CN105142352A - Making method of circuit board - Google Patents
Making method of circuit board Download PDFInfo
- Publication number
- CN105142352A CN105142352A CN201510618851.7A CN201510618851A CN105142352A CN 105142352 A CN105142352 A CN 105142352A CN 201510618851 A CN201510618851 A CN 201510618851A CN 105142352 A CN105142352 A CN 105142352A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- copper foil
- conducting wire
- manufacture method
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0522—Using an adhesive pattern
Abstract
The invention discloses a making method ofa circuit board. The making method comprises steps of forming a conductive circuit on a copper foil in a physical way and transferring the conductive circuit to one side, on which insulation adhesive materials are arranged, of the base plate; and laminating the copper foil of the conductive circuit on the base plate on which the insulation materials are arranged, thereby forming a circuit board. In this way, the process for making the circuit board is simplified; cost is reduced; and thicker copper foils can be processed with the method.
Description
Technical field
The present invention relates to circuit board technology field, particularly relate to a kind of manufacture method of circuit board.
Background technology
In the circuit-board processes extensively adopted at present, have employed chemicals in a large number and carry out surface treatment, Copper Foil being pressed together on substrate, needing the copper foil surface being retained as conducting wire to plate one deck slicker solder resist layer, then chemically remaining Copper Foil being eroded; Or have in pressing on the substrate of Copper Foil and cover dry film or wet film, then form the conducting wire being coated with copper through operations such as overexposure, development, etchings.But, this chemically treated mode complex process, produce and rise this height, and pollution to a certain degree is all also existed to the environment of periphery.Meanwhile, the existing method adopting the mode of etching to form conducting wire, the definite limitation that the thickness for Copper Foil has, when Copper Foil is thicker, the effect of etching is unsatisfactory.
Summary of the invention
The invention provides a kind of manufacture method of circuit board, its main purpose is the flow process simplifying process for manufacturing circuit board, reduces costs, and enables the method use thicker Copper Foil to process.
For achieving the above object, the invention provides a kind of manufacture method of circuit board, the manufacture method of this circuit board comprises:
On Copper Foil, form conducting wire by physics mode, and described conducting wire is transferred to the one side that substrate arranged has insulating adhesive material;
The described Copper Foil forming described conducting wire is pressed together on the described substrate being furnished with described insulating material and forms circuit board.
Preferably, describedly on Copper Foil, form conducting wire by physics mode, and the step described conducting wire transfer base substrate being furnished with the one side of insulating adhesive material comprises:
Described Copper Foil cuts out the profile of conducting wire, wherein, the conductive trace portion in described Copper Foil and the state being in part between non-conductive circuit pack and being connected;
Described Copper Foil is transferred to the one side that described substrate arranged has insulating adhesive material, and removes the non-conductive circuit pack in described Copper Foil.
Preferably, describedly on Copper Foil, form conducting wire by physics mode, and the step described conducting wire transfer base substrate being furnished with the one side of insulating adhesive material comprises:
By coordinating of stamping plush copper and stamping loading plate, described conducting wire is obtained to described Copper Foil punch forming, wherein, described substrate corresponds to described stamping loading plate and places, and the conductive trace portion of described Copper Foil is directly bonded on the described insulating adhesive material of described substrate surface.
Preferably, described the described Copper Foil being pre-formed described conducting wire is pressed together on be furnished with described insulating material described substrate on form the step of circuit board after, the manufacture method of described circuit board also comprises:
The surface of described circuit board does not distribute described conducting wire part formed solder mask.
Preferably, the step of the part formation solder mask of the described described conducting wire that do not distribute on the surface of described circuit board comprises:
Solder mask is covered with by the non-conductive circuit pack of mode on the surface of described circuit board of silk screen printing;
By described circuit board to explosure or baking, to solidify described solder mask.
Preferably, the step of the part formation solder mask of the described described conducting wire that do not distribute on the surface of described circuit board comprises:
Non-conductive circuit pack on the surface of described circuit board covers dry film solder resist material, to form solder mask.
Preferably, pressing-in temp is 160-180 DEG C, and pressing time is 20-30s.
