CN101534613B - Method for manufacturing circuit board with offset structure - Google Patents
Method for manufacturing circuit board with offset structure Download PDFInfo
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- CN101534613B CN101534613B CN200810300566.0A CN200810300566A CN101534613B CN 101534613 B CN101534613 B CN 101534613B CN 200810300566 A CN200810300566 A CN 200810300566A CN 101534613 B CN101534613 B CN 101534613B
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- 238000000034 method Methods 0.000 title claims abstract description 42
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 239000010410 layer Substances 0.000 claims abstract description 132
- 239000000758 substrate Substances 0.000 claims abstract description 121
- 239000012790 adhesive layer Substances 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims abstract description 21
- 239000002131 composite material Substances 0.000 claims abstract description 5
- 238000003825 pressing Methods 0.000 claims description 8
- -1 polytetrafluoroethylene Polymers 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 4
- 235000019157 thiamine Nutrition 0.000 claims description 4
- 150000003544 thiamines Chemical class 0.000 claims description 4
- DNXHEGUUPJUMQT-CBZIJGRNSA-N Estrone Chemical compound OC1=CC=C2[C@H]3CC[C@](C)(C(CC4)=O)[C@@H]4[C@@H]3CCC2=C1 DNXHEGUUPJUMQT-CBZIJGRNSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229920002799 BoPET Polymers 0.000 claims description 2
- 239000005041 Mylar™ Substances 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 abstract description 8
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 238000005530 etching Methods 0.000 description 7
- 238000003698 laser cutting Methods 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 235000019994 cava Nutrition 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention relates to a method for manufacturing a circuit board with an offset structure, which comprises the following steps that: a first substrate, an adhesive layer and a second substrate are provided, wherein the first substrate comprises a first base material layer, a first conductive layer and a second conductive layer, and the second substrate is a composite base material consisting of a second base material layer and a third conductive layer; a first conductive line is formed on the first conductive layer, and an attaching area is defined; incisions penetrating through two opposite surfaces of the adhesive layer is arranged in the adhesive layer, thereby allowing the adhesive layer to have a first cutting surface and a second cutting surface opposite to each other; a reinforced piece of which the size corresponds to that of the attaching area is provided; the first conductive line and the second base material layer are tightly attached to the two opposite surfaces of the adhesive layer, the attaching area is positioned between the first cutting surface and the second cutting surface, and the reinforced piece is accommodated in the incisions; a second conductive line is formed on the second conductive layer to obtain a circuit substrate; and the circuit substrate is cut off along the first cutting surface.
Description
Technical field
The present invention relates to the circuit board making technical field, relate in particular to a kind of manufacture method of circuit board.
Background technology
Along with electronic product miniaturization and high speed performanceization day by day, the element of circuit board surface welding is more and more, requires the conducting wire density of circuit board and working transmission also increasing.In order to adapt to this demand, circuit board develops into double sided board and multi-layer sheet from single sided board.Wherein, double-sided PCB and multilayer circuit board have more wiring area, higher packaging density and are widely used, referring to document: Takahashi, and A.; High density multilayer printed circuit board for HITAC M-880; IEEE Trans.on Components, Packaging, and Manufacturing Technology; 1992.
As a kind of novel multi-layer circuit board that occurs in recent years; Has the circuit board of break difference structure because it has the different numbers of plies in different zones; The area thickness that the number of plies is few is little, rigidity is little, and the zone that the number of plies is many has elevated track density, big thickness and big rigidity, and has excellent overall performance; The transmission that it both can realize bulk information has suitable rigid and flexibility again.
Referring to Fig. 1 a, be a kind of structural representation with multilayer circuit board 100 of break difference structure.This multilayer circuit board 100 is processed by a double-sided substrate 110 and a single face substrate 120, and wherein, the first conducting wire layer, 111 place of this double-sided substrate 110 are provided with the attach region 112 that is used for encapsulating electronic components.
