CN108734068A - Fingerprint sensing unit impression system and its method - Google Patents
Fingerprint sensing unit impression system and its method Download PDFInfo
- Publication number
- CN108734068A CN108734068A CN201710265253.5A CN201710265253A CN108734068A CN 108734068 A CN108734068 A CN 108734068A CN 201710265253 A CN201710265253 A CN 201710265253A CN 108734068 A CN108734068 A CN 108734068A
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- China
- Prior art keywords
- fingerprint sensing
- sensing unit
- layer
- jig
- unit
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
Abstract
A kind of fingerprint sensing unit impression system of present invention offer and its method, including：With shrinkage pool to house the first jig of fingerprint sensing unit；Module is imprinted, to form embossed layer in the surface of the first jig and fingerprint sensing unit；Laser cutting module, to cut embossed layer to form the protective layer that area is more than fingerprint sensing unit upper surface in fingerprint sensing unit；And with groove to house the second jig of fingerprint sensing unit; its further groove includes connecting the vacuum suction unit of air pump; when the shrinkage pool of fingerprint sensing unit from the first jig is replaced to the groove of the second jig; booster air pump makes vacuum suction unit adsorb and fixes fingerprint sensing unit; then protective layer is cut with laser cutting module, the area of protective layer is made to be equal to the area of fingerprint sensing unit upper surface.Fingerprint sensing unit impression system and its method provided by the invention significantly reduce the protective layer of fingerprint sensing unit because material be coated with it is uneven caused by flash or surface irregularity the case where.
Description
Technical field
The present invention relates to imprinting process technical field, the impression system in particular to a kind of electronic component and its side
Method.
Background technology
Fingerprint identification module has gradually become one of standard outfit of electronic device, and user can pass through fingerprint recognition mould
Block carries out the identification of status, to be unlocked or control to electronic device.
In general, fingerprint identification module has the protective layer of a fingerprint sensing unit and covering thereon, when user is with hand
When finger presses on protective layer, fingerprint sensing unit can detect the finger print of contact protection layer surface.
In existing technology, the formation of protective layer, the typically surface prior to a batch of fingerprint sensing unit are formed
After embossed layer, then to be cut by laser embossed layer with output single one fingerprint identification module.But due to the processing mode of batch,
Be formed by it is uneven when embossed layer may be because coating, and the case where cause the limit of embossed layer to overflow or generate flash,
The so not only possible protective layer out-of-flatness for allowing fingerprint sensing unit or the appearance to tarnish, also may be such that it loses carefully
The sense of touch of cause.
In view of this, how to provide a kind of impression system and method, reduces embossed layer limit effectively to carry and overflow or flash
The case where occur, for the of the invention technical task to be solved.
Invention content
The main object of the present invention is to provide a kind of fingerprint sensing unit impression system have a upper table to imprint
The one fingerprint sensing unit of face and a lower surface, the system include：
First jig, with first surface, relative to first surface second surface and at least a shrinkage pool is formed in second
Surface, shrinkage pool is to accommodating fingerprint sensing unit；
Module is imprinted, to form embossed layer in the upper surface of the second surface of the first jig and fingerprint sensing unit；
Laser cutting module to cut embossed layer to form protective layer in the upper surface of fingerprint sensing unit, and is protected
The area of layer is more than the area of upper surface；
Air pump；And
Second jig has groove to accommodating fingerprint sensing unit, and groove includes vacuum suction unit, and vacuum suction
Unit connects air pump；
Wherein, when the shrinkage pool of fingerprint sensing unit from the first jig is replaced to the groove of the second jig, booster air pump with
Driving vacuum suction unit adsorbs and fixes fingerprint sensing unit, then cuts protective layer with laser cutting module, makes protective layer
Area be equal to upper surface area.
In above-mentioned preferred embodiment, wherein shrinkage pool runs through first surface and second surface.
In above-mentioned preferred embodiment, wherein the first jig further comprises that adhesive-layer, adhesive-layer are located at first surface,
And adhesive-layer is adhering to the lower surface of fingerprint sensing unit.
In above-mentioned preferred embodiment, wherein embossed layer includes：Light-curable ink layer, thermo-cured ink layer, mixed type
Ink layer, ultraviolet light photopolymerization resin layer or anti-fingerprint film plating layer.
In above-mentioned preferred embodiment, wherein coining module includes：Coater unit and imprinter unit.
