CN104681454A - Packaging technology for novel fingerprint lock device - Google Patents
Packaging technology for novel fingerprint lock device Download PDFInfo
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- CN104681454A CN104681454A CN201510091436.0A CN201510091436A CN104681454A CN 104681454 A CN104681454 A CN 104681454A CN 201510091436 A CN201510091436 A CN 201510091436A CN 104681454 A CN104681454 A CN 104681454A
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Abstract
The invention discloses a packaging technology for a novel fingerprint lock device. The novel fingerprint lock device comprises a fingerprint recognition chip, a ceramic cover plate, a flexible PCB and a data processing chip. The packaging technology comprises the following steps: filling the surfaces of aluminum welding pads in blind holes of the fingerprint recognition chip with nickel metal layers to extend out of the upper surface and form bulges so as to form bonding pad thickening parts; coating the upper surface, having the bonding pad thickening parts, of the fingerprint recognition chip with a temporary bonding adhesive layer; bonding a glass supporting plate with the surface, having the bonding pad thickening parts, of the fingerprint recognition chip through the temporary bonding adhesive layer; thinning the lower surface opposite to the upper surface of the fingerprint recognition chip so as to reduce the thickness of the fingerprint recognition chip to about 150-300 microns; sequentially forming a first tapered blind hole, a second tapered blind hole and third tapered blind holes in the lower surface of the fingerprint recognition chip by etching gradually. After wafer-level chip packaging technology and a silicon through hole technology are integrated, a set of novel process is formed, so that the thickness is reduced, the total thickness of a product is greatly reduced and the reliability of the product is greatly improved.
Description
Technical field
The present invention relates to a kind of packaging technology for novel finger print lock device, belong to technical field of semiconductor encapsulation.
Background technology
In the advanced package technologies of fingerprint chip, after the iPhone5S and the issue of supporting Touch ID fingerprint identification technology thereof of American apple company, after it discloses the issue of a kind of brand-new fingerprint identification technology, it discloses a kind of brand-new fingerprint recognition chip, which employs and first use Wafer level packaging to carry out grooving at the side of every chips, and weld pad of reforming, later stage uses known low camber (low loop height) wire soldering technology to complete module packaging, to reduce module height, it is the bridge technology being mixed with wafer-level packaging and conventional package.The Touch ID encapsulating structure that Apple's patent text is announced, bonding wire mode is adopted to realize, just carry out grooving on the chip surface, to reduce module height after bonding wire, therefore, in the encapsulation technology of advanced fingerprint chip, real the fingerprint recognition chip package form and the patent that adopt wafer scale TSV encapsulation technology is not also seen in the market.
How by the Wafer level packaging of existing image sensor dice, again for the concrete specification requirement of fingerprint recognition chip package, develop brand-new complete packaging technology, the new technique direction for fingerprint recognition chip package application extension, become the direction that those of ordinary skill in the art make great efforts.
Summary of the invention
The object of the invention is to provide a kind of packaging technology for novel finger print lock device, this packaging technology being used for novel finger print lock device forms a set of new technological process by after wafer stage chip encapsulation and silicon through hole Technology Integration, directly save conventional package routing step, decrease holder and FPC equal thickness, product gross thickness is reduced greatly, the use of this technology makes the solid that can have 0.4mm in the packaging body of 0.5mm, be conducive to meeting industrial design moulding and realize enough product strengths, finally having increased substantially product reliability.