The manufacture method of the circuit board that the present invention proposes, in advance Copper Foil is made conducting wire, then pressing is carried out in conducting wire and the substrate being furnished with insulating adhesive material in advance, in the circuit board making process that the present invention proposes, adopt physics mode to carry out operation all the time, avoid the use of chemicals, relative to prior art, process is simple, reduces cost, and the pollution significantly reduced environment, and the present invention is not high to the thickness requirement of Copper Foil, thicker Copper Foil can be used to process.
Accompanying drawing explanation
Fig. 1 is the flow chart of manufacture method first embodiment of circuit board of the present invention;
Fig. 2 is the refinement flow chart of step S20 in manufacture method first embodiment of circuit board of the present invention;
Fig. 3 is the structural representation of circuit board in manufacture method first embodiment of circuit board of the present invention;
Fig. 4 is the flow chart of manufacture method second embodiment of circuit board of the present invention;
Fig. 5 is the refinement flow chart of step S40 in manufacture method second embodiment of circuit board of the present invention.
The realization of the object of the invention, functional characteristics and advantage will in conjunction with the embodiments, are described further with reference to accompanying drawing.
Embodiment
Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
The invention provides a kind of manufacture method of circuit board.
With reference to shown in Fig. 1, it is the flow chart of manufacture method first embodiment of circuit board of the present invention.
In a first embodiment, the manufacture method of this circuit board comprises:
Step S10, forms conducting wire by physics mode on Copper Foil, and described conducting wire is transferred to the one side that substrate arranged has insulating adhesive material;
The circuit of the size of the substrate in the present embodiment making sheet all is as required determined, according to the complexity of circuit and need the quantity of the element installed to determine the size of substrate, the thickness of ordinary circumstance infrabasal plate is 0.5-6.5 millimeter; And insulating adhesive material is used for the Copper Foil in substrate and subsequent process to bond, this insulating adhesive material can be the heat reactive resin of uniform application on substrate on the surface arranging conducting wire, also can other have insulation bonding effect material, the adhesive tape etc. that such as polyimide film is made.
It should be noted that, the method for the present embodiment, to the not requirement of the shape of substrate, can be stereochemical structure or polymorphic structure, such as ball-type substrate.And the method for the present embodiment, to the material of substrate also not requirement, can be the conventional substrate of glass fabric and mixed with resin, also can be insulating material or the non-insulating material with other characteristics.Such as, when bonding the material used and inherently having the insulation characterisitic of suitable intensity, base material is not limited to insulating material, such as, adopt hot curing silica gel as jointing material.Therefore, the manufacture method of the circuit board that the present embodiment proposes is relative to prior art, and the substrate shape of employing and material are all very flexible, can make very thin circuit board or baroque circuit board, can be applied to multiple occasion.
The method be transferred to conducting wire on the surface of the insulating adhesive material be arranged in advance on substrate can have numerous embodiments, below enumerates two kinds of modes wherein.In one embodiment, can by the mode of cutting; Such as hand cut, also can use the equipment such as carving machine, laser cutting machine or electron ion cutting machine to cut, and then overlays on substrate by the Copper Foil after cutting; With reference to shown in Fig. 2, specifically comprise the following steps:
Step S11, described Copper Foil cuts out the profile of conducting wire, wherein, and the conductive trace portion in described Copper Foil and the state being in part between non-conductive circuit pack and being connected;
Step S12, is transferred to described Copper Foil the one side that described substrate arranged has insulating adhesive material, and removes the non-conductive circuit pack in described Copper Foil.
Use carving machine or laser cutting machine to cut out contour of track on the Copper Foil of default size, the circuit of cutting is corresponding with needing the circuit of making sheet.Uniform dynamics to be ensured during cutting, the conductive trace portion of needs and useless outline portion is made to be in the state of half-connection, ensureing under the prerequisite that Copper Foil is smooth after well cutting, transfer to surface substrate being furnished with insulating adhesive material, unwanted Copper Foil part torn by use instrument, leave conductive trace portion, for pressing is prepared.Wherein, the length and width size of Copper Foil is preferably equal with the length and width size of substrate.
