CN104701443A - LED substrate applicable to simple line COB package and method for preparing same - Google Patents
LED substrate applicable to simple line COB package and method for preparing same Download PDFInfo
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- CN104701443A CN104701443A CN201310643535.6A CN201310643535A CN104701443A CN 104701443 A CN104701443 A CN 104701443A CN 201310643535 A CN201310643535 A CN 201310643535A CN 104701443 A CN104701443 A CN 104701443A
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- copper foil
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- insulating barrier
- insulating layer
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Abstract
An LED substrate applicable to simple line COB package and a method for preparing the same are provided. The LED substrate comprises a substrate, an insulating layer, and a line layer. The line layer is copper foil, and the copper foil is made into a circuit structure by stamping and fixed to the insulating layer. A silver-plated layer is arranged on the copper foil and the insulating layer. The insulating layer and the substrate are fixed together. The insulating layer is provided with holes in positions corresponding to die bonding regions of the substrate. The method for preparing the LED substrate comprises the following steps: (1) stamping the copper foil into a required circuit structure; (2) bonding the copper foil and the insulating layer with epoxy resin; (3) plating the copper foil and the insulating layer after bonding with silver; (4) punching the die bonding regions and silver-plated connecting lines of the material after silver plating, and removing redundant electroplated lines; (5) bonding the punched combination of the copper foil and the insulating layer with the substrate metal; (6) coating the surface of the circuit and the epoxy resin with needed ink and text; and (7) cutting the material going through the above steps to form the LED substrate. The LED substrate of the invention retains the original features of an aluminum substrate, and the cost of production is greatly reduced.
Description
Technical field
The present invention relates to the wiring board of a kind of LED, be specially a kind of LED-baseplate and the preparation method that are applicable to simple circuit COB packing forms.
Background technology
Aluminium base main functional modules is by substrate, and insulating barrier, line layer formed, and the material that substrate adopts is aluminium.Aluminium base is responsible for heat radiation, and line layer is responsible for conducting circuit and bonding wire, and insulating barrier is responsible for isolation circuit and heat dissipating layer.
Traditional COB aluminium base manufacture craft is normally first by aluminium sheet, insulating barrier, Copper Foil pressing is made into covers copper aluminium base, adopt multiple method printed circuit on Copper Foil afterwards, main employing light is painted etching and is made circuit, demand due to gold thread bonding needs at copper foil surface plating welding coating (silver-plated), therefore cannot an etch-forming, also will again be etched away by the excess line being used for plating channel.Because etching work procedure is complicated, material cost is higher, although this technical maturity, precision is high, can at the various complicated circuit of its surface rendering, but the circuit due to COB is drawn often very simple, and be applicable to the preparation method of this kind of simple circuit COB substrate as specialized designs is a kind of, the COB substrate produced by this improving technique significantly can reduce production cost.
Summary of the invention
The object of the present invention is to provide a kind of LED-baseplate being applicable to simple circuit COB packing forms, this LED-baseplate had both remained the original feature of aluminium base, significantly reduced again it and was produced into.
To achieve these goals, technical problem solved by the invention realizes by the following technical solutions:
Be applicable to a LED-baseplate for simple circuit COB packing forms, comprise substrate, insulating barrier, line layer; Described line layer is Copper Foil, and it is fixing on the insulating layer that Copper Foil strikes out circuit structure, and Copper Foil and insulating barrier are provided with one deck silver coating; Described insulating barrier is fixed on substrate, and the corresponding section, crystal bonding area on insulating barrier and substrate is provided with hole.
Described substrate is the metal material of thickness at 0.5-3mm.
The thickness of described Copper Foil is 0.01-0.2mm.
Be applicable to a preparation method for the LED-baseplate of simple circuit COB packing forms, comprise the following steps:
(1) process circuit layer: Copper Foil is struck out required circuit structure;
(2) adhesive dielectric layers: by Copper Foil and insulating barrier epoxy resin bonding;
(3) plating welding coating: by bonding after Copper Foil and insulating barrier silver-plated;
(4) punching: by the material after silver-plated to die bond region and silver-plated connection line punching, remove unnecessary electroplating line, die bond regional location and substrate metal are stopped without any insulating material;
(5) adhesive base plate: the Copper Foil after punching and insulating barrier combination and substrate metal are bonded;
(6) brushing ink: the ink needed in circuit and epoxy resin surface brushing and word;
(7) profile is cut: the material excision forming of above operation will be completed.
Beneficial effect
The present invention had both remained the original feature of aluminium base, significantly reduced its production cost again; Adopt the mode of punching press to provide the circuit structure of wiring board, can provide the COB substrate production needs of most of line construction, compare with traditional LED-baseplate and eliminate a large amount of etch process, cost is lower, thermal diffusivity better effects if simultaneously.
Accompanying drawing explanation
Form schematic diagram after Fig. 1 Copper Foil 1 punching press;
Fig. 2 Copper Foil 1 schematic diagram bonding with glass fabric;
Fig. 3 punching schematic diagram;
Fig. 4 profile cutting schematic diagram;
Form schematic diagram after Fig. 5 Copper Foil 2 punching press;
Fig. 6 Copper Foil 2 and PET film bond schematic diagram.