In above-mentioned preferred embodiment, wherein coater unit is：Painting cloth-knife or coating wheel.
In above-mentioned preferred embodiment, wherein imprinter unit is：Platen or coining wheel.
Another preferred practice of the present invention, is related to a kind of fingerprint sensing unit method for stamping, includes the following steps：
(a) provides fingerprint sensing unit, and fingerprint sensing unit has the upper surface and the lower surface；
(b) provides the first jig, and the first jig has first surface, the second surface and at least relative to first surface
One shrinkage pool is formed in second surface；
(c) fingerprint sensing unit is placed in shrinkage pool by, and in the upper surface of fingerprint sensing unit and the second table of the first jig
Face forms embossed layer；
(d) cuts embossed layer, to form protective layer of the area more than the area of upper surface；
(e) provides the second jig, and the second jig has groove, and groove includes vacuum suction unit；
(f) adsorbs fixed fingerprint sensing unit by fingerprint sensing replacement unit to groove, and with vacuum suction unit；And
(g) cuts protective layer, and the area of protective layer is made to be equal to the area of upper surface.
In above-mentioned preferred embodiment, wherein in step (c), it is coated with and embossed ink material is to form embossed layer.
In above-mentioned preferred embodiment, wherein ink material is：Light curable type ink, thermohardening type printing ink or doped with
The mixed type ink of light curable type ink and thermohardening type printing ink.
In above-mentioned preferred embodiment, wherein in step (c), it is coated with and imprints ultraviolet light photopolymerization resin material with shape
At embossed layer.
In above-mentioned preferred embodiment, wherein in step (c), it is coated with and imprints anti-fingerprint plated film to form embossed layer.
Description of the drawings
Fig. 1：For fingerprint sensing unit impression system provided by the present invention；
Fig. 2A to 2G：For the present invention schematic diagram of protective layer is formed in fingerprint sensing unit upper surface；
Fig. 3 A to 3C：For the schematic diagram of the protective layer of present invention finishing fingerprint sensing unit；And
Fig. 4：For the flow chart of fingerprint sensing unit method for stamping provided by the present invention.
Reference sign：
S101~S106 steps
1 fingerprint sensing unit impression system
10 first jigs
101 first jig plates
1011 shrinkage pools
1012 first surfaces
1013 second surfaces
102 adhesive-layers
11 second jigs
111 grooves
112 vacuum suction units
113 communicating pipes
12 air pumps
13 coining modules
131 coater units
132 imprinter units
14 laser cutting modules
20 fingerprint sensing units
201 lower surfaces
202 upper surfaces
30 embossed layers
301 protective layers
Specific implementation mode
Advantages of the present invention and feature and reach its method will be carried out with reference to exemplary embodiments and attached drawing it is more detailed
It describes and is easier to understand.However, the present invention can realize and in different forms not it is understood that being only limitted to set forth herein
Embodiment.On the contrary, for skilled artisan, these embodiments provided will make the disclosure more thorough
With comprehensively and completely convey the scope of the present invention.
First, refering to Figure 1, Fig. 1 is fingerprint sensing unit impression system provided by the present invention.The fingerprint sense
Surveying unit impression system 1 includes：First jig 10, the second jig 11, air pump 12, coining module 13 and laser cutting module 14.
Wherein, the second jig 11 connects an air pump 12, and second can be made to control by running the gas in the second jig 11 of emptying of air pump 12
Tool 11 generates the effect of vacuum suction；Imprinting module 13 includes：Coater unit 131 and imprinter unit 132, wherein coater unit
131 can be painting cloth-knife or coating wheel；Imprinter unit 132 can be platen or coining wheel.