For achieving the above object, the technical solution used in the present invention is: a kind of packaging technology for novel finger print lock device, described novel finger print lock device comprises fingerprint recognition chip, ceramic cover plate, flexible PCB and data processing chip, be provided with high dielectric constant layer between the induction zone of described fingerprint recognition chip and ceramic cover plate, described flexible PCB and data processing chip are all electrically connected fingerprint recognition chip;
This fingerprint recognition chip upper surface is distributed with several blind holes, in the blind hole of described fingerprint recognition chip, there is aluminum pad, this aluminum pad extends in the middle part of blind hole from blind via bottom, in blind hole, aluminium welding pad surface is filled with nickel metal layer, this nickel metal layer extends to fingerprint recognition chip upper surface and forms projection in the middle part of blind hole, forms pad thickened section;
Described fingerprint recognition chip lower surface also has the first tapered blind hole, the second tapered blind hole successively with blind hole opposite region ecto-entad, second tapered blind hole is positioned at the bottom of the first tapered blind hole, the cross section of described first tapered blind hole, the second tapered blind hole is taper, the opening of the second tapered blind hole is less than the opening of the first tapered blind hole, is the aluminum pad of fingerprint recognition chip bottom this second tapered blind hole;
Described fingerprint recognition chip lower surface, first tapered blind hole, second tapered blind hole surface has insulating barrier, several triconic blind holes are offered bottom described second tapered blind hole, be positioned at fingerprint recognition chip, first tapered blind hole, above second tapered blind hole and triconic blind hole, there is titanium conductive pattern layer successively, copper metallic conductive pattern layer, this titanium conductive pattern layer, copper metallic conductive pattern layer is positioned at insulating barrier and the opposing surface of fingerprint recognition chip, one welding resisting layer is positioned at copper metallic conductive pattern layer and the opposing surface of titanium conductive pattern layer, this welding resisting layer has several through holes, one soldered ball is electrically connected with copper metallic conductive pattern layer by described through hole, described flexible PCB and data processing chip are all electrically connected the soldered ball of fingerprint recognition chip,
Described novel finger print lock device is obtained by following manufacturing process, comprises the following steps:
Step one, in the blind hole of described fingerprint recognition chip, nickel metal layer is filled on aluminium welding pad surface, thus upper surface form projection, form pad thickened section;
Step 2, on the fingerprint recognition chip upper surface coating method with pad thickened section ephemeral key rubber alloy layer;
Step 3, the upper surface that a glass support plate has pad thickened section by ephemeral key rubber alloy layer and fingerprint recognition chip to be bonded;
Step 4, by thinning for the lower surface opposing with fingerprint recognition chip upper surface, thus fingerprint recognition chip thickness is thinned to 150 ~ 300 microns;
Step 5, realize described first tapered blind hole, the second tapered blind hole and triconic blind hole from fingerprint recognition chip lower surface successively by progressively to etch;
Step 6, by magnetron sputtering sputter one titanium conductive pattern layer above fingerprint recognition chip, the first tapered blind hole, the second tapered blind hole and triconic blind hole;
Step 7, by magnetron sputtering in titanium conductive pattern layer surface sputter one layers of copper;
Step 8, by plating at the layers of copper surface deposition one bronze medal thickening layer of step 7, thus form copper metallic conductive pattern layer;
Step 9, by step 3 glass support plate remove after, fingerprint recognition chip, ceramic cover plate, flexible PCB and data processing chip are fitted together, the soldered ball of data processing chip with fingerprint recognition chip are electrically connected.
In technique scheme, further improved plan is as follows:
1., in such scheme, the upper surface that described lug boss contacts with transparent cover plate circumferentially offers v-depression.
2., in such scheme, described guard metal layer is nickel-gold layer or nickel palladium layers.
3., in such scheme, described flexible PCB and data processing chip are positioned at same plane.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
1. the present invention is used for the packaging technology of novel finger print lock device, it forms a set of new technological process by after wafer stage chip encapsulation and silicon through hole Technology Integration, directly save conventional package routing step, decrease holder and FPC equal thickness, product gross thickness is reduced greatly, the use of this technology makes the solid that can have 0.4mm in the packaging body of 0.5mm, is conducive to meeting industrial design moulding and realizes enough product strengths, finally having increased substantially product reliability.
2. the present invention is used for the packaging technology of novel finger print lock device, its fingerprint recognition chip, ceramic cover plate, flexible PCB and data processing chip, high dielectric constant layer is provided with between the induction zone of described fingerprint recognition chip and ceramic cover plate, described flexible PCB and data processing chip are all electrically connected fingerprint recognition chip, data processing chip is directly mounted this kind of module group assembling structure on fingerprint chip simpler in manufacturing process, data processing chip is directly directly connected with fingerprint chip and strengthens data processing speed and electrical stability, also improve attachment efficiency.