In another embodiment, shaping to Copper Foil can be realized by stamping technique, in the course of processing of this kind of molding mode, Copper Foil preforming can be carried out with Copper Foil transfer simultaneously, namely substrate can be placed on immediately below diel, stamping forming conducting wire Copper Foil is directly dropped on substrate, fits with insulating adhesive material, for follow-up bonding processes is prepared, specifically comprise the following steps:
By coordinating of stamping plush copper and stamping loading plate, described conducting wire is obtained to described Copper Foil punch forming, wherein, described substrate corresponds to described stamping loading plate and places, and the conductive trace portion of described Copper Foil is directly bonded on the described insulating adhesive material of described substrate surface.
Stamping plush copper is made to become the relation of to conducting wire to be formed, stroke is generally arranged on 3-4 millimeter, stamping loading plate is provided with the openwork part coordinated with circuit to be formed, wherein, openwork part and stamping plush copper precision-fit, complete the shearing of Copper Foil, the thickness of stamping loading plate is generally 2-3 millimeter.
In other examples, except above-mentioned two kinds of modes, conducting wire Copper Foil can also be made by other molding mode, will not enumerate at this.
Step S20, is pressed together on the described Copper Foil being pre-formed described conducting wire on the described substrate being furnished with described insulating material and forms circuit board.
The stitching surface Copper Foil shifted and substrate being placed on Heat sealer carries out pressing, in other examples, also can carry out pressing by other press equipment.With reference to shown in Fig. 3, be the structural representation of the circuit board in the present embodiment, conductive trace portion 20 pressing of Copper Foil forms circuit board 100 on the substrate 10.When using Heat sealer to carry out stitching operation, preferably, pressing-in temp is 160-180 DEG C, pressing time can last till 20 seconds to 30 seconds, concrete temperature can when sample test, and the thickness according to the baseplate material selected, insulating adhesive material and circuit board finished product adjusts, once test sample, the pressing parameter of sample no longer does excessive adjustment in batch production, in order to avoid affect the quality of finished product.
Further, when stitching operation, in order to protective circuit plate, on substrate, conducting wire Copper Foil, cover one deck to prevent adhesion cover layer, moved on the stitching surface of Heat sealer.
The manufacture method of the circuit board that the present embodiment proposes, in advance Copper Foil is made conducting wire, again pressing is carried out in conducting wire and the substrate being furnished with insulating adhesive material in advance, all the time physics mode is adopted to carry out operation in the circuit board making process that the present invention proposes, avoid the use of chemicals, relative to prior art, process is simple, reduce cost, and the pollution significantly reduced environment, and the present invention is not high to the thickness requirement of Copper Foil, thicker Copper Foil can be used to process.
In addition, the Copper Foil that the present embodiment physics preform adopts in addition can be very thick, the consumption problem of etching mode to etching solution need not be considered, also need not consider to etch impact on line width, the circuit board made can conducting big current, and when Copper Foil is thicker, thermal resistance is lower, thermal conductivity is much better than the circuit board that etching mode is made, and is applicable to LED, the application scenarios such as power supply.
With reference to shown in Fig. 4, the first embodiment based on the manufacture method of invention circuit board proposes the second embodiment of the manufacture method of circuit board of the present invention.In the present embodiment, the difference of described method and the first embodiment is, after step S20, the manufacture method of this circuit board also comprises:
Step S30, the non-conductive circuit pack on the surface of described circuit board forms solder mask.
On the circuit board formed, form solder mask in the present embodiment, to form the coating of a protection, damage with Pollution protection, operation and be convenient to assembling use subsequently.
Specifically can there is numerous embodiments, below enumerate two kinds of modes wherein.In one embodiment, with reference to shown in Fig. 5, step S30 specifically comprises the following steps:
Step S31, is covered with solder mask by the non-conductive circuit pack of mode on the surface of described circuit board of silk screen printing;
Step S32, by described circuit board to explosure or baking, to solidify described solder mask.
In another embodiment, dry film solder resist material can be covered, to form solder mask by the non-conductive circuit pack on the surface of described circuit board.In other examples, except above-mentioned two kinds of modes, can also by other means and material formed solder mask, such as by insulation film punching in advance formed pad room, then with the substrate forming copper foil circuit together the mode such as pressing form solder mask, will not enumerate at this.Preferably pad room is formed to insulation film punching in advance in the present embodiment, then with the substrate forming copper foil circuit together the mode such as pressing form solder mask, this mode, relative to other chemical modes, avoids environment.