Fig. 2A to Fig. 2 G is please referred to, Fig. 2A to Fig. 2 G is that the present invention forms showing for protective layer in fingerprint sensing unit upper surface
It is intended to.Fig. 2A and Fig. 2 B are please referred to, in Fig. 2A, the first jig 10 includes：First jig plate 101 and adhesive-layer 102, adhesive-layer
102 be a kind of heat safe gummed paper, it is made still to have certain viscosity under high temperature；First jig plate 101 includes then：First table
Face 1012, second surface 1013 and the shrinkage pool 1011 through first surface 1012 and second surface 1013.Adhesive-layer 102 is located at the
One surface 1012 is simultaneously attached on first surface 1012, and shrinkage pool 1011 is then used to house fingerprint sensing unit 20.Fig. 2 B are will
Fingerprint sensing unit 20 is positioned over the stereoscopic schematic diagram of shrinkage pool 1011, and in Fig. 2 B, adhesive-layer 102 is to be located at first surface 1012
On and for adhering to 20 lower surface 201 of fingerprint sensing unit, to fix fingerprint sensing unit 20.And adhesive-layer 102 can attach
It is removed on first surface 1012 or from first surface 1012.Therefore, after fingerprint sensing unit 20 forms protective layer, can lead to
It crosses removal adhesive-layer 102 and takes out fingerprint sensing unit 20 from shrinkage pool 1011 to facilitate.The fingerprint sensing unit 20 be by
The encapsulation of plane grid array package (Land Grid Array, LGA) technology is made, and includes：Substrate (being not shown in the drawing), with
The sensor chip (being not shown in the drawing) of electrical property of substrate connection and epoxy moldable resin (the Epoxy Molding of encapsulation
Compound, EMC) material (being not shown in the drawing), and encapsulating the fingerprint sensing unit 20 completed has on a lower surface 201 and one
Surface 202.
Then, Fig. 2 C are please referred to, when fingerprint sensing unit 20 is positioned over shrinkage pool 1011, lower surface 201 adheres to
Adhesive-layer 102 makes it that can be temporarily fixed among shrinkage pool 1011.And the upper surface 202 of fingerprint sensing unit 20 then can be slightly higher than
Or the second surface 1013 of slightly below the first jig plate 101, or flush and formed with the second surface 1013 of the first jig plate 101
One coplanar structure type.Ink material, ultraviolet light photopolymerization resin material or anti-fingerprint plated film can be coated with by coater unit 131
In the second surface 1013 of the upper surface of fingerprint sensing unit 20 202 and the first jig plate of part 101 to form embossed layer 30.Please
With continued reference to Fig. 2 D, after the completion of the coating of coater unit 131, imprinter unit 132 then carries out imprint step to embossed layer 30, in
When coining, embossed layer 30 can be allowed to harden in a manner of Baking out or ultraviolet light exposure, and height is formed in the surface of embossed layer 30
The surface light (high-gloss).The high finish surface is the high and surface with gloss oil sense or specular appearance of fineness.It is aforementioned
Ink material can be：Light curable type ink, thermohardening type printing ink or doped with light curable type ink and thermohardening type printing ink
Mixed type ink；Ultraviolet light photopolymerization resin material is then made of resin monomer (monomer) and performed polymer (oligomer)
Oligomer can rapid crosslinking curing in a short time after by ultraviolet light；And with Baking out or ultraviolet light exposure
The embossed layer 30 of the formation then difference due to difference of institute's coating material type can be：Light-curable ink layer, thermosetting carburetion
The combination of layer of ink, mixed type ink layer, ultraviolet light photopolymerization resin layer, anti-fingerprint film plating layer or abovementioned layers.
Please continue to refer to Fig. 2 E, after layer 30 to be imprinted hardens completely, then embossed layer 30 is cut with laser cutting module 14, and
Protective layer 301 is formed in the upper surface of fingerprint sensing unit 20 202.As shown in Fig. 2 F and Fig. 2 G, Fig. 2 F are that embossed layer 30 is cut
Vertical view after the completion of cutting, wherein protective layer 301 can completely cover the upper surface 202 of fingerprint sensing unit 20, and protective layer
301 area is more than the area of the upper surface 202 of fingerprint sensing unit 20；Fig. 2 G are the side view of fingerprint sensing unit 20, will
Fingerprint sensing unit 20 is from after the taking-up of shrinkage pool 1011, wherein the protective layer 301 being cut by embossed layer 30 can completely cover
The upper surface 202 of lid fingerprint sensing unit 20, and the area of protective layer 301 is more than the upper surface 202 of fingerprint sensing unit 20
Area.Wherein, when the upper surface of fingerprint sensing unit 20 202 is flushed with the second surface 1013 of the first jig plate 101, institute's shape
At the thickness of protective layer 301 be equal to the thickness of embossed layer 30；When the upper surface of fingerprint sensing unit 20 202 is slightly below first
When the second surface 1013 of jig plate 101, the thickness for being formed by protective layer 301 is then slightly thicker than the thickness of embossed layer 30；When
When the upper surface 202 of fingerprint sensing unit 20 is slightly above the second surface 1013 of the first jig plate 101, it is formed by protective layer
301 thickness is then slightly thinner than the thickness of embossed layer 30.