3. the present invention is used for the packaging technology of novel finger print lock device, its aluminum pad extends in the middle part of blind hole from blind via bottom, in blind hole, aluminium welding pad surface is filled with nickel metal layer, this nickel metal layer extends to fingerprint recognition chip upper surface and forms projection in the middle part of blind hole, form pad thickened section, wafer aluminium PAD is avoided to be directly exposed in air, increase interconnecting lead contact area and improve wire connective stability and reliability, adopt the advanced technology of WLCSP-TSV, overcome the deficiency that traditional fingerprint recognition chip package is thicker, achieve low-power consumption, small size and high efficiency integral fingerprint recognition.
4. the present invention is used for the packaging technology of novel finger print lock device, its fingerprint recognition chip lower surface, the first tapered blind hole, the second tapered blind hole surface have insulating barrier, several triconic blind holes are offered bottom described second tapered blind hole, be positioned at above fingerprint recognition chip, the first tapered blind hole, the second tapered blind hole and triconic blind hole and there is titanium conductive pattern layer, copper metallic conductive pattern layer successively, both the adhesion of metal level and Si substrate had been added, by the electron transfer prevented between copper and silicon.
5. the present invention be used for novel finger print lock device packaging technology, its in order to reduce sliver and each operation safety in production, we increase the bonding glass substrate of a temporary support before wafer thinning process, product encapsulated cut before separate bonding substrate again.By this safeguard measure, greatly reduce sliver rate, improving product yield; Secondly, copper metallic conductive pattern layer is formed by 2 kinds of techniques and reaches better track stability and reliability.
Accompanying drawing explanation
Accompanying drawing 1 is the novel Fingerprint Lock semiconductor device partial structurtes schematic diagram one of the present invention;
Accompanying drawing 2 is the novel Fingerprint Lock semiconductor device partial structurtes schematic diagram two of the present invention;
Accompanying drawing 3 is A place partial structurtes enlarged diagram in accompanying drawing 2;
Accompanying drawing 4 is the plan structure schematic diagram of accompanying drawing 3;
Accompanying drawing 5 is the novel Fingerprint Lock semiconductor device structure schematic diagram of the present invention;
Accompanying drawing 6A ~ J is the packaging technology flow chart of the present invention for novel finger print lock device.
In above accompanying drawing: 1, fingerprint recognition chip; 2, blind hole; 3, aluminum pad; 4, nickel metal layer; 5, pad thickened section; 6, the first tapered blind hole; 7, the second tapered blind hole; 8, insulating barrier; 9, triconic blind hole; 10, titanium conductive pattern layer; 11, copper metallic conductive pattern layer; 12, welding resisting layer; 13, through hole; 14, soldered ball; 15, ceramic cover plate; 16, flexible PCB; 17, data processing chip; 18, high dielectric constant layer.