At present, adopt the Layer increasing method method that promptly is layering to make circuit board usually with break difference structure.With multilayer circuit board 100 is example; Its existing manufacture method comprises: at first; Double-sided substrate 110, single face substrate 120 and bond layer 130 are provided; Please consult Fig. 1 a and Fig. 1 b in the lump, the first surface of this double-sided substrate 110 is a conducting wire layer 111, and this bond layer 130 is provided with the otch 131 corresponding with attach region 112 sizes; Secondly, see also Fig. 1 c, utilize adhesive phase 130 that the substrate layer 121 of single face substrate 120 is pressed to the first conducting wire layer, 111 surface of double-sided substrate 110, obtain circuit board substrate 140 thus; Once more,, lay dry film 150, adopt exposure, development, etching method to make second conducting wire 143 or the like step in the outer conductive layer surface 142 of circuit board substrate 140 referring to Fig. 1 d and Fig. 1 e.
Yet, when double-sided substrate 110 is flexible circuit board, owing to have flexibility and ductility preferably; They are with 120 pressings of single face substrate the time; The double-sided substrate of otch 131 corresponding positions will cause that the dry film structure that is attached at this place bends, when exposure, development and circuit etching towards single face substrate 120 depressions; Because the dry film 150 of otch 131 corresponding positions is to single face substrate 120 depressions; To cause and follow-uply differ, even broken string, greatly influence the circuit precision and the product percent of pass of circuit board through second conducting wire, 143 thicknesses that overexposure, development, etching conducting layer craft make.
Therefore, be necessary to provide a kind of manufacture method, to improve the making precision and the qualification rate of circuit board with circuit board of break difference structure.
Summary of the invention
A kind of manufacture method with circuit board of break difference structure; It comprises the steps: to provide first substrate, adhesive layer and second substrate; Said first substrate comprises first substrate layer, is formed at first conductive layer and second conductive layer on relative two surfaces of first substrate layer, and said second substrate comprises second substrate layer and is formed at the 3rd conductive layer on this second substrate layer surface; Form first conducting wire in first conductive layer, and define attach region in this surface, first conducting wire; In said adhesive layer the otch that connects its relative two surfaces is set, makes adhesive layer have first cut surface and second cut surface relative thus with first cut surface; The reinforced sheet corresponding with the attach region size is provided; First substrate, adhesive layer and second substrate are stacked and pressed together successively; And make said first conducting wire and second substrate layer be close to relative two surfaces of adhesive layer respectively; Said attach region is between first cut surface and second cut surface, and said reinforced sheet is contained in otch; Form second conducting wire in second conductive layer, get circuit substrate; Along the said circuit substrate of the first cut surface severing, make circuit board thus with break difference structure.
Preferably, said first substrate is a flexible base, board, and said second substrate is rigid substrates or flexible base, board.
Preferably, said first substrate layer and second substrate layer are individual layer insulating substrate or the composite base material that is made up of individual layer conductive layer and the insulating substrates of being located at relative two surfaces of this individual layer conductive layer respectively.
Preferably, the material of said insulating substrate is selected from phenolic resins, epoxy resin, mylar, polyimides, polytetrafluoroethylene, gathers in thiamines, polymethyl methacrylate, Merlon, the polyimides-polyethylene-terephthaldehyde's ester one or more.
The manufacture method of the circuit board with break difference structure that the present technique scheme provides is passed through in the otch of adhesive layer setting and attach region size match; Bonding first substrate of the adhesive layer that utilizes this to have otch and second substrate; Adopt reinforced sheet to fill otch again; The conductive layer surface that feasible skin is to be connected up is smooth; Produce drop because the outer conductive layer that otch causes caves in to otch when having avoided pressing first substrate and second substrate, thereby the manufacture method that has overcome prior art causes easily the conducting wire thickness to differ, even the defective of broken string.Therefore, the manufacture method of use present technique scheme can improve the circuit making precision and the product percent of pass of circuit board significantly.