In figure, 001: punching target
002: cutting target
101: Copper Foil 1
102: Copper Foil 2
201: the glass fabric scribbling epoxy resin
202:PET plastic film
203: bright aluminium sheet
301: high temperature gummed tape
302: ink
401: jig
402: punching die
403: jig
Embodiment
Below in conjunction with the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Embodiment 1
Get thickness 0.2mm, width is 50mm Copper Foil, carries out punching press, and after punching press, shape is for shown in Fig. 1; Glass fabric is cut into wide 200mm, and long 300mm, tightens with tensioner, and its one side high temperature gummed tape touch, then is cut into length 150mm, and width is the Xiao Zhang of 50mm; Xiao Zhang's glass fibre is arranged in corresponding mould, post high temperature gummed tape one faces down, at another side brushwork epoxy resin, to the glass fabric of epoxy resin be scribbled together with the process of mould froth in vacuum, again the Copper Foil after oil removing dehumidification treatments is placed in this mould, by anchor point alignment laminating, as shown in Figure 2; Mould after laminating is sent into baking box together with material, and design temperature is the baking of 70-80 degree, until solidification, mould scribbles release agent, is separated by material after cured with mould; Taken out by material after having toasted, tear high temperature gummed tape off, it is silver-plated to send Electroplate Factory; By the material after silver-plated to die bond region and silver-plated connection line punching, by anchor point or overall dimension alignment, as shown in Figure 3; Having Copper Foil one to face down the material after punching is placed on corresponding mould, and perforate steel mesh covers according to positioner, and brushwork epoxy resin is on the material of steel mesh perforate relevant position; Be that the aluminium sheet of 0.8mm-2mm cuts into the fritter that length is 150mm, width 50mm by the thickness of light, be positioned on corresponding mould, with the adheres scribbling epoxy resin, put into baking box, design temperature is the baking of 70-80 degree, until solidification; Copper Foil one will be had to face up to be placed on corresponding mould, and perforate steel mesh covers according to positioner, brushing heat curing-type or photosensitive type ink; The material being stained with aluminium sheet is carried out the cutting punching press of profile and screw hole, as shown in Figure 4.
Embodiment 2
Get thickness 0.1mm, width is 50mm Copper Foil, carries out punching press, and after punching press, shape is for shown in Fig. 5; Copper Foil after punching press is sent Electroplate Factory silver-plated, silver-plated form is one side parcel plating; Be 70mm by width, thickness be the PET film of 0.1mm through the process of special plastic inorganic agent, make it can adhesion firm in epoxy resin; Silver-plated Copper Foil is placed on corresponding mould, at not silver-plated even application one deck epoxy resin, fitted by corresponding mould and PET film bond, while laminating, the profile of PET film and die bond position can be cut by this mould, as shown in Figure 6; Material after laminating is carefully peeled off mould, and due to the viscosity of epoxy resin, Copper Foil can be attached to PET film surface, put into corresponding container and send into baking box, design temperature is the baking of 70-80 degree, and applies weight to material, until solidification, container scribbles release agent, after cured material is separated; Material is placed in corresponding mould, Copper Foil one faces down, at another side even application one deck epoxy resin, be that the aluminium sheet of 0.8mm-2mm cuts into the fritter that length is 150mm, width 50mm by the thickness of light, be positioned in mould, with the adheres scribbling epoxy resin, put into baking box, design temperature is the baking of 70-80 degree, until solidification; Copper Foil one will be had to face up to be placed on corresponding mould, and perforate steel mesh covers according to positioner, brushing heat curing-type or photosensitive type ink; The material being stained with aluminium sheet is carried out the punching press of profile and screw hole.
To those skilled in the art, obviously the invention is not restricted to the details of above-mentioned one exemplary embodiment, and when not deviating from spirit of the present invention or essential characteristic, the present invention can be realized in other specific forms.Therefore, no matter from which point, all should embodiment be regarded as exemplary, and be nonrestrictive, scope of the present invention is limited by claims instead of above-mentioned explanation, and all changes be therefore intended in the implication of the equivalency by dropping on claim and scope are included in the present invention.
In addition, be to be understood that, although this specification is described according to execution mode, but not each execution mode only comprises an independently technical scheme, this narrating mode of specification is only for clarity sake, those skilled in the art should by specification integrally, and the technical scheme in each embodiment also through appropriately combined, can form other execution modes that it will be appreciated by those skilled in the art that.
Claims (4)
1. be applicable to a LED-baseplate for simple circuit COB packing forms, comprise substrate, insulating barrier, line layer; It is characterized in that, described line layer is Copper Foil, and it is fixing on the insulating layer that Copper Foil strikes out circuit structure, and Copper Foil and insulating barrier are provided with one deck silver coating; Described insulating barrier is fixed on substrate, and the corresponding section, crystal bonding area on insulating barrier and substrate is provided with hole.
2. a kind of LED-baseplate being applicable to simple circuit COB packing forms according to claim 1, it is characterized in that, described substrate is the metal material of thickness at 0.5-3mm.
