CN104681454B - The packaging technology of device is locked for novel finger print - Google Patents
The packaging technology of device is locked for novel finger print Download PDFInfo
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- CN104681454B CN104681454B CN201510091436.0A CN201510091436A CN104681454B CN 104681454 B CN104681454 B CN 104681454B CN 201510091436 A CN201510091436 A CN 201510091436A CN 104681454 B CN104681454 B CN 104681454B
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Abstract
The present invention discloses a kind of packaging technology that device is locked for novel finger print, including fingerprint recognition chip, ceramic cover plate, flexible PCB and data processing chip, nickel metal layer is filled on aluminium welding pad surface in the blind hole of fingerprint recognition chip, so as to upper surface and form projection, forms pad thickened section；The ephemeral key rubber alloy layer on the fingerprint recognition chip upper surface coating method with pad thickened section；The upper surface that one glass support plate has pad thickened section by ephemeral key rubber alloy layer and fingerprint recognition chip is bonded；The lower surface opposite with fingerprint recognition chip upper surface is thinned, so that fingerprint recognition chip thickness is thinned into 150 ~ 300 microns；First tapered blind hole, the second tapered blind hole and triconic blind hole are realized successively from fingerprint recognition chip lower surface by progressively etching.The present invention will form a set of new technological process after wafer stage chip encapsulation and silicon hole Technology Integration, reduces thickness, substantially reduces product gross thickness, product reliability is greatly improved.
Description
Technical field
The present invention relates to a kind of packaging technology that device is locked for novel finger print, belong to technical field of semiconductor encapsulation.
Background technology
In terms of the advanced package technologies of fingerprint chip, in the iPhone5S and its supporting Touch of American apple company
After the issue of ID fingerprint identification technologies, it is disclosed after a kind of brand-new fingerprint identification technology issue, and it discloses a kind of brand-new
Fingerprint recognition chip, which employs first carrying out grooving in the side of every chips using Wafer level packaging, and reforms weld pad,
Later stage uses known low camber（low loop height）Wire soldering technology completes module packaging, is mixed to reduce module height
The bridge technology of wafer-level packaging and conventional package is closed.The Touch ID encapsulating structures that Apple Inc.'s patent text is announced,
Realized using bonding wire mode, simply carried out grooving on the chip surface, to reduce module height after bonding wire, therefore referred to advanced
In the encapsulation technology of line chip, the real fingerprint recognition chip using wafer scale TSV encapsulation technologies has not yet been viewed in the market
Packing forms and patent.
How by the Wafer level packaging of existing image sensor dice, again for the tool of fingerprint recognition chip package
Body specification requirement, the brand-new complete packaging technology of exploitation has been fingerprint recognition chip package application extension new technique direction, into
The direction made great efforts for those of ordinary skill in the art.
The content of the invention
It is an object of the present invention to provide a kind of packaging technology that device is locked for novel finger print, this is used for novel finger print lock device
Packaging technology by wafer stage chip encapsulation and silicon hole Technology Integration after form a set of new technological process, directly save tradition
Packaging and routing step, reduces holder and FPC equal thickness, substantially reduces product gross thickness, the technology use so that
There can be 0.4mm solid in 0.5mm packaging body, be conducive to meeting industrial design moulding and realize that enough products are strong
Degree, is finally greatly improved product reliability.
