CN203910778U - Fingerprint identification chip packaging module - Google Patents
Fingerprint identification chip packaging module Download PDFInfo
- Publication number
- CN203910778U CN203910778U CN201420293645.4U CN201420293645U CN203910778U CN 203910778 U CN203910778 U CN 203910778U CN 201420293645 U CN201420293645 U CN 201420293645U CN 203910778 U CN203910778 U CN 203910778U
- Authority
- CN
- China
- Prior art keywords
- identification
- fingerprint chip
- encapsulation module
- chip encapsulation
- fingerprint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 title 1
- 238000007789 sealing Methods 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 230000006698 induction Effects 0.000 claims abstract description 28
- 238000005538 encapsulation Methods 0.000 claims description 63
- 239000010410 layer Substances 0.000 claims description 33
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 25
- 239000011241 protective layer Substances 0.000 claims description 21
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 10
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 5
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 5
- 229910026551 ZrC Inorganic materials 0.000 claims description 5
- OTCHGXYCWNXDOA-UHFFFAOYSA-N [C].[Zr] Chemical compound [C].[Zr] OTCHGXYCWNXDOA-UHFFFAOYSA-N 0.000 claims description 5
- UFGZSIPAQKLCGR-UHFFFAOYSA-N chromium carbide Chemical compound [Cr]#C[Cr]C#[Cr] UFGZSIPAQKLCGR-UHFFFAOYSA-N 0.000 claims description 5
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 5
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 5
- 229910003470 tongbaite Inorganic materials 0.000 claims description 5
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- -1 acryl Chemical group 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 230000035945 sensitivity Effects 0.000 abstract description 5
- 239000000463 material Substances 0.000 description 28
- 230000003068 static effect Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000002054 transplantation Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Abstract
An embodiment of the utility model provides a chip package module is discerned to fingerprint, chip package module is discerned to fingerprint includes that base plate, fingerprint discern chip, mould seal and color layer. The substrate is provided with an upper surface and a lower surface opposite to the upper surface, and the substrate comprises at least one grounding pad exposed on the upper surface; the fingerprint identification chip is provided with an induction area and a top surface, wherein the induction area is formed on the top surface, and the fingerprint identification chip is arranged on the upper surface; the die sealing layer covers the top surface and exposes the sensing area; and the color layer is positioned on the mold sealing layer, and the color layer covers and contacts the sensing area. The utility model provides a whole thickness of chip package module is discerned to fingerprint is lower, and then makes the sensitivity of chip package module is discerned to fingerprint improve.
Description
Technical field
The utility model relates to a kind of identification of fingerprint chip encapsulation module, and particularly relates to the identification of fingerprint chip encapsulation module with bearer bar.
Background technology
Common identification of fingerprint chip encapsulation module mainly comprises substrate, chip and mould envelope body at present.Chip is arranged on substrate and with electrical property of substrate and is connected, and mould envelope body is covered on the surface and chip of substrate.In general, when the sensing area of finger contact chip, because chip outside is coated with multilayer film, make identification of fingerprint chip encapsulation module integral thickness higher, and the sensitivity of identification of fingerprint chip encapsulation module is lower.
Utility model content
The utility model embodiment provides a kind of identification of fingerprint chip encapsulation module, and its integral thickness is lower.
The utility model embodiment provides a kind of identification of fingerprint chip encapsulation module, and described identification of fingerprint chip encapsulation module comprises substrate, identification of fingerprint chip, mould sealing and color layer.Substrate has a upper surface and a lower surface relative with upper surface, and substrate comprises at least one ground mat, and ground mat is exposed to upper surface.Identification of fingerprint chip has an induction zone and an end face, and wherein middle induction zone is formed on end face, and identification of fingerprint chip configuration is on upper surface.Mould sealing covers the end face of identification of fingerprint chip and exposes the induction zone of identification of fingerprint chip.Color layer is positioned on mould sealing, and color layer covers and the induction zone of contact identification of fingerprint chip.
Further, described identification of fingerprint chip encapsulation module also comprises a protective layer, and described protective layer is disposed on described color layer.