Description of drawings
Fig. 1 a to Fig. 1 e is pressing and form the sketch map of circuit in the circuit board manufacturing method of existing break difference structure.
Fig. 2 to Figure 13 is the sketch map of the circuit board manufacturing method with break difference structure that provides of the embodiment of present technique scheme.
Embodiment
Below will combine the manufacture method of the circuit board that embodiment and accompanying drawing provide the present technique scheme to be elaborated with break difference structure.
The manufacture method of the circuit board with break difference structure that present embodiment provides may further comprise the steps:
The first step provides first substrate 200, second substrate 300 and adhesive layer 400.
See also Fig. 2, first substrate 200 is to comprise the flexible base, board of two conductive layers at least, and its concrete structure is decided according to the concrete structure of the circuit board with break difference structure to be made.In the present embodiment, first substrate 200 is a flexible double-sided copper-clad laminated sheet, and it comprises first substrate layer 210 and lays respectively at first conductive layer 220 and second conductive layer 230 on first substrate layer, 210 relative two surfaces.
The material of first conductive layer 220 and second conductive layer 230 can be copper, silver, gold or other common metal.In the present embodiment, first conductive layer 220 and second conductive layer 230 are rolled copper foil.
The 3rd conductive layer 320 materials can be copper, silver, gold or other common metal, and in the present embodiment, it is a rolled copper foil.
In second step, form first conducting wire 221 in first conductive layer 220, and define attach region 222 in these 221 surfaces, first conducting wire.
Present embodiment adopts the common technology in this area to form said first conducting wire 221, attaches dry film like the surface in first conductive layer 220, experiences exposure, development, etching work procedure then and forms.
Referring to Fig. 3, it is the position view of attach region 222 with respect to first conducting wire 221.Attach region 222 is used for the following adopted surface mount process electronic component is mounted to circuit board surface, and its shape and size are decided according to the actual requirements.In the present embodiment, attach region 222 is rectangular, and it is positioned at the middle part of first conducting wire 221.
In the 3rd step, offer and attach region 222 corresponding otch 410 in adhesive layer 400.
Otch 410 can adopt blanking equipment to go out, and it can be difform through hole, like circle, rectangle or other polygon etc.Also can adhesive layer 400 be cut into the less two parts of size, make every part have cut surface, then should two-part cut surface be oppositely arranged but be not in contact with one another, be equivalent between these two parts, form otch 410 thus.Referring to Fig. 4; The size of otch 410 should satisfy when first conducting wire 221 and second substrate layer 310 are close to relative two surfaces of adhesive layer 400 respectively, and attach region 222 is positioned at the projection of otch 410 with respect to second substrate layer 310 with respect to the projection of second substrate layer 310.Preferably, the shape and the size match of the shape of cross section of otch 410 and size and attach region 222.In the present embodiment, adhesive layer 400 is cut off first bonding part 420 and second bonding part 430 that becomes to be separated from each other, and first bonding part 420 has first cut surface, 421, the second bonding parts 430 and has second cut surface 431 relative with first cut surface 421.First cut surface 421 cooperates formation otch 410 with second cut surface 431.
In the 4th step, a reinforced sheet 500 corresponding with attach region 222 sizes is provided.
Reinforced sheet 500 can directly place in the otch 410, also can adhere to the first surface of second base material 310.Particularly, can define tag slot 321, and mount reinforced sheet 500 with 321 corresponding sections, tag slot in the first surface 302 of second base material 310 prior to the 3rd conductive layer 320 surfaces.In the present embodiment, reinforced sheet 500 is affixed on first surface 302 and 321 corresponding surfaces, tag slot.Please consult Fig. 5 to Fig. 6 in the lump, illustrating of tag slot 321 needs to decide according to the size and the shape of otch 410.Preferably, the shape of tag slot 321 and size and otch 410 couplings.Particularly; The illustrating of tag slot 421 can be adopted etching the 3rd conductive layer 320 and formed the mode of identification patterns in the first surface 301 of the 3rd conductive layer 320; Also can mount tab, perhaps illustrate, as long as can play recognition reaction directly perceived with other common mode in first surface 301.Through the size and the position of definition reinforced sheet 500 with respect to first surface 301 that tag slot 321 can intuitively draw the required reinforced sheet that mounts 500 is set, so that follow-uply mount reinforced sheet 500 in first surface 301 and these 221 corresponding sections, tag slot and follow-uply remove the second corresponding substrate layer of tag slot 321 according to tag slot 321.