It please refers to Fig.1 and Fig. 3 A to Fig. 3 C, Fig. 3 A to Fig. 3 C is showing for the protective layer of the invention for modifying fingerprint sensing unit
It is intended to.In Fig. 3 A, the second jig 11 has groove 111, and groove 111 is to the accommodating fingerprint sensing with protective layer 301
Unit 20, and 111 bottom of groove includes vacuum suction unit 112 and the communicating pipe being connected with vacuum suction unit 112 113.
The other end of communicating pipe 113 is then connected to air pump 12 (as shown in Figure 1).Then, as shown in Figure 3B, there will be protective layer 301
Fingerprint sensing unit 20 when being positioned over groove 111, start and run air pump 12, air pump 12 can further empty vacuum suction list
Gas in member 112 and communicating pipe 113 makes vacuum suction unit 112 generate the effect of vacuum suction to adsorb fingerprint sensing list
Fingerprint sensing unit 20 is thereby fixed in the lower surface 201 of member 20.At this point, laser cutting module 14 cuts protective layer 301, make guarantor
The area of sheath 301 is equal to the area of the upper surface 202 of fingerprint sensing unit 20.Finally, Fig. 3 C are please referred to, in Fig. 3 C, are waited for
The cutting finishing of protective layer 301 is completed, after making area of the area equal to the upper surface 202 of fingerprint sensing unit 20 of protective layer 301,
Air pump 12 i.e. out of service, allows vacuum suction unit 112 to lose the effect of vacuum suction, so can be by fingerprint sensing unit 20
It is taken out from groove 111.Another preferred practice of the present invention, the action that also can control air pump 12 to be supplied, when gas supply, gas
Body then sprays gas by fingerprint sensing unit 20 by being circulated to vacuum suction unit 112, vacuum suction unit 112 communicating pipe 113
It is removed from groove 111, or fingerprint sensing unit 20 can be more easily removed.Though the present invention is only proposed vacuum suction
Unit 112 is set to the embodiment of 111 bottom of groove, but in practical application, can also be set to vacuum suction unit 112
Any surface of groove 111 is not limited with embodiment proposed by the invention.
Also referring to Fig. 1, Fig. 2A to Fig. 2 G, Fig. 3 A to Fig. 3 C and Fig. 4, Fig. 4 is fingerprint sensing list provided by the present invention
The flow chart of first method for stamping.First, fingerprint sensing unit 20 is provided, fingerprint sensing unit 20 has upper surface 202 and following table
Face 201 (step S100)；Then, the first jig 10 is provided, the first jig has first surface 1012, relative to first surface
1012 second surface 1013 and at least a shrinkage pool 1011 is formed in second surface 1013 (step S101), in step S101,
First jig 10 includes the first jig plate 101 and adhesive-layer 102, then has on the first jig plate 101 and runs through first surface 1012
With the shrinkage pool 1011 of second surface 1013, adhesive-layer 102 then be located at first surface 1012, and be attached at first surface 1012 it
On.Fingerprint sensing unit 20 is placed in shrinkage pool 1011, and in the of the upper surface of fingerprint sensing unit 20 202 and the first jig 10
Two surfaces 1013 form embossed layer 30 (step S102), in step S102, first with coater unit 131 by ink material, ultraviolet
The materials such as light-hardening resin material or anti-fingerprint plated film are coated on upper surface 202 and the first jig plate of fingerprint sensing unit 20
101 second surface 1013 is to form embossed layer 30, after the completion of coating, then compresses embossed layer 30 with imprinter unit 132, then with
Baking out or the mode of ultraviolet light exposure make embossed layer 30 harden.Ink material above-mentioned can be：Light curable type ink, thermosetting
Change type ink or doped with light curable type ink and the mixed type ink of thermohardening type printing ink；Ultraviolet light photopolymerization resin material be by
The oligomer that resin monomer and performed polymer are formed, can be after receiving ultraviolet light, and promptly crosslinking is solid in a short time
Change.And the embossed layer 30 formed with Baking out or ultraviolet light exposure then according to using the difference of material and difference,
Can be：Light-curable ink layer, thermo-cured ink layer, mixed type ink layer, ultraviolet light photopolymerization resin layer, anti-fingerprint film plating layer or preceding
State the combination of each layer.