Embodiment
Below in conjunction with embodiment, the invention will be further described:
Embodiment 1: a kind of packaging technology for novel finger print lock device, described novel finger print lock device comprises fingerprint recognition chip 1, ceramic cover plate 15, flexible PCB 16 and data processing chip 17, be provided with high dielectric constant layer 18 between the induction zone of described fingerprint recognition chip 1 and ceramic cover plate 2, described flexible PCB 16 and data processing chip 17 are all electrically connected fingerprint recognition chip 1;
This fingerprint recognition chip 1 upper surface is distributed with several blind holes 2, in the blind hole 2 of described fingerprint recognition chip 1, there is aluminum pad 3, this aluminum pad 3 extends in the middle part of blind hole 2 bottom blind hole 2, in blind hole 2, aluminium welding pad 3 surface is filled with nickel metal layer 4, this nickel metal layer 4 extends to fingerprint recognition chip 1 upper surface and forms projection in the middle part of blind hole 2, forms pad thickened section 5;
Described fingerprint recognition chip 1 lower surface also has the first tapered blind hole 6, second tapered blind hole 7 successively with blind hole 2 opposite region ecto-entad, second tapered blind hole 7 is positioned at the bottom of the first tapered blind hole 6, the cross section of described first tapered blind hole 6, second tapered blind hole 7 is taper, the opening of the second tapered blind hole 7 is less than the opening of the first tapered blind hole 6, is the aluminum pad 3 of fingerprint recognition chip 1 bottom this second tapered blind hole 7;
Described fingerprint recognition chip 1 lower surface, first tapered blind hole 6, second tapered blind hole 7 surface has insulating barrier 8, several triconic blind holes 9 are offered bottom described second tapered blind hole 7, be positioned at fingerprint recognition chip 1, first tapered blind hole 6, above second tapered blind hole 7 and triconic blind hole 9, there is titanium conductive pattern layer 10 successively, copper metallic conductive pattern layer 11, this titanium conductive pattern layer 10, copper metallic conductive pattern layer 11 is positioned at insulating barrier 8 surface opposing with fingerprint recognition chip 1, one welding resisting layer 12 is positioned at copper metallic conductive pattern layer 11 surface opposing with titanium conductive pattern layer 10, this welding resisting layer 12 has several through holes 13, one soldered ball 14 is electrically connected with copper metallic conductive pattern layer 11 by described through hole 13,
Described flexible PCB 16 and data processing chip 17 are all electrically connected the soldered ball 12 of fingerprint recognition chip 1; Above-mentioned pad thickened section 5 thickness is 2 microns;
Described novel finger print lock device is obtained by following manufacturing process, comprises the following steps:
Step one, in the blind hole 2 of described fingerprint recognition chip 1, nickel metal layer 4 is filled on aluminium welding pad 3 surface, thus upper surface form projection, form pad thickened section 5;
Step 2, on the fingerprint recognition chip 1 upper surface coating method with pad thickened section 5 ephemeral key rubber alloy layer;
Step 3, the upper surface that a glass support plate 19 has pad thickened section 5 by ephemeral key rubber alloy layer 20 and fingerprint recognition chip 1 to be bonded;
Step 4, by thinning for the lower surface opposing with fingerprint recognition chip 1 upper surface, thus by fingerprint recognition chip 1 reduced thickness to 150 ~ 300 microns;
Step 5, realize described first tapered blind hole 6, second tapered blind hole 7 and triconic blind hole 9 from fingerprint recognition chip 1 lower surface successively by progressively to etch;
Step 6, by magnetron sputtering sputter one titanium conductive pattern layer 10 above fingerprint recognition chip 1, first tapered blind hole 6, second tapered blind hole 7 and triconic blind hole 9;
Step 7, by magnetron sputtering in titanium conductive pattern layer 10 surperficial sputter one layers of copper;
Step 8, by plating at the layers of copper surface deposition one bronze medal thickening layer of step 7, thus form copper metallic conductive pattern layer 11;
Step 9, by after glass support plate 19 is removed in step 3, fingerprint recognition chip 1, ceramic cover plate 15, flexible PCB 16 and data processing chip 17 are fitted together, data processing chip 17 is electrically connected with the soldered ball 12 of fingerprint recognition chip 1.