Further, described identification of fingerprint chip encapsulation module also comprises a bearer bar, and described bearer bar and described ground mat are electrically connected and have a fluting, and described identification of fingerprint chip is positioned at described fluting, and described fluting exposes described identification of fingerprint chip.
Further, the bearer bar that described bearer bar is metal.
Further, described identification of fingerprint chip encapsulation module also comprises a plurality of electronic components, and described electronic component arrangements is on the described upper surface of described substrate, and described mould sealing covers described electronic component.
Further, described identification of fingerprint chip encapsulation module also comprises a plurality of electronic components and a counterdie sealing, and described electronic component arrangements is in the described lower surface of described substrate, and described counterdie sealing covers described electronic component.
Further, described mould sealing is formed by epoxy resin, acryl resin or silica gel.
Further, each in described mould sealing, described color layer and described protective layer forms by alundum (Al2O3), aluminium oxide, titanium oxide, titanium carbide, chromium oxide, chromium carbide, zirconia or zirconium carbide.
In sum, the utility model embodiment provides a kind of identification of fingerprint chip encapsulation module.Identification of fingerprint chip encapsulation module comprises substrate, identification of fingerprint chip, mould sealing and color layer.Mould sealing at least exposes the induction zone of identification of fingerprint chip, and color layer is positioned on mould sealing and covers the induction zone of identification of fingerprint chip.Compared to known technology, the integral thickness of identification of fingerprint chip encapsulation module is lower, and then the sensitivity of identification of fingerprint chip encapsulation module is improved.In addition, the material of color layer and protective layer can adopt higher dielectric coefficient.In addition, the identification of fingerprint chip encapsulation module of the utility model embodiment comprises bearer bar.When finger or the sensing area of other object contact identification of fingerprint chips, bearer bar is born Toe Transplantation for Segmental Finger or other object applied force amounts, thereby bearer bar can be in order to strengthen the overall construction intensity of identification of fingerprint chip encapsulation module.In addition, bearer bar can also transmit the static of pointing or other objects bring by ground mat, thereby bearer bar can provide the purposes of identification of fingerprint chip electro-static discharge protection.
In order further to understand the technology that the utility model is taked, refer to following relevant detailed description of the present utility model, graphic, believe feature of the present utility model and feature, when being goed deep into thus and concrete understanding, yet appended graphic and annex only provide with reference to and explanation use, be not used for to the utility model limitr in addition.
Accompanying drawing explanation
Figure 1A is the structural representation of the identification of fingerprint chip encapsulation module of the utility model the first embodiment.
Figure 1B is the generalized section that in Figure 1A, P-P section along the line illustrates.
Fig. 2 A is the structural representation of the identification of fingerprint chip encapsulation module of the utility model the second embodiment.
Fig. 2 B is the generalized section that Fig. 2 A illustrates.
Fig. 3 is the structural representation of the identification of fingerprint chip encapsulation module of the utility model the 3rd embodiment.
[symbol description]
100,200,300 identification of fingerprint chip encapsulation modules
110 substrates
112 ground mats
120 identification of fingerprint chips
130 mould sealings
130 counterdie sealings
140 color layers
150 protective layers
260 bearer bars
270 electronic components
A1 induction zone
The non-induction zone of A2
H1, H2 distance
R1 fluting
S1 upper surface
S2 lower surface
W1 wire
Embodiment
Figure 1A is the structural representation of the identification of fingerprint chip encapsulation module of the utility model the first embodiment, and Figure 1B is the generalized section that in Figure 1A, P-P section along the line illustrates.Refer to Figure 1A and Figure 1B, identification of fingerprint chip encapsulation module 100 comprises substrate 110, identification of fingerprint chip 120, mould sealing 130 and color layer 140.Substrate 110 and identification of fingerprint chip 120 are all disposed on substrate 110, and mould sealing 130 is disposed on identification of fingerprint chip 120, and color layer 140 is disposed on mould sealing 130.