Reinforced sheet 500 is used to fill otch 410; Preferably; The shape and the size match of its shape and size and attach region 222 and otch 410; After guaranteeing that follow-up first substrate 200 and second substrate 300 are close to the mode pressing on adhesive layer 400 relative two surfaces with first conducting wire 221, second substrate layer 310, reinforced sheet 500 complete filling otch 410, and attach region 222 is between first cut surface 421 and second cut surface 431.
In the 5th step, first substrate 200, adhesive layer 400 and second substrate 300 are stacked and pressed together successively.
Please consult Fig. 4 and Fig. 7 in the lump; The lamination and the pressing of first substrate 200, adhesive layer 400 and second substrate 300 should make second substrate layer 310 and first conducting wire 221 be close to adhesive layer 400 two opposite surfaces respectively; And attach region 222 is between first cut surface 421 and second cut surface 431; Reinforced sheet 500 is contained in the otch 410, and the attach region 222 corresponding with otch 410 places contacts.Thus; Otch 410 is reinforced sheet 500 complete filling, and second conductive layer 230 no longer caves in towards second substrate layer 310 with otch 410 corresponding parts, that is to say; Mode through reinforced sheet 500 filling otch are set makes second conductive layer, 230 surface smoothnesss improve, and no longer has big drop.
The 6th step formed second conducting wire 231 in second conductive layer 230, got circuit substrate 700.
Consult Fig. 8 and Fig. 9, the formation of second conducting wire 231 can be adopted etch process, and it specifically is included in second conductive layer, 230 surfaces and pastes steps such as dry film 600, exposure, development, etching.In addition; Referring to Figure 10; Before or after the pattern of second conducting wire 231 forms; Also can comprise one bore to connect the through hole of second conductive layer 230 and the 3rd conductive layer 320, with the step that the through hole hole wall is electroplated, with conducting second conductive layer 230 and the 3rd conductive layer 320, make and can realize between second conductive layer 230 and the 3rd conductive layer 320 that signal transmits.If through hole hole wall electroplating technology is after the pattern of second conducting wire 231 forms, to carry out, then carry out to paste dry film in the surface of second conductive layer 230 with the protection circuit pattern before the hole wall plating.
In the 7th step, cut circuit substrate 700 along first cut surface 421.
Before cutting circuit substrate 700, can take out reinforced sheet 500, and then cut circuit substrate 700, also can not take out reinforced sheet 500, and directly adopt cutting equipment to cut circuit substrate 700 along first cut surface 421.Please consult Figure 11 to Figure 13 in the lump, in the present embodiment, cut before the circuit substrate 700, expose part second substrate layer 310, remove this part second substrate layer 310, and take out reinforced sheet 500 through removing the 3rd corresponding conductive layer of tag slot 321.
Referring to Figure 11, conductive layer can adopt etching mode, also can adopt neodymium-doped yttrium-aluminum garnet Nd:YAG laser cutting.Please consult Figure 11 and Figure 12 in the lump, this part second substrate layer 310 can be removed through laser cutting.Laser species can carry out corresponding selection according to the material of second substrate layer 310.In general, neodymium-doped yttrium-aluminum garnet Nd:YAG laser emitted laser wavelength is shorter, belongs to ultraviolet band, and pulse frequency is higher, can be used for cutting conductive layer and insulating barrier.CO
2Laser emitted laser wavelength is longer, belongs to middle-infrared band, only is applied to cut insulating barrier usually.Certainly, also can select the hybrid laser system, that is, and with Nd:YAG laser cutting conductive layer, with CO
2The laser cutting insulating barrier.In the present embodiment, second substrate layer 310 is an insulating barrier, so with CO
2Laser cutting gets final product.