3. a kind of LED-baseplate being applicable to simple circuit COB packing forms according to claim 1, it is characterized in that, the thickness of described Copper Foil is 0.01-0.2mm.
4. be applicable to a preparation method for the LED-baseplate of simple circuit COB packing forms, it is characterized in that, comprise the following steps:
(1) process circuit layer: Copper Foil is struck out required circuit structure;
(2) adhesive dielectric layers: by Copper Foil and insulating barrier epoxy resin bonding;
(3) plating welding coating: by bonding after Copper Foil and insulating barrier silver-plated;
(4) punching: by the material after silver-plated to die bond region and silver-plated connection line punching, remove unnecessary electroplating line;
(5) adhesive base plate: the Copper Foil after punching and insulating barrier combination and substrate metal are bonded;
(6) brushing ink: the ink needed in circuit and epoxy resin surface brushing and word;
(7) profile is cut: the material excision forming of above operation will be completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310643535.6A CN104701443A (en) | 2013-12-05 | 2013-12-05 | LED substrate applicable to simple line COB package and method for preparing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310643535.6A CN104701443A (en) | 2013-12-05 | 2013-12-05 | LED substrate applicable to simple line COB package and method for preparing same |
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| Publication Number | Publication Date |
|---|---|
| CN104701443A true CN104701443A (en) | 2015-06-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310643535.6A Pending CN104701443A (en) | 2013-12-05 | 2013-12-05 | LED substrate applicable to simple line COB package and method for preparing same |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101674A (en) * | 2015-07-20 | 2015-11-25 | 惠州绿草电子科技有限公司 | Manufacturing method of stacked circuit board and stacked circuit board |
| CN105142352A (en) * | 2015-09-24 | 2015-12-09 | 深圳市顺劲辉电子科技有限公司 | Making method of circuit board |
| CN105188280A (en) * | 2015-07-31 | 2015-12-23 | 惠州绿草电子科技有限公司 | Mechanical through hole forming method of printed circuit board and printed circuit board with mechanical through holes |
| GB2545285A (en) * | 2015-12-02 | 2017-06-14 | Ningbo Klite Electric Mft Co Ltd | Composite LED circuit board and manufacturing method |
| WO2018170958A1 (en) * | 2017-03-23 | 2018-09-27 | 深圳亚信昌科技有限公司 | Double-sided aluminum-based circuit board and fabrication method therefor |
| CN110536560A (en) * | 2018-10-19 | 2019-12-03 | 汪炜杰 | The production method and its transformer of transformer lines plate |
| CN111447743A (en) * | 2020-04-09 | 2020-07-24 | 江门市盈声电子科技有限公司 | Circuit board preparation process and circuit board prepared by using same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202188450U (en) * | 2011-08-09 | 2012-04-11 | 深圳市瑞丰光电子股份有限公司 | LED (light-emitting diode) module and lighting device |
| CN202721893U (en) * | 2012-06-26 | 2013-02-06 | 田茂福 | Aluminum-based circuit board and LED lamp bar |
| CN203013787U (en) * | 2012-12-27 | 2013-06-19 | 深圳市光核光电科技有限公司 | Graphite substrate packaged LED light source |
-
2013
- 2013-12-05 CN CN201310643535.6A patent/CN104701443A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202188450U (en) * | 2011-08-09 | 2012-04-11 | 深圳市瑞丰光电子股份有限公司 | LED (light-emitting diode) module and lighting device |
| CN202721893U (en) * | 2012-06-26 | 2013-02-06 | 田茂福 | Aluminum-based circuit board and LED lamp bar |
| CN203013787U (en) * | 2012-12-27 | 2013-06-19 | 深圳市光核光电科技有限公司 | Graphite substrate packaged LED light source |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101674A (en) * | 2015-07-20 | 2015-11-25 | 惠州绿草电子科技有限公司 | Manufacturing method of stacked circuit board and stacked circuit board |
| CN105188280A (en) * | 2015-07-31 | 2015-12-23 | 惠州绿草电子科技有限公司 | Mechanical through hole forming method of printed circuit board and printed circuit board with mechanical through holes |
| CN105142352A (en) * | 2015-09-24 | 2015-12-09 | 深圳市顺劲辉电子科技有限公司 | Making method of circuit board |
| GB2545285A (en) * | 2015-12-02 | 2017-06-14 | Ningbo Klite Electric Mft Co Ltd | Composite LED circuit board and manufacturing method |
| GB2545285B (en) * | 2015-12-02 | 2020-11-11 | Ningbo Klite Electric Mft Co Ltd | Composite LED Circuit Board and Manufacturing Method |
| WO2018170958A1 (en) * | 2017-03-23 | 2018-09-27 | 深圳亚信昌科技有限公司 | Double-sided aluminum-based circuit board and fabrication method therefor |
| CN110536560A (en) * | 2018-10-19 | 2019-12-03 | 汪炜杰 | The production method and its transformer of transformer lines plate |
| CN111447743A (en) * | 2020-04-09 | 2020-07-24 | 江门市盈声电子科技有限公司 | Circuit board preparation process and circuit board prepared by using same |
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Application publication date: 20150610 |