The support plate (carrier) of substrate 110 in order to configure as identification of fingerprint chip 120.Substrate 110 has a upper surface S1 and a lower surface S2 with respect to upper surface S1.Substrate 110 comprises at least one ground mat 112, and ground mat 112 is exposed to upper surface S1.In practice, substrate 110 can be circuit board or flexible printed wiring board (flexible printed circuit board, FPCB), and these ground mats 112 and the circuit (not illustrating) that is positioned at upper surface S1 can arrange according to the configuration needs of identification of fingerprint chip 120.In addition, in the present embodiment, being shaped as of substrate 110 is square.But, in other embodiments, the shape of substrate 110 can be adjusted according to actual user demand, for example, be circle, ellipse, triangle, rectangle or irregular shape.The utility model is not limited this.
Identification of fingerprint chip 120 is disposed at the upper surface S1 of substrate 110.Identification of fingerprint chip 120 has an induction zone A1, and induction zone A1 is positioned on the active surface (active surface) of identification of fingerprint chip 120.In the utility model embodiment, identification of fingerprint chip 120 is electrically connected with routing mode (wire bonding) and substrate 110 by wire W1.But, identification of fingerprint chip 120 can be to be also otherwise electrically connected with substrate 110, for example, be that the circuit of chip bonding mode (flip chip) or other method for packing and substrate 110 is electrically connected.The utility model is not limited the configuration mode of identification of fingerprint chip 120.
Mould sealing 130 only covers the non-induction zone A2 of identification of fingerprint chip 120 and covers the wire W1 that is positioned at non-induction zone A2, and mould sealing 130 at least exposes the induction zone A1 of identification of fingerprint chip 120.The surperficial beeline H1 that identification of fingerprint chip 120 arrives mould sealing 130 is between 20 μ m to 30 μ m.What deserves to be explained is, in the present embodiment, the material of mould sealing 130 can be silica gel material (Silicon) or epoxide resin material or acryl resin material.By ink-jetting style (spray), mould sealing 130 is covered in to wire W1 and does not cover the induction zone A1 of identification of fingerprint chip 120.But, in other embodiments, the material of mould sealing 130 can be the material that adopts high-k, the group that selects free alundum (Al2O3), aluminium oxide, titanium oxide, titanium carbide, chromium oxide, chromium carbide, zirconia, zirconium carbide and combination in any thereof to form.
Color layer 140 is positioned on mould sealing 130 and covers the induction zone A1 of identification of fingerprint chip 120.Specifically, color layer 140 covers on mould sealing 130, and covers towards induction zone A1 along mould sealing 130.The thickness of color layer 140, between 5 μ m to 15 μ m, that is to say, the aspect ratio mould sealing 130 of color layer 140 that is positioned at induction zone A1 is low.In the present embodiment, the material of color layer 140 comprises alundum (Al2O3) and nonmetallic materials.Wherein, nonmetallic materials comprise silicon, graphite etc., can be so that transparent alundum (Al2O3) present multiple color, thus make color layer 140 can there is multiple color, be for example white, golden, green, redness or black.But, in other embodiments, the material of color layer 140 can only comprise nonmetallic materials, and the material of mould sealing 130 can be alundum (Al2O3), by plating, evaporation, sputter, nonmetallic materials is directly formed on the surface of alundum (Al2O3) material.The color of color layer 140 can adjust according to actual product demand, and the utility model is not limited this.
Identification of fingerprint chip encapsulation module 100 can also comprise protective layer 150, and protective layer 150 is disposed on color layer 140.Protective layer 150 covers on color layer 140 and covers towards induction zone A1 along color layer 140.The thickness of protective layer 150 is between 5 μ m to 15 μ m.The surface of the induction zone A1 of identification of fingerprint chip 120 approximately between 10 μ m to 30 μ m, also, is positioned at the protective layer 150 of induction zone A1 and the whole height of color layer 140 is lower than mould sealing 130 to the surperficial beeline H2 of protective layer 150.Protective layer 150 is used for reducing color layer 140 because user scrapes, grinds or other ways of contact and suffer the probability of wearing and tearing decolouring.In the present embodiment, because the material of protective layer 150 is the alundum (Al2O3) that presents clear, colorless, thereby can show the color of the color layer 140 that is positioned at protective layer 150 belows.But; in other embodiments; the material of protective layer 150 can be also the material that adopts high-k, the group that selects free alundum (Al2O3), aluminium oxide, titanium oxide, titanium carbide, chromium oxide, chromium carbide, zirconia, zirconium carbide and combination in any thereof to form.For further protection identification of fingerprint chip, protective layer 150 materials can have resistance to acids and bases, and can 250 ℃ to 320 ℃ of withstand high temperatures and the high rigidity that reaches 6H.In addition, in order to reduce residual greasy dirt or water stain probability on identification of fingerprint chip encapsulation module 100, the material of protective layer 150 can have the characteristic of hydrophobic and oleophobic.