To reach above-mentioned purpose, the technical solution adopted by the present invention is：A kind of encapsulation work that device is locked for novel finger print
Skill, the novel finger print lock device includes fingerprint recognition chip, ceramic cover plate, flexible PCB and data processing chip, the finger
High dielectric constant layer, the flexible PCB and data processing core are provided between the induction zone and ceramic cover plate of line identification chip
Piece electrically connects fingerprint recognition chip；
This fingerprint recognition chip upper surface, which is distributed with several blind holes, the blind hole of the fingerprint recognition chip, has aluminium weldering
Disk, this aluminum pad is extended in the middle part of blind hole from blind via bottom, and aluminium welding pad surface is filled with nickel metal layer, this nickel metal layer in blind hole
Fingerprint recognition chip upper surface is extended in the middle part of from blind hole and projection is formed, and forms pad thickened section；
The fingerprint recognition chip lower surface simultaneously has the first tapered blind hole, the successively with blind hole opposite region ecto-entad
Two tapered blind holes, the second tapered blind hole is located at the bottom of the first tapered blind hole, first tapered blind hole, the second tapered blind hole
Section is taper, and the opening of the second tapered blind hole is less than the opening of the first tapered blind hole, and this second tapered blind hole bottom is fingerprint
The aluminum pad of identification chip；
The fingerprint recognition chip lower surface, the first tapered blind hole, the second tapered blind hole surface have insulating barrier, described
Two taper blind via bottoms offer several triconic blind holes, positioned at fingerprint recognition chip, the first tapered blind hole, the second taper
There is titanium conductive pattern layer, copper metal conductive pattern layer successively, this titanium is conductive above blind hole and triconic blind hole
Graph layer, copper metal conductive pattern layer are located at the insulating barrier surface opposite with fingerprint recognition chip, and a welding resisting layer is located at copper metal
Several through holes are provided with the conductive pattern layer surface opposite with titanium conductive pattern layer, this welding resisting layer, a soldered ball passes through institute
Through hole is stated to electrically connect with copper metal conductive pattern layer；The flexible PCB and data processing chip electrically connect fingerprint recognition core
The soldered ball of piece；
The novel finger print lock device is obtained by following manufacturing process, is comprised the following steps：
Step 1: nickel metal layer is filled on aluminium welding pad surface in the blind hole of the fingerprint recognition chip, so that upper surface is simultaneously
Form raised, form pad thickened section；
Step 2: on the fingerprint recognition chip upper surface coating method with pad thickened section ephemeral key rubber alloy layer；
Step 3: one glass support plate is had into the upper of pad thickened section with fingerprint recognition chip by ephemeral key rubber alloy layer
Surface bonding；
Step 4: the lower surface opposite with fingerprint recognition chip upper surface is thinned, so that by fingerprint recognition chip thickness
It is thinned to 150 ~ 300 microns；
Step 5: realizing first tapered blind hole, second successively from fingerprint recognition chip lower surface by progressively etching
Tapered blind hole and triconic blind hole；
Step 6: by magnetron sputtering in fingerprint recognition chip, the first tapered blind hole, the second tapered blind hole and triconic
The titanium conductive pattern layer of sputter one above blind hole；
Step 7: by magnetron sputtering in the layers of copper of titanium conductive pattern layer surface sputter one；
Step 8: a bronze medal thickening layer is deposited on the layers of copper surface of step 7 by electroplating, so as to form copper metal conductive pattern
Shape layer；
Step 9: by step 3 glass support plate remove after, by fingerprint recognition chip, ceramic cover plate, flexible PCB and
Data processing chip is fitted together, and data processing chip is electrically connected with the soldered ball of fingerprint recognition chip.
Further improved scheme is as follows in above-mentioned technical proposal：
1. in such scheme, the upper surface that the lug boss is contacted with transparent cover plate circumferentially offers v-depression.
2. in such scheme, the guard metal layer is nickel-gold layer or nickel palladium layers.
3. in such scheme, the flexible PCB and data processing chip are generally aligned in the same plane.
Because above-mentioned technical proposal is used, the present invention has following advantages and effect compared with prior art：
1. the present invention locks the packaging technology of device for novel finger print, it encapsulates wafer stage chip and silicon hole technology
A set of new technological process is formed after integration, conventional package routing step is directly saved, reduces holder and FPC equal thickness,
Substantially reduce product gross thickness, the technology is used so that there can be 0.4mm solid in 0.5mm packaging body, favorably
In meeting industrial design moulding and realizing enough product strengths, product reliability is finally greatly improved.