Embodiment 2: a kind of packaging technology for novel finger print lock device, described novel finger print lock device comprises fingerprint recognition chip 1, ceramic cover plate 15, flexible PCB 16 and data processing chip 17, be provided with high dielectric constant layer 18 between the induction zone of described fingerprint recognition chip 1 and ceramic cover plate 2, described flexible PCB 16 and data processing chip 17 are all electrically connected fingerprint recognition chip 1;
This fingerprint recognition chip 1 upper surface is distributed with several blind holes 2, in the blind hole 2 of described fingerprint recognition chip 1, there is aluminum pad 3, this aluminum pad 3 extends in the middle part of blind hole 2 bottom blind hole 2, in blind hole 2, aluminium welding pad 3 surface is filled with nickel metal layer 4, this nickel metal layer 4 extends to fingerprint recognition chip 1 upper surface and forms projection in the middle part of blind hole 2, forms pad thickened section 5;
Described fingerprint recognition chip 1 lower surface also has the first tapered blind hole 6, second tapered blind hole 7 successively with blind hole 2 opposite region ecto-entad, second tapered blind hole 7 is positioned at the bottom of the first tapered blind hole 6, the cross section of described first tapered blind hole 6, second tapered blind hole 7 is taper, the opening of the second tapered blind hole 7 is less than the opening of the first tapered blind hole 6, is the aluminum pad 3 of fingerprint recognition chip 1 bottom this second tapered blind hole 7;
Described fingerprint recognition chip 1 lower surface, first tapered blind hole 6, second tapered blind hole 7 surface has insulating barrier 8, several triconic blind holes 9 are offered bottom described second tapered blind hole 7, be positioned at fingerprint recognition chip 1, first tapered blind hole 6, above second tapered blind hole 7 and triconic blind hole 9, there is titanium conductive pattern layer 10 successively, copper metallic conductive pattern layer 11, this titanium conductive pattern layer 10, copper metallic conductive pattern layer 11 is positioned at insulating barrier 8 surface opposing with fingerprint recognition chip 1, one welding resisting layer 12 is positioned at copper metallic conductive pattern layer 11 surface opposing with titanium conductive pattern layer 10, this welding resisting layer 12 has several through holes 13, one soldered ball 14 is electrically connected with copper metallic conductive pattern layer 11 by described through hole 13,
Described flexible PCB 16 and data processing chip 17 are all electrically connected the soldered ball 12 of fingerprint recognition chip 1.
Above-mentioned pad thickened section 5 thickness is 3.2 microns.In above-mentioned second tapered blind hole 7, there are four triconic blind holes 9.
Described novel finger print lock device is obtained by following manufacturing process, comprises the following steps:
Step one, in the blind hole 2 of described fingerprint recognition chip 1, nickel metal layer 4 is filled on aluminium welding pad 3 surface, thus upper surface form projection, form pad thickened section 5;
Step 2, on the fingerprint recognition chip 1 upper surface coating method with pad thickened section 5 ephemeral key rubber alloy layer;
Step 3, the upper surface that a glass support plate 19 has pad thickened section 5 by ephemeral key rubber alloy layer 20 and fingerprint recognition chip 1 to be bonded;
Step 4, by thinning for the lower surface opposing with fingerprint recognition chip 1 upper surface, thus by fingerprint recognition chip 1 reduced thickness to 150 ~ 300 microns;
Step 5, realize described first tapered blind hole 6, second tapered blind hole 7 and triconic blind hole 9 from fingerprint recognition chip 1 lower surface successively by progressively to etch;
Step 6, by magnetron sputtering sputter one titanium conductive pattern layer 10 above fingerprint recognition chip 1, first tapered blind hole 6, second tapered blind hole 7 and triconic blind hole 9;
Step 7, by magnetron sputtering in titanium conductive pattern layer 10 surperficial sputter one layers of copper;
Step 8, by plating at the layers of copper surface deposition one bronze medal thickening layer of step 7, thus form copper metallic conductive pattern layer 11;
Step 9, by step 3 glass support plate remove after, fingerprint recognition chip 1, ceramic cover plate 15, flexible PCB 16 and data processing chip 17 are fitted together; Described flexible PCB 16 and data processing chip 17 are positioned at same plane, are electrically connected by data processing chip 17 with the soldered ball 12 of fingerprint recognition chip 1.
When adopting the above-mentioned packaging technology for novel finger print lock device, it forms a set of new technological process by after wafer stage chip encapsulation and silicon through hole technology Technology Integration, directly save conventional package routing step, decrease holder and FPC equal thickness, product gross thickness is reduced greatly, the use of this technology makes the solid that can have 0.4mm in the packaging body of 0.5mm, is conducive to meeting industrial design moulding and realizes enough product strengths, finally having increased substantially product reliability.