Fig. 2 A is the structural representation of the identification of fingerprint chip encapsulation module of the utility model the second embodiment.Fig. 2 B is the generalized section that Fig. 2 A illustrates.The identification of fingerprint chip encapsulation module 200 of the second embodiment and the identification of fingerprint chip encapsulation module of the first embodiment 100 the two structural similarity, effect is identical, for example, identification of fingerprint chip encapsulation module 200 equally all comprises substrate 110 with identification of fingerprint chip encapsulation module 100.By the two difference of the identification of fingerprint chip encapsulation module of only introducing 200 and identification of fingerprint chip encapsulation module 100, it is no longer repeated for identical feature below.
In order to improve the sensitivity of identification of fingerprint chip encapsulation module, to make higher just finger need to quite approach chip.But easily make chip to bear the strength that comes from more greatly finger.According to this, chip is easy because repeatedly meet with stresses, and causes chip to produce crack.In addition, the sensing area of human body or other object contact chips all may produce static discharge (electrostatic discharge, ESD), and then easily chip is caused damage.Refer to Fig. 2 A and Fig. 2 B, infringement chip being caused in order to reduce counter stress and static discharge, identification of fingerprint chip encapsulation module can also comprise bearer bar 260.Bearer bar 260 is a framework and has a fluting R1, and identification of fingerprint chip 120 is positioned at fluting H1, and bearer bar 260 is electrically connected with ground mat 112.The material of bearer bar 130 is metal material or alloy material, for example, and dilval, copper alloy etc.What deserves to be explained is; when finger or the active region A1 of other object contact identification of fingerprint chips 120; bearer bar 260 can be born the strength that part identification of fingerprint chip 120 bears, thereby bearer bar 260 can be in order to strengthen the overall construction intensity of identification of fingerprint chip encapsulation module 100.In addition, bearer bar 260 can also transmit the static of pointing or other objects bring by ground mat 112, thereby bearer bar 130 can provide the purposes of identification of fingerprint chip 120 electrostatic discharge protectives.
Fig. 3 is the structural representation of the identification of fingerprint chip encapsulation module of the utility model the 3rd embodiment.The identification of fingerprint chip encapsulation module 300 of the 3rd embodiment and the identification of fingerprint chip encapsulation module of the second embodiment 200 the two structural similarity, effect is identical, for example, identification of fingerprint chip encapsulation module 300 equally all comprises substrate 110 with identification of fingerprint chip encapsulation module 200.By the two difference of the identification of fingerprint chip encapsulation module of only introducing 300 and identification of fingerprint chip encapsulation module 200, it is no longer repeated for identical feature below.
Refer to Fig. 3, substrate 110, except the support plate in order to as identification of fingerprint chip 120, can also arrange various electronic components 150 thereon.In the present embodiment, electronic component 150 is disposed at upper surface S1 and lower surface S2 is upper, and is electrically connected with substrate 110.But, in other embodiment, electronic component 150 also can only be disposed on upper surface S1 or lower surface S2.Mould sealing 130 and counterdie sealing 130 ' are all covered on electronic component 150.The material of counterdie sealing 130 ' can be silica gel material, epoxide resin material or acryl resin material.In addition, the material of counterdie sealing 130 ' can be also the material that adopts high-k, the group that selects free alundum (Al2O3), aluminium oxide, titanium oxide, titanium carbide, chromium oxide, chromium carbide, zirconia, zirconium carbide and combination in any thereof to form.
What deserves to be explained is, electronic component 150 can comprise multiple all kinds, is also that the kind of these electronic components 150 is also incomplete same.Electronic component 120 can be a plurality of incomplete same electronic components, for example, be chip, transistor, diode, electric capacity, inductance or other high frequencies, radio frequency (Radio frequency, RF) element etc.As Figure 1A illustrates, electronic component 150 can comprise different kinds, but all with electronic component 150, represents at this.But, the utility model is not limited the kind of electronic component 150.