2. the present invention locks the packaging technology of device, its fingerprint recognition chip, ceramic cover plate, flexible PCB for novel finger print
Plate and data processing chip, are provided with high dielectric constant layer, institute between the induction zone and ceramic cover plate of the fingerprint recognition chip
State flexible PCB and data processing chip and electrically connect fingerprint recognition chip, by data processing chip directly against being attached to fingerprint core
Such a module group assembling structure is simpler in manufacturing process on piece, and data processing chip is directly joined directly together increasing with fingerprint chip
Strong data processing speed and electrical stability, also improve attachment efficiency.
3. the present invention locks the packaging technology of device for novel finger print, its aluminum pad is from blind via bottom extends to blind hole
Aluminium welding pad surface is filled with nickel metal layer in portion, blind hole, and this nickel metal layer extends to fingerprint recognition chip upper table in the middle part of blind hole
Face simultaneously forms projection, forms pad thickened section, it is to avoid wafer aluminium PAD is directly exposed in air, increases interconnecting lead contact surface
Product improves wire connective stability and reliability, using WLCSP-TSV advanced technology, overcomes traditional fingerprint recognition chip
The thicker deficiency of encapsulation, realizes low-power consumption, small size and high efficiency integral fingerprint recognition.
4. the present invention locks the packaging technology of device for novel finger print, its fingerprint recognition chip lower surface, the first taper are blind
Hole, the second tapered blind hole surface have insulating barrier, and the second tapered blind hole bottom offers several triconic blind holes, position
Have titanium conductive successively above fingerprint recognition chip, the first tapered blind hole, the second tapered blind hole and triconic blind hole
Graph layer, copper metal conductive pattern layer, had both added the adhesion of metal level and Si substrates, by preventing the electricity between copper and silicon
Son migration.
5. the present invention locks the packaging technology of device for novel finger print, it is raw safely in order to reduce sliver and each process
Production, we increase the bonding glass substrate of a temporary support before wafer thinning process, before product has been encapsulated and cut
Bonding substrate is solved again.By this safeguard measure, sliver rate is substantially reduced, product yield is lifted；Secondly, copper metal conductive pattern
Layer reaches more preferable track stability and reliability by 2 kinds of technique formation.
Brief description of the drawings
Accompanying drawing 1 is the new Fingerprint Lock semiconductor devices partial structural diagram one of the present invention；
Accompanying drawing 2 is the new Fingerprint Lock semiconductor devices partial structural diagram two of the present invention；
Accompanying drawing 3 is partial structurtes enlarged diagram at A in accompanying drawing 2；
Accompanying drawing 4 is the overlooking the structure diagram of accompanying drawing 3；
Accompanying drawing 5 is the new Fingerprint Lock semiconductor device structure schematic diagram of the present invention；
Accompanying drawing 6A ~ J locks the packaging technology flow figure of device for the present invention for novel finger print.
In the figures above：1st, fingerprint recognition chip；2nd, blind hole；3rd, aluminum pad；4th, nickel metal layer；5th, pad thickened section；6、
First tapered blind hole；7th, the second tapered blind hole；8th, insulating barrier；9th, triconic blind hole；10th, titanium conductive pattern layer；11st, copper
Metallic conductive pattern layer；12nd, welding resisting layer；13rd, through hole；14th, soldered ball；15th, ceramic cover plate；16th, flexible PCB；17th, data processing
Chip；18th, high dielectric constant layer.