Further, after step S20, the manufacture method of this circuit board also comprises:
Non-conductive circuit pack on the surface of described circuit board is formed and helps layer.
Can be formed and help layer by carrying out the modes such as spray tin, gold-plated, turmeric, rosin coating on circuit boards, the mode be preferably coated with rosin in the present embodiment is formed and helps layer, and this mode cost is lower, and avoids environment.
Further, before insulating adhesive material is arranged in substrate surface, can be good to make insulating adhesive material being fitted on substrate, substrate is cleaned, compressed air is such as used to blow clean substrate surface, also the special cleaning fluid of circuit board can be used to clean, or use soft brush to clean.
The manufacture method of the circuit board that the present embodiment proposes, the circuit board formed forms solder mask, as protective layer, damages and be convenient to assembling use subsequently with Pollution protection, operation.
These are only the preferred embodiments of the present invention; not thereby the scope of the claims of the present invention is limited; every utilize specification of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (7)
1. a manufacture method for circuit board, is characterized in that, the manufacture method of described circuit board comprises:
On Copper Foil, form conducting wire by physics mode, and described conducting wire is transferred to the one side that substrate arranged has insulating adhesive material;
The described Copper Foil forming described conducting wire is pressed together on the described substrate being furnished with described insulating material and forms circuit board.
2. the manufacture method of circuit board according to claim 1, is characterized in that, describedly on Copper Foil, forms conducting wire by physics mode, and the step described conducting wire transfer base substrate being furnished with the one side of insulating adhesive material comprises:
Described Copper Foil cuts out the profile of conducting wire, wherein, the conductive trace portion in described Copper Foil and the state being in part between non-conductive circuit pack and being connected;
Described Copper Foil is transferred to the one side that described substrate arranged has insulating adhesive material, and removes the non-conductive circuit pack in described Copper Foil.
3. the manufacture method of circuit board according to claim 1, is characterized in that, describedly on Copper Foil, forms conducting wire by physics mode, and the step described conducting wire transfer base substrate being furnished with the one side of insulating adhesive material comprises:
By coordinating of stamping plush copper and stamping loading plate, described conducting wire is obtained to described Copper Foil punch forming, wherein, described substrate corresponds to described stamping loading plate and places, and the conductive trace portion of described Copper Foil is directly bonded on the described insulating adhesive material of described substrate surface.
4. the manufacture method of circuit board according to claim 1, it is characterized in that, described the described Copper Foil being pre-formed described conducting wire is pressed together on be furnished with described insulating material described substrate on form the step of circuit board after, the manufacture method of described circuit board also comprises:
Non-conductive circuit pack on the surface of described circuit board forms solder mask.
5. the manufacture method of circuit board according to claim 4, is characterized in that, the step that described non-conductive circuit pack on the surface of described circuit board forms solder mask comprises:
Solder mask is covered with by the non-conductive circuit pack of mode on the surface of described circuit board of silk screen printing;
By described circuit board to explosure or baking, to solidify described solder mask.
6. the manufacture method of circuit board according to claim 4, is characterized in that, the step that described non-conductive circuit pack on the surface of described circuit board forms solder mask comprises:
Non-conductive circuit pack on the surface of described circuit board covers dry film solder resist material, to form solder mask.