Certainly, also can make the 3rd conducting wire in the 3rd conductive layer 320 as required.The making of the 3rd conducting wire can be made with second conducting wire 231 simultaneously, also can take out reinforced sheet 500 back making.
Referring to Figure 12 and Figure 13, can obtain having the circuit board of break difference structure along first conducting wire 221 of first cut surface 421 severing in the lump, first substrate layer 210 and second conducting wire 231.
The manufacture method of the circuit board with break difference structure of present embodiment is filled otch 410 through reinforced sheet 500 is set; Feasible second conductive layer, 230 surfacings to be connected up; Because caving in along otch 410, second conductive layer 230 that otch 410 causes produces drops when having avoided pressing first substrate 200 and second substrate 300; Thereby the manufacture method that has overcome prior art causes the conducting wire thickness to differ easily, even the defective of broken string.Therefore, the manufacture method of use present technique scheme can improve the circuit making precision and the product percent of pass of circuit board significantly.
More than the manufacture method of the circuit board with break difference structure of present technique scheme is described in detail, but can not be interpreted as it is restriction to the present technique plan plot.It is understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion, and all these change the protection range that all should belong to the application's claim with distortion according to the technical conceive of present technique scheme.
Claims (9)
1. manufacture method with circuit board of break difference structure, it comprises the steps:
First substrate, adhesive layer and second substrate are provided; Said first substrate comprises first substrate layer, is formed at first conductive layer and second conductive layer on relative two surfaces of first substrate layer, and said second substrate comprises second substrate layer and is formed at the 3rd conductive layer on this second substrate layer surface;
Form first conducting wire in first conductive layer, and define attach region in this surface, first conducting wire; In said adhesive layer the otch that connects its relative two surfaces is set, makes adhesive layer have first cut surface and second cut surface relative thus with first cut surface;
The reinforced sheet corresponding with the attach region size is provided;
First substrate, adhesive layer and second substrate are stacked and pressed together successively; And make said first conducting wire and second substrate layer be close to relative two surfaces of adhesive layer respectively; Said attach region is between first cut surface and second cut surface, and said reinforced sheet is contained in otch;
Form second conducting wire in second conductive layer, get circuit substrate;
Along the said circuit substrate of the first cut surface severing, make circuit board thus with break difference structure.
2. the manufacture method with circuit board of break difference structure as claimed in claim 1 is characterized in that, said first substrate is a flexible base, board, and said second substrate is rigid substrates or flexible base, board.
3. the manufacture method with circuit board of break difference structure as claimed in claim 2; It is characterized in that said first substrate layer and second substrate layer are individual layer insulating substrate or the composite base material that is made up of individual layer conductive layer and the insulating substrates of being located at relative two surfaces of this individual layer conductive layer respectively.
4. the manufacture method with circuit board of break difference structure as claimed in claim 3; It is characterized in that the material of said insulating substrate is selected from phenolic resins, epoxy resin, mylar, polyimides, polytetrafluoroethylene, gather in thiamines, polymethyl methacrylate, Merlon, the polyimides-polyethylene-terephthaldehyde's ester one or more.
5. the manufacture method with circuit board of break difference structure as claimed in claim 1; It is characterized in that; After this manufacture method also is included in pressing first substrate, adhesive layer and second substrate, form the through hole that connects second conductive layer and the 3rd conductive layer, with conducting first conductive layer and the 3rd conductive layer.
6. the manufacture method with circuit board of break difference structure as claimed in claim 5 is characterized in that, this manufacture method also is included in after second conductive layer forms second conducting wire, and the 3rd conductive layer is processed the conducting wire.