Embodiment
With reference to embodiment, the invention will be further described：
Embodiment 1：A kind of packaging technology that device is locked for novel finger print, the novel finger print lock device is known including fingerprint
Other chip 1, ceramic cover plate 15, flexible PCB 16 and data processing chip 17, the induction zone and pottery of the fingerprint recognition chip 1
High dielectric constant layer 18 is provided between porcelain cover plate 15, the flexible PCB 16 and data processing chip 17 electrically connect fingerprint
Identification chip 1；
This upper surface of fingerprint recognition chip 1, which is distributed with several blind holes 2, the blind hole 2 of the fingerprint recognition chip 1, to be had
Aluminum pad 3, this aluminum pad 3 extends to the surface of aluminium welding pad 3 in the middle part of blind hole 2, blind hole 2 from the bottom of blind hole 2 and is filled with nickel metal layer
4, this nickel metal layer 4 extends to the upper surface of fingerprint recognition chip 1 from the middle part of blind hole 2 and forms projection, forms pad thickened section 5；
The lower surface of fingerprint recognition chip 1 simultaneously has the first tapered blind hole successively with the opposite region ecto-entad of blind hole 2
6th, the second tapered blind hole 7, the second tapered blind hole 7 is located at the bottom of the first tapered blind hole 6, and first tapered blind hole 6, second is bored
The section of shape blind hole 7 is taper, opening of the opening less than the first tapered blind hole 6 of the second tapered blind hole 7, this second tapered blind hole
7 bottoms are the aluminum pad 3 of fingerprint recognition chip 1；
The lower surface of fingerprint recognition chip 1, the first tapered blind hole 6, the surface of the second tapered blind hole 7 have insulating barrier 8, institute
State the bottom of the second tapered blind hole 7 and offer several triconic blind holes 9, positioned at fingerprint recognition chip 1, the first tapered blind hole 6,
Second tapered blind hole 7 and the top of triconic blind hole 9 have titanium conductive pattern layer 10, copper metal conductive pattern layer successively
11, this titanium conductive pattern layer 10, copper metal conductive pattern layer 11 are located at the table opposite with fingerprint recognition chip 1 of insulating barrier 8
Face a, welding resisting layer 12 is located at the surface opposite with titanium conductive pattern layer 10 of copper metal conductive pattern layer 11, this welding resisting layer 12
On be provided with several through holes 13, a soldered ball 14 is electrically connected by the through hole 13 with copper metal conductive pattern layer 11；
The flexible PCB 16 and data processing chip 17 electrically connect the soldered ball 14 of fingerprint recognition chip 1；Above-mentioned pad
The thickness of thickened section 5 is 2 microns；
The novel finger print lock device is obtained by following manufacturing process, is comprised the following steps：
Step 1: nickel metal layer 4 is filled on the surface of aluminium welding pad 3 in the blind hole 2 of the fingerprint recognition chip 1, so that upper table
Face simultaneously forms projection, forms pad thickened section 5；
Step 2: on the upper surface coating method of fingerprint recognition chip 1 with pad thickened section 5 ephemeral key rubber alloy layer；
Step 3: a glass support plate 19 is thickened by ephemeral key rubber alloy layer 20 with fingerprint recognition chip 1 with pad
The upper surface bonding in portion 5；
Step 4: the lower surface opposite with the upper surface of fingerprint recognition chip 1 is thinned, so that fingerprint recognition chip 1 is thick
Degree is thinned to 150 ~ 300 microns；
Step 5: realizing first tapered blind hole 6, successively from the lower surface of fingerprint recognition chip 1 by progressively etching
Two tapered blind holes 7 and triconic blind hole 9；
Step 6: by magnetron sputtering in fingerprint recognition chip 1, the first tapered blind hole 6, the second tapered blind hole 7 and the 3rd
The titanium conductive pattern layer 10 of 9 top sputter of tapered blind hole one；
Step 7: by magnetron sputtering in the layers of copper of 10 surface sputter of titanium conductive pattern layer one；
Step 8: a bronze medal thickening layer is deposited on the layers of copper surface of step 7 by electroplating, so as to form copper metal conductive pattern
Shape layer 11；
Step 9: by after glass support plate 19 is removed in step 3, by fingerprint recognition chip 1, ceramic cover plate 15, flexible
Pcb board 16 and data processing chip 17 are fitted together, and the soldered ball 14 of data processing chip 17 and fingerprint recognition chip 1 is electrically connected
Connect.