Above-described embodiment, only for technical conceive of the present invention and feature are described, its object is to person skilled in the art can be understood content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences done according to Spirit Essence of the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (4)
1. the packaging technology for novel finger print lock device, it is characterized in that: described novel finger print lock device comprises fingerprint recognition chip (1), ceramic cover plate (15), flexible PCB (16) and data processing chip (17), be provided with high dielectric constant layer (18) between the induction zone of described fingerprint recognition chip (1) and ceramic cover plate (2), described flexible PCB (16) and data processing chip (17) are all electrically connected fingerprint recognition chip (1);
This fingerprint recognition chip (1) upper surface is distributed with several blind holes (2), in the blind hole (2) of described fingerprint recognition chip (1), there is aluminum pad (3), this aluminum pad (3) extends to blind hole (2) middle part from blind hole (2) bottom, blind hole (2) interior aluminium welding pad (3) surface is filled with nickel metal layer (4), this nickel metal layer (4) extends to fingerprint recognition chip (1) upper surface from blind hole (2) middle part and forms projection, forms pad thickened section (5);
Described fingerprint recognition chip (1) lower surface also has the first tapered blind hole (6), the second tapered blind hole (7) successively with blind hole (2) opposite region ecto-entad, second tapered blind hole (7) is positioned at the bottom of the first tapered blind hole (6), the cross section of described first tapered blind hole (6), the second tapered blind hole (7) is taper, the opening of the second tapered blind hole (7) is less than the opening of the first tapered blind hole (6), and this second tapered blind hole (7) bottom is the aluminum pad (3) of fingerprint recognition chip (1);
Described fingerprint recognition chip (1) lower surface, first tapered blind hole (6), second tapered blind hole (7) surface has insulating barrier (8), described second tapered blind hole (7) bottom offers several triconic blind holes (9), be positioned at fingerprint recognition chip (1), first tapered blind hole (6), second tapered blind hole (7) and triconic blind hole (9) top have titanium conductive pattern layer (10) successively, copper metallic conductive pattern layer (11), this titanium conductive pattern layer (10), copper metallic conductive pattern layer (11) is positioned at insulating barrier (8) surface opposing with fingerprint recognition chip (1), one welding resisting layer (12) is positioned at copper metallic conductive pattern layer (11) surface opposing with titanium conductive pattern layer (10), this welding resisting layer (12) has several through holes (13), one soldered ball (14) is electrically connected with copper metallic conductive pattern layer (11) by described through hole (13), described flexible PCB (16) and data processing chip (17) are all electrically connected the soldered ball (12) of fingerprint recognition chip (1),
Described novel finger print lock device is obtained by following manufacturing process, comprises the following steps:
Step one, in the blind hole (2) of described fingerprint recognition chip (1), nickel metal layer (4) is filled on aluminium welding pad (3) surface, thus upper surface form projection, form pad thickened section (5);
Step 2, on fingerprint recognition chip (1) the upper surface coating method with pad thickened section (5) ephemeral key rubber alloy layer;
Step 3, the upper surface that a glass support plate (19) has pad thickened section (5) by ephemeral key rubber alloy layer (20) and fingerprint recognition chip (1) to be bonded;
Step 4, lower surface that will be opposing with fingerprint recognition chip (1) upper surface are thinning, thus by fingerprint recognition chip (1) reduced thickness to 150 ~ 300 microns;
Step 5, realize described first tapered blind hole (6), the second tapered blind hole (7) and triconic blind hole (9) from fingerprint recognition chip (1) lower surface successively by progressively to etch;
Step 6, by magnetron sputtering fingerprint recognition chip (1), the first tapered blind hole (6), the second tapered blind hole (7) and triconic blind hole (9) top sputter one titanium conductive pattern layer (10);
Step 7, by magnetron sputtering in titanium conductive pattern layer (10) surperficial sputter one layers of copper;
Step 8, by plating at the layers of copper surface deposition one bronze medal thickening layer of step 7, thus form copper metallic conductive pattern layer (11);
Step 9, by step 3 glass support plate remove after, fingerprint recognition chip (1), ceramic cover plate (15), flexible PCB (16) and data processing chip (17) are fitted together, data processing chip (17) is electrically connected with the soldered ball (12) of fingerprint recognition chip (1).