In sum, the utility model embodiment provides a kind of identification of fingerprint chip encapsulation module.Identification of fingerprint chip encapsulation module comprises substrate, identification of fingerprint chip, mould sealing and color layer.Mould sealing at least exposes the induction zone of identification of fingerprint chip, and color layer is positioned on mould sealing and covers the induction zone of identification of fingerprint chip.Compared to known technology, the integral thickness of identification of fingerprint chip encapsulation module is lower, and then the sensitivity of identification of fingerprint chip encapsulation module is improved.In addition, the material of color layer and protective layer can adopt higher dielectric coefficient.In addition, the identification of fingerprint chip encapsulation module of the utility model embodiment comprises bearer bar.When finger or the sensing area of other object contact identification of fingerprint chips, bearer bar is born Toe Transplantation for Segmental Finger or other object applied force amounts, thereby bearer bar can be in order to strengthen the overall construction intensity of identification of fingerprint chip encapsulation module.In addition, bearer bar can also transmit the static of pointing or other objects bring by ground mat, thereby bearer bar can provide the purposes of identification of fingerprint chip electro-static discharge protection.
The foregoing is only embodiment of the present utility model, it is not in order to limit scope of patent protection of the present utility model.Any those of ordinary skill in the art, within not departing from spirit of the present utility model and scope, the change of doing and the equivalence of retouching are replaced, and are still in scope of patent protection of the present utility model.
Claims (8)
1. an identification of fingerprint chip encapsulation module, is characterized in that, described identification of fingerprint chip encapsulation module comprises:
One substrate, described substrate has a upper surface and a lower surface relative with described upper surface, and described substrate comprises at least one ground mat, and described ground mat is exposed to described upper surface;
One identification of fingerprint chip, described identification of fingerprint chip has an induction zone and an end face, and wherein said induction zone is formed on described end face, and described identification of fingerprint chip configuration is on described upper surface;
One mould sealing, described mould sealing covers described end face and exposes described induction zone; And
One color layer, described color layer is positioned on described mould sealing, and described color layer covers and contact described induction zone.
2. identification of fingerprint chip encapsulation module according to claim 1, is characterized in that, described identification of fingerprint chip encapsulation module also comprises a protective layer, and described protective layer is disposed on described color layer.
3. identification of fingerprint chip encapsulation module according to claim 1; it is characterized in that; described identification of fingerprint chip encapsulation module also comprises a bearer bar; described bearer bar and described ground mat are electrically connected and have a fluting; and described identification of fingerprint chip is positioned at described fluting, described fluting exposes described identification of fingerprint chip.
4. identification of fingerprint chip encapsulation module according to claim 3, is characterized in that, the bearer bar that described bearer bar is metal.
5. identification of fingerprint chip encapsulation module according to claim 1, it is characterized in that, described identification of fingerprint chip encapsulation module also comprises a plurality of electronic components, and described electronic component arrangements is on the described upper surface of described substrate, and described mould sealing covers described electronic component.
6. identification of fingerprint chip encapsulation module according to claim 1, it is characterized in that, described identification of fingerprint chip encapsulation module also comprises a plurality of electronic components and a counterdie sealing, described electronic component arrangements is in the described lower surface of described substrate, and described counterdie sealing covers described electronic component.
7. identification of fingerprint chip encapsulation module according to claim 1, is characterized in that, described mould sealing is formed by epoxy resin, acryl resin or silica gel.