Embodiment 2：A kind of packaging technology that device is locked for novel finger print, the novel finger print lock device is known including fingerprint
Other chip 1, ceramic cover plate 15, flexible PCB 16 and data processing chip 17, the induction zone and pottery of the fingerprint recognition chip 1
High dielectric constant layer 18 is provided between porcelain cover plate 15, the flexible PCB 16 and data processing chip 17 electrically connect fingerprint
Identification chip 1；
This upper surface of fingerprint recognition chip 1, which is distributed with several blind holes 2, the blind hole 2 of the fingerprint recognition chip 1, to be had
Aluminum pad 3, this aluminum pad 3 extends to the surface of aluminium welding pad 3 in the middle part of blind hole 2, blind hole 2 from the bottom of blind hole 2 and is filled with nickel metal layer
4, this nickel metal layer 4 extends to the upper surface of fingerprint recognition chip 1 from the middle part of blind hole 2 and forms projection, forms pad thickened section 5；
The lower surface of fingerprint recognition chip 1 simultaneously has the first tapered blind hole successively with the opposite region ecto-entad of blind hole 2
6th, the second tapered blind hole 7, the second tapered blind hole 7 is located at the bottom of the first tapered blind hole 6, and first tapered blind hole 6, second is bored
The section of shape blind hole 7 is taper, opening of the opening less than the first tapered blind hole 6 of the second tapered blind hole 7, this second tapered blind hole
7 bottoms are the aluminum pad 3 of fingerprint recognition chip 1；
The lower surface of fingerprint recognition chip 1, the first tapered blind hole 6, the surface of the second tapered blind hole 7 have insulating barrier 8, institute
State the bottom of the second tapered blind hole 7 and offer several triconic blind holes 9, positioned at fingerprint recognition chip 1, the first tapered blind hole 6,
Second tapered blind hole 7 and the top of triconic blind hole 9 have titanium conductive pattern layer 10, copper metal conductive pattern layer successively
11, this titanium conductive pattern layer 10, copper metal conductive pattern layer 11 are located at the table opposite with fingerprint recognition chip 1 of insulating barrier 8
Face a, welding resisting layer 12 is located at the surface opposite with titanium conductive pattern layer 10 of copper metal conductive pattern layer 11, this welding resisting layer 12
On be provided with several through holes 13, a soldered ball 14 is electrically connected by the through hole 13 with copper metal conductive pattern layer 11；
The flexible PCB 16 and data processing chip 17 electrically connect the soldered ball 14 of fingerprint recognition chip 1.
The above-mentioned thickness of pad thickened section 5 is 3.2 microns.There are four triconic blind holes in above-mentioned second tapered blind hole 7
9。
The novel finger print lock device is obtained by following manufacturing process, is comprised the following steps：
Step 1: nickel metal layer 4 is filled on the surface of aluminium welding pad 3 in the blind hole 2 of the fingerprint recognition chip 1, so that upper table
Face simultaneously forms projection, forms pad thickened section 5；
Step 2: on the upper surface coating method of fingerprint recognition chip 1 with pad thickened section 5 ephemeral key rubber alloy layer；
Step 3: a glass support plate 19 is thickened by ephemeral key rubber alloy layer 20 with fingerprint recognition chip 1 with pad
The upper surface bonding in portion 5；
Step 4: the lower surface opposite with the upper surface of fingerprint recognition chip 1 is thinned, so that fingerprint recognition chip 1 is thick
Degree is thinned to 150 ~ 300 microns；
Step 5: realizing first tapered blind hole 6, successively from the lower surface of fingerprint recognition chip 1 by progressively etching
Two tapered blind holes 7 and triconic blind hole 9；
Step 6: by magnetron sputtering in fingerprint recognition chip 1, the first tapered blind hole 6, the second tapered blind hole 7 and the 3rd
The titanium conductive pattern layer 10 of 9 top sputter of tapered blind hole one；
Step 7: by magnetron sputtering in the layers of copper of 10 surface sputter of titanium conductive pattern layer one；
Step 8: a bronze medal thickening layer is deposited on the layers of copper surface of step 7 by electroplating, so as to form copper metal conductive pattern
Shape layer 11；
Step 9: after glass support plate in step 3 is removed, by fingerprint recognition chip 1, ceramic cover plate 15, flexible PCB
Plate 16 and data processing chip 17 are fitted together；The flexible PCB 16 and data processing chip 17 are generally aligned in the same plane, will
Data processing chip 17 is electrically connected with the soldered ball 14 of fingerprint recognition chip 1.
