laminated with the cover plate assembly, and the absorbent treatment is layered on side of the thin film transistor (TFT) away from the piezoelectric layer.
- 11. ultrasonic wave biological identification device according to claim 10, it is characterised in that the thickness of the acoustic matching layer is 20 microns~100 microns, the thickness of the piezoelectric layer is 8 microns~10 microns.
- 12. a kind of electronic equipment, it is characterised in that know including the ultrasonic wave biological as described in claim 1~11 any one Other device, the cover plate assembly are the shell of the electronic equipment.
- 13. a kind of electronic equipment, it is characterised in that the ultrasonic wave including shell and as described in claim 1~11 any one Biological identification device, the cover plate assembly are embedded in the shell, or, the cover plate assembly is laminated with the shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721165633.3U CN207182303U (en) | 2017-09-12 | 2017-09-12 | Ultrasonic wave biological identification device and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721165633.3U CN207182303U (en) | 2017-09-12 | 2017-09-12 | Ultrasonic wave biological identification device and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN207182303U true CN207182303U (en) | 2018-04-03 |
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ID=61746124
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721165633.3U Expired - Fee Related CN207182303U (en) | 2017-09-12 | 2017-09-12 | Ultrasonic wave biological identification device and electronic equipment |
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| CN (1) | CN207182303U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020155321A1 (en) * | 2019-01-31 | 2020-08-06 | 武汉华星光电半导体显示技术有限公司 | Oled display screen module |
-
2017
- 2017-09-12 CN CN201721165633.3U patent/CN207182303U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020155321A1 (en) * | 2019-01-31 | 2020-08-06 | 武汉华星光电半导体显示技术有限公司 | Oled display screen module |
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