2. the packaging technology for novel finger print lock device according to claim 1, is characterized in that: described pad thickened section (5) thickness is 3 ~ 4 microns.
3. the packaging technology for novel finger print lock device according to claim 1, is characterized in that: have at least three triconic blind holes (9) in described second tapered blind hole (7).
4. the packaging technology for novel finger print lock device according to claim 1, is characterized in that: described flexible PCB (16) and data processing chip (17) are positioned at same plane.
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106229325A (en) * | 2016-09-21 | 2016-12-14 | 苏州科阳光电科技有限公司 | Sensor module and preparation method thereof |
| CN106548927A (en) * | 2016-11-03 | 2017-03-29 | 苏州晶方半导体科技股份有限公司 | The method for packing and encapsulating structure of fingerprint recognition chip |
| CN106650702A (en) * | 2017-01-05 | 2017-05-10 | 深圳市深越光电技术有限公司 | Processing method for fingerprint identification apparatus, and fingerprint identification apparatus |
| CN106653616A (en) * | 2016-11-22 | 2017-05-10 | 苏州晶方半导体科技股份有限公司 | Encapsulation method and encapsulation structure of fingerprint sensor chip |
| CN106650552A (en) * | 2015-10-30 | 2017-05-10 | 深圳指芯智能科技有限公司 | Metal ring for fingerprint identification sensor, and preparation method and application thereof |
| CN107680911A (en) * | 2017-11-06 | 2018-02-09 | 苏州科阳光电科技有限公司 | A kind of fingerprint recognition modular structure and preparation method, terminal device |
| CN109830890A (en) * | 2019-01-15 | 2019-05-31 | 华天慧创科技（西安）有限公司 | The encapsulating structure and packaging method of a kind of chip module, wafer stage chip |
| CN110738074A (en) * | 2018-07-18 | 2020-01-31 | 上海箩箕技术有限公司 | Optical fingerprint sensor module and forming method thereof |
| WO2020206966A1 (en) * | 2019-04-10 | 2020-10-15 | 深圳市汇顶科技股份有限公司 | Optical fingerprint apparatus and electronic device |
| WO2022227346A1 (en) * | 2021-04-30 | 2022-11-03 | 深圳市汇顶科技股份有限公司 | Capacitance sensor and manufacturing method therefor |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040251525A1 (en) * | 2003-06-16 | 2004-12-16 | Shellcase Ltd. | Methods and apparatus for packaging integrated circuit devices |
| TWI242851B (en) * | 2004-04-28 | 2005-11-01 | Advanced Semiconductor Eng | Fingerprint sensor package |
| US7315070B2 (en) * | 2004-06-01 | 2008-01-01 | Fujitsu Limited | Fingerprint sensor package |
| CN101419952A (en) * | 2008-12-03 | 2009-04-29 | 晶方半导体科技（苏州）有限公司 | Wafer stage chip encapsulation method and encapsulation construction |
| CN101800207A (en) * | 2010-03-12 | 2010-08-11 | 晶方半导体科技（苏州）有限公司 | Packaging structure of semiconductor element and manufacture method thereof |
| CN102509718A (en) * | 2011-12-15 | 2012-06-20 | 中国科学院上海微系统与信息技术研究所 | Wafer-level chip size encapsulation technology for GaAs (gallium arsenide) CCD (Charge Coupled Device) image sensor |
| CN102810549A (en) * | 2012-08-29 | 2012-12-05 | 格科微电子（上海）有限公司 | Method for manufacturing wafer-level packages of image sensors |
| CN203910778U (en) * | 2014-05-23 | 2014-10-29 | 新东亚微电子股份有限公司 | Fingerprint identification chip packaging module |
-
2015
- 2015-02-28 CN CN201510091436.0A patent/CN104681454B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040251525A1 (en) * | 2003-06-16 | 2004-12-16 | Shellcase Ltd. | Methods and apparatus for packaging integrated circuit devices |