7. the manufacture method of circuit board according to claim 1, is characterized in that, pressing-in temp is 160-180 DEG C, and pressing time is 20-30s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510618851.7A CN105142352A (en) | 2015-09-24 | 2015-09-24 | Making method of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510618851.7A CN105142352A (en) | 2015-09-24 | 2015-09-24 | Making method of circuit board |
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| CN105142352A true CN105142352A (en) | 2015-12-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510618851.7A Pending CN105142352A (en) | 2015-09-24 | 2015-09-24 | Making method of circuit board |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107484347A (en) * | 2017-08-30 | 2017-12-15 | 苏州达方电子有限公司 | In the method that circuit is formed on the bottom plate of button |
| TWI619852B (en) * | 2017-02-24 | 2018-04-01 | 南亞塑膠工業股份有限公司 | Manufacturing methods of electrolytic copper foil having football-shaped copper particles and circuit board assembly |
| TWI619851B (en) * | 2017-02-24 | 2018-04-01 | 南亞塑膠工業股份有限公司 | Manufacturing methods of electrolytic copper foil having needle-shaped copper particles and circuit board assembly |
| CN108235574A (en) * | 2016-12-15 | 2018-06-29 | 吴勇杰 | Circuit board and preparation method thereof |
| CN108323025A (en) * | 2018-02-01 | 2018-07-24 | 北京启创驿讯科技有限公司 | A kind of preparation method and processing copper foil of printed circuit board |
| CN109379846A (en) * | 2018-10-09 | 2019-02-22 | 信丰迅捷兴电路科技有限公司 | A kind of novel flexible circuit board double hollow out circuit manufacturing method |
| CN109769350A (en) * | 2019-03-14 | 2019-05-17 | 西安科技大学 | A kind of preparation method of one-sided circuit board and heat conductive insulating glue film |
| CN109788667A (en) * | 2018-12-27 | 2019-05-21 | 南京浦江电子有限公司 | A kind of composite material cylinder manifold and its manufacturing process |
| CN110536560A (en) * | 2018-10-19 | 2019-12-03 | 汪炜杰 | The production method and its transformer of transformer lines plate |
| CN112533389A (en) * | 2020-12-01 | 2021-03-19 | 广东工业大学 | Method for processing printed circuit board by combining die imprinting and curing process |
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| CN101083876A (en) * | 2006-06-02 | 2007-12-05 | 刘扬名 | Nano spraying circuit board producing method and equipment and material configuration |
| CN104701443A (en) * | 2013-12-05 | 2015-06-10 | 董挺波 | LED substrate applicable to simple line COB package and method for preparing same |
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| CN101083876A (en) * | 2006-06-02 | 2007-12-05 | 刘扬名 | Nano spraying circuit board producing method and equipment and material configuration |
| CN104701443A (en) * | 2013-12-05 | 2015-06-10 | 董挺波 | LED substrate applicable to simple line COB package and method for preparing same |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108235574A (en) * | 2016-12-15 | 2018-06-29 | 吴勇杰 | Circuit board and preparation method thereof |
| TWI619852B (en) * | 2017-02-24 | 2018-04-01 | 南亞塑膠工業股份有限公司 | Manufacturing methods of electrolytic copper foil having football-shaped copper particles and circuit board assembly |
| TWI619851B (en) * | 2017-02-24 | 2018-04-01 | 南亞塑膠工業股份有限公司 | Manufacturing methods of electrolytic copper foil having needle-shaped copper particles and circuit board assembly |
| CN107484347A (en) * | 2017-08-30 | 2017-12-15 | 苏州达方电子有限公司 | In the method that circuit is formed on the bottom plate of button |
| CN108323025B (en) * | 2018-02-01 | 2020-01-14 | 北京启创驿讯科技有限公司 | Preparation method of printed circuit board and copper foil for processing |
| CN108323025A (en) * | 2018-02-01 | 2018-07-24 | 北京启创驿讯科技有限公司 | A kind of preparation method and processing copper foil of printed circuit board |
| CN109379846A (en) * | 2018-10-09 | 2019-02-22 | 信丰迅捷兴电路科技有限公司 | A kind of novel flexible circuit board double hollow out circuit manufacturing method |
| CN110536560A (en) * | 2018-10-19 | 2019-12-03 | 汪炜杰 | The production method and its transformer of transformer lines plate |
| CN109788667A (en) * | 2018-12-27 | 2019-05-21 | 南京浦江电子有限公司 | A kind of composite material cylinder manifold and its manufacturing process |
| CN109788667B (en) * | 2018-12-27 | 2022-03-25 | 南京浦江电子有限公司 | Composite material bus board and manufacturing process thereof |
| CN109769350A (en) * | 2019-03-14 | 2019-05-17 | 西安科技大学 | A kind of preparation method of one-sided circuit board and heat conductive insulating glue film |
| CN112533389A (en) * | 2020-12-01 | 2021-03-19 | 广东工业大学 | Method for processing printed circuit board by combining die imprinting and curing process |
| CN112533389B (en) * | 2020-12-01 | 2021-08-10 | 广东工业大学 | Method for processing printed circuit board by combining die imprinting and curing process |
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Application publication date: 20151209 |