8. identification of fingerprint chip encapsulation module according to claim 2; it is characterized in that, each in described mould sealing, described color layer and described protective layer forms by alundum (Al2O3), aluminium oxide, titanium oxide, titanium carbide, chromium oxide, chromium carbide, zirconia or zirconium carbide.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103209127 | 2014-05-23 | ||
| TW103209127U TWM484793U (en) | 2014-05-23 | 2014-05-23 | Package module of fingerprint recognition chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203910778U true CN203910778U (en) | 2014-10-29 |
Family
ID=51785032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420293645.4U Expired - Fee Related CN203910778U (en) | 2014-05-23 | 2014-06-04 | Fingerprint identification chip packaging module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN203910778U (en) |
| TW (1) | TWM484793U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104681454A (en) * | 2015-02-28 | 2015-06-03 | 苏州科阳光电科技有限公司 | Packaging technology for novel fingerprint lock device |
| CN105718843A (en) * | 2014-12-03 | 2016-06-29 | 关键应用科技股份有限公司 | Fingerprint recognition device and manufacturing method thereof |
| TWI547885B (en) * | 2015-04-08 | 2016-09-01 | 麥克思股份有限公司 | Fingerprint identification device |
| WO2016183975A1 (en) * | 2015-05-19 | 2016-11-24 | 苏州晶方半导体科技股份有限公司 | Chip packaging structure and packaging method |
| CN107180768A (en) * | 2016-03-10 | 2017-09-19 | 南茂科技股份有限公司 | Manufacturing method and manufacturing equipment of fingerprint identification packaging structure |
| CN107437053A (en) * | 2016-05-27 | 2017-12-05 | 中兴通讯股份有限公司 | A kind of fingerprint identification method and device |
| CN107437045A (en) * | 2016-05-25 | 2017-12-05 | 晨星半导体股份有限公司 | Fingeprint distinguisher and the contactor control device with finger print identification function |
| CN109994431A (en) * | 2017-12-29 | 2019-07-09 | 矽品精密工业股份有限公司 | Encapsulating structure |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI594341B (en) * | 2015-01-19 | 2017-08-01 | 神盾股份有限公司 | Fingerprint sensor package and method for fabricating the same |
| TWM506323U (en) * | 2015-02-03 | 2015-08-01 | Tpk Touch Solutions Xiamen Inc | Touch control device |
| JP2017063163A (en) * | 2015-09-25 | 2017-03-30 | 京セラ株式会社 | Wiring board for fingerprint sensor |
| TWI730812B (en) * | 2020-06-15 | 2021-06-11 | 義隆電子股份有限公司 | Fingerprint sensing chip module for a smart card and packaging method of the same |
-
2014
- 2014-05-23 TW TW103209127U patent/TWM484793U/en not_active IP Right Cessation
- 2014-06-04 CN CN201420293645.4U patent/CN203910778U/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105718843A (en) * | 2014-12-03 | 2016-06-29 | 关键应用科技股份有限公司 | Fingerprint recognition device and manufacturing method thereof |
| CN104681454A (en) * | 2015-02-28 | 2015-06-03 | 苏州科阳光电科技有限公司 | Packaging technology for novel fingerprint lock device |
| CN104681454B (en) * | 2015-02-28 | 2017-10-13 | 苏州科阳光电科技有限公司 | The packaging technology of device is locked for novel finger print |
| TWI547885B (en) * | 2015-04-08 | 2016-09-01 | 麥克思股份有限公司 | Fingerprint identification device |
| WO2016183975A1 (en) * | 2015-05-19 | 2016-11-24 | 苏州晶方半导体科技股份有限公司 | Chip packaging structure and packaging method |
| CN107180768A (en) * | 2016-03-10 | 2017-09-19 | 南茂科技股份有限公司 | Manufacturing method and manufacturing equipment of fingerprint identification packaging structure |
| CN107180768B (en) * | 2016-03-10 | 2019-10-11 | 南茂科技股份有限公司 | Manufacturing method and manufacturing equipment of fingerprint identification packaging structure |
| CN107437045A (en) * | 2016-05-25 | 2017-12-05 | 晨星半导体股份有限公司 | Fingeprint distinguisher and the contactor control device with finger print identification function |
| CN107437053A (en) * | 2016-05-27 | 2017-12-05 | 中兴通讯股份有限公司 | A kind of fingerprint identification method and device |
| CN107437053B (en) * | 2016-05-27 | 2022-11-11 | 中兴通讯股份有限公司 | Fingerprint identification method and device |
| CN109994431A (en) * | 2017-12-29 | 2019-07-09 | 矽品精密工业股份有限公司 | Encapsulating structure |
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| Publication number | Publication date |
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| TWM484793U (en) | 2014-08-21 |
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