Using it is above-mentioned for novel finger print lock device packaging technology when, its by wafer stage chip encapsulation and silicon hole technology
A set of new technological process is formed after Technology Integration, conventional package routing step is directly saved, reduces holder and FPC uniform thickness
Degree, substantially reduces product gross thickness, using so that can have 0.4mm solid in 0.5mm packaging body for the technology has
Beneficial to meeting industrial design moulding and realizing enough product strengths, product reliability is finally greatly improved.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar can understand present disclosure and implement according to this, and it is not intended to limit the scope of the present invention.It is all according to the present invention
The equivalent change or modification that Spirit Essence is made, should all be included within the scope of the present invention.
Claims (1)
1. a kind of packaging technology for Fingerprint Lock device, it is characterised in that：The Fingerprint Lock device includes fingerprint recognition chip
（1）, ceramic cover plate（15）, flexible PCB（16）And data processing chip（17）, the fingerprint recognition chip（1）Induction zone
With ceramic cover plate（15）Between be provided with high dielectric constant layer（18）, the flexible PCB（16）And data processing chip（17）
Electrically connect fingerprint recognition chip（1）；
This fingerprint recognition chip（1）Several blind holes are distributed with upper surface（2）, the fingerprint recognition chip（1）Blind hole（2）It is interior
With aluminum pad（3）, this aluminum pad（3）From blind hole（2）Bottom extends to blind hole（2）Middle part, blind hole（2）Interior aluminum pad（3）Table
Face is filled with nickel metal layer（4）, this nickel metal layer（4）From blind hole（2）Middle part extends to fingerprint recognition chip（1）Upper surface and shape
Into projection, pad thickened section is formed（5）；
The fingerprint recognition chip（1）Lower surface and and blind hole（2）Opposite region ecto-entad has the first tapered blind hole successively
（6）, the second tapered blind hole（7）, the second tapered blind hole（7）Positioned at the first tapered blind hole（6）Bottom, first tapered blind hole
（6）, the second tapered blind hole（7）Section be taper, the second tapered blind hole（7）Opening be less than the first tapered blind hole（6）Open
Mouthful, this second tapered blind hole（7）Bottom is fingerprint recognition chip（1）Aluminum pad（3）；
The fingerprint recognition chip（1）Lower surface, the first tapered blind hole（6）, the second tapered blind hole（7）Surface has insulating barrier
（8）, second tapered blind hole（7）Bottom offers several triconic blind holes（9）, positioned at fingerprint recognition chip（1）,
One tapered blind hole（6）, the second tapered blind hole（7）With triconic blind hole（9）Top has titanium conductive pattern layer successively
（10）, copper metal conductive pattern layer（11）, this titanium conductive pattern layer（10）, copper metal conductive pattern layer（11）Positioned at insulation
Layer（8）With fingerprint recognition chip（1）Opposite surface, a welding resisting layer（12）Positioned at copper metal conductive pattern layer（11）With titanium
Conductive pattern layer（10）Opposite surface, this welding resisting layer（12）On be provided with several through holes（13）, a soldered ball（14）By described
Through hole（13）With copper metal conductive pattern layer（11）Electrical connection, the flexible PCB（16）And data processing chip（17）It is electric
Connect fingerprint recognition chip（1）Soldered ball（14）；
The Fingerprint Lock device is obtained by following manufacturing process, is comprised the following steps：
Step 1: in the fingerprint recognition chip（1）Blind hole（2）Interior aluminum pad（3）Fill nickel metal layer in surface（4）, so that
Upper surface simultaneously forms projection, forms pad thickened section（5）；
Step 2: with pad thickened section（5）Fingerprint recognition chip（1）Ephemeral key rubber alloy layer on the coating method of upper surface；
Step 3: by a glass support plate（19）Pass through ephemeral key rubber alloy layer（20）With fingerprint recognition chip（1）Increase with pad
Thick portion（5）Upper surface bonding；
Step 4: will be with fingerprint recognition chip（1）The opposite lower surface in upper surface is thinned, so that by fingerprint recognition chip（1）It is thick
Degree is thinned to 150 ~ 300 microns；
Step 5: from fingerprint recognition chip（1）Lower surface realizes first tapered blind hole successively by progressively etching（6）,
Two tapered blind holes（7）With triconic blind hole（9）；
Step 6: by magnetron sputtering in fingerprint recognition chip（1）, the first tapered blind hole（6）, the second tapered blind hole（7）With
Triconic blind hole（9）The titanium conductive pattern layer of top sputter one（10）；
Step 7: by magnetron sputtering in titanium conductive pattern layer（10）The layers of copper of surface sputter one；
Step 8: a bronze medal thickening layer is deposited on the layers of copper surface of step 7 by electroplating, so as to form copper metal conductive pattern layer
（11）；
Step 9: after glass support plate in step 3 is removed, by fingerprint recognition chip（1）, ceramic cover plate（15）, flexible PCB
Plate（16）And data processing chip（17）Fit together, by data processing chip（17）With fingerprint recognition chip（1）Soldered ball
（14）Electrical connection.