7. the manufacture method with circuit board of break difference structure as claimed in claim 5 is characterized in that, the shape of the shape of said otch and size and said attach region and size match.
8. the manufacture method with circuit board of break difference structure as claimed in claim 7 is characterized in that, the shape of the shape of said reinforced sheet and size and said otch and size match.
9. the manufacture method with circuit board of break difference structure as claimed in claim 1 is characterized in that, the material of said first conductive layer, second conductive layer and the 3rd conductive layer is selected from copper, silver or golden.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810300566.0A CN101534613B (en) | 2008-03-14 | 2008-03-14 | Method for manufacturing circuit board with offset structure |
| US12/342,205 US8112880B2 (en) | 2008-03-14 | 2008-12-23 | Method for manufacturing multilayer printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810300566.0A CN101534613B (en) | 2008-03-14 | 2008-03-14 | Method for manufacturing circuit board with offset structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101534613A CN101534613A (en) | 2009-09-16 |
| CN101534613B true CN101534613B (en) | 2012-06-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810300566.0A Active CN101534613B (en) | 2008-03-14 | 2008-03-14 | Method for manufacturing circuit board with offset structure |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8112880B2 (en) |
| CN (1) | CN101534613B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102083282B (en) * | 2009-11-27 | 2012-11-21 | 富葵精密组件(深圳)有限公司 | Method for manufacturing printed circuit board (PCB) |
| US8664656B1 (en) | 2012-10-04 | 2014-03-04 | Apple Inc. | Devices and methods for embedding semiconductors in printed circuit boards |
| KR101241070B1 (en) * | 2012-10-05 | 2013-03-11 | 주식회사 에스아이 플렉스 | The printed circuit board manufacturing method |
| WO2015129061A1 (en) * | 2014-02-27 | 2015-09-03 | 京セラ株式会社 | Piezoelectric actuator, and piezoelectric vibration device, portable terminal, acoustic generator, acoustic generation device, and electronic device provided therewith |
| JP6787286B2 (en) * | 2017-09-20 | 2020-11-18 | 株式会社村田製作所 | Manufacturing method of inductor parts |
| CN110831325B (en) * | 2018-08-10 | 2021-04-20 | 鹏鼎控股(深圳)股份有限公司 | Antenna circuit board and manufacturing method thereof |
| CN113438807A (en) * | 2021-06-30 | 2021-09-24 | 东莞市小精灵教育软件有限公司 | Connecting structure of soft board and hard board and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1262596A (en) * | 1994-12-20 | 2000-08-09 | 国际商业机器公司 | Method for making multi-layer circuit board by substrate with open |
| JP2001036239A (en) * | 1999-07-19 | 2001-02-09 | Nippon Mektron Ltd | Manufacture of flexible multilayered circuit board |
| CN1832664A (en) * | 2005-03-11 | 2006-09-13 | 三星电机株式会社 | Method of fabricating printed circuit board having embedded multi-layer passive devices |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5262594A (en) * | 1990-10-12 | 1993-11-16 | Compaq Computer Corporation | Multilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling same |
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2008
- 2008-03-14 CN CN200810300566.0A patent/CN101534613B/en active Active
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1262596A (en) * | 1994-12-20 | 2000-08-09 | 国际商业机器公司 | Method for making multi-layer circuit board by substrate with open |
| JP2001036239A (en) * | 1999-07-19 | 2001-02-09 | Nippon Mektron Ltd | Manufacture of flexible multilayered circuit board |
| CN1832664A (en) * | 2005-03-11 | 2006-09-13 | 三星电机株式会社 | Method of fabricating printed circuit board having embedded multi-layer passive devices |
Also Published As
| Publication number | Publication date |
|---|---|
| US20090229121A1 (en) | 2009-09-17 |
| CN101534613A (en) | 2009-09-16 |
| US8112880B2 (en) | 2012-02-14 |
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