Then, embossed layer 30 is cut with laser cutting module 14, to form protection of the area more than the area of upper surface 202
301 (step S103) of layer；Then, the second jig 11 is provided, the second jig 11 has groove 111, and groove 111 is inhaled including vacuum
Coupon member 112 (step S104), in step S104,111 bottom of groove have vacuum suction unit 112 and with vacuum suction list
The communicating pipe 113 that member 112 is connected, the other end of communicating pipe 113 are then connected to air pump 12.Extremely by the displacement of fingerprint sensing unit 20
Groove 111, and will have in step S105 with the fixed fingerprint sensing unit 20 (step S105) of the absorption of vacuum suction unit 112
When the fingerprint sensing unit 20 of matcoveredn 301 is positioned over groove 111, start and run air pump 12, air pump 12 then empties vacuum
Absorbing unit 112 and the gas in communicating pipe 113 make vacuum suction unit 112 adsorb the lower surface of fingerprint sensing unit 20
201, thereby to fix fingerprint sensing unit 20；Finally, protective layer 301 is cut with laser cutting module 14, makes protective layer 301
Area is equal to the area (step S106) of upper surface 202, and in step S106, the cutting of layer 301 finishing to be protected is completed, and protection is made
The area of layer 301 is equal to after the area of the upper surface 202 of fingerprint sensing unit 20, i.e., air pump 12 out of service makes vacuum suction
Unit 112 loses the effect of vacuum suction, so can take out fingerprint sensing unit 20 from groove 111；Also it can control gas
The action that pump 12 is supplied, makes gas be circulated to vacuum suction unit 112 by communicating pipe 113, passes through vacuum suction unit 112
It sprays gas to remove fingerprint sensing unit 20 from groove 111, or makes it that can be easier to take out.
Compared to the prior art, present invention offer is a kind of carrying out coining processing and cutting finishing protection to fingerprint sensing unit
The impression system of layer significantly reduces the protective layer of fingerprint sensing unit because material is coated with by secondary cutting and finishing
It is uneven caused by flash or surface irregularity the case where.On the other hand, the jig provided through the invention, can be to list
One or more fingerprint sensing units carry out different coatings and are handled with coining, so can be according to its mounting electronic device kind
The difference of class, being formed has different types of, single-layer or multi-layer protective layer fingerprint identification module；A therefore the present invention actually pole
Has the invention of industrial value.
The present invention appointed as those skilled in the art apply craftsman think and be it is all as modify, so neither de- claim is intended to protect
Person.
Claims (12)
1. a kind of fingerprint sensing unit impression system, to imprint the fingerprint sensing list with a upper surface and a lower surface
Member, the system include：
One first jig, with a first surface, relative to the first surface a second surface and at least a shrinkage pool is formed in
The second surface, an at least shrinkage pool is to the accommodating fingerprint sensing unit；
One coining module, to form a pressure in the upper surface of the second surface of first jig and the fingerprint sensing unit
Print layer；
One laser cutting module, to cut the embossed layer in the upper surface of the fingerprint sensing unit formed a protective layer,
And the area of the protective layer is more than the area of the upper surface；
One air pump；And
One second jig has a groove to house the fingerprint sensing unit, which includes a vacuum suction unit, and should
Vacuum suction unit connects the air pump；
Wherein, when the fingerprint sensing unit is replaced from an at least shrinkage pool for first jig to the groove of second jig
When, start the air pump to drive the vacuum suction unit to adsorb and fix the fingerprint sensing unit, then with the laser cutting mould
Block cuts the protective layer, and the area of the protective layer is made to be equal to the area of the upper surface.
2. fingerprint sensing unit impression system as described in claim 1, wherein an at least shrinkage pool through the first surface and
The second surface.
3. fingerprint sensing unit impression system as claimed in claim 2, wherein the first jig further comprises an adhesive-layer, it should
Adhesive-layer is located at the first surface, and the adhesive-layer is adhering to the lower surface of the fingerprint sensing unit.
4. fingerprint sensing unit impression system as described in claim 1, the wherein embossed layer include：Light-curable ink layer, heat
Solidified oil layer of ink, mixed type ink layer, ultraviolet light photopolymerization resin layer or anti-fingerprint film plating layer.
5. fingerprint sensing unit impression system as described in claim 1, wherein the coining module include：One coater unit and one
Imprinter unit.
6. fingerprint sensing unit impression system as claimed in claim 5, the wherein coater unit are：Painting cloth-knife or coating wheel.