| TWI242851B (en) * | 2004-04-28 | 2005-11-01 | Advanced Semiconductor Eng | Fingerprint sensor package |
| US7315070B2 (en) * | 2004-06-01 | 2008-01-01 | Fujitsu Limited | Fingerprint sensor package |
| CN101419952A (en) * | 2008-12-03 | 2009-04-29 | 晶方半导体科技（苏州）有限公司 | Wafer stage chip encapsulation method and encapsulation construction |
| CN101800207A (en) * | 2010-03-12 | 2010-08-11 | 晶方半导体科技（苏州）有限公司 | Packaging structure of semiconductor element and manufacture method thereof |
| CN102509718A (en) * | 2011-12-15 | 2012-06-20 | 中国科学院上海微系统与信息技术研究所 | Wafer-level chip size encapsulation technology for GaAs (gallium arsenide) CCD (Charge Coupled Device) image sensor |
| CN102810549A (en) * | 2012-08-29 | 2012-12-05 | 格科微电子（上海）有限公司 | Method for manufacturing wafer-level packages of image sensors |
| CN203910778U (en) * | 2014-05-23 | 2014-10-29 | 新东亚微电子股份有限公司 | Fingerprint identification chip packaging module |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106650552A (en) * | 2015-10-30 | 2017-05-10 | 深圳指芯智能科技有限公司 | Metal ring for fingerprint identification sensor, and preparation method and application thereof |
| CN106650552B (en) * | 2015-10-30 | 2019-09-13 | 深圳指芯智能科技有限公司 | A kind of fingerprint Identification sensor becket and its preparation method and application |
| CN106229325A (en) * | 2016-09-21 | 2016-12-14 | 苏州科阳光电科技有限公司 | Sensor module and preparation method thereof |
| CN106548927A (en) * | 2016-11-03 | 2017-03-29 | 苏州晶方半导体科技股份有限公司 | The method for packing and encapsulating structure of fingerprint recognition chip |
| US10497728B2 (en) | 2016-11-22 | 2019-12-03 | China Wafer Level Csp Co., Ltd. | Fingerprint sensing chip packaging method and fingerprint sensing chip package |
| CN106653616A (en) * | 2016-11-22 | 2017-05-10 | 苏州晶方半导体科技股份有限公司 | Encapsulation method and encapsulation structure of fingerprint sensor chip |
| CN106650702A (en) * | 2017-01-05 | 2017-05-10 | 深圳市深越光电技术有限公司 | Processing method for fingerprint identification apparatus, and fingerprint identification apparatus |
| CN107680911A (en) * | 2017-11-06 | 2018-02-09 | 苏州科阳光电科技有限公司 | A kind of fingerprint recognition modular structure and preparation method, terminal device |
| CN110738074A (en) * | 2018-07-18 | 2020-01-31 | 上海箩箕技术有限公司 | Optical fingerprint sensor module and forming method thereof |
| CN110738074B (en) * | 2018-07-18 | 2024-02-27 | 上海箩箕技术有限公司 | Optical fingerprint sensor module and forming method thereof |
| CN109830890A (en) * | 2019-01-15 | 2019-05-31 | 华天慧创科技（西安）有限公司 | The encapsulating structure and packaging method of a kind of chip module, wafer stage chip |
| CN109830890B (en) * | 2019-01-15 | 2021-10-22 | 华天慧创科技（西安）有限公司 | Chip module, wafer-level chip packaging structure and packaging method |
| WO2020206966A1 (en) * | 2019-04-10 | 2020-10-15 | 深圳市汇顶科技股份有限公司 | Optical fingerprint apparatus and electronic device |
| US11321957B2 (en) | 2019-04-10 | 2022-05-03 | Shenzhen GOODIX Technology Co., Ltd. | Optical fingerprint apparatus and electronic device |
| WO2022227346A1 (en) * | 2021-04-30 | 2022-11-03 | 深圳市汇顶科技股份有限公司 | Capacitance sensor and manufacturing method therefor |
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