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| CN201510091436.0A CN104681454B (en) | 2015-02-28 | 2015-02-28 | The packaging technology of device is locked for novel finger print |
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| CN106650552B (en) * | 2015-10-30 | 2019-09-13 | 深圳指芯智能科技有限公司 | A kind of fingerprint Identification sensor becket and its preparation method and application |
| CN106229325A (en) * | 2016-09-21 | 2016-12-14 | 苏州科阳光电科技有限公司 | Sensor module and preparation method thereof |
| CN106548927A (en) * | 2016-11-03 | 2017-03-29 | 苏州晶方半导体科技股份有限公司 | The method for packing and encapsulating structure of fingerprint recognition chip |
| CN106653616A (en) * | 2016-11-22 | 2017-05-10 | 苏州晶方半导体科技股份有限公司 | Encapsulation method and encapsulation structure of fingerprint sensor chip |
| CN106650702A (en) * | 2017-01-05 | 2017-05-10 | 深圳市深越光电技术有限公司 | Processing method for fingerprint identification apparatus, and fingerprint identification apparatus |
| CN107680911A (en) * | 2017-11-06 | 2018-02-09 | 苏州科阳光电科技有限公司 | A kind of fingerprint recognition modular structure and preparation method, terminal device |
| CN110738074B (en) * | 2018-07-18 | 2024-02-27 | 上海箩箕技术有限公司 | Optical fingerprint sensor module and forming method thereof |
| CN109830890B (en) * | 2019-01-15 | 2021-10-22 | 华天慧创科技（西安）有限公司 | Chip module, wafer-level chip packaging structure and packaging method |
| CN209765526U (en) | 2019-04-10 | 2019-12-10 | 深圳市汇顶科技股份有限公司 | Optical fingerprint device and electronic equipment |
| CN112985471B (en) * | 2021-04-30 | 2021-11-02 | 深圳市汇顶科技股份有限公司 | Capacitive sensor and manufacturing method thereof |
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| CN102509718A (en) * | 2011-12-15 | 2012-06-20 | 中国科学院上海微系统与信息技术研究所 | Wafer-level chip size encapsulation technology for GaAs (gallium arsenide) CCD (Charge Coupled Device) image sensor |
| CN102810549A (en) * | 2012-08-29 | 2012-12-05 | 格科微电子（上海）有限公司 | Method for manufacturing wafer-level packages of image sensors |
| CN203910778U (en) * | 2014-05-23 | 2014-10-29 | 新东亚微电子股份有限公司 | Fingerprint identification chip packaging module |
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Address after: 215143, No. 568, Fang Qiao Road, Lake Industrial Park, Xiangcheng Economic Development Zone, Jiangsu, Suzhou Patentee after: Suzhou Keyang Semiconductor Co., Ltd Address before: 215143, No. 568, Fang Qiao Road, Lake Industrial Park, Xiangcheng Economic Development Zone, Jiangsu, Suzhou Patentee before: SUZHOU KEYANG PHOTOELECTRIC TECHNOLOGY CO., LTD. |