7. fingerprint sensing unit impression system as claimed in claim 5, the wherein imprinter unit are：Platen or coining wheel.
8. a kind of fingerprint sensing unit method for stamping, includes the following steps：
Step (a) provides a fingerprint sensing unit, which has a upper surface and a lower surface；
Step (b) provides one first jig, which has a first surface, relative to the one second of the first surface
Surface and at least a shrinkage pool is formed in the second surface；
The fingerprint sensing unit is placed in an at least shrinkage pool by step (c), and in the upper surface of the fingerprint sensing unit and is somebody's turn to do
The second surface of first jig forms an embossed layer；
Step (d) cuts the embossed layer, to form a protective layer of the area more than the area of the upper surface；
Step (e) provides one second jig, which has a groove, and the groove includes a vacuum suction unit；
The fingerprint sensing replacement unit is fixed the fingerprint sensing by step (f) to the groove, and with vacuum suction unit absorption
Unit；And
Step (g) cuts the protective layer, and the area of the protective layer is made to be equal to the area of the upper surface.
9. fingerprint sensing unit method for stamping as claimed in claim 8 is coated with wherein in step (c) and imprints an ink
Material is to form the embossed layer.
10. fingerprint sensing unit method for stamping as claimed in claim 9, the wherein ink material are：Light curable type ink, heat
Curable ink or doped with light curable type ink and the mixed type ink of thermohardening type printing ink.
11. fingerprint sensing unit method for stamping as claimed in claim 8, wherein in step (c), it is coated with and to imprint one ultraviolet
Light-hardening resin material is to form the embossed layer.
12. fingerprint sensing unit method for stamping as claimed in claim 8, wherein in step (c), it is coated with and imprints primary antibody and refer to
Line plated film is to form the embossed layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710265253.5A CN108734068B (en) | 2017-04-21 | 2017-04-21 | Fingerprint sensing unit imprinting system and method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710265253.5A CN108734068B (en) | 2017-04-21 | 2017-04-21 | Fingerprint sensing unit imprinting system and method thereof |
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| Publication Number | Publication Date |
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| CN108734068A true CN108734068A (en) | 2018-11-02 |
| CN108734068B CN108734068B (en) | 2022-10-04 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1502166A (en) * | 2001-04-17 | 2004-06-02 | 3M | Flexible capacitive touch sensor |
| US7276394B2 (en) * | 2001-09-20 | 2007-10-02 | Eastman Kodak Company | Large area flat image sensor assembly |
| TW201511965A (en) * | 2013-09-27 | 2015-04-01 | Innolux Corp | Structure with diamond-like carbon, fingerprint identification device and manufacturing method thereof |
| US20150187707A1 (en) * | 2012-10-14 | 2015-07-02 | Synaptics Incorporated | Biometric Image Sensor Packaging and Mounting |
| CN105279503A (en) * | 2015-11-20 | 2016-01-27 | 浙江水晶光电科技股份有限公司 | Fingerprint identification cover plate and preparation method thereof, and fingerprint identification module |
| CN106384105A (en) * | 2016-10-29 | 2017-02-08 | 南昌欧菲生物识别技术有限公司 | Manufacturing method of fingerprint recognition module |
-
2017
- 2017-04-21 CN CN201710265253.5A patent/CN108734068B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1502166A (en) * | 2001-04-17 | 2004-06-02 | 3M | Flexible capacitive touch sensor |
| US7276394B2 (en) * | 2001-09-20 | 2007-10-02 | Eastman Kodak Company | Large area flat image sensor assembly |
| US20150187707A1 (en) * | 2012-10-14 | 2015-07-02 | Synaptics Incorporated | Biometric Image Sensor Packaging and Mounting |
| TW201511965A (en) * | 2013-09-27 | 2015-04-01 | Innolux Corp | Structure with diamond-like carbon, fingerprint identification device and manufacturing method thereof |
| CN105279503A (en) * | 2015-11-20 | 2016-01-27 | 浙江水晶光电科技股份有限公司 | Fingerprint identification cover plate and preparation method thereof, and fingerprint identification module |
| CN106384105A (en) * | 2016-10-29 | 2017-02-08 | 南昌欧菲生物识别技术有限公司 | Manufacturing method of fingerprint recognition module |
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| Publication number | Publication date |
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| CN108734068B (en) | 2022-